JP6669217B2 - Package and light emitting device using the same - Google Patents

Description

  The present invention relates to a package and a light emitting device using the package.

  2. Description of the Related Art Conventionally, as a package for a light emitting diode (LED), for example, package structures described in Patent Documents 1 and 2 have been proposed.

JP 2010-153861 A JP 2006-324317 A

  However, the above-mentioned conventional package has a problem that light is repeatedly reflected on the inner surface and light from the light emitting element cannot be efficiently extracted.

  Therefore, the present invention has been made in view of such circumstances, and an object of the present invention is to provide a package excellent in light extraction efficiency and / or a light emitting device using the same.

In order to solve the above-described problems, the present invention includes a first lead electrode, a second lead electrode, and a resin molded body formed integrally with the first and second lead electrodes, and emits light. A package having a concave portion in which an element is housed, wherein the concave portion includes a base portion and a side wall portion, and the base portion has an upper surface of the first lead electrode exposed from the resin molded body. An element mounting area, and a wire connection area in which an upper surface of the second lead electrode is exposed from the resin molded body, wherein the element mounting area is a top view substantially along the outer shape of the light emitting element. Shape, the wire connection area is adjacent to the element mounting area and smaller than the element mounting area, and the surface of the side wall portion is upward from the element mounting area and the wire connection area. So that the opening diameter of the concave portion increases toward Wherein the inclined or curved.

  ADVANTAGE OF THE INVENTION According to this invention, the light of a light emitting element can be efficiently taken out by reducing the repetition of light reflection on the inner surface of a package.

FIG. 1 is a schematic perspective view of a package according to an embodiment of the present invention. 1 is a schematic top view of a light emitting device according to one embodiment of the present invention. It is a schematic sectional drawing which shows the AA cross section in FIG. 1B. 1 is a schematic top view of a light emitting device according to one embodiment of the present invention. It is a schematic sectional drawing which shows the BB cross section in FIG. 2A.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the package and the light emitting device described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. Further, what is described in one embodiment or example can be applied to other embodiments or examples. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of description.

<First Embodiment>
FIG. 1A is a schematic perspective view of the package according to the first embodiment. FIG. 1B is a schematic top view of the light emitting device according to Embodiment 1, and FIG. 1C is a schematic sectional view showing an AA section in FIG. 1B.

  As shown in FIG. 1A, the package 100 according to Embodiment 1 is a package for an LED having an outer shape of a square shape in a top view. The package 100 includes a first lead electrode 10, a second lead electrode 20, and a resin molded body 30. The resin molded body 30 is formed integrally with the first lead electrode 10 and the second lead electrode 20. The package 100 has a concave portion 110 in which a light emitting element is accommodated.

  The recess 110 includes a base 111 and a side wall 119. The base 111 includes an element mounting area 113 and a wire connection area (first wire connection area) 117. The element mounting area 113 is an area where the upper surface of the first lead electrode 10 is exposed from the resin molded body 30. The wire connection region 117 is a region where the upper surface of the second lead electrode 20 is exposed from the resin molded body 30. The element mounting area 113 has a top view shape substantially along the outer shape of the light emitting element. The wire connection area 117 is adjacent to the element mounting area 113 and is smaller than the element mounting area 113. The surface of the side wall 119 is inclined so that the opening diameter of the recess 110 increases upward from the element mounting area 113 and the wire connection area 117.

  In the package 100 having such a configuration, since the end of the side wall portion 119 (that is, the boundary between the side wall portion 119 and the base portion 111) is provided close to the light emitting element, light emitted from the light emitting element is directly transmitted. The light is easily reflected on the surface of the side wall portion 119 and deflected toward the opening of the recess 110. Therefore, repetition of light reflection on the inner surface of the package can be reduced, and light from the light emitting element can be efficiently extracted.

  As shown in FIGS. 1B and 1C, the light emitting device 150 according to the first embodiment includes a package 100, a light emitting element 40, a wire 50, and a sealing member 60. The light emitting element 40 is mounted on the element mounting area 113 of the package. The wire 50 connects the wire connection region 117 of the package and the light emitting element 40. The sealing member 60 fills the recess 110 of the package and seals the light emitting element 40.

  The light emitting device 150 having such a configuration can exhibit the function of the package 100 and extract light from the light emitting element 40 efficiently.

  Hereinafter, preferred modes of the package 100 and the light emitting device 150 will be described.

  As shown in FIGS. 1A to 1C, it is preferable that the element mounting region 113 and the wire connection region 117 form one continuous planar region. Accordingly, the occurrence of burrs during molding of the resin molded body 30 is suppressed, and the element mounting region 113 and the wire connection region 117 can be easily formed with high accuracy. Further, it is easy to connect the wire 50 to the wire connection region 117.

  As shown in FIGS. 1A and 1B, the top surface shape of the element mounting region 113 is a square shape with rounded corners. Since the top-view shape of many light-emitting elements 40 is rectangular, the top-view shape of the element mounting region 113 is preferably rectangular or rectangular with rounded corners. Accordingly, the end of the side wall portion 119 is easily provided close to the light emitting element 40, and light emitted from the light emitting element 40 is easily reflected directly on the surface of the side wall portion 119. The element mounting area 113 is substantially parallel to the outer shape of the resin molded body 30 and the opening of the recess 110 when viewed from above.

  As shown in FIGS. 1A and 1B, it is preferable that one side forming the periphery of the wire connection region 117 be located on substantially the same straight line as one side forming the periphery of the element mounting region 113 in a top view. Thereby, from the viewpoint of molding the resin molded body 30, the element mounting region 113 and the wire connection region 117 are easily formed. In the light emitting element 40 having a rectangular shape in a top view, at least one of a pair of positive and negative electrodes (pad electrodes) is often arranged near a corner, and the wire 50 is easily formed correspondingly.

  As shown in FIGS. 1A and 1B, the opening shape of the concave portion 110 is a rectangular shape with a rounded corner substantially along the outer shape of the resin molded body 30 in a top view. Since the external shape of many packages is rectangular when viewed from the top, the opening shape of the concave portion 110 is rectangular or rectangular with rounded corners substantially along the external shape of the resin molded body 30 when viewed from the top. It is preferred that Thereby, the opening of the concave portion 110 is easily provided to be large, and the light emitted from the light emitting element is easily extracted efficiently. The notch for identifying the polarity (see the lower left part of the package in FIG. 1B) is not considered as the opening shape of the recess 110.

  As shown in FIGS. 1A and 1B, the area of the element mounting region 113 (in a top view) is 1.67 times the area of the light emitting element 40 (about 1.3 times the length of one side) according to design values. It is. As described above, the area of the element mounting region 113 is preferably equal to or less than twice the area of the light emitting element 40, more preferably equal to or less than 1.5 times the area of the light emitting element 40. It is even more preferable that the area is 1.2 times or less the area. In the element mounting region 113 having such a size, the end of the side wall portion 119 is easily provided close to the light emitting element 40, and light emitted from the light emitting element 40 is directly transmitted to the surface of the side wall portion 119. Easy to reflect. The lower limit of the area of the element mounting region 113 is not particularly limited as long as the light emitting element 40 can be fixed to the element mounting region 113, but is preferably larger than (one time) the area of the light emitting element 40. Further, the adhesive for bonding the light emitting element 40 is preferably separated from the side wall portion 119, but may be a part of the surface of the side wall portion 119 as long as it is translucent.

  As shown in FIGS. 1A and 1C, the inclination angle θ of the surface of the side wall portion 119 (the angle inside the resin molded body 30 with reference to the upper surface of the lead electrode) depends on the configuration (shape and arrangement) of the base portion 111. And change. For this reason, the surface of the side wall portion 119 is constituted by a plurality of surfaces having different inclination angles θ. The inclination angle θ of the surface of the side wall portion 119 is not particularly limited, but is preferably as small as possible from the viewpoint of light extraction efficiency (however, the degree is such that the predetermined depth of the concave portion 110 can be secured). Specifically, the inclination angle θ is, for example, greater than 0 ° and 45 ° or less, preferably 5 ° or more and 40 ° or less, and more preferably 5 ° or more and 35 ° or less. In the case where the surface of the side wall portion 119 is curved as in the second embodiment described later, it is assumed that the side wall portion 119 is considered as a tangent plane or a tangent in a cross section.

  As shown in FIG. 1C, the sealing member 60 preferably does not substantially include a phosphor. Accordingly, the surface of the side wall portion 119 is most easily used as a reflection surface without being covered with a phosphor, and light emitted from the light emitting element 40 is easily reflected directly on the surface of the side wall portion 119.

  As shown in FIG. 1B, the package 100 may include a protection element 70. The protection element 70 is embedded in the resin molded body 30, specifically, in the resin molded body 30 forming the side wall portion 119. Thereby, light incidence on the protection element 70 and light absorption due to the light incidence can be suppressed or avoided. In the package 100, since the inclination angle θ of the surface of the side wall 119 is relatively small and the ratio of the side wall 119 in the recess 110 is relatively large, the protection element 70 is easily buried in the resin molded body 30.

  In addition, as shown in FIGS. 1A and 1B, in the package 100, the base 111 includes a second wire connection region 115. The second wire connection region 115 is a region where the upper surface of the first lead electrode 10 is exposed from the resin molded body 30 and is different from the element mounting region 113. That is, the base portion 111 of the package 100 includes the element mounting region 113, the first wire connection region 117, the separation region between the first lead electrode 10 and the second lead electrode 20, and the second wire connection region 115. It is comprised including. Then, in the present embodiment, these areas form one plane area continuously. The second wire connection region 115 is preferably located at a position substantially symmetric with the first wire connection region 117 with respect to the element mounting region 113, for example.

  Further, “smaller than the element mounting area 113” with respect to the wire connection area 117 (also the second wire connection area 115) means that the area is smaller than the element mounting area 113 in a top view. Is not particularly limited. However, when the direction in which the first lead electrode 10 and the second lead electrode 20 are arranged in the horizontal direction and the direction perpendicular to the vertical direction is the length of at least the length of the wire connection region 117 in the top view. It is preferable that the width (width) is smaller than that of the element mounting region 113. Further, it is more preferable that the horizontal length (width) of the wire connection region 117 is smaller than that of the element mounting region 113.

<Embodiment 2>
2A is a schematic top view of the light emitting device according to Embodiment 2, and FIG. 2B is a schematic sectional view showing a BB section in FIG. 2A.

  As shown in FIGS. 2A and 2B, the package 200 according to the second embodiment is a rectangular LED package whose external shape is long in the horizontal direction when viewed from above. The package 200 includes a first lead electrode 10, a second lead electrode 20, and a resin molded body 30. The resin molded body 30 is formed integrally with the first lead electrode 10 and the second lead electrode 20. The package 200 has a recess 210 in which the light emitting element is accommodated. The concave portion 210 includes a base portion 211 and a side wall portion 219. The base portion 211 includes an element mounting area 213 and a wire connection area 217. The element mounting region 213 is a region where the upper surface of the first lead electrode 10 is exposed from the resin molded body 230. The wire connection region 217 is a region where the upper surface of the second lead electrode 20 is exposed from the resin molded body 30. The element mounting area 213 has a top view shape substantially along the outer shape (square in this example) of the light emitting element. The wire connection area 217 is adjacent to the element mounting area 213 and is smaller than the element mounting area 213. The surface of the side wall portion 219 is curved so that the opening diameter of the concave portion 210 increases upward from the element mounting region 213 and the wire connection region 217.

  Light emitting device 250 according to the second embodiment includes package 200, light emitting element 41, wire 50, and sealing member 60. The light emitting element 41 is mounted on the element mounting area 213 of the package. The wire 50 connects the wire connection region 217 of the package and the light emitting element 41. The sealing member 60 fills the recess 210 of the package and seals the light emitting element 41.

  The package 200 and the light emitting device 250 having such a configuration can also reduce light repetition on the inner surface of the package and efficiently extract light from the light emitting element.

  Hereinafter, preferred modes of the package 200 and the light emitting device 250 will be described.

  As shown in FIGS. 2A and 2B, it is preferable that the element mounting area 213 and the wire connection area 217 are separated by a projection of the resin molded body 30. Thereby, the light emitted from the light emitting element 41 is reflected by the projections of the resin molded body 30 to reduce the incidence of light on the wire 50 (especially in the vicinity of the connection portion with the wire connection region 217) and the light absorption due to the light. Can be. In this example, the protrusions of the resin molded body 30 are provided on the area where the first lead electrode 10 and the second lead electrode 20 are separated from each other, but the first lead electrode 10 or the second lead electrode 20 may be unevenly provided.

  As shown in FIG. 2A, the wire connection region 217 is preferably on a diagonal extension of the element mounting region 213 and is adjacent to a corner of the element mounting region 213 in a top view. Thus, the ratio of the end of the side wall portion 219 to the edge of the element mounting region 213 can be relatively increased, and light emitted from the light emitting element 41 can be easily reflected directly on the surface of the side wall portion 219. Further, when at least one of the pair of positive and negative electrodes (pad electrodes) is a light emitting element having a rectangular shape in a top view arranged near a corner, it is easy to form a wire correspondingly. Note that the element mounting area 213 is oblique to the outer shape of the resin molded body 30 and the opening of the recess 210 (rotated by about 45 ° in this example) in a top view.

  As shown in FIG. 2B, the upper surface (substrate side) of the light emitting element 41 is smaller than the lower surface (element structure side), and the side surface is inclined. For this reason, the luminous intensity of the light emitting element 41 is higher in the oblique direction than in the upward direction. The light emitting device 250 has a configuration in which light emitted from such a light emitting element 41 in an oblique direction is directly reflected on the surface of the side wall portion 119 to be easily extracted.

  As shown in FIG. 2B, the sealing member 60 includes a phosphor 80. Then, the phosphors 80 are dispersed over substantially the entire area inside the sealing member 60. Thereby, the coating of the surface of the side wall 119 with the phosphor 80 is reduced, and the surface of the side wall 119 is relatively easily used as a reflection surface. Therefore, even when the phosphor 80 is included in the sealing member 60, the light emitted from the light emitting element 41 is relatively easily reflected directly on the surface of the side wall portion 119.

  In addition, even if the phosphor is unevenly distributed near the light emitting element in the sealing member, or the phosphor is held by the light emitting element itself, the coating of the surface of the side wall portion 119 with the phosphor is reduced, The surface of the portion 119 can be easily used as a reflection surface.

  As described above, a top-view (top emission) type package has been described as an embodiment. However, any package that includes first and second lead electrodes and a resin molded body and has a concave portion in which a light emitting element is accommodated can be used. A side view (side emission) type package may be used, and the structure of the external connection terminal is not particularly limited.

  Hereinafter, each component of the package and the light emitting device of the present invention will be described.

(First lead electrode 10, second lead electrode 20)
As the lead electrode, a conductive metal member connected to the light emitting element can be used. Specific examples include copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, and alloys thereof, phosphor bronze, and iron-containing copper. Various shapes of the lead electrode can be formed by subjecting the metal plate material to processing such as pressing, rolling, and etching. Further, on the surface layer of the lead electrode, a light reflecting film such as silver, aluminum, rhodium, gold, copper, or an alloy thereof may be provided by plating or the like, and among them, silver having the highest light reflectivity is preferable. .

(Resin molded body 30)
As a base material of the resin molded body, a thermosetting resin or a thermoplastic resin can be used. Examples of the thermosetting resin include an epoxy resin, an epoxy-modified resin, a silicone resin, a silicone-modified resin, a polybismaleimide triazine resin, a polyimide resin, and a polyurethane resin. Among them, any one of an epoxy resin, an epoxy-modified resin, a silicone resin, and a silicone-modified resin is preferable. As the thermoplastic resin, aliphatic polyamide resin, semi-aromatic polyamide resin, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polycarbonate resin, syndiotactic polystyrene, polyphenylene ether, polyphenylene sulfide, polyether sulfone resin, polyether ketone resin And polyarylate resins. Among them, an aliphatic polyamide resin or polycyclohexane terephthalate is preferred. In these base materials, as a filler or a coloring pigment, glass, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, wollastonite, Mica, zinc oxide, barium titanate, potassium titanate, aluminum borate, aluminum oxide, zinc oxide, silicon carbide, antimony oxide, zinc stannate, zinc borate, iron oxide, chromium oxide, manganese oxide, carbon black, etc. Particles or fibers can be incorporated. Among them, it is preferable to use silica as a filler and titanium oxide or zinc oxide as a coloring pigment (reflecting material).

(Light emitting elements 40 and 41)
As the light emitting element, a semiconductor light emitting element such as a light emitting diode element can be used. The light-emitting element may have any element structure including various semiconductors and a pair of positive and negative electrodes. In particular, the light emitting element capable of light emission by a nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) are preferred. In addition, a gallium arsenide-based or gallium-phosphorus-based semiconductor light emitting element that emits green to red light may be used. Many light-emitting elements have a substrate. The substrate is preferably light-transmitting, but is not limited to this. Examples of the base material of the substrate include sapphire, spinel, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphorus, indium phosphorus, zinc sulfide, zinc oxide, zinc selenide, and the like. In the case of a light-emitting element in which a pair of positive and negative electrodes are provided on the same surface side, each electrode is connected to a lead electrode by a wire and mounted face-up. In the case of a light emitting element having a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, a lower electrode is bonded to a lead electrode with a conductive adhesive, and an upper electrode is connected to the lead electrode with a wire. The number of light emitting elements mounted on one package may be one or more. The plurality of light emitting elements can be connected in series or in parallel by a wire. Further, for example, three light emitting elements of blue, green, and red light emission may be mounted in one package.

(Wire 50)
The wire is a conducting wire connecting the electrode of the light emitting element and the lead electrode. Specifically, a metal wire of gold, copper, silver, platinum, aluminum, or an alloy thereof can be used. In particular, a gold wire that is less likely to break due to stress from the sealing member and has excellent heat resistance and the like is preferable. In addition, at least the surface may be made of silver in order to enhance light reflectivity.

(Sealing member 60)
The sealing member is a member that seals a light emitting element, a wire, and the like, and protects the element from dust, moisture, external force, and the like. The base material of the sealing member may be any material as long as it has electrical insulation and can transmit light emitted from the light emitting element and / or the phosphor (preferably, transmittance is 70% or more). Specific examples include a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, a modified resin thereof, or a hybrid resin containing at least one of these resins. Among them, a silicone resin or a modified resin thereof is preferable because it has excellent heat resistance and light resistance and has a small volume shrinkage after solidification. Further, particles having various functions such as a filler and a phosphor may be mixed in a base material of the sealing member. As the filler, a diffusing agent, a coloring agent, or the like can be used. Specifically, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass And carbon black.

(Protective element 70)
The protection element is an element for protecting the light emitting element from static electricity and high voltage surge. Specifically, a Zener diode is used.

(Phosphor 80)
The phosphor absorbs at least a part of the primary light emitted from the light emitting element and emits secondary light having a different wavelength from the primary light. Specifically, yttrium aluminum garnet activated with cerium, nitrogen-containing calcium aluminosilicate activated with europium and / or chromium, sialon activated with europium, silicate activated with europium, activated with manganese And potassium fluorosilicate. Thereby, a light emitting device that emits a mixed color light (for example, white light) of primary light and secondary light of visible wavelength or a light emitting device that emits secondary light of visible wavelength when excited by primary light of ultraviolet light is used. Can be.

(adhesive)
The adhesive is a member for bonding the light emitting element to the lead electrode. As the insulating adhesive, an epoxy resin, a silicone resin, a polyimide resin, a modified resin thereof, a hybrid resin, or the like can be used. As the conductive adhesive, a conductive paste of silver, gold, palladium, or the like, a tin-bismuth-based, tin-copper-based, tin-silver-based, or gold-tin-based solder can be used.

Hereinafter, examples according to the present invention will be described in detail. It is needless to say that the present invention is not limited to only the examples described below.
<Example 1>
The light emitting device of the first embodiment is a substantially rectangular parallelepiped top-view type SMD LED having the structure of the light emitting device 150 of the example shown in FIGS. 1B and 1C (excluding the protection element 70). Hereinafter, the vertical (up and down) and horizontal (left and right) directions will be specified and described with respect to the orientation of the package and the light emitting device shown in FIG.

  The package has a length of 3.0 mm, a width of 3.0 mm, and a thickness of 0.52 mm, and is formed by integrally forming a resin molded body on a pair of positive and negative (first and second) lead electrodes. I have. In this package, a processed metal plate (lead frame) in which a plurality of sets of lead electrodes are connected vertically and horizontally via suspension leads is placed in a mold, and the constituent material of a liquid resin molded body is injected and solidified. After being released from the mold, it is manufactured by cutting (singulation).

  Each of the first and second lead electrodes is a plate-like small piece of a copper alloy having a maximum thickness of 0.2 mm and having a surface plated with silver. The exposed areas on the lower surfaces of the first and second lead electrodes are substantially flush with the lower surface of the resin molded body, and constitute the lower surface of the package. In each of the first and second lead electrodes, a cut suspension lead portion is exposed at an end surface of a package (resin molded body).

  The resin molded body is a square shape having an outer shape in a top view of 3.0 mm in length and 3.0 mm in width, a maximum thickness of 0.52 mm, and is made of an epoxy resin containing silica and titanium oxide. At the upper surface of the resin molded body, that is, substantially at the center of the upper surface of the package, a square opening (excluding a notch for polarity identification) having a rounded corner of 2.6 mm in length and 2.6 mm in width when viewed from the top, A recess having a depth of 0.32 mm is formed.

The recess is composed of a base and a side wall. The element mounting area at the base (rounded corners) is an exposed area on the upper surface of the first lead electrode (the center in the vertical direction, the right end in the horizontal direction), and has a length of 840 μm. This is a substantially square area having a width of 840 μm. The second wire connection region is an exposed region on the upper surface of the first lead electrode (contiguous to the left side of the element mounting region and the lower side is located on the same straight line), and has a substantially rectangular shape with a length of 420 μm and a width of 310 μm. Area. The first wire connection region is an exposed region on the upper surface of the second lead electrode (the upper side is located on the same straight line as the upper side of the element mounting region in the vertical direction, and the horizontal position is the left end). This is a substantially rectangular area having a length of 420 μm and a width of 230 μm. Between the element mounting region at the base and the first wire connection region, there is a space between the first lead electrode and the second lead electrode, which is formed on the surface of the resin molded body. The surface of the side wall portion is formed of a resin molded body, and is inclined with the periphery of the base portion substantially as a starting point (end). The inclination angle θ of the surface of the side wall is 18 to 33 °.

  One light emitting element is bonded to the element mounting area of the package with an adhesive, which is dimethyl silicone resin. This light-emitting element is a 650-μm-long, 650-μm-wide, and 150-μm-thick LED element capable of emitting blue light (center wavelength: about 453 nm), in which a nitride semiconductor element structure is stacked on a sapphire substrate. In the light emitting element, the n-electrode is connected to the second wire connection region by a wire, and the p-electrode is connected to the first wire connection region by a wire. The wire is a gold wire having a wire diameter of 25 μm.

  The recess of the package is filled with a sealing member to cover the light emitting element. The sealing member is made of a phenyl silicone resin as a base material, and contains a filler of silica therein. The upper surface of the sealing member is substantially flush with the upper surface of the package, and is substantially flat (strictly, a slightly concave surface due to curing shrinkage). The sealing member is formed by dropping a liquid constituent material into a concave portion of a package with a dispenser or the like and solidifying the material by heating.

  The light emitting device of Example 1 configured as described above can emit light with a radiant flux Φe of 117.1 mW at a current of 65 mA. This is for a radiant flux Φe of 107.8 mW of a light emitting device manufactured in the same manner except that the opening has the same shape when viewed from above and has a recess having a side wall surface which is uniformly inclined at an inclination angle θ = 63 °. Therefore, the value is as high as 8.7%.

  The light-emitting device according to the present invention is used in a backlight device of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guidance, a projector device, and further, a digital video camera, a facsimile, a copier, a scanner and the like. It can be used for an image reading device and the like.

100, 200: Package 110, 210: Depression 111, 211: Base (113, 213: Element mounting area, 115: Second wire connection area, 117, 217: Wire connection area (first wire connection area) )
119, 219 Side wall portion 10 First lead electrode 20 Second lead electrode 30 Resin molded body 150, 250 Light emitting device 40, 41 Light emitting element 50 Wire 60 Sealing member 70 Protection element 80 … Phosphor

Claims (6)

A package comprising: a first lead electrode; a second lead electrode; and a resin molded body formed integrally with the first and second lead electrodes,
A concave portion, an element mounting region in which the upper surface of the first lead electrode is exposed from the resin molded body on the bottom surface of the concave portion, and an upper surface of the second lead electrode on the bottom surface of the concave portion, wherein An exposed wire connection area;
The element mounting area and the wire connection area are separated by the resin molded body,
The end of the side wall of the recess is located at the edge of the element mounting area,
The surface of the side wall is inclined or curved from the end of the side wall to the start of the side wall,
The package in which the wire connection region is smaller than the element mounting region in a top view, and is on an extension of a diagonal line of the element mounting region and is adjacent to a corner of the element mounting region.   2. The package according to claim 1, wherein the element mounting area is oblique with respect to an outer shape of the resin molded body and an opening of the recess when viewed from above. 3. A package according to claim 1 or 2,
A light-emitting element housed in the recess, and mounted on the element mounting area,
A light emitting device comprising:   The light emitting device according to claim 3, wherein an area of the element mounting region is equal to or less than 1.5 times an area of the light emitting element in a top view. The light emitting element,
Having a substrate and an element structure formed on the substrate,
The surface on the element structure side is mounted on the element mounting area with the element mounting area facing the element mounting area,
The surface on the substrate side is smaller than the surface on the element structure side,
The light emitting device according to claim 3, wherein the side surface is inclined. A sealing member that is filled in the concave portion and seals the light emitting element,
The sealing member includes a phosphor dispersed in the sealing member,
The light emitting device according to claim 3.

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