JP6675151B2 - Light irradiation device - Google Patents

Description

  The present invention relates to a light irradiation device, and more particularly to a modular light irradiation device.

  In recent years, a light irradiation device using a light emitting element such as an LED (Light Emitting Diode) as a light source has been put to practical use. In such a light irradiation device, a plurality of light emitting elements are mounted side by side on a substrate to obtain a desired amount of light and are modularized. Further, a light emitting device in which the number of light emitting elements is further increased by combining light emitting modules including a plurality of light emitting elements is also used (for example, see Patent Documents 1 and 2).

JP 2004-253364 A JP 2006-156829 A

  In a light emitting device using a light emitting module, by adjusting the number and arrangement of the light emitting modules to be used, a light emitting device having a size and a light amount according to the application can be assembled. On the other hand, in order to arrange a plurality of modules side by side, a space for fixing and wiring is required at a peripheral portion of each module, so that an area where a light emitting element cannot be mounted occurs. As a result, it is difficult to uniformly arrange the light emitting elements in the entire light emitting device, which may lead to uneven illuminance. If the light emitting elements are arranged at regular intervals in consideration of the space at the peripheral portion, the mounting density of the light emitting elements is reduced, and the obtained light quantity is reduced.

  The present invention has been made in view of such problems, and one of its exemplary purposes is to provide a module-type light irradiation device with an increased mounting density of light-emitting elements.

  In order to solve the above problems, a light irradiation device according to an embodiment of the present invention includes a light emitting unit having a light emitting element on a front side, a plurality of connectors on a back side, and a base substrate on which a plurality of connectors are provided on a main surface. And. The light emitting unit is disposed on the main surface, each of the plurality of connectors of the light emitting unit is connected to a corresponding connector of the base substrate, and power is supplied through at least one of the connectors of the base substrate.

  According to this aspect, the connector for fixing the light emitting unit to the base substrate is provided on the back side opposite to the light emitting element, and power is supplied via the back side connector. Can be arranged as follows. Thereby, the mounting density of the light emitting element can be increased. Further, by changing the size of the base substrate, it is possible to provide a light irradiation device in which the number of light emitting units according to the application is arranged.

  At least one of the plurality of connectors of the light emitting unit may be a power connector, and at least one of the plurality of connectors of the light emitting unit may be a heat dissipation connector. The light emitting unit may be supplied with power through a first connector of the base board connected to the power connector, and may radiate heat through a second connector of the base board connected to the heat radiating connector.

  A heat radiating plate provided on the opposite side of the light emitting unit with respect to the base substrate may be further provided. The second connector of the base board may have a heat radiating hole penetrating the base board. The heat radiating plate may have a heat radiating terminal extending toward the heat radiating connector through the heat radiating hole.

  A wiring board provided between the base board and the heat sink may be further provided. The wiring board may have a communication hole penetrating the wiring board and communicating with the heat dissipation hole. The first connector of the base board may have a wiring hole penetrating the base board. The wiring board may have a power supply terminal extending toward the power supply connector through the wiring hole.

  A cooling mechanism for cooling the heat sink may be further provided.

  The heat dissipation connector may have a different shape from the power supply connector.

  The number of heat radiation connectors included in the light emitting unit may be larger than the number of power supply connectors included in the light emitting unit.

  According to the light irradiation device of the present invention, the mounting density of the light emitting elements can be increased.

FIG. 2 is a top view illustrating a configuration of a light irradiation device according to an embodiment. It is sectional drawing which shows the structure of a light irradiation apparatus schematically. It is a bottom view which shows the structure of a light emitting unit schematically. FIG. 3 is a perspective view schematically showing a configuration of a base substrate. FIG. 3 is a perspective view schematically showing a configuration of a wiring board. It is a perspective view which shows the structure of a heat sink roughly. It is sectional drawing which shows the mode of assembling a light irradiation apparatus typically. It is a top view showing the composition of the light irradiation device concerning a modification. It is a top view showing the composition of the light irradiation device concerning a modification.

  Hereinafter, embodiments for implementing the present invention will be described in detail with reference to the drawings. In the description, the same elements will be denoted by the same reference symbols, without redundant description.

  FIG. 1 is a top view illustrating a configuration of a light irradiation device 10 according to the embodiment. The light irradiation device 10 includes a plurality of light emitting units 12. The light emitting unit 12 has a plurality of light emitting elements 14 and a unit substrate 20. The light irradiation device 10 is a modular light emitting device in which a plurality of light emitting units 12 are arranged side by side.

  In the present embodiment, as an example, a case where one light emitting unit 12 has 3 × 3 = 9 light emitting elements 14 and 2 × 4 = 8 such light emitting units 12 are provided. In another embodiment, the number of light emitting elements included in the light emitting unit 12 may be other than nine, and the number of light emitting units 12 included in the light irradiation device 10 may be other than eight. For example, in another embodiment, one light-emitting unit 12 may have 2 × 2 = 4 light-emitting elements 14 or 4 × 4 = 16 light-emitting elements 14. .

  The light irradiation device 10 has a power supply line 48 for connecting to an external power supply (not shown). The power supply line 48 is provided in the end region 46. The end region 46 and the power supply line 48 will be described later with reference to FIG.

  FIG. 2 is a cross-sectional view schematically showing the configuration of the light irradiation device 10, and shows a cross section taken along line AA of FIG. The light irradiation device 10 includes a base substrate 30, a wiring substrate 40, and a heat sink 50 in addition to the plurality of light emitting units 12. The light emitting unit 12, the base substrate 30, the wiring substrate 40, and the heat sink 50 are sequentially stacked.

  The unit substrate 20 is a metal substrate made of a metal having a high heat dissipation property such as copper (Cu) or aluminum (Al). The plurality of light emitting elements 14 are mounted on the surface 20a of the unit substrate 20. The plurality of light emitting elements 14 are arranged at equal intervals so that the surface intensity distribution of the emitted light becomes uniform. The plurality of light emitting elements 14 are arranged in a tetragonal lattice or a hexagonal lattice on the surface 20 a of the unit substrate 20.

  The light emitting element 14 is an LED (Light Emitting Diode), particularly an LED that emits ultraviolet light. In the present embodiment, as the light emitting element 14, an LED having a center wavelength or a peak wavelength of the radiated light included in an ultraviolet region of about 200 nm to 300 nm is used. When the light irradiation device 10 is used for sterilization using ultraviolet light irradiation, it is preferable to use a device that emits ultraviolet light having a wavelength of 260 nm, which is a wavelength with high sterilization efficiency. As such an ultraviolet LED, for example, an LED using aluminum gallium nitride (AlGaN) is known. In addition, when using for other uses, such as resin hardening, what is necessary is just to select the light source which emits ultraviolet light of the wavelength suitable for a use. In addition, when used for other purposes such as lighting, an LED that emits visible light or infrared light may be used as the light emitting element 14.

  On the back surface 20b of the unit substrate 20, unit-side connectors 22a and 22b (hereinafter, also collectively referred to as unit-side connectors 22) are provided. The unit-side connector 22 is connected to the board-side connectors 32a and 32b of the base board 30 (hereinafter, also collectively referred to as the board-side connector 32). The unit-side connector 22 is connected to the board-side connector 32 and fixes the light emitting unit 12 arranged on the main surface 30 a of the base board 30 to the base board 30.

  The unit side connector 22 includes two types of a power supply connector 22a and a heat radiation connector 22b. The power connector 22 a has a first groove 24 a that engages with the board-side first connector 32 a of the base board 30, and a power pad 26 a that is connected to the power terminal 42 of the wiring board 40. The power supply pad 26a is electrically connected to the electrode of the light emitting element 14 inside the unit substrate 20. The power supply pad 26 a is a connection terminal for receiving power supply required for driving the light emitting element 14 from the wiring board 40.

  The heat dissipation connector 22b has a second groove 24b that engages with the board-side second connector 32b of the base board 30, and a heat dissipation pad 26b that is connected to the heat dissipation terminal 52 of the heat dissipation plate 50. The heat radiation pad 26b is thermally connected to the light emitting element 14 inside the unit substrate 20. The heat radiation pad 26b is a connection terminal for transmitting heat generated by driving the light emitting element 14 to the heat radiation plate 50.

  The base substrate 30 is a member for fixing the plurality of light emitting units 12, and is made of, for example, a resin material or a metal material. The base substrate 30 is preferably formed of a low-cost resin material having excellent workability. The base board 30 has a plurality of board-side connectors 32 provided on the main surface 30a. The board-side connector 32 includes two types of board-side first connectors 32a connected to the power connector 22a and board-side second connectors 32b connected to the heat dissipation connector 22b.

  The board-side first connector 32a has a first protrusion 34a that engages with the first groove 24a of the power connector 22a, and a wiring hole 36a that penetrates the base board 30 at the position of the first protrusion 34a. The power supply terminal 42 of the wiring board 40 is inserted into the wiring hole 36a.

  The board-side second connector 32b has a second protrusion 34b that engages with the second groove 24b of the heat dissipation connector 22b, and a heat dissipation hole 36b that penetrates the base board 30 at the position of the second protrusion 34b. The heat dissipation terminal 52 of the heat dissipation plate 50 is inserted into the heat dissipation hole 36b.

  The first protrusion 34a and the second protrusion 34b have the same structure, and the wiring hole 36a and the heat radiation hole 36b have the same structure. Therefore, the board side first connector 32a and the board side second connector 32b have the same structure.

  The wiring board 40 is a wiring layer for supplying power required for driving the light emitting elements 14 to each of the plurality of light emitting units 12. The wiring board 40 has a power supply terminal 42 and a communication hole 44. The power terminal 42 is a columnar member extending toward the power connector 22 a of the unit board 20. The power supply terminal 42 is inserted into the wiring hole 36a of the board-side first connector 32a, and is connected to the power supply pad 26a at the tip. The communication hole 44 is a through hole that penetrates the wiring board 40 at a position corresponding to the heat radiation connector 22b and communicates with the heat radiation hole 36b of the base substrate 30. The heat dissipation terminal 52 of the heat dissipation plate 50 is inserted into the communication hole 44.

  The heat radiating plate 50 is a member for radiating heat generated by driving the light emitting element 14, and is made of a member having a high thermal conductivity such as copper. The heat sink 50 has a heat sink terminal 52. The heat radiating terminal 52 is a columnar member extending toward the heat radiating connector 22 b of the unit substrate 20. The heat dissipation terminal 52 is inserted into the communication hole 44 of the wiring board 40 and the heat dissipation hole 36b of the second board-side connector 32b, and is connected to the heat dissipation pad 26b at the tip.

  The heat sink 50 may be thermally connected to a cooling mechanism (not shown) provided on the side opposite to the light emitting unit 12. The cooling mechanism may be a heat sink, an air cooling device including a fan, or the like, or a water cooling device including a pump for circulating cooling water. Further, the cooling mechanism may include a heat pipe connected to a heat sink or the like, or may include a Peltier-type cooling device.

  FIG. 3 is a bottom view schematically illustrating the configuration of the light emitting unit 12, and is a plan view when the unit substrate 20 is viewed from the back surface 20b. The power connector 22a has a first groove 24a surrounded by a cylindrical side wall, and a power pad 26a exposed at the bottom of the first groove 24a. Similarly, the heat radiation connector 22b has a second groove 24b surrounded by a cylindrical side wall and a heat radiation pad 26b exposed at the bottom of the second groove 24b.

  In the present embodiment, the unit board 20 has 3 × 3 = 9 unit-side connectors 22. Of the nine unit-side connectors 22, two are power supply connectors 22a and the remaining seven are heat dissipation connectors 22b. One of the two power connectors 22a is a positive power connector, and the other is a negative power connector. For example, in the arrangement of three rows and three columns, the power supply connector 22a arranged on the upper side of the second column is on the plus (+) side, and the power supply connector 22a arranged on the lower side of the second column is on the minus (-) side. . With such an arrangement, the heat dissipation connector 22b can be arranged in an H shape, and the light emitting unit 12 can uniformly dissipate heat. Further, the number of the heat radiation connectors 22b is made larger than the number of the power supply connectors 22a, so that heat radiation can be improved.

  In this embodiment, the power supply connector 22a and the heat radiation connector 22b are arranged in three rows and three columns, but may be arranged differently in other embodiments. Further, the number of unit-side connectors 22 in which the power supply connector 22a and the heat radiation connector 22b are totaled may be other than nine.

  FIG. 4 is a perspective view schematically showing a configuration of the base substrate 30. The base substrate 30 has a size corresponding to the number of light emitting units 12 included in the light irradiation device 10. In the present embodiment, eight regions C1 to C8 in which the eight light emitting units 12 are arranged are provided on the main surface 30a so that the eight light emitting units 12 can be arranged. In each of the eight regions C1 to C8, two board-side first connectors 32a and seven board-side second connectors 32b are provided. The board-side first connector 32a and the board-side second connector 32b are provided on the main surface 30a so as to be connectable to the power supply connector 22a and the heat dissipation connector 22b shown in FIG.

  The first protrusion 34a of the board-side first connector 32a has a cylindrical shape corresponding to the shape of the power connector 22a. Further, the wiring hole 36a of the board-side first connector 32a is formed by a cylindrical side wall. Similarly, the second protrusion 34b of the board-side second connector 32b has a cylindrical shape corresponding to the shape of the heat dissipation connector 22b, and the wiring hole 36a of the board-side second connector 32b is formed by a cylindrical side wall. You.

  FIG. 5 is a perspective view schematically showing a configuration of the wiring board 40. The wiring board 40 has a size corresponding to a predetermined number of the light emitting units 12, and has a size corresponding to the four light emitting units 12 in the present embodiment. The wiring board 40 is provided with four regions D1 to D4 respectively corresponding to the four light emitting units 12, and each of the four regions D1 to D4 has two power supply terminals 42 and seven communication terminals. A hole 44 is provided. The power supply terminal 42 and the communication hole 44 are provided corresponding to the position of the board-side connector 32 of the base board 30. The power terminal 42 has a columnar shape corresponding to the shapes of the power connector 22a and the board-side first connector 32a. The communication hole 44 is surrounded by a cylindrical side wall corresponding to the shape of the heat dissipation connector 22b and the board-side second connector 32b.

  The wiring board 40 has an end region 46 outside the regions D1 to D4 corresponding to the light emitting units 12. The end region 46 is a region that is not in contact with the base substrate 30 when the wiring substrate 40 is combined with the base substrate 30. The end region 46 is provided with a connection point with a power supply line 48 connected to an external power supply (not shown). By providing a connection portion with the power supply line 48 in the end region 46 not in contact with the base substrate 30, the base substrate 30 and the power supply line 48 can be prevented from interfering with each other.

  FIG. 6 is a perspective view schematically showing the configuration of the heat sink 50. The heat radiating plate 50 has a size corresponding to the predetermined number of the light emitting units 12, and in the present embodiment, similarly to the wiring board 40, has a size corresponding to the four light emitting units 12. The heat radiating plate 50 is provided with four regions E1 to E4 respectively corresponding to the four light emitting units 12, and each of the four regions E1 to E4 is provided with seven heat radiating terminals 52. The heat dissipation terminals 52 are provided corresponding to the positions of the board-side second connectors 32b of the base board 30. The heat dissipation terminal 52 has a cylindrical shape corresponding to the shape of the heat dissipation connector 22b, the board-side second connector 32b, and the communication hole 44.

  FIG. 7 is a cross-sectional view schematically showing how the light irradiation device 10 is assembled, and corresponds to a cross section taken along line BB of FIG. The light irradiation device 10 is completed by combining eight light emitting units 12, one base substrate 30, two wiring substrates 40 (40a, 40b), and two heat sinks 50 (50a, 50b). The first wiring board 40a and the first heat sink 50a are arranged so that the area D1 of the first wiring board 40a and the area E1 of the first heat sink 50a overlap the area C1 of the base substrate 30. The second wiring board 40b and the second heat sink 50b are arranged so that the area D1 of the second wiring board 40b and the area E1 of the second heat sink 50b overlap the area C5 of the base substrate 30.

  The power supply terminal 42 is inserted into the wiring hole 36a and connected to the power supply pad 26a. The heat radiation terminal 52 is inserted into the communication hole 44 and the heat radiation hole 36b and connected to the heat radiation pad 26b. The light emitting unit 12 is fixed to the base substrate 30 by engaging the power supply connector 22a with the board-side first connector 32a and engaging the heat dissipation connector 22b with the board-side second connector 32b. Thereby, the light irradiation device 10 is completed.

  According to the above configuration, the light-emitting unit 12 is fixed by the plurality of unit-side connectors 22 provided on the back surface 20b, is supplied with power via the board-side first connector 32a, and is supplied with power via the board-side second connector 32b. Heat is dissipated. Therefore, the light emitting unit 12 has a structure for fixing and wiring provided on the back surface 20b, and does not require a space for fixing and wiring at the periphery. Therefore, according to the present embodiment, the mounting density of the light emitting elements 14 provided on the surface 20a of the light emitting unit 12 can be increased. Further, the interval between the light emitting elements 14 between the adjacent light emitting units 12 can be reduced. Thereby, the mounting density of the light emitting elements 14 can be increased over the entire light irradiation device 10. Further, the plurality of light emitting elements 14 can be arranged at uniform intervals, and the light irradiation device 10 with small illuminance unevenness can be obtained.

  According to the present embodiment, since the plurality of light emitting units 12 are fixed to and integrated with the base substrate 30, the size of the light irradiation device 10 can be changed by adjusting the size of the base substrate 30. If a light emitting element is mounted by preparing a wiring board or a heat sink having a size corresponding to the use of the light irradiation device, the wiring board or the heat sink must be designed for each specification of the light irradiation device. On the other hand, according to the present embodiment, the light irradiation device 10 having a desired size can be assembled by combining the wiring board 40 and the heat radiating plate 50 prepared in advance. The cost can be reduced in comparison.

  According to the present embodiment, since the light-emitting elements 14 are divided into the plurality of light-emitting units 12 and are arranged on the base substrate 30, even if some of the light-emitting elements 14 do not turn on, this also applies. The light irradiation device 10 can be repaired simply by replacing the light emitting unit 12. If all the light-emitting elements 14 are mounted on one wiring board, it is necessary to peel off the light-emitting elements 14 fixed by soldering or the like, and it takes time to repair. In some cases, the mounting board may be damaged in the step of peeling off the light emitting element 14 for repair, and the mounting board and the mounting board may need to be replaced. On the other hand, according to the present embodiment, the light emitting element 14 that is no longer lit can be easily replaced in units of the light emitting unit 12, so that the cost for maintenance of the light irradiation device 10 can be reduced.

  According to the present embodiment, since the heat radiating plate 50 is provided on the lowermost layer of the light irradiation device 10, the lower surface of the heat radiating plate 50 is exposed, and the heat radiating plate 50 can be easily cooled. Further, since the lower surface of the heat sink 50 is exposed, a cooling mechanism for cooling the heat sink 50 can be easily attached. Thus, the heat radiation of the light emitting element 14 can be enhanced to stabilize the operation of the light emitting element 14, and the life of the light emitting element 14 can be prevented from being shortened due to thermal influence.

(Modification 1)
FIG. 8 is a top view illustrating a configuration of a light irradiation device 110 according to a modification. In this modification, the base substrate 130 is made larger than the base substrate 30 according to the above-described embodiment, so that more light emitting units 12 can be arranged. Specifically, the base substrate 130 has a size such that 4 × 8 = 32 light emitting units 12 can be arranged. The light irradiation device 110 includes eight wiring boards 40 a to 40 g and eight heat sinks 50. According to the present modification, by changing the size of the base substrate 130, the light emitting units 12, the wiring substrate 40, and the heat radiating plate 50 according to the above-described embodiment can be used to provide light irradiation devices 110 having different sizes. be able to.

(Modification 2)
FIG. 9 is a top view showing a configuration of a light irradiation device 210 according to another modification. In this modification, the shape of the base substrate 230 is elongated so that the light irradiation device 210 has a shape different from that of the above-described embodiment. Specifically, the base substrate 230 has a shape such that eight light emitting units 12 can be arranged in a line. The light irradiation device 210 includes two wiring boards 40a and 40b and two heat sinks 50. According to this modification, by changing the shape of the base substrate 230, the light emitting unit 12, the wiring substrate 40, and the heat sink 50 according to the above-described embodiment can be used to provide the light irradiation device 210 having a different shape. Can be.

  The present invention has been described based on the embodiments. It is understood by those skilled in the art that the present invention is not limited to the above-described embodiment, and that various design changes are possible, various modifications are possible, and such modifications are also within the scope of the present invention. Where it is.

  In the above-described embodiment, the case where the unit-side connector 22 and the board-side connector 32 have a cylindrical shape, and the power supply terminal 42 and the heat radiation terminal 52 have a cylindrical shape corresponding thereto. In a further modification, the cross section orthogonal to the axial direction of the unit-side connector 22 and the board-side connector 32 may be formed in a polygon such as a triangle, a quadrangle, or a hexagon, and the power supply terminal 42 and the heat radiation terminal 52 may be formed in these. The corresponding polygonal column shape may be used.

  In the above-described embodiment, the case where the power supply connector 22a and the heat dissipation connector 22b have the same shape, and the board-side first connector 32a and the board-side second connector 32b connected to these have the same shape. In a further modification, the power supply connector 22a and the heat dissipation connector 22b may have different shapes. For example, when the power connector 22a is square, the heat dissipation connector 22b may be circular. Further, the positive power connector 22a and the negative power connector 22a may have different shapes. Thus, by making the shape different according to the type of the connector, it is possible to prevent the unit-side connector 22 and the board-side connector 32 from being erroneously connected.

  In the above-described embodiment, the case where the unit-side connector 22 is a female connector having a groove and the board-side connector 32 is a male connector having a protrusion is described. In a further modification, the unit-side connector may be a male connector having a protrusion, and the board-side connector 32 may be a female connector having a groove. Further, the connector shape may be varied depending on the type of the connector, such that the power connector 22a is a male connector and the heat radiation connector 22b is a female connector.

  In the above-described embodiment, the case where the unit side connector 22 is one of the power supply connector 22a and the heat radiation connector 22b has been described. In a further modification, a part of the plurality of unit-side connectors 22 may be a control connector. The light emitting unit 12 may have a control circuit for controlling the operation of the light emitting element 14, and may transmit and receive a signal for controlling the operation of the light emitting element 14 through a control connector. The control connector may be connected to a control terminal configured to extend from the wiring board toward the control connector of the light emitting unit.

  In the above-described embodiment, the case where the base substrate 30, the wiring substrate 40, and the heat sink 50 are stacked in this order has been described, but in a further modification, the base substrate 30, the heat sink, and the wiring substrate are stacked in this order. A light irradiation device may be configured. In this case, a communication hole for inserting a power supply terminal of the wiring board may be provided in the heat sink without providing the communication hole in the wiring board.

  In the above-described embodiment, the case where the wiring board 40 and the heat sink 50 are formed as separate bodies has been described. In a further modification, the wiring board 40 and the heat sink 50 may be integrated. In this case, the above-described power supply terminal and heat dissipation terminal may extend toward the light emitting unit 12 from a substrate having a wiring function and a heat dissipation function.

  In the above-described embodiment, the case where the base substrate 30 and the wiring substrate 40 are formed separately is described. In a further modification, the base substrate 30 and the wiring substrate 40 may be integrated. In this case, as the board-side connector connected to the power supply connector 22a, a board-side first connector having the functions of the above-described first protrusion 34a and the power supply terminal 42 may be provided.

  DESCRIPTION OF SYMBOLS 10 ... Light irradiation apparatus, 12 ... Light emitting unit, 14 ... Light emitting element, 22 ... Unit side connector, 22a ... Power supply connector, 22b ... Heat dissipation connector, 30 ... Base board, 30a ... Main surface, 32 ... Board side connector, 36a ... Wiring hole, 36b: heat dissipation hole, 40: wiring board, 42: power supply terminal, 44: communication hole, 50: heat dissipation plate, 52: heat dissipation terminal.

Claims (5)

A base substrate,
N light emitting units detachably attached in an array on the front side of the base substrate;
Two or more wiring boards detachably mounted in an array on the back side of the base board,
Two or more heat sinks detachably attached in an array on the back side of the base substrate,
Each light emitting unit has m light emitting elements arranged in an array on the front side and m unit side connectors provided on the back side of each light emitting element,
The base substrate includes a n × m pieces of the board-side connector to be arranged in an array, each substrate-side connector is configured to be connectable to a corresponding unit side connector,
At least one of the m unit-side connectors of each light-emitting unit is a power-only connector, and the rest of the m unit-side connectors of each light-emitting unit are heat-radiation-only connectors,
Each wiring board is provided at a power supply terminal extending toward the power supply-only connector through a through hole provided at the board-side connector connected to the power-only connector, and at a board-side connector connected to the heat radiation-only connector. A communication hole provided at a position corresponding to the through-hole, configured to be connectable to two or more and less than n light-emitting units,
Each heat radiating plate has heat radiating terminals extending toward the heat radiating connector through communication holes of the wiring board and through holes provided in a board side connector connected to the heat radiating connector, and two or more n heat radiating terminals are provided. A light irradiation device configured to be connectable to less than the light emitting units. The light emitting unit includes one or more first light emitting elements disposed at the center of the light emitting unit, and a plurality of second light emitting elements disposed around the first light emitting element,
A connector dedicated to heat dissipation is provided on the back side of the one or more first light emitting elements, and a connector dedicated for power supply is provided on the back side of at least one second light emitting element, and a second light emitting element different from the at least one second light emitting element The light irradiating apparatus according to claim 1, wherein a heat radiation-dedicated connector is provided on a back side of the light irradiating device.   3. The light irradiation device according to claim 1, wherein the number of the radiation-only connectors included in the light-emitting unit is greater than the number of the power-only connectors included in the light-emitting unit. 4. Each of the n × m board-side connectors has an annular protrusion extending from the main surface of the base board toward the light emitting unit at an outer periphery of the through hole through which the power terminal or the heat radiating terminal is inserted. And
4. The light irradiation device according to claim 1, wherein each of the m unit-side connectors of each light-emitting element has a groove that engages with the annular protrusion. 5.   The light irradiation device according to any one of claims 1 to 4, further comprising a cooling mechanism provided on the opposite side of the wiring board with respect to the heat sink.

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