JP6665143B2 - Light emitting device manufacturing method - Google Patents

Description

  The present invention relates to a light emitting device, and more particularly, to a light emitting device including a light guide member that increases luminous efficiency.

  In recent years, light emitting devices equipped with semiconductor light emitting elements such as light emitting diodes (LEDs) and laser diodes (Laser Diodes: LDs) as light sources have been used for various lighting and display devices. In particular, since these semiconductor light emitting devices have low power consumption and a long life, they are attracting attention as light sources for next-generation lighting that can be substituted for fluorescent lamps, and further improvement in light emission output and light emission efficiency is required. There is also a need for a light source with good light distribution characteristics and high luminance, such as floodlighting such as a car headlight.

  For example, in Patent Document 1, an LED chip assembly in which a phosphor chip is fixed to an LED chip with a light-transmitting adhesive is mounted on a cup portion of a lead frame or an insulating substrate, and a light scattering agent is mixed therein to protect the LED chip. A light emitting device in which the LED chip assembly is sealed with a layer or a sealing resin has been proposed.

JP-A-2002-141559 JP 2007-019096 A JP-A-2002-305328 JP-A-10-151794 JP 2009-043764 A JP 2008-300621 A JP 2008-277592 A

  However, in the light emitting device described in Patent Document 1, a light-transmitting adhesive for bonding the phosphor chip on the LED chip directly or along the side surface of the light emitting element from the phosphor chip and the cup portion of the lead frame. The light emitted from the LED chip or the phosphor chip is guided by the adhesive and is absorbed by the surface of the insulating substrate or the electrode or lead frame provided thereon. As a result, there is a problem that the light output of the light-emitting device is reduced, and a similar problem occurs with the light-transmitting resin that covers the light-emitting element or the phosphor chip and the surface of the substrate, the electrode, or the like. Further, the light path of such a light-transmitting member is small, and even if the light path is narrow, the influence on the characteristics of the light emitting device is large. Further, the LED chip and the phosphor chip of the cited document 1 merely have their opposing surfaces fixed to each other with an adhesive, and the efficiency of coupling light emitted from the LED chip to the phosphor chip is low. If the matching of the external shapes is poor, there is a concern that uneven brightness, uneven color and directivity may be deteriorated.

  The present invention has been made in view of the above problems, and an object of the present invention is to reduce the loss of light emitted from a light emitting element, increase its use efficiency, and improve the light coupling efficiency from the light emitting element to a light transmitting member. It is an object of the present invention to provide a light emitting device capable of increasing the luminous efficiency and the luminance.

The light-emitting device according to the present invention can achieve the above object by the following configurations (1) to (15).
(1) A light-transmitting member having a light-emitting surface and a light-receiving surface of a light-emitting device, a light-emitting element joined to the light-transmitting member having an emission surface facing the light-receiving surface, and the light transmission from the light-emitting element surface. A light guide member that is provided to extend to a member surface and guides outgoing light from the light emitting element to the light transmitting member, wherein the light guide member includes an emission surface of the light emitting element and the light. A first joining region in which the light receiving surfaces of the transmissive members are joined to face each other, and a first region extending from the joining region and covering one surface of the light emitting element and the light transmitting member protruding outside the joining region. And a first reflective surface for reflecting the emitted light toward the light transmitting member is provided on an outer surface of the first coated region.
(2) The light emitting device includes a covering member having a light reflecting material, and the covering member covers a surface of the light guide member and exposes the light emitting surface to cover surfaces of the light emitting element and the light transmitting member. The light emitting device according to the above (1).
(3) The light emitting device according to (1) or (2), wherein the light transmitting member is a wavelength conversion member that is excited by light emitted from the light emitting element.
(4) The first covering region covers one of the protruding surface and the other side surface of the light emitting element and the light transmitting member, and the first reflection surface is provided to face the side surface. The light emitting device according to any one of the above (1) to (3).
(5) The covering member covers the surface of the other side surface via the light guide member in the first covering region, and removes the surface of the side surface of the light emitting element or the light transmitting member exposed from the light guide member. The light-emitting device according to (4), wherein the light-emitting device is covered.
(6) A part of the light receiving surface of the light transmitting member protrudes outward from the emission surface, and the first reflection surface is an inclined surface inclined from a side surface of the light emitting element toward the light receiving surface. The light emitting device according to any one of (1) to (5).
(7) The light emitting device according to (6), wherein a light receiving surface of the light transmitting member is larger than an emission surface of the light emitting element and includes the emission surface.
(8) A part of the light emitting surface of the light emitting element protrudes outward from the light receiving surface, and the first reflecting surface is an inclined surface inclined from a side surface of the light transmitting member toward the light emitting surface. The light emitting device according to any one of (1) to (5).
(9) The light-emitting device according to (8), wherein an emission surface of the light-emitting element is larger than a light-receiving surface of the light transmitting member and includes the light-receiving surface.
(10) The plurality of light emitting elements are separated from each other and are joined to a plurality of light receiving members on the light receiving surface side, and the light guide member is configured such that a part of the light receiving surface sandwiched between the separated light emitting elements is partially separated. A second covering region extending from the joining region and covering the second covering region, and a second reflecting surface that reflects light emitted from the adjacent light emitting element toward the light receiving surface, The light emitting device according to any one of the above (1) to (9), provided on an outer surface of the light emitting device.
(11) The light-emitting device according to (10), wherein the second covering region covers side surfaces of the spaced-apart light-emitting elements facing each other.
(12) The light emitting device according to (10) or (11), wherein at least one of the plurality of light emitting elements has a different distance from the light exit surface to the light receiving surface of the light transmitting member.
(13) The light emitting element has a semiconductor layer and a substrate on the emission surface side of the semiconductor layer, and the light guide member extends to and covers a side surface of the substrate, exposing the semiconductor side surface. The light emitting device according to any one of the above (1) to (12).
(14) The light-emitting device includes a covering member that contains a light-reflective material, exposes the light-emitting surface, and covers a part of the light-emitting element and the light-transmitting member, and the first reflection surface or The light emitting device according to any one of (1) to (13), wherein the second reflection surface is provided at an interface between the light guide member and the covering member.
(15) The light emitting device according to any one of (1) to (14), wherein the first reflection surface or the second reflection surface is a convex curved surface that is convex toward the side surface.

  ADVANTAGE OF THE INVENTION According to this invention, light is efficiently taken out from a light emitting element by joining the light transmission member and the light emitting element which were arrange | positioned mutually opposing by the light guide member provided between them and the area | region extended therefrom. Thus, a light-emitting device that can guide light and optically couple to a light-transmitting member, has high luminous efficiency, and can emit light with high luminance can be provided. Further, by further covering the light transmitting member and the light emitting element joined by the light guide member with a light reflective covering member to form a light emitting device having a light emitting surface in a part of the light transmitting member, the efficiency is further improved. When the light transmitting member is a wavelength conversion member, a light emitting device capable of emitting light with high light emission characteristics and high light emission efficiency can be provided. In addition, with such a structure, the outer shape, size, and arrangement of the light emitting element and the light transmitting member are different, and a light source having a desired shape and outer size can be obtained. Therefore, a light emitting device that can be easily miniaturized is obtained. A light-emitting device whose light-emitting characteristics such as luminance can be adjusted can be obtained.

1A is a schematic top view of a light emitting device according to an embodiment of the present invention, and FIG. FIG. 2 is a schematic cross-sectional view illustrating the vicinity of a light source unit of the light emitting device according to one embodiment of the present invention. FIG. 4 is a schematic cross-sectional view illustrating the periphery of a light source unit of a light emitting device of a comparative example according to the present invention. FIG. 1 is a schematic sectional view of a light emitting device according to one embodiment of the present invention. 1A is a schematic cross-sectional view of a light emitting device according to an embodiment of the present invention, and FIG. FIG. 2 is a schematic cross-sectional view illustrating the vicinity of a light source unit of the light emitting device according to one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view for explaining the vicinity of a light source unit of the light emitting device according to one embodiment of the present invention. FIG. 1 is a schematic sectional view illustrating a light emitting device according to one embodiment of the present invention. FIG. 1 is a schematic sectional view illustrating a light emitting device according to one embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting element / device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention thereto, unless otherwise specified, and are merely illustrative examples. Only. In addition, the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of description. Further, each element constituting the present invention may be configured such that a plurality of elements are formed of the same member and one member also serves as the plurality of elements, or conversely, the function of one member may be performed by a plurality of members. It can be realized by sharing. Similarly, the embodiments described below can also be applied by appropriately combining the configurations and the like unless otherwise specified.

  As shown in FIGS. 1 and 2, the light emitting device of the present invention mainly includes a light emitting element 10, a light transmitting member 20, and a light guiding member 30. The light emitting element 10 has an emission surface, and the light transmitting member 20 has a surface 21 (light emission surface 90) exposed to the outside, a light receiving surface 22 facing the surface 21, and a side surface, respectively. The light emitting element 10 is arranged such that the light emitting surface thereof faces the light receiving surface 22 of the light transmitting member, and one of the light emitting element 10 and the light transmitting member 20 protrudes outward from the other member. The light guide member 30 can be applied with an adhesive for fixing the light emitting element 10 and the light transmitting member 20, and has a light transmitting property to transmit light from the surface of the light emitting element and the light transmitting member, specifically, from the surface of the light emitting element. It is provided extending to the surface of the member, and has a function of guiding light emitted from the light emitting element 10 to the light transmitting member 20. The light guide member 30 includes a joining region 31 joining the light emitting element and the light receiving surface 22 of the light transmitting member, which face each other, and a projecting surface extending from the joining region. And a covering region (32, 37) for covering the surface or a part of the light receiving surface 22 of the light transmitting member. The light guide member is separated from the mounting surface of the substrate, and retreats from the mounting surface of the light emitting element 10 and is located on the light transmitting member 20 side. Therefore, it is possible to prevent light emitted from the light emitting element 10 from propagating through the light guide member 30 and being guided to the substrate 50 and absorbed. A reflection surface is provided on the outer surface of the covering region to reflect light emitted from the light emitting element 10 to the light transmitting member 20 side. As described above, by the reflection of the outer surface of the light guide member 30, the diffusion of light can be suppressed, the light can be focused in the light guide member 30, and the light can be guided to the light transmission member 20. And the light emitted from the light emitting element 10 can be efficiently coupled to the light transmitting member 20, and the luminance distribution on the light emitting surface can be improved. In addition, by joining the light emitting element and the light conversion member, the luminance and chromaticity in the light emitting surface can be distributed well.

  Further, as shown in FIGS. 1, 2, 5, and 6, the covering region covers the surface of the protrusion and connects to the other side surface, and the light guide member facing the covered side surface. It is preferable that the reflection surface is provided on an outer surface of the light emitting element. By making the inclined surface connecting the surface of one protruding portion and the other side surface the outer surface, bulging to the outside of the covering region is suppressed, and the light reflected by the outer surface reaches the light transmitting member 20. By shortening the optical path length and making the outer surface a concave curved surface, it becomes a reflective surface of a convex curved surface, so that the light guiding function of the light guiding member 30 can be enhanced.

  Further, as shown in FIGS. 1 and 2, the light emitting device of the present invention further includes a light-reflective covering member 40, and covers a part of the light emitting element 10 and the light transmitting member 20 with the covering member 40. The exposed surface 21 of the light transmitting member can be used as the light emitting surface 90 of the device, and a surface emitting type light emitting device can be obtained. The covering member 40 also functions as a filler containing the light-reflective material 45 and a sealing material, so that downsizing of the light emitting device can be realized. In addition, by providing the light guide member 30 with its light reflectivity, the light guide member 30 is provided so as to cover the surface thereof, thereby assisting the light guide function and further increasing the efficiency of light coupling of the light emitted from the light emitting element 10 to the light transmitting member. it can. Further, on the surface of the light emitting element and the light transmitting member, a region covered with the light guide member and a region exposed from the region are provided, and those regions are covered with the covering member. The covering region is preferably covered by the covering member via the light guide member. Specifically, the covering member covers one side surface in the covering region via the light guide member 30 and covers the other side surface exposed from the light guide member 30. Thus, the light reflection function of the covering member enhances the light confinement effect in the light guide member 30 in the covering region, and restricts the light propagation region from the light emitting element 10 to the light transmitting member 20 in the exposed region. Thus, the light can be efficiently guided to the light transmitting member 20 by the light guiding member 30. Further, it is preferable that the reflection surface of the covering region is provided at the interface between the light guide member and the covering member, so that the function can be further enhanced. With such a configuration, it is possible to increase the utilization efficiency of light emitted from the light emitting element 10 and to realize high-luminance light emission with less color unevenness and excellent light distribution characteristics.

(Embodiment 1)
1 and 2 show a light emitting device 100 according to Embodiment 1 of the present invention. The cross section of FIG. 1A is a schematic cross-sectional view taken along line AA of FIG. FIG. 2 is a schematic sectional view around the light source section. The light emitting device 100 of the example shown in FIG. 1 is a surface emitting light emitting device having a light emitting surface 90. The light-emitting device 100 mainly includes a light-emitting element 10 having a semiconductor element structure 11 on a growth substrate 1 and a plate-like light having a light-receiving surface 22 facing the surface 21 with a light-emitting surface 90 exposed. The transmission member 20 includes a light guide member 30 for guiding light emitted from the light emitting element 10 to the light transmission member 20, and a covering member 40 containing a light reflective material 45. The light emitting element 10 is flip-chip mounted on the wiring layer 51 of the substrate 50 with the emission surface, which is the back surface of the growth substrate 1, facing the light receiving surface 22 of the light transmitting member. It is optically coupled to the light transmitting member 20. A frame 55 surrounding the light emitting element 10 and the light transmitting member 20 is provided on the substrate 50, and the inside of the frame 55 is filled with the covering member 40, and the light emitting element 10 and a part of the light transmitting member 20 are covered. It is covered by the member 40. The light emitting region of the light emitting device 100, that is, the light emission window is substantially limited to the surface 21 of the light transmitting member 20, and a surface emitting type light emitting device having the surface 21 as the light emitting surface 90 is obtained. In the light emitting device 100, the brightness and the distribution of light emitted from the surface 21, that is, the light emitting surface 90, can be controlled by the shape and size of the surface 21 of the light transmitting member 20. Further, the light emitting device has a relatively uniform luminance and chromaticity in the light emitting surface. Here, the planar shape of the light transmitting member and the light emitting element is rectangular as shown in the drawing, and the light emitting element is included in the light transmitting member in a plane.

  The light source unit will be described in detail with reference to FIG. 2. The light guide member 30 has a joining region 31 that joins the light emitting element 10 and the light transmitting member 20 so as to face each other. The light receiving surface 22 of the member is provided in a region facing the light emitting surface of the light emitting element 10. In a specific example, for example, an example described later, the thickness of the bonding region is about 0.01 μm to 100 μm. Since the light guide member 30 is interposed in the bonding region, the light emitting element and the light transmitting member are separated from each other, and the difference in the refractive index at the emission surface of the light emitting element 10 is reduced as compared with the case where a gas such as air is interposed. In addition, light can be efficiently extracted from the light emitting element 10. Therefore, light from the light emitting surface of the light emitting element 10 is transmitted into the bonding region 31 and directly optically coupled to the light receiving surface 22 of the light transmitting member.

  In the present embodiment, the light receiving surface 22 of the light transmitting member is larger than the emission surface of the light emitting element 10, and includes the light receiving surface 22, and a part of the light receiving surface 22 protrudes outside the emission surface of the light emitting element 10. In other words, the side surface of the light transmitting member 20 is located outside the side surface of the light emitting element 10, and the entire periphery thereof is provided with a protruding portion. In such a light emitting device 100, the light emitting surface 90 of the light emitting device can be used as a relatively large light emission window portion than the emission surface of the element to increase the luminous flux of emitted light. The light guide member 30 extends from the above-described bonding region 31 to cover the protruding surface of the light transmitting member and the side surface hanging down on a part of the side surface of the light emitting element 10. Specifically, this region is provided in a region protruding outside of the bonding region. Here, the light emitted from the light emitting element 10 is usually radiated not only from the emission surface but also from the side surface and the bottom surface (mounting surface side), and a part of the light is mainly emitted from the side surface of the light emitting device to the first side. And the light is guided. In other words, as in the case of the above-described bonding region, also in the first covering region 32, the difference in the refractive index of the emission surface of the light emitting element can be reduced, and the light extraction efficiency can be increased. Here, the outer surface of the first covering region 32 facing the covering member 40, that is, the outer surface of the first covering region 32 facing the side surface of the light emitting element 10 transmits light emitted from the light emitting element 10 through light transmission. It has a first reflection surface 33 that reflects the light toward the member 20, and therefore, the reflected light of the emitted light is reflected by the first reflection surface 33 toward the light receiving surface 22 of the light transmitting member 20 and is guided. Optically coupled to the light transmitting member 20. As described above, the light emitted to the side from the light emitting element 10 is once extracted into the light guide member 30 and then reflected by the first reflection surface 33, so that the light is exposed from the light guide member and the light emitting element 10 is reflected. Light loss due to absorption in the light emitting element 10 can be reduced as compared with a form in which the light is directly covered by the covering member 40, and the light is once propagated and spread in the light guide member, so that the optical coupling efficiency and the like can be reduced. Light emission characteristics can be improved.

  As described above, as shown in FIGS. 1 and 2 as in the present embodiment, the reflection function is enhanced by providing the first reflection surface 33 of the light guide member 30 at the interface with the coating member 40. Further, since the interface is composed of the translucent light-guiding member 30 and the covering member 40 containing a light-reflective material in the translucent base material, a gentle reflection interface that seeps into the covering member is provided. Become. Such a configuration is a structure that can be easily formed by filling the covering member 40 after forming the first covering region 32 in the light guide member 30 and has excellent mass productivity. Note that the first reflection surface 33 does not necessarily need to be provided at the interface with the covering member 40. For example, an outer surface of the first covering region 32 facing the covering member 40 is separated from the covering member 40, a gap is provided therebetween, and the first reflection surface 33 serves as an interface between the light guide member 30 and air. May be provided. According to this embodiment, the light guide member 30 has a high refractive index at this interface, so that a large amount of light can be reflected in the first covering region 32. Furthermore, the light component transmitted from the first covering region 32 into the gap can be reflected again on the surface of the covering member 40. In addition to this embodiment, for example, a layer made of a highly reflective metal film such as silver (Ag) or aluminum (Al), a dielectric multilayer film, or a translucent particle is provided on the outer surface of the first covering region 32. The first reflection surface 33 may be formed.

  In the light emitting device 100, the surface of the first covering region 32 facing the side surface of the light emitting element 10 is preferably an inclined surface inclined from the side surface toward the light receiving surface 22 of the light transmitting member. Thereby, the light emitted from the light emitting element 10 to the side can be favorably reflected to the light receiving surface 22 side of the light transmitting member, and the cross-sectional width increases toward the protruding surface. it can. Further, this inclined surface may be a flat surface, but by being a convex curved surface protruding toward the bonding region 31, the surface area of the first reflecting surface 33 can be increased as compared with the case where the inclined surface is a flat surface. Is preferable because the reflection efficiency of the light can be increased.

  The method for forming the first covering region 32 is not particularly limited. For example, the first covering region 32 is formed by applying a suitable amount of a resin material forming the light guide member 30 on the emission surface of the light emitting element 10 and then mounting the light transmitting member 20. can do. At this time, the light transmitting member 20 may be appropriately pressed. The application of the resin is performed by a dispensing method, a stamping method, or the like. The mounting of the light transmitting member 20 can be mass-produced by a die bonding apparatus having a collet capable of adsorbing, transporting, and pressing the light transmitting member 20.

  The resin material forming the light guide member 30 may drip directly from the protrusion of the light emitting element 10 or the light transmitting member 20 or along the side surface of the light emitting element 10 to reach the mounting substrate 50. FIG. 3 is a schematic cross-sectional view for explaining a mode in which such a light guide member 36 is provided with a hanging portion. As shown in FIG. 3, when the adhesive resin of the light guide member 36 continuously hangs down the side surface of the light emitting element 10 onto the mounting substrate 50 as shown in FIG. A path is formed. For this reason, the light emitted from the light emitting element 10 to the side or downward is guided to the mounting substrate 50 side by this hanging part, reaches the surface of the mounting substrate 50 and the wiring 51, and reduces the light loss due to absorption. Occurs. Also, the formation of the hanging portion may block the formation of the underfill 70 and the like in the region between the light emitting element 10 and the substrate 50, and may prevent the penetration of the covering member 40. Light loss occurs. In particular, if the applied amount of the resin material is too large, the light guide member 36 directly hangs down on the substrate 50 from the projecting portion of the light transmitting member 20, or separates from the above-described bonding region to crosslink the light emitting element 10 and the substrate 50. However, even in the case described above, an optical path is formed in the same manner as described above, and there is a possibility that optical loss is caused. Further, in a third embodiment described later, although it is a structure that is difficult to be formed as compared with the case where the light transmitting member protrudes as in the present embodiment, the hanging portion that reaches the mounting substrate by covering the side surface similarly is also provided. May be provided. For this reason, the amount of the resin material applied is appropriately adjusted so as not to be excessive, and is adjusted according to the area of the protruding surface and the position of the protruding portion as described later.

  Therefore, it is preferable that the outer surface of the first covering region 32 be located closer to the light transmitting member 20 than the bottom surface and the mounting surface of the light-emitting element 10. It is preferable that the distance be halfway along the side surface of the element 10. That is, as shown in FIGS. 1 and 2, on the side surface of the light emitting element 10, a region (first covering region 32) covered on the emission surface (upper side), the bottom surface, and the mounting surface with respect to the light guide member. It is desirable to provide a region exposed on the (lower) side. Further, it is preferable that this exposed region is covered with the covering member 40. More specifically, when the light emitting element 10 includes the semiconductor layer 11 having the element structure and the substrate 1 on the emission surface side of the semiconductor layer, the light guide member 30 extends to and covers the side surface of the substrate, Preferably, the side surfaces of the semiconductor layer 11 are exposed. Thereby, while the light reflectivity on the semiconductor layer 11 side including the light emitting layer is enhanced, the light transmittance on the substrate side can be enhanced. The first covering region 32 may be formed so as to extend uniformly from the bonding region 31 to the side surface of the light emitting element 10, but may be discretely and partially formed from the bonding region 31 to the side surface of the light emitting device 10. It may be formed to hang down.

  Such a mode is easily achieved by performing a surface treatment such as applying a release agent in advance to a region to be exposed from the light guide member 30 so that the region is hardly covered with the light guide member 30 or the like. As the release agent, a commercially available release agent can be used. For example, a fluorine-based release agent such as a spray-type die-free or a chemical solution type OPTOOL manufactured by Daikin can be used. In particular, it is preferable that the surface facing the emission surface of the light emitting element 10 and the mounting surface are surface-treated, and furthermore, a part of the side surface continuous therefrom, particularly the side surface of the semiconductor layer 11, that is, the exposure of the semiconductor layer 11 The surface is preferably surface-treated. In addition, the surface treatment and the covering member 40 do not have to coincide with each other, and may partially overlap or be separated from each other.

  On the other hand, in the light emitting device 100 of the example shown in FIGS. 1 and 2, it is preferable that the side surface of the light transmitting member 20 is exposed from the light guide member 30 and is further covered with a light reflective covering member 40. As described above, the bulging to the outside of the outer surface of the light guide member 30 can be suppressed as compared with the case where the light guide member 30 also covers the side surface of the light transmission member 20, and thus the optical path length to the light transmission member 20 can be shortened. And the optical coupling efficiency can be increased. Further, as described above, the first reflection surface 33 having a shape and an inclination angle suitable for light reflection on the light receiving surface 22 side can be easily formed, which is preferable.

  Next, each component and structure of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
The light-emitting device 10 can be a known device, specifically, a semiconductor light-emitting device. In particular, a GaN-based compound semiconductor is preferable because it can emit short-wavelength visible light or ultraviolet light capable of efficiently exciting a fluorescent substance. . The specific emission peak wavelength is from 240 nm to 560 nm, preferably from 380 nm to 470 nm. In addition, a light emitting element of a ZnSe-based, InGaAs-based, or AlInGaP-based semiconductor may be used.

(Light emitting element structure)
As shown in FIG. 4, the light emitting element structure 11 composed of a semiconductor layer includes at least a first conductivity type (n-type) layer 2 and a second conductivity type (p-type) layer 3, and further includes an active layer 3 therebetween. Is preferred. The electrode structure is preferably an electrode structure on the same surface side, in which both first and second conductivity type (negative) electrodes 6 and 7 are provided on one main surface side. A counter electrode structure in which electrodes are provided to face each other may be used. In the mounting form of the light emitting element 10, for example, in the above-mentioned same-surface-side electrode structure, flip-chip mounting in which the electrode forming surface is a mounting surface and the substrate 1 facing the main surface is a main output surface is performed by flip-chip mounting. 20 is preferable in terms of optical connection to In addition, mounting where the electrode forming surface side is the main emission surface and mounting a light transmitting member thereon, face-up mounting, flip chip mounting on a light transmitting member having a wiring structure, and light transmission with the above-described counter electrode structure It can be connected to the member and the mounting substrate, and is preferably mounted in an embodiment in which the light emitting element and the light transmitting member are not provided with wiring and electrodes. The growth substrate 1 of the semiconductor layer 11 may be removed if the light emitting element structure is not formed, and the semiconductor layer from which the growth substrate has been removed may be provided with a support substrate, for example, a conductive substrate or another transparent member. -The structure which bonded the board | substrate can also be used. The light-transmitting member 20 can be used for the support substrate. Alternatively, an element having a structure in which a semiconductor layer is bonded and covered with a light-transmitting member such as glass or resin and supported may be used. The removal of the growth substrate can be performed by peeling, polishing, or LLO (Laser Lift Off), for example, mounted or held on a support, an apparatus, or a submount. The light emitting element 10 can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 that face each other, the other main surface that faces the light extraction side (the emission surface side) is On the light reflection side (the lower side in FIG. 1), a light reflection structure can be provided in the semiconductor layer on the light reflection side, an electrode, or the like. As an example of the light reflection structure, a structure in which a multilayer reflection layer is provided in a semiconductor layer, or an electrode having a highly reflective metal film such as Ag or Al or a dielectric multilayer film and a reflection layer are provided on the semiconductor layer There is a structure.

(Nitride semiconductor light emitting device)
As an example of the light emitting device 10, in the nitride semiconductor light emitting device 10 of FIG. 4, an n-type semiconductor layer as a first nitride semiconductor layer 2, an active layer 3 on a C-plane sapphire substrate as a growth substrate 1. And a p-type semiconductor layer as the second nitride semiconductor layer 4 are epitaxially grown in this order. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode which is the first electrode 7, and a light-transmitting conductive layer 5 such as ITO and a second electrode are formed on almost the entire surface of the p-type layer 4. 6, a p-type pad electrode is formed. Further, the protective film 8 is provided by exposing the surfaces of the n-type and p-type pad electrodes 6 and 7 and covering the semiconductor layer. The n-type pad electrode 7 may be formed via a light-transmitting conductive layer as in the case of the p-type. In addition to the C-plane sapphire, the growth substrate 1 has an R-plane and an A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, ZnS, ZnO, GaAs. , GaN and AlN. Examples of the nitride semiconductor, the general formula _{In x Al y Ga 1-x} -y N (0 ≦ x, 0 ≦ y, x + y ≦ 1) of the other, B and P, may be mixed with As . The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or a multilayer, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue light emitting element structure 11, an n-type semiconductor layer such as a Si-doped GaN is formed on a sapphire substrate via an underlayer of a nitride semiconductor such as a buffer layer, for example, a low-temperature grown thin film GaN and a GaN layer. An n-type contact layer of GaN / InGaN and an n-type multilayer film layer of GaN / InGaN are laminated, followed by an active layer of InGaN / GaN MQW, and a p-type multilayer film layer of Mg-doped InGaN / AlGaN as a p-type semiconductor layer. And a Mg-doped GaN p-type contact layer.

(Light transmitting member)
The light emitting device 100 in FIG. 1 includes a light transmitting member 20 that transmits light from the light emitting element 10. The light transmission member 20 is preferably a light conversion member having a wavelength conversion material capable of wavelength conversion of at least a part of light passing therethrough. For example, as in the embodiment, when the primary light from the light source excites a fluorescent material as a wavelength conversion material in the light transmitting member 20, secondary light having a different wavelength from the primary light is obtained. By mixing with light, emitted light having a desired hue can be realized.

  As described above, the light transmitting member 20 of the first embodiment includes the light emitting element 10 in a plan view from the surface 21 (light emitting surface 90), and the side surface thereof is more outward than the side surface (end surface) of the light emitting device 10. The light receiving surface 22 is wider than the light emitting surface of the light emitting element 10 and is optically connected via the light guide member, so that the loss is small. The protruding length of the side surface of the light transmitting member with respect to the side surface of the light emitting element is, for example, 0.25 to 5 times the thickness of the light emitting element, and specifically 0.5 to 2 times. Less than twice. As an example, in the light emitting device of the first embodiment, the light transmitting member 20 protrudes from the terminal end with a width of about 50 μm. In addition, as shown in Embodiment 3 described later, the side surface of the light transmitting member may be located inside the side surface of the light emitting element, that is, the emission surface of the light emitting element may be protruded. The light receiving surface 22 of the light transmitting member may be smaller than the light emitting surface of the light emitting element 10. In this embodiment, the protruding length is, for example, 0.25 to 5 times the thickness of the light transmitting member, and specifically 0.5 to 2 times. By narrowing the light emitting area with respect to the light emitting element, the luminance is relatively increased, the color mixture is made uniform, and the color unevenness is reduced. In addition, if the side surface of the light transmitting member 20 is located substantially on the same plane as the side surface of the light emitting element 10, the light amount from the light emitting element 10 is insufficient at the outer edge of the light transmitting member, causing color unevenness. It can be suppressed from becoming easy.

  Here, as the translucent material serving as the base material of the light transmissive member 20, the same material as the covering member 40 described below can be used, and for example, an inorganic substance such as resin or glass can be used. Even in the case of not having a conversion function, it is preferable to use the same material as the light transmitting member for light conversion, excluding or replacing the phosphor. When the light transmitting member has a plate shape as in the embodiment, the front surface 21 and the light receiving surface 22 are both substantially flat surfaces, and furthermore, the opposing two surfaces are substantially parallel to each other. This is preferable because the efficiency of optical coupling via the light guide member of the present invention is increased and the bonding is facilitated. On the other hand, the shape is not limited to a plate shape, a shape having a curved surface as a whole or a part, a surface shape such as an uneven surface, and various shapes or forms, for example, a light-condensing shape, a shape for dispersing, for example, a lens shape or the like. Such an optical shape can also be adopted. In addition, as a wavelength conversion function, besides emitting a mixed color light of the primary light of the light emitting element and the converted light (secondary light), for example, a converted light by the ultraviolet light of the light emitting element or a mixed light by a plurality of converted lights. Alternatively, a light emitting device that mainly emits secondary light converted from primary light may be used.

The light transmitting member 20 having the wavelength conversion function is, specifically, a glass plate, a member provided with the light conversion member, or a single crystal, polycrystal, or amorphous body having the phosphor crystal of the light conversion member or a phase thereof. , Sintered body, aggregate, porous material of ceramic body, or phosphor crystal particles, and a transparent material added as appropriate, mixed with and impregnated with a transparent material such as a transparent resin Or a translucent member containing phosphor particles, for example, a molded article of translucent resin. The light transmitting member 20 is preferably made of an inorganic material rather than an organic material such as a resin from the viewpoint of heat resistance. Specifically, it is preferably made of a translucent inorganic material containing a phosphor, particularly a sintered body of the phosphor and an inorganic substance (a binder, a binder), or a sintered body or crystal of the phosphor. This increases reliability. In the case of using the YAG phosphor of the embodiment, a YAG / alumina sintered body using alumina (Al ₂ O ₃ ) as a binder, and a glass bonded together with a YAG single crystal or a high-purity sintered body are used. A sintered body as a material is preferable from the viewpoint of reliability. Further, since the light transmitting member 20 is formed in a plate shape, the coupling efficiency with the emission surface of the light emitting element 10 formed in a planar shape is good, and the light transmitting member 20 is easily positioned so that the main surface of the light transmitting member 20 is substantially parallel. Can be matched. In addition, by making the thickness of the light transmitting member 20 substantially constant, the amount of wavelength conversion of light passing therethrough is made substantially uniform, the ratio of color mixing is stabilized, and color unevenness at the light emitting surface 90 can be suppressed. Therefore, when a plurality of light emitting elements 10 are mounted on one light transmitting member 20, the distribution of luminance and chromaticity in the light emitting surface 90 due to the arrangement of the individual light emitting elements 10 is substantially uniform and high. Bright light emission can be obtained. In addition, the thickness of the light transmitting member 20 having the wavelength conversion function is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less in light emission efficiency and chromaticity adjustment.

The wavelength conversion member can emit white light by being suitably combined with a blue light emitting element. As a typical phosphor used for the wavelength conversion member, a YAG-based phosphor (yttrium aluminum alloy) attached with cerium having a garnet structure is used. garnet) and LAG-based phosphor (lutetium aluminum garnet) can be mentioned, in particular, at the time of high luminance and long-term use _{(Re 1-x Sm x)} 3 (Al 1-y Ga y) 5 O 12 : Ce (0 ≦ x <1, 0 ≦ y ≦ 1, where Re is at least one element selected from the group consisting of Y, Gd, La, and Lu) and the like. A phosphor containing at least one selected from the group consisting of YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, SCESN, SESN, CESN, CASBN, and CaAlSiN ₃ : Eu; Can be used. The wavelength conversion member can be provided, for example, between the light transmitting member and the light emitting element, in the coupling member, between the light emitting element and the covering member, in addition to the light transmitting member. The light transmitting member, the wavelength conversion member, and the sintered body can be similarly disposed in the light emitting device. It is also possible to increase the reddish component by using a nitride-based phosphor having yellow to red light emission or the like, thereby realizing lighting or a light bulb color LED having a high average color rendering index Ra. Specifically, by adjusting and including the amount of phosphors having different chromaticity points on the CIE chromaticity diagram in accordance with the emission wavelength of the light emitting element, the phosphors are connected to each other on the chromaticity diagram by the light emitting element. Can emit light at any point. In addition, a nitride phosphor, an oxynitride phosphor, and a silicate phosphor that convert near ultraviolet to visible light into a yellow to red region can be used. For _{example, L 2 SiO 4: Eu (} L represents an alkaline earth metal), in particular _{(Sr x Mae 1-x)} 2 SiO 4: Eu (Mae is Ca, Ba alkaline earth metals, etc.) and the like. Examples of nitride-based phosphors and oxynitride (oxynitride) phosphors include Sr-Ca-Si-N: Eu, Ca-Si-N: Eu, Sr-Si-N: Eu, and Sr-Ca-Si. -O-N: Eu, Ca- Si-O-N: Eu, Sr-Si-O-N: include Eu, the alkaline earth silicon nitride phosphor, the general formula _LSi 2 _O 2 _N 2: Eu , general formula _{L x Si y N (2 /} 3x + 4 / 3y): Eu or _{L x Si y O z N (} 2 / 3x + 4 / 3y-2 / 3z): Eu (L is, Sr, Ca, Sr, and Ca ).

(Coating member)
As shown in FIG. 1, the covering member 40 covers a part of the light transmitting member 20, and specifically covers at least a part of the side surface of the light transmitting member 20. In the present invention, it is preferable that the reflectance of the covering member is higher than that of the substrate and the wiring provided on the substrate, since the covering member hangs down from the element or the like to prevent formation of a light leakage path. The covering member 40 containing the light reflecting material is preferably made of a translucent resin material as the base material, and is preferably a silicone resin composition, a modified silicone resin composition, or the like. A light-transmitting insulating resin composition such as a modified epoxy resin composition or an acrylic resin composition can be used. Also, a covering member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can be used. Further, inorganic materials having excellent light resistance, such as glass and silica gel, can also be used. In addition, by molding the resin material, it can be molded into a desired shape and can cover a desired area. In the present invention, the light emitting element of the light source unit, the light guide member, the surface of the light transmitting member, and particularly the side surface thereof are covered. Can be formed. Similarly, the surface on the light emitting surface side can have a desired shape, and can have a concave or convex curved surface in addition to the flat surface shown in the figure. In the first embodiment, a silicone resin is used as a covering member from the viewpoint of heat resistance and weather resistance.

Further, the covering member 40 contains at least one kind of light reflective material 45 in the base material. By containing the light-reflective material 45, the reflectance of the covering member 40 is increased, and more preferably, by using low-absorbing particles, light absorption and loss are reduced, and the covering member having light scattering properties is provided. it can. The light-reflective material 45 contained in the covering member 40 is at least one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF. Is at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ . Since the particles of the light-reflective material are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, the material can have high reflectivity and low absorptivity, and can be used as a base material, particularly, a light-transmitting material. The difference in refractive index from the conductive resin can be increased, which is preferable. Further, the covering member 40 can be formed of a molded body made of the light-reflective material, and specifically, can be a porous material such as an aggregate obtained by aggregating the particles, a sintered body, or the like. In addition, a molded article by a sol-gel method may be used, and the refractive index difference between the light-reflective material and the air in the porous material is increased, so that the light reflectivity can be enhanced. . On the other hand, when compared with a covering member provided with a base material such as the above resin, it is possible to form into a desired shape and controllability of the covering region, and also to enhance sealing performance and airtight performance, and In this case, it is preferable to use a covering member provided with the base material. In addition, in consideration of the characteristics of both the covering members, both can be formed into a composite molded body.For example, the outer surface side of the porous molded body is impregnated with a resin, and the inner surface side of the light emitting element side is porous. The structure can be made. As described above, the covering member or the enclosure made of the covering member may communicate the internal region with the outside or may be gas-permeable, and may be in any form as long as at least light does not leak.

  In the covering member 40 containing the light-reflective material 45 in the above-described base material, since the depth at which light leaks varies depending on the concentration and density of the covering material 40, the concentration and density are appropriately adjusted according to the shape and size of the light emitting device. Adjust it. For example, when the thickness is reduced with a relatively small light emitting device, it is preferable to provide a high-concentration light-reflective material 45. On the other hand, in the preparation process of the raw material of the covering member 40 containing the light-reflective material 45, the application of the raw material, the molding, and the like, the concentration thereof is adjusted as appropriate. The same applies to the above porous body. As an example, in the case of the embodiment, it is preferable that the concentration of the light-reflective material 45 is 20% by weight or more (wt%) and the thickness thereof is 20 μm or more. The emitted light with high directivity is obtained, and the formation of an underfill by the covering member with an appropriate viscosity can be easily performed. In addition, if the concentration of the light-reflective material is increased, the heat diffusion property of the covering member can be increased.

  In the formation region of the covering member, the covering member 40 is provided on at least the side surface of the light transmitting member 20, preferably also covers the side surface of the light emitting element, and more preferably, the light emitting surface is exposed in the light source section including the light transmitting member and the light emitting element. The same applies to the case where the other parts are covered and the light guide member 30 is interposed. Thereby, it is possible to avoid light from leaking from the side surface of the light transmitting member, and to suppress light having a relatively large intensity from the side surface and having a color difference when the light conversion member is provided, thereby suppressing emission light. Directivity is improved, and luminance unevenness and color unevenness can be reduced. In addition, by covering the side surfaces of each member and element and restricting them to the light extraction direction side, directivity and luminance can be increased. Further, when the light transmitting member 20 contains a wavelength conversion material, the heat generation of the wavelength conversion material is particularly remarkable, which can be improved. As long as the side surface of the light transmitting member 20 is covered with the covering member 40 and the surface 21 is exposed, the outer surface shape is not particularly limited, and the exposed surface is smaller than the surface 21 of the light transmitting member as shown in FIG. A concave structure may be used. By protruding the light emitting surface 90, light shielding by the covering member 40 can be avoided, and the surfaces may be substantially the same, and a desired surface can be obtained. In the first embodiment, the covering member 40 also covers a part of the light receiving surface 22, and as shown in the drawing, the periphery of the light emitting element 10, specifically, the area facing the light emitting element 10 on the light receiving surface 22 of the light transmitting member. The area excluding is covered. With this configuration, as shown in FIG. 2, on the light receiving surface 22, an optical connection region (joining region 31) and a covering region covered with the light guide members (covering regions 32 and 33) are provided. . Further, in the covering region, the light that has proceeded to the light receiving surface 22 side of the light transmitting member is reflected to the light extraction side, so that light loss of primary light due to light absorption by the substrate 50 or the like can be suppressed. As shown in FIGS. 5 and 8, when a plurality of light emitting elements 10 are bonded to one light transmitting member 20, the covering member 40 is filled between the light emitting elements (the second covering region 34). It is preferable to cover the separated area of the light receiving surface 22. With this configuration, the heat radiation property of the separated area can be improved with respect to the heat of the light conversion member in the bonding area. This is also preferable in the protruding portion of the light transmitting member and the first covering area 32 as described above.

(Additional member)
In addition to the light-reflective material 45 and the light conversion member, a viscosity-enhancing agent or the like can be appropriately added to the covering member 40, whereby a desired emission color, a color of the member or the surface of the device, for example, a high contrast Thus, a light-emitting device having desired directivity characteristics, such as black color, can be obtained. Similarly, various colorants can be added as a filter material for cutting unnecessary wavelengths. The same applies to other members, and light-transmitting materials such as light-guiding members, sealing members, and light-transmitting members.

(Light guide member)
The light guide member 30 is used as an adhesive that is interposed between the light emitting element 10 and the light transmission member 20 to fix both members. The light guide member is preferably made of a material having translucency, capable of guiding light emitted from the light emitting element 10 to the light transmitting member side, and capable of optically coupling both members. Examples of the material include resin materials used for the above members, and a translucent thermosetting resin such as a silicone resin or an epoxy resin is preferable, and a silicone resin is preferable because of its excellent heat resistance and light resistance. It is preferable to use a silicone resin because the effect of the fluorine-based release agent is high. Further, a dimethyl-based silicone resin is excellent in reliability such as high-temperature resistance, and a phenyl-based silicone resin can increase the refractive index to increase the light extraction efficiency from the light emitting element 10.

(Mounting board 50)
On the other hand, in the light emitting device 100 shown in FIG. 1, the substrate 50 on which the light emitting element 10 is mounted can use a wiring 51 on which at least a surface is connected to an electrode of the element. Etc. may be provided. The material of the substrate is made of, for example, aluminum nitride (AlN), and is a single crystal, polycrystal, sintered substrate, other materials such as ceramics such as alumina, glass, a semimetal or metal substrate such as Si, and a laminate thereof. A body or a composite can be used, and metallic and ceramic are preferable because of high heat dissipation. The substrate 50 may have no wiring. For example, a configuration in which the device of FIG. 4 is mounted on the growth substrate side to wire-connect the electrode of the device to the electrode of the device, or a configuration in which wiring is provided to the light transmitting member and connected. May be. In addition to the form in which the covering member 40 is provided on the mounting board 50 as in the illustrated light emitting device, the outer side surface of the mounting board 50 may be covered. It is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is adhered on the wiring 51 by a conductive adhesive 60 and is electrically connected to the outside. As the conductive adhesive 60, solder, Ag paste, Au bump, or the like can be used.

(Frame, laminated board, base material)
The light emitting device 100 shown in FIG. 1 has a frame 55 and is a holding member for the covering member 40. The frame 55 can be formed of ceramic, resin, or the like. Alumina having high light reflectivity is preferable, but is not limited thereto if a reflective film is formed on the surface. In the case of a resin, in addition to using screen printing or the like, a molded body may be bonded to a mounting substrate. Further, it is preferable to increase the reflectance by using a light-reflective material as in the case of the covering member 40. Moreover, you may color a frame according to the objective like the said addition member. The frame can be removed after filling or molding the covering member. Further, the frame may be formed integrally with the mounting substrate of the light emitting element, such as a laminated substrate 56, a device base having a cavity structure with a base material, or the like.

(Method of manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below. First, bumps 60 are formed on the mounting substrate 50 or the light emitting element 10 and flip-chip mounted. In this example, one LED chip is arranged and mounted in a region corresponding to one light emitting device on the substrate 50 before singulation. Next, the light guide member 30 is applied to the light emitting surface of the light emitting element 10 (the back surface of the sapphire substrate or the exposed surface of the nitride semiconductor when the substrate is removed by LLO), and the light transmitting member 20 is laminated. The resin 30 is thermoset and joined. Next, the resin constituting the covering member 40 is potted by a dispenser (liquid metering device) so as to cover the side surface of the light transmitting member 20 in the frame 55 standing upright around the light emitting element 10. I do. The dropped resin 40 crawls and covers the side surfaces of the light emitting element 10 and the light transmitting member 20 due to surface tension, and forms an inclined surface that becomes lower from the surface 21 toward the frame 55. Further, the exposed surface of the resin 40 may be flattened so as to be substantially flush with the surface 21. Then, after the resin 40 is cured, dicing is performed at a predetermined position and cut out to a desired size to obtain the light emitting device 100.

(Embodiment 2)
FIG. 5A is a schematic cross-sectional view of a light emitting device 200 according to Embodiment 2 of the present invention, and FIG. 5B is a schematic cross-sectional view for explaining the periphery of the light source unit. In the light emitting device 200, other configurations except for the number of the light emitting elements 10 and the structure of the light guide member 30 are substantially the same as those in the above-described first embodiment, and thus, the same configurations are denoted by the same reference numerals. The description will be appropriately omitted.

  In the light emitting device of the present invention, the number of light emitting elements 10 bonded to one light transmitting member 20 is not particularly limited. By using a plurality of light-emitting elements 10 as compared with the single light-emitting element of Embodiment 1, depending on the size and shape of the light-transmitting member and the light-emitting surface, and in order to obtain desired light-emitting characteristics, a plurality of light-emitting elements are used. They can be arranged as appropriate and can be driven individually, which is preferable because a light emitting surface having a desired shape and light emitting characteristics can be obtained. When a plurality of light-emitting elements 10 are mounted, they are provided at an appropriate distance from each other, and this separation distance is appropriately determined in consideration of the light distribution characteristics, heat dissipation, and mounting accuracy of the light-emitting elements. For example, within 10% of the dimensions of the light emitting element. In addition, the plurality of light emitting elements 10 may be connected to each other. Further, in the present embodiment, the two are arranged in a row. However, the present invention is not limited to this, and various arrangements such as a lattice arrangement and a regular or irregular arrangement are possible. It is desirable to arrange the spaces at substantially equal intervals to reduce the intensity distribution.

  In the light emitting device 200, a plurality of (two in the figure) light emitting elements 10 are mounted on a mounting substrate 50 so as to be separated from each other, and a light having a light receiving surface 22 large enough to include the plurality of light emitting elements 10 is provided. The transmissive member 20 is joined thereon via a light guide member 30. In this light-emitting device 200, the frame is laminated on the substrate 50 to form a base 56 having a cavity structure, and is connected to the wiring layer 51 for the mounting element on the upper surface side and electrically connected to the wiring layer 51 for external connection. Wiring layer 52 is also provided on the lower surface side of the base 56.

  In such a light emitting device 200, the bonding regions 31 are provided in regions facing the light receiving surface 22 of the light transmitting member and the emission surfaces of the light emitting elements 10, respectively. The above-mentioned first covering region 32 is a light-emitting element 10 that is disposed outside the light-receiving surface among the plurality of light-emitting elements, and is provided on a side surface facing the outside. The portion is covered as a protruding surface, and a first reflecting surface 33 is provided on the outer surface thereof, and the light emitted to the side from the light emitting element 10 is reflected to the light receiving surface 22 side of the light transmitting member to guide the light. be able to. Further, in this example, although not shown, a plurality of light emitting elements are arranged at one end of the light receiving surface, and a first covering region and a first reflecting surface are provided on the side surface on the end side, respectively. May be separated for each element. Preferably, they are joined to each other, and the one first covering region and the first reflecting surface may be common, and may be arranged close enough to the extent that they are formed. At this time, the first covering region may be provided with a recess between the elements.

  When a plurality of light emitting elements 10 are joined to the light receiving surface 22 side of one light transmitting member 20, the light guide member 30 also hangs down in a separation region sandwiched between adjacent light emitting elements, that is, adjacent light emitting elements. A second covering region extends from the bonding region and covers a part of the side surface of the element that faces each other and a part of the light receiving surface sandwiched between the elements. The second covering region 34 is usually provided so as to connect mutually facing side surfaces of the adjacent light emitting elements 10. The outer surface of the second covering region 34 is also located closer to the light transmitting member 20 than the mounting surface of the light emitting element 10, that is, by separating the light guide member from the mounting substrate, the To prevent light from leaking and being absorbed. Further, a second reflection surface 35 that reflects light emitted from the light emitting element 10 toward the light receiving surface 22 is provided on an outer surface of the second covering region 34. As described above, in the light emitting device in which the plurality of light emitting elements 10 are mounted on the light receiving surface 22 of one light transmitting member 20, the second reflecting surface 35 of the light guide member 30 causes the plurality of light emitting elements 10 to be laterally located. The light emitted to the separated area is taken out favorably, reflected on the light receiving surface 22 side of the light transmitting member, and optically coupled to the light transmitting member 20. Further, it is preferable that second reflecting surface 35 also has the same inclined surface as the first reflecting surface in light emitting device 100 of the first embodiment. In particular, as shown in the figure, it is preferable that one convex curved surface be provided between the elements because the emitted light from each element can be suitably reflected in the separated area and mixed with each other.

  In addition, it is preferable that the second reflection surface 35 be provided at a distance from the light receiving surface 22 of the light transmitting member to be farther than each emission surface of the light emitting element 10. Accordingly, as shown in FIG. 8 (Embodiment 5), when the reflecting surface 35 or the protruding end of the convex curved surface is provided closer to the light receiving surface than the emitting surface, the light emitting device is provided between the emitting surface and the light receiving surface. In comparison, the light emitted from each light emitting element 10 can be diffused and guided in a wide range, and the reduction of the luminous flux in the separated area can be reduced. Therefore, the luminance unevenness caused by the arrangement of each light emitting element 10 and its light distribution. In addition, chromaticity unevenness can be reduced, and the luminance in the light emitting surface can be made uniform. On the other hand, in the former case as shown in FIG. 8, the respective light emitting elements are easily separated and the luminance unevenness is increased, but the light extraction efficiency can be increased, which is preferable when the light emitting elements are used.

  In addition, at least one set of the plurality of light emitting elements 10 has a different emission surface height due to mounting deviation or the like, and the distance from the emission surface of each light emitting element to the light receiving surface 22 of the light transmitting member is different from each other. It is preferable to interpose a light guide member. Thereby, light incidence from one light emitting element 10 to the adjacent light emitting element 10 can be reduced, and loss of a light beam due to light absorption in the light emitting element 10 can be suppressed. Such a configuration can be adjusted by the thickness of the conductive adhesive 60 for bonding the light emitting element 10 to the mounting substrate 50 and the like.

  Like the first reflection surface, the second reflection surface 35 is preferably provided at the interface between the light guide member 30 and the covering member 40 sandwiched between the adjacent light emitting elements 10. Since the metal substrate such as a wiring is not formed on the mounting substrate 50 and the surface of the substrate is often exposed in the separated region sandwiched between the adjacent light emitting elements, light absorption easily occurs. Is preferably covered with a covering member, and more preferably, the covering member 40 is filled, and the second reflection surface 35 is provided at an interface with the covering member 40. Further, as described above, a form in which a gap is provided between the covering member 40 filled in the separation region and the second reflection surface 35 may be employed.

(Embodiment 3)
FIG. 6 is a schematic cross-sectional view illustrating the periphery of the light source unit of the light emitting device according to Embodiment 3 of the present invention. In this light emitting device, the relationship between the size of the light emitting element 10 and the light transmitting member 20 and the other configuration except for the structure of the light guide member 30 are the same as those of the above-described first embodiment. Are denoted by the same reference numerals, and description thereof will be appropriately omitted. In the light emitting device of the example shown in FIG. 6, the light receiving surface 22 of the light transmitting member is smaller than the light emitting surface of the light emitting element 10, and a part of the light emitting surface protrudes outside the light receiving surface 22. In other words, the side surface of the light transmitting member 20 is located inside the side surface of the light emitting element 10. In such a light emitting device, the luminance of emitted light can be increased by using the light emitting surface 90 of the light emitting device as a relatively small light emission window. That is, unlike Embodiments 1 and 2 described above, the light guide member extends to the projecting surface of the light emitting element and the side surface of the light transmitting member provided inside the projecting end, and the area is reduced. Coated.

  In the light emitting device of the present embodiment, the light guide member 30 has a joining region 31 that joins a region of the light emitting element 10 facing the light transmitting member and the light receiving surface 22 of the light transmitting member. Further, the light guide member 30 has a first covering region 32 extending from the joining region 31, climbing up to the side surface of the light transmitting member 20, and covering the side surface of the light transmitting member 20. The first covering region 32 that covers the side surface of the light transmitting member 20 reflects and condenses the light emitted from the light emitting element 10, and particularly reflects the light at the end thereof and guides the light toward the light transmitting member 20. Can light. Further, since the outer surface of the first covering region 32 is also located closer to the light transmitting member 20 than the mounting surface of the light emitting element 10, light can be prevented from leaking to the mounting substrate 50. Here, the outer surface of the first covering region 32 facing the covering member 40 side, that is, the outer surface of the first covering region 32 facing the side surface of the light transmitting member is configured to transmit the light emitted from the light emitting element 10 to the light transmitting member. It has a first reflection surface 33 that reflects light toward the 20 side. Therefore, the light transmitted through the first covering region 32 is reflected by the first reflecting surface 33 toward the light transmitting member 20, and the reflected light is optically coupled to the light transmitting member 20, and the light is transmitted from the light emitting surface 90 to the device. Released to the outside. As described above, by efficiently coupling the light emitted from the light emitting element 10 to the light receiving surface 22 side of the light transmitting member to the light transmitting member, it is possible to increase the utilization efficiency of the light emitted from the light emitting element 10. it can.

  The first reflecting surface 33 in the light emitting device of the present embodiment can also have the same interface configuration as the first reflecting surface 33 in the light emitting devices 100 of the first and second embodiments. It is preferably provided at the interface with the covering member 40. Further, the outer surface of the first covering region 32 facing the side surface of the light transmitting member 20 is an inclined surface inclined from the side surface to the emission surface side of the light emitting element 10. It becomes an inclined surface, which is preferable because it can be reflected well on the light transmitting member 20 side. Further, the inclined surface may be a flat surface, but as described above, the surface of the first reflecting surface 33 can be increased by being a convex curved surface protruding toward the bonding region 31, thereby increasing the light reflection efficiency. It is preferable because it can be used.

  On the other hand, in the light emitting device of the example shown in FIG. 6, it is preferable that the side surface of the light emitting element 10 is exposed from the light guide member 30 and is covered with the light reflective covering member 40. As described above, the outer surface of the light guide member 30 is provided so as to connect the emission surface of the light emitting element 10 and the side surface of the light transmission member 20, so that the light guide member 30 also covers the side surface of the light emitting element 10. As compared with the case, the outward bulging of the outer surface of the light guide member 30 can be suppressed. Therefore, the optical path length of the light reflected by the outer surface of the light guide member 30 to the light transmission member 20 can be shortened, the light absorption in the light guide member 30 is reduced, and the light transmitted to the light transmission member 20 is reduced. The coupling efficiency can be increased. Further, the first reflecting surface 33 having a shape and an inclination angle suitable for reflecting light toward the light transmitting member 20 can be easily formed, and the reflection efficiency of the first reflecting surface 33 can be increased.

(Embodiment 4)
FIG. 7 is a schematic cross-sectional view illustrating the periphery of the light source unit of the light emitting device according to Embodiment 4 of the present invention. In the example shown in FIG. 7, the configuration of the light guide member 30 and other configurations except for the shape of the surface 21 of the light transmission member are substantially the same as those of the above-described first embodiment. The same reference numerals are given and the description will be appropriately omitted. In the light emitting device of the example shown in FIG. 7, the light receiving surface 22 of the light transmitting member is larger than the emission surface of the light emitting element 10, and a part of the light receiving surface 22 projects outside the emission surface of the light emitting element 10. The light guide member 30 has a joining region 31 for joining the light receiving surface 22 of the light transmitting member facing the light emitting element and the emitting surface of the light emitting device 10, and extends from the joining region 31. And a third covering region 37 having an outer surface on the side closer to the light transmitting member 20 than the mounting surface of the light emitting element 10. The side surface of the light emitting element 10 and the side surface of the light transmitting member 20 are exposed from the light guide member 30. The outer surface of the third covering region 37 has a third reflecting surface 38 that reflects light emitted from the light emitting element 10 toward the light receiving surface 22 of the light transmitting member 20. Here, the third covering region and the third reflecting surface are respectively forms of the first covering region and the first reflecting surface described above.

  The outer surface of the third covering region 37 is preferably an inclined surface inclined from the end of the emission surface of the light emitting element 10 to the light receiving surface 22 side of the protruding portion of the light transmitting member 20. As a result, the third reflecting surface 38 becomes an inclined surface inclined from the end of the light emitting surface of the light emitting element 10 to the light receiving surface 22 side of the protruding portion of the light transmitting member 20, and the light emitted from the light emitting element 10 and the light transmitting member The reflected light and emitted light can be favorably reflected on the light receiving surface 22 side of the light transmitting member. Further, the inclined surface may be a flat surface, but by being a convex curved surface protruding toward the bonding region 31, the surface area of the third reflecting surface 38 can be increased as compared with the case where the inclined surface is a flat surface. Is preferable because the reflection efficiency of the light can be increased. The third reflecting surface 38 is preferably provided at the interface with the covering member 40, like the first reflecting surface 33 of the first embodiment, but the third reflecting surface 38 is separated from the covering member 40 by a gap. It may be formed by providing a metal film or a dielectric multilayer film.

  By joining the light emitting element 10 and the light transmitting member 20 with such a light guide member 30, the light emitting element is compared with a case where the light emitting element 10 and the light transmitting member 20 are joined only at the joining region 31. The ten outgoing lights can be suitably coupled, and the luminance and chromaticity distribution in the light emitting surface can be made uniform. Since the light guide function of the light guide member 30 depends on the length of the side surface of the light emitting element 10 protruding from the side surface of the light transmission member 20, the light guide member 30 may have the above-described range, for example. Such a covering form of the light guide member 30 can be achieved by appropriately adjusting the amount, the projecting width, and the surface area of the light guide member. Can be achieved by preventing the light guide member 30 from hanging down on the side surface of the light guide member 30. A release agent may be applied to the side surface of the light transmitting member 20, and it can be manufactured with high accuracy. In this example, since the side surface of the light emitting element is exposed, the side surface is not covered as in the first and second embodiments, so that the return light and the converted light are prevented from re-entering the element by the light guide member. That is, the contact area between the light guide member and the light emitting element can be minimized, and the coupling efficiency can be increased. Further, in the example shown in FIG. 7, the surface 23 of the light transmitting member has an uneven surface, and the light transmitted through the light transmitting member 20 is scattered by the unevenness to improve the light extraction efficiency from the light transmitting member 20. In addition, it is possible to reduce uneven brightness and color and achieve uniform light distribution. In particular, it is preferable to mount a plurality of light emitting elements 10 because uneven brightness and uneven color due to the light emitting elements 10 are reduced. Such irregularities can be formed on the surface of the light transmitting member by polishing, dry etching, wet etching, or the like, so that irregular irregular structures as well as irregular structures having a regular pattern can be formed. In addition, such a concavo-convex structure can be provided not only on the surface of the light transmitting member but also on the light receiving surface, and further on the surface of each member on the optical path, to achieve the same effect. It may be provided on the surface of a member in contact therewith, for example, on the surface of the substrate 1 on the semiconductor layer 11 side, and such a structure is used although not described in detail in the embodiments.

(Modification)
In the first to fourth embodiments, the case where one of the light emitting element and the light transmitting member is mainly included in the other, that is, inside the other is described. However, the light emission in the light emitting device of the present invention is described. The relationship between the element and the light transmitting member is not limited to this mode, and it suffices that one of the elements has at least partially a protruding portion that protrudes outward from the other. For example, one of the side surfaces constituting the light emitting element, or a part of one side surface, protrudes outward from the side surface constituting the light transmitting member, and the other side surfaces are substantially flush with each other, or The form in which the member protrudes may be used, and the reverse form may be used. In such a form, the first covering region is provided on one protruding side surface or a part of the side surface. Further, in a top view, a form in which protruding portions are provided on both sides of one of the light emitting element and the light transmitting member may be employed. In such a case, at least one of the first covering regions 32 described in the first and second embodiments is provided in a cross section of the region having the protruding portion. In the case where there are a plurality of light emitting elements, the light emitting elements and the light transmitting members may be provided with the first covering region, and may be mixed. Preferably, it is preferable that the first covering region is provided on one of the two sides, that is, any one of the first and third embodiments in terms of the function of the light guide member. May be mixed. More preferably, the first covering region is unified in any form between the light-emitting element and the entire outer periphery of the light transmitting member. This is because unevenness in luminance and chromaticity in the light emitting surface can be reduced, and it is most preferable that one of the side surfaces of the light emitting element and the light transmitting member is included inside the other.

  As described above, the light guide member according to the present invention is provided on the surface of the light emitting element and the light transmitting member, and is provided between the light emitting element and the light transmitting member, and optically couples the two, thereby forming a composite light source. Between them, the joint area they oppose, one protruding surface, or the other end face provided inside it and its end, the first covering area extending and covering from the joint area, Is provided. The light guide member is specifically made of a resin material, and is also used as an adhesive. As described above, by providing the protruding surface, the wet region spreads from the bonding region to the surface, and also from the protruding surface. Further, it may be wet and spread to the side surface serving as the other end. As described above, since the light guide member utilizes the wetting of the resin on each surface before the resin is cured, specifically, before the resin is cured, first, the amount of the material, the method of applying the material, and the protrusion surface The width and area of the protrusion can be controlled, and in addition, the spread to other regions can be controlled by using a release agent. Therefore, as a specific form of the light guide member, it is preferable that the thickness in the joining region is smaller than that of the light transmitting member and further smaller than that of the growth substrate to reduce the size of the composite light source and increase the coupling efficiency. In addition, the projection width at that time is about 0.25 to 5 times the thickness of the light emitting element or the light transmitting member, so that it is easy to control at the time of manufacturing, and the diffusion of light from a suitable element, Light can be collected. As described above, as shown in Embodiments 1 and 3, when the other end is covered from one protrusion, the end on the protrusion side is preferably exposed. In comparison, the spread of the light source can be suppressed, and the characteristics of the present invention can be improved, which is preferable. In the case of coating, if the thickness is thinner than that of the other end, the influence can be reduced, and the same effect as a coating member described later can be expected, which is preferable.

  Further, as described above, it is preferable that the covering area of the protruding surface is thinner than the bonding area as shown in FIG. 7. Can be expected. As seen in the first and third embodiments, various characteristics are affected by the covering region on the side surface of the element. However, when the light-transmitting substrate 1 of a different material from the semiconductor layer 11 is provided, the substrate is Covering is preferable because the function of the light guide member can be assisted as a light propagation region between the light transmission member and the element, similarly to the light guide member. In particular, in the case of a light conversion member, the component of the converted light is also included in the region, which is effective in uneven chromaticity and orientation. In the element from which the substrate 1 has been removed, the light component from the emission surface is much larger than that of the side surface, so that the element side surface may be exposed. As described above, the presence of the covering member can assist the function of the light guide member in confining the light to the composite light source, emitting the light from the light emitting surface, and coupling the same, but the reflection such as the metal film or the dielectric multilayer film Membrane can be substituted. In the case of having a light reflecting material as in the embodiment, since the light seeps into the base material, the light of the light source spreads more than the inside of the coating, thereby increasing the efficiency of light diffusion and light collection. It is preferable because it enhances the light emission characteristics, brightness unevenness, and directivity, and particularly synergistically contributes to the function of the light guide member. Also, in the case of the light conversion member, it is preferable that it contributes to the color unevenness and the orientation, and furthermore, its side surface is covered, so that the surface 21 differs in color and wavelength component ratio, and is relatively high. Light emission is preferably suppressed.

  Further, the member having the protruding portion of the light emitting element 10 and the light transmitting members 20 and 24 may not have a clear boundary between the surface facing the other member and the side surface continuing from the surface. . For example, in the light emitting device 100 of the first embodiment, the light receiving surface 22 and the side surface of the light transmitting member 20 may be integrally formed to be one curved surface, for example, a spherical surface or a part thereof. Furthermore, when the light receiving surface 22 of the light transmitting member and the emission surface of the light emitting element 10 are directly joined by crystal bonding by thermocompression bonding or the like, the projection has a first covering region, and a plurality of light emitting elements are provided. The light guide member 30 having the second covering region between the elements can also be formed.

(Embodiment 5)
FIG. 8 is a schematic cross-sectional view of a light emitting device 300 according to Embodiment 5 of the present invention. In the light emitting device 300, the same reference numerals are given to configurations substantially similar to those of Embodiments 1 to 4 described above. The description will be appropriately omitted. The example shown in FIG. 8 is a surface-emitting type light source in which the light-emitting element 10 and the light-transmitting member 20 are covered with a covering member 40 containing a light-reflective material 45 and the surface 21 of the light-transmitting member 20 is used as a light-emitting surface. The sealing member 80 is formed, covers the light source, and further covers a part of the covering member to form a hemispherical optical lens. In the light emitting device 300, a plurality of (two in the figure) light emitting elements 10 are flip-chip mounted on a wiring pattern 51 on the upper surface side of a mounting substrate 50, and one light transmitting member 20 is provided thereon with a light guide member. They are joined by a member 30. Note that, in this example, the frame body seen in Embodiment 1 is removed after molding the covering member 40, and the side surface of the covering member 40 is exposed to the outside to constitute the outer surface of the light emitting device. The width of the cross section of the light receiving surface 22 of the light transmitting member is smaller than the distance between the outer side surfaces of the light emitting element 10 located at the outermost side, in other words, smaller than the width of the region where the plurality of light emitting elements are provided. In addition, the side surface of the light emitting element 10 located at the outermost protrudes outside the side surface of the light transmitting member 20. The light guide member 30 has a second covering region and a second reflection surface 35 similar to those of the second embodiment in the separated region sandwiched between the adjacent light emitting elements. A first covering region and a first reflecting surface 33 similar to those in Embodiment 3 are provided in a region connecting the light-emitting element 10 and the projection on the light-emitting element 10 located at the outermost periphery.

  According to such a configuration of the light emitting device 300, the light emitted from the light emitting element 10 is transmitted through the first and second covering regions of the light guide member 30 and the first and second reflecting surfaces 33 and 35. Light can be efficiently coupled to the member 20 and light can be efficiently extracted from the light transmitting member 20 to the sealing member 80, so that a light emitting device with higher output can be obtained. Although the emitted light is exaggerated or changed by the optical lens 80 due to the light distribution characteristics on the surface 21 of the light transmitting member, the light guide member 30 of the present invention can make the brightness and chromaticity unevenness of the light uniform. Therefore, a light emitting device having excellent light distribution characteristics can be obtained. Further, the sealing member 80 continuously covers the surface 21 of the light transmitting member and a part of the surface of the covering member 40, and reflects the light of the sealing member 80 on the surface of the covering member 40 to the outside. The light can be efficiently extracted, and the light emission side surface of the covering member 40 is formed as a concave surface inclined from the side surface of the light transmitting member 20 toward the substrate 50, whereby light is diffused, and emission light of the light emitting device can be widely oriented. As described above, in the light emitting device of the present invention, the optical member can be bonded to the surface of the light transmitting member on the light emitting surface to obtain desired light emitting characteristics.

(Sealing member)
Here, if the sealing member 80 has a lower refractive index than the light transmitting member, it can be joined to the surface 21 to improve the light extraction efficiency. The light emitting side surface of the sealing member 80 can be formed in various shapes according to the purpose. For example, as shown in FIG. 8, by forming the surface on the light emission side into a spherical (hemispherical) lens shape and a convex curved surface, light emission from the light transmitting member can be efficiently extracted to the outside. The present invention is not limited to this. Various optical elements and optical members having a desired shape may be formed, a concave lens shape, a parabolic curved surface, a flat convex end may be formed, and light may be scattered as an uneven surface.

The sealing member 80 is made of, for example, a resin such as an epoxy resin, a silicone resin, a modified silicone resin, a urea resin, a urethane resin, an acrylic resin, a polycarbonate resin, and a polyimide resin, like the base material and the light guide member of the covering member 30 described above. It can be formed using a material. In addition, since the sealing member 80 also serves as a sealing material for protecting the light emitting element 10 and the light transmitting member 20, a material having excellent weather resistance, heat resistance, and hardness is preferable, and among the above, epoxy resin or Hard silicone resins are preferred. In addition, glass may be used. Further, the above-described phosphor and / or light scattering particles such as TiO ₂ and / or a filler such as quartz glass can be appropriately added to the sealing member 80. The sealing member 80 is formed by compression molding, transfer molding, or the like.

(Embodiment 6)
FIG. 9 is a schematic cross-sectional view of a light emitting device 400 according to Embodiment 6 of the present invention. Components substantially similar to those of Embodiments 1 and 2 are denoted by the same reference numerals, and description thereof is omitted as appropriate. I do. In the light emitting device 400 of the example shown in FIG. 9, the light emitting element 10 is flip-chip mounted at substantially the center of the bottom of a mounting base (package) 56 having a concave portion. The mounting portion is a part of the mounting base 56, but may be a submount. The light transmitting member 24 is mounted on and bonded to the light emitting element 10 via the light guiding member 30. Then, the concave portion is filled with the sealing member 84, and the concave portion is closed by the light conversion member 81 having a surface to be the light emitting surface 82 of the light emitting device 400. The light transmitting member 24 and the light converting member 81 can have the same configurations as those in the case where the above-described light transmitting member and the above-described light transmitting member 20 contain a wavelength conversion material, respectively. , For example, a transparent resin. In particular, in this example, the light transmitting member 24 may not include a wavelength conversion material, and may be an optical element capable of condensing and diffusing light in addition to a plate shape as illustrated, or may be mixed with a light scattering material. Further, a reflective film having a concave curved surface is provided so as to cover the inner surface of the concave portion from the inner surface of the convex portion of the mounting portion, so that the light can be reflected and condensed toward each of the members 24 and 84. Here, this reflection film is formed by the covering member 41 containing the light-reflective material 46 and has a concave curved reflection surface due to the above-mentioned resin crawling. The covering member 41 may be formed by forming a highly reflective metal film such as Ag or Al on the surface of the covering member 41 instead of the covering member 41, or by providing a light conversion member containing a phosphor as described above. Alternatively, a configuration in which no covering member is provided and the inner surface of the mounting substrate is used as a reflecting surface as in the related art may be used. Further, in the concave portion, the light converting member may be contained in the sealing member 84, and the light converting member may be airtightly sealed, and the member 81 may be a member that does not contain the light converting member like the member 24. . That is, a light-emitting device including converted light can be obtained by providing a light conversion member on any of the members 24, 41, 81, and 84, and a light-emitting device that extracts light emitted from a light-emitting element without being included in any of them can also be obtained.

  Also in such a light emitting device 400, the light guide member 30 has the above-described bonding region 31, the first covering region, and the first reflection surface 33, as in Embodiment 2, and the inside of the recess is sealed. Since it is filled with the member 84, the outer surface of the first covering region forms an interface with the translucent sealing member, and the first reflection surface 33 is provided at the interface. That is, when a refractive index difference is provided between the light guide member and the sealing member, the interface reflection thereof can be used, and when the first coating region side has a high refractive index, the reflectance can be increased, which is preferable. The same is true. Light is diffused and emitted in all directions from the light emitting element 10, and a part of the light component is reflected by the inner surface of the first reflecting surface 33 toward the light receiving surface 26 of the light transmitting member 24, and the light component is reflected. The light is emitted from the light emitting surface 25, a part of the light is reflected by the concave portion, and the light can be extracted from the light transmitting member 81. Therefore, the light of the light emitting element 10 is condensed by the light transmitting member 24 and emitted from the surface 25 to increase the luminance of the light emitting surface 82 in the front direction, suppress the diffusion of light in the recess, and reduce the light absorption. be able to. The same applies to the second reflection surface 35 and the second covering area thereof.

  Furthermore, in the case of Embodiment 4 in which the light emitting element 10 is not covered with the light-reflective covering member 40, the coverage of the first and second covering regions provided on the side surfaces of the light emitting element 10 is Similar to the first embodiment or wider than the first embodiment is preferable. If the area covered by the light guide member 30 on the side surface of the light emitting element 10 is wide, the light extraction efficiency from the light emitting element 10 into the light guide member 30 can be increased, and the surface area of the first and second reflecting surfaces 33 and 35 can be further reduced. The coupling efficiency of light to the light transmitting member 20 can be increased. However, as described above, in order to avoid light loss due to light absorption in the mounting base 56, the light guide member 30 has an outer surface located closer to the light transmitting member 20 than the mounting surface of the light emitting element 10, It is preferable to be separated from the surface of the mounting base 56.

  Hereinafter, examples according to the present invention will be described in detail. It is needless to say that the present invention is not limited to only the examples described below.

(Example 1)
As shown in FIG. 5, the light source unit of the light emitting device according to the first embodiment has a substantially square LED chip (approximately 1 mm × 1 mm) as a light emitting element 10 on a wiring 51 of a ceramic substrate 50 made of AlN. In this structure, two light emitting wavelengths (455 nm) are flip-chip mounted in a structure in which the semiconductors 11 are stacked, and YAG and alumina (Al ₂ O ₃ ) are sintered thereon as a light transmitting member 20 as a plate-shaped light converting member. The outer shape of the body, the front surface 21 and the light receiving surface 22 is a substantially rectangular shape having a size of about 1.1 mm × 2.2 mm, and a thickness of about 150 μm is placed thereon and joined to each other by the light guide member 30. At this time, an appropriate amount of the silicone resin to be the light guide member 30 is applied on the emission surface (the back surface of the substrate 1) of each LED with tweezers, and the light transmitting member 20 is mounted thereon with tweezers. The resin is thermally cured in an oven at 150 ° C. for 60 minutes, and adhered so that the two LEDs are included in the light receiving surface of the light transmitting member as shown. In this manner, the light guide member 30 covers the bonding region 31 between the LED and the light transmitting member, the first covering region 32 covering the outer side surface of the LED light source, and the inner side surface between the LEDs. The second covering region 34 is formed, and at this time, the light guide member is formed on the side surface of the LED and on a part or substantially all of the semiconductor layer 11. Then, as shown in FIG. 1, the LED is mounted on the wiring 51 of the substrate 50, and the recess inside the frame surrounding the light emitting element 10 and the light transmitting member 20 is filled with the covering member 40, and the light transmitting member is filled. In a state where the surface 21 of the light emitting element 20 is exposed as a light emitting surface, the light emitting element 10 and the light transmitting member 20 are covered with the covering member 40, and the frame is removed as shown in FIG. Here, the covering member 40 is a silicone resin containing a light reflective material 45 which is TiO ₂ fine particles having a particle size of about 270 nm at a concentration of about 23% by weight. When driven at a current of 350 mA, the light emitting device of Example 1 has a light flux of about 167 [lm] (chromaticity y value of about 0.339), a maximum luminance of 6086 [cd / cm ² ], and an average luminance of 3524 [cd / cm]. ² ], a light beam having a high luminous flux and a high luminance can be obtained.

(Example 2)
As shown in FIG. 6, the light emitting device according to the second embodiment has a configuration in which the light receiving surface of one light transmitting member is included in the emission surface of one light emitting element. One LED chip 10 having a substantially rectangular shape of about 1 mm × 6.5 mm provided with six element structures on a substrate, and the light transmitting member 20 having a substantially rectangular shape of about 0.8 mm × 6.3 mm, A light emitting device is manufactured in the same manner as in the first embodiment. When the light transmitting member 20 is placed, the light guiding member 30 is lightly pressed to crawl up a part of the side surface of the light transmitting member 20 to form the first covering region 32. When driven at a current of 700 mA, the light emitting device of the second embodiment has a light flux of about 740 [lm] (chromaticity y value of about 0.280), a maximum luminance of 4629 [cd / cm ² ], and an average luminance of 4123 [cd / cm]. ² ], a light beam having a high luminous flux and a high luminance can be obtained.

  INDUSTRIAL APPLICABILITY The light emitting device of the present invention can be suitably used for a light source for illumination, a backlight light source such as an LED display, a liquid crystal display device, a traffic light, an illuminated switch, various sensors and various indicators.

DESCRIPTION OF SYMBOLS 10 ... Light-emitting element (1 ... Growth substrate, 2 ... First conductivity type (n-type) semiconductor layer, 3 ... Active layer, 4 ... Second conductivity type (p-type) semiconductor layer, 5 ... Translucent conductive layer, 6 ... second electrode (p-side pad electrode), 7 ... first electrode (n-side pad electrode), 8 ... protective film, 11 ... element structure)
20, 24: light transmitting member (21, 23, 25: surface, 22, 26: light receiving surface)
30 light guide member (31 joining region, 32 first covering region, 33 first reflecting surface, 34 second covering region, 35 second reflecting surface, 37 third covering region , 38: third reflecting surface), 40, 41: covering member, 45, 46: light-reflective material 50: mounting substrate (51, 52: wiring, 55: frame, 56: laminated substrate or base material), 60 ... conductive adhesive

Claims (10)

Mounting a light emitting element on a substrate,
A step of applying a resin material for forming a light guide member on an emission surface facing the mounting surface of the light emitting element,
Preparing a plate-shaped light transmitting member having a light emitting surface and a light receiving surface of a light emitting device, arranging a light receiving surface of the light transmitting member via the resin material so as to face an emission surface of the light emitting element,
By pressing the light transmitting member, the light emitting element protruding outward from the bonding area from the bonding area where the resin material before curing is bonded to the light emitting element and the light transmitting member while facing each other. The light-exiting surface and the light-receiving member of the light-transmitting member are extended while extending away from the mounting surface of the substrate to one end of the protruding surface and the other side of the light-receiving member, so that the outer surface has a covered area having a concave curved surface. Forming the light guide member separated from the mounting surface of the substrate after the resin material is formed. After the step of forming the light guide member,
Covering the surface of the light guide member with a covering member having a light reflecting material,
The method for manufacturing a light emitting device according to claim 1, further comprising a step of exposing a light emitting surface of the light transmitting member to form a covering member that covers surfaces of the light emitting element and the light transmitting member. Before the step of forming the covering member,
The method for manufacturing a light emitting device according to claim 2, further comprising: forming a frame holding the covering member on the substrate.   The light emitting device according to claim 3, wherein the step of forming the frame includes a step of bonding a molded body of the frame to a mounting substrate.   The method of manufacturing a light emitting device according to any one of claims 2 to 4, wherein the step of forming the covering member includes a step of potting a resin material constituting the covering member on the substrate.   The method for manufacturing a light emitting device according to claim 1, wherein the light transmitting member includes a wavelength conversion member that is excited by light emitted from the light emitting element. A part of the light receiving surface of the light transmitting member projects outward from the light emitting surface of the light emitting element,
The method for manufacturing a light emitting device according to claim 1, wherein the outer surface connects a side surface of the light emitting element and a light receiving surface of the light transmitting member. A part of the light emitting surface of the light emitting element projects outward from the light receiving surface of the light transmitting member,
The method of manufacturing a light emitting device according to claim 1, wherein the outer surface connects a side surface of the light transmitting member and an emission surface of the light emitting element. The step of mounting the light emitting element includes a step of mounting a plurality of the light emitting elements on the substrate separated from each other,
The light emitting device according to any one of claims 1 to 8, wherein the step of disposing the light transmitting member includes a step of disposing the light receiving surface of the light transmitting member so as to face the emission surfaces of the plurality of light emitting elements. Device manufacturing method   The method of manufacturing a light emitting device according to claim 9, wherein the step of forming the light guide member includes a step of having a second covering region that covers the mutually facing side surfaces of the light emitting element in which the light guide member is separated. .

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