JP6764248B2 - アクティブマトリクス表示装置 - Google Patents
アクティブマトリクス表示装置 Download PDFInfo
- Publication number
- JP6764248B2 JP6764248B2 JP2016088524A JP2016088524A JP6764248B2 JP 6764248 B2 JP6764248 B2 JP 6764248B2 JP 2016088524 A JP2016088524 A JP 2016088524A JP 2016088524 A JP2016088524 A JP 2016088524A JP 6764248 B2 JP6764248 B2 JP 6764248B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- pixels
- wiring
- supply wiring
- pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011159 matrix material Substances 0.000 title claims description 45
- 239000000758 substrate Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 7
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 108
- 239000004065 semiconductor Substances 0.000 description 10
- 241000750042 Vini Species 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 230000003071 parasitic effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80517—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
まず、本発明の実施の形態に係る表示装置1について、図1〜図4Bを用いて説明する。なお、本実施の形態に係る表示装置は、アクティブマトリクス型の有機EL表示装置(有機EL表示パネル)であり、複数の画素が行方向及び列方向にマトリクス状に配置された表示領域(画素部)を備えている。
本実施の形態における表示装置1の構成について、図1を基に説明する。図1は、本実施の形態に係る表示装置1の一部切り欠き斜視図である。
次に、各画素30の回路構成について説明する。図2は、本実施の形態に係る画素30の回路構成を示す回路図である。具体的には、同図には、行方向に隣り合って配置される2つの画素30が示されている。
次に、本実施の形態に係る表示装置1における画素30の配線の構成について、図3〜図4Bを用いて説明する。
このように配置された複数の画素30を備える表示装置1は、電源配線SLについて完全に線対称に配置された複数の画素を備える表示装置に比べて、表示品位を改善することが可能となる。このことの理解を容易にするために、参考として、比較例に係る表示装置の構成を説明する。
以上、本発明に係るアクティブマトリクス表示装置について、実施の形態に基づいて説明したが、本発明は上記の実施の形態に限定されるものではない。上述した実施の形態に対して本発明の主旨を逸脱しない範囲で当業者が思いつく各種変形を施して得られる変形例や、本発明に係るアクティブマトリクス表示装置を内蔵した各種機器も本発明に含まれる。
10 有機EL素子
20 アクティブマトリクス基板
30、30a、30b、930、930a、930b 画素
100 基板
101 チャネル半導体層
102 ゲート絶縁層
103 下部配線層
104 パッシベーション層
105 上部配線層
106 平坦化層
111 AM層
112 有機EL層
113、 透明電極層
114 封止材料層
115 バンク
CS 容量素子
GL ゲート配線
SL ソース配線
PL 電源配線
Td 駆動トランジスタ
Taz、Tws トランジスタ
Claims (5)
- マトリクス状に配置された複数の画素を有するアクティブマトリクス表示装置であって、
前記複数の画素の各々は、
基板に設けられた駆動素子と、
前記駆動素子によって発光し、かつ、前記基板の上方に設けられた金属電極層、及び、当該金属電極層の上方に設けられた透明電極層を含む発光素子と、
前記基板に設けられ、前記複数の画素に供給されるデータに対応する電圧を保持する容量素子とを有し、
前記アクティブマトリクス表示装置は、さらに、
前記基板に設けられ、前記複数の画素にデータを供給するデータ配線と、
前記基板に設けられ、前記複数の画素に電力を供給する電源配線とを備え、
前記電源配線は、
前記発光素子に電流を供給する第一電源配線、前記容量素子の電圧を初期化する電圧を供給する第二電源配線であり、
前記複数の画素のうち、前記電源配線が延設された第一方向と交差する第二方向に隣り合う2つの画素には、同一の前記第一電源配線または同一の前記第二電源配線を介して電力が供給され、
前記データ配線と前記金属電極層とは、前記基板の平面視において重ならないように配置され、
前記第一電源配線および前記第二電源配線は、前記基板の平面視において前記金属電極層に重なるように配置され、
1つの画素には、前記第一電源配線および前記第二電源配線のいずれか一方のみが配置され、前記一方はいずれの画素においても前記第二方向の同じ側に配置され、
前記データ配線は、画素毎に配置され、いずれの画素においても前記第二方向の同じ側に配置される、
アクティブマトリクス表示装置。 - 前記第一電源配線と前記第二電源配線とは、前記第二方向に沿って、画素毎に交互に配置される
請求項1に記載のアクティブマトリクス表示装置。 - 前記複数の画素のレイアウトは、前記第二方向に沿って、二画素ごとに繰り返される
請求項1または2に記載のアクティブマトリクス表示装置。 - 前記電源配線を共有する2つの画素において、前記駆動素子を含む回路素子は、当該電源配線について線対称の位置に配置される
請求項1〜3のいずれか1項に記載のアクティブマトリクス表示装置。 - さらに、前記複数の画素を画素毎に区画する隔壁を備え、
前記データ配線は、前記隔壁の下方に配置される
請求項1〜4のいずれか1項に記載のアクティブマトリクス表示装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016088524A JP6764248B2 (ja) | 2016-04-26 | 2016-04-26 | アクティブマトリクス表示装置 |
US15/492,464 US9960223B2 (en) | 2016-04-26 | 2017-04-20 | Active-matrix display device |
CN201710263868.4A CN107346777B (zh) | 2016-04-26 | 2017-04-21 | 有源矩阵显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016088524A JP6764248B2 (ja) | 2016-04-26 | 2016-04-26 | アクティブマトリクス表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017198809A JP2017198809A (ja) | 2017-11-02 |
JP6764248B2 true JP6764248B2 (ja) | 2020-09-30 |
Family
ID=60089777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016088524A Active JP6764248B2 (ja) | 2016-04-26 | 2016-04-26 | アクティブマトリクス表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9960223B2 (ja) |
JP (1) | JP6764248B2 (ja) |
CN (1) | CN107346777B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102688600B1 (ko) * | 2016-05-03 | 2024-07-25 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP2019032447A (ja) | 2017-08-08 | 2019-02-28 | 株式会社Joled | アクティブマトリクス表示装置 |
JP6873476B2 (ja) | 2017-08-08 | 2021-05-19 | 株式会社Joled | アクティブマトリクス表示装置 |
KR102594557B1 (ko) * | 2017-12-22 | 2023-10-25 | 엘지디스플레이 주식회사 | 유기발광표시패널 및 이를 이용한 유기발광표시장치 |
JP7432327B2 (ja) * | 2019-09-04 | 2024-02-16 | 株式会社ジャパンディスプレイ | 表示システム |
WO2021064820A1 (ja) * | 2019-09-30 | 2021-04-08 | シャープ株式会社 | 表示装置 |
KR20210086441A (ko) * | 2019-12-30 | 2021-07-08 | 엘지디스플레이 주식회사 | 표시패널과 그 리페어 방법 |
EP3846216B1 (en) | 2019-12-30 | 2024-09-25 | LG Display Co., Ltd. | Display panel and repair method thereof |
GB2627131A (en) * | 2022-09-06 | 2024-08-14 | Boe Technology Group Co Ltd | Display substrate, display panel, and display apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3528182B2 (ja) * | 1997-02-17 | 2004-05-17 | セイコーエプソン株式会社 | 表示装置 |
JP3620538B2 (ja) * | 1997-02-17 | 2005-02-16 | セイコーエプソン株式会社 | 表示装置 |
US6512504B1 (en) | 1999-04-27 | 2003-01-28 | Semiconductor Energy Laborayory Co., Ltd. | Electronic device and electronic apparatus |
JP2001195016A (ja) | 1999-10-29 | 2001-07-19 | Semiconductor Energy Lab Co Ltd | 電子装置 |
US6580094B1 (en) | 1999-10-29 | 2003-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro luminescence display device |
KR100834346B1 (ko) * | 2001-12-28 | 2008-06-02 | 엘지디스플레이 주식회사 | 능동행렬 유기전기발광소자 |
JP4310984B2 (ja) * | 2002-02-06 | 2009-08-12 | 株式会社日立製作所 | 有機発光表示装置 |
US8378930B2 (en) * | 2004-05-28 | 2013-02-19 | Sony Corporation | Pixel circuit and display device having symmetric pixel circuits and shared voltage lines |
KR100637164B1 (ko) * | 2004-06-26 | 2006-10-20 | 삼성에스디아이 주식회사 | 능동 구동형 전계발광 디스플레이 장치 |
TWI327720B (en) * | 2005-03-11 | 2010-07-21 | Sanyo Electric Co | Active matrix type display device and driving method thereof |
-
2016
- 2016-04-26 JP JP2016088524A patent/JP6764248B2/ja active Active
-
2017
- 2017-04-20 US US15/492,464 patent/US9960223B2/en active Active
- 2017-04-21 CN CN201710263868.4A patent/CN107346777B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US9960223B2 (en) | 2018-05-01 |
CN107346777B (zh) | 2023-05-12 |
JP2017198809A (ja) | 2017-11-02 |
CN107346777A (zh) | 2017-11-14 |
US20170309696A1 (en) | 2017-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6764248B2 (ja) | アクティブマトリクス表示装置 | |
CN107369411B (zh) | 有源矩阵显示装置 | |
TWI553611B (zh) | 顯示裝置 | |
US9786225B2 (en) | Organic light emitting diode display | |
TWI612657B (zh) | 顯示裝置 | |
US10032839B2 (en) | Display device | |
KR102139972B1 (ko) | 유기전계 발광표시소자 및 이의 제조방법 | |
US10014358B2 (en) | Organic light emitting display having a first insulating layer and a gate metal layer constitute a first capacitor | |
JP7389106B2 (ja) | 有機発光表示装置 | |
JP6747156B2 (ja) | 表示装置 | |
KR102560393B1 (ko) | 유기 발광 표시 장치 | |
JP2005338754A (ja) | 発光表示装置及び発光表示パネル | |
KR20190126963A (ko) | 유기 발광 표시 장치 | |
JP2009054328A (ja) | 有機el表示装置 | |
KR20200097856A (ko) | 유기 발광 표시 장치 | |
KR20120041459A (ko) | 백색 유기전계발광표시장치와 이의 제조방법 | |
CN111326673A (zh) | 显示装置 | |
KR20050104587A (ko) | 발광 표시 패널 및 발광 표시 장치 | |
JP6771401B2 (ja) | アクティブマトリクス表示装置 | |
JP6754798B2 (ja) | 有機el表示パネル | |
US9881548B2 (en) | Organic light emitting diode display with shielding portion | |
KR20150077169A (ko) | 유기발광다이오드 표시장치 및 이의 제조방법 | |
JP5391678B2 (ja) | 表示装置 | |
JP6873476B2 (ja) | アクティブマトリクス表示装置 | |
JP2022096682A (ja) | 表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20170322 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20170324 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181218 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190911 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191008 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200526 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200722 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200818 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200911 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6764248 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S303 | Written request for registration of pledge or change of pledge |
Free format text: JAPANESE INTERMEDIATE CODE: R316303 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S803 | Written request for registration of cancellation of provisional registration |
Free format text: JAPANESE INTERMEDIATE CODE: R316803 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |