JP6893023B2 - Polishing equipment - Google Patents

Description

The present invention relates to a polishing apparatus in which a temperature control structure in which a temperature control fluid flows is formed on the back side of a polishing surface.

Conventionally, in order to perform temperature control such as cooling of a surface plate for polishing a work such as a silicon wafer, a polishing device provided with a temperature control structure in which a fluid for temperature control flows on the back side of a polishing surface in contact with the work has been known. Has been done. The temperature control structure in this polishing device has, for example, a temperature control fluid flow path that spirally extends from a water supply port provided near the inner edge of the surface plate toward a drainage port formed near the outer edge. (For example, refer to Patent Document 1) or a surface plate having a plurality of flow paths extending in the circumferential direction and allowing the temperature of the temperature adjusting fluid flowing through each flow path to be individually adjusted (for example, Patent Document 1). (See a few).

Jikkai Sho 59-151655 Japanese Unexamined Patent Publication No. 2002-373875 Japanese Unexamined Patent Publication No. 2002-23948

However, in the temperature control structure having the fluid flow path extending in a spiral shape, the temperature control efficiency of the polished surface gradually decreases from the center portion of the surface plate to the outer edge portion. Therefore, it is not possible to preferentially and efficiently control the temperature of a region intended as a main temperature control target, such as a region having a high contact ratio with the work during work polishing. Therefore, due to the influence of the polishing heat generated by the polishing of the work, there arises a problem that the temperature of the polished surface is partially raised or the polishing conditions are partially deviated in connection with the temperature rise.
On the other hand, in a temperature control structure in which the temperature of the temperature control fluid flowing through a plurality of flow paths can be individually adjusted, it is necessary to have a plurality of fluid supply / discharge paths, which increases the size of the device and complicates control. Problems such as

The present invention has been made by paying attention to the above problems, and preferentially and efficiently adjusts the temperature of a region intended as the main temperature control target of the polished surface without complicating the structure, and is accompanied by polishing of the work. It is an object of the present invention to provide a polishing apparatus capable of suppressing a partial change in the temperature of a polished surface or a partial deviation of the polishing conditions in connection therewith.

In order to achieve the above object, the present invention is a polishing device provided with a surface plate having a temperature control structure in which a temperature control fluid flows on the back side of a polishing surface for polishing a work.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the drain port for discharging the temperature control fluid, the water supply port and the drain port, and the inner edge portion of the surface plate. It has a plurality of flow paths extending along a plurality of concentric circles arranged in order from the outer edge to the outer edge, and a partition wall extending in the radial direction of the surface plate to partition the concentric circles. There is.
Then, the plurality of flow paths extend once in the circumferential direction of the surface plate and communicate with each other through a folded portion along the partition wall to form a single route connected as a whole of the polished surface. .. Further, the temperature control fluid supplied from the water supply port flows in the flow path along the first concentric circle in the first direction, then folds back along the partition wall, and flows along the second concentric circle. It flows into the path, flows in the flow path along the second concentric circle in the direction opposite to the first direction, and is discharged from the drain port.

As a result, the temperature of the region intended as the main temperature control target of the polished surface is preferentially and efficiently controlled without complicating the structure, and the temperature of the polished surface changes partially as the work is polished, or In connection with this, it is possible to prevent the polishing conditions from partially deviating.

It is sectional drawing which shows schematic about the whole structure of the polishing apparatus of Example 1. FIG. It is a top view which shows the cooling structure of the polishing apparatus of Example 1. FIG. It is explanatory drawing explaining the region when the polished surface of a surface plate is divided. It is a top view which shows the cooling structure of the polishing apparatus of a comparative example. It is explanatory drawing which shows the cooling state of the polished surface by the cooling structure of the comparative example. It is explanatory drawing which shows the flow direction of the cooling water in the cooling structure of Example 1. FIG. It is explanatory drawing which shows the cooling state of the polished surface by the cooling structure of Example 1. FIG. It is a top view which shows the 1st modification of the cooling structure of Example 1. FIG. It is a top view which shows the 2nd modification of the cooling structure of Example 1. FIG.

Hereinafter, a mode for carrying out the polishing apparatus of the present invention will be described with reference to Example 1 shown in the drawings. In the following embodiments, the temperature control structure of the present invention will be described as a cooling structure.

(Example 1)
First, the configuration will be described.
The polishing device 1 in the first embodiment is a double-sided polishing device that polishes both the front and back surfaces of a thin plate-shaped work W such as a semiconductor wafer, a crystal wafer, a sapphire wafer, a glass wafer, or a ceramic wafer. Hereinafter, the configuration of the polishing apparatus 1 of the first embodiment will be described separately as "overall configuration", "detailed configuration of surface plate", and "detailed configuration of cooling structure".

[overall structure]
FIG. 1 is a cross-sectional view schematically showing the overall configuration of the polishing apparatus of the first embodiment. Hereinafter, the overall configuration of the polishing apparatus of the first embodiment will be described with reference to FIG.

As shown in FIG. 1, the polishing apparatus 1 of the first embodiment rotates around the lower surface plate 2 and the upper surface plate 3 and the lower surface plate 2 and the upper surface plate 3 arranged concentrically around the axis L1. A freely arranged sun gear 4, an internal gear 5 arranged on the outer peripheral side of the lower surface plate 2 and the upper surface plate 3, and a work holding hole (not shown) arranged between the lower surface plate 2 and the upper surface plate 3. ) Is formed and has a carrier plate 6. Further, a polishing pad 2a is attached to the upper surface of the lower surface plate 2, and a polishing pad 3a is attached to the lower surface of the upper surface plate 3. The surfaces of the polishing pads 2a and 3a serve as polishing surfaces for polishing the work W.

The lower platen 2, the sun gear 4, and the internal gear 5 are connected to a drive device (not shown) via drive shafts 7a, 7b, and 7c, respectively, and are rotationally driven.

Further, the carrier plate 6 meshes with the sun gear 4 and the internal gear 5. Then, the carrier plate 6 revolves around the axis L1 while rotating due to the rotation of the sun gear 4 and the internal gear 5. By the rotation and revolution of the carrier plate 6 and the rotation of the lower surface plate 2 and the upper surface plate 3, both sides of the work W arranged in the work holding hole are polished by the polishing pads 2a and 3a.

The upper surface plate 3 is suspended and supported by a rod 8b of the elevating actuator 8 via a surface plate suspension 8a attached to the upper surface of the upper surface plate 3. Here, a centering bearing 8c is interposed at the tip of the rod 8b. As a result, the upper surface plate 3 is swayably and rotatably suspended and supported by the elevating actuator 8.

On the other hand, a driver drive shaft 9 rotated by a drive device (not shown) is inserted into the drive shaft 7b to which the sun gear 4 is fixed, and the upper end portion 9a of the driver drive shaft 9 is the upper end opening 7d of the drive shaft 7b. Protruding from. A driver 10 is fixed to the upper end portion 9a, and the driver 10 rotates integrally with the driver drive shaft 9. Further, a groove portion (not shown) with which the hook 3b provided on the upper surface plate 3 is engaged is formed on the outer peripheral surface of the driver 10. Then, the rod 8b extends and the upper surface plate 3 moves downward, and the hook 3b engages with the groove portion of the driver 10, so that the upper surface plate 3 rotates integrally with the rotation of the driver 10. It has become.

That is, the upper surface plate 3 moves up and down by the expansion and contraction operation of the rod 8b, and rotates by the rotation operation of the driver drive shaft 9. Further, the upper surface plate 3 is provided with a supply hole (not shown) for supplying the polishing slurry.

[Detailed configuration of surface plate]
The lower platen 2 of the polishing apparatus 1 of the first embodiment has a cooling structure on the back side of the polished surface in order to suppress a partial temperature change of the polished surface (surface of the polishing pad 2a) due to frictional heat generated during the polishing process of the work W. 40 (temperature control structure) is formed. As shown in FIG. 1, the lower surface plate 2 has a lower flat plate member 21, a lower jacket member 22, and a lower surface plate receiving member 23.

The lower flat plate member 21 is a plate member having a flat surface on which the polishing pad 2a is attached, and is located on the uppermost surface of the lower platen 2. The lower flat plate member 21 is formed of a low thermal expansion material having a small coefficient of linear expansion and being resistant to thermal deformation.

The lower jacket member 22 is a plate member fixed to the back side (lower surface) of the lower flat plate member 21, and a cooling structure 40 is formed on the surface facing the lower flat plate member 21. The tip of the partition wall 46 (see FIG. 2) that partitions the flow path 43 of the cooling structure 40 is fixed to the lower flat plate member 21. Further, the lower jacket member 22 is made of stainless steel having a larger coefficient of linear expansion and higher rigidity than the lower flat plate member 21 and the lower surface plate receiving member 23.

The lower surface plate receiving member 23 is a plate member fixed to the back side (lower surface) of the lower jacket member 22 and to which the drive shaft 7a is fixed.

The upper surface plate 3 of the polishing apparatus 1 of the first embodiment is cooled on the back side of the polished surface in order to suppress a partial temperature change of the polished surface (the surface of the polishing pad 3a) due to frictional heat generated during the polishing process of the work W. A structure 40 (temperature control structure) is formed. As shown in FIG. 1, the upper surface plate 3 has an upper flat plate member 31 and an upper jacket member 32.

The upper flat plate member 31 is a plate member having a flat surface on which the polishing pad 3a is attached, and is located on the lowermost surface of the upper surface plate 3. The upper flat plate member 31 is formed of a low thermal expansion material having a small coefficient of linear expansion and being resistant to thermal deformation.

The upper jacket member 32 is a plate member that is fixed to the back side (upper surface) of the upper flat plate member 31 and is suspended and supported by the surface plate suspension 8a. The upper jacket member 32 has a cooling structure 40 formed on a surface facing the upper flat plate member 31. Incidentally, the tip of the partition wall 46 for partitioning the flow path 43 of the cooling structure 40 is fixed to the upper side flat plate member 3 1. Further, the upper jacket member 32 is made of stainless steel having a larger coefficient of linear expansion and higher rigidity than the upper flat plate member 31.

[Detailed configuration of cooling structure]
FIG. 2 is a plan view showing a cooling structure of the polishing apparatus of the first embodiment. Hereinafter, the detailed configuration of the cooling structure of the first embodiment will be described with reference to FIG.

A cooling structure 40 is formed on both the lower jacket member 22 and the upper jacket member 32 of the first embodiment. The cooling structure 40 circulates cooling water (fluid for temperature control) supplied from a cooling water circulation device (not shown), and exchanges heat between the cooling water and the lower flat plate member 21 or the upper flat plate member 31. The lower flat plate member 21 and the upper flat plate member 31 are cooled. Since the cooling structure 40 formed on the lower jacket member 22 and the cooling structure 40 formed on the upper jacket member 32 have the same configuration, the cooling structure formed on the lower jacket member 22 will be described below. 40 will be described.

As shown in FIG. 2, the cooling structure 40 of the first embodiment has a flow path communicating the water supply port 41 for supplying cooling water, the drainage port 42 for discharging the cooling water, and the water supply port 41 and the drainage port 42. It has 43 and a partition wall 44 extending along the radial direction of the lower platen 2.

The water supply port 41 is an opening of a vertical hole penetrating the lower jacket member 22 in the axis L1 direction, and communicates with a water supply channel (not shown) connected to a water discharge port of a cooling water circulation device (not shown). The water supply channel has a vertical hole extending in the axial direction inside the drive shaft 7a and a horizontal hole extending horizontally inside the lower surface plate receiving member 23.

The drainage port 42 is an opening of a vertical hole penetrating the lower jacket member 22 in the axis L1 direction, and communicates with a drainage channel (not shown) connected to the water absorption port of the cooling water circulation device. The opening area of the drainage port 42 is set to the same size as the water supply port 41. The drainage channel has a vertical hole extending in the axial direction inside the drive shaft 7a and a horizontal hole extending horizontally inside the lower surface plate receiving member 23.

The flow path 43 is a groove through which cooling water flows from the water supply port 41 toward the drain port 42. The flow path 43 is partitioned by a partition wall 46 formed on the lower jacket member 22, and extends along a plurality of concentric circles arranged in the radial direction of the lower platen 2. The flow path 43 of the first embodiment is along a plurality of concentric circles (here, five concentric circles, first concentric circles R1 to fifth concentric circles R5) arranged in order from the inner edge portion α to the outer edge portion β of the lower platen 2. It also has a first flow path 43a, a second flow path 43b, a third flow path 43c, a fourth flow path 43d, and a fifth flow path 43e.

It should be noted that, inside the first flow path 43a formed at the position closest to the inner edge portion α along the first concentric circle R1 located on the innermost circumference, a plurality of the first flow paths 43a are lined up in the extending direction ( Here, two drainage ports 42) are formed. Further, along the second concentric circle R2 located second from the innermost circumference, inside the second flow path 43b adjacent to the first flow path 43a, a plurality of lines are arranged in the extending direction of the second flow path 43b. Here, two water supply ports 41) are formed. That is, in the first embodiment, the drainage port 42 is formed inside the lower platen 2 rather than the water supply port 41.

The flow path 43 extends along a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) and extends in the circumferential direction of the lower platen 2, but is folded back along the partition wall 44. .. That is, of the flow paths 43, the second flow path 43b and the third flow path 43c communicate with each other at the first folding section 45a, and the third flow path 43c and the fourth flow path 43d communicate with each other at the second folding section 45b. The fourth flow path 43d and the fifth flow path 43e communicate with each other at the third folding section 45c, and the fifth flow path 43e and the first flow path 43a communicate with each other at the fourth folding section 45d. The first to fifth flow paths 43a to 43e form one cooling water route connected as a whole by folding back the intermediate positions of the lower platen 2 along the circumferential direction.

The partition wall 44 is a wall surface extending in the radial direction of the lower platen 2. The partition wall 44 partitions the intermediate positions of a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) along the flow path 43. Further, the partition wall 44 of the first embodiment is a second partition that partitions the first partition wall 44a that partitions all of the first concentric circles R1 to the fifth concentric circles R5 and the second, third, and fourth concentric circles R2, R3, and R4. It has a wall 44b and.
That is, the first folded portion 45a and the third folded portion 45c are formed along the first partition wall 44a, and the second folded portion 45b is formed along the second partition wall 44b. Further, a fourth folded-back portion 45d that communicates the fifth flow path 43e and the first flow path 43a is formed between the first partition wall 44a and the second partition wall 44b.

Next, the action will be described.
First, the configuration and problems of the surface plate having the cooling structure of the comparative example will be described, and then the operation of the polishing apparatus of Example 1 will be described as "surface plate cooling effect during polishing", "different material combination operation", and " The description will be divided into "characteristic action depending on the formation position of the water supply port and the drainage port" and "other characteristic action".

[Structure and issues of surface plate with cooling structure of comparative example]
FIG. 3 is an explanatory view showing a region where the polished surface of the surface plate is divided, FIG. 4 is a plan view showing a cooling structure of the polishing apparatus of the comparative example, and FIG. 5 is a polished surface by the cooling structure of the comparative example. It is explanatory drawing which shows the surface temperature of. Hereinafter, the configuration and problems of the surface plate having the cooling structure of the comparative example will be described with reference to FIGS. 3 to 5.

Generally, in a polishing apparatus for polishing a work such as a silicon wafer, a carrier plate is sandwiched between a lower surface plate and an upper surface plate, and the work is arranged inside a work holding hole formed in the carrier plate. Therefore, the moving range of the work is limited by the carrier plate. On the other hand, the carrier plate meshes with the sun gear and the internal gear. Therefore, the work holding hole needs to be formed at a predetermined distance from the inner peripheral edge and the outer peripheral edge of the carrier plate.

As a result, as shown in FIG. 3, the surface plate polishing surface K is between the central region A located at the center of the surface plate, the outer edge region C along the outer edge of the surface plate, and the central region A and the outer edge region C. When divided into the intermediate region B located in, the intermediate region B, which has the highest ratio of contact with the work as the work is polished, is the central region due to the frictional heat generated between the work and the work (hereinafter referred to as "working heat"). It is known that the temperature is higher than that of A and the outer edge region C.

On the other hand, in the cooling structure 100 (temperature control structure) of the comparative example, as shown in FIG. 4, the entire surface plate is radially divided into 15 equal parts by the dividing wall surface 101 extending in the radial direction, and the surface plate is divided into 15 equal parts in each divided region. A water supply port 102 and a drainage port 103, and a flow path forming wall 104 extending from the inner edge portion α toward the outer edge portion β are formed, respectively. Here, the water supply port 102 and the drainage port 103 are located at positions sandwiching the flow path forming wall 104, and both are formed in the vicinity of the inner edge portion α of the surface plate.

In the cooling structure 100 of such a comparative example, the cooling water (temperature control fluid) flowing out from the water supply port 102 is the outer edge portion β of the surface plate along the flow path forming wall 104 as shown by the arrow in FIG. Flow toward. Then, this cooling water passes through the gap 106 between the flow path forming wall 104 and the outer peripheral wall 105 formed along the outer edge portion β, and then passes along the flow path forming wall 104 along the inner edge portion α of the surface plate. It flows toward the drainage port 103.

That is, in the cooling structure 100 of this comparative example, the cooling water flows in the radial direction in each of the divided regions radially divided into 15 equal parts, and is folded back along the outer edge portion β. Therefore, the entire surface of the polished surface of the surface plate X having the cooling structure 100 is cooled substantially evenly. As a result, on the polished surface of the surface plate X, as shown in FIG. 5, the intermediate region B having a high probability of contacting the work becomes about 23 ° C. to 24 ° C. due to the influence of the processing heat generated during the work polishing. Therefore, the temperature becomes higher than that of the central region A and the outer edge region C, which are suppressed to 23 ° C. or lower. That is, in the surface plate X having the cooling structure 100 of this comparative example, the temperature of the polished surface partially rises as the work is polished, and a part of the polished surface is thermally deformed and distorted, maintained or maintained at a constant rate. Fine polishing conditions for which internal changes are desirable deviate locally. In addition, there is a risk of locally promoting deterioration of the surface of the polishing pad. Due to the action of one or a combination of these phenomena, it is possible that the surface of the work cannot be polished uniformly, resulting in a decrease in polishing accuracy.

Further, in the cooling structure 100 of the comparative example, the divided wall surface 101 and the flow path forming wall 104 extend in the radial direction of the surface plate in order to form the flow path along the radial direction of the surface plate. Therefore, when the surface plate X is suspended during transportation, the bending moment force is applied to the divided wall surface 101 and the flow path forming wall 104. Here, when the divided wall surface 101 and the flow path forming wall 104 are formed concentrically, the bending moment force flows on the concentric circles and acts, so that the force can be dispersed. However, in the case of the cooling structure 100 of the comparative example, the drag against the bending moment force depends on the rigidity of the divided wall surface 101 and the flow path forming wall 104. Therefore, unless the rigidity of the divided wall surface 101 and the flow path forming wall 104 is increased, the surface plate tends to be bent and deformed.
Therefore, for example, it is necessary to devise a fixing method during rough machining of the surface plate, shorten the transport time (hanging time) during surface plate manufacturing, and require a predetermined curing time after machining. In addition, there is a problem that the quality of the surface plate X is affected, and the delivery date is delayed.

Further, in the cooling structure 100 of this comparative example, since the divided wall surface 101 and the flow path forming wall 104 extend in the radial direction of the surface plate, the tips of the divided wall surface 101 and the flow path forming wall 104 are cut. At that time, the machined surface becomes continuous in the radial direction of the surface plate X. Therefore, there is also a problem that the radial deflection of the surface plate X due to the influence of the residual stress generated by this cutting process becomes large.

[Surface plate cooling action during polishing]
FIG. 6 is an explanatory view showing the flow direction of the cooling water in the cooling structure of the first embodiment, and FIG. 7 is an explanatory view showing the surface temperature of the polished surface by the cooling structure of the first embodiment. Hereinafter, the surface plate cooling action during the polishing process in the polishing apparatus 1 of the first embodiment will be described with reference to FIGS. 6 and 7. The cooling structure 40 in the lower surface plate 2 and the cooling structure 40 in the upper surface plate 3 can exert the same operation. Therefore, in the following, only the cooling structure 40 formed on the lower platen 2 will be described.

In the cooling structure 40 of the lower surface plate 2 included in the polishing apparatus 1 of the first embodiment, when cooling water is supplied from a cooling water circulation device (not shown), the cooling water is supplied to the lower jacket member 22 and the lower surface plate receiving member 23. It flows out from the water supply port 41 through a water supply channel (not shown) formed inside the water supply port 41. At this time, a plurality (two) of water supply ports 41 are provided along the extending direction of the second flow path 43b, but the same amount of cooling water flows out from all the water supply ports 41 at substantially the same time.

The cooling water flowing out from the water supply port 41 first fills the second flow path 43b of the flow path 43 in which the water supply port 41 is formed, and then, as shown by an arrow in FIG. 6, the first folding portion 45a It flows into the third flow path 43c via. The cooling water that has flowed into the third flow path 43c flows in the third flow path 43c in the counterclockwise direction shown in FIG. 6, and flows into the fourth flow path 43d via the second folding portion 45b. Then, the cooling water that has flowed into the fourth flow path 43d flows in the fourth flow path 43d in the clockwise direction shown in FIG. 6, and flows into the fifth flow path 43e via the third turn-back portion 45c. Further, the cooling water that has flowed into the fifth flow path 43e flows in the fifth flow path 43e in the counterclockwise direction shown in FIG. 6, and flows into the first flow path 43a via the fourth turn-back portion 45d.

Then, the cooling water that has flowed into the first flow path 43a is discharged from the drain port 42 formed in the first flow path 43a. At this time, although a plurality (two) of the drainage ports 42 are provided along the extending direction of the first flow path 43a, the same amount of cooling water is discharged from all the drainage ports 42.

Then, heat exchange is performed between the cooling water flowing through the flow path 43 and the lower flat plate member 21 provided with the polishing pad 2a, and the surface (polishing surface) of the polishing pad 2a is cooled.

Here, in the cooling structure 40 of the first embodiment, the cooling water is supplied from the water supply port 41 → the second flow path 43b → the third flow path 43c → the fourth flow path 43d → the fifth flow path 43e → the first flow path 43a →. It flows with the drain port 42. Therefore, the flow path 43 cools the entire surface of the polished surface with one cooling route. As a result, the water supply / drainage route can be made into a simple structure, and the structure can be prevented from becoming complicated. Further, since the flow path 43 is one route, the flow velocity of the cooling water flowing through the flow path 43 can be improved. Therefore, the heat transfer coefficient by the cooling water becomes high, and the temperature control efficiency can be improved.

Further, the third flow path 43c is formed along the third concentric circle R3 located third from the innermost circumference. The fourth flow path 43d is formed along the fourth concentric circle R4 located fourth from the innermost circumference. Here, the third flow path 43c and the fourth flow path 43d are flow paths formed at positions facing the intermediate region B (see FIG. 3) having the highest ratio of contact with the work W during work polishing. ..

On the other hand, in this cooling structure 40, the cooling water flowing out from the second flow path 43b in which the water supply port 41 is formed flows into the third flow path 43c and then flows in order to the fourth flow path 43d. There is. Therefore, in the cooling structure 40 of Example 1, the flow paths (third flow path 43c and fourth flow path 43d) facing the intermediate region B where the cooling water having a relatively low temperature becomes relatively high during polishing of the work. Can be flushed to. That is, the third flow path 43c and the fourth flow path 43d, which have high temperature control efficiency, can be opposed to the intermediate region B of the polished surface, which is required to be cooled efficiently, and the region having high cooling requirement is prioritized. Can be cooled.

In the second flow path 43b in which the water supply port 41 is formed, the cooling water temperature is the lowest, but cooling water is simultaneously supplied from a plurality of water supply ports 41 arranged along the extending direction of the second flow path 43b. Therefore, the flow velocity is lower than that of the third flow path 43c and the fourth flow path 43d. That is, the surface plate temperature control efficiency of the second flow path 43b is lower than that of the third flow path 43c and the fourth flow path 43d. However, since the second flow path 43b, which has low temperature control efficiency, faces the central region A of the lower platen 2, it can be prevented from significantly affecting the cooling state of the polished surface.

Further, in the cooling structure 40 of the first embodiment, the flow path 43 is folded back by the partition walls 44 that partition the plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5), and the cooling water flows along the partition walls 44. It turns back and flows. That is, the flow direction of the cooling water is reversed every time it flows in the circumferential direction of the surface plate. Therefore, unlike the case where the flow path is formed in a spiral shape, for example, the temperature distribution of the cooling water in an arbitrary circumferential region can be made uniform.

As a result, in the lower platen 2 of the polishing apparatus 1 of the first embodiment, the region having a high cooling requirement (intermediate region B) among the polished surfaces can be efficiently and preferentially cooled. Even if processing heat is generated during polishing, the entire surface of the polishing pad 2a can be adjusted to a uniform temperature of approximately 23 ° C. or lower. Then, it is possible to suppress a partial change (here, an increase) in the temperature of the surface (polishing surface) of the polishing pad 2a, suppress the thermal deformation of the lower platen 2, and / or polish in the polishing apparatus. It is possible to maintain fine polishing conditions on the entire surface (polished surface) of the pad 2a. As a result, it is possible to prevent adverse effects on the work W during polishing, such as a decrease in polishing accuracy.

[Various material combination action]
In general, the surface plate of a polishing device such as a lower surface plate or an upper surface plate changes with time after a long period of time on a yearly basis, and the polished surface may be distorted. In this case, it is necessary to remove the lower surface plate and upper surface plate from the drive shaft that rotates the lower surface plate and the rod that suspends and supports the upper surface plate, and wrap the polished surface again to correct the shape. ..

On the other hand, the lower surface plate 2 of the polishing apparatus 1 of the first embodiment has a lower flat plate member 21, a lower jacket member 22, and a lower surface plate receiving member 23. The lower flat plate member 21 and the lower surface plate receiving member 23 are formed of a low coefficient of thermal expansion material having a linear expansion coefficient smaller than that of the lower jacket member 22, and the lower jacket member 22 has a linear expansion coefficient smaller than these. It is made of stainless steel, which is large and has high rigidity.

That is, in the lower platen 2, the lower flat plate member 21 that comes into contact with the work W and directly transfers the processing heat, and the lower jacket member that is fixed to the back side of the lower flat plate member 21 and has the cooling structure 40 formed therein. 22 is formed of materials having different coefficients of linear expansion.

Therefore, the entire lower platen 2 has a bimetal-like structure in which two metal plates having different coefficients of thermal expansion are bonded together. As a result, the amount of deflection of the lower platen 2 can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40.

Further, the upper surface plate 3 of the polishing apparatus 1 of the first embodiment has an upper flat plate member 31 and an upper jacket member 32, and the upper flat plate member 31 has a lower coefficient of linear thermal expansion than that of the upper jacket member 32. The upper jacket member 32 is made of an inflatable material, and the upper jacket member 32 is made of stainless steel having a larger coefficient of linear expansion and higher rigidity.

That is, in the upper surface plate 3, the upper flat plate member 31 that comes into contact with the work W and directly transfers the processing heat, and the upper jacket member 32 that is fixed to the back side of the upper flat plate member 31 and has the cooling structure 40 formed therein. Is formed of materials with different coefficients of linear expansion.

Therefore, the entire upper surface plate 3 also has a bimetal-like structure in which two metal plates having different coefficients of thermal expansion are bonded together. As a result, the amount of deflection of the upper surface plate 3 can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40.

Then, in both the lower surface plate 2 and the upper surface plate 3 , the amount of deflection of the surface plate can be controlled by adjusting the temperature of the cooling water, so that when the polished surface is distorted due to aging. Even if there is, distortion can be alleviated by adjusting the temperature of the cooling water. Therefore, it is possible to eliminate the need for re-wrapping the polished surface.

Further, in the first embodiment, the lower flat plate member 21 has a smaller linear expansion coefficient than the lower jacket member 22, and the upper flat plate member 31 has a smaller linear expansion coefficient than the upper jacket member 32. That is, the lower flat plate member 21 and the upper flat plate member 31 in which frictional heat is directly transmitted in contact with the work W are formed of a material having a small coefficient of linear expansion that is less likely to be thermally deformed. Therefore, it is possible to prevent the lower flat plate member 21 and the upper flat plate member 31 from being thermally deformed by the processing heat generated during work polishing, and to control the plateau deflection while suppressing the deformation of the lower surface plate 2 and the upper surface plate 3. It can be possible.

Moreover, in general, stainless steel is a cheaper material than low thermal expansion materials. Therefore, as compared with the case where the entire surface plate is formed of the low thermal expansion material, the lower jacket member 22 and the upper jacket member 32 are manufactured by substituting stainless steel as in the polishing apparatus 1 of the first embodiment, so that the cost is increased. It is possible to reduce the cost.

Further, in the upper surface plate 3 of the first embodiment, the upper flat plate member 31 to which the processing heat during work polishing is directly transmitted is formed of a low thermal expansion material having a small coefficient of linear expansion and hardly being thermally deformed, and the upper jacket member 32. Is made of inexpensive stainless steel. As a result, in the upper surface plate 3, it is possible to reduce the cost while suppressing the thermal deformation of the upper flat plate member 31.

Further, the stainless steel forming the lower jacket member 22 and the upper jacket member 32 is a material having relatively high rigidity. Therefore, the rigidity of the lower surface plate 2 and the upper surface plate 3 can be improved as compared with the case where the lower jacket member 22 and the upper jacket member 32 are formed of the low thermal expansion material. As a result, for example, even if the lower surface plate 2 or the upper surface plate 3 is suspended during manufacturing, bending can be suppressed and the ease of manufacturing can be improved.

[Characteristic action depending on the formation position of water supply port and drainage port]
In the first embodiment, the water supply channel connected to the cooling water circulation device (not shown) includes a vertical hole formed in the inside of the drive shaft 7a in the vertical direction, a horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23, and the like. have. Further, the drainage channel has the same configuration as the water supply channel, and has a vertical hole formed in the drive shaft 7a in the vertical direction and a horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23. doing.

On the other hand, in the cooling structure 40 of the first embodiment, as shown in FIG. 2, the drainage port 42 is located at the position closest to the inner edge portion α of the lower platen 2, that is, at the innermost circumference of the lower platen 2. 1 The water supply port 41 is formed in the first flow path 43a along the concentric circle R1 and is located in the second flow path 43b adjacent to the first flow path 43a along the second concentric circle R2 located second from the innermost circumference. It is formed. That is, both the water supply port 41 and the drain port 42 are formed in the vicinity of the drive shaft 7a.

As a result, as compared with the case where the water supply port 41 and the drainage port 42 are formed in the vicinity of the outer edge portion β of the lower surface plate 2, a horizontal hole extending horizontally inside the lower surface plate receiving member 23 in the water supply channel and the drainage channel. The length of the portion can be shortened. That is, it is possible to further suppress the complexity of the cooling structure 40 and improve the ease of making a surface plate.

In particular, if the water supply port 41 and the drain port 42 are formed in the vicinity of the outer edge portion β of the lower surface plate 2 in the large lower surface plate 2 having a diameter dimension exceeding 2 meters, the inside of the lower surface plate receiving member 23 is formed. A long horizontal hole extending horizontally is required. However, it is very difficult to form a long horizontal hole, and even if it can be realized, the processing cost will inevitably rise. However, in the polishing apparatus 1 of the first embodiment, since the water supply port 41 and the drain port 42 are formed at positions near the inner edge portion α, a long horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23 becomes unnecessary. Therefore, it is possible to suppress the soaring processing cost.

Further, in the first embodiment, a plurality (two) of each of the water supply port 41 and the drainage port 42 are formed. Then, the same amount of cooling water flows out from all the water supply ports 41 at almost the same time, and the same amount of cooling water is discharged from all the drainage ports 42 at almost the same time. This is only in response to the restrictions of the in-flight waterway design up to the surface plate water supply port and the in-flight waterway design from the drainage port. Therefore, the number is not necessarily limited to this number. That is, it is important that the number of water supply ports 41 and drainage ports 42 is designed so that a desired flow rate and flow velocity can be obtained within an allowable pressure resistance.

Further, in the first embodiment, a plurality of water supply ports 41 are formed side by side in the extending direction of the second flow path 43 b in which the water supply ports 41 are formed. Therefore, it is possible to suppress the interference of the cooling water flowing out from the plurality of water supply ports 41 and not to hinder the smooth flow of the cooling water. Then, the smooth flow of the cooling water can secure the flow velocity and improve the surface plate temperature control efficiency.

Further, the plurality of drainage ports 42 are also formed side by side in the extending direction of the first flow path 43a in which the drainage ports 42 are formed, so that the drainage ports 42 can be quickly discharged without disturbing the flow of the cooling water. It becomes. As a result, the flow velocity of the cooling water can be secured and the surface plate temperature control efficiency can be further improved without hindering the smooth flow of the cooling water.

[Other characteristic actions]
In the cooling structure 40 of the first embodiment, the flow paths 43 are formed along a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) arranged in the radial direction of the lower platen 2. Therefore, the partition wall 46 for partitioning the first flow path 43a to the fifth flow path 43e extends in the circumferential direction of the lower platen 2.

Since the partition wall 46 extends in the circumferential direction of the lower platen 2, the suspension position when suspending the lower platen 2 when transporting the lower platen 2, the inner edge portion α of the lower platen 2, and the outer edge portion β And are not continuous. As a result, it is possible to suppress bending deformation in the surface plate radial direction when the lower surface plate 2 is conveyed. That is, the deformation of the lower platen 2 during production can be reduced, the production time of the lower platen 2 can be shortened, and the ease of production can be improved.

Further, in the cooling structure 40 of the first embodiment, since the flow path 43 is along a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) arranged in the radial direction of the lower surface plate 2, the first flow path 43a The tips of the partition walls 46 that partition the fifth flow path 43e are discontinuous in the surface plate radial direction. Therefore, the influence of the residual stress generated when the tip of the partition wall 46 is cut can be reduced, and the radial bending of the lower platen 2 can be further suppressed.

Next, the effect will be described.
In the polishing apparatus 1 of the first embodiment, the effects listed below can be obtained.

(1) Polishing provided with a surface plate (lower surface plate 2, upper surface plate 3) in which a cooling structure 40 through which cooling water flows is formed on the back side of a polishing surface (surface of polishing pads 2a, 3a) for polishing the work W. In device 1,
The cooling structure 40 communicates the water supply port 41 for supplying the cooling water, the drainage port 42 for discharging the cooling water, the water supply port 41 and the drainage port 42, and the surface plate (lower surface plate). 2. A flow path 43 extending along a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) arranged in the radial direction of the upper surface plate 3), and the surface plate (lower surface plate 2, upper surface plate 3). ), With a partition wall 44 extending in the radial direction and partitioning the concentric circles (first concentric circles R1 to fifth concentric circles R5).
The cooling water supplied from the water supply port 41 flows in the flow path (third flow path 43c) along the first concentric circle (third concentric circle R3) in the first direction (counterclockwise direction). It is folded back along the partition wall 44 and flows into the flow path (fourth flow path 43d) along the second concentric circle (fourth concentric circle R4), and flows along the second concentric circle (fourth concentric circle R4). The structure is such that the water flows in the (fourth flow path 43d) in the direction opposite to the first direction (counterclockwise direction) (clockwise direction) and is discharged from the drain port 42.
As a result, the temperature of the region (intermediate region B) intended as the main temperature control target of the polished surface is preferentially and efficiently controlled without complicating the structure, and the temperature of the polished surface is partially adjusted as the work is polished. It is possible to prevent the polishing conditions from partially deviating from the polishing conditions.

(2) The water supply port 41 is formed in a second flow path 43b along a concentric circle (second concentric circle R2) located second from the innermost circumference of the surface plate (lower surface plate 2, upper surface plate 3). ,
The drainage port 42 is a concentric circle (first concentric circle R1) located on the innermost circumference of the surface plate (lower surface plate 2, upper surface plate 3) when the water supply port 41 is formed in the second flow path 43b. ) Is formed in the first flow path 43a.
As a result, in addition to the effect of (1), the lengths of the horizontal water supply channel and drainage channel formed inside the surface plate can be shortened, and the complexity of the cooling structure 40 can be further suppressed.

(3) A plurality of the water supply ports 41 are formed side by side in the extending direction of the flow path (second flow path 43b) along a predetermined concentric circle (second concentric circle R2).
As a result, in addition to the effects of (1) or (2), the load due to the cooling water pressure can be reduced and the cooling water can flow smoothly.

(4) A plurality of the drainage ports 42 are formed so as to be arranged in the extending direction of the flow path (first flow path 43a) along a predetermined concentric circle (first concentric circle R1).
As a result, in addition to the effects of any one of (1) to (3), the load due to the cooling water pressure can be further reduced, and the flow of the cooling water can be further smoothed.

(5) The surface plate (lower surface plate 2, upper surface plate 3) includes a flat plate member (lower flat plate member 21, upper flat plate member 31) on which the polished surface is formed and the flat plate member (lower flat plate member 21). It has a jacket member (lower jacket member 22, upper jacket member 32) that is fixed to the upper flat plate member 31) and has the cooling structure 40 formed therein.
The flat plate member (lower flat plate member 21, upper flat plate member 31) and the jacket member (lower jacket member 22, upper jacket member 32) are formed of materials having different coefficients of linear expansion.
As a result, in addition to the effects of any of (1) to (4), the amount of surface plate deflection can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40, eliminating the distortion of the surface plate due to aging. can do.

(6) The flat plate member (lower flat plate member 21, upper flat plate member 31) is formed of a material having a coefficient of linear expansion smaller than that of the jacket member (lower jacket member 22, upper jacket member 32). did.
As a result, in addition to the effect of (5), thermal deformation of the flat plate member in which frictional heat is directly transmitted in contact with the work W can be suppressed, and surface plate deformation can be further prevented.

(7) The surface plate (lower surface plate 2) has the jacket member (lower jacket member 22), and further has a surface plate receiving member (lower surface plate receiving member 23) that supports them. It is also possible to design.
In that case, the depending linear expansion coefficient design constant Edition receiving member (the lower surface plate receiving member 23) may be arbitrarily set the change control unit amount. As a result, in addition to the effect of (5), the degree of suppression of thermal deformation of the surface plate can be adjusted.

Although the polishing apparatus of the present invention has been described above based on the first embodiment, the specific configuration is not limited to this embodiment, and the gist of the invention according to each claim in the claims is described. Design changes and additions are permitted as long as they do not deviate.

In the first embodiment, a drainage port 42 is formed in the first flow path 43a located on the innermost circumference of the surface plate, and a water supply port 41 is formed in the second flow path 43b adjacent to the first flow path 43a. Indicated. However, the present invention is not limited to this, and for example, the water supply port 41 may be formed in the first flow path 43a and the drainage port 42 may be formed in the second flow path 43b. In this case, the cooling water filled in the first flow path 43a flows in the order of the fifth flow path 43e → the fourth flow path 43d → the third flow path 43c, and finally flows into the second flow path 43b. In this way, by reversing the water supply port 41 and the discharge port 42 without changing the cooling structure 40, it is possible to change the region where the temperature control is to be preferentially performed.
However, even at this time, the water supply port 41 and the drain port 42 are formed in the vicinity of the drive shaft 7a, and the length of the horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23 is shortened. Therefore, it is possible to further suppress the complexity of the cooling structure 40.

Further, in the cooling structure 40 of the first embodiment, the cooling water is supplied from the water supply port 41 → the second flow path 43b (filled with cooling water) → the third flow path 43c (counterclockwise) → the fourth flow path 43d (clockwise). An example is shown in which the flow is as follows: 5th flow path 43e (counterclockwise) → 1st flow path 43a (cooling water discharge) → drain port 42. However, the present invention is not limited to this, for example, the cooling structure of FIG. 6 is inverted to the left and right, and the flow of the cooling water is reversed (water supply port 41 → second flow path 43b (cooling water filling) → third flow path). 43c (clockwise) → 4th flow path 43d (counterclockwise) → 5th flow path 43e (clockwise) → 1st flow path 43a (cooling water discharge) → drain port 42). As a result, the water supply / drainage route can be made into a simple structure, and the structure can be prevented from becoming complicated. Further, since the flow path 43 is one route, the flow velocity of the cooling water flowing through the flow path 43 can be improved. Therefore, the heat transfer coefficient by the cooling water becomes high, and the temperature control efficiency can be improved. Further, since the direction of the flow path can be reversed without changing the structure, it is possible to preferentially change the region where the temperature control is desired.

Further, the water supply port 41 and the drain port 42 may be formed in the fifth flow path 43e located on the outermost periphery of the surface plate. When the water supply port 41 or the drainage port 42 is formed at the outermost peripheral position of the surface plate, a horizontal hole for water supply / drainage is not formed in the lower surface plate receiving member 23 or the like, and a tube or the like arranged outside the surface plate or the like. The cooling water may be supplied and drained using the above.

Further, in the first embodiment, an example in which two water supply ports 41 and two drainage ports 42 are formed is shown, but the present invention is not limited to this. The water supply port 41 and the drain port 42 may be formed in an arbitrary number of two or more. Further, the number of water supply ports 41 and the number of drainage ports 42 may be different. Further, the opening area of the water supply port 41 and the opening area of the drain port 42 may be different, the opening areas of the plurality of water supply ports 41 may be different from each other, or the opening areas of the plurality of drain ports 42 may be different from each other. You may.

Further, the flow path 43 extends along a plurality of concentric circles (first concentric circles R1 to fifth concentric circles R5) arranged in the radial direction of the surface plates (lower surface plate 2, upper surface plate 3), and a plurality of these. Concentric circles (first concentric circles R1 to fifth concentric circles R5) may be partitioned by a partition wall 44. Therefore, the shape of the flow path is not limited to that shown in the first embodiment, and is, for example, a cooling structure 40A of the first modification shown in FIG. 8 or a cooling structure 40B of the second modification shown in FIG. You may.

That is, in the cooling structure 40A which is the first modification, the water supply port 41 and the drainage port 42 are formed in the first flow path 43a located on the innermost circumference of the surface plate. Further, as the partition wall 47, the first partition wall 47a for partitioning all of the first concentric circles R1 to the fifth concentric circles R5, the second partition wall 47b for partitioning the first concentric circles R1 to the fourth concentric circles R4, and the second and third partition walls 47b. A third partition wall 47c for partitioning the concentric circles R2 and R3 and a fourth partition wall 47d for partitioning the first and second concentric circles R1 and R2 are formed.

Then, a first folding portion 48a that communicates the first flow path 43a and the third flow path 43c is formed between the first partition wall 47a and the fourth partition wall 47d, and the first folding portion 48a is formed along the third partition wall 47c. A second folding portion 48b that communicates with the second flow path 43b and the third flow path 43c is formed, and a third folding portion 48c that communicates with the first flow path 43a and the second flow path 43b along the fourth partition wall 47d is formed. A fourth folded-back portion 48d that communicates the first flow path 43a and the fourth flow path 43d is formed between the second partition wall 47b and the third partition wall 47c, and along the first partition wall 47a. A fifth folding portion 48e that communicates the fourth flow path 43d and the fifth flow path 43e is formed, and the first flow path 43a and the fifth flow path 43e are formed between the first partition wall 47a and the second partition wall 47b. Form a sixth folding portion 48f that communicates with the above. At this time, the water supply port 41 is formed in the first turning portion 48a, and the drainage port 42 is formed in the sixth turning portion 48f.

As a result, in the cooling structure 40A of the first modification, the cooling water flowing out from the water supply port 41 is the water supply port 41 → the first turn-back portion 48a → the third flow path 43c → the second turn-back portion 48b → the second flow path. 43b-> 3rd turn-back part 48c-> 1st flow path 43a-> 4th turn-back part 48d-> 4th flow path 43d-> 5th turn-back part 48e-> 5th flow path 43e-> 6th turn-back part 48f-> drainage port 42 I will go.

Further, in the cooling structure 40B which is the second modification, the water supply port 41 is formed in the first flow path 43a located on the innermost circumference of the surface plate, and drains into the fifth flow path 43e located on the outermost circumference of the surface plate. Form the mouth 42. Further, the partition wall 49 is only for partitioning all of the first concentric circles R1 to the fifth concentric circles R5.

Then, the first folding portion 50a, the second folding portion 50b, the third folding portion 50c, and the fourth folding portion 50d are alternately formed with the partition wall 49 in between. Then, the first and second flow paths 43a and 43b are communicated with each other via the first turn-around portion 50a, and the second and third flow paths 43b and 43c are communicated with each other via the second turn-around portion 50b. The third and fourth flow paths 43c and 43d are communicated via 50c, and the fourth and fifth flow paths 43d and 43e are communicated via the fourth folding portion 50d.

As a result, in the cooling structure 40B of the second modification, the cooling water flowing out from the water supply port 41 is the water supply port 41 → the first flow path 43a → the first turn-back portion 50a → the second flow path 43b → the second turn-back portion. 50b-> 3rd flow path 43c-> 3rd turn-back portion 50c-> 4th flow path 43d-> 4th turn-back section 50d-> 5th flow path 43e-> drainage port 42.

Further, in Example 1, an example was shown in which the lower flat plate member 21 of the lower platen 2 is formed of a low coefficient of thermal expansion material having a small coefficient of linear expansion, and the lower jacket member 22 is made of stainless steel having a large coefficient of linear expansion. However, the present invention is not limited to this, and when the lower flat plate member 21, the lower jacket member 22, or the like is selected from, for example, a material having a large coefficient of linear expansion, cast iron, aluminum, stainless steel, or the like may be arbitrarily selected. When selecting from materials having a small coefficient of linear expansion, ceramics, granites, carbon fiber reinforced materials, silicon carbide fiber reinforced materials, Invar alloy materials and the like may be arbitrarily selected. Further, depending on the combination, the unit strain amount can be set and controlled according to the adjustment accuracy of the cooling water temperature according to the difference in the coefficient of linear expansion between the lower flat plate member 21 and the lower jacket member 22. Become. That is, it may be selected and combined in consideration of deformation control characteristics, desired rigidity in terms of equipment configuration, and the like. The same applies to the upper surface plate 3.
Further, as in the example shown in the first embodiment, the lower surface plate receiving member 23 is further provided under the lower jacket member 22, and the material thereof is different from that of the lower jacket member 22. Deformation characteristics can also be formulated.

Further, in Example 1, the cooling structure is exemplified as the temperature control structure, but the present invention can be applied to the heating structure in which the heating fluid that raises the temperature of the polished surface flows.

Further, in the first embodiment, a double-sided polishing device having a lower surface plate 2 and an upper surface plate 3 and capable of polishing both sides of the work W at the same time is shown, but it is a single-sided polishing device that polishes only one side of the work W. Also, the present invention can be applied.

Further, in the first embodiment, the number of concentric circles along the flow path 43 is set to 5, but the number is not limited to this, and any number of concentric circles can be set.

1 Polishing device 2 Lower surface plate 2a Polishing pad 3 Upper surface plate 3a Polishing pad 3b Hook 4 Sun gear 5 Internal gear 6 Carrier plate 21 Lower plate member 22 Lower jacket member 23 Lower surface plate receiving member 31 Upper plate member 32 Upper Jacket member 40 Cooling structure (temperature control structure)
41 Water supply port 42 Drainage port 43 Flow path 43a 1st flow path 43b 2nd flow path 43c 3rd flow path 43d 4th flow path 43e 5th flow path 44 Partition wall 45a 1st turn-back part 45b 2nd turn-back part 45c 3rd Folded part 45d 4th folded part

Claims (6)

In a polishing apparatus equipped with a surface plate having a temperature control structure in which a temperature control fluid flows on the back side of a polishing surface for polishing a work.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the drain port for discharging the temperature control fluid, the water supply port and the drain port, and the inner edge portion of the surface plate. It has a plurality of flow paths extending along a plurality of concentric circles arranged in order from the surface to the outer edge portion, and a partition wall extending in the radial direction of the surface plate to partition the concentric circles.
Each of the plurality of flow paths extends once in the circumferential direction of the surface plate and communicates with each other through a folded portion along the partition wall to form a single route connected as a whole of the polished surface.
The temperature control fluid supplied from the water supply port flows in the flow path along the first concentric circle in the first direction, then folds back along the partition wall into the flow path along the second concentric circle. A polishing apparatus characterized in that it flows in, flows in a flow path along the second concentric circle in a direction opposite to the first direction, and is discharged from the drain port. In a polishing apparatus equipped with a surface plate having a temperature control structure in which a temperature control fluid flows on the back side of a polishing surface for polishing a work.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the drain port for discharging the temperature control fluid, and the water supply port and the drain port, and in the radial direction of the surface plate. It has a flow path extending along a plurality of concentric circles arranged in a row, and a partition wall extending in the radial direction of the surface plate to partition the concentric circles.
The temperature control fluid supplied from the water supply port flows in the flow path along the first concentric circle in the first direction, then folds back along the partition wall into the flow path along the second concentric circle. It flows in, flows in the flow path along the second concentric circle in the direction opposite to the first direction, and is discharged from the drain port.
The water supply port is either a first flow path along a concentric circle located on the innermost circumference of the surface plate or a second flow path along a concentric circle located second from the innermost circumference of the surface plate. Formed in
The drainage port is formed in the second flow path when the water supply port is formed in the first flow path, and the first flow port is formed in the second flow path when the water supply port is formed in the second flow path. A polishing device characterized by being formed on a road. In a polishing apparatus equipped with a surface plate having a temperature control structure in which a temperature control fluid flows on the back side of a polishing surface for polishing a work.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the drain port for discharging the temperature control fluid, and the water supply port and the drain port, and in the radial direction of the surface plate. It has a flow path extending along a plurality of concentric circles arranged in a row, and a partition wall extending in the radial direction of the surface plate to partition the concentric circles.
The temperature control fluid supplied from the water supply port flows in the flow path along the first concentric circle in the first direction, then folds back along the partition wall into the flow path along the second concentric circle. It flows in, flows in the flow path along the second concentric circle in the direction opposite to the first direction, and is discharged from the drain port.
A polishing apparatus characterized in that a plurality of water supply ports are formed side by side in the extending direction of a flow path along a predetermined concentric circle. In a polishing apparatus equipped with a surface plate having a temperature control structure in which a temperature control fluid flows on the back side of a polishing surface for polishing a work.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the drain port for discharging the temperature control fluid, and the water supply port and the drain port, and in the radial direction of the surface plate. It has a flow path extending along a plurality of concentric circles arranged in a row, and a partition wall extending in the radial direction of the surface plate to partition the concentric circles.
The temperature control fluid supplied from the water supply port flows in the flow path along the first concentric circle in the first direction, then folds back along the partition wall into the flow path along the second concentric circle. It flows in, flows in the flow path along the second concentric circle in the direction opposite to the first direction, and is discharged from the drain port.
A polishing apparatus characterized in that a plurality of the drainage ports are formed side by side in the extending direction of the flow path along a predetermined concentric circle. In the polishing apparatus according to any one of claims 1 to 4.
The surface plate includes a flat plate member to which the abrasive surface is formed and is fixed to the flat plate member and the jacket member in which the temperature adjustment structure together is formed, the,
A polishing apparatus characterized in that the flat plate member and the jacket member are made of materials having different coefficients of linear expansion. In the polishing apparatus according to claim 5,
The flat plate member is a polishing apparatus made of a material having a coefficient of linear expansion smaller than that of the jacket member.

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