JP6961809B2 - Boards, electronic components and mounting equipment - Google Patents

Description

The present invention relates to a substrate having an insulating layer and a metal layer, and an electronic component and a mounting device using the substrate.

Conventionally, a substrate such as CCL (Copper Clad Laminate) has been known. A substrate such as CCL has an insulating layer such as a polyimide film. Then, in order to improve the adhesion between the metal layer and the insulating layer, it has been proposed to provide an adhesion layer containing polyimide and particulate metal between the metal layer and the insulating layer (see, for example, Patent Document 1). .).

Japanese Unexamined Patent Publication No. 2009-158727

Providing a separate adhesion layer containing a particulate metal as shown in Patent Document 1 is different from the design-designed current flow because at least a part of the current flows through the particulate metal in the adhesion layer. A current flow will occur.

The present invention provides a substrate, an electronic component, and a mounting device capable of improving the adhesion between a metal layer and an insulating layer while preventing a current flow different from the designed current flow.

The substrate according to the present invention
Insulation layer and
A metal layer provided on the insulating layer and
A redox layer provided between the insulating layer and the metal layer and having a concavo-convex shape on the surface on the insulating layer side.
May be provided.

In the substrate according to the present invention
The redox layer may contain oxides of materials constituting the metal layer.

In the substrate according to the present invention
The redox layer may have a first redox layer and a first redox layer provided on the insulating layer side of the first redox layer.

In the substrate according to the present invention
The metal layer is copper
The redox layer may contain copper oxide as a main component.

In the substrate according to the present invention
The redox layer may be made of copper oxide.

In the substrate according to the present invention
The metal layer is patterned and has a substantially rectangular or substantially square cross section.
The redox layer having a concavo-convex shape may be provided on the insulating layer side of the metal layer.

In the substrate according to the present invention
The metal layer is patterned and has a substantially rectangular cross section.
The metal layer may have an uneven shape only on the insulating layer side.

In the substrate according to the present invention
The entire redox layer may be embedded in the insulating layer.

In the substrate according to the present invention
A redox layer is provided on the other surface of the patterned metal layer and at least a part of the side surface of the metal layer.
The redox layer may be embedded in the insulating layer.

In the substrate according to the present invention
Redox layers may be provided on the other side, side surface and one side of the patterned metal layer.

In the substrate according to the present invention
A part of the metal layer is embedded in the insulating layer,
The redox layer is provided on the side surface of the metal layer embedded in the insulating layer.
The redox layer may not be provided on the side surface of the metal layer exposed from the insulating layer.

In the substrate according to the present invention
The insulating layer may have a first insulating layer and a resist layer provided on the first insulating layer.

The electronic component according to the present invention
With the above-mentioned board
Electronic components provided on the substrate and
With
The electronic component may be provided on the metal layer.

The mounting device according to the present invention is
The electronic components described above may be provided.

In the present invention, when the embodiment provided between the insulating layer and the metal layer and the redox layer having a concavo-convex shape is provided on the surface (the other surface) on the insulating layer side, the redox having a concavo-convex shape is adopted. The layer can increase the peel strength (adhesion) between the metal layer and the insulating layer. Further, since the redox layer is provided with an uneven shape for improving the adhesion to the insulating layer and the metal layer is not provided with such an uneven shape, it is possible to prevent the current flowing in the metal layer from being disturbed. ..

FIG. 5 is a cross-sectional view showing a first aspect of the substrate according to the embodiment of the present invention. FIG. 2 is a cross-sectional view showing a second aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a third aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing an embodiment in which a metal layer and a redox layer are patterned in a substrate according to an embodiment of the present invention. FIG. 5 is a cross-sectional view showing an embodiment in which the entire redox layer and a part of the metal layer are embedded in an insulating layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing another aspect in which the entire redox layer and a part of the metal layer are embedded in the insulating layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing an example of a substrate manufacturing process according to an embodiment of the present invention. FIG. 7 is a cross-sectional view showing an example of a substrate manufacturing process according to an embodiment of the present invention, following FIG. 7. FIG. 5 is a cross-sectional view showing a fourth aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a fifth aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a sixth aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a seventh aspect of the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing an eighth aspect of the substrate according to the embodiment of the present invention. The cross-sectional view which showed the aspect which has the concavo-convex shape on the other surface of a metal layer. The cross-sectional view which showed the aspect which provided the substance layer in the substrate by embodiment of this invention. FIG. 5 is a cross-sectional view showing a first aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a second aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a third aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a fourth aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a fifth aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a sixth aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a seventh aspect in which the insulating layer has a first insulating layer and a resist layer in the substrate according to the embodiment of the present invention.

Embodiment << configuration >>
The substrate according to this embodiment is, for example, CCL (Copper Clad Laminate). As shown in FIG. 1, the substrate may have an insulating layer 10 and a metal layer 30 provided on the insulating layer 10. A redox layer 20 having an uneven shape on the surface on the insulating layer 10 side may be provided between the insulating layer 10 and the metal layer 30. The substrate provided in this embodiment may be a printed circuit board, a metal-clad laminate such as a copper-clad laminate, or the like.

The insulating layer 10 may be made of, for example, resin, glass, ceramic or the like. The insulating layer 10 may be a mixture of two or more kinds of insulating substances. For example, the insulating layer 10 may contain a fibrous or granular insulator. The insulating layer 10 may be a semi-cured sheet (prepreg) obtained by impregnating a base material such as paper or glass fiber with a resin and drying it. The insulating layer 10 may contain a heat conductive substance such as silicon nitride.

As the material of the insulating layer 10, a heat-curable resin, an ultraviolet curable resin, or the like may be used. If there is a certain degree of heat resistance, a thermoplastic resin may be used as the material of the insulating layer 10. As the thermosetting resin, a polyimide resin, an epoxy resin, a phenol resin, a cyanate resin or the like may be used. The thermoplastic resin may have a thermal deformation temperature of 50 degrees or higher.

The metal layer 30 may be a metal foil, metal plating, a rolled plate, or the like.

The redox layer 20 may contain an oxide of a material constituting the metal layer 30. Further, the redox layer 20 may have an uneven shape in whole or in part. The uneven shape may have a substantially triangular cross section (see FIG. 2), a substantially rectangular shape (see FIG. 2), or a substantially semicircular shape (see FIG. 3). ), It may have a substantially circular shape (see FIG. 3), it may have a mesh shape in which fibers are entangled, and the uneven shape may be configured as various shapes. In the present embodiment, the "substantially XX shape" means that the shape is approximately XX when viewed by a person skilled in the art.

The metal layer 30 may be copper. The redox layer 20 may contain copper oxide as a main component. Copper oxide may include cuprous oxide, cupric oxide, or both cuprous oxide and cupric oxide. Here, the "main component" means that the content is contained in an amount exceeding 50% by weight. The metal layer 30 may be other than copper, and may be, for example, gold, silver, aluminum, nickel, or an alloy containing these metals. The thickness of the metal layer 30 may be 10 μm to 60 μm or 18 μm to 45 μm.

As shown in FIG. 11, the redox layer 20 may have a first redox layer 21 and a second redox layer 22 provided on the insulating layer side of the first redox layer 21. When the oxidation-reduction layer is composed of copper oxide, for example, the first oxidation-reduction layer 21 _{contains the first copper oxide (Cu 2} O) and the second reduced dioxide layer 22 contains the second copper oxide (Cu O). It may be contained. Further, the primary redox layer 21 may be made of cuprous oxide (Cu ₂ O), and the reduced carbon dioxide layer 22 may be made of cupric oxide (Cu O).

The redox layer 20 may be composed of only copper oxide. in short. All of the redox layer 20 may be composed of copper oxide. The copper oxide may be cuprous oxide (Cu ₂ O), cupric oxide (Cu O), or both cuprous oxide and cupric oxide. Since the cuprous oxide becomes the cuprous oxide as the oxidation reaction proceeds, the treatment time with the treatment liquid 120 (see FIG. 7A) is adjusted to mix the cuprous oxide and the cupric oxide. The ratio may be adjusted.

When the metal layer 30 is copper and the redox layer 20 is copper oxide and the thickness of the metal layer before forming the redox layer 20 is 18 μm, the minimum value is 1.090 N / mm. It was confirmed that the maximum value was 1.150 N / mm and the average value was 1.115 N / mm. Further, when the metal layer 30 is copper and the redox layer 20 is copper oxide and the thickness of the metal layer before forming the redox layer 20 is 35 μm, the minimum value is 1.606 N / mm. It was confirmed that the maximum value was 1.784 N / mm and the average value was 1.691 N / mm.

As shown in FIG. 7, redox is reduced by applying the treatment liquid 120 to the front surface of the metal layer 30 located on the insulating layer 10 side (hereinafter, referred to as “the other surface” and also referred to as “the back surface”). Layer 20 may be formed. The redox layer 20 may be formed by immersing the other surface of the metal layer 30 in the treatment liquid 120 for a predetermined time, or after the treatment liquid 120 is applied to the other surface of the metal layer 30 and a predetermined time has elapsed. The redox layer 20 may be formed by removing the treatment liquid 120. As the treatment liquid 120, for example, an alkaline treatment liquid 120 such as _{NaClO 2 or NaOH may be used. When NaCl O 2} is used as the treatment liquid 120 and copper is used as the metal layer 30, for example, the following reaction occurs, and the _{redox layer 20 composed of Cu O and / or Cu 2} O and having an uneven shape is formed. It will be formed.
2Cu ＋ NaClO ₂ → 2CuO ＋ NaCl
4Cu ＋ NaClO ₂ → 2Cu ₂ O ＋ NaCl
2Cu ₂ O + NaClO ₂ → 4CuO + NaCl

The redox layer 20 having an uneven shape may be formed by treating the other surface of the metal layer 30 with the treatment liquid 120. More specifically, when the other surface of the metal layer 30 is treated with the treatment liquid 120, a chemical reaction such as an oxidation-reduction reaction occurs, and as a result, an oxidation-reduction layer 20 having an uneven shape may be formed. .. The treatment with the treatment liquid 120 is performed only on the other side of the metal layer 30, and may not be performed on the one side. By forming the redox layer 20 having a concavo-convex shape only on the other surface side for ensuring the peel strength and not providing the concavo-convex shape at other places, the cross-sectional area of the metal layer 30 through which the current effectively flows. It is beneficial in that it can be secured. However, the present invention is not limited to this aspect, and the redox layer 20 may be formed on the side surface and / or one side surface of the metal layer 30 (see FIGS. 12 and 13). When the embodiment composed of a multilayer substrate is adopted, the peel strength with respect to the substrate located on the one side surface can be increased by providing the redox layer 20 having a concavo-convex shape on one side surface. When adopting the embodiment in which at least a part of the metal layer 30 is embedded in the insulating layer 10 as described later, the peel strength can be enhanced by providing the redox layer 20 having an uneven shape on the side surface of the metal layer 30. can. When at least a part of the metal layer 30 is embedded in the insulating layer 10, as shown on the upper side of FIG. 13, the redox layer 20 is not provided in the portion not embedded in the insulating layer 10. Alternatively, as shown in FIG. 12, the redox layer 20 of the portion not embedded in the insulating layer 10 may be left.

The other surface of the metal layer 30 is treated with the treatment liquid 120 for a relatively long time, such as 15 to 20 minutes, in order to form the redox layer 20 having a concavo-convex shape sufficiently large to secure the peel strength. You may. Further, it can be confirmed that by treating with the treatment liquid 120 for a sufficient time in this way, the metal layer 30 having a substantially flat shape can be formed on the other side, and thus the current flow can be stabilized. ing.

The metal layer 30 may be patterned for various designs such as circuit design (see FIG. 7D). The patterned metal layer 30 may have a substantially rectangular cross section. The "rectangular shape" is a shape including various rectangular shapes such as a square, a rectangle, and a trapezoid. The "substantially rectangular shape" of the present embodiment includes an aspect having irregularities inevitably formed on the surface. The metal layer 30 may have a substantially rectangular shape or a substantially square shape. In the present embodiment, the substantially rectangular shape means that one side (upper side) has a length of 70% or more of the other side (lower side) in the cross section. .. What is a substantially square shape? In the cross section, the difference between the length in the thickness direction and the length of one side is within ± 5% of the length in the thickness direction and the length of one side, whichever is longer. It means that there is.

The length of one side of the patterned metal layer 30 is preferably 80% or more, more preferably 90% or more, and 95% or more of the length of the other side. Is even more preferable. As confirmed by the inventor, copper is used as the metal layer 30, and the redox layer 20 is patterned in a manner composed of cuprous oxide and cupric oxide, which is surprisingly one side of the metal layer 30. It was possible to realize a mode in which the length of the side is 90% or more and a mode in which the length of the side is 95% or more of the length of the other side. When the metal layer made of copper is patterned in the manner conventionally used, the cross section is formed of a trapezoidal shape. Therefore, the length of one side of the metal layer 30 is the same as that of the other side. It is very beneficial to be able to provide an aspect that is 90% or more of the length. That is, by adopting such an embodiment, the spacing between the patterned metal layers 30 can be arranged at a position closer to each other in the in-plane direction as compared with the embodiment in which the cross section has a trapezoidal shape, and the patterning can be performed. Can be miniaturized. Further, by adopting such an aspect, a current closer to the design value can be passed as compared with the aspect in which the cross section has a trapezoidal shape.

At least a part of the redox layer 20 having an uneven shape may be embedded in the insulating layer 10 (see FIG. 9), or the entire redox layer 20 may be embedded in the insulating layer 10 (FIG. 2 and FIG. 9). (See FIG. 3). Further, the redox layer 20 may be placed on one surface of the insulating layer 10 (upper surface of FIG. 10), and the redox layer 20 may not be embedded in the insulating layer 10 (see FIG. 10). However, from the viewpoint of increasing the peel strength, it is preferable that at least a part of the redox layer 20 is embedded in the insulating layer 10 (see FIG. 9), and the entire redox layer 20 is embedded in the insulating layer 10. It is more preferable (see FIGS. 2 and 3). In the present embodiment, "buried" means that the surface is located on the other side (lower side of the cross section in FIG. 2 and the like) rather than one surface (may be referred to as "front surface"). "Embedded in the insulating layer 10" means that the insulating layer 10 is located on the other side (lower side) of the one surface.

The insulating layer 10 may be in a semi-cured state. A part or all of the patterned metal layer 30 may be embedded in the semi-cured insulating layer 10 by pushing it into the insulating layer 10 (see FIGS. 5 and 6). When a part of the metal layer 30 is embedded in the insulating layer 10, for example, the entire redox layer 20 and a part of the side surface of the metal layer 30 may be embedded in the insulating layer 10. When the metal layer 30 is embedded in the insulating layer 10, a pressing force may be applied to the metal layer 30, but the present invention is not limited to this mode, and the metal layer 30 is embedded in the insulating layer 10 by its own weight. It may be. When the metal layer 30 is embedded in the insulating layer 10, the metal layer 30 and the redox layer 20 after patterning may be embedded in the insulating layer 10 (see FIG. 5), or before patterning. The metal layer 30 and the redox layer 20 may be embedded in the insulating layer 10 (see FIG. 6).

After embedding a part or all of the patterned metal layer 30 in the semi-cured insulating layer 10 by pushing it into the insulating layer 10, the insulating layer 10 may be cured by applying heat or irradiating it with ultraviolet rays. When a thermoplastic resin is used as the insulating layer 10, the insulating layer 10 may be cured by allowing it to cool or cool.

As shown in FIG. 15, a substance layer 200 whose etching is slower than that of the metal layer 30 may be provided on one surface of the metal layer 30. This material layer 200 is a layer different from the resist layer. The material layer 200 may be made of a metal different from that of the metal layer 30, and when the metal layer 30 is made of a first metal, the material layer 200 may be made of a second metal. As an example, when copper is used as the metal layer 30, a nickel layer may be used as the material layer 200 whose etching is slow. The material layer 200 may eventually be removed. When such a substance layer 200 is adopted, since the etching solution is first used to dissolve the substance layer 200, a metal layer 30 closer to a rectangular shape can be obtained.

"effect"
Next, an example of the effect of the present embodiment having the above-described configuration will be described. In addition, any aspect described in "effect" can be adopted in the above configuration.

When an embodiment is adopted in which the redox layer 20 is provided between the insulating layer 10 and the metal layer 30 and has a concavo-convex shape on the surface on the insulating layer 10 side, the metal is formed by the redox layer 20 having the concavo-convex shape. The peel strength (adhesion) between the layer 30 and the insulating layer 10 can be increased. Further, since the redox layer 20 is provided with an uneven shape for improving the adhesion to the insulating layer 10 and the metal layer 30 is not provided with such an uneven shape, the current flowing through the metal layer 30 is disturbed. Can be prevented. That is, when a concavo-convex shape is formed on the surface of the metal layer 30 as shown in FIG. 14, it is necessary to design a circuit or the like in consideration of the current flowing through the concavo-convex shape. Further, if the current flowing in such an uneven shape is not taken into consideration, the current may flow in a mode different from the design. On the other hand, when this aspect is adopted, as shown in FIG. 14, a relatively large uneven shape for adhering to the insulating layer 10 is not formed on the metal layer 30, so that the current is caused by the uneven shape on the surface of the metal layer 30. It is possible to prevent the flow of the metal from being disturbed, and it is also possible to prevent an adverse effect on the millimeter wave. Therefore, the current can be passed more accurately according to the design. Since no current flows through the redox layer 20, even if the redox layer 20 has an uneven shape, it does not pose a problem from the viewpoint of current disturbance. Further, as described above, the patterned metal layer 30 has a substantially rectangular shape or a substantially square shape, so that a current closer to the design value can be passed.

When the redox layer 20 contains an oxide of a material constituting the metal layer 30, and the redox layer 20 is formed by oxidizing a part of the metal layer 30, the metal layer is formed without using another material. It is advantageous in that the redox layer 20 can be formed only by oxidizing 30.

When copper is used as the metal layer 30 and the redox layer 20 contains copper oxide as a main component, the portion oxidized by oxidizing the metal layer 30 made of copper is used as the redox layer 20. It is beneficial in that it can be done.

When the embodiment in which all the portions of the metal layer 30 treated by the treatment liquid 120 are the redox layer 20, it is advantageous in that the entire treated metal layer 30 can be used as the redox layer 20. ..

As shown in FIGS. 11 to 13, in the embodiment in which the redox layer 20 has the first redox layer 21 and the first redox layer 22, the first treatment liquid is used to form the first redox layer 21. A second treatment liquid different from the first treatment liquid may be used to form the reduced dioxide layer 22. More specifically, the first redox layer 21 may be formed by treating the metal layer 30 with the first treatment liquid. Then, the second redox layer 22 may be formed by treating a part or all of the first redox layer 21 with the second treatment liquid. When such an embodiment is adopted, it is advantageous in that the thickness of the first redox layer 21 and the thickness of the second redox layer 22 can be easily controlled. Further, the first redox layer 21 and the second dioxide reduction layer 22 may be formed with the same treatment liquid without being limited to such an embodiment. More specifically, by treating the metal layer 30 with a predetermined treatment liquid, the first redox layer 21 is formed on the metal layer side, and the second redox layer 22 is formed on the side away from the metal layer 30. You may do so. In the case of treating with the first treatment liquid, the second treatment liquid or the predetermined treatment liquid in this way, the concentration of the treatment liquid, the temperature of the treatment liquid, the treatment time and the like are adjusted to adjust the first redox layer 21. The thickness and the thickness of the reduced carbon dioxide layer 22 may be controlled.

When the aspect in which the cross section of the patterned metal layer 30 is substantially rectangular is adopted, it is possible to prevent the current flowing through the metal layer 30 from being disturbed due to the relatively large uneven shape, and by extension, it is accurate. Circuit design is possible.

Next, an example of the manufacturing process of the electronic component will be described.

First, a metal layer 30 made of copper foil or the like is prepared. The other surface of the metal layer 30 is immersed in a treatment liquid 120 made of alkali or the like stored in the container 110 for a predetermined time (see FIG. 7A). As a result, the redox layer 20 including the uneven shape is formed on the other surface of the metal layer 30 (see FIG. 7B). Before immersing the other surface of the metal layer 30 in the treatment liquid 120, the other surface of the metal layer 30 may be cleaned to remove impurities, dirt, and the like. In the embodiment in which the redox layer 20 has the first redox layer 21 and the first redox layer 22, as described above, the first treatment liquid is used to form the first redox layer 21, and then the first treatment liquid is used. A second treatment liquid different from the first treatment liquid may be used to form the reduction reduction layer 22. Further, the present invention is not limited to such an embodiment, and by treating the metal layer 30 with a predetermined treatment liquid, the first redox layer 21 is formed on the metal layer side, and the first redox layer 21 is formed on the side away from the metal layer 30. The carbon dioxide reduction layer 22 may be formed.

Next, the other surface of the metal layer 30 is placed on one surface of the insulating layer 10 (see FIG. 7C).

Next, a resist is provided on one surface of the metal layer 30 and edging is performed. As a result, the metal layer 30 can be patterned and a circuit can be formed. Since the other surface of the metal layer 30 is treated with the treatment liquid 120 and placed on the insulating layer 10 and then patterned, the patterned metal layer 30 is redox-reduced on one surface and the side surfaces. The layer 20 is not formed, and the redox layer 20 can be formed only on the other surface side.

Electronic components 60 such as semiconductor elements, capacitors, and resistors are placed on one surface of the metal layer 30 of the substrate formed as described above (see FIG. 8A).

After that, one side of the metal layer 30 is sealed with a sealing resin or the like, and an electronic component in which the electronic element is sealed by the sealing portion 90 is manufactured (see FIG. 8B). Such electronic components may be incorporated into any mounting device such as automobiles, airplanes, ships, helicopters, personal computers, home appliances and the like. As described above, in the present embodiment, the mounting device is also provided. It is not always necessary to seal with a sealing resin or the like, and an embodiment in which a sealing portion such as a sealing resin is not provided can also be adopted.

When a part of the patterned metal layer 30 is embedded in the insulating layer 10, after the metal layer 30 is patterned, the metal layer 30 is pressed by a pressing member or the like to be inside the semi-cured insulating layer 10. A part of the redox layer 20, or the whole of the redox layer 20 and a part of the metal layer 30 may be embedded in the metal layer (see FIG. 5). Further, the present invention is not limited to such an embodiment, and the metal layer 30 is pressed by a pressing member or the like before patterning, and a part of the redox layer 20 or the redox layer 20 is contained in the semi-cured insulating layer 10. And a part of the metal layer 30 may be buried (see FIG. 6).

By embedding a part of the redox layer 20 or the whole redox layer 20 and a part of the metal layer 30 in the semi-cured insulating layer 10, heat is applied or ultraviolet rays are applied. Alternatively, the semi-cured insulating layer 10 may be cured by allowing it to cool or cool. By adopting such an embodiment, it is possible to provide a substrate having stronger adhesion (peel strength).

As shown in FIG. 16, the insulating layer 10 may have a resist layer 15. In this case, a first insulating layer 16 made of a resin or the like different from the resist layer 15 may be provided below the resist layer 15. The resist layer 15 has an insulating property equivalent to that of the first insulating layer 16, and may have a strong adhesive force with the first insulating layer 16.

When such an embodiment is adopted, as shown in FIG. 17, a resist layer 15, a redox layer 20 and a metal layer 30 may be provided as a part of the first insulating layer 16, and FIG. 18 shows. As shown, the metal layer 30 may be provided as a part of the redox layer 20. In the case of adopting the embodiment in which the resist layer 15, the redox layer 20, the metal layer 30, and the redox layer 20 are provided only partially as described above, after the layers are completely formed as shown in FIG. By selectively removing the layer as appropriate, the mode as shown in FIGS. 17 and 18 may be obtained.

Further, as shown in FIG. 19, the resist layer 15, the redox layer 20, and the metal layer 30 may be provided by being pushed into the first insulating layer 16. Further, when such an embodiment is adopted, a redox layer 20 having an uneven shape may be provided on the side surface of the metal layer 30 as shown in FIG. 20, or the metal layer 30 may be provided as shown in FIG. And the redox layer 20 having an uneven shape may be provided on the side surface of the resist layer 15. At this time, the side surface of the redox layer 20 may also have an uneven shape. Further, as shown in FIG. 22, the surface of the first insulating layer 16 may be roughened.

The description of each embodiment and the disclosure of the drawings described above are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above-described embodiments or disclosure of the drawings. The invention is not limited. Further, the description of the claims at the time of filing is only an example, and the description of the claims may be changed as appropriate based on the description of the description, drawings and the like.

10 Insulation layer 20 Redox layer 30 Metal layer 60 Electronic components

Claims (12)

Insulation layer and
A metal layer provided on one side of the insulating layer and
An oxide layer provided between the insulating layer and the metal layer and having an uneven shape on the surface on the insulating layer side,
With
The oxide layer is provided on the other surface of the metal layer in which the insulating layer is present, and is not provided on one surface on the side opposite to the other surface side.
The other surface of the metal layer is a substrate having a flat shape as compared with the uneven shape on the surface of the oxide layer on the insulating layer side. The oxide layer contains an oxide of a material constituting the metal layer, and contains an oxide.
The substrate according to claim 1, wherein an electronic component is provided on one surface of the metal layer. The substrate according to claim 1 or 2, wherein the oxide layer has a first oxide layer and a first dioxide layer provided on the insulating layer side of the first oxide layer. The metal layer is copper
The substrate according to any one of claims 1 to 3, wherein the oxide layer contains copper oxide as a main component. The substrate according to claim 4, wherein the oxide layer is made of copper oxide. The metal layer is patterned and has a substantially rectangular or substantially square cross section.
The substrate according to any one of claims 1 to 5, wherein the oxide layer having a concavo-convex shape is provided on the insulating layer side of the metal layer. The metal layer is patterned and has a substantially rectangular cross section.
The substrate according to any one of claims 1 to 6, wherein the oxide layer having a concavo-convex shape is provided only on the insulating layer side of the metal layer. An oxide layer is provided on the other surface of the patterned metal layer and at least a part of the side surface of the metal layer.
The substrate according to any one of claims 1 to 7, wherein the oxide layer is embedded in the insulating layer. A part of the metal layer is embedded in the insulating layer,
The oxide layer is provided on the side surface of the metal layer embedded in the insulating layer.
The substrate according to any one of claims 1 to 8, wherein the oxide layer is not provided on the side surface of the metal layer exposed from the insulating layer. The substrate according to any one of claims 1 to 9, wherein the insulating layer has a first insulating layer and a resist layer provided on the first insulating layer. The substrate according to any one of claims 1 to 10 and the substrate.
Electronic components provided on the substrate and
With
An electronic device characterized in that the electronic component is provided on the metal layer. A mounting device including the electronic device according to claim 11.

Images