JP6960575B2 - Manufacturing method of mounting board and component mounting method in component mounting system - Google Patents

Description

The present invention relates to a method for manufacturing a mounting board and a method for mounting a component in a component mounting system for mounting a component on a substrate.

In a component mounting line configured by connecting a plurality of component mounting devices, a mounting board in which components are mounted on the board is produced. When a mounting board is produced on such a component mounting line, if a component mounting error such as a component shortage or a component supply error occurs in the component mounting device, an operator performs recovery work from the error. During the restoration work, the mounting work on the component mounting device is stopped, so that the production efficiency of the mounting board is lowered. Therefore, even if a component mounting error occurs, a method has been proposed in which production is continued without stopping the component mounting line to suppress a decrease in production efficiency (see, for example, Patent Document 1).

In Patent Document 1, when a component mounting error is detected during production, the mounting of the component is skipped and the production of the mounting board is continued. Then, the worker collects the board for which the component mounting is skipped from the boards carried out from the component mounting line, and re-inserts the collected board into the same component mounting line to mount the skipped component. ..

Japanese Unexamined Patent Publication No. 2012-209300

However, in the prior art including Patent Document 1, the production efficiency of the mounting board is lowered because the mounting time on the component mounting line is increased by the time required to re-insert the recovered board and mount the skipped component. There was a problem of closing it.

Therefore, an object of the present invention is to provide a method for manufacturing a mounting board and a method for mounting a component in a component mounting system capable of suppressing a decrease in production efficiency of the mounting board even if a component mounting error occurs.

The method for manufacturing a mounting board in the component mounting system of the present invention includes a first component mounting line including a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying it out downstream, and a component mounting device. A method for manufacturing a mounting board in a component mounting system including a second component mounting line provided on the downstream side of the first component mounting line, and the first component mounting line. When a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and in the second component mounting line, the board ID of the skip board on which the mounting of the component is skipped and the above The skip component is mounted on the skip board based on the skip information including the skip component information linked to the board ID, and the second component mounting line is on a board other than the carried-in skip board. Is carried downstream without mounting the parts .
Further, the method for manufacturing a mounting board in the component mounting system of the present invention includes a first component mounting line including a component mounting device for mounting a component on a substrate having a substrate ID carried in from the upstream and carrying it out downstream, and a component. A method for manufacturing a mounting board in a component mounting system including a mounting device and a second component mounting line arranged on the downstream side of the first component mounting line, wherein the first component mounting line is When a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and the mounting of the component is skipped. The skip information including the information of the skip component is notified downstream, and the second component mounting line acquires the skip information associated with the board ID from the first component mounting line and informs the skip board. The skip component is mounted , and the second component mounting line is carried out downstream without mounting the component on a board other than the carried-in skip board .

The method for manufacturing a mounting board in the component mounting system of the present invention includes a first component mounting line including a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying it out downstream, and a component mounting device. A second component mounting line arranged on the downstream side of the first component mounting line, and a storage unit that can be shared between the first component mounting line and the second component mounting line. In the method of manufacturing a mounting board in a component mounting system, when a component mounting error occurs, the first component mounting line skips mounting of the component in which the component mounting error has occurred and mounts the component. The skip information including the information of the skip component that is associated with the board ID of the skip board and the skip component that was skipped is stored in the storage unit, and the second component mounting line is the storage unit. The skip information associated with the board ID is acquired, the skip component is mounted on the skip board, and the second component mounting line mounts the component on a board other than the carried-in skip board. Carry it out downstream without doing anything .

The component mounting method of the present invention includes a first component mounting line including a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying it out to the downstream, and the first component mounting device. It is a component mounting method for mounting a component on the board in a component mounting system including a second component mounting line arranged on the downstream side of the component mounting line. When a mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and in the second component mounting line, the board ID of the skip board on which the mounting of the component is skipped and the board The skip component is mounted on the skip board based on the skip information including the skip component information linked to the ID, and the second component mounting line is on a board other than the carried-in skip board. , Carry out downstream without mounting parts .
Further, the component mounting method of the present invention includes a first component mounting line including a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying it out to the downstream, and the first component mounting device. A component mounting method for mounting the component on the board in a component mounting system including a second component mounting line arranged on the downstream side of the component mounting line 1, wherein the first component mounting line is , When a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and the mounting of the component is skipped. The skip information including the information of the skip component is notified downstream, and the second component mounting line acquires the skip information associated with the board ID from the first component mounting line and informs the skip board. The skip component is mounted , and the second component mounting line is carried out downstream without mounting the component on a board other than the carried-in skip board .

The component mounting method of the present invention includes a first component mounting line including a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying it out to the downstream, and the first component mounting device. In a component mounting system including a second component mounting line arranged on the downstream side of the component mounting line and a storage unit that can be shared between the first component mounting line and the second component mounting line. the component mounting method for mounting the component to the substrate, the first component mounting line, if the part article mounting error occurs, skip the implementation of parts of the component mounting error occurs, the component The board ID of the skip board whose mounting is skipped and the skip information including the information of the skip component which is associated with the board ID and skipped are stored in the storage unit, and the second component mounting line is stored in the storage. The skip information associated with the board ID is acquired from the unit, and the skip component is mounted on the skip board. Carry out downstream without mounting .

According to the present invention, it is possible to suppress a decrease in production efficiency of a mounting board even if a component mounting error occurs.

Configuration explanatory view of the component mounting system according to the embodiment of the present invention Top view of the component mounting apparatus according to the embodiment of the present invention. A block diagram showing a configuration of a control system of a component mounting system according to an embodiment of the present invention. A flow chart showing a component mounting method by the component mounting system according to the embodiment of the present invention. (A) (b) (c) (d) Process explanatory view of a component mounting method by the component mounting system according to the embodiment of the present invention. (A) (b) (c) (d) Process explanatory view of a component mounting method by the component mounting system according to the embodiment of the present invention. Configuration explanatory view of another embodiment of the component mounting system according to the embodiment of the present invention. (A) (b) Process explanatory view of a component mounting method according to another embodiment of the component mounting system according to the embodiment of the present invention. (A) (b) Process explanatory view of a component mounting method according to another embodiment of the component mounting system according to the embodiment of the present invention. (A) (b) Process explanatory view of a component mounting method according to another embodiment of the component mounting system according to the embodiment of the present invention.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting system. In the following, the corresponding elements will be designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 2, as biaxial directions orthogonal to each other in the horizontal plane, the X direction (horizontal direction in FIG. 2) of the substrate transport direction and the Y direction (vertical direction in FIG. 2) orthogonal to the substrate transport direction are shown.

First, the component mounting system 1 will be described with reference to FIG. In FIG. 1, the component mounting system 1 connects a first component mounting line L1, a board stocker M4, and a second component mounting line L2 in a board transport direction (direction from the left side to the right side in FIG. 1) to form a communication network. It is connected by 2 and the whole is controlled by the management computer 3. Further, a reflow device M8 is connected downstream of the second component mounting line L2.

A substrate on which solder is printed on an electrode portion provided on the surface is carried into the first component mounting line L1. The first component mounting line L1 includes three connected component mounting devices M1 to M3, and has a function of mounting components in order on a board carried in from the upstream in the board transport direction and carrying the components downstream. ing. The second component mounting line L2 includes three connected component mounting devices M5 to M7, and mounts the skipped components on the board on which the component mounting is skipped in the first component mounting line L1. It has a function. The reflow device M8 has a function of heating a substrate on which a component is mounted to cure the solder and executing a solder reflow process for joining the electrode portion of the substrate and the component.

That is, the component mounting system 1 has a first component mounting line L1 that mounts components on a board that is carried in from the upstream and carries them out downstream, and a second component that is arranged downstream of the first component mounting line L1. It includes a mounting line L2, a first component mounting line L1, a second component mounting line L2, and a management computer 3 (management device) connected by a communication network 2. Further, the component mounting system 1 further includes a reflow device M8 downstream of the second component mounting line L2. The configuration of the first component mounting line L1 and the second component mounting line L2 is not limited to the example of FIG. 1, and four or more component mounting devices M1 to M3 and M5 to M7 are connected to each other. Alternatively, it may be composed of one component mounting device M1 to M3 and M5 to M7.

The board stocker M4 moves the magazine in the vertical direction, a transport conveyor that receives the boards carried in from the upstream and carries them out to the downstream, a magazine having a storage shelf for storing a plurality of boards received from the transport conveyor in a stack, and a magazine. It is provided with a stocker working unit 43 (see FIG. 3) that is provided with an elevating means. The board stocker M4 selectively stores the board carried in from the upstream in the magazine, carries it out downstream without storing it in the magazine, or carries out the board stored in the magazine downstream in accordance with the instruction from the management computer 3. It has a function to do. That is, the board stocker M4 is arranged between the first component mounting line L1 and the second component mounting line L2, and is connected to the management computer 3 (management device) by the communication network 2 to store a plurality of boards. Can be done.

Next, the configurations of the component mounting devices M1 to M3 and M5 to M7 will be described with reference to FIG. The component mounting devices M1 to M3 and M5 to M7 have the same configuration, and the component mounting device M1 will be described here. The component mounting device M1 has a function of executing a component mounting operation of mounting a component supplied from the component supply unit on a board. A substrate transport mechanism 5 is arranged in the X direction in the center of the base 4. The board transfer mechanism 5 transfers the board B carried in from the upstream to the mounting work position, positions it, and holds it. Further, the board transfer mechanism 5 carries out the board B for which the component mounting work has been completed downstream from the mounting work position.

Parts supply units 6 are arranged on both sides of the substrate transfer mechanism 5. A plurality of tape feeders 7 are mounted in parallel on each component supply unit 6. The tape feeder 7 pitches the carrier tape having the pocket for accommodating the component D (see FIG. 5) from the outside of the component supply unit 6 toward the substrate transport mechanism 5 (tape feed direction). The component D is supplied to the component take-out position by the mounting head of the component mounting mechanism described in 1.

A Y-axis beam 8 provided with a linear drive mechanism is arranged at one end of the upper surface of the base 4 in the X direction. Two X-axis beams 9 similarly provided with a linear drive mechanism are coupled to the Y-axis beam 8 so as to be movable in the Y direction. A mounting head 10 is mounted on each of the two X-axis beams 9 so as to be movable in the X direction. The mounting head 10 includes a plurality of suction units 10a to which suction nozzles for sucking and holding the component D are mounted at the lower end.

In FIG. 2, the mounting head 10 moves in the X direction and the Y direction by driving the Y-axis beam 8 and the X-axis beam 9. As a result, the two mounting heads 10 suck and take out the component D from the component take-out position of the tape feeder 7 arranged in the corresponding component supply unit 6 by the suction nozzle, and take out the component D, and the substrate B is positioned on the substrate transfer mechanism 5. Implement at the implementation point of. The Y-axis beam 8, the X-axis beam 9, and the mounting head 10 form a component mounting mechanism 11 for mounting the component D on the substrate B by moving the mounting head 10 holding the component D.

A component recognition camera 12 is arranged between the component supply unit 6 and the substrate transfer mechanism 5. When the mounting head 10 from which the component D is taken out from the component supply unit 6 moves above the component recognition camera 12, the component recognition camera 12 takes an image of the component D held by the mounting head 10 and holds the component D. Recognize posture. The board recognition camera 13 is attached to the plate 14 to which the mounting head 10 is attached, and moves integrally with the mounting head 10.

When the mounting head 10 moves, the board recognition camera 13 moves above the board B positioned by the board transfer mechanism 5, images the board mark (not shown) provided on the board B, and captures the image of the board B. Recognize the position. In the component mounting operation on the substrate B by the mounting head 10, the mounting position is corrected by taking into consideration the recognition result of the component D by the component recognition camera 12 and the recognition result of the board position by the board recognition camera 13. Further, a substrate recognition mark M is attached to the surface of the substrate B. The board recognition mark M is a bar code, a two-dimensional code, or the like associated with a board ID unique to each board B. The board recognition camera 13 captures the board recognition mark M and recognizes the board ID.

Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The component mounting devices M1 to M3 included in the first component mounting line L1 have the same configuration, and the component mounting device M1 will be described here. The component mounting device M1 includes a mounting control unit 21, a mounting storage unit 22, a board transfer mechanism 5, a component supply unit 6, a component mounting mechanism 11, a component recognition camera 12, a board recognition camera 13, a display unit 23, and a communication unit 24. ing.

The mounting control unit 21 is an arithmetic processing device having a CPU function. By executing the processing program stored in the mounting storage unit 22, the mounting control unit 21 executes the processing program stored in the mounting storage unit 22, so that the board transport mechanism 5, the component supply unit 6, the component mounting mechanism 11, the component recognition camera 12, the board recognition camera 13, and the display unit 23 By controlling each part of the above, the component mounting operation of mounting the component D supplied from the component supply unit 6 on the substrate B held by the substrate transfer mechanism 5 is executed. Further, the mounting control unit 21 monitors the state of each part during the component mounting work. For example, the remaining number of parts D that can be supplied by each tape feeder 7 mounted on the component supply unit 6, the operating status of each tape feeder 7, the suction status of the component D by the mounting head 10, and the like are monitored.

The board recognition camera 13 captures the board recognition mark M and recognizes the board ID. The display unit 23 is a display device such as a liquid crystal panel, and displays various data, notification information, and the like. The communication unit 24 is a communication interface, and is a management computer 3, another component mounting device M2, M3 of the first component mounting line L1, and a second component mounting line L2 (component mounting devices M5 to M7) via the communication network 2. ), Send and receive signals and data to and from the board stocker M4.

In FIG. 3, when the mounting control unit 21 detects the occurrence of a component mounting error from the state of each part during the component mounting work, the mounting of the component D is skipped, and the skipped component D and the board B of the board B whose mounting is skipped are skipped. The ID is associated with the skip information 22a and stored in the mounting storage unit 22. The skip information 22a is transmitted to the management computer 3 via the communication unit 24. For example, component mounting errors include component breakage and component supply error in the tape feeder 7 mounted on the component supply unit 6, suction error in which the suction nozzle cannot suck component D, and component D held by the suction nozzle in the component recognition camera 12. There is a recognition error that cannot be recognized.

Hereinafter, the component D whose mounting is skipped when a component mounting error occurs is referred to as "skip component Ds". Further, the board B on which the mounting of the skip component Ds is skipped is referred to as "skip board Bs". In this way, when the component mounting error occurs, the first component mounting line L1 skips the mounting of the component D (skip component Ds) in which the component mounting error has occurred, and skips the mounting of the skip component Ds. The management computer 3 (management device) is notified of the skip information 22a including the board ID of the skip board Bs and the information of the skip component Ds that was skipped.

In FIG. 3, the management computer 3 includes a management control unit 31, a management storage unit 32, an input unit 33, a display unit 34, and a communication unit 35. The management control unit 31 is an arithmetic unit such as a CPU, and has an internal processing unit such as a skip management unit 31a. The management storage unit 32 is a storage device, and includes component mounting data for overall control of the component mounting system 1, operating status transmitted from each device, the remaining number of components D of the component mounting devices M1 to M3 and M5 to M7, and the like. In addition, skip information 32a and the like are stored.

The input unit 33 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting an operation command or data. The display unit 34 is a display device such as a liquid crystal panel, and displays various data such as skip information 32a, notification information, and the like. The communication unit 35 is a communication interface, and is a first component mounting line L1 (component mounting devices M1 to M3), a second component mounting line L2 (component mounting devices M5 to M7), and a board stocker M4 via the communication network 2. Send and receive signals and data to and from.

The skip management unit 31a stores the skip information 22a notified (transmitted) from the component mounting devices M1 to M3 of the first component mounting line L1 as skip information 32a in the management storage unit 32, and mounts the skip component Ds. The skip information 22a (32a) is notified to the component mounting devices M5 to M7 of the second component mounting line L2. The skip information 22a may be directly notified from the component mounting devices M1 to M3 of the first component mounting line L1 to the component mounting devices M5 to M7 of the second component mounting line L2.

Further, in the skip management unit 31a, the second component mounting line L2 is the first component mounting line based on the skip information 32a and the remaining number of components D of the component mounting devices M5 to M7 of the second component mounting line L2. It is determined whether or not the skip component Ds can be mounted on the skip board Bs carried out from L1. That is, in the component mounting devices M5 to M7 for mounting the skip component Ds on the second component mounting line L2, it is determined whether or not the skip component Ds is out of parts.

When the second component mounting line L2 cannot mount the skip component Ds, the skip management unit 31a notifies the display unit 34 of the management computer 3 to that effect. That is, when the management device 3 (management device) receives the skip information 32a and the second component mounting line L2 cannot mount the skip component Ds, the management computer 3 (management device) notifies the notification unit (display unit 34) to that effect. have.

Further, when the second component mounting line L2 cannot mount the skip component Ds, the skip management unit 31a instructs the board stocker M4 to store the skip board Bs on which the skip component Ds cannot be mounted in the magazine. To send. Further, when the cause of the component mounting error generated in the first component mounting line L1 is a component shortage of the tape feeder 7, the skip management unit 31a displays information on the tape feeder 7 of the component shortage on the display unit 34 (tape feeder). (7 position, part type, etc.) may be notified.

In FIG. 3, the component mounting devices M5 to M7 included in the second component mounting line L2 have the same configuration as the component mounting device M1 described above, and detailed description thereof will be omitted. Hereinafter, the component mounting devices M5 to M7 included in the second component mounting line L2 will be described focusing on the differences from the component mounting devices M1 to M3 included in the first component mounting line L1. The mounting storage unit 22 of the component mounting devices M5 to M7 included in the second component mounting line L2 stores skip information 22a transmitted from the management computer 3 or the component mounting devices M1 to M3 of the first component mounting line L1. Has been done.

The second component mounting line L2 recognizes the board ID by capturing the board recognition mark M of the board B to be carried in by the board recognition camera 13. Based on the skip information 22a, the mounting control unit 21 of each component mounting device M5 to M7 skips only the board B that matches the board ID of the skip board Bs included in the skip information 22a among the carried-in boards B. Mount the component Ds. In this way, the second component mounting line L2 acquires the skip information 22a from the management computer 3 (management device) and mounts the skip component Ds on the skip board Bs. Further, the second component mounting line L2 is carried out to the downstream reflow device M8 without mounting the component D on the boards B other than the skip board Bs carried in.

In FIG. 3, the substrate stocker M4 includes a stocker control unit 41, a stocker storage unit 42, a stocker working unit 43, and a communication unit 44. The communication unit 44 is a communication interface, and exchanges signals and data with and from the management computer 3 via the communication network 2. The stocker control unit 41 controls the stocker work unit 43 in accordance with a command from the management computer 3 to carry in, carry out, and store the board B in the magazine. The stocker storage unit 42 stores the position of the storage shelf of the board B stored in the magazine and the board ID in association with each other. The stocker control unit 41 takes out the board B of the commanded board ID from the magazine and carries it out based on the information stored in the stocker storage unit 42.

Here, the operation of the board stocker M4 based on the command from the management computer 3 will be specifically described. The skip management unit 31a of the management computer 3 determines that the second component mounting line L2 cannot mount the skip component Ds, and determines that the board B (skip board Bs) carried out from the management computer 3 from the first component mounting line L1. Upon receiving the command to store the skip board Bs, the board stocker M4 stores the skip board Bs in the magazine. That is, when the second component mounting line L2 cannot mount the skip component Ds on the skip substrate Bs, the substrate stocker M4 stores the carried-in skip substrate Bs in the magazine.

After storing the skip board Bs in the magazine, the skip management unit 31a determines that the second component mounting line L2 can mount the skip component Ds, and carries out the stored skip board Bs from the management computer 3. Upon receiving the command, the board stocker M4 takes out the designated skip board Bs from the magazine and carries it out to the second component mounting line L2. That is, the board stocker M4 storing the carried-in skip board Bs carries out the skip board Bs in which the second component mounting line L2 can mount the skip component Ds among the stored skip boards Bs.

Further, when there is no command from the management computer 3, that is, when the board B carried in from the first component mounting line L1 is not the skip board Bs, the board stocker M4 does not store the board B in the magazine. It is carried out to the component mounting line L2 of 2.

Next, a component mounting method for mounting the component D on the substrate B in the component mounting system 1 will be described with reference to FIGS. 5 and 6 according to the flow of FIG. First, the board B on which the solder is printed is carried into the first component mounting line L1 (ST1: board carrying step). At this time, the board ID of the board B is recognized by the head component mounting device M1. Next, in the first component mounting line L1, preset components D are mounted at mounting positions in the component mounting devices M1 to M3 in order while transporting the substrate B from upstream to downstream (ST2: component mounting process).

In FIG. 5A, the component D (1) is mounted on the substrate B (1) carried into the component mounting device M1 of the first component mounting line L1 (arrow a1). Next, the component D (2) is mounted on the substrate B (1) carried into the component mounting device M2 (arrow a2 in FIG. 5B). Next, the component D (3) is mounted on the substrate B (1) carried into the component mounting device M3 (arrow a3 in FIG. 5C). In this way, all the components D (1) to D (3) scheduled to be mounted on the first component mounting line L1 are mounted on the substrate B (1).

In FIG. 4, it is then determined whether or not a component mounting error has occurred during the component mounting work on the first component mounting line L1 (ST3: component mounting error determination step). In the example of FIG. 5, in the first component mounting line L1, all the components D (1) to D (3) are mounted without causing a component mounting error, and the management computer is mounted from the component mounting devices M1 to M3. No skip information 22a is notified to 3. In this case, the management computer 3 does not transmit the command for accommodating the board B (1) in the board stocker M4, and the skip information 22a (32a) is not transmitted to the second component mounting line L2. That is, in the component mounting error determination step (ST3), it is determined that no component mounting error has occurred (No).

When it is determined in the component mounting error determination step (ST3) that no component mounting error has occurred (No), the board stocker M4 does not store the board B (1) in the magazine and the second component mounting line L2. (Arrow a4 in FIG. 5D). Then, the second component mounting line L2 is carried out without mounting the component D on the carried-in board B (1) (ST4). The carried-out board B (1) is carried into a reflow device M8 provided downstream of the second component mounting line L2 (arrow a5 in FIG. 5D), and a solder reflow process is executed (ST5 :). Reflow process). That is, the second component mounting line L2 is carried out to the reflow device M8 without mounting the component D on the board B (1) other than the skip board Bs carried in.

FIG. 6 shows an example in which a component mounting error occurs in the first component mounting line. In this example, in the component mounting process (ST2), a component mounting error of the component D (2) occurs in the component mounting device M2. Therefore, it is determined that a component mounting error has occurred (Yes) in the component mounting error determination step (ST3). In FIG. 6A, the mounting of the component D (2) is skipped on the substrate B (2) on which the component D (1) is mounted by the component mounting device M1 and carried into the component mounting device M2 (arrow c1). Is carried out to the component mounting device M3. That is, the component D (2) becomes the skip component Ds, and the substrate B (2) becomes the skip substrate Bs. Next, the substrate B (2) is carried into the component mounting device M3, and the component D (3) is mounted.

In FIG. 4, when it is determined that a component mounting error has occurred in the component mounting error determination step (ST3) (Yes), the component mounting device M2 notifies the management computer 3 of skip information 22a (ST6: skip). Information notification process). That is, when a component mounting error occurs in the first component mounting line L1, the first component mounting line L1 skips the mounting of the component D (2) in which the component mounting error has occurred, and at the same time, the component D (2) Notify the management computer 3 (management device) of the skip information 22a including the board ID of the skip board Bs (board B (2)) whose mounting is skipped and the information of the skip component Ds (part D (2)) that was skipped. .. The notified skip information 22a is stored in the management storage unit 32 as skip information 32a.

Next, the skip management unit 31a determines whether or not the skip component Ds (component D (2)) can be mounted on the second component mounting line L2 (ST7: determination step). When the skip component Ds is out of parts and it is determined that the skip component Ds cannot be mounted on the second component mounting line L2 (No in ST7), the skip management unit 31a displays the component D (2) on the display unit 34. (ST8: Notification process). That is, when the management computer 3 (management device) receives the skip information 22a and the second component mounting line L2 cannot mount the skip component Ds, the display unit 34 (notification unit) notifies that fact.

Next, the skip management unit 31a transmits a command to store the skip board Bs (board B (2)) in the board stocker M4. Upon receiving the command, the board stocker M4 stores the carried-in (arrow c2 in FIG. 6 (b)) skip boards Bs (board B (2)) in the magazine (ST9: board storage step). That is, when the second component mounting line L2 cannot mount the skip component Ds on the skip board Bs, the board stocker M4 stores the carried-in skip board Bs in the magazine.

Even when the worker has not finished replenishing the skip component Ds to the second component mounting line L2, the component mounting work on the first component mounting line L1 is continued. Then, the skip board Bs on which the skip component Ds carried out from the first component mounting line L1 is not mounted is sequentially stored in the board stocker M4. Further, if the component mounting error in the component mounting device M2 is a suction error that can be automatically recovered and the component D (2) can be mounted on the next board B (No in ST3), the board stocker M4 Carries out to the second component mounting line L2 without storing the board B.

In this way, by providing the board stocker M4 between the first component mounting line L1 and the second component mounting line L2, the parts are cut off in the first component mounting system 1 and the second component mounting line L2. Even in the situation where it occurs, the component mounting work can be continued in the component mounting system 1.

In FIG. 4, when it is determined that the skip component Ds can be mounted on the second component mounting line L2 (Yes in ST7), the board stocker M4 carries out the stored skip board Bs (board B (2)). That is, when the second component mounting line L2 can mount the skip component Ds on the skip board Bs, the board stocker M4 storing the carried-in skip board Bs becomes the second of the stored skip boards Bs. The component mounting line L2 carries out the skip board Bs on which the skip component Ds can be mounted downstream. Alternatively, when it is determined that the skip component Ds can be mounted on the second component mounting line L2 when it is carried out from the first component mounting line L1 (Yes in ST7), the board stocker M4 stores the skip board Bs. Without doing so, it is carried out to the second component mounting line L2.

Next, the second component mounting line L2 takes an image of the board recognition mark M of the skip board Bs carried in, collates the board ID, and skips to the skip board Bs that matches the board ID of the acquired skip information 32a (22a). The component Ds is mounted (ST10: skip component mounting process). In FIG. 6 (c), the skip component Ds (D (2)) is mounted on the skip board Bs (board B (2)) carried into the component mounting device M6 of the second component mounting line L2 (arrow c3). NS. That is, the second component mounting line L2 acquires the skip information 32a from the management computer 3 (management device) and mounts the skip component Ds on the skip board Bs.

In FIG. 4, when all the skip components Ds are mounted on the second component mounting line L2, the reflow process (ST5) is executed. That is, the substrate B (2) on which all the components D (1) to D (3) are mounted is carried into the reflow device M8 (arrow c4 in FIG. 6D), and the solder reflow process is executed.

As described above, in the component mounting system 1, the reflow device M8 is provided downstream of the second component mounting line L2, and in the case of the board B other than the skip board Bs, the component D is mounted on the second component mounting line L2. It is carried out to the reflow device M8 without any operation (ST4). Therefore, the component mounting system 1 does not require a branch for separating the completed board B and the skip board Bs in the transport path, and the reflow device M8 can also be configured by one unit.

As described above, the component mounting system 1 includes a first component mounting line L1, a second component mounting line L2, and a management computer 3 (management device) connected by a communication network 2. Then, when a component mounting error occurs in the first component mounting line L1, the first component mounting line L1 skips the mounting of the component D and notifies the management computer 3 of the skip information 22a. Then, the second component mounting line L2 acquires the skip information 22a (32a) from the management computer 3 and mounts the skip component Ds on the skip board Bs. As a result, it is possible to prevent interruption of the component mounting work due to the occurrence of a component mounting error and suppress a decrease in production efficiency of the mounting board.

Next, the configuration of another embodiment of the component mounting system will be described with reference to FIG. 7. In FIG. 7, in addition to the above-mentioned component mounting system 1, the component mounting system 100 further includes a third component mounting line L3, a board distribution device M12, and a second reflow device M13. Hereinafter, in order to distinguish from the second reflow device M13, the reflow device M8 downstream of the second component mounting line L2 is referred to as the first reflow device M8. The second reflow device M13 has a function of executing the solder reflow process in the same manner as the first reflow device M8.

The third component mounting line L3 has the same configuration as the first component mounting line L1 and includes three connected component mounting devices M9 to M11, and the board B carried in from the upstream in the board transport direction. It has a function of mounting component D in order and carrying it out downstream. Hereinafter, the third component mounting line L3 will be described with reference to an example of producing a mounting board of the same board type as the first component mounting line L1. The mounting board produced by the third component mounting line L3 is not limited to the same board type as the mounting board produced by the first component mounting line L1. At least, the width of the substrate B (the width in the direction orthogonal to the substrate transport direction) may be the same.

The third component mounting line L3 is arranged upstream of the second component mounting line L2 and is connected to the substrate stocker M4 via a substrate sorting device M12 disposed downstream of the first component mounting line L1. There is. The board sorting device M12 has a conveyor that holds the substrate B that is carried in from the upstream and carries it out to the downstream, and the conveyor is on the downstream side of the first component mounting line L1 (hereinafter referred to as "first line side"). And a conveyor moving mechanism for moving between the third line and the downstream side of the third component mounting line L3 (hereinafter referred to as "third line side"). As described above, the third component mounting line L3 is arranged in parallel with the first component mounting line L1 upstream of the second component mounting line L2.

In FIG. 7, the second reflow device M13 is arranged downstream of the substrate sorting device M12 on the third line side. The board sorting device M12 receives and holds the board B carried out from the first component mounting line L1 with the conveyor on the first line side. Then, the substrate B to be held is carried out to the board stocker M4, or the conveyor is moved to the third line side and carried out to the second reflow device M13. Further, the board sorting device M12 receives and holds the board B carried out from the third component mounting line L3 while the conveyor is on the third line side. Then, the substrate B to be held is carried out to the second reflow device M13, or the conveyor is moved to the first line side and carried out to the board stocker M4.

The component mounting devices M9 to M11 and the board distribution device M12 of the third component mounting line L3 are connected to the management computer 3 via the communication network 2. The board sorting device M12 moves the conveyor between the first line side and the third line side according to the command of the management computer 3, receives the board B from the upstream, and carries it out to the downstream of the commanded side.

In this way, the component mounting system 100 is arranged upstream of the second component mounting line L2 and in parallel with the first component mounting line L1, and is connected to the management computer 3 (management device) by the communication network 2. A third component mounting line L3 for mounting the component D on the substrate B having the substrate ID carried in from the upstream and carrying it out downstream is further provided. Further, the component mounting system 100 includes a second reflow device M13 arranged downstream of the first component mounting line L1 and in parallel with the second component mounting line L2.

Next, a component mounting method for mounting the component D on the board B in the component mounting system 100 will be described with reference to FIGS. 8 to 10. Hereinafter, referring to the flow of FIG. 4 described above, the same steps as the component mounting method by the component mounting system 1 are designated by the same reference numerals, and detailed description thereof will be omitted. In the first component mounting line L1 and the third component mounting line L3, component mounting work on the substrate B is executed in parallel. Further, in the second component mounting line L2, the skip component Ds is mounted on the skip board Bs in parallel with the component mounting work on the first component mounting line L1 and the third component mounting line L3.

In FIG. 8A, the first component mounting line L1 is carried into the first component mounting line L1 (ST1), and the component D (1) and the component D (2) are mounted on the (ST2) substrate. B (3) is carried into the component mounting device M3 (arrow e1). A component mounting error has occurred in the component mounting device M3 (Yes in ST3), the mounting of the component D (3) on the board B (3) is skipped, and the skip information 22a is transmitted to the management computer 3. (ST6).

Next, when the skip component Ds (D (3)) can be mounted on the second component mounting line L2 (Yes in ST7), the board B (3) is carried into the component mounting device M7 on the second component mounting line L2. (Arrow e2 in FIG. 8B). Next, when the skip component Ds (D (3)) is mounted in the component mounting device M7 (ST10), it is carried into the first reflow device M8 (arrow e3 in FIG. 9A) (ST5).

In FIG. 8A, in the third component mounting line L3, the component mounting work on the board B (4) is performed in parallel with the component mounting work on the board B (3) at the first component mounting line L1. Is being executed. Specifically, the board B (4) carried into the third component mounting line L3 (ST1) and mounted with the component D (1) (ST2) is carried into the component mounting device M10 (arrow f1). There is. A component mounting error has occurred in the component mounting device M10 (Yes in ST3), the mounting of the component D (2) on the board B (4) is skipped, and the skip information 22a is transmitted to the management computer 3. (ST6).

Next, the substrate B (4) is carried into the component mounting device M11 (arrow f2 in FIG. 8B), and the component D (3) is mounted. In FIG. 9A, the substrate B (4) is then carried out to the conveyor (arrow f4) that has moved to the third line side (arrow f3). In FIG. 9B, the conveyor then moves to the first line side while holding the substrate B (4) (arrow f5), and the substrate B (4) is carried into the substrate stocker M4 (arrow f6). ..

Next, when the skip component Ds (D (2)) can be mounted on the second component mounting line L2 (Yes in ST7), the board B (4) is carried into the component mounting device M6 on the second component mounting line L2. (Arrow f7 in FIG. 10A). When the skip component Ds (D (2)) is mounted in the component mounting device M6 (ST10), it is carried into the first reflow device M8 (arrow f8 in FIG. 10B) (ST5).

In this way, when the component mounting error occurs, the third component mounting line L3 skips the mounting of the component D in which the component mounting error has occurred, and notifies the management computer 3 (management device) of the skip information 22a. doing. Then, the second component mounting line L2 acquires the skip information 22a from the management computer 3 (management device), and mounts the skip component Ds on the skip board Bs carried out from the third component mounting line L3. ..

As a result, when a mounting board is produced in parallel on two component mounting lines (first component mounting line L1 and third component mounting line L3), even if a component mounting error occurs in one of them, the mounting board It is possible to suppress a decrease in production efficiency. Further, by using the second component mounting line L2 for mounting the skip component Ds in common, the cost of the component mounting system 100 and the occupied area of the device can be suppressed.

In FIG. 9B, in the first component mounting line L1, the component mounting work on the board B (5) is executed in parallel with the loading work of the board B (4) into the second component mounting line L2. Has been done. In FIG. 9B, the first component mounting line L1 is carried into the first component mounting line L1 (ST1), and the component D (1) and the component D (2) are mounted on the (ST2) substrate. B (5) is carried into the component mounting device M3 (arrow g1). All the components D (1) to D (3) are mounted on the board B (5) without causing a component mounting error in the first component mounting line L1.

Next, the substrate B (5) is carried out to the conveyor moving to the first line side (arrow g2 in FIG. 10A). In FIG. 10B, the conveyor then moves to the third line side while holding the substrate B (5) (arrow g3) and is carried into the second reflow device M13 (arrow g4) (ST5). .. That is, the substrate B (5) is carried out on the second component mounting line L2 without mounting the component D (ST4), and is carried into the second reflow device M13 (ST5).

In addition to the above example, the substrate B on which all the components D (1) to D (3) are mounted on the third component mounting line L3 may be carried into the second reflow device M13 (ST5). .. The management computer 3 is based on the mounting status of the skip component Ds of the second component mounting line L2 and the solder reflow processing of the first reflow device M8 and the second reflow device M13, and the first reflow device M8 and the second reflow device M8. The board distribution device M12 is instructed to distribute the board B so that the solder reflow process can be efficiently executed by being dispersed in the reflow device M13.

In this way, the first component mounting line L1 or the third component mounting line L3 arranged in parallel upstream of the second component mounting line L2 for mounting the skip component Ds on the skip board Bs is the skip board Bs. Is carried out to the second component mounting line L2, and the boards B other than the skip board Bs are carried out to the second reflow device M13 arranged in parallel with the second component mounting line L2. Further, the first component mounting line L1 or the third component mounting line L3 carries the board B other than the skip board Bs into the second component mounting line L2, and the second component mounting line L2 carries in the skip. The component D may be carried out to the first reflow device M8 arranged downstream of the second component mounting line L2 without mounting the component D on the substrate B other than the substrate Bs.

As a result, even if the skip board Bs on which the skip component Ds is mounted is retained in the second component mounting line L2, other than the skip board Bs on which all the components D (1) to D (3) are mounted. The substrate B can be conveyed to the second reflow device M13 to perform the solder reflow process. Further, even when the board mounting work time is shorter than the solder reflow process, the solder reflow process is distributed to the first reflow device M8 and the second reflow device M13 to prevent the board B from staying and to prevent the board B from staying. It is possible to suppress a decrease in production efficiency.

The component mounting system 100 is not limited to the above configuration. For example, three or more component mounting lines (first component mounting line L1, third component mounting line L3, etc.) are arranged in parallel upstream of the second component mounting line L2, and the board sorting device M12 is used. The substrate B may be distributed and conveyed from the upstream component mounting line to the second component mounting line L2. Further, the board stocker M4 may be provided for each component mounting line located upstream of the second component mounting line L2.

Further, the component mounting system 100 does not include the board sorting device M12, and the board B carried out from the first component mounting line L1 or the third component mounting line L3 is removed by the operator from the board stocker M4 or the second component mounting line L3. It may be conveyed to the reflow device M13.

Further, the component D to be mounted on the second component mounting line L2 does not have to be all the components D to be mounted on the upstream component mounting line. For example, the component D that is determined to have almost no error from the past results or the like may be excluded. That is, the type of component D that can be mounted on the second component mounting line L2 may be less than the type of component D that can be mounted on the component mounting line located upstream of the second component mounting line L2. This makes it possible to simplify the configuration of the second component mounting line L2.

Further, in parallel with the second component mounting line L2, a bypass path may be provided to carry the board B other than the skip board Bs carried out from the upstream component mounting line into the first reflow device M8. As a result, even when the skip substrate Bs is retained in the second component mounting line L2, the substrates B other than the skip substrate Bs can be efficiently solder reflowed in the first reflow device M8.

The component mounting system and component mounting method of the present invention have the effect of suppressing a decrease in production efficiency of a mounting board even if a component mounting error occurs, and are useful in the field of component mounting in which components are mounted on a board. Is.

1,100 Component mounting system 2 Communication network (network)
3 Management computer (management device)
B board Bs skip board D part Ds skip part L1 first part mounting line L2 second part mounting line L3 third part mounting line M4 board stocker M8 reflow device

Claims (20)

A first component mounting line provided with a component mounting device for mounting components on a board having a board ID carried in from the upstream and carrying out the components downstream, and a component mounting device provided on the downstream side of the first component mounting line. It is a method of manufacturing a mounting board in a component mounting system including a second component mounting line to be mounted.
In the first component mounting line, when a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped.
In the second component mounting line, the skip is based on the board ID of the skip board on which the mounting of the component is skipped and the skip information including the information of the skip component linked to the board ID and skipped. The skip component is mounted on the board,
The second component mounting line is a method for manufacturing a mounting board in a component mounting system, in which components are carried out downstream without being mounted on a board other than the carried-in skip board. A first component mounting line provided with a component mounting device for mounting components on a board having a board ID carried in from the upstream and carrying out the components downstream, and a component mounting device provided on the downstream side of the first component mounting line. It is a method of manufacturing a mounting board in a component mounting system including a second component mounting line to be mounted.
In the first component mounting line, when a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and the board ID and the board ID of the skip board on which the mounting of the component is skipped are skipped. Notifies the skip information including the information of the skipped skip parts to the downstream in association with
The second component mounting line acquires the skip information associated with the board ID from the first component mounting line, mounts the skip component on the skip board, and mounts the skip component .
The second component mounting line is a method for manufacturing a mounting board in a component mounting system, in which components are carried out downstream without being mounted on a board other than the carried-in skip board. A first component mounting line provided with a component mounting device for mounting components on a board having a board ID carried in from the upstream and carrying out the components downstream, and a component mounting device provided on the downstream side of the first component mounting line. A method for manufacturing a mounting board in a component mounting system including a second component mounting line, a storage unit that can be shared by the first component mounting line and the second component mounting line, and the like.
In the first component mounting line, when a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and the board ID and the board ID of the skip board in which the mounting of the component is skipped are skipped. The skip information including the information of the skipped parts linked with is stored in the storage unit, and the skip information is stored in the storage unit.
The second component mounting line acquires the skip information associated with the board ID from the storage unit, mounts the skip component on the skip board, and mounts the skip component .
The second component mounting line is a method for manufacturing a mounting board in a component mounting system, in which components are carried out downstream without being mounted on a board other than the carried-in skip board. The component mounting system is further provided with a board stocker arranged between the first component mounting line and the second component mounting line and capable of storing a plurality of boards.
The substrate stocker is
When the second component mounting line cannot mount the skip component on the skip board, the carried-in skip board is stored.
The method according to any one of claims 1 to 3, wherein when a component mounting error does not occur in the first component mounting line, the board is carried out to the second component mounting line without being stored. A method for manufacturing a mounting board in a component mounting system. The type of component that can be mounted on the second component mounting line is a component that is determined to have no error based on past results, and is mounted on the component mounting line located upstream of the second component mounting line. The method for manufacturing a mounting board in the component mounting system according to any one of claims 1 to 4, wherein some of the possible components are excluded. Loading said substrate stocker which stores the skip substrate was, among the skip substrate that contains, unloading the skip substrate on which the second component mounting line can implement the skip part downstream claim 4 A method for manufacturing a mounting board in the component mounting system described in 1. The component mounting system includes a management device connected to the first component mounting line, the second component mounting line, and a network.
A component is mounted on a board having a board ID, which is arranged upstream of the second component mounting line and in parallel with the first component mounting line, is connected to the management device by the network, and has a board ID carried in from the upstream. Further equipped with a third component mounting line to be carried downstream
3. A method for manufacturing a mounting board in the component mounting system described in any one of them. The component mounting system further includes a reflow device downstream of the second component mounting line.
The mounting in the component mounting system according to any one of claims 1 to 7, wherein the second component mounting line is carried out to the reflow device without mounting components on a board other than the skip board that has been carried in. Substrate manufacturing method. The management device has a notification unit and has a notification unit.
The mounting board in the component mounting system according to claim 7, wherein when the management device receives the skip information, if the second component mounting line cannot mount the skip component, the notification unit notifies that fact. Manufacturing method. The component mounting system comprises a conveyor that has one end connected to the second component mounting line and the other end connected to the first component mounting line or the third component mounting line.
The method for manufacturing a mounting board in the component mounting system according to claim 7, wherein the transfer conveyor is connected to the second component mounting line at one end when the carried-in substrate is the skip substrate. A first component mounting line provided with a component mounting device for mounting a component on a board having a board ID carried in from the upstream and carrying out the component downstream, and a component mounting device provided on the downstream side of the first component mounting line. It is a component mounting method for mounting a component on the board in a component mounting system including a second component mounting line.
In the first component mounting line, when a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped.
In the second component mounting line, the skip is based on the board ID of the skip board on which the mounting of the component is skipped and the skip information including the information of the skip component linked to the board ID and skipped. The skip component is mounted on the board,
The second component mounting line is a component mounting method in which components are carried out downstream without being mounted on a board other than the carried-in skip board. A first component mounting line provided with a component mounting device for mounting components on a board having a board ID carried in from the upstream and carrying out the components downstream, and a component mounting device provided on the downstream side of the first component mounting line. A component mounting method for mounting the component on the board in a component mounting system including a second component mounting line.
In the first component mounting line, when a component mounting error occurs, the mounting of the component in which the component mounting error has occurred is skipped, and the board ID and the board ID of the skip board on which the mounting of the component is skipped are skipped. Notifies the skip information including the information of the skipped skip parts to the downstream in association with
The second component mounting line acquires the skip information associated with the board ID from the first component mounting line, mounts the skip component on the skip board, and mounts the skip component .
The second component mounting line is a component mounting method in which components are carried out downstream without being mounted on a board other than the carried-in skip board. A first component mounting line provided with a component mounting device for mounting components on a board having a board ID carried in from the upstream and carrying out the components downstream, and a component mounting device provided on the downstream side of the first component mounting line. A component that mounts the component on the board in a component mounting system including a second component mounting line to be mounted, and a storage unit that can be shared by the first component mounting line and the second component mounting line. It ’s an implementation method,
The first component mounting line, if the part article mounting error occurs, the component mounting error skip parts mounting generated, the substrate and the ID of the skip substrate mounted is skipped of the component substrate Skip information including information on the skipped skip component associated with the ID is stored in the storage unit.
The second component mounting line acquires the skip information associated with the board ID from the storage unit, mounts the skip component on the skip board, and mounts the skip component .
The second component mounting line is a component mounting method in which components are carried out downstream without being mounted on a board other than the carried-in skip board. The component mounting system is further provided with a board stocker arranged between the first component mounting line and the second component mounting line and capable of storing a plurality of boards.
The substrate stocker is
When the second component mounting line cannot mount the skip component on the skip board, the carried-in skip board is stored.
The method according to any one of claims 11 to 13, wherein when a component mounting error does not occur in the first component mounting line, the board is carried out to the second component mounting line without being stored. Component mounting method. The type of component that can be mounted on the second component mounting line is a component that is determined to have no error based on past results, and is mounted on the component mounting line located upstream of the second component mounting line. The component mounting method according to any one of claims 11 to 14, excluding some of the possible components. When the second component mounting line becomes capable of mounting the skip component on the skip board, the board stocker that stores the carried-in skip board is the second of the stored skip boards. The component mounting method according to claim 14, wherein the skip board on which the skip component can be mounted is carried out downstream. The component mounting system is
A management device connected to the first component mounting line and the second component mounting line via a network,
A component is mounted on a board having a board ID, which is arranged upstream of the second component mounting line and in parallel with the first component mounting line, is connected to the management device by the network, and has a board ID carried in from the upstream. Further equipped with a third component mounting line to be carried downstream
13. The component mounting method described in either. The component mounting system further includes a reflow device downstream of the second component mounting line.
The component mounting method according to any one of claims 11 to 17, wherein the second component mounting line is carried out to the reflow device without mounting components on a board other than the skip board that has been carried in. The management device has a notification unit and has a notification unit.
The component mounting method according to claim 17, wherein when the management device receives the skip information and the second component mounting line cannot mount the skip component, the notification unit notifies that fact. The component mounting system comprises a conveyor that has one end connected to the second component mounting line and the other end connected to the first component mounting line or the third component mounting line.
The component mounting method according to claim 17, wherein the transfer conveyor has one end connected to the second component mounting line when the carried-in substrate is the skip substrate.

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