JP6680302B2 - Light emitting device - Google Patents

Description

The present invention relates to a light emitting device, and particularly to a light emitting device including a light transmitting member and a covering member for increasing the efficiency of extracting light from a light emitting element.

2. Description of the Related Art In recent years, a light emitting device equipped with a semiconductor light emitting element such as a light emitting diode (LED) or a laser diode (LD) as a light source has been used for various illuminations and display devices. In particular, since these semiconductor light emitting elements have low power consumption and long life, they are attracting attention as a light source for next-generation lighting that can replace fluorescent lamps, and further improvement in light emission output and light emission efficiency is required.

For example, in the light-emitting device proposed in Patent Document 1, a light-emitting element chip that is an LED is flip-chip mounted on the bottom of a storage recess provided in a package that is a mounting substrate.
Further, the incident surface of a light extraction increasing member having the shape of a plano-convex lens is optically coupled to the emission surface of the light emitting element chip. The light extraction increasing member has a refractive index intermediate between that of the sapphire substrate of the light emitting element chip and air. The emission surface of the light extraction increasing member is a spherical surface, and at all positions on the emission surface, light is emitted in a cone whose normal line is the center line and whose critical angle is the angle formed by the center line and the generatrix line. It is formed so as to include the emission surface of the element chip. According to this configuration, substantially no total reflection occurs on the emission surface of the light extraction increasing member, so that light can be extracted from the light extraction increasing member without causing attenuation or extinction of light due to multiple reflection. It is said that the utilization efficiency of light can be improved.

JP, 2006-351809, A JP, 2007-019096, A JP, 2006-037097, A JP, 2006-352061, A JP-A-2002-305328 JP, 10-151794, A

However, in the light-emitting device described in Patent Document 1, the light emitted from the light-emitting element chip to the side thereof passes through the sealing resin and propagates inside the sealing resin and the package. Absorbed and attenuated. Further, since the sealing resin also optically couples to the incident surface of the light extraction increasing member, the light emitting region on the incident surface becomes substantially large, and the light component reflected on the emission surface of the light extraction increasing member increases. For these reasons, it is difficult to sufficiently extract the light emitted from the light emitting element chip to the outside, and it is difficult to further reduce the size of the device while maintaining the light extraction efficiency.

Further, conventionally, a structure is assumed in which LED light is assumed as a light source, and the extraction efficiency thereof is increased, and the structure is such that the extracted LED light is wavelength-converted by a separately provided phosphor or the like.
Therefore, the wavelength conversion light as the emitted light of the light emitting device and the LED light added to the light are reduced due to light scattering and absorption between the separated LED light source section and the wavelength conversion section. The structure is such that the directivity of the emitted light is reduced, the color unevenness or the brightness unevenness is large, or the emission characteristics of the emitted light of the device are insufficient. There is a case. Further, with such a separation structure of the light source and the conversion unit, it is difficult to downsize the entire device.

The present invention has been made in view of the above problems, and an object thereof is to improve the extraction efficiency of light emitted from a light-emitting element, to be downsized, to increase the emission efficiency, color unevenness, and brightness unevenness. It is an object of the present invention to provide a light-emitting device that has a light-emitting characteristic with suppressed light emission.

The light emitting device according to the present invention can achieve the above object by the following configurations (1) to (13).
(1) A light-transmitting member having a coating member containing a light-reflecting material, a light-emitting side surface, and a light-incident-side surface facing the surface of the coating member and disposed in the surface, On the light incident side surface of the light transmitting member, the light emitting element and the incident area side of the light emitting element are coupled to the incident area surrounded by the outer reflection area and partly embedded in the covering member. And a wavelength conversion member that is excited by the light emitting element.
(2) In the light transmitting member, the light emitting side is a convex curved surface, and at least the reflecting region on the light incident side is a substantially flat surface, and the cross sectional width of the incident region is half or less of the light incident side surface. The light emitting device according to (1) above.
(3) A light-transmitting member having a covering member containing a light-reflecting material, a light-emitting side surface of a convex curved surface, and a light-incident side surface facing the surface of the covering member and arranged in the surface. And a light source part, which is coupled to an inner incident area surrounded by a reflection area of the substantially flat surface on the light incident side surface of the light transmitting member and is partially embedded in the covering member, A light emitting device provided in a light source unit, wherein a cross-sectional width of the incident region is half or less of a surface of the light incident side.
(4) The light emitting device according to (3), wherein the light emitting device further includes a wavelength conversion member coupled to the light source unit on the incident region side of the light emitting element and excited by the light emitting element.
(5) The wavelength conversion member is a plate-shaped body having first and second main surfaces facing each other, and a plurality of the light emitting elements are joined to the second main surface, and the incident area is provided. The light-emitting device according to any one of (1), (2), and (4) above, wherein the first main surface is joined to.
(6) The light emitting device according to any one of (1) to (5), wherein the reflective region is provided on a surface of the light transmitting member that is separated from a surface of the covering member.
(7) The light emitting device includes a translucent adhesive that adheres a surface of the light transmissive member on a light incident side to a surface of the covering member, and the incident region and the reflective region include the translucent adhesive. The light emitting device according to any one of (1) to (6) above, which is provided at an interface with the agent.
(8) Any of the above (1) to (5), wherein the light transmitting member is provided on the light source section and on the surface of the covering member, and the reflection region is an interface between the light transmitting member and the covering member. Or 1
The light emitting device described in 1.
(9) The light-emitting device according to (8), wherein the incident region projects toward the light-emitting side from the reflective region.
(10) The surface shape on the light emitting side of the light transmitting member is spherical (1) to (9).
The light-emitting device according to any one of 1.
(11) The light emitting device has a mounting substrate on which the light emitting element is mounted, and the light emitting element is electrically connected to the mounting substrate on a mounting surface side facing a surface on the incident region side. The light-emitting device according to any one of (1) to (10) above.
(12) The light source unit of the light emitting device includes a wavelength conversion member that is coupled to a surface of the light emitting element on the incident region side and is excited by the light emitting device, and the covering member extends from the incident region to the light source unit. The light emitting device according to (11), which is provided so as to cover the side surface of the mounting substrate and extend to the surface of the mounting substrate.
(13) The light emitting device according to (12), wherein the covering member is provided in contact with side surfaces of the light emitting element and the wavelength conversion member, respectively.

The present invention, the light-reflecting coating member, the light-emitting element of the light source section, the wavelength conversion section coupled to it is coated, the light source of the light-emitting element, or the emitted light from the composite light source is extracted in one direction,
That is, the light source is used as one light emitting surface, the light emitting window portion of the light emitting device is used as one specific area, and the light transmitting member that encloses the window portion is joined to be covered with the covering member. It is possible to remarkably improve the light extraction efficiency and obtain light emission characteristics with suppressed unevenness in color and brightness. In particular, since the light component that is coupled to the window portion in a part of the light transmitting member and is reflected on the inner surface of the light transmitting member in the other region is reflected by the covering member, the light can be efficiently extracted. That is, even if a light transmitting member having a large amount of light components propagating through the member can be taken out with high efficiency, the light transmitting member occupying a relatively large area and volume can be made small, and the device can be downsized. It is possible to suppress deterioration of characteristics. Further, since the above-mentioned composite light source is used, the light source section can be made small, which also contributes to downsizing of the device.

FIG. 1 is a schematic cross-sectional view (a) of a light emitting device according to an embodiment of the present invention and a schematic top view (b) thereof. FIG. 2 is a schematic cross-sectional view illustrating the vicinity of the light source unit of the light emitting device of FIG. 1 according to the embodiment of the present invention. It is schematic sectional drawing (A)-(D) which shows the light-emitting device of each calculation model which concerns on this invention. 6 is a graph showing the relationship between the ratio of the diameter of the light transmitting member and the diameter of the incident region and the light extraction efficiency in each calculation model of the present invention. It is a schematic sectional drawing of the light emitting element which concerns on one embodiment of this invention. 6A to 6D are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment of the present invention. FIG. 1 is a schematic cross-sectional view (a) of a light emitting device according to an embodiment of the present invention and a schematic cross-sectional view (b) illustrating the periphery of a light source section thereof. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one embodiment of this invention. It is schematic sectional drawing (a)-(c) of each light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. 6 is a graph showing a relationship between a light transmission member and light emission efficiency in the light emitting device according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting elements and devices described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, and the relative arrangements of the components described below are not intended to limit the scope of the present invention thereto only as long as there is no specific description, and are merely illustrative examples. Only. In addition, the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of description. Further, each element constituting the present invention may be configured such that a plurality of elements are configured by the same member and one member also serves as a plurality of elements, or conversely, the function of one member is performed by a plurality of members. It can be shared and realized. Further, similarly to each of the embodiments described below, each configuration or the like can be appropriately combined and applied unless otherwise specified.

(Embodiment 1)
1 and 2 are schematic views of a light emitting device 100 according to Embodiment 1 of the present invention, and FIG.
Is a schematic cross-sectional view taken along the line AA in FIG. 1B of the schematic top view, and FIG. 2 is a schematic cross-sectional view around the light source unit. The light emitting device 100 of the example shown in FIGS. 1 and 2 mainly includes a light emitting element 10, a light transmitting member 20, a covering member 30, a wavelength converting member 40, and a mounting substrate 50. The substrate 50 includes a frame body 55 and a wiring 51 on which a plurality (two in the drawing) of the light emitting elements 10 are flip-chip mounted. The wavelength conversion member 40 has a plate shape and has first and second surfaces facing each other, and the second surface is joined to the back surface of each light emitting element 10. And
The covering member 30 containing the light reflecting material 35 is filled inside the frame body 55, and the light emitting element 10 and the wavelength conversion member 40 of the light source section are covered by the covering member 30 with the first surface as an exposed surface. .
The covering member 30 continuously covers the side surface, a part of the second surface, and the side surface of the light emitting element 10. As a result, the light emitted from the light emitting element 10 and / or the wavelength conversion member 40 is reflected and guided to the light emitting side by the light reflective coating member 30, and is extracted from the first surface of the wavelength conversion member 40. The surface emitting type light source uses the first surface as a main light extraction window, that is, a light emitting surface. The shape and size of the first surface can be used as a light source, and the light transmitting member 20 as an optical element for the light source is bonded to the light incident area 80 of a partial area on the light incident side on the light source. .

FIG. 2 is a schematic cross-sectional view for explaining the vicinity of the light source unit of the light emitting device according to the first embodiment. As shown in FIG. 2, the light transmitting member 20 has the wavelength converting member 4 on the surface on the light incident side.
No. 0 surface is included and is provided in a part of the covering member 30 that surrounds the outside, and the surface 21 on the light emitting side, which is the light emitting surface of the light emitting device, faces the surface on the light incident side. Have. The surface on the light incident side faces the first surface of the wavelength conversion member 40, the incident region 80 on which the light from the light emitting element 10 and / or the wavelength conversion member 40 is incident, and the surface of the covering member 30 outside thereof. And a reflection region 90 facing the. The incident area 80 increases the extraction efficiency of light from the first surface of the wavelength conversion member 40, and as shown in FIGS. 1 and 2, reflects the light of the light transmission member 20 in the reflection area 90. . Here, as shown in the figure, the light transmitting member 20 is a hemispherical lens, and the center thereof is substantially the center of the incident area on the surface of the light source unit, that is, the light emitting surface 21 having a convex curved surface is provided. It is an optical element. At this time, in the cross section perpendicular to the first surface of the wavelength conversion member 40, the diameter (cross section width) L of the light source section and the incident region 80 is half or less of the radius of curvature r (= R / 2) of the light transmission member 20. , L ≦ (R / 2) / 2. A part of the light incident from the incident area 80 is emitted to the outside from the light emitting side surface 21, and the remaining light components are reflected to the light incident side on the inner surface of the light emitting side surface 21 and become return light. This return light is directly
Alternatively, most of them reach the reflection region 90 while repeating multiple reflection on the inner surface of the light transmitting member 20. The return light that has entered the reflection region 90 is reflected by the surface of the light-reflective coating member 30 to change the angle of incidence on the light-emission-side surface 21 of the light-transmissive member 20 and promote its transmission to the outside. To be done. Here, as will be described later, it is preferable that the covering member is a translucent member including a light-reflecting material because the diffuse reflection effect on the surface thereof is enhanced and light loss is small.

In addition, as described above, when light is incident on the light transmitting member 20 from the light emitting element 10 or the light source portion including the light emitting element 10 and the wavelength conversion member 40, one of the light source portions of the light reflecting coating member 30 is incident on the light reflecting portion. Since the portion is embedded, the light is almost not directly incident on the light transmissive member 20 from the reflective region 90 because it is almost limited to the incident region 80. You can get closer. As a result, it is possible to reduce the light reflection on the surface 21 on the light emitting side of the light transmitting member of the optical element having the convex curved surface, and thus to downsize and thin the entire device while maintaining high light extraction efficiency. Becomes As described above, in the light emitting device of the present invention, the light-incident side surface of the light-transmissive member 20 is provided with the incident region 8 for highly efficiently coupling the light source unit in the light-transmissive member 20.
0, and a reflection area 90 for reflecting the light component in the light transmitting member toward the surface 21 on the light emitting side,
Due to the different action, the light extraction efficiency can be remarkably improved in accordance with various shapes of the surface 21 on the light emitting side of the light transmitting member 20.

In particular, in the first embodiment, the light incident side surface of the light transmitting member 20 is directly connected to the light source section, that is, the first surface of the wavelength conversion member 40 and the outer surface of the covering member 30. That is, they are joined, that is, the incident region 80 is provided at the interface with the first surface, and the reflective region 90 is provided at the interface with the surface of the covering member 30, respectively. Therefore, the return light that reaches the reflection region 90 can be reflected or scattered by the surface of the light-reflective coating member 30, transmitted through the light-emitting side surface 21, and taken out of the device. In particular, as will be described later, when the covering member is a translucent member containing a light-reflecting material, for example, a translucent resin, interface coating with the light transmissive member is possible on the covering member surface, and The light that has entered the inside is reflected and scattered by the light-reflecting material, so that the effect of the reflection region 90 is enhanced and the light emitting device has excellent light emitting characteristics. In the light emitting device 100 of the first embodiment as described above, after the surface emitting type light source unit is manufactured as described later,
It can be manufactured by directly bonding the light transmitting member 20 thereon by various molding techniques and molding, and is the most excellent in mass productivity as compared with the light emitting devices of other embodiments described later.

Further, as shown in the figure, the incident area 80 preferably protrudes toward the light emitting side from the reflective area 90. As a result, the surface of the covering member 30 is not shielded from light, and as shown in the drawing, if the reflecting area 90 is an inclined surface inclined from the reflecting area toward the projecting incident area 80, that is, an inclined surface reflecting to the outside, Light emission to the side of the light transmitting member 20 by the reflection region 90, that is, a high angle component from the light emitting device is increased, and a wide orientation is obtained.

(Optical element and light source)
The relationship between the diameter W of the light transmitting member 20, that is, the diameter W of the optical element, the radius of curvature r of the convex curved surface, and the diameter L of the incident region 80 in the present invention will be described in detail below. FIG. 3 is a schematic cross-sectional view showing the structure of each light emitting device of the theoretical calculation model studied here. Light-emitting device 1 shown in FIG.
10 includes a light source unit 16 which is a rectangular parallelepiped (plate-like) having a side length L and a square shape and a thickness of 100 μm. Further, the light source section exposes only its upper surface and covers its side surface and bottom surface with the covering member 31, and the covering member 31 has a reflectance of 100%. Then, a hemispherical light transmitting member 20a having a diameter R whose center of curvature is the center of the upper surface of the light source portion indicated by a black circle in the figure is provided on the same surface of the light source portion and the covering member. Diameter R and diameter W of the light transmitting member is 4 mm (curvature radius 2 mm)
And the refractive index is 1.537. This light emitting device 110 is assumed to be the light emitting device 100 of the above-described first embodiment. Moreover, the light emitting device 120 shown in FIG.
The light emitting device 110 is the same as the above-described light emitting device 110, except that a gap 86 is provided between the surface of the cover member 32 and the surface of the cover member 32, and both surfaces are separated from each other. More specifically, there is an inclined surface 94 that is inclined downward from the upper surface of the light source section, facing the flat surface (reflection area) of the light transmission member 20b outside the light source section 16, and the refractive index of the air in the void 86. Is 1.000. The light emitting device 120 is assumed to be the light emitting device 200 of the second embodiment described later.

The light emitting device 130 shown in FIG. 3C is the same as the light emitting device 110 except that the light source section 16 is provided on the surface of the covering member 33, and the light source section is embedded in the light transmitting member 20c. Are covered except for the bottom surface, and the center of curvature is the light source portion 16 as shown by the black circles in the figure.
Located in the center of the bottom of the. Further, in the light emitting device 140 shown in FIG. 3D, the surface on which the light transmitting member is provided includes the covering member 34 and the base material 35 having a low reflectance on the outside thereof, and the light transmitting member 20d is changed. Except for this, the light emitting device 110 is the same as the light emitting device 110. In detail, the covering member 34 has a reflectance of 100% like other devices, is a square having a side of 2.7 mm in a top view, and the base material 35 has a reflectance of 90%. It constitutes the entire area of the light transmitting member. The light transmitting member 20d is a spherical surface having a radius of curvature of 3 mm and having a center of curvature at a position 2 mm away from the center of the upper surface of the light source unit and having a diameter W of about 4.472 mm. Therefore, in the light emitting device 140, on the light incident side surface of the light transmitting member, a region having a reflectance of 100% by the covering member 34 outside the incident region, and a substrate having a reflectance of 90% outside the region.
And the surface on the light source side is a hemispherical flat surface.

Based on the light emitting devices 110, 120, 130, 140 described above, the radius of curvature r (
R / 2) or the diameter (cross section width) W and the ratio (L / R, L / W) of the diameter (cross section width) L of the incident region,
The relationship with the light extraction efficiency is analyzed by theoretical calculation for each model. FIG. 4 shows the analysis results. Models A to C are the above-mentioned devices 110 to 130, model AD is a model in which the covering member 31 of the above-mentioned device 110 is replaced with the covering member 34 and the base material 35 of the device 140, models DD and DD. -W is the device 140 and its L / W ratio, and models DA and DA-W are models in which the covering member 34 and the base material 35 of the device 140 are replaced by the covering member 31 of the device 110 and the model L and L. / W ratio, and the diameter L of the light source unit 16 is changed. As shown in FIG. 4, in the models A to C and the AD, DD-W, and DA-W light emitting devices, the L / R ratio (
In the models DD-W and DA-W, when the L / W ratio) is larger than 0.5, the light extraction efficiency begins to decrease, which is particularly remarkable in the models A to C and AD. This indicates that in the range of 0.5 or less, the light extraction efficiency of the light source unit can be close to that of a point light source with respect to the light emitting surface of the light transmitting member having a hemispherical surface or a convex curved surface. Further, comparing the models A to C, the models A and B are significantly suppressed in the reduction amount of the light extraction efficiency even in the region where the L / R is large, as compared with the model C of the comparative example, and the models of the light source unit 16 are reduced. It can be seen that the structure in which a part is covered with the light-reflecting covering member has an advantage in downsizing the device while maintaining high luminous efficiency. Further, in the model AD of the comparative example, the efficiency is lower than the models A to C even in a small light source region, and the L / R sharply decreases at 0.5 or more. It is necessary to make the size sufficiently small and the size of the light transmitting member large enough, and it is necessary to increase the size of the device for high efficiency.

Further, the light extraction efficiency of the models DA and DD using the light transmitting member 20d of the light emitting device 140 is the same as the models A to C and AD using the light transmitting members 20a to 20c of the other light emitting devices 110 to 130.
Compared to, the initial value and maximum value are significantly lower. From the viewpoint of light extraction efficiency, it is most preferable that the surface of the light transmitting member on the light emitting side is a hemispherical surface, but the size of the device becomes large. On the other hand, in the light emitting device 140 (models DA and DD) of the semi-spherical flat member 20d,
Although the light reflection component on the inner surface of the light transmitting member 20d increases and the efficiency decreases, the device is excellent in downsizing and thinning. Even if the models DA and DD are compared, the model DD of the comparative example (device 140)
Compared with the above, the efficiency of the model DA tends to be excellent, and it can be seen that the present invention can realize a highly efficient device even in miniaturization and thinning. Further, like the light emitting device 140, the light transmitting member 20
Models AD and DD having a region 35 having a low reflectance on the outer edge of the surface on the light incident side are comparative examples. In such a region, members in the device lower than the covering member such as the substrate 50 and the wiring 51 are exposed. The structure is assumed. Therefore, in this model, due to the downsizing of the device and the increase in the area of the light source, the light reflection on the inner surface increases, the amount of light reaching the low reflectance region forming the outer edge of this ring increases, and the light extraction efficiency is further improved. Will be reduced. The light transmitting member of the present invention has a flat shape from a hemispherical surface, a flat convex curved surface with a changed curvature, and FIG.
, (C), which has various optical lens shapes and has a large amount of internal reflection of the light transmitting member, has a high luminous efficiency and maintains the high efficiency to make the device compact and thin. Can be converted.

  Next, each component and structure of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
As the light emitting element 10, a known light emitting element, specifically, a semiconductor light emitting element can be used, and in particular, a GaN-based semiconductor is preferable because it can emit visible light or ultraviolet light having a short wavelength that can efficiently excite the fluorescent substance. The specific emission peak wavelength is 240 nm or more and 560 nm or less, preferably 38
It is 0 nm or more and 470 nm or less. In addition to these, ZnSe-based, InGaAs-based, Al
An InGaP-based semiconductor light emitting element may be used.

(Light emitting element structure)
The light emitting device structure 11 including the semiconductor layer has at least the first conductivity type (n.
It is preferable that the structure includes a (type) layer 2 and a second conductivity type (p-type) layer 3, and further has an active layer 3 therebetween. Further, the electrode structure is such that both the first conductivity type electrode 2 and the second conductivity type electrode 6 are provided on the one main surface side.
7 is preferably provided on the same surface side electrode structure, but may be a counter electrode structure in which electrodes are provided so as to oppose each main surface of the semiconductor layer. Also in the mounting mode of the light emitting element 10, for example, in the above-mentioned same-side electrode structure, flip-chip mounting in which the electrode forming surface is the mounting surface and the substrate 1 side facing the electrode forming surface is the main emitting surface is the emitting surface and the light transmitting member. It is preferable in terms of optical connection with 20. Besides this,
The electrode forming surface side is used as a main emitting surface, and a translucent member and a wavelength converting member are mounted thereon.
Face-up mounting, a translucent member having a wiring structure, flip-chip mounting on a wavelength conversion member, and connection to a light transmissive member and a mounting substrate by the above-mentioned counter electrode structure can be performed, and preferably a light emitting element and translucent It is preferable to implement the embodiment in which the member and the wavelength conversion member are not provided with wiring and electrodes. In addition,
The growth substrate 1 of the semiconductor layer 11 may be removed when the light emitting device structure is not formed, and the support substrate, for example, a conductive substrate or another translucent member may be added to the semiconductor layer from which the growth substrate has been removed. It is also possible to adopt a structure in which the substrate is bonded. A transparent member and a wavelength conversion member 20 may be used for this support substrate. In addition, the semiconductor layer may be adhered by a transparent member such as glass or resin.
It may be a coated and supported structural element. The growth substrate can be removed by, for example, mounting or holding it on a support, a device, or a submount, and peeling, polishing, or LLO (Laser Lift Off). The light emitting element 10 may have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 that face each other, the other main surface that faces the light extraction side (emission surface side) is The light-reflecting side (lower side in FIG. 1) can be provided, and a light-reflecting structure can be provided in the semiconductor layer on the light-reflecting side, an electrode, or the like. As an example of the light reflection structure, a structure in which a multilayer film reflection layer is provided in a semiconductor layer, or an electrode having a metal film having high light reflectivity such as Ag and Al or a dielectric multilayer film and a reflection layer are provided on the semiconductor layer. There is a different structure.

(Nitride semiconductor light emitting device)
As an example of the light emitting device 10, in the nitride semiconductor light emitting device 10 of FIG. 5, an n-type semiconductor layer that is the first nitride semiconductor layer 2 and an active layer 3 are provided on the C-plane sapphire substrate that is the growth substrate 1. And the p-type semiconductor layer that is the second nitride semiconductor layer 4 are sequentially epitaxially grown. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode which is the first electrode 7, and the translucent conductive layer 5 such as ITO and the second electrode are formed on almost the entire surface of the p-type layer 4. A p-type pad electrode of No. 6 is formed. Further, the protective film 8 exposes the surfaces of the n-type and p-type pad electrodes 6 and 7,
It is provided so as to cover the semiconductor layer. Note that the n-type pad electrode 7 may be formed via a translucent conductive layer as in the p-type. The growth substrate 1 is, in addition to C-plane sapphire, R-plane and A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, Zn.
There are conductive substrates of semiconductors such as S, ZnO, GaAs, GaN and AlN. Examples of the nitride semiconductor, other general formula _{In x Al y Ga 1-xy} N (0 ≦ x, 0 ≦ y, x + y ≦ 1), B
Alternatively, P and As may be mixed crystals. The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or a multilayer, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue light emitting device structure 11, an n-type semiconductor layer such as Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature grown thin film GaN and a GaN layer. N-type contact layer and a GaN / InGaN n-type multilayer film layer are laminated, and subsequently an InGaN / GaN MQW active layer and a p-type semiconductor layer, for example, Mg-doped InGaN / AlGaN p-type multilayer film layer. And a p-type contact layer of Mg-doped GaN are laminated.

(Wavelength conversion member)
The light emitting device 100 of FIG. 1 includes a wavelength conversion member 40, which is excited by light from the light emitting element 10 in the light source section and is capable of wavelength conversion of at least a part of the incident light. The light source unit may have a structure in which a light-emitting element or a translucent member joined to the light-emitting element is added, and a wavelength conversion member is preferably used as the translucent member. Even when described simply as a wavelength conversion member in the present specification, it can be applied by being replaced with a translucent member when it does not depend on the wavelength conversion function. Thereby, the primary light emitted from the light emitting element 10 in the light source section is excited by the wavelength conversion member 40, whereby secondary light having a wavelength different from the emission wavelength of the light emitting element 10 is obtained, and the primary light and By mixing the wavelength-converted secondary lights, it becomes a composite light source that can realize emitted light having a desired hue. In addition to this, a light source unit that emits a secondary light excited by the primary light or a form in which almost only the secondary light is transmitted, for example, converted light of an ultraviolet light emitting LED (single color, mixed color light), It may be a light emitting device provided with.

Moreover, the wavelength conversion member 40 of FIG. 1 is configured to include the light emitting element 10 in a plan view from the first surface side. In other words, as shown in FIG. 1, the side surface of the wavelength conversion member 40 projects outside the side surface of the light emitting element 10. Thereby, the light emitted from the light emitting element 10 is directly coupled by the light receiving surface wider than the upper surface of the light emitting element 10, so that the loss of the light flux is small. The amount of protrusion of the side surface of the wavelength conversion member 40 with respect to the side surface of the light emitting element 10 is, for example, 3% or more and 30% or less, specifically, 5% or more and 15%, compared to the size of the light emitting element 10.
It is the following. As an example, in the light emitting device of Example 2 below, the wavelength conversion member 40 is projected at a terminal end with a width of about 50 μm.

Although the shape of the wavelength conversion member 40 is not particularly limited, it is a plate-like body in the first embodiment, has a good coupling efficiency with the emission surface of the planar light emitting element 10, and can be easily aligned so as to be substantially parallel to each other. preferable. In addition, by making the thickness substantially constant, it is possible to stabilize the ratio of color mixture and suppress color unevenness in the incident area 80 on the surface of the light source unit. In addition, it is easy to bond a plurality of light emitting elements 10 to one wavelength conversion member 40, and the distribution of luminance and chromaticity on the emission surface of the light source section depends on the arrangement of the light emitting elements, but this can be suppressed. The thickness of the wavelength conversion member 40 is preferably 10 μm or more and 500 μm or less, more preferably 50 μm or more and 300 μm or less in terms of light emission efficiency and chromaticity adjustment. Further, the number of mounted light emitting elements 10 bonded to one translucent member or wavelength conversion member 40 is not particularly limited, and if a plurality of light emitting elements 10 are mounted,
This is preferable because the amount of luminous flux can be increased and the brightness of the light emitted from the light source unit can be increased. Examples of the arrangement in the case of a plurality include arrangement in a line, arrangement at equal intervals in lattice positions, and the like.

Here, as the material of the translucent member used for the light source section and serving as the base material of the wavelength conversion member 40, the same material as that of the covering member 30 described below can be used. For example, resin, glass,
Inorganic substances can be used. Further, a molded body or a crystal body of the following phosphor may be used. Specifically, examples of the wavelength conversion member 40 include a glass plate provided with the wavelength conversion member, or a single crystal body, a polycrystal body, an amorphous body, a ceramic body having a phosphor crystal or a phase thereof. In addition, a sintered body, an aggregate, and a porous body of phosphor crystal particles and a translucent member that is appropriately added, and a light transmissive member such as a translucent resin mixed and impregnated therein, or It is composed of a light transmitting member containing phosphor particles, for example, a molded body of a light transmitting resin.

The wavelength conversion member can be suitably combined with a blue light emitting element to emit white light, and a typical phosphor used for the wavelength conversion member is a YAG phosphor (yttrium.aluminum. Garnet) and LAG-based phosphors (lutetium / aluminum / garnet), especially when used for a long time with high brightness (R
_{e 1-x Sm x) 3} (Al 1-y Ga y) 5 O 12: Ce (0 ≦ x <1,0 ≦ y ≦ 1, where, Re is
It is at least one element selected from the group consisting of Y, Gd, La, and Lu. ) Etc. are preferable. In addition, YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CC
A, SCA, SCESN, SESN, CESN, CASBN and CaAlSiN ₃ : Eu
A phosphor containing at least one selected from the group consisting of can be used. The wavelength conversion member is
In addition to the light-transmissive member, it may be provided, for example, in the light-transmissive member, between the light-transmissive member and the light-emitting element, in an adhesive material interposed therebetween, or between the light-emitting element and the covering member. Lighting and bulb color LE with a high average color rendering index Ra by increasing the reddish component by using a nitride-based phosphor that emits yellow to red light.
D etc. can also be realized. Specifically, by adjusting and containing the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the emission wavelength of the light emitting element, the chromaticity diagram between the phosphors and the chromaticity diagram connected by the light emitting element is shown. Can emit light at any point. In addition, a nitride phosphor, an oxynitride phosphor, and a silicate phosphor that convert near-ultraviolet to visible light into a yellow to red region can be used. For example, L ₂ SiO ₄ : Eu (L is an alkaline earth metal), especially (Sr _x Mae _1-x ) ₂ Si
O ₄ : Eu (Mae is an alkaline earth metal such as Ca or Ba). As a nitride-based phosphor and an oxynitride (oxynitride) phosphor, Sr—Ca—Si—N: Eu
, Ca-Si-N: Eu, Sr-Si-N: Eu, Sr-Ca-Si-O-N: Eu, C
a-Si-O-N: Eu, Sr-Si-O-N: Eu include, as the alkaline earth silicon nitride phosphor, the general formula _{LSi 2 O 2 N 2: Eu} , general formula L _x Si _y N _{(2 / 3x + 4 / 3y)} : Eu or L _x Si _y O _z N _{(2 / 3x + 4 / 3y-2 / 3z)} : Eu (L is Sr, Ca, or Sr and Ca) It is represented by.

(Coating member)
As shown in FIG. 1, the covering member 30 covers a part of the light source unit and the surface of the light transmitting member, specifically, covers the light source unit including at least the light emitting element so as to be embedded, and also transmits the light. The member extends and covers the incident side surface of the member. Further, a part of the wavelength conversion member 40 in the light source section, specifically, the side surface thereof is covered, and the surface of the light source section exposed from the light conversion section becomes an emission surface and enters the light transmission member. The base material of the covering member 30 is a resin material, which is more transparent, and it is preferable to use a silicone resin composition, a modified silicone resin composition, or the like, but an epoxy resin composition or a modified epoxy resin composition. A transparent insulating resin composition such as an acrylic resin composition can be used. Further, a sealing member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can also be used, and a translucent resin is suitable for coating a desired region in the present invention and molding thereof. Inorganic substances having excellent light resistance such as glass, silica gel and the like can also be used. Furthermore, it is preferable that the covering member 30 is made of a resin molded body having high heat resistance because it can cope with heat generation of the light emitting element of the light source section and the wavelength conversion member 40. In the first embodiment, a silicone resin is used as the resin forming the base material of the covering member 30. Silicone resin has excellent heat resistance, water repellency, and electrical insulation, and has the advantage that it does not easily deteriorate over time. Furthermore, the surface of the covering member 30 may be formed into a desired shape, for example, the shape of an inclined surface or a curved surface shown in the figure, to enhance the function and effect of the reflection area, control the directivity and the color distribution, and collect the light. By properly combining with the optical function of the light transmitting member, the emission characteristics of the device can be controlled.

Further, the covering member 30 contains at least one kind of light-reflecting material 35 in the base material. By containing a light-reflecting material, the reflectance of the covering member is increased, and more preferably, when the particles having low absorptivity are used, light absorption and loss are reduced, and a covering member having a light scattering property can be obtained, Specifically, translucent particles are used. As the light reflecting material, Ti, Zr, Nb, Al, S
One oxide selected from the group consisting of i, or at least one of AlN and MgF, specifically, TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO. It is at least one selected from the group consisting of ₂ . The particles of the light reflective material are Ti, Zr, N
Since it is one kind of oxide selected from the group consisting of b and Al, the material can have high reflectivity and low absorptivity, and the difference in refractive index from the base material, particularly the translucent resin can be increased, which is preferable. . Further, the covering member can also be constituted by a molded body of the above-mentioned light-reflecting material, and specifically, it can be a porous material such as an aggregate obtained by aggregating the above-mentioned particles, a sintered body, and the like. In addition, the molded body by the sol-gel method may be used, and the difference in the refractive index between the light-reflecting material and the air in the porous layer is increased,
It is preferable because it can improve the light reflectivity and can be composed of an inorganic material. On the other hand, a covering member provided with a base material such as the above resin is more capable of molding into a desired shape and controllability of the covering area, and can be improved in sealing performance and airtightness. preferable. Further, in consideration of the characteristics of both the covering members, a composite molded body of the both can be formed. For example, a part of the porous molded body, the outer surface side is impregnated with resin, and the inner surface side of the light emitting element side is It can have a porous structure. As described above, the covering member or the enclosing body that encloses the light source unit by the covering member may be such that the inner region communicates with the outside, or may be gas permeable, and at least the light does not leak out. .

In the covering member 30 containing the light-reflecting material 35 in the base material described above, the depth at which light leaks differs depending on the concentration and density of the base material. Should be adjusted. For example, in the case of reducing the wall thickness of a relatively small light emitting device, it is preferable to provide a high-concentration light-reflecting material. On the other hand, the concentration and particle size can be appropriately adjusted so as to be suitable for the production of the raw material of the covering member containing the light-reflecting material, the coating of the raw material, the molding, etc. Can be used, and the same applies to the porous body. As an example, it is preferable that the content concentration of the light-reflecting material 35 is 20% by weight or more, and the thickness of the covering member 30 is 20 μm or more. Within this range, productivity is good,
Emission light with high brightness and high directivity can be obtained from the first surface, which is the light emitting surface. Further, other fillers may be added to the resin base material. For example, a heat conductive material can be added, heat generated by the light source unit can be efficiently diffused, reliability can be improved, and output can be increased. As the heat conductive material, specifically, a heat conductivity of 0.8 W / K · m or more is preferable, and for example, Ag or Cu.
Examples thereof include metal materials such as, and ceramic materials such as diamond, alumina, AlN, and glass, which have good heat dissipation, and these may be mixed and contained. Further, a pigment or the like may be mixed and colored to absorb light having a specific wavelength.

The area covered by the covering member is as described above, which will be described in detail below. By covering the side surface of the light source section and the side surface of the wavelength conversion member, it is possible to prevent light from leaking from the side surface, and also to prevent light from being emitted outward from the side surface, resulting in color unevenness in the overall emission color. And uneven brightness can be reduced. Further, a part of the light source section is exposed, and specifically, a light emitting element, a wavelength conversion member,
Further, by covering the side surfaces of the other members and exposing the upper surfaces thereof, and limiting the light emitting region thereof, the directivity of the emitted light and the brightness on the emission surface can be enhanced. Further, the heat generated in the light source part, particularly the wavelength conversion member, is conducted to the covering member 30, and the heat dissipation property can be improved as compared with the case where the covering member 30 is not covered. Further, in addition to the side surface of the wavelength conversion member 40, a part of the light emitting element side surface (second surface) may be coated. Specifically, as shown in FIGS. The covering member 30 is filled between the covering member 50 and 50, and the periphery of the light emitting element 10 is covered with the covering member 30. That is, on the second surface, the exposed region is covered except the facing region that is joined to the light emitting element 10. in this way,
An optical connection region and a coating region of the coating member 30 are provided on the second surface, and the side surface of the light emitting element is extended from the coating region to cover the connection region with high efficiency of primary light. The light in the wavelength conversion member can be reflected on the second surface side to suppress light absorption in the substrate 50. Further, when a plurality of light emitting elements 10 are joined, the above-mentioned problem is increased in the adjacent elements, but the covering member 30 is filled between the elements, and the space between the adjacent element bonding areas on the second surface is increased. It is preferable that the above-mentioned effect is obtained by coating the above.

In the light emitting device of the present invention, the exposed surface side of the covering member 30 is the first surface (emission surface) of the light source section.
Of the light transmitting member and the opposing region thereof, and various other forms can be adopted for the other exposed surface region and the inner side. For example, the covering member 30 may cover the side surface of the wavelength conversion member 40 to form the exposed surface, and the side surface or the periphery of the light source section on the inner side thereof may be in contact with or separated from each other. In this case, A covering member that is in contact with or separated from the light emitting element is provided. As shown in the drawing, it is preferable in terms of manufacturing that the light emitting element 10 is encapsulated continuously from the side surface and the second surface of the wavelength conversion member to embed the light source unit. On the other hand, on the inner side, in addition to such contact, the covering member 30 can be arranged outside of the side surface of the light emitting element 10 with a space therebetween. It is preferable because reflection can be realized and deterioration of the coating member such as resin due to light or heat can be prevented. Further, a plurality of light emitting elements 10
It is possible to provide a structure in which the gap is also provided in the space area. At this time, it is preferable to form an exposed portion having a high refractive index difference between air and gas in the inner space of the void so that the refractive index difference with the light emitting element 10 is increased.

In the present invention, the light transmissive member is provided on the light incident side surface with a reflective region outside the incident region of the light source unit, and the reflective region is provided on the surface of the light transmissive member and further at the interface with the covering member.
The reflection function largely depends on the material and surface morphology of each member. In the first embodiment, by being formed at the interface between the covering member containing the light reflecting material and the light transmitting member formed thereon,
Equipped with suitable reflection and scattering functions. Specifically, the mutually translucent materials form an interface between the translucent materials, a high reflectance is obtained, and further, a scattering function is imparted by the light reflective material in the covering member. It Thereby, it is possible to improve the light extraction efficiency, improve the luminance, and the color unevenness, and particularly when the device is downsized, that is, the ratio of the light source unit L is large, or the diameter of the light transmitting member is small or the shape is deformed from the spherical surface, The effect increases when flattened. At this time, it is particularly preferable that a difference in refractive index is provided to each member forming the interface, and a large refractive index
On the light transmitting member side, the reflectance of the interface of the light transmitting material is improved, the output of the device is improved, which is preferable. On the covering member side, a large amount of light is taken in and scattered, so that the orientation Properties, brightness and chromaticity distribution are superior, which is preferable. Therefore, not only the above-mentioned optical element function of the light transmitting member and the interface between both members, which will be described later, the shape of the reflecting surface, but also the material and composition of both members, as well as the concentration and distribution of the above-mentioned reflecting material in the covering member are adjusted. Also by doing so, the light emitting device of the present invention can appropriately control its light emitting characteristics. Especially when the wavelength conversion member is included in the light source section, the chromaticity and brightness distribution of the light emitted from the light source section are unique due to the characteristics of the member such as the shape, but this can be controlled by the function of the reflection area. preferable. Further, since both members are made of resin, the resin interface can be formed into a desired shape, and as will be described later, it is preferable that a device having light emitting characteristics such as various directivities can be designed.

As described above, the light emitting device of the present invention has two regions surrounding the light source part, one light transmitting member side is a light guide region having a light emitting surface, and the other covering member side is a light guiding region. It is a covered area with high reflectance, and the light source part has a structure in which the exit area is exposed from the covered area and is coupled to the light guide area, and the reflective area is provided at the boundary between the light guide and covered areas. ing. By enclosing the light source unit with these two regions and providing the incident region and the reflection region in the joint portion or the boundary region thereof, each function and effect described above can be appropriately expressed and controlled, and desired light emission characteristics, A light emitting device that can be downsized can be obtained. In particular, it is preferable that the emission surface of the light source section is a surface light source and is a planar incident area so that the reflection area at the boundary portion continuing to it can function in cooperation. On the other hand, as shown in the examination of the device 140 and the models DD and DA which will be described later, it is preferable that the covering region is preferably formed, that is, it is provided at the boundary between the two regions. For example, the outer edge of the light transmitting member, which is wider than the covering member, faces the mounting substrate exposed from the covering member and is provided with a boundary, so that the characteristics of the device are greatly affected by the substrate surface having a low reflectance. Further, in another example, when the light leaking from the light source section or the path thereof is provided on the side surface or the mounting side surface of the light source section, the amount of light is large, so that the output and the efficiency are greatly reduced. For example, the side surface of the light emitting element and the surface (the substrate side, the mounting side) facing the incident area are exposed from the covering member, and the surface having a lower reflectance and a higher light absorptivity than the covering member such as the substrate surface is exposed there. Therefore, the effect becomes remarkable. Therefore, it is preferable that either the periphery of the light source portion or the exposed surface of low reflectance and high absorption rate is covered, or preferably both surfaces are formed, and the covering member as in the first embodiment. The form filled with is a structure provided with both. Therefore, it is preferable that the covering region is provided so as to face substantially the entire region of the light guide region, and the light incident side surface of the light transmitting member is included in the surface of the covering member. It is preferable that the area other than the emission surface is covered. Specifically, as shown in the figure, a covering member is provided as an underfill on the facing surface side of the light emitting element, and a structure having both is provided. For example, the precoat or the underfill that covers the light emitting element and the light source section is a transparent resin and has low reflection. The structure has a structure that prevents the exposure of the surface having a high absorption rate and a high absorption rate, the surface of the substrate, and the formation of a light leakage path from the light source section. Therefore, the surface of the light source section facing the emission side is included by the covering member and the covering area, that is, the surface of the covering member and the covering area on the opposite side (the surface on the substrate 50 side in the figure) is covered by the covering member from the light source section. It is preferably separated.

The reflecting surfaces provided at the boundary between the light guide area and the covering area are provided on the surfaces of the respective areas which face each other, and when they are joined as in the first embodiment, they are provided at the interface thereof.
In the former case, when facing each other with being separated from each other as in the case of the second embodiment, a reflecting function is given to each of the facing surfaces of the light transmitting member and the covering member, and they are superposed, so that the light extraction efficiency is high. In the latter case, since the reflection function is provided at the boundary region and the interface between the members, it becomes easy to control the directivity. Therefore, the reflecting surface can have a desired reflecting function in forming each region and each member,
When the inclination of the surface is substantially flat with respect to the incident area, light is extracted in the emission direction of the light source section, and on the other hand, when the reflecting surface is inclined outward as in the second embodiment, for example, its normal line. When the direction is tilted outward with respect to the optical axis of the light source section, is wide directivity, and when tilted inward, high-luminance light emission is preferable, which is preferable. Further, a structure provided with various optical surfaces such as a convex curved surface and a concave curved surface can obtain desired light emitting characteristics, and in the case of a scattering covering member containing a light reflecting material, each region, each Different reflection functions can be provided on each facing surface of the member, and when the two are joined, the above-mentioned interface reflection and internal scattering function can be imparted, and when the two are separated, diffused reflection on the surface of the covering member accelerates light extraction. Can be a structure. As described above, the coating region, the reflectance of the coating member, for example, the concentration of the light-reflecting material may be constant as in the embodiments and examples, and different regions may be provided or distributed. You may. By this, different reflection functions can be imparted to each region and part, for example, the concentration of the light-reflecting material is changed between the inner region on the light source unit side and the outer region outside it, or each region is covered with a covering member having a different concentration. The light emitting device can be formed to have different scattering properties in each of the inner and outer regions. For example, the outer region may be made of a high-concentration light-reflecting material to enhance the scattering property and reduce the color unevenness of the outer edge portion of the emitted light.

(Light transmitting member)
The light transmitting member 20 may be bonded to the first surface of the light emitting element 10 or the first surface of the wavelength conversion member 40 to improve the light extraction efficiency. The light transmitting member 20 has at least a light emitting side surface 21 and a light incident side surface, and the light emitting side surface 21 can be formed in various shapes according to the purpose. For example, as described above, the surface 21 on the light emitting side is formed into a convex lens shape having a convex curved surface and a spherical surface (hemispherical surface), so that uniform transmission characteristics (critical angle) are obtained with respect to light incident in all azimuth angles.
Therefore, the light can be efficiently extracted to the outside. Moreover, not only the spherical surface, but a desired curvature,
By using a convex lens shape, for example, a bullet shape, the emission angle of light can be made smaller than that of a spherical surface. In addition, light may be diffused by forming a concave curved surface or a concave lens shape.
As described in FIG. 9, an optical element having a desired directivity may be used.

The light transmitting member 20 is formed using a resin material such as an epoxy resin, a silicone resin, a modified silicone resin, a urea resin, a urethane resin, an acrylic resin, a polycarbonate resin, or a polyimide resin, like the base material of the covering member 30. can do. Since the light transmission member 20 also plays a role as a sealing material that protects the light emitting element 10 and the wavelength conversion member 40, a material excellent in weather resistance, heat resistance, and hardness is preferable, such as an epoxy resin or a hard silicone resin. Is preferable, and glass may be used. Furthermore, the above-mentioned phosphor, and / or the above-mentioned light-scattering particles such as TiO ₂ , and / or the above-mentioned filler such as quartz glass, and the above-mentioned pigment, etc. are appropriately added to the light-transmissive member 20. It is possible to obtain a desired light emitting characteristic, and the same applies to a transparent resin material such as a transparent member and the adhesive 15. In addition, the light transmitting member 20
Can be molded into a desired size and a desired shape as described above by compression molding, transfer molding or the like.

(Mounting board)
On the other hand, in the light emitting device 100 of FIG. 1, the substrate 50 on which the above light emitting element 10 is mounted is
At least a surface on which a wiring 51 connected to the electrode of the element is formed can be used, and a wiring 52 (FIGS. 7 and 9) for external connection may be provided. The material of the substrate is, for example, aluminum nitride (AlN), and is made of single crystal, polycrystal, sintered substrate, other materials such as ceramics such as alumina, glass, semi-metal or metal substrate such as Si, and laminated layers thereof. A body or a composite can be used, and metal and ceramic are preferable because they have high heat dissipation. It should be noted that the substrate 50 does not need to have wiring. For example, the growth substrate side may be mounted with the element of FIG. 5 so that the electrode of the element is wire-connected to the electrode of the apparatus, or the wiring is provided and connected to the wavelength conversion member. But it is okay. In addition to the configuration in which the covering member 30 is provided on the mounting substrate 50 as in the illustrated light emitting device, the outer side surface of the mounting substrate 50 may be covered. Moreover, it is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is adhered onto the wiring 51 by a conductive adhesive material 60 and electrically connected to the outside. Conductive adhesive 6
For 0, solder, Ag paste, Au bump or the like can be used.

(Frame, laminated substrate, base material)
The light emitting device 100 shown in FIG. 1 has a frame body 55 and is a holding member for the covering member 30. The frame body 55 can be formed of ceramic, resin, or the like. Alumina, which has high light reflectivity, is preferable, but it is not limited to this as long as a reflective film is formed on the surface. If it is a resin, screen molding or the like may be used, and the molded body may be adhered to the mounting substrate. Further, it is preferable to increase the reflectance by using a light reflecting material as in the case of the covering member 30. Further, like the above-mentioned addition member, the frame body may be colored according to the purpose. The frame can be removed after filling or molding the covering member. Further, the frame body may be formed integrally with the mounting substrate of the light emitting element, such as the laminated substrate 56, a device substrate having a cavity structure made of a base material or the like.

(Adhesive)
An adhesive 15 may be interposed at the interface between the light emitting element 10 and the wavelength conversion member 40, whereby both members are fixed. The adhesive 15 is preferably made of a material that can effectively guide light emitted from the light emitting element 10 to the wavelength conversion member 40 side and can optically connect both members. Examples of the material include resin materials used for the above members, and as an example, a translucent adhesive material such as silicone resin is used. A similar translucent adhesive may be provided between the other members, for example, the adhesive 55 in the second embodiment (FIG. 7) on the optical path.

(Method of manufacturing light emitting device)
An example of a method of manufacturing the light emitting device 100 of the example shown in FIG. 1 will be described below with reference to FIG. First, as shown in FIG. 6A, bumps 60 are formed on the substrate 58 or on the light emitting element 10, and the light emitting element 10 is flip-chip mounted via the bumps 60. In this example, one LED chip is mounted side by side on a region corresponding to one light emitting device on the submount substrate 58 (however, the number of LED chips can be appropriately changed). Next, the first surface side of the light emitting element 10 (
On the back surface of the sapphire substrate 1 or on the exposed surface of the nitride semiconductor 11 if the substrate is removed,
A wavelength conversion member 40 is laminated by applying a silicone resin as an adhesive material. Then, the silicone resin is thermally cured to bond the light emitting element 10 and the wavelength conversion member 40. Further, a frame 57 having a predetermined size and shape is provided upright around the light emitting element 10. Here, the frame body 5
The height of 7 is lower than that of the first surface of the wavelength conversion member 40, but may be substantially the same or higher.

Next, the liquid resin 31 containing the light-reflecting particles is potted in the frame 57 by a dispenser (liquid quantitative discharge device) 71 or the like so as to cover the side surface of the wavelength conversion member 40. The dropped resin 36 crawls up on the wall surface side of the light emitting element 10 due to surface tension and covers the side surface of the wavelength conversion member 40. Then, the resin 36 is cured to form the covering member 37.
Here, the covering member 37 has a concave portion that is recessed at a position lower than the first surface of the wavelength converting member 40, and in other words, a convex portion in which the first surface of the wavelength converting member 40 is arranged at the highest position. The window portion is shaped like a window, and the surface of the covering member 37 becomes an inclined surface in the periphery thereof. Next, as shown in FIG. 6B, an appropriate amount of liquid thermosetting resin 26 serving as a light transmitting member is dropped on the covering member 37 and the wavelength converting member 40 by the same dispenser or the like. Subsequently, as shown in FIG. 6C, a predetermined pressure is applied from above by an upper mold 72 having a hemispherical lens mold to compress the resin layer 26, and in that state for a predetermined time. The resin layer 26 is held and the resin layer 26 is primarily cured. Here, it is preferable that the heating temperature and the heating time in the mold are set to conditions such that the resin reaches a hardness sufficient to maintain a predetermined shape. For example, the primary curing temperature is 100 to 17
The temperature is 0 ° C., preferably about 120 to 150 ° C. The curing time is 200 to 900 seconds, preferably 250 to 600 seconds. Further, a lens having a desired lens diameter and a desired radius of curvature can be formed depending on the shape of the inner surface of the upper mold 72.

Further, as shown in FIG. 6D, the substrate provided with the series of light-emitting devices in which the resin molded body 27 having the desired lens shape is formed is taken out from the mold and heated under predetermined conditions to mold the resin. The body 27 is secondarily cured. The conditions of the secondary curing are, for example, the temperature of the secondary curing is equal to or higher than that of the primary curing so that the resin molded body 27 is sufficiently cured, and the time of the secondary curing is set to be longer than the primary curing. Preferably. In the case of epoxy resin and hard silicone resin, the time for secondary curing is set to about 3 to 5 hours. If the secondary curing is sufficiently performed in this way, it is possible to prevent unreacted curing components from remaining in the resin molded body 80 and adversely affecting the reliability of the light emitting device. Also,
By performing the secondary curing after removing from the mold, the throughput of the process can be increased. Finally, dicing is performed at a predetermined position (for example, the dotted line A in FIG. 6D), cut into a desired size, and individualized to obtain the light emitting device 100 in FIG.

(Embodiment 2)
FIG. 7A is a schematic sectional view of the light emitting device 200 according to Embodiment 2 of the present invention.
(B) is a schematic sectional view for explaining the peripheral portion of the light source. In the light emitting device 200, the structure other than the light transmitting member 20 is substantially the same as that of the first embodiment, and therefore, the same configurations are denoted by the same reference numerals and the description thereof will be appropriately omitted. The light emitting device 200 has a configuration in which a light transmitting member 20 preliminarily formed in a hemispherical shape having a diameter R (= W) is bonded to the first surface of the wavelength converting member 40 via a light transmitting adhesive material 28. ing. In this light emitting device 200,
On the surface of the light transmitting member 20 on the light incident side, an incident area 82 that is joined to the adhesive 28 with a diameter L2 and a reflective area 92 outside the incident area 82 are provided. The reflection area 92 and the surface 93 of the covering member are separated from each other, and a space 85 is provided between them, and the reflection area 92 is the bottom surface of the light transmitting member 20 and forms an interface with the air for reflection. Therefore, the light extraction efficiency can be improved. As can be seen from the above analysis result shown in FIG. 4, the light emitting device 2 according to the second embodiment
00 has a higher light extraction efficiency than that of the light emitting device 100 of the first embodiment, and particularly when the light source is large, the light transmitting member is small, and the device 00 is excellent in configuration. In addition,
The translucent adhesive material 28 is preferably a material having a refractive index substantially the same as that of the light transmissive member 20 to be joined. This is for reducing the reflection of light at the interface between the light transmitting member 20 and the light transmitting adhesive 28 and improving the optical coupling efficiency. If the light transmitting member 20 and the light transmitting adhesive 28 are made of substantially the same material, for example, if they are made of substantially the same resin. You can easily achieve that.

In addition, the intervening translucent adhesive material 28 is provided in a region facing the incident region 82 on the light source section side, that is, on the surface on the light incident side, with the first surface of the wavelength conversion member 40 which is the emission surface of the light source section. An incident area 81 having a diameter L1 is provided at the interface, and a reflective area 91 is provided at the interface with the surface of the covering member. This diameter L
2 is preferably larger than the diameter L1 so that light can be efficiently guided from the light source section to the light transmitting member 20. In addition, since the reflective region 91 is provided, the return light in the translucent adhesive material is reflected and scattered on the surface of the covering member, and the efficiency of optical coupling to the light transmissive member 20 can be increased. It should be noted that the light-transmitting adhesive material 28 is covered on the light source section side (the light-incident area 8 described above).
1 and the reflection area 91) and the range of the covering / joining area of the reflecting area 93 of the covering member exposed from the adhesive, the ratio of the reflecting areas 91 and 92 outside the light source section can be adjusted. Substantially the entire area of the light-incident-side surface of 20 may be covered with the translucent adhesive material 28.
In this case, a space between the light transmissive member and the covering member is filled with a translucent adhesive material to form a transparent region, which promotes the transmission of light from the light transmissive member 20 into the translucent adhesive material 28. As in the case of No. 1, the structure is such that the return light is reflected by the reflection area 91 on the surface of the covering member and is extracted to the outside. That is, the incident surface side 25 is separated from the emission surface 81 of the light source section and the surface 93 of the covering member through the translucent adhesive, so that the light propagates in the separation area sandwiched between the respective surfaces. And then reflected on the surface 93,
Since the light is scattered, and on the other hand, it is also reflected by the reflection area 92 facing it, an efficient reflection structure can be obtained.

(Embodiment 3)
FIG. 8 is a schematic cross-sectional view for explaining the vicinity of the light source unit of the light emitting device according to Embodiment 3 of the present invention. Note that the structure around the light source portion of the light emitting device described here can be applied to the configurations of the light emitting devices in other embodiments. The incident region 83 of the light transmitting member has a concavo-convex structure, the incident light from the light emitting element 10 and / or the wavelength converting member 40 of the light source unit is scattered, and the return light can be reflected and scattered. The reflection function of the region 90 is supplemented, the directivity of the light emitted from the light emitting surface can be widened, and uneven brightness and uneven color are easily reduced. In particular, when a plurality of light emitting elements 10 are mounted on one wavelength conversion member 40, the influence of the arrangement of each light emitting element 10 and the influence of light distribution, luminance unevenness, and color unevenness caused thereby are large, and are reduced. Therefore, it is preferable. Further, the uneven surface is expected to improve the optical coupling efficiency and the adhesion of both members. Also,
Such a concavo-convex structure can be provided not only on the surface of the wavelength conversion member, but also on the surface of the light emitting element side thereof, and also on the surface of each member on the optical path to obtain the same effect. It may be provided in the boundary region with or in the light source part, for example, on the surface of the substrate 1 on the semiconductor layer 11 side, and such a structure is used although not described in detail in the embodiments. Uneven surface 4 of wavelength conversion member
The concavo-convex structure such as 3 can be provided by polishing, dry etching, wet etching, etc., and in addition to the irregular concavo-convex structure, the concavo-convex structure having a regular pattern can be formed.

In the light emitting device shown in FIG. 8, the light emitting element 10 has a structure in which a semiconductor element structure 11 having a plurality of light emitting regions (light emitting layers) separated from each other is provided on one growth substrate 1. In this way, by bonding a single light emitting element and further forming the growth substrate 1 into the light emitting element 10 in which the light emitting regions are separated, a plurality of light emitting elements 1 can be formed in one wavelength conversion member 40.
As compared with the case where 0 is mounted, the influence of the arrangement of the light emitting elements 10 and the light distribution can be reduced. Furthermore, the wavelength conversion member 40 has a width smaller than the width of the first surface (the back surface of the growth substrate 1) of the light emitting element 10, that is, at least a pair of opposing side surfaces of the wavelength conversion member 40 has
It is located inside the side surface of the light emitting element 10. With this configuration, the luminance is relatively increased by narrowing the light emitting region, and the ratio of the color mixture of the primary light and the secondary light can be made uniform within the surface, so that the wavelength conversion member 40 as in the first embodiment. If the side surface of the light emitting element 10 is located substantially on the same surface as the side surface of the light emitting element 10, the amount of light from the light emitting element 10 is insufficient at the outer edge portion of the wavelength conversion member, and color unevenness easily occurs. it can. However, the “substantially the same surface” in the present specification may be substantially the same surface in terms of the function described above, and is, for example, about ± 10% of the dimensions of the wavelength conversion member 40 and the light emitting element 10. can do. Further, in the light emitting device shown in FIG. 8, the light emitting element 10 and the wavelength conversion member 40 are directly bonded without a translucent adhesive material. Such joining can be realized by surface activation or crystal joining by thermocompression bonding, and by not using an adhesive that is a resin material having a relatively small refractive index, the interface with different refractive indexes is not increased and the bonding efficiency is improved. It is possible to improve the heat dissipation from the wavelength conversion member 40.

(Embodiment 4)
9A, 9B and 9C respectively show a light emitting device 30 according to Embodiment 4 of the present invention.
FIG. 3 is a schematic sectional view of 0, 400, and 500. The fourth embodiment shows a modified example of the shape of the light transmitting member 20 and its light emitting side surface in the light emitting device according to the present invention, which can be applied to each of the embodiments and other main structures. Since the above is substantially the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be appropriately omitted.

The shape of the surface 21 on the light emitting side of the light transmitting member 20 in the light emitting device 300 of the example shown in FIG. 9A has a convex curved surface which is a flat shape from a hemispherical surface. More specifically, as indicated by a black circle in the drawing, the center of curvature is located at a position apart from the center of the surface of the wavelength conversion member 40 by Y downward, and the surface 21 has a diameter R (curvature radius) about the center. It is composed of a part of a spherical surface of r = R / 2), and its diameter (cross section width) W is W = 2 × (r ² −Y ² ) ^1/2 . Device 140, model D described above
As shown in (DA), by making the light transmitting member 20 a flat shape, the light emitting device can be made smaller and thinner, but the surface 21 changes from a hemispherical surface, so that the inner surface of the light transmitting member 20 is changed. Light reflection increases. However, in the light emitting device of the present invention, since the reflection area 90 occupies most of the surface of the light transmitting member 20 on the light incident side, the light in the light transmitting member is reflected there and is further scattered by the light reflecting material 35. By doing so, it can be taken out efficiently. In the drawing, the covering member 30 has a cross-sectional width sufficiently wider than that of the light transmitting member 20, but it goes without saying that the covering members 30 can be made smaller so that both ends are substantially the same. In addition, the light emitting device 300 includes the substrate 50.
A Zener diode electrically connected to the light emitting element 10 is provided thereover. As described above, the protective element 14 for electrically protecting the light emitting element is embedded in the covering member 30 as shown in the drawing, and if it is separated from the light source section and the reflection area, it is optically effective with respect to other main constituent members. In addition, the diameter of the light emitting device and the covering member can be made substantially equal to the diameter of the light transmitting member, that is, if the light emitting device and the covering member are arranged inside the light transmitting member 20 and in the reflection region 90, the light emitting device can be downsized. It is preferable because it does not hinder the chemical conversion.

In the light emitting device 400 of the example shown in FIG. 9B, the shape of the light transmitting member 20 is the wavelength converting member 40.
The upper surface 22 is formed by two convex curved surfaces that intersect with each other directly above the center of the light source, and the side surface 23 thereof. Light emitted from the surface of the light source unit passes through the incident area 80, and the upper surface 22 is mainly used as a reflective surface to the side. And is taken out to the outside of the device with the side surface 23 mainly as a light emitting surface. In addition, on the upper surface 22,
In order to enhance the reflection function, a reflective film or member such as a metal film, a dielectric multilayer film, or a covering member containing the light reflective material 35 may be formed. Further, in such a light emitting device, the extraction efficiency is enhanced by the reflection and scattering by the upper surface 22 and the reflection region 94, and the color unevenness of the light emitted from the wavelength conversion member 40 is alleviated. In addition, the wavelength conversion member 4
The side surface of 0 may be exposed from the covering member 30.

In the light emitting device 500 of the example shown in FIG. 9C, the light transmitting member 20 has a shape including a flat upper surface 23 and a side surface 24 that is a curved surface inclined toward the inner light source section. Have. Thus, the light emitted from the surface of the light source unit passes through the incident area 80, is condensed upward by the side surface 24, and is extracted from the upper surface 23 to the outside of the device. A similar reflective film may be formed on the side surface 24 as described for the light emitting device 400, and as shown by a dotted line in the figure, a new frame is newly formed on the frame 56. It is also possible to fill a covering member containing the light-reflecting material 35 to form a laminated structure of the second light-reflecting layer covering the light-transmitting member 20.

The above examples show examples of application to various light transmitting members in the light emitting device of the present invention, and in the devices of FIGS. 9 (b) and 9 (c), the above-described reflective regions 94 and 95 are also included. It is provided, and the incident region of the light source unit is provided inside thereof. In particular, in the light transmitting members having various shapes instead of the convex curved surface as in FIG. 9A and other embodiments, more light is trapped inside the light transmitting member than the convex curved surface, and Other structures work well. Also, in the relationship between the diameter L of the light source section and the diameter W of the light transmitting member, the relationship between the L / W ratio and the light extraction efficiency tends to become more prominent, and the efficiency drop tends to increase. it is conceivable that.
As described above, the devices of FIGS. 9B and 9C have a structure in which, in addition to the reflection region facing the covering member on the incident surface side, the reflection regions are provided on the other surfaces 22 and 24, Further, the light emitting surface 23 is provided, and by this structure, suitable reflection and scattering by the covering member can be achieved in a part of the reflection region, particularly in the vicinity of the light source portion, and a device having desired light emitting characteristics can be realized.

(Embodiment 5)
FIG. 10 is a schematic cross-sectional view of a light emitting device 600 according to Embodiment 5 of the present invention, and the other main structure except the mounting form of light emitting element 10 is substantially the same as in Embodiment 1, and therefore, The same configurations will be denoted by the same reference numerals and the description thereof will be appropriately omitted. In the light emitting device of the present invention, the light source section is covered with the light-reflecting covering member 30 and optically coupled to the light transmitting member. Regarding the covering form, specifically, the mounting form of the light emitting element and the covering member form, It can take various forms. The light emitting device 600 of FIG. 9 is an example thereof, which does not have the substrate 50,
0 is molded into a rectangular parallelepiped shape or a plate shape, and this molded body constitutes the exposed surface of the light emitting device together with the light transmitting member 20. The covering member 30 is provided with a conductor 61 connected to each electrode of the light emitting element 10.
The external connection portion is formed reaching the back surface side of. The extending direction of the conductor 61, the exposed position,
The surface can be changed as appropriate, and for example, it may be exposed by being stretched outward on the same side as the light transmitting member 20. The conductor 61 may have a columnar shape as shown in FIG. 9 or a combination of layered shapes. With such a light emitting device 600, the light source part such as the light emitting element 10 can be almost completely covered with the covering member 30 except the incident region 80 of the light source part, and the light emitted from the light source part is mounted on the mounting substrate 50. , Absorption and loss due to the conductor wiring, etc. can be reduced,
It is possible to improve the extraction efficiency of light from the light source unit.

Such an apparatus, for example, mounts a light emitting element on a supporting substrate, applies a covering member to form a molded body, and performs surface treatment with a release agent or the like in advance, and peels it from the supporting substrate. It can be realized by a method of taking out the molded body of the covering member in which the light source unit is embedded. Other structures are
The light transmitting member may be molded or adhered before or after peeling the molded body, and may be cut into individual devices before and after the peeling, and a light transmitting member using a supporting substrate such as a mold. You may form the molded body on it. Further, the wiring structure of the light source unit is such that the surface on the incident region 80 side is placed so as to face the support substrate, and the electrode of the light emitting element and the conductor on the electrode are formed, plated,
The conductor may be formed by bumps or the like to form the covering member, and the wiring side surface is placed so as to face the support substrate, and the conductor or the conductor is previously formed on the light emitting element side, the support substrate side or both. A wiring layer on a supporting substrate or a conductor combining them may be provided and peeled.

Hereinafter, examples according to the present invention will be described in detail. It is needless to say that the present invention is not limited to only the examples described below.

(Examples 1 to 3)
In the light emitting devices of Examples 1 to 3, the light emitting element 10 as shown in FIG. 7, or the element and the wavelength conversion member 40 bonded to the element are covered with the side surface by the covering member, and the exposed light emitting surface of the upper surface of the light source unit. It has a structure in which the lens 20 is adhered to the upper surface thereof with an adhesive 28. Specifically, on the wiring 51 of the AlN ceramic substrate 50, a blue LED LE having a substantially square shape of about 1 mm × 1 mm is formed as the light emitting element 10.
One D chip is flip-chip mounted with bumps 60. In Example 1, the LED
The side surface of the LED chip is covered with a covering member 30 filled around the sapphire substrate, which is the growth substrate 1 of FIG. The covering member 3
No. 0 is a silicone resin containing the light-reflecting material 35, which is fine particles of TiO ₂ having a particle diameter of about 270 nm, in a concentration of about 23 weight percent. Further, in Examples 2 and 3, one sheet of YAG sintered body, which is the plate-shaped wavelength conversion member 40, is bonded onto the growth substrate 1 of the LED 10 by the translucent adhesive 15 made of silicone resin. Then, as shown in the drawing, in a state where the emission surface of the surface of the wavelength conversion member 40 is exposed, as in the first embodiment, a part of the bottom surface and the side surface of the wavelength conversion member 40 by the covering member 30, the side surface of the LED chip, and the like. The surface of is encapsulated. The surface of the covering member 30 is inclined in the vicinity of the light source part so as to crawl up the side surface continuous from the emission surface of the light source part as shown in the figure. The outer shape of the wavelength conversion member 40 has a size of about 1.1 in the second embodiment.
mm × 1.1 mm, in Example 3, it has a rectangular shape of about 1.5 mm × 1.5 mm, and the thickness is about 1
It is 50 μm. Then, in each of the examples, the light emitting element 10 was formed on the surface of the covering member.
Alternatively, the same hemispherical lens-shaped light transmission member 20 made of silicone resin and having a diameter R of about 4 mm is included so that the emission surface of the light source section of the wavelength conversion member 40 is included and the optical axis is located substantially at the center thereof. The translucent adhesive 28 made of silicone resin is bonded to each of the emission surfaces.

The ratio (L / R) of the diameter L of the light source portion to the diameter R of the light transmitting member 20 is about 0.250 in the first embodiment, about 0.275 in the second embodiment, and about 0.375 in the third embodiment. is there. Example 1
The blue monochromatic light-emitting device of the above has a peak emission wavelength of 449n at a driving current of 350mA.
It emits light with a light emission output of 522 mW. Further, the white light emitting device of Example 2 has a luminous flux of 115 lm (chromaticity y value of 0.38) at a driving current of 350 mA and a luminous flux of 170 lm (same chromaticity y value) at a driving current of 550 mA, and has a relatively high brightness. . The white light emitting device of Example 3 has a luminous flux of 135 lm (chromaticity y value of 0.38) and a driving current of 5 at a driving current of 350 mA.
At 50 mA, the luminous flux is 200 lm (same chromaticity y value), and the luminous flux is relatively high.

(Examples 4 to 6)
Next, the structure of the wavelength conversion member 40 is changed, and the influence of the presence or absence of the light transmission member 20 on the light emission efficiency is verified below. The light emitting device of the fourth embodiment is the same as that of the third embodiment, and the light emitting devices of the fifth and sixth embodiments respectively change only the configuration of the wavelength conversion member 40 of the fourth embodiment. In Example 6, a silicate phosphor of (Sr, Ba) ₂ SiO ₄ : Eu was dispersed in a silicone resin in the same manner as in Example 5 using a sheet in which the same YAG phosphor was dispersed in a silicone resin. It is a sheet. Sheets of these resins are produced by spin-coating a resin coated with a release agent with a resin in which a phosphor is diffused, curing the resin, and cutting it into a predetermined size. In the light emitting devices of Examples 4 to 6, the difference in light emission efficiency depending on the presence or absence of the light transmitting member 20 is shown in FIG. In addition, after mounting the light transmitting member 20 of Examples 4, 5, and 6, D, E, and F respectively.
And before mounting the light transmission member 20 is described as d, e, and f, respectively. As shown in FIG. 11, in any of the examples, by mounting the light transmissive member 20, it is possible to improve efficiency in light emission of the same chromaticity, and it can be confirmed that light emission efficiency is improved.

When a sintered body is used as the wavelength conversion member 40, it may be difficult to generate a sintered body, the conversion efficiency may be reduced, or the firing of two or more kinds of phosphors may be greatly restricted. is there. On the other hand, a sheet produced by diffusing a phosphor in a resin has a low production temperature and does not impair the characteristics of the phosphor, and thus can be produced regardless of the type of the phosphor. For example, FIG.
As shown in FIG. 1, the resin sheet using the silicate phosphor exhibits higher conversion efficiency than that using the YAG phosphor. The surface of the plate coated with the release agent may be flat, or a concavo-convex structure may be formed on a resin sheet as a concavo-convex surface.

INDUSTRIAL APPLICABILITY The light-emitting device of the present invention can be suitably used for a light source for illumination, an LED display, a backlight light source such as a liquid crystal display device, a traffic light, an illumination switch, various sensors, various indicators and the like.

10 ... Light emitting element (1 ... Growth substrate, 2 ... First conductivity type (n type) semiconductor layer, 3 ... Active layer, 4 ... Second conductivity type (p type) semiconductor layer, 5 ... Translucent conductive layer, 6 ... Second electrode (p-side pad electrode), 7
... first electrode (n-side pad electrode), 8 ... protective film, 11 ... semiconductor element structure,
14 ... Protective element, 15 ... Adhesive material, 16 ... Light emitting part,
20 (20a to d) ... Light transmitting member (21 ... Surface on light emitting side, 22, 24, 25 ... Reflecting surface,
23 ... Luminescent surface) 26 ... Resin layer, 28 ... Adhesive,
30-34 ... Covering member, 35 ... Light-reflecting material,
40 ... Light transmitting (wavelength converting) member,
50, 58 ... Mounting substrate / base material (51-52 ... Wiring pattern, 55-57 ... Frame body or laminated substrate or base material), 60 ... Conductive adhesive material, 61 ... Conductor, 71 ... Dispenser, 72 ... Top Mold

Claims (8)

A light source section having a light emitting element and a translucent member bonded to the light emitting element;
A covering member containing a light-reflecting material, which embeds a part of the light emitting element and the translucent member so that a part of the light source unit is exposed,
A light-transmitting member facing the surface of the light source unit and the covering member, and having an incident region into which light from the light source unit is incident;
A protective element electrically connected to the light emitting element,
The light emitting device in which the protection element is separated from the surfaces of the light source unit and the covering member and is embedded in the covering member.   The light emitting device according to claim 1, wherein the translucent member includes a wavelength conversion member.   The light emitting device according to claim 1, further comprising a base on which the light emitting element and the protection element are mounted.   The light emitting device according to claim 1, wherein the protective element is arranged below a reflection region outside the incident region on a light incident side surface of the light transmitting member.   The light emitting device according to claim 1, further comprising a frame body that holds the covering member.   The light emitting device according to claim 1, comprising a plurality of the light emitting elements.   7. The cross-sectional view in the vertical direction including the light source section, the width of the light incident side surface of the light transmitting member and the surface side width of the covering member are substantially the same. Light emitting device.   The light emitting device according to claim 1, wherein a surface shape of the light transmitting member on a light emitting side has a convex curved surface.

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