JP6948111B2 - Resin compositions, conductive copper pastes, and semiconductor devices - Google Patents

Description

The present invention relates to resin compositions, conductive copper pastes, and semiconductor devices, and more particularly to resin compositions, conductive copper pastes, and semiconductor devices having low resistivity when fired in the atmosphere.

Semiconductor devices in which the electrode portion of a semiconductor element and the conductive portion of a substrate are bonded to each other are very widely used. For bonding the electrode portion of a semiconductor element and the conductive portion of a substrate, a conductive adhesive or solder is used. Electrodes are used. The conductive adhesive has an advantage that it can be bonded at a lower temperature than soldering, but since it has a higher specific resistance than solder, lowering the resistance of the conductive adhesive has been studied.

Conventional conductive adhesives use silver as the conductive filler. However, due to the migration property of silver and the soaring price, the use of copper as a conductive filler is being considered. Further, the conductive adhesive using this copper is also required to cure easily oxidizable copper in the air atmosphere.

As a paste using copper as a conductive filler, a conductive copper paste containing copper powder having a predetermined particle size distribution and tap density, a thermosetting resin, an organic carboxylic acid, and a chelating agent, and polybutadiene as an essential component is disclosed. (Patent Document 1, claims 1, 0013, 0022).

This conductive copper paste is capable of screen printing, has good conductivity comparable to that of conductive silver paste, and has migration resistance, and is suitable for fine pitch compatible through holes. Specific examples of the organic carboxylic acid include salicylic acid, benzoic acid, tartaric acid, citric acid, maleic acid, succinic acid, fumaric acid, and malonic acid (paragraph 0008 of Patent Document 1). 0018 paragraph 0018 of Patent Document 1). All of these organic carboxylic acids are solid at room temperature.

A circuit characterized by containing a metal powder containing copper, a compound containing at least two (meth) acrylic groups, and a β-dicarbonyl compound, substantially free of azo compounds and peroxides. A conductive paste for a substrate is disclosed (Patent Document 2, claim 1). It is described that the conductive paste for a circuit board may contain a compound having flux activity (paragraph 0014 of Patent Document 2), and an aliphatic carboxylic acid such as oleic acid is used as the compound having flux activity. It is mentioned (Patent Document 2, paragraphs 0038 and 0046).

In addition, it contains a prepolymer having at least two or more hydroxyl groups in one molecule and containing one or more tertiary amines, copper powder, an amino resin, and a reducing agent, and can be etched with an acidic etching solution. A conductive copper paste composition is disclosed (Patent Document 3 claim 1), and unsaturated monocarboxylic acids having 12 to 23 carbon atoms such as oleic acid and linoleic acid are mentioned as reducing agents (Patent). 0016 paragraph 0016 of Document 3).

However, these conductive copper pastes have a problem that their specific resistance becomes high when they are held under high temperature and high humidity after curing (for example, temperature: 85 ° C., humidity 85%, 500 hours). all right.

Japanese Unexamined Patent Publication No. 2008-130301 JP-A-2009-295895 Japanese Unexamined Patent Publication No. 10-064333

As a result of diligent research, the present inventors have obtained a specific resistance after curing in the air by using a copper powder, a thermosetting resin, a fatty acid, an amine or an amine compound, and a specific wet dispersant in combination. We have found a resin composition having a low resistivity and a small change in resistivity even after holding under high temperature and high humidity, and a conductive copper paste using this resin composition. That is, the present invention provides a resin composition having a low specific resistance after curing in the air and a small change in specific resistance even after holding at high temperature and high humidity, and a conductive copper paste using this resin composition. With the goal.

The present invention relates to a resin composition, a conductive copper paste, a cured product of the conductive copper paste, and a semiconductor device that solve the above problems by having the following configurations.
[1] Containing (A) copper powder, (B) thermosetting resin, (C) fatty acid, (D) amine or amine compound, and (E) wet dispersant having a decomposition temperature of 250 ° C. or lower. A characteristic resin composition.
[2] The resin composition according to the above [1], wherein the component (E) is a dicarboxylic acid salt having a molecular weight of 490 or less.
[3] The component (E) is the general formula (1):

(In the formula, R ₁ and R ₂ are H, Na or Cu, respectively).
The resin composition according to the above [1] or [2], which is represented by.
[4] The resin composition according to any one of the above [1] to [3], wherein the component (B) is a resol type phenol resin.
[5] The above-mentioned [1] to [4], wherein the component (C) is at least one selected from the group consisting of oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid and lauric acid. Resin composition.
[6] The resin composition according to any one of the above [1] to [5], wherein the component (D) is triethanolamine.
[7] A conductive copper paste using the resin composition according to any one of the above [1] to [6].
[8] A cured product of the conductive copper paste according to the above [7].
[9] A semiconductor device comprising a cured product of the resin composition according to any one of the above [1] to [6].

According to the present invention [1], a resin composition having a low specific resistance after curing in the air and a small change in specific resistance even after holding at high temperature and high humidity, and a conductive copper paste using this resin composition are provided. be able to.

According to the present invention [7], it is possible to provide a conductive copper paste using a resin composition having a low specific resistance after curing in the atmosphere and a small change in specific resistance even after holding at high temperature and high humidity. According to the present invention [8], it is possible to provide a cured product of a low resistance conductive copper paste for obtaining a highly reliable semiconductor device. According to the present invention [9], for example, a highly reliable semiconductor device having a small connection resistance value between the electrode portion of the semiconductor element and the conductive portion of the substrate can be obtained.

(E) This is an example of the result of simultaneous measurement of thermogravimetric analysis and differential thermal analysis of the component.

[Resin composition]
The resin composition of the present invention (hereinafter referred to as a resin composition) has (A) copper powder, (B) thermosetting resin, (C) fatty acid, (D) amine or amine compound, and (E) decomposition temperature. It is characterized by containing a wet dispersant having a temperature of 250 ° C. or lower.

The copper powder as the component (A) imparts conductivity to the cured resin composition. This resin composition is superior from the viewpoint that the specific resistance after curing does not change significantly depending on the content of the component (A). The average particle size of the component (A) is preferably in the range of 1 to 10 μm from the viewpoint of the oxygen content and the specific resistance of the resin composition after curing. Examples of the component (A) include rod-shaped, flake-shaped, and spherical copper powder, and the component (A) is a rod-shaped copper powder obtained by crushing particle-shaped dendritic copper powder (electrolytic copper powder). However, it is more preferable. Further, when the tap density of the component (A) is high, it is preferable from the viewpoint of the specific resistance of the resin composition after curing. Commercially available products of the component (A) include electrolytic copper powder (ECY-4B, specific surface area: 0.223 m ² / g, tap density: 4.65 g / cm ³ , average particle size: 6) manufactured by Mitsui Metal Mining Co., Ltd. .7 μm). Here, the specific surface area is measured by the BET method, the tap density is measured by a shaking specific gravity measuring machine (tap machine), and the average particle size is measured by a laser diffraction / scattering type particle distribution measuring device. The component (A) may be used alone or in combination of two or more.

The thermosetting resin as the component (B) imparts adhesiveness and curability to the conductive copper paste. As the component (B), a phenol resin is preferable, and a resol type phenol resin is more preferable, from the viewpoint of thermosetting shrinkage and adhesion. Commercially available products of the component (B) include a resol-type phenol resin manufactured by Showa Polymer Co., Ltd. (product name: Shonor CKM-918A) and a resol-type phenol resin manufactured by Showa Polymer Co., Ltd. (product name: Shonor CKM-908). ), Resol-type phenol resin manufactured by Gunei Chemical Co., Ltd. (product name: Registop PL-6317), and resol-type phenol resin manufactured by DIC Co., Ltd. (product name: Phenolite J-325). The component (B) may be used alone or in combination of two or more. In addition, a solid resin such as a resol type phenol resin may be used after being heated and mixed with a diluent which is a component (E) described later to make a liquid when preparing a paste.

The fatty acid as the component (C) functions as a flux component that elutes the oxide layer on the surface of the copper powder. The component (C) is preferably in the form of a chain. As the component (C),
Oleic acid (CH ₃ (CH ₂ ) ₇ CH = CH (CH ₂ ) ₇ COOH, cis-9-octadecenoic acid, liquid),
Linoleic acid (CH _3- (CH ₂ ) ₄ -CH = CHCH ₂ CH = CH (CH ₂ ) ₇ COOH, cis-9, cis-12-octadecazienoic acid, liquid),
Linolenic acid _{(CH 3 CH 2 CH = CHCH} 2 CH = CHCH 2 CH = CH (CH 2) 7 COOH, cis-9, cis-12, cis-15-octadecatrienoic acid, liquid),
Stearic acid (CH ₃ (CH ₂ ) ₁₆ COOH, octadecanoic acid, white solid),
Palmitic acid (CH ₃ (CH ₂ ) ₁₄ COOH, hexadecanoic acid, white solid), and lauric acid (CH ₃ (CH ₂ ) ₁₀ COOH, dodecanoic acid, white solid)
At least one selected from the group consisting of is more preferable from the viewpoint of excellent wettability with copper powder, and oleic acid is further preferable. The component (C) may be used alone or in combination of two or more.

The amine or amine compound as the component (D) immobilizes the copper ions eluted by the flux effect of the component (C) and suppresses the action of the carboxyl group of the fatty acid at room temperature (25 ° C.). The component (D) preferably contains triethanolamine (TEA, N (CH ₂ CH ₂ OH) ₃ ), 2,2'-iminodiethanol (diethanolamine), or o-aminophenol (2-aminophenol). , Triethanolamine is more preferable from the viewpoint of pot life. The component (D) may be used alone or in combination of two or more.

The wet dispersant as the component (E) is a wet dispersant having a decomposition temperature of 250 ° C. or lower, and is a wet portion that acts as a surfactant between the copper powder and other components, and a dispersion that prevents the copper powder from settling or agglomerating. Has a part. Here, the decomposition temperature of the component (E) is measured under the conditions of sample mass: 3 g, atmospheric atmosphere, and heating rate: 10 ° C./min using a thermogravimetric / differential thermal simultaneous measurement (TG-DTA) device. It is measured from the inflection point of the thermogravimetric curve of. FIG. 1 shows an example of the results of simultaneous measurement of thermogravimetric analysis and differential thermal analysis of component (E). As can be seen from FIG. 1, the decomposition temperature of the component (E) used in this measurement is 243 ° C. It can be confirmed that 243 ° C. is the decomposition temperature from the fact that the DTA curve shows heat generation. The component (E) used at this time is a dicarboxylic acid weak anion-based dispersant (product name: HypermerKD-57) manufactured by CRODA Co., Ltd. The component (E) reduces the specific resistance of the cured resin composition. Specifically, the component (E) blocks oxygen to the component (A) by wetting the copper powder which is the component (A) with other components, and (A). It is considered that the component is rust-proofed and, in addition, the conductive path of the component (A) is strengthened. The component (E) is preferably branched, and the component (E) is a dicarboxylic acid having a molecular weight of 490 or less. A salt is more preferable, and the general formula (1):

(In the formula, R ₁ and R ₂ are H, Na or Cu, respectively).
The dicarboxylic acid salt represented by is more preferable, and R ₁ and R ₂ are particularly preferable from the viewpoint of the dielectric strength of the cured resin composition. Here, it is considered that the alkyl group on the left side of the dicarboxylic acid salt represented by the general formula (1) is hydrophobic and serves as a dispersion part, and the two carboxyl groups on the right side are hydrophilic and serve as a dispersion part. .. _{Examples of commercially available products in which R 1} and R ₂ are H in the general formula (1) include a dicarboxylic acid weak anion-based dispersant manufactured by CRODA Co., Ltd. (product name: Hypermer KD-57, decomposition temperature: 243 ° C.). ..

The component (A) is 80 to 98 parts by mass with respect to a total of 100 parts by mass of the components (A) and (B) from the viewpoint of the adhesiveness of the resin composition and the specific resistance of the resin composition after curing. It is preferably 85 to 95 parts by mass, and more preferably 85 to 95 parts by mass.

Further, in the case of the cured product of the resin composition, the component (A) is preferably 80 to 98 parts by mass, preferably 85 to 95 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). It is more preferable that it is a part. Here, since the mass loss of the resin composition during curing is as small as less than 1%, the preferable content of the component (A) in the cured product is the same as the content of the component (A) before curing. .. Here, the quantitative analysis of the component (A) is performed by a thermogravimetric analyzer.

From the viewpoint of the curability of the resin composition and the specific resistance of the resin composition after curing, the component (B) is 2 to 20 parts by mass with respect to 100 parts by mass in total of the components (A) and (B). Is preferable, and 5 to 15 parts by mass is more preferable.

Further, in the case of the cured product of the resin composition, the component (B) is preferably 2 to 20 parts by mass, preferably 5 to 15 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). It is more preferable that it is a part. Here, the quantitative analysis of the component (B) is performed by an ion chromatograph-mass spectrometer.

The amount of the component (C) is preferably 0.5 to 3 parts by mass, more preferably 1 part by mass, based on 100 parts by mass of the total of the components (A) and (B). If the amount of the component (C) is less than 0.5 parts by mass, the specific resistance of the cured resin composition tends to be high, and if it is more than 3 parts by mass, the pot life of the resin composition tends to be short.

Further, in the case of the cured product of the resin composition, the component (C) is preferably 1 to 3 parts by mass with respect to 100 parts by mass in total of the components (A) and (B). Here, the quantitative analysis of the component (C) is performed by an ion chromatography-mass spectrometer.

The amount of the component (D) is preferably 1 to 10 parts by mass, more preferably 3 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). If the amount of the component (D) is less than 1 part by mass, the pot life of the resin composition tends to be short, and if it is more than 10 parts by mass, the specific resistance value of the cured resin composition tends to be high.

The component (E) is preferably 0.2 to 5 parts by mass, more preferably 0.25 to 3 parts by mass, and even more preferably 1 part by mass. If it is less than 0.2 parts by mass, the moisture resistance of the cured resin composition tends to decrease, and if it is more than 5 parts by mass, the specific resistance of the cured resin composition tends to increase.

Further, as the resin composition, a diluent can be used from the viewpoint of melting / liquefaction when the component (B) is solid and adjusting the viscosity of the resin composition. The diluent can be appropriately selected in consideration of the solubility of the thermosetting resin and the curing conditions. Specifically, ethyl carbitol, ethyl carbitol acetate, butyl carbitol, butyl carbitol acetate, terpineol, etc. Dihydroterpineol, ethyl cellosolve, butyl cellosolve, ethyl cellosolve acetate, butyl cellosolve acetate, phenoxyethanol and the like can be mentioned, and phenoxyethanol (product name: Highsolve EPH) manufactured by Toho Kagaku Co., Ltd. can be used from the viewpoint of drying property of the resin composition. preferable.

The diluent is preferably 10 to 20 parts by mass with respect to 100 parts by mass of the resin composition.

The resin composition of the present invention contains a curing accelerator such as imidazole (for example, 2-phenyl-4-methyl-5, manufactured by Shikoku Kasei Kogyo Co., Ltd.) as necessary, as long as the object of the present invention is not impaired. Hydroxymethylimidazole (trade name: Curesol 2P4MHZ-PW), leveling agent, colorant, ion trap agent, defoamer, flame retardant, other additives and the like can be blended.

The resin composition of the present invention can be obtained, for example, by stirring, melting, mixing, and dispersing components (A) to (E) and other additives at the same time or separately, with heat treatment if necessary. Can be done. The device for mixing, stirring, dispersing, etc. is not particularly limited, but a Raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill, and the like can be used. .. Moreover, you may use these devices in combination as appropriate.

The initial viscosity of the resin composition is preferably in the range of 20 to 25 Pa · s from the viewpoint of screen printability. Here, the initial viscosity of the resin composition is measured within 24 hours after the resin composition is prepared, using a Brookfield type viscometer (model number: HBDV-1, No. 14 rotor) at 25 ° C. and 10 rotations. do.

The resin composition of the present invention is formed and applied to a desired position of an electronic component such as a conductive portion of a substrate or an electrode portion of a semiconductor element by screen printing, a dispenser or the like.

The curing conditions of the resin composition of the present invention are preferably 150 to 300 ° C. for 5 to 60 minutes, and particularly suitable is a high temperature and short time of 200 to 220 ° C. for 20 to 40 minutes. The cured product of the resin composition has a low resistivity.

The resin composition of the present invention is preferably used for a conductive copper paste, and is suitable as an adhesive for electronic parts such as an electrode portion of a semiconductor element and a conductive portion of a substrate.

[Semiconductor device]
The semiconductor device of the present invention has a cured product of the above-mentioned resin composition, that is, a cured product of a conductive copper paste. The semiconductor device includes, for example, a substrate having a conductive portion and a semiconductor element having an electrode portion, and is a cured film of a resin composition which is a cured product of the above resin composition. Are joined.

The semiconductor device of the present invention has a small connection resistance value between the electrode portion of the semiconductor element and the conductive portion of the substrate, and is highly reliable.

The present invention will be described with reference to Examples, but the present invention is not limited thereto. In the following examples, parts and% indicate parts by mass and% by mass unless otherwise specified.

In the examples and comparative examples,
As the component (A), electrolytic copper powder manufactured by Mitsui Metal Mining Co., Ltd. (product name: ECY-4B, oxygen content: 0.11%, specific surface area: 0.223 m ² / g, tap density: 4.65 g / cm ³ , Average particle size: 6.7 μm),
As the component (B), a resol type phenol resin (product name: Shonor CKM-918A) manufactured by Showa Denko Corporation was used.
As the component (C), oleic acid, stearic acid, and palmitic acid manufactured by Wako Pure Chemical Industries, Ltd. are used.
As the component (D), triethanolamine (TEA, 2,2', 2 "-nitrilotriethanol), 2,2'-iminodiethanol (diethanolamine), o-aminophenol (2) manufactured by Wako Pure Chemical Industries, Ltd. -Aminophenol),
As a component (E), a dicarboxylic acid weak anion-based dispersant manufactured by CRODA Co., Ltd. (product name: HypermerKD-57, decomposition temperature: 243 ° C.),
As a component (E'), a dicarboxylic acid weak anionic dispersant manufactured by CRODA Co., Ltd. (product name: HypermerKD-16, decomposition temperature: 350 ° C.); lauroyl sarcosine manufactured by Kawaken Fine Chemical Co., Ltd. (product name: Soipon SLA, decomposition temperature: 294). ℃), oleoyl sarcosine (product name: Soipon SOA, decomposition temperature: 320 ° C, lauroylmethyl-β-alanine (product name: Alanon ALA, decomposition temperature: 338 ° C), diethanol stearate (product name: amizole SDE, decomposition temperature: 333) ℃), diethanol stearate (product name: amizole SDHE, decomposition temperature: 339 ° C), diethanol oleate (product name: amizole ODE, decomposition temperature: 341 ° C), diethanol oleate (product name: amizole ODHE, decomposition temperature: 345 ° C) , PEG-2 cocamine (Viscofine E2C, decomposition temperature: 295 ° C.), fatty acid ester (Hinoact KF-1000, decomposition temperature: 291 ° C.), amino group-containing polyester (product name: Hinoact KF-1300M, decomposition temperature: 358 ° C.) Here, the decomposition temperature of the component (E) and the component (E') was determined by using a thermal weight / differential heat simultaneous measuring device (model number: TG8120) manufactured by Shimadzu Corporation, sample mass: 3 g, and atmosphere. The temperature was measured under the conditions of atmosphere and temperature rise rate: 10 ° C./min. CRODA dicarboxylic acid weak anionic dispersant (product name: HypermerKD-16 is a chemical formula (2) :.

It is represented by.
As a diluent, a diluent manufactured by Toho Chemical Industry Co., Ltd. (product name: High Solve EPH) was used.

[Examples 1 to 11, Comparative Examples 1 to 15, Reference Examples 1 to 2]
The raw materials were uniformly kneaded with a three-roll mill at the ratios shown in Tables 1 to 4 to prepare a resin composition. A resin composition is prepared by uniformly kneading the component (A), the component (B), the component (C), the component ( D) , and the component (E) (or the component (E')) with a three-roll mill. bottom. Finally, the viscosity was measured with a Brookfield type viscometer (model number: HBDV-1, No. 14, rotor, 10 rpm), and a diluent was added so as to be in the range of 20 to 25 Pa · s. When the component (B) was solid and difficult to knead, the component (B) was dissolved in a part of the diluent in advance, and then the other components were kneaded.

〔Evaluation method〕
<< Initial viscosity measurement >>
Within 24 hours after preparing the resin composition, the resin composition was measured at 25 ° C. and 10 rotations using a Brookfield type viscometer (HBDV-1, No. 14 rotor). The results are shown in Tables 1 to 4 (listed in the viscosity row).

<< Measurement of resistivity >>
A pattern of width: 1 mm and length: 71 mm is printed on an alumina substrate with a screen printing machine, and heat-treated in the air at 200 ° C. for 30 minutes in a belt conveyor type curing furnace to cure. rice field. The film thickness of the obtained resin composition cured film was measured by using a surface roughness shape measuring machine manufactured by Tokyo Precision Co., Ltd. (model number: Surfcom 1500SD-2), and the resistivity value was measured by Digital Multi manufactured by TFF Keithley Instruments Co., Ltd. Each measurement was performed using a meter (model number: 2001), and the volume resistivity was calculated and used as the specific resistance. The specific resistance is ^{preferably 1.2 × 10 -4} Ω · cm or ^{less, and more preferably 1.0 × 10 -4} Ω · cm or less. The results are shown in Tables 1-5 (listed in the resistivity row in Tables 1-4 and in the initial column in Table 5).

<< Evaluation of change in resistivity after holding at high temperature and high humidity >>
The specific resistance of the cured resin composition film after being left for 100, 200, 250, 300, 500 hours in an environment of temperature: 85 ° C. and humidity: 85% for which the above specific resistance was measured was measured. Further, {[(specific resistance after holding for each time) − (initial specific resistance)] / (initial specific resistance) × 100} was defined as the specific resistance change rate (unit:%). The specific resistance change rate is preferably 20% or less. Table 5 shows the results.

《Measurement of strength》
A 1.5 mm □ block pattern was printed on the alumina substrate with a screen printing machine, a 3216 size alumina chip was placed on the alumina substrate, and the mixture was heat-treated at 200 ° C. for 30 minutes in a belt conveyor type curing furnace to cure. After curing, the shear strength at a loading speed of 12 mm / min was measured using a tabletop strength tester (model number: 1605HTP) manufactured by Aiko Engineering. The strength is preferably 500 N / cm ² or more. The results are shown in Tables 1 to 4.

As can be seen from Tables 1 to 5 , in all of Examples 1 to 11 , the specific resistance of the cured resin composition was low, the rate of change in specific resistance was low, and the strength was high. On the other hand, Comparative Example 1 in which the component (E) was not used and Comparative Examples 2 to 12 in which the component (E') was used instead of the component (E) had a high resistivity change rate. Here, the Hypermer KD-16 used in Comparative Example 2 has a structure similar to that of the Hypermer KD-57 used as the component (E) as shown in the chemical formula (2), but has a decomposition temperature of 350 ° C. The rate of change in resistivity was high. In Comparative Examples 11 and 12, the initial resistivity was also high. Further, in Comparative Example 13 which did not contain the component (C) and the component (D) and Comparative Example 14 which did not contain the component (D), the initial specific resistance value was very high. Comparative Example 15 containing no component (C) is not shown in Table 3, but when kept at room temperature (25 ° C.), the viscosity becomes 1.2 times or more the initial viscosity in 6 days or less. The pot life was not good.

As described above, the resin composition of the present invention is very useful as a conductive copper paste because it has a low resistivity after curing in the atmosphere and a small change in resistivity even after holding at high temperature and high humidity.

Claims (7)

(A) copper powder, (B) thermosetting resin, (C) fatty acid, (D) amine or amine compound, and (E) general formula (1):

(In the formula, R ₁ and R ₂ are H, Na or Cu, respectively).
Contains a wetting dispersant having a decomposition temperature of 250 ° C. or lower, represented by
The component (A) is 80 to 98 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B), and the component (B) is a total of 100 parts by mass of the component (A) and the component (B). It is 2 to 20 parts by mass with respect to the mass part, and the component (C) is 0.5 to 3 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B), and (D). The component) is 1 to 10 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B), and the component (E) is a total of 100 parts by mass of the component (A) and the component (B). The resin composition is characterized by having a mass of 0.2 to 5 parts by mass. Component (B) is a resol type phenol resin, according to claim 1 Symbol placement of the resin composition. The resin composition according to claim 1 or 2 , wherein the component (C) is at least one selected from the group consisting of oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid and lauric acid. The resin composition according to any one of claims 1 to 3 , wherein the component (D) is triethanolamine. A conductive copper paste using the resin composition according to any one of claims 1 to 4. The cured product of the conductive copper paste according to claim 5. A semiconductor device comprising a cured product of the resin composition according to any one of claims 1 to 4.

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