JP6956534B2 - Manufacturing method of electronic device - Google Patents

Description

The present invention relates to a method for manufacturing an electronic device in which an electronic component is mounted on a light transmissive substrate.

Conventionally, as a method of mounting an electronic component on a substrate, a bump ball is formed on a substrate on which a circuit pattern is formed in advance with an Au wire or the like, the electronic component is mounted on the bump ball, and the electronic component is electrically irradiated by heat and ultrasonic waves. There is known a method of fixing an electronic component to a circuit pattern while connecting to the circuit board. Another method is to apply solder paste or the like to the circuit pattern on the board, mount the electronic components on it, heat it to melt the solder, and electrically connect it, and also fix the electronic components to the circuit pattern. Are known.

As a method of forming a circuit pattern, a method of masking and etching a copper foil is widely used. Further, in Patent Document 1, a coating film of a wiring pattern is formed on a substrate by printing or the like with a conductive ink in which metal nanoparticles and a dispersant such as a polymer are dispersed in a liquid medium, and then the coating film of the wiring pattern is formed. A technique is disclosed in which an electronic component is mounted on the surface so that its external terminal is immersed therein, and metal nanoparticles of a coating film of a wiring pattern are photo-fired by irradiating light from the back surface side of the substrate. At this time, in the technique of Patent Document 1, after printing the wiring pattern, the liquid medium is removed so that the content of the liquid medium is in the range of 0.01 to 3% by mass, and then the electronic component is mounted. There is. This prevents the wiring pattern from collapsing when the electronic components are mounted on the wiring pattern, and also prevents vacancies from being generated inside the wiring pattern during light firing.

Japanese Unexamined Patent Publication No. 2014-17364

In the technique of Patent Document 1, after mounting the external terminals of the electronic component so as to be immersed in the wiring pattern printed with the conductive ink, the liquid medium of the conductive ink is removed to a predetermined amount, and then light firing is performed. Therefore, since the liquid medium is removed before the light firing with the electronic components mounted, the volume of the wiring pattern coating film formed with the conductive ink shrinks, causing the electronic components to shift in position and at the same time. A gap is generated between the terminal of the electronic component and the shrunk coating film, which tends to cause poor bonding.

An object of the present invention is to improve the positional accuracy and bonding quality of electronic components in the process of bonding electronic components to a wiring pattern by light firing conductive ink.

In order to achieve the above object, the method for manufacturing an electronic device of the present invention is a method in which conductive particles are dispersed in a solution at a portion of a wiring pattern on a light transmissive substrate to which electrodes of electronic components should be bonded. The coating process of applying ink, the mounting process of mounting electronic components on a light-transmitting substrate so that the electrodes are mounted on the conductive ink, and the mounting process of applying a load to the electronic components while pressing the electrodes against the conductive ink. The present invention includes a joining step of joining the electrode and the wiring pattern by irradiating the conductive ink with an electromagnetic wave and sintering the conductive particles.

According to the manufacturing method of the present invention, it is possible to form a flexible conductive region without damaging the light-transmitting substrate by the light for firing the conductive particles.

(A)-(f) Explanatory drawing which shows the manufacturing method of the electronic device of 1st Embodiment. (A), (b-1) to (b-2), and (c) are explanatory views showing another example of the support mechanism of the light transmissive substrate 10 of the second embodiment. (A) to (c) are explanatory views which show another example of the support mechanism of the light transmissive substrate 10 of 2nd Embodiment. The explanatory view which shows the structure of the manufacturing apparatus of the electronic device of 3rd Embodiment. The explanatory view which shows the structure of the manufacturing apparatus of the electronic device of 3rd Embodiment. The flowchart which shows the control operation of the system control part of the manufacturing apparatus of the electronic device of 3rd Embodiment. The process chart which shows the process of manufacturing an electronic device using the manufacturing apparatus of the electronic device of 3rd Embodiment. Explanatory drawing which shows the device manufacturing method of this embodiment. The explanatory view which shows the configuration example which arranges the mirror 105d in the manufacturing apparatus of 3rd Embodiment, and irradiates a light transmissive substrate 10 with light. (A), (b), and (c) are explanatory views showing an example in which electronic devices are mounted on both sides of the light transmissive substrate 10 by using the support mechanism of FIG.

A method for manufacturing an electronic device according to an embodiment of the present invention will be described.

The method for manufacturing the electronic device of the first embodiment will be described with reference to FIGS. 1 (a) to 1 (f).

First, the light transmissive substrate 10 on which the wiring pattern 11 is formed is prepared.

Here, the wiring pattern 11a on the light transmissive substrate 10 is formed by the steps of FIGS. 1A to 1C. Specifically, a light-transmitting substrate 10 is prepared (FIG. 1A), and a solution (conductive ink) in which conductive particles are dispersed is applied to the surface of the light-transmitting substrate 10 in a desired wiring pattern shape. Is applied to the surface by a method such as printing (FIG. 1 (b)). As a result, a coating film 11a of the conductive ink is formed on the surface of the light transmissive substrate 10. If necessary, the coating film 11a is heated to evaporate the solvent and dry it.

Next, as shown in FIG. 1 (c), the coating film 11a is made to transmit the light transmissive substrate 10 from the back surface side of the light transmissive substrate 10 and is irradiated with the electromagnetic wave (here, the luminous flux) 12. The luminous flux 12 has a wavelength that allows the light to pass through the light-transmitting substrate 10 and is absorbed by the conductive particles of the conductive ink. At this time, the light transmissive substrate 10 may be mounted on the light transmissive support material 9 which is transparent to the luminous flux 12. As a result, the luminous flux 12 can be stably irradiated even when the light transmissive substrate 10 having a thin thickness is used. The luminous flux 12 may be focused to a predetermined spot diameter, or may be formed into a desired wiring pattern 11 shape by a mask or the like. Further, the entire light transmissive substrate 10 may be irradiated. In the region of the coating film 11a irradiated with the luminous flux 12, the conductive particles absorb the energy of light and the temperature rises, and the conductive particles melt at a temperature lower than the melting point of the bulk of the material constituting the particles. do. As the temperature of the conductive particles rises, the molten conductive nanoparticles fuse directly with the adjacent particles. As a result, the conductive particles are sintered together, and the conductive wiring pattern 11 is formed. At this time, since the molten conductive particles are fixed to the surface of the light-transmitting substrate 10, the wiring pattern 11 directly fixed to the light-transmitting substrate 10 can be formed. Further, if necessary, the coating film 11a that has not been irradiated with light may be removed.

Next, as shown in FIG. 1D, the conductive ink is applied to the portion of the wiring pattern 11 to which the electrode 31 of the electronic component 30 is to be joined to form the coating film 40a.

Then, as shown in FIG. 1 (e), the electronic component 30 is mounted so that the electrode 31 is in contact with the coating film 40a. After that, a load is applied to the electronic component 30 to press the electrode 31 against the coating film 40a of the conductive ink. With a load applied, as shown in FIG. 1 (f), the light transmissive substrate 10 is transmitted from the back surface side of the light transmissive substrate 10 directly under the electrode 31 to irradiate the luminous flux 12 having a predetermined irradiation diameter. , The electrode 31 and the wiring pattern 11 are joined by sintering the conductive particles to form the electrode connection region 40 in the same manner as in the step of FIG. 1 (c). The irradiation diameter of the luminous flux 12 can be made smaller than the diameter of the electrode 31.

Since the volume shrinks when the coating film 40a is sintered and changes to the electrode connection region 40, there is a possibility that a gap may be generated between the electrode connection region 40 and the electrode 31, or the electronic component 30 may be misaligned. However, in the present embodiment, since the electronic component 30 is pressed against the coating film 40a by applying a load, the electronic component 30 can be joined to each other without being displaced from the electrode connection region 40.

Further, since the size of the electrode connection region 40 can be made smaller than the size of the electrode 31, it is possible to provide a minute-sized electrode connection region 40 that is difficult to reach with a conventional bump. Therefore, even when the adjacent electrodes 31 are close to each other, they can be connected to the wiring pattern 11 without short-circuiting, so that the mounting density of the electrodes 31 can be improved.

As the magnitude of the load, as an example, not more than 10000 g / mm ² per unit area 1 g / mm ² or more electrodes 31, 1 g / mm ² or more 5000 g / mm ² or less is desirable, 5 g / mm ² or more More preferably 1000 g / mm ² or less.

As described above, according to the method of manufacturing the electronic device of the present embodiment, it is possible to improve the position accuracy and the joining quality of the electronic component with respect to the wiring pattern 11.

Further, by supporting the light transmissive substrate 10 by the light transmissive support material 9 as shown in FIGS. 1 (c) to 1 (f), even when the light transmissive substrate 10 is thin and has low rigidity, a load is applied to the electrons. The component 30 can be pressed against the coating film 40a.

If the substrate 10 can withstand a load, it can be manufactured without using the support material 9.

As the light transmissive support material 9, a material that transmits the light flux 12 and has rigidity that can withstand a load is used.

The size of the electrode connection region 40 can be formed to be, for example, 1 mm or less in diameter and 1 nm to 50 μm in thickness. Further, the electric resistance value of the electrode connection region 40 ^{is preferably 10 -4} Ω · cm or less, and particularly preferably a low resistance on the order of ^{10 -6 Ω · cm.}

The size of the load, for example, can be set to about 1 g / mm ² or more 10000 g / mm ² or less.

Further, as the method for forming the coating film 11a or the coating film 40a in the step of FIG. 1B or FIG. 1D, any method can be used as long as a film having a desired film thickness can be formed. You may. When the coating films 11a and 40a are formed by printing, gravure printing, flexographic printing, screen printing and the like can be used. In addition, an inkjet method, a transfer method, or the like can be used.

In the above description, the wiring pattern 11 on the light transmissive substrate 10 is formed by using the conductive ink by the steps of FIGS. 1A to 1C, but it may be formed by another method. good. For example, the wiring pattern 11 may be formed by attaching a metal substance such as copper foil to the surface of the light transmissive substrate 10 and then forming a desired wiring shape by an etching method or the like and plating if necessary.

Further, in the above description, after forming the coating film 11a on the light transmissive substrate 10 using the conductive ink by the steps of FIGS. 1A to 1D, the conductive particles are baked by irradiating the light beam 12. After connecting and forming the wiring pattern 11, the coating film 40a to be the electrode connection region 40 is applied, but this embodiment is not limited to this method. After forming the coating film 11a according to FIGS. 1 (a) and 1 (b), a drying step is performed as necessary, and FIGS. 1 (d) to 1 (f) are performed without irradiating the light flux 12 of FIG. 1 (c). ), And in the step of FIG. 1 (f), the coating film 11a and the coating film 40a are simultaneously or continuously irradiated with light to obtain the wiring pattern 11 and the electrode connection region 40. It may be formed in the same process.

As the wavelength of the luminous flux 12 to be irradiated, the wavelength absorbed by the conductive particles contained in the coating films 11a and 40a is used. The light to be irradiated may be ultraviolet, visible, or infrared light, or may be microwave. For example, when Ag, Cu, Au, Pd or the like is used as the conductive particles, visible light having a diameter of 400 to 600 nm can be used.

The conductive ink will be further described. This ink is a solution in which conductive particles are dispersed. As the conductive particles, for example, one or more of conductive metals such as Au, Ag, Cu, Pd, ITO, Ni, Pt, and Fe and conductive metal oxides can be used. In order to efficiently perform sintering by electromagnetic waves, it is desirable to enhance the electromagnetic wave absorption characteristics of the ink containing the conductive particles, and it is desirable that some or all of the conductive particles have a nano-sized shape. The particle size contained is, for example, 10 to 150 nm. Further, the particle size of the conductive particles may be only nanoparticles of less than 1 μm, or may be a mixture of nanoparticles of less than 1 μm and nanoparticles of 1 μm or more.

As the solution for dispersing the conductive particles of the conductive ink, it is preferable to use an organic solvent or water, but it may be contained in epoxy, silicone, or urethane resin. An additive (polymer component, etc.) for improving dispersibility may be added to the solvent, and a resin component (epoxy, silicone, urethane, etc.) may be added for improving the fixing force.

As the electromagnetic wave used for sintering the conductive particles, those including those in the wavelength range of ultraviolet light, visible light, infrared light, and microwave can be used. The electromagnetic wave may be spread and irradiated, or may be focused and irradiated. For example, by focusing the electromagnetic wave and irradiating the coating film 40a on the substrate 10, the heating region becomes the focused electromagnetic wave. It becomes extremely local with a spot diameter of about, and local heat can be conducted to the surrounding light-transmitting substrate 10 and dissipated into the air. By carrying out this method, it is possible to suppress the temperature rise of the light transmissive substrate 10, and it is possible to form the wiring pattern 11 without damaging the light transmissive substrate 10. Therefore, a resin or the like can also be used as the light transmissive substrate 10.

In the present embodiment, as the light transmissive substrate 10, for example, a thin light transmissive substrate or film having a thickness of 10 to 1000 μm can be used. Even with such a thin light-transmitting substrate 10, the electronic component 30 can be mounted by electromagnetic wave sintering as in the present embodiment. Examples of the material of the light transmissive substrate 10 include glass, PS (polystyrene), PP (polypropylene), PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene terephthalate), polyimide, acrylic, epoxy, silicone and the like. It is possible to use a product mainly composed of the organic components of. In order to improve the adhesion between the light transmissive substrate 10 and the wiring pattern 11, the light transmissive substrate 10 may be surface-treated. For example, a plasma treatment, a UV (ultraviolet) treatment, a treatment of applying a coupling agent, or the like is performed.

Further, it is desirable that the wiring pattern 11 formed in the steps of FIGS. 1A to 1C has a thickness larger than a width. In particular, the ratio of the thickness to the width of the wiring pattern 11 is preferably thickness / width = 1/100 or more, more preferably thickness / width = 5/100 or more, and thickness / width = 10/100 or more. Especially desirable in some cases. Further, when a large current is supplied to the wiring pattern 11, it is desirable that the thickness / width = 20/100 or more. As an example, the wiring pattern 11 is formed to have a width of 1 μm or more and a thickness of about 1 nm to 50 μm. Further, the electrical resistivity of the wiring pattern 3 ^{is preferably 10 -4} Ω · cm or less, and particularly preferably a low resistance on the order of ^{10 -6 Ω · cm.}

In the steps of FIGS. 1 (a) to 1 (c), it is desirable that the wiring pattern 11 to be formed is formed so as to be porous. That is, the adjacent conductive particles are not completely melted and mixed with each other, but are sintered at the interface where they come into contact with each other to form pores at least a part between the sintered conductive particles. It is desirable to sinter electromagnetic waves at a high temperature. For example, by using laser light as the luminous flux 12 and irradiating the coating film 11a with an irradiation intensity that does not melt the transmitted light-transmitting substrate 10, the region of the coating film 11a irradiated with the luminous flux 12 can be irradiated in a short time. A relatively large amount of energy can be applied, the conductive particles can be heated to melt and sintered, and by stopping the irradiation of the luminous flux 12 of the laser light, heat conduction to the surrounding coating film 11a and the light transmissive substrate 10 can be achieved. Because it can be cooled more quickly, a porous wiring pattern can be formed. In other words, when the coating film 11a is sintered with the luminous flux 12 of the laser beam, the porous wiring pattern 11 is formed by adjusting the irradiation intensity of the luminous flux 12 so that the coating film 11a has an appropriate temperature. can. As a specific example, a stretched polyethylene terephthalate (PET) film (melting point of about 250 ° C., heat resistant temperature of about 150 ° C.) is used as the light transmissive substrate 10, and a laser is used so that the shape of the light transmissive substrate 10 is maintained. When the coating film 11a is irradiated from the back surface of the light transmissive substrate 10 by adjusting the intensity of the light flux 12 and the conductive particles of the coating film 11a are sintered, a porous wiring pattern 11 can be formed. ..

When the wiring pattern 11 is porous, as described above, the wiring pattern 11 itself has followability (flexibility). Therefore, even when the flexible light transmissive substrate 10 is deformed, the wiring pattern 11 itself has followability (flexibility). Since the wiring pattern 11 follows, the wiring pattern 11 is unlikely to be peeled off from the light transmissive substrate 10, and cracks and the like are unlikely to occur. Therefore, it is possible to provide a flexible light transmissive 10 that is less likely to cause disconnection.

In the step of FIG. 1C, it is of course possible to irradiate the light flux 12 from the surface of the light transmissive substrate 10 on the side where the coating film 11a is provided.

Any electronic component 30 may be used, but as an example, a light emitting element (LED, LD), a light receiving element, a resistor, a capacitor, a transistor, an IC, a switch, an integrated circuit, and a display element (liquid crystal display) can be used. , Plasma display, EL display, etc.) can be used. Further, in FIG. 1, only one electronic component 30 is mounted on the light transmissive substrate 10, but it is of course possible to mount two or more electronic components 30.

<Second embodiment>
The second embodiment will be described with reference to FIGS. 2 and 3.

In the first embodiment, the light transmissive substrate 10 is supported by the light transmissive support material 9, and the light flux 12 transmitted through the light transmissive support material 9 and the light transmissive substrate 10 is applied to the coating film 40a of the conductive ink. Although it was configured to irradiate, in the second embodiment, the light transmissive substrate 10 is supported by a support mechanism different from that of the light transmissive support material 9. This makes it possible to sinter the coating film 40a while applying a load to the electronic component 30.

Specifically, specific examples of the support mechanism are shown in FIGS. 2 and 3. FIG. 2A is a mechanism 54 for pulling at least one set of opposing edges of the light transmissive substrate 10 outward in the in-plane direction. It is desirable to pull each of all the opposing edges of the light transmissive substrate 10. By pulling the light transmissive substrate 10 in this way, even if the light transmissive substrate 10 is in the form of a sheet having low rigidity, the tension prevents the electronic component 30 from being deformed by a load, and the electronic component 30 is formed into the coating film 40a. The light beam 12 can be irradiated while pressing.

FIG. 2B-1 shows a frame member 50 on which the light transmissive substrate 10 is mounted. As shown in FIG. 2B-2, the frame member 50 is arranged under the light-transmitting substrate 10 so as to support the periphery of the light-transmitting substrate 10 on which the coating film 40a is formed. This makes it possible to prevent and support the deformation of the light-transmitting substrate 10 when a load is applied to the electronic component 30.

The frame member 50 may be provided with a plurality of holes having openings 50a having a small diameter on the upper surface thereof, and the inside of the holes may be depressurized by the pump 50b. As a result, the back surface of the light transmissive substrate 10 can be adsorbed on the upper surface of the frame material 50, so that the position shift of the light transmissive substrate 10 with respect to the frame material 50 can be prevented.

FIG. 2C is a mechanism in which the solvent 51a is filled up to the height of the upper surface of the edge of the transparent container 51, and the light transmissive substrate 10 is supported by the liquid surface of the solvent 51a and the upper surface of the edge of the transparent container 51. In this configuration, the light transmissive substrate 10 can be adsorbed and held by the surface tension of the solvent. The light flux 12 passes through the container 51 and the solvent 51a, and further passes through the light-transmitting substrate 10 to irradiate the coating film 40a. Therefore, it is desirable to use a solvent 51a that is heated by irradiation with the luminous flux 12 and has a boiling point higher than the temperature reached.

FIG. 3A shows that at least a pair of corresponding edges of the light-transmitting substrate 10 are fixed by the fixing mechanism 53, and in that state, the light-transmitting substrate 10 is fixed by the frame 52 of FIG. 3B from below. As shown in FIG. 3C, the light transmissive substrate 10 is pushed up to deform the light transmissive substrate 10 and apply tension to the light transmissive substrate 10. As a result, similarly to the configuration of FIG. 2A, the light transmissive substrate 10 can be prevented from being deformed by the load due to the tension, and the light flux 12 can be irradiated while pressing the electronic component 30 against the coating film 40a.

The configuration and process other than the support mechanism are the same as those in the first embodiment, and thus the description thereof will be omitted.

<Third embodiment>
The third embodiment will be described with reference to FIGS. 4 to 7.

The apparatus shown in FIGS. 4 and 5 is a manufacturing apparatus that realizes the manufacturing method of the first embodiment.

This manufacturing apparatus includes a light transmissive substrate support portion (stage) 101 that supports the light transmissive substrate 10 on which the wiring pattern 11 is formed, a dispenser 102, an electronic component moving portion 103, a load portion 104, and an electromagnetic wave ( A light beam) irradiation unit 105 is provided. The dispenser 102 forms a coating film 40a by applying a conductive ink in which conductive particles are dispersed in a solution onto a light-transmitting substrate 10. The electronic component moving unit 103 lifts the electronic component 30 and moves it to the position of the coating film 40a of the light transmissive substrate 10 and mounts it on the coating film 40a. The load unit 104 applies a load that presses the electronic component 30 mounted on the coating film 40a against the coating film 40a. The electromagnetic wave (luminous flux) irradiation unit 105 irradiates the coating film 40a with electromagnetic waves from the back surface side of the light transmissive substrate 10 in a state where the load unit 104 applies a load to the electronic component 30, and is contained in the coating film 40a. Sinter conductive particles. An electronic device is manufactured by performing the steps of FIGS. 1 (c) to 1 (f) described in the first embodiment by this device.

In the devices of FIGS. 4 and 5, the electronic component moving unit 103 is configured to apply a load by pressing the lifted electronic component 30 against the coating film 40a. As a result, the electronic component moving unit 103 also serves as the load unit 104. Further, a light transmitting substrate support drive mechanism 106 for moving the light transmitting substrate support 101 from the position of the dispenser 102 to the position of the electronic component moving portion 103 is further provided.

This will be described in more detail. The light-transmitting substrate support portion 101 is provided with a light-transmitting support material 9 for mounting the light-transmitting substrate 10. The dispenser 102 includes a tank 102a that stores conductive ink and delivers an instructed amount, a nozzle 102b that discharges the conductive ink sent out from the tank 102a, and a z-direction drive unit 102c that adjusts the height of the nozzle 102b. , A drive control unit 103f that controls these drive units, and a discharge control unit 102d that controls the tank 102a.

Further, the tank 102a may have a structure integrated with the nozzle 102b. Further, the dispenser 102 may further include a drive mechanism for moving the nozzle 102b with respect to the light transmissive substrate 10. The drive mechanism has a structure in which the nozzle 102b can move in the x and y directions with respect to the light transmissive substrate 10. As a result, the nozzle 102b can be precisely moved with respect to the light transmissive substrate 10, so that the coating film 40a and the coating film 11a can be formed more finely and accurately.

The electronic component moving unit 103 uses the table 103h in which a plurality of electronic components 30 are arranged in advance, the suction head 103a, the pump 103b for depressurizing the inside of the suction head 103a, and the suction head 103a in the x, y, and z directions. It has a drive unit 103c, 103d, 103e to be moved to, a drive control unit 103f for controlling these drive units, and a pump control unit 103g for controlling the pump 103b. The z-direction drive unit 103e also serves as the load unit 104. The electromagnetic wave (luminous flux) irradiation unit 105 includes a light source 105a and a light source control unit 105b that controls the light source 105a. The support unit drive mechanism 106 includes light-transmitting substrate support unit drive units 106a and 106b that move the support unit 101 in the x and y directions, respectively. The drive control unit 103f also controls the operation of the light transmissive substrate support unit drive units 106a and 106b.

The support unit driving unit 106 may be configured to be able to drive the support unit 101 in the z direction as well. This makes it possible to control the position of the support portion 101 more precisely.

The dispense control unit 102d, the pump control unit 103g, the drive control unit 103f, and the light source control unit 105b are connected to the system control unit 107 that controls the overall operation.

When a transfer method is used as a method for forming the coating film 40a of the conductive ink, it can be realized by using the discharge mechanism portion as the transfer mechanism portion.

A method of manufacturing an electronic device using the manufacturing apparatus of this embodiment will be described. FIG. 6 is a flowchart showing a control operation by the system control 107, and FIG. 7 is a process chart showing a manufacturing process. The system control unit 107 is configured to include a CPU and a memory, and when the CPU reads and executes a program stored in the memory in advance, the system control unit 107 operates as shown in the flow of FIG. 6 to function as the system control unit 107. To realize.

First, according to the steps of FIGS. 1 (a) and 1 (b) of the first embodiment, the coating film 11a in the shape of the wiring pattern 11 is printed with the conductive ink on the light transmissive substrate 10 (step 701). If necessary, the coating film 11a is heated to evaporate the solvent and dry it. At this stage, the coating film 11a is not photosintered.

The operator sets the light-transmitting substrate 10 on which the coating film 11a is formed on the light-transmitting support material 9 of the light-transmitting substrate support portion 101 of the manufacturing apparatus of FIG. 4 (step 702). The support member 9 can be set from the time of step 701.

The following steps are performed using the manufacturing apparatus of FIGS. 4 and 5. The system control unit 107 instructs the drive control unit 103f to operate the light transmissive substrate support unit drive units 106a and 106b in the x and y directions, and moves the light transmissive substrate support unit 101 to move the dispenser 102. The light transmissive substrate 10 is moved to the dropping position of the nozzle 102b (step 61). Subsequently, the system control unit 107 instructs the drive control unit 103f to operate the z-direction drive unit 102c of the dispenser 102 to bring the nozzle 102b closer to the light transmissive substrate 10 to a predetermined distance. Then, the system control unit 107 instructs the dispense control unit 102d to send out a predetermined amount of the conductive ink from the tank 102a. As a result, the conductive ink is ejected from the tip of the nozzle 102b and is dropped at a predetermined position on the coating film 11a of the light transmissive substrate 10 (step 62). By the steps 61 and 62 above, the coating film 40a is formed at a predetermined position of the coating film 11a of the light transmissive substrate 10 (step 703).

The system control unit 107 instructs the drive control unit 103f to operate the light transmissive substrate support unit drive units 106a and 106b in the x and y directions to move the light transmissive substrate support unit 101. As in step 5, the light transmissive substrate 10 is moved to the position of the electronic component moving unit 103 (step 63). Next, the system control unit 107 instructs the drive control unit 103f to operate the drive units 103c, 103d, 103e and move the suction head 103a in the x, y, z directions to move the suction head 103a into a table. It is moved to the coordinates of one electronic component 30 on 103h (step 64). Then, the system control unit 107 instructs the pump control unit 103g to reduce the pressure inside the suction head 103a by the pump 103b, and sucks the electronic component 30 to the tip of the suction head 103a (step 65). Further, the system control unit 107 instructs the drive control unit 103f to operate the drive units 103c, 103d, 103e, and makes the suction head 103a the coating film 40a of the light transmissive substrate 10 on the light transmissive substrate support portion 101. The electrode of the electronic component 30 and the coating film 40a are aligned with each other, and the electronic component 30 is placed on the coating film 40a (step 66). Subsequently, the drive control unit 103f operates the drive unit 103e in the z direction to lower the suction head 103a, press the electronic component 30 with the suction head 103a, and maintain a state in which a predetermined load is applied (step 67). ). In this state, the system control unit 107 instructs the light source control unit 105b to focus and emit light from the light source 105a (step 68). Light passes through the light transmissive support member 9 and the light transmissive substrate 10 and irradiates the film 11a and the coating film 40a for a predetermined time. Is formed. When the electrode connection region 40 is formed, the pump control unit 103g stops the depressurization of the pump 103b to turn off the adsorption of the electronic component 30, and the drive control unit 103f sets the drive unit 103e in the z direction. By operating and raising the suction head 103a, the application of the load to the electronic component 30 is stopped (step 69). In steps 63 to 69, the electronic components are picked up, moved onto the light transmissive substrate 10 (step 704), mounted on the coating film 40a (step 705), irradiated with light while applying a load, and sintered. (Step 706), each step of forming the electrode connection region 40 and joining the electrode 31 and the wiring pattern 11 (step 707) can be executed (FIGS. 1 (e) and 1 (f)).

After that, the coating film 11a is continuously irradiated with laser light from the light source 105a, and the conductive particles in the coating film 11a are photosintered to form the wiring pattern 11. At this time, the drive control unit 103f operates the light transmissive substrate support unit drive units 106a and 106b to move the light transmissive substrate 10 so that the entire wiring pattern 11 is sintered. , The entire region of the coating film 11a to be sintered is irradiated with the laser beam.

As described above, by using the manufacturing apparatus of the third embodiment, the electronic device can be manufactured by the manufacturing method of the first embodiment.

The load unit 104 may have any structure as long as it can apply a downward load to the suction head 103a, and a weight or a spring may be used.

The timing of irradiating the coating film 11a with light to form the wiring pattern 11 may be after the electrode connection region 40 is formed as in the third embodiment, but may be between steps 702 and 703 of FIG.

It is also possible to adopt a method in which the substrate support portion 101 does not move. In this case, by providing the dispenser 102 with a mechanism for driving the nozzle 102a in the x, y, and z directions, the electronic component 30 can be mounted on the light transmissive substrate 10 with high accuracy.

In the first to third embodiments described above, a method of manufacturing an electronic device by joining a wiring pattern on a light transmissive substrate and an electrode of an electronic component by photosintering has been described. The object to be joined by the form method is not limited to the electrodes of electronic components. For example, as shown in FIG. 8, it is also possible to join an optical component 81 such as a lens on the light transmissive substrate 10. The manufacturing method in this case is as follows. First, a conductive ink in which conductive particles are dispersed in a solution is applied to a portion of the light transmissive substrate 10 to which the optical component 81 should be bonded to form a bonding coating film 40a. Next, the portion of the optical component 81 to be bonded (the edge portion in FIG. 8) is mounted on the bonding coating film 40a. At this time, the light transmissive substrate 10 is mounted on the light transmissive support material 9 as needed. While applying a load to the optical component 81 and pressing the portion (edge) to be bonded against the bonding coating film 40a, the bonding coating film 40a is irradiated with an electromagnetic wave (luminous flux) 12 to conduct conductivity in the bonding coating film 40a. By sintering the sex particles, a bonding region (40) for joining the portion (edge) of the optical component 81 and the light transmissive substrate 10 is formed. For example, as shown in FIG. 8, the light flux 12 may be transmitted from the back surface side of the light transmissive support member 9 and the light transmissive substrate 10 and irradiated, or may be irradiated from above the light transmissive substrate 10. good.

In the manufacturing apparatus of the third embodiment, as shown in FIG. 9, a movable mirror 105d that reflects the laser light emitted by the laser light source 105a in a desired direction may be arranged. As a result, the plurality of coating films 40a can be sequentially irradiated with light without changing the position of the light transmissive substrate 10. As a result, a plurality of electronic components 30 can be bonded onto the light transmissive substrate 10. In particular, in the configuration using the movable mirror 105d of FIG. 9, when the light transmissive substrate 10 has a concave curved shape with respect to the light source 105a, the conditions (irradiation angles) equivalent to those of the coating films 40a at a plurality of locations. , Irradiation intensity), there is an advantage that the light beam 12 can be irradiated.

Further, in the above-described embodiment, the configuration in which the electronic component 30 is bonded only to one side of the light transmissive substrate 10 has been described, but as shown in FIGS. For example, by turning over the light transmissive substrate 10, electronic components can be bonded to both sides. It should be noted that the configurations of FIGS. 10 (a) to 10 (c) have the same reference numerals as those of FIGS. 2 (a), (b-1) to (b-2), and (c). Therefore, detailed explanation is omitted.

The electronic device of the present embodiment can be applied to any device as long as the electronic component is mounted on a light transmissive substrate. For example, it can be applied to an instrument panel (instrument display panel) of an automobile, a display unit of a game machine, or the like. Further, since the substrate can be curved, it can be applied to wearable (wearable on the body) electronic devices (glasses, watches, displays, medical devices, etc.) and curved displays.

In addition to these, lighting equipment (point-emitting / surface-emitting lighting, flexible lighting, automobile lighting (interior, exterior), etc.), display equipment (see-through display, wearable display, head-up display, etc.), production equipment (game) It can be suitably used for production lighting, displays, etc. for equipment (pachinko).

9 ... Light-transmitting support material, 10 ... Light-transmitting substrate, 11a ... Coating, 11 ... Wiring pattern, 40a ... Coating, 40 ... Electromagnetic connection region, 101 ... Light-transmitting substrate support (stage), 102 ... Dispenser, 103 ... Electronic component moving part, 104 ... Load part, 105 ... Electromagnetic wave (luminous flux) irradiation part, 106 ... Light transmitting substrate support part Drive mechanism, 107 ... System control part

Claims (5)

A wiring coating coating step of applying conductive ink in which conductive particles are dispersed in a solution onto a light-transmitting substrate to form a wiring coating having the shape of a wiring pattern.
A wiring pattern sintering step of irradiating the wiring coating film with an electromagnetic wave to sinter the conductive particles in the wiring coating film to form the porous wiring pattern.
Of the wiring pattern, the portion to be bonded to electrodes of the electronic component, the conductive ink conductive particles are dispersed in a solution is applied, a coating step of forming a bonding coating,
The mounting process of mounting the electronic component on the light transmissive substrate so that the electrode is mounted on the bonding coating film, and
While applying a load to the electronic component and pressing the electrode against the bonding coating film, the bonding coating film is irradiated with an electromagnetic wave to sinter the conductive particles in the bonding coating film, thereby forming the electrode. A method for manufacturing an electronic device, which comprises a sintering step of forming an electrode connection region for joining the wiring pattern and the wiring pattern. A wiring coating coating step of applying conductive ink in which conductive particles are dispersed in a solution onto a light-transmitting substrate to form a wiring coating having the shape of a wiring pattern.
A coating step of applying a conductive ink in which conductive particles are dispersed in a solution to a portion of the coating film for wiring to which an electrode of an electronic component should be bonded to form a coating film for bonding.
The mounting process of mounting the electronic component on the light transmissive substrate so that the electrode is mounted on the bonding coating film, and
While applying a load to the electronic component and pressing the electrode against the bonding coating film, the wiring coating film and the bonding coating film are irradiated with electromagnetic waves to form the wiring coating film and the bonding coating film. An electronic device comprising a sintering step of sintering conductive particles to form the porous wiring pattern and forming an electrode connection region for joining the electrode and the wiring pattern. Manufacturing method. The method for manufacturing an electronic device according to claim 1 or 2 , wherein in the sintering step, the light transmissive substrate is supported by a support mechanism against the load. The method for manufacturing an electronic device according to claim 3 , wherein as the support mechanism, a light transmissive support material on which the light transmissive substrate is mounted, a frame material on which the light transmissive substrate is mounted, and the light transmissive substrate. An electronic device characterized by using at least one of a mechanism for pulling the opposite edges of the light-transmitting substrate outward in the in-plane direction and a container in which a solvent for supporting the light-transmitting substrate at the liquid surface is stored. Production method. A method of manufacturing an electronic device according to any one of claims 1 to 4, wherein the load is a method of manufacturing an electronic device, characterized in that 1 g / mm ² or more 10000 g / mm ² or less.

Images