JP6903459B2 - Electroplating equipment and electroplating method - Google Patents

Description

The present invention relates to electroplating equipment, in particular such machines equipped with many movable workpiece transfer means, and electroplating methods.

As shown in FIG. 1, in the conventional electroplating apparatus shown as 10 as a whole, many workpiece transporting means 12 are relative to pass through the tank 14 containing the electroplating solution. It is possible to move to. Each work piece transporting means 12 is removable from each work piece to be electroplated. When the workpiece is mounted on the workpiece transporting means 12, the workpiece and the workpiece transporting means 12 are electrically connected to each other. The workpiece transporting means 12 can move continuously in the tank 14 in a row, that is, one after another, whereby the workpiece is sequentially moved so as to pass through the tank 14. Let me. The work piece to be electroplated is usually rectangular and has a flat shape. When the workpiece is mounted on the workpiece transporting means 12 and transported, the opposing main surfaces of the workpiece face sideways and the workpiece is oriented in a vertical state. As a result, the electroplating apparatus is called a continuous vertical electroplating apparatus.

The cathode rod 16 is fixed to the tank 14 of the electroplating apparatus 10, and each of the workpiece transporting means 12 is electrically connected to the cathode rod 16 via each slide contact 18, whereby the workpiece is processed. While the object transporting means 12 is relatively moving so as to pass through the tank 14, it is electrically connected to the cathode rod 16. Many anode plates 20, each energized by each power source 22, are located in the tank 14 and fixed to the tank 14. Therefore, when the workpiece moves in the electroplating solution in the tank 14 by the workpiece transporting means 12, the workpiece is exposed to an electric field between the cathode rod 16 and the anode plate 20 and is in the electroplating solution. Metal deposits on the workpiece.

It is generally known that the effective cover area of such electroplating equipment can be as short as the width of the workpiece. The total amount of metal electroplated on the workpiece depends primarily on the amp-hours consumed by the workpiece in the electroplating solution during the electroplating process and is therefore supplied to each workpiece. It is important to control the amount of current. However, in the conventional electroplating apparatus 10, if the electrical resistance of the workpiece is different or the workpiece transporting means 12 is different, the electric plating apparatus 10 is supplied to each of the workpieces moving in the tank 14. It becomes very difficult to control the current. This is because, during electroplating, the workpiece and workpiece transfer means 12 with lower electrical resistance consumes more current and the workpiece and workpiece with higher electrical resistance. This is because the object transporting means 12 consumes less current.

Therefore, an object of the present invention is to provide an electroplating apparatus and an electroplating method for alleviating the above defects, or at least to provide a useful alternative to commerce and the public. In particular, it has been found that at least the above defects can be mitigated by further improvements and technological innovations based on the automatic electroplating system disclosed in Chinese Patent Application Publication No. 1034369646A.

According to the first feature of the present invention, at least one tank for accommodating the electroplating solution and the first work piece to be electroplated are detachable and movable relative to the tank. It is provided with a first transport means and a second transport means that is removable from the second workpiece to be electroplated and is movable relative to the tank, and the first transport means is at least one first. The second transport means is electrically connected to a power source and can move at the same time as the first power source, and the second transport means is electrically connected to at least one second power source and can move at the same time as the second power source. An electroplating apparatus is provided in which one power source and the second power source are electrically connected to at least one grounded common conductor.

According to the second feature of the present invention, (a) the first workpiece is detachably attached to and electrically connected to the first transport means, and (b) passes through a tank containing an electroplating solution. In addition, the first transport means is moved relative to the tank, and (c) at least one first power source is associated with the first transport means so as to be movable at the same time as the first transport means, (d). ) Power is supplied from the first power source to the first transport means, (e) the second workpiece is detachably attached to and electrically connected to the second transport means, and (f) a tank for accommodating the electroplating solution. The second transport means is moved so as to pass through the tank and relative to the tank, and (g) at least one second power source can be moved at the same time as the second transport means. (H) Power is supplied from the second power source to the second transport means, and (i) the current supplied to the first transport means and the current supplied to the second transport means are individually adjusted to (i). j) Provided is a method of electroplating at least one workpiece comprising the step of electrically connecting a first power source and a second power source to at least one grounded common conductor.

Schematic of a conventional electroplating apparatus. The schematic diagram of the electroplating apparatus which concerns on 1st Embodiment of this invention. The schematic diagram of the electroplating apparatus which concerns on 2nd Embodiment of this invention.

An embodiment of the present invention will be described as an example with reference to the accompanying drawings. A schematic view of the continuous vertical electroplating apparatus according to the first embodiment of the present invention is shown in FIG. 2, and the whole is shown as 100.

The electroplating apparatus 100 includes a tank 102 for accommodating the electroplating solution. Many workpiece transporting means 104, five of which are shown in FIG. 2, pass through the tank 102 and are relatively sequentially movable. Each work piece transporting means 104 is physically and electrically connected to the work piece to be electroplated and becomes removable in order to establish a physical and electrical connection with the work piece. There is.

Each work piece conveying means 104 is fixed and electrically connected to a set of power supplies 106a and 106b such as a current regulator. The plurality of power supplies 106a are electrically connected to the first common anode 108, and each power supply 106a is a slide contact 112a for performing a sliding motion relative to the anode 108 while maintaining an electrical connection with the anode 108. Is electrically connected to the anode 108, a plurality of power supplies 106b are electrically connected to the second common anode 110, and each power supply 106b is an anode while maintaining an electrical connection with the anode 110. It is electrically connected to the anode 110 via each slide contact 112b for performing a sliding motion relative to the 110. Therefore, the power supplies 106a and 106b of each set can move relative to the tank 102 at the same time together with the workpiece transporting means 104 to which they are electrically and physically connected to each other. The power supply 106a is electrically connected between the anode 108 and the workpiece conveying means 104, and the power supply 106b is electrically connected between the anode 110 and the workpiece conveying means 104. Many anode plates 114, six of which are shown in FIG. 2, are located within the tank 102 and are secured to the tank 102.

The two anodes 108 and 110 may both be grounded. Alternatively, the two anodes 108, 110 may be set to a voltage of, for example, 5 volts. If appropriate, the two anodes 108 and 110 may be set to different voltages.

The electric power from each of the power sources 106a and 106b connected to each workpiece transport means 104 to each workpiece transport means 104 can be adjusted individually. In particular, the power supplies 106a and 106b can be set to the current control mode, so that even if the electrical resistances of the individual workpiece transfer means 104 and the individual workpieces are different, each workpiece is different. The various power supplies 106a and 106b are controlled so that the currents supplied to the transport means 104 (and the workpieces transported by the workpiece transport means 104) are the same. The total amount of metal electroplated on the work piece depends primarily on the amp-hours consumed by the work piece in the electroplating solution during the electroplating process in the tank 102, and thus all work work. By controlling all the power supplies 106a and 106b to supply the same current to the object transporting means 104 (and all the workpieces transported by the workpiece transporting means 104), the individual workpieces are transported. Even if the electrical resistance of the individual workpieces differs from that of the means 104, a more uniform and consistent electroplating result can be obtained regardless of this.

A schematic view of the continuous vertical electroplating apparatus according to the second embodiment of the present invention is shown in FIG. 3, and the whole is shown as 200.

The electroplating apparatus 200 includes a tank 202 for accommodating the electroplating solution. Many workpiece transport means 204 (four of which are shown in FIG. 3) pass through the tank 202 and are relatively sequentially movable. Each workpiece transport means 104 is physically and electrically connected to each electroplated workpiece 205 and is removable to establish a physical and electrical connection with the workpiece 205. It has become.

Each work piece conveying means 204 is fixed and electrically connected to a set of power supplies 206a and 206b such as a current regulator. The plurality of power supplies 206a are electrically connected to the split anode 208, and each power supply 206a is a slide contact 212a for performing a sliding motion relative to the split anode 208 while maintaining an electrical connection with the split anode 208. Is electrically connected to the split anode 208 via. The plurality of power supplies 206b are electrically connected to the split anode 210, and each power supply 206b is a slide contact 212b for performing a sliding motion relative to the split anode 210 while maintaining an electrical connection with the split anode 210. Is electrically connected to the split anode 210 via. Therefore, each pair of the power supplies 206a and 206b can move relative to the tank 202 at the same time together with the workpiece transporting means 204 to which they are electrically and physically connected to each other. The power supply 206a is electrically connected between the split anode 208 and the workpiece conveying means 204, and the power supply 206b is electrically connected between the split anode 210 and the workpiece conveying means 204.

As described above, the anodes 208 and 210 are both separated. In particular, the anode 208 is split at many positions 220 so as to form a plurality of electrically separated split portions 222. Therefore, while the electroplating apparatus 200 is in operation and the workpiece 205 is moving so as to pass through the tank 202, each power supply 206a is arranged continuously (in series) but is electrically charged. Although the power supply 206b is arranged continuously (in series), it moves relative to the plurality of divided portions 222 of the anode 208 which is separated and is continuously electrically connected. It moves relative to the plurality of divided portions 226 of the anode 210 that are electrically separated and is continuously electrically connected. For example, while the workpiece transport means 204 electrically connected to the power supply 206 is relatively moving so as to pass through the tank 202 of the electroplating apparatus 200, the power supply 206a is the first of the anode 208. It moves so as to be continuously electrically connected to the split portion 222, then to the second split portion 222, and then to the third split portion 222. Here, the first, second, and third divided portions 222 are sequentially arranged in the longitudinal direction and electrically separated from each other.

With such an arrangement, it is possible to individually control the voltage of each divided portion 222 of the anode 208, whereby different electroplating effects can be obtained, that is, different products can be electroplated. Similarly, the anode 210 is also split at many positions 224 so as to form a plurality of electrically separated splits 226. With such a configuration, it is possible to individually control the voltage of each divided portion 226 of the anode 210, whereby different electroplating effects can be obtained, that is, different products can be electroplated. Each cathode side of the power supplies 206a, 206b is electrically connected to the grounded common conductor 230 via each slide contact 229, and thus each cathode side (and each cover) of the power supplies 206a, 206b. The workpieces 205) transported to the workpiece transport means 204 are also connected to each other. The grounded common conductor 230 may be a grounded housing of the electroplating apparatus 200.

The electric power supplied from the power supplies 206a and 206b connected to the workpiece transport means 204 to the workpiece transport means 204 can be individually adjusted. In particular, the power supplies 206a and 206b can be set to the current control mode, so that even if the electrical resistances of the individual workpiece transport means 204 and the individual workpieces are different, each workpiece Various power supplies 206a, connected to the same split 226 of the anode 210, so that the currents supplied to the transport means 204 (and each workpiece transported by each workpiece transport means 204) are the same. 206b is controlled. Similarly, it is connected to the same divided portion 222 of the anode 208 so that the current supplied to each workpiece transporting means 204 (and each workpiece transported by each workpiece transporting means 204) is the same. Various power supplies 206a and 206b are controlled. The total amount of metal electroplated on the workpiece depends primarily on the amperage time consumed by the workpiece in the electroplating solution during the electroplating process in the tank 202, so each anode 208, All power supplies so that the same current is supplied to all the workpiece transfer means 204 (and all the workpieces conveyed by the workpiece transfer means 204) in each of the divisions 222 and 226 of 210. By controlling 206a and 206b, even if the electrical resistances of the individual workpiece transport means 204 and the individual workpieces are different, a more uniform and consistent electroplating result can be obtained regardless of the difference. be able to.

By electrically connecting each cathode side of the power supplies 206a and 206b to a grounded common conductor 230 (for example, a grounded housing of the device 200), the work piece is conveyed by a plurality of workpiece transfer means 204. The voltages applied to both ends of the plurality of workpieces 205 are the same, and therefore the edge effect is reduced. In addition, in existing electroplating equipment, a large current flows through the common cathode conductor, which causes a further potential difference between the workpiece 205. On the other hand, in the electroplating apparatus 200 according to the present invention, since the power supplies 206a and 206b locally generate electricity, it is not necessary to pass a large current, and this further reduces the potential difference between the workpiece 205.

It is understood that the above is only a feasible example of the present invention and that various modifications and / or replacements can be made without departing from the gist of the present invention.

Further, for example, certain features of the invention described in separate embodiments for clarity may be combined into one embodiment. Conversely, for example, the various features of the invention described in one embodiment for brevity may be separate embodiments or any suitable partial combination.

Claims (16)

With at least one tank containing the electroplating solution,
A first transport means that is removable from the first electroplated workpiece and can move relative to the tank.
It is equipped with a second transport means that is removable from the second work piece to be electroplated and can move relative to the tank.
The first transport means is electrically connected to at least one first power source that supplies an electric current to the first transport means, and can move at the same time as the first power source.
The second transport means is electrically connected to at least one second power source that supplies an electric current to the second transport means, and can move at the same time as the second power source.
The first power source and the second power source are electrically connected to at least one grounded common conductor .
The first power supply and the second power supply can be controlled so that the current supplied to the first transport means and the current supplied to the second transport means are substantially the same.
The first power source and the second power source are electrically connected to at least one split anode.
The grounded common conductor is the housing of the device.
An electroplating apparatus in which the cathode side of the first power source and the cathode side of the second power source are electrically connected to the grounded common conductor. The electroplating apparatus according to claim 1, wherein the first power source is slidable with respect to the grounded common conductor via a first slide contact. The electroplating apparatus according to claim 1, wherein the second power source is slidable with respect to the grounded common conductor via a second slide contact. The electroplating apparatus according to claim 1, wherein the first transport means is electrically connected to at least one third power source and can move at the same time as the third power source. The electroplating apparatus according to claim 4, wherein the second transport means is electrically connected to at least one fourth power source and can move at the same time as the fourth power source. The first power supply, the second power supply, the third power supply, and the fourth power supply so that the current supplied to the first transport means and the current supplied to the second transport means are substantially the same. The electroplating apparatus according to claim 5, wherein the power supply is controllable. The electroplating apparatus according to claim 1, wherein the first power supply and the second power supply are current regulators, respectively. The electroplating apparatus according to claim 5, wherein the third power supply and the fourth power supply are current regulators, respectively. The electroplating apparatus according to claim 1, wherein the electric power supplied to the first conveying means and the electric power supplied to the second conveying means can be individually adjusted. The electroplating apparatus according to claim 1 , wherein the split anode includes at least a first split portion and a second split portion that are electrically separated from each other. (A) The first workpiece is detachably attached to the first transport means and electrically connected.
(B) The first transport means is moved so as to pass through the tank containing the electroplating solution and relative to the tank.
(C) At least one first power source is associated with the first transport means so as to be movable at the same time as the first transport means.
(D) Electric power is supplied from the first power source to the first transport means, and the electric power is supplied to the first transport means.
(E) The second workpiece is detachably attached to the second transport means and electrically connected.
(F) The second transport means is moved so as to pass through the tank containing the electroplating solution and relative to the tank.
(G) At least one second power source is associated with the second transport means so as to be movable at the same time as the second transport means.
(H) Power is supplied from the second power source to the second transport means,
(I) The current supplied to the first transport means and the current supplied to the second transport means are individually adjusted.
(J) Electroplating at least one workpiece comprising the step of electrically connecting the first power source and the second power source to at least one grounded common conductor .
(K) The first power supply and the second power supply are electrically connected to a split anode including at least one first split portion and one second split portion electrically separated from each other, and the first power supply is electrically connected. The cathode side of the first power supply and the cathode side of the second power supply are electrically connected to the grounded common conductor.
(L) A method of controlling the first power supply and the second power supply so that the current supplied to the first transport means and the current supplied to the second transport means are substantially the same. A step (m ) of associating a third power source with the first transport means so as to be movable at the same time as the first transport means, and associating a fourth power source with the second transport means so as to be movable at the same time as the second transport means 11. The method of claim 11 , further comprising step (n). The first power source is electrically connected to the first division section of the divided anode, the second power source is electrically connected to the second divided portion of the divided anode of claim 11 Method. At least to electrically connect the first power supply to the first split portion of the split anode and then at least electrically connect the first power supply to the second split portion of the split anode. The method according to claim 11 , further comprising the step (o) of moving the first power source. The method according to claim 11 , wherein the grounded common conductor is a housing of an electroplating apparatus. The first power supply, the second power supply, the third power supply, and the fourth power supply so that the current supplied to the first transport means and the current supplied to the second transport means are substantially the same. 12. The method of claim 12 , further comprising a step (p) of controlling the power supply.

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