JP6633172B2 - High frequency transmission equipment - Google Patents

Description

  The present invention relates to a high-frequency transmission device provided with a plurality of signal lines.

  As a multi-channel high-frequency transmission board for transmitting a plurality of high-frequency signals, a high-frequency transmission device having a plurality of signal lines is widely used. In such a high-frequency transmission device, a phenomenon called crosstalk in which a high-frequency signal transmitted on a certain signal line is transferred to another signal line is known.

  As a high-frequency transmission device that suppresses such crosstalk, a signal transmission board described in Patent Document 1 is known. In the signal transmission board described in Patent Literature 1, the crosstalk is reduced by arranging a ground line buried in the board between adjacent signal lines (“signal transmission line” in Patent Literature 1). I'm trying.

JP-A-11-266015 (published September 28, 1999)

  However, in the conventional high-frequency transmission device, there is a problem that when the size is reduced, crosstalk increases.

  In other words, reducing the size of the high-frequency transmission device means (1) reducing the distance between signal lines and (2) reducing the width of the ground pattern disposed between the signal lines. . Each of the structural changes (1) and (2) acts in a direction to increase crosstalk.

  The present invention has been made in view of the above problems, and an object of the present invention is to reduce the crosstalk generated between signal lines in a high-frequency transmission device having a plurality of signal lines while reducing the area required for mounting the same. It is to make it smaller.

  In order to solve the above-described problem, a high-frequency transmission device according to one embodiment of the present invention includes a plurality of high-frequency transmission substrates and a housing that houses the plurality of high-frequency transmission substrates. Each is composed of (1) a dielectric substrate, (2) a signal line on the front surface formed on the surface of the dielectric substrate, and (3) a ground pattern on the front surface formed on the surface of the dielectric substrate. And (4) a rear surface of the dielectric substrate facing the signal line on the front side, the ground pattern including a pair of ground patterns disposed so as to sandwich the signal line on the front side. A plurality of high-frequency transmission boards, wherein the signal line on the front side of one of the two high-frequency transmission boards is the other high-frequency transmission board. Week It is supported by the housing so as to face the rear surface side of the ground pattern of the transmission substrate, characterized in that.

  According to the above configuration, the plurality of high-frequency transmission boards are arranged in an overlapping manner. Therefore, the area required for mounting the high-frequency signal transmission device can be reduced as compared with the case where a plurality of high-frequency transmission substrates are arranged side by side. Moreover, the signal line of each high-frequency transmission board is sandwiched between the ground pattern of the high-frequency transmission board and the ground pattern of the high-frequency transmission board adjacent to the high-frequency transmission board, and is shielded by these two ground patterns. Therefore, crosstalk between signal lines of each high-frequency transmission board can be suppressed.

  Therefore, in the high-frequency transmission device provided with a plurality of signal lines, the area required for mounting can be reduced while suppressing crosstalk generated between the signal lines.

  In addition, according to the above configuration, a coplanar waveguide can be configured by the signal lines formed on the surface of the dielectric substrate and the pair of ground patterns.

In the high frequency transmission apparatus according to an embodiment of the present invention, the shortest effective wavelength of the effective wavelength of a high-frequency signal, each of the signal lines of the surface side is transmitted as lambda _1, the surface side sandwiching the signal lines of the surface-side Is preferably 0.1 × λ ₁ or less.

  According to the above configuration, the signal lines and the pair of ground patterns formed on the surface of the dielectric substrate function as good coplanar waveguides.

In the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission substrates further includes a signal line on a back surface formed on a back surface of the dielectric substrate,
The ground pattern on the back side includes a pair of ground patterns arranged so as to sandwich the signal line on the back side.
The plurality of high-frequency transmission boards are arranged such that, of the two high-frequency transmission boards adjacent to each other, the ground pattern on the front side of one high-frequency transmission board faces the signal line on the back side of the other high-frequency transmission board. Supported by the body,
As lambda ₁ shortest effective wavelength of the effective wavelength of a high-frequency signal, each of the signal lines and the back surface side of the signal line of the surface side is transmitted, the ground patterns of the above-mentioned surface side sandwiching the signal lines of the surface-side and spacing, and the spacing of the ground patterns of the above rear surface side sandwiching the signal line of the back surface side is 0.1 × lambda ₁ or less, it is preferable.

  In the high-frequency transmission device according to one embodiment of the present invention, when each of the plurality of high-frequency transmission boards includes the front-side signal line, both ends of the front-side signal line have the high-frequency transmission line. Insulated from other members constituting the substrate, and when each of the plurality of high-frequency transmission substrates includes the signal line on the front side and the signal line on the back side, the signal line on the front side and the back side It is preferable that one or both of the signal lines on both sides are insulated at both ends from other members constituting the high-frequency transmission board.

  In the high-frequency transmission device according to one embodiment of the present invention, when each of the plurality of high-frequency transmission boards includes the front-side signal line, each of the front-side signal lines has the front-side signal line. Only the surface of the formed dielectric substrate is formed so as to extend from one end to the other end of the dielectric substrate, and each of the plurality of high-frequency transmission substrates is a signal line on the front side. And when the signal line on the back side is provided, each of the signal lines on the front side is provided only on one surface of the dielectric substrate on which the signal line on the front side is formed, and one end of the dielectric substrate is provided. And / or each of the signal lines on the back side is formed only on the back surface of the dielectric substrate on which the signal lines on the back side are formed. Body board from one end to the other Is formed so as to reach the end, it is preferable.

  In the high-frequency transmission device according to one aspect of the present invention, each of the plurality of high-frequency transmission boards is arranged in a fence shape along a side of the front-side ground pattern facing the signal line on the front side. It is preferable that the short-circuit post group further includes a first short-circuit post group that short-circuits the ground pattern on the front surface and the ground pattern on the rear surface.

  According to the above configuration, the first group of short-circuit posts functions as a shielding wall for an electric field generated by the high-frequency signal transmitted by the signal line. Accordingly, it is possible to prevent a high-frequency signal transmitted by a signal line from being transferred to another high-frequency signal transmitted by a signal line provided on a dielectric substrate of an adjacent high-frequency transmission substrate. Therefore, the high-frequency transmission device can further suppress crosstalk between signal lines.

  In the high-frequency transmission device according to one aspect of the present invention, each of the plurality of high-frequency transmission substrates further includes a rear-side signal line formed on a rear surface of the dielectric substrate, and the rear-side ground pattern is Each of the plurality of high-frequency transmission boards includes a pair of ground patterns arranged so as to sandwich the signal line on the back side, and each of the plurality of high-frequency transmission boards is shaped like a fence along a side facing the signal line on the back side of the ground pattern on the back side. And a second short post group for short-circuiting the ground pattern on the front surface and the ground pattern on the rear surface, which are arranged in the second group.

In the high-frequency transmission device according to one embodiment of the present invention, when each of the plurality of high-frequency transmission boards includes the front-side signal line, both ends of the front-side signal line have the high-frequency transmission line. Insulated from other members that make up the board,
When each of the plurality of high-frequency transmission boards includes the signal line on the front side and the signal line on the back side, one or both of the signal line on the front side and the signal line on the back side have both ends. Is preferably insulated from other members constituting the high-frequency transmission board.

  In the high-frequency transmission device according to one embodiment of the present invention, when each of the plurality of high-frequency transmission boards includes the front-side signal line, each of the front-side signal lines has the front-side signal line. Only the surface of the formed dielectric substrate is formed so as to extend from one end to the other end of the dielectric substrate, and each of the plurality of high-frequency transmission substrates is a signal line on the front side. And when the signal line on the back side is provided, each of the signal lines on the front side is provided only on one surface of the dielectric substrate on which the signal line on the front side is formed, and one end of the dielectric substrate is provided. And / or each of the signal lines on the back side is formed only on the back surface of the dielectric substrate on which the signal lines on the back side are formed. Body board from one end to the other Is formed so as to reach the end, it is preferable.

  In each of the plurality of high-frequency transmission boards provided in the high-frequency transmission device according to one embodiment of the present invention, the signal line on the front side and the ground pattern on the back side are opposed to each other, In addition, it is preferable that the signal line on the back side and the ground pattern on the front side face each other.

  According to the above configuration, in each of the high-frequency transmission boards, (1) the signal line on the front side and the signal line on the back side are compared with the case where the signal line on the front side and the signal line on the back side are opposed to each other. Each of the signal lines is surrounded on all sides by a conductor, and (2) the distance between the signal line on the front side and the signal line on the back side is large. Therefore, the present high-frequency transmission device can suppress crosstalk that can occur between the signal line on the front side and the signal line on the back side.

  In the high-frequency transmission device including a plurality of high-frequency transmission boards, a signal line on the front side and a signal line on the back side are formed on the front and back of the dielectric substrate, respectively. Therefore, the present high-frequency transmission device has twice as many signal lines as compared to the case where signal lines are formed on one of the front and back surfaces of the dielectric substrate. Therefore, the present high-frequency transmission device can double the signal line mounting density while having the same size as the high-frequency transmission device in which signal lines are formed on one of the front and back surfaces of the dielectric substrate.

  As described above, the present high-frequency transmission device has a larger gap between the signal line on the front surface and the signal line on the rear surface as compared with the high-frequency transmission device in which the signal line is formed on one of the front and back surfaces of the dielectric substrate. , The mounting density of signal lines can be doubled while suppressing crosstalk occurring at the same time. In other words, the size can be further reduced while suppressing crosstalk that may occur between the signal line on the front side and the signal line on the back side.

  Further, each of the plurality of high-frequency transmission boards included in the high-frequency transmission device according to one embodiment of the present invention includes a first dielectric layer, a second dielectric layer, and the first dielectric layer. An inner layer interposed between the first dielectric layer and the second dielectric layer, and separating the first dielectric layer and the second dielectric layer, the inner layer being made of a conductor. Is preferred.

  According to the above configuration, the inner layer provided on the dielectric substrate electromagnetically shields the signal lines on the front surface and the signal lines on the rear surface provided on the front and back surfaces of the dielectric substrate. Therefore, the present high-frequency transmission device can suppress crosstalk that can occur between the signal line on the front surface and the signal line on the rear surface provided on the same dielectric substrate.

  ADVANTAGE OF THE INVENTION According to this invention, in the high frequency transmission apparatus provided with several signal lines, the area required for the mounting can be reduced, suppressing the crosstalk which arises between signal lines.

FIG. 1A is a perspective view illustrating a configuration of a high-frequency transmission device according to a first embodiment of the present invention. FIG. 2B is a perspective view illustrating a configuration of a high-frequency transmission board included in the high-frequency transmission device illustrated in FIG. (A) is a top view which shows the structure of the high frequency transmission board shown in (b) of FIG. FIG. 2B is a cross-sectional view illustrating a configuration of the high-frequency transmission substrate illustrated in FIG. 1B, and is a cross-sectional view taken along line A-A ′ illustrated in FIG. (A) is a top view showing a configuration of a high-frequency transmission board provided in a high-frequency transmission device according to a second embodiment of the present invention. (B) is a cross-sectional view showing the configuration of the high-frequency transmission board shown in (a), and is a cross-sectional view taken along line B-B 'shown in (a). (A) is a top view showing a configuration of a high-frequency transmission board provided in a high-frequency transmission device according to a first modification of the present invention. (B) is a front view of the high-frequency transmission device, and is a front view showing an arrangement of four of the high-frequency transmission substrates accommodated in the high-frequency transmission device. (A) And (b) is a top view which shows the structure of the high frequency transmission board | substrate with which the high frequency transmission device concerning the 2nd modification of this invention is provided. (C) is a front view of the high-frequency transmission device, and is a front view showing an arrangement of four high-frequency transmission boards accommodated in the high-frequency transmission device. (A) And (b) is a top view which shows the structure of the high frequency transmission board with which the high frequency transmission device concerning the 3rd modification of this invention is provided. (C) is a side view showing a configuration of the high-frequency transmission device. (A) is a top view showing a configuration of a high-frequency transmission board provided in a high-frequency transmission device according to a third embodiment of the present invention. FIG. 2B is a cross-sectional view illustrating the configuration of the high-frequency transmission board illustrated in FIG. 1A, and is a cross-sectional view taken along line C-C ′ illustrated in FIG. It is a top view showing the composition of the high frequency transmission board with which the high frequency transmission device concerning a 4th embodiment of the present invention is provided. (A) is a top view which shows the structure of the high frequency transmission board with which the high frequency transmission device concerning 5th Embodiment of this invention is provided. (B) is a front view showing a configuration of the high-frequency transmission device. FIG. 1A is a block diagram illustrating a configuration of a high-frequency signal transmission device to which a high-frequency transmission device according to one embodiment of the present invention is applied. (B) is a block diagram showing a configuration of a high-frequency signal transmitting / receiving device to which the high-frequency transmission device according to one embodiment of the present invention is applied.

[First Embodiment]
A high-frequency transmission device 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a perspective view illustrating a configuration of a high-frequency transmission device 1 according to the present embodiment. FIG. 1B is a perspective view illustrating a configuration of a high-frequency transmission board 10 included in the high-frequency transmission device 1 illustrated in FIG. FIG. 2A is a top view illustrating the configuration of the high-frequency transmission board 10 illustrated in FIG. 2B is a cross-sectional view illustrating the configuration of the high-frequency transmission substrate 10 illustrated in FIG. 1B, and is a cross-sectional view taken along line AA ′ illustrated in FIG. .

  The high-frequency transmission device 1 is a multi-channel high-frequency transmission device that transmits a plurality of high-frequency signals, and includes a plurality of high-frequency transmission substrates 10 and a housing 20 as shown in FIG.

  Each of the high-frequency transmission substrates 10 includes a dielectric substrate 11, a signal line 12, a pair of ground patterns 13, and a ground pattern 14, as shown in FIG.

  The dielectric substrate 11 is a substrate made of a dielectric such as glass epoxy. In the coordinate system shown in FIG. 1, the dielectric substrate 11 has the front (front) surface 11a and the back surface 11b parallel to the xy plane, and the direction from the back surface 11b to the front surface 11a matches the positive direction of the z-axis. It is arranged to be.

  On the surface 11a of the dielectric substrate 11, a signal line 12 and a pair of ground patterns 13 are formed. As shown in FIG. 2A, the pair of ground patterns 13 is a ground pattern arranged so as to sandwich the signal line 12, and includes a ground pattern 131 and a ground pattern 132. The signal line 12 and the pair of ground patterns 13 form a coplanar waveguide. In the present embodiment, the signal line 12 and the pair of ground patterns 13 extend in the y-axis direction on the coordinate axes illustrated in FIG.

  On the rear surface 11b of the dielectric substrate 11, a ground pattern 14 on the rear surface side is formed. As shown in FIG. 2B, the ground pattern 14 is arranged to face the signal line 12 with the dielectric substrate 11 interposed therebetween.

  The ground patterns 13 and 14 are grounded via a grip 21 of the housing 20 as described later.

  Each of the signal line 12, the ground pattern 13, and the ground pattern 14 is a thin film made of a conductor such as copper or aluminum.

  In the present embodiment, the housing 20 supports and accommodates the four high-frequency transmission boards 10 as shown in FIG. In the present embodiment, the housing 20 is made of a conductor and grounded.

  In the present embodiment, when the four high-frequency transmission boards 10 housed in the housing 20 are distinguished from each other, the four high-frequency transmission boards 10 are distinguished from each other by sequentially adding subscripts a to d from the high-frequency transmission board 10 on the z-axis negative direction side. I do. That is, the high-frequency transmission boards 10a, 10b, 10c, and 10d are arranged in order from the high-frequency transmission board that is arranged closest to the negative side of the z-axis.

The housing 20 supports and accommodates the high-frequency transmission boards 10a to 10d as follows. That is, the housing 20 is
(1) The side wall of the housing 20 faces the ground pattern 14 of the high-frequency transmission board 10a,
(2) The signal line 12 of the high-frequency transmission board 10a faces the ground pattern 14 of the adjacent high-frequency transmission board 10b,
(3) The signal line 12 of the high-frequency transmission board 10b faces the ground pattern 14 of the adjacent high-frequency transmission board 10c,
(4) The signal line 12 of the high-frequency transmission board 10c faces the ground pattern 14 of the adjacent high-frequency transmission board 10d,
(5) The high-frequency transmission boards 10a to 10d are supported and accommodated such that the signal line 12 of the high-frequency transmission board 10c and the side wall of the housing 20 face each other.

  In other words, the plurality of high-frequency transmission boards 10a to 10d are configured such that the signal line 12 of one of the two high-frequency transmission boards 10 faces the ground pattern 14 of the other high-frequency transmission board 10 among the two adjacent high-frequency transmission boards. Are supported by the housing 20.

  In order to support the high-frequency transmission boards 10a to 10d as described above, the housing 20 is provided with the grip 21 (see FIG. 1A). The holding unit 21 holds the high-frequency transmission boards 10a to 10d. In the present embodiment, the holding unit 21 includes a holding unit 21 a provided on the lower wall of the housing 20 for holding the lower ends of the high-frequency transmission boards 10 a to 10 d and a high-frequency transmission provided on the upper wall of the housing 20. It comprises a holding portion 21b for holding the upper ends of the substrates 10a to 10d.

  As described above, since the housing 20 is made of a conductive material and is grounded, the grip 21 as a part of the housing 20 is also made of a conductive material and is grounded. Therefore, the ground patterns 13 and 14 formed on the front and back surfaces of the dielectric substrate 11 included in the high-frequency transmission substrate 10 are grounded via the grip 21.

  In the present embodiment, the holding unit 21 is provided on the upper wall and the lower wall of the housing 20, and holds the high-frequency transmission boards 10a to 10d by holding the upper and lower ends of the high-frequency transmission boards 10a to 10d. It has been described as supporting. However, the holding unit 21 is provided on either the upper wall or the lower wall of the housing 20, and holds the high-frequency transmission boards 10a to 10d by holding either the upper end or the lower end of the high-frequency transmission boards 10a to 10d. It may be configured to support.

  According to the high-frequency transmission device 1, a plurality of high-frequency transmission substrates 10 are arranged in an overlapping manner. Therefore, the area required for mounting the high-frequency signal transmission device can be reduced as compared with the case where a plurality of high-frequency transmission substrates are arranged side by side. Moreover, taking the high-frequency transmission board 10a as an example, the signal line 12 of the high-frequency transmission board 10a is sandwiched between the ground pattern 14 of the high-frequency transmission board 10a and the ground pattern 14 of the high-frequency transmission board 10b adjacent to the high-frequency transmission board 10a. , Are shielded by these two ground patterns. The signal lines 12 of the high-frequency transmission boards 10b to 10d are also shielded by two ground patterns, similarly to the signal lines 12 of the high-frequency transmission board 10a. Therefore, according to the high-frequency transmission device 1, crosstalk between the signal lines 12 of each high-frequency transmission board 10 can be suppressed.

  Therefore, in the high-frequency transmission device provided with a plurality of signal lines, the area required for mounting can be reduced while suppressing crosstalk generated between the signal lines.

  Further, the signal lines 12 included in each of the high-frequency transmission boards 10 are sandwiched between a pair of ground patterns 13 provided on the surface 11 a of the dielectric board 11. In other words, the signal lines 12 included in each of the high-frequency transmission boards 10 are surrounded on all sides by conductors that are grounded. Therefore, the high-frequency transmission device 1 can further suppress crosstalk generated between the signal lines 12.

  In addition, the high-frequency transmission device 1 does not need to reduce the width of the pair of ground patterns 13 in order to reduce the area required for mounting, and therefore suppresses suppressed low crosstalk and (1) increases the frequency of the high-frequency signal. (2) It can be maintained even when the signal power of the high-frequency signal increases.

  In addition, the high-frequency transmission device 1 configured as described above can make the shape when viewed in a plan view from the direction in which the signal line 12 extends close to a square. In other words, the high-frequency transmission device 1 can increase the aspect ratio, which is the ratio of height to width, when viewed in a plan view from the direction in which the signal line 12 extends.

  One example of applying the high-frequency transmission device 1 is a high-frequency signal transmission device in which an integrated antenna is connected to one end and a cable for transmitting a high-frequency signal is connected to the other end. More specifically, a vehicle-mounted integrated antenna system mounted on a vehicle is exemplified. In such an application example, it is required that the high-frequency transmission device 1 to which the cable is connected is mounted on the body of an automobile by passing through the narrow space. As described above, the area required for mounting the high-frequency transmission device 1 is reduced, and the high aspect ratio facilitates the passage of the high-frequency transmission device 1 through a narrow space. It becomes easy to mount it on the like.

(Spacing between ground patterns on the front side)
In the following, among the effective wavelength of the high-frequency signal the signal lines 12 provided in each of the high frequency transmission substrate 10a~10d transmits, to the shortest effective wavelength and lambda _1. Spacing of the surface side of the ground pattern 13 sandwiching the respective signal lines 12, and more specifically, the distance between the ground pattern 131 and the ground pattern 132 and the width W _13. In the high frequency transmission apparatus 1, the width _{W 13} is preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, the signal line 12 and the ground pattern 13 form a better coplanar waveguide. Therefore, crosstalk between the signal lines 12 can be further reduced.

(Ventilation port)
Further, as shown in FIG. 1A, the housing 20 preferably includes a ventilation port 22 provided on a wall surface thereof. The ventilation port 22 corresponds to an opening formed on the wall surface of the housing described in the claims. In the present embodiment, the housing 20 includes a ventilation port 22a provided on an upper wall surface thereof and a ventilation port 22b provided on a side wall surface thereof.

  When the high-frequency transmission device 1 is arranged such that the upper and lower wall surfaces of the housing 20 are substantially parallel to the horizontal plane, the main surface (the front surface and the back surface) of the high-frequency transmission substrate 10 is arranged so as to be parallel to the vertical direction. The four high-frequency transmission boards 10 are housed in the housing 20.

  According to the above configuration, convection of air is likely to occur in the space separating the high-frequency transmission boards 10, and the air inside the housing 20 can be circulated. Therefore, even when a high-power high-frequency signal is input to each of the signal lines 12, the high-frequency transmission board 10 can be cooled.

[Second embodiment]
A high-frequency transmission device according to a second embodiment of the present invention will be described with reference to FIG. The high-frequency transmission device according to the present embodiment is obtained by replacing the high-frequency transmission substrate 10 (see FIG. 1) provided in the high-frequency transmission device 1 according to the first embodiment with a high-frequency transmission substrate 30 shown in FIG. . Hereinafter, the high-frequency transmission board 30 according to the present embodiment will be described. The same members as those of the high-frequency transmission board 10 described above are denoted by the same reference numerals, and description thereof will be omitted. The high-frequency transmission device 3 according to the present embodiment in which the high-frequency transmission board 30 shown in FIG.

  The high-frequency transmission board 30 is specifically configured as shown in FIG. FIG. 3A is a top view illustrating the configuration of the high-frequency transmission board 30. FIG. FIG. 3B is a cross-sectional view illustrating the configuration of the high-frequency transmission board 30 and is a cross-sectional view taken along line B-B ′ illustrated in FIG. Compared to the high-frequency transmission board 10 according to the first embodiment, in each of the high-frequency transmission boards 30, the signal line 32 includes an amplifier group 35 for amplifying the high-frequency signal transmitted by the signal line 32 (see the claims). Described amplifier).

  In the present embodiment, the amplifier group 35 includes an amplifier 351 which is an amplifier inserted in the signal line 32 and is a first-stage amplifier, and an amplifier 352 which is an amplifier inserted in the signal line 32 and is a next-stage amplifier. It has. The signal line 32 includes a signal line 321 on the input side to which a high-frequency signal is input, a signal line 322 connecting the amplifier 351 and the amplifier 352, and a signal line 323 on the output side for outputting a high-frequency signal. I have.

  The first-stage amplifier 351 has an input terminal, an output terminal, and two ground terminals. The input terminal of the amplifier 351 is connected to the signal line 321, the output terminal is connected to the signal line 322, and the two ground terminals are connected to the ground pattern 131 and the ground pattern 132, respectively.

  Similarly, the next-stage amplifier 352 also has an input terminal, an output terminal, and two ground terminals. The input terminal of the amplifier 352 is connected to the signal line 322, the output terminal is connected to the signal line 323, and the two ground terminals are connected to the ground pattern 131 and the ground pattern 132, respectively.

  The first-stage amplifier 351 amplifies the high-frequency signal input from the signal line 321 with a predetermined gain, and outputs the amplified signal to the signal line 322. The next-stage amplifier 352 amplifies the high-frequency signal amplified by the amplifier 351 with a predetermined gain, and outputs the amplified signal to the signal line 323.

  It is preferable to use an amplifier of a type called an LNA (Low Noise Amplifier) for the first-stage amplifier 351. The LNA is an amplifier that has a small gain but generates little noise, and can further improve the S / N ratio of the input first high-frequency signal.

  It is preferable to use an amplifier having a larger gain than the LNA as the amplifier 352 at the next stage. By using an amplifier having a large gain, it is possible to output a high-frequency signal having an amplitude suitable for the subsequent stage of the high-frequency transmission board 30.

  With such a configuration, the high-frequency transmission board 30 can transmit, amplify, and output the high-frequency signal input to the signal line 32 to a subsequent stage. In other words, the high-frequency transmission board 30 also functions as a high-frequency amplification board. Therefore, the high-frequency transmission device 3 according to the present embodiment also functions as a high-frequency amplifier.

  When the high-frequency transmission board 30 is viewed in a plan view, the signal lines 32 on the front surface and the ground patterns 14 on the rear surface face each other. Therefore, as shown in FIG. 3B, when the high-frequency transmission board 30 is viewed in cross section, the amplifier group 35 inserted into the signal line 32 faces the ground pattern 14 via the dielectric board 11. Further, as is clear from FIG. 1A, the amplifier group 35 provided on the front surface side of a certain dielectric substrate 11 faces the ground pattern 14 provided on the back surface side of the adjacent dielectric substrate 11. .

  As described above, in the high-frequency transmission device 3 according to the present embodiment, the amplifier group 35 is sandwiched between the ground patterns 14 from above and below. The amplifier group 35 is surrounded by upper and lower wall surfaces of the housing 20 from the left and right directions.

  Since the amplifier group 35 is surrounded on all sides by a conductor that is grounded, noise generated when the amplifier group 35 amplifies a high-frequency signal and an electric field generated by the amplified high-frequency signal are grounded. Shielded by the conductive material. Therefore, the high-frequency transmission device 3 according to the present embodiment can suppress transfer of the noise and the like to the high-frequency signal transmitted by the signal line 32 provided on another dielectric substrate 11. Therefore, even when an amplifier for amplifying a high-frequency signal is inserted into the signal line 32 as in the high-frequency transmission device 3 according to the present embodiment, crosstalk generated between the signal lines 32 can be suppressed.

  When the high-frequency transmission device 3 is arranged such that the upper and lower wall surfaces of the housing 20 are substantially parallel to the horizontal plane, the main surfaces (the front surface and the back surface) of the high-frequency transmission substrate 30 are arranged in parallel with the vertical direction. In this case, convection of air is likely to occur in the space separating the high-frequency transmission boards 30, so that the radiation efficiency of the high-frequency transmission board 30 can be increased, and as a result, the operational stability of the amplifier group 35 increases.

  Further, the ground pattern 13 and the ground pattern 14 also function as a dissipation layer that dissipates heat generated when the amplifier group 35 amplifies a high-frequency signal to the housing 20. Therefore, even when the amount of heat generated by the amplifier group 35 is large, the amplifier group 35 can be efficiently cooled.

  Also, in the high-frequency transmission device 3 according to the present embodiment, it is preferable that the housing 20 includes a ventilation port 22 provided on a wall surface. Since the air vent 22 is provided, the air inside the housing 20 can be circulated, so that the amplifier group 35 can be cooled more efficiently.

  Since the amplifier group 35 can be cooled more efficiently, deterioration of the S / N ratio due to thermal noise can be suppressed.

  In the present embodiment, the amplifier group 35 has been described as being configured by the two-stage amplifiers 351 and 352. However, the number of stages of the amplifiers constituting the amplifier group 35 is not limited to two. The amplifier group 35 may be configured by a single amplifier, or may be configured by three or more stages of amplifiers.

[First Modification]
A high-frequency transmission device according to a first modification of the second embodiment will be described with reference to FIG. The high-frequency transmission device 4 according to the present modification is obtained by modifying the arrangement of the signal lines 32 and the amplifier groups 35 in the high-frequency transmission substrate 30 shown in FIG. 3 like the high-frequency transmission substrate 40 shown in FIG. Hereinafter, the high-frequency transmission board 40 according to the present modification will be described.

  FIG. 4A is a top view illustrating the configuration of the high-frequency transmission board 40. FIG. FIG. 4B is a front view of the high-frequency transmission device 4 according to the present modification, showing the arrangement of the four high-frequency transmission substrates 40a, 40b, 40c, and 40d accommodated in the high-frequency transmission device 4. FIG. The front view of the high-frequency transmission device 4 refers to the first direction (the y-axis direction in the coordinate system illustrated in FIG. 4B) in which the signal line 42 extends in the first direction. Means a plan view obtained when viewed from the negative direction side. In FIG. 4B, the housing 20 is not shown for easy understanding. These also apply to FIGS. 5, 6 and 9 described later.

  As shown in FIG. 4A, a signal line 42, a ground pattern 43 provided so as to sandwich the signal line 42, and a signal line 42 are formed on the surface of the dielectric substrate 11 of the high-frequency transmission substrate 40. An inserted amplifier group 45 is provided. The signal line 42 includes signal lines 421, 422, and 423. The amplifier group 45 includes a first-stage amplifier 451 and a second-stage amplifier 452. The ground pattern 14 facing the signal line 42 is provided on the back side of the dielectric substrate 11 of the high-frequency transmission board 40.

  In the high-frequency transmission board 40, the width of one ground pattern 431 of the ground patterns 43 on the front side is formed to be wider than the width of the other ground pattern 432.

  When the high-frequency transmission board 40 is accommodated in the housing 20 of the high-frequency transmission device 4, the amplifier group 45 (amplifiers 451 and 452) is located at a low position inside the housing 20 as shown in FIG. Be placed. In other words, the plurality of high-frequency transmission boards 40 are arranged such that the front surface and the back surface are parallel to the xy plane in the coordinate system illustrated in FIG. , The signal line 42 extends in the y-axis direction, and the amplifier group 45 (the amplifier described in the claims) inserted into the signal line 42 in each of the plurality of high-frequency transmission boards 40 is in the x-axis direction. It is arranged eccentrically.

  In this case, the width of the ground pattern 431 functioning as a radiation fin in the high-frequency transmission board 40 is wider than the width of the ground pattern 131 included in the high-frequency transmission board 30 shown in FIG. Therefore, the ground pattern 431 can more efficiently dissipate the heat of the amplifier group 45 into the air and cool the amplifier group 45 more efficiently.

  Further, inside the housing 20, the air warmed by the heat generated by the amplifier group 45 convects to a high position inside the housing 20, and a low position inside the housing 20 from the outside of the housing 20. Colder air flows in.

  Therefore, according to the high-frequency transmission device 4, the amplifier group 45 can be arranged at a position inside the housing 20 where the temperature is lower. Therefore, unnecessary rise in the temperature of the amplifier group 45 can be avoided.

[Second Modification]
A high-frequency transmission device according to a second modification of the second embodiment will be described with reference to FIG. The high-frequency transmission device 5 according to this modification is obtained by modifying the arrangement of the signal lines 32 and the amplifier groups 35 in the high-frequency transmission substrate 30 shown in FIG. 3 as in the high-frequency transmission substrate 50 shown in FIG. Hereinafter, the high-frequency transmission board 50 according to the present modification will be described.

  FIGS. 5A and 5B are top views illustrating the configuration of the high-frequency transmission board 50. FIG. FIG. 5C is a front view showing the configuration of the high-frequency transmission device 5 according to the present modification (the housing 20 is not shown), and includes four high-frequency transmission substrates housed in the high-frequency transmission device 5. It is a front view showing arrangement of 50a, 50b, 50c, and 50d.

  As shown in FIGS. 5A and 5C, on the front side of the dielectric substrate 11 of the high-frequency transmission boards 50a and 50c, a signal line 52a and a ground pattern 53a provided so as to sandwich the signal line 52a are provided. And an amplifier group 55a inserted into the signal line 52a. The signal line 52a includes signal lines 521, 522, and 523. The amplifier group 55a includes a first-stage amplifier 551 and a second-stage amplifier 552. The ground pattern 14 facing the signal line 52a is provided on the back side of the dielectric substrate 11 of the high-frequency transmission boards 50a and 50c.

  In the high-frequency transmission boards 50a and 50c, of the ground patterns 53a on the front surface side, the width of one ground pattern 531 is formed to be wider than the width of the other ground pattern 532.

  On the other hand, as shown in FIGS. 5B and 5C, a signal line 52b and a ground provided so as to sandwich the signal line 52b are provided on the surface side of the dielectric substrate 11 of the high-frequency transmission boards 50b and 50d. A pattern 53b and an amplifier group 55b inserted into the signal line 52b are provided. The signal line 52b includes signal lines 524, 525, and 526. The amplifier group 55b includes a first-stage amplifier 553 and a second-stage amplifier 554. The ground pattern 14 facing the signal line 52b is provided on the back side of the dielectric substrate 11 of the high-frequency transmission boards 50b and 50d.

  In the high-frequency transmission boards 50b and 50d, of the ground patterns 53b on the front surface side, the width of one ground pattern 533 is formed to be smaller than the width of the other ground pattern 534.

  When the high-frequency transmission board 50 is housed in the housing 20 of the high-frequency transmission device 5, the amplifier group 55a (amplifiers 551 and 552) of the high-frequency transmission boards 50a and 50c is, as shown in FIG. The amplifier group 55b (amplifiers 553, 554) of the high-frequency transmission boards 50b, 50d is arranged at a high position inside the housing 20.

  In other words, the plurality of high-frequency transmission boards 50 are arranged such that the front surface and the back surface are parallel to the xy plane in the coordinate system illustrated in FIG. , The signal lines 52a and 52b are extended in the y-axis direction, and the amplifier groups 55a and 55b respectively inserted into the signal lines 52a and 52b in each of the plurality of high-frequency transmission boards 50 (see the claims). Amplifiers) are arranged offset in the x-axis direction.

  According to the above configuration, each of the amplifiers (amplifier group) arranged on the adjacent dielectric substrate 11 is different from the high-frequency transmission device 3 according to the second embodiment and the high-frequency transmission device 4 according to the first modification. The distance between 55a and the amplifier group 55b) can be increased.

  Therefore, the high-frequency transmission device 5 can further suppress the influence of heat between the amplifiers (the amplifier group 55a and the amplifier group 55b) arranged on the adjacent dielectric substrate 11. As a result, deterioration of the S / N ratio due to thermal noise can be further suppressed.

[Third Modification]
A high-frequency transmission device according to a third modification of the second embodiment will be described with reference to FIG. In the high-frequency transmission device 6 according to this modification, the arrangement of the signal line 32 and the amplifier group 35 in the high-frequency transmission substrate 30 shown in FIG. 3 is changed to a high-frequency transmission substrate 60 shown in FIGS. Obtained by deformation. In other words, the high-frequency transmission device 6 according to the present modification differs from the high-frequency transmission substrates 50a, 50b, 50c, and 50d housed in the high-frequency transmission device 5 according to the second modification shown in FIG. The amplifier groups 55a and 55b in the high-frequency transmission board 50 according to the second modification are replaced with the high-frequency transmission boards 60a, 60b, 60c, and 60d shown in FIGS. It is obtained by displacing in the first direction which is the extending direction. Hereinafter, the high-frequency transmission board 60 according to the present modification will be described.

  6A and 6B are top views showing the configuration of the high-frequency transmission board 60. FIG. FIG. 6C is a side view showing the configuration of the high-frequency transmission device 6 according to the present modification (the housing 20 is not shown), and four high-frequency transmission substrates accommodated in the high-frequency transmission device 6. It is a side view which shows the relative relationship on the xy plane of amplifier group 65a, 65b arrange | positioned at 60a, 60b, 60c, 60d.

  As shown in FIG. 6A, a signal line 62a, a ground pattern 53a provided so as to sandwich the signal line 62a, and a signal line are provided on the surface side of the dielectric substrate 11 of the high-frequency transmission boards 60a and 60c. And an amplifier group 65a inserted in 62a. The signal line 62a includes signal lines 621, 622, and 623. The amplifier group 65a includes a first-stage amplifier 651 and a second-stage amplifier 652. The ground pattern 14 facing the signal line 62a is provided on the back side of the dielectric substrate 11 of the high-frequency transmission boards 60a and 60c. In the high-frequency transmission boards 60a and 60c, the amplifier group 65a is eccentrically arranged in the negative y-axis direction.

  On the other hand, as shown in FIG. 6B, on the surface side of the dielectric substrate 11 of the high-frequency transmission boards 60b and 60d, a signal line 62b, a ground pattern 53b provided so as to sandwich the signal line 62b, And an amplifier group 65b inserted into the signal line 62b. The signal line 62b includes signal lines 624, 625, and 626. The amplifier group 65b includes a first-stage amplifier 653 and a second-stage amplifier 654. The ground pattern 14 facing the signal line 62b is provided on the back side of the dielectric substrate 11 of the high-frequency transmission boards 60b and 60d. In the high-frequency transmission boards 60b and 60d, the amplifier group 65b is eccentrically arranged in the positive y-axis direction.

  In other words, the plurality of high-frequency transmission boards 60 are arranged such that the front and back surfaces are parallel to the xy plane in the coordinate system shown in FIG. , The signal lines 62a and 62b extend in the y-axis direction, and the amplifier groups 65a and 65b inserted into the signal lines 62a and 62b in each of the plurality of high-frequency transmission boards 60 (see the claims). Amplifiers) are arranged offset from each other in the x-axis direction and the y-axis direction. Since the amplifier groups 65a and 65b are arranged so as to be shifted from each other in the x-axis direction and the y-axis direction, the distance between the amplifier groups 65a and 65b is further increased as shown in the side view of FIG. be able to.

  Therefore, according to the high-frequency transmission device 6, the influence of heat between the amplifiers (the amplifier group 65a and the amplifier group 65b) arranged on the adjacent dielectric substrate 11 is reduced by the high-frequency transmission device 5 according to the second modification. It can be further suppressed. As a result, deterioration of the S / N ratio due to thermal noise can be further suppressed.

[Third embodiment]
A high-frequency transmission device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7A is a top view illustrating a configuration of a high-frequency transmission board 70 included in the high-frequency transmission device 7 according to the present embodiment. FIG. 7B is a cross-sectional view illustrating a configuration of the high-frequency transmission board 70, and is a cross-sectional view taken along line CC ′ illustrated in FIG.

  The high-frequency transmission device 7 according to the present embodiment is obtained by replacing the high-frequency transmission substrate 10 (see FIG. 1) provided in the high-frequency transmission device 1 according to the first embodiment with a high-frequency transmission substrate 70 shown in FIG. is there. Hereinafter, the high-frequency transmission board 70 according to the present embodiment will be described. The same members as those of the high-frequency transmission board 10 described above are denoted by the same reference numerals, and description thereof will be omitted. The high-frequency transmission device 7 according to the present embodiment in which the high-frequency transmission board 70 shown in FIG.

  As shown in FIG. 7A, the high-frequency transmission board 70 is located along the side of the front-side ground patterns 131 and 132 facing the signal line as compared with the high-frequency transmission board 10 according to the first embodiment. The difference is that a short post group 16a arranged in a fence shape is further provided. The short post group 16a includes a plurality of short posts 16ai (i is a positive integer).

  Further, each of the high-frequency transmission boards 70 is a short-circuit arranged in a fence along the side gripped by the grip portion 21 of the housing 20 among the four sides forming the ground pattern 13 on the front surface side of the dielectric substrate 71. A post group 16b may be provided. The short post group 16b includes a plurality of short posts 16bi (i is a positive integer).

  Each of the short-circuit post groups 16a and 16b short-circuits the ground pattern 13 on the front side and the ground pattern 14 on the rear side. In the present embodiment, when it is not necessary to distinguish the short-circuit post groups 16a and 16b, they are simply referred to as a short-circuit post group 16.

  Each of the plurality of shorting posts forming the shorting post group 16 is a conductor filled inside a through hole formed to penetrate the dielectric substrate 71 or a conductive member formed on an inner wall of the through hole. Consists of a body. The upper end of the group of shorting posts 16 contacts the ground pattern 13, and the lower end of the group of shorting posts 16 contacts the ground pattern 14. That is, the shorting post group 16 short-circuits the ground pattern 13 and the ground pattern 15 facing each other.

  The plurality of shorting post groups 16a short-circuit the ground pattern 131 and the ground pattern 132 sandwiching the signal line 12 via the ground pattern 14, so that the short-circuiting post group 16a does not have the short-circuiting post group 16a. The potentials of the ground patterns 131 and 132 functioning as ground patterns can be made to match each other well.

  According to the above configuration, the transmission characteristics of the coplanar waveguide including the signal line 12 and the ground patterns 131 and 132 can be further improved.

  In addition, by providing the plurality of short-circuit post groups 16b, the ground pattern 13 is in contact with the ground pattern 14 along the side gripped by the grip portion 21 of the housing 20, in addition to the side facing the signal line 12. Short-circuited. Therefore, since the ground pattern 13 and the ground pattern 14 can be short-circuited by more short-circuit posts, the potential distribution of the ground pattern 13 and the potential distribution of the ground pattern 14 can be made more uniform.

(Spacing between shorting posts)
Here, the signal lines 12 included in each of the four high frequency transmission substrate 70 is to lambda ₁ shortest effective wavelength of the effective wavelength of a high-frequency signal to be transmitted. Further, as shown in FIGS. 7A and 7B, the center axis interval between two short-circuit posts 16 _ai facing each other via the signal line 12 among the two short-circuit posts belonging to the short-circuit post group 16 a is set to a width. W _16ax . In the high frequency transmission apparatus 7, the width _{W 16Ax} is preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, the high-frequency signal transmitted through the signal line 12 can be regarded as one in which the ground patterns 131 and 132 sandwiching the signal line 12 are grounded at one point. Therefore, the high-frequency transmission board 70 functions as a better coplanar waveguide than the high-frequency transmission board 10.

As shown in FIG. 7A, two adjacent short-circuit posts 16a _i arranged along the same side of the ground pattern 13 on the front surface among the two short-circuit posts belonging to the short-circuit post group 16a. , 16a _{i + 1} is _defined as a width W _16ay . In the high frequency transmission apparatus 7, the width _{W 16Ay} is preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, the short-circuit post group 16a, which is a pair of short-circuit post groups along the signal line 12, functions as a shielding wall for an electric field generated by the high-frequency signal transmitted by the signal line 12. Therefore, the short-circuit post group 16a can further suppress crosstalk between the high-frequency signal transmitted by the signal line 12 and the high-frequency signal transmitted by the signal line 12 provided on the adjacent dielectric substrate 71.

In the present embodiment, the center axis interval between two short-circuit posts adjacent to each other among the two short-circuit posts belonging to the short-circuit post group 16b is configured to be equal to the width _W16ay .

[Fourth embodiment]
A high-frequency transmission device according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a top view showing the configuration of the high-frequency transmission board 80 provided in the high-frequency transmission device 8 according to the present embodiment. The high-frequency transmission device 8 according to the present embodiment is obtained by replacing the high-frequency transmission substrate 10 (see FIG. 1) provided in the high-frequency transmission device 1 according to the first embodiment with a high-frequency transmission substrate 80 shown in FIG. is there. Hereinafter, the high-frequency transmission board 80 according to the present embodiment will be described. The same members as those of the high-frequency transmission board 10 described above are denoted by the same reference numerals, and description thereof will be omitted. Further, the high-frequency transmission device 8 according to the present embodiment in which the high-frequency transmission board 80 illustrated in FIG.

  The high-frequency transmission board 80 according to the present embodiment is obtained by adding a notch 801 to the high-frequency transmission board 40 according to the first modification. Specifically, as shown in FIG. 8, a cutout 801 is formed in each of the high-frequency transmission boards 80 so that the space on the front side and the space on the back side of the dielectric substrate 81 communicate with each other.

  As described above, by providing the notch 801 in the high-frequency transmission board 80, the air in the space on the front side and the air in the space on the back side can convect each other. In other words, in the high-frequency transmission device 8 in which the four high-frequency transmission boards 80 are accommodated in the housing 20, the space inside the housing 20 and divided by the four high-frequency transmission boards 80 is: All are in communication. Further, the space inside the case 20 and the space outside the case 20 communicate with each other via the ventilation hole 22 formed in the wall surface of the case 20.

  According to the high-frequency transmission device 8 configured as described above, the cold air existing outside the housing 20 (1) flows into the inside of the housing 20 from the ventilation port 22 b provided on the side surface of the housing 20. (2) Diffusion through the notch 801 provided in the high-frequency transmission board 80 into each of the spaces partitioned by the four high-frequency transmission boards 80.

  The cool air diffused into the space defined by the four high-frequency transmission boards 80 changes to warm air by cooling the amplifier group 45, which is a main heat source. This warm air (3) convects to the upper part of the space defined by the four high-frequency transmission boards 80, and (4) is discharged to the outside of the housing 20 from the ventilation port 22 a provided on the upper surface of the housing 20. Is done.

  Therefore, the high-frequency transmission device 8 can efficiently discharge heat generated inside the housing 20 (mainly heat generated by the amplifier group 45) to the outside of the housing 20. In other words, the high-frequency transmission device 8 can efficiently cool the high-frequency transmission board 80 (mainly the amplifier group 45).

  In the present embodiment, each of the high-frequency transmission boards 80 has three notches 801. However, the number of cutouts 801 provided in each of the high-frequency transmission boards 80 is not limited to three.

  In the present embodiment, the notch 801 is formed so as to cut out from one of two long sides (sides held by the holding unit 21 of the housing 20) of the high-frequency transmission board 80. However, the high-frequency transmission board 80 may include an opening for communicating the space on the front side and the space on the back side of the dielectric substrate 81 instead of the notch 801. Note that the shapes of the notch 801 and the opening formed in the high-frequency transmission board 80 are not limited to rectangles.

  In the present embodiment, the notch 801 is provided only in one of the ground patterns 831 of the ground pattern 83 that sandwiches the signal line 42. However, the notch 801 may be provided in both ground patterns 831 and 832 of the ground pattern 83.

[Fifth Embodiment]
A high-frequency transmission device according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9A is a top view illustrating a configuration of a high-frequency transmission board 90 included in the high-frequency transmission device 9 according to the present embodiment. FIG. 9B is a front view showing the configuration of the high-frequency transmission device 9 (the housing 20 is not shown) and shows the arrangement of four high-frequency transmission substrates 90 housed in the high-frequency transmission device 9. It is a front view.

  The high-frequency transmission device according to the present embodiment is obtained by replacing the high-frequency transmission substrate 10 (see FIG. 1) provided in the high-frequency transmission device 1 according to the first embodiment with a high-frequency transmission substrate 90 shown in FIG. . Hereinafter, the high-frequency transmission board 90 according to the present embodiment will be described.

  The high-frequency transmission board 90 according to the present embodiment is different from the high-frequency transmission board 10 according to the first embodiment in that signal lines are provided on the front and back of the dielectric substrate, respectively. Hereinafter, this point will be described with reference to FIG.

  The dielectric substrate 91 of the high-frequency transmission substrate 90 includes a signal line 92, a ground pattern 93, a signal line 96, and a ground pattern 97.

  The signal line 92 is a signal line provided on the surface of the dielectric substrate 91 and extends in the y-axis direction of the coordinate system shown in FIG.

  The ground pattern 93 is a ground pattern provided on the surface of the dielectric substrate 91, and is provided so as to sandwich the signal line 92. The ground pattern 93 includes ground patterns 931 and 932.

  The signal line 96 is a signal line provided on the back surface of the dielectric substrate 91 and extends in the y-axis direction of the coordinate system shown in FIG.

  The ground pattern 97 is a ground pattern provided on the back surface of the dielectric substrate 91, and is provided so as to sandwich the signal line 96. The ground pattern 97 includes ground patterns 971 and 972.

  As shown in FIGS. 9A and 9B, the signal line 92 is opposed to the ground pattern 972 via the dielectric substrate 91, and the signal line 96 is connected to the ground pattern via the dielectric substrate 91. 931.

  Therefore, when the high-frequency transmission board 90 is compared with the high-frequency transmission board 10 according to the first embodiment, the dielectric substrate 91 further includes a signal line 96 for transmitting a high-frequency signal disposed on the back side, Signal line 96 is sandwiched between the ground pattern 97 on the back side and can also be expressed as opposing the ground pattern 93 on the front side.

  As shown in FIG. 9B, in the high-frequency transmission boards 90a to 90c of the four high-frequency transmission boards 90, the signal line 92 on the front side is (1) in the vertical direction (in FIG. 9B) The z-axis direction in the illustrated coordinate system) is sandwiched by the ground pattern 972 on the back side, and (2) its left-right direction (x-axis direction in the coordinate system illustrated in FIG. 9B) is on the front side. Are sandwiched between the ground patterns 93.

  In the high-frequency transmission board 90d of the four high-frequency transmission boards 90, the signal line 92 on the front surface side is (1) vertically interposed between the ground pattern 972 on the back side and the wall surface of the housing 20. , (2) the horizontal direction (x-axis direction in the coordinate system shown in FIG. 9B) is sandwiched by the ground pattern 93 on the front surface side.

  Therefore, it can be said that the signal line 92 on the front surface side of the high-frequency transmission board 90 is surrounded on all sides by a grounded conductor.

  On the other hand, the signal lines 96 on the back side of the four high-frequency transmission boards 90 are also configured equivalently to the signal lines 92 on the front side, so that the signal lines 96 on the back side are conductors grounded on all sides. Can be described as being surrounded by

  Further, since the signal line 92 faces the ground pattern 97 and the signal line 96 faces the ground pattern 93, the signal line 92 does not face the signal line 96. Therefore, the distance between the signal line 92 and the signal line 96 formed on each of the adjacent high-frequency transmission boards 90 is equal to the distance between the signal line on the front side and the signal line on the back side formed on each of the adjacent high-frequency transmission boards 90. Are farther apart than when they face each other.

  According to the above configuration, since the four sides of the signal lines 92 and 96 are surrounded by the grounded conductor and the distance between the signal lines 92 and 96 is large, the signal lines 92 and 96 are formed between the signal lines 92 and 96. The obtained crosstalk can be suppressed.

  In addition, the high-frequency transmission device 9 including the four high-frequency transmission substrates 90 includes the signal lines 92 and 96 on the front and back of the dielectric substrate 91, respectively, and thus is compared with the high-frequency transmission device 1 according to the first embodiment. It has twice as many signal lines. In other words, the high-frequency transmission device 9 according to the present embodiment can double the signal line mounting density while having the same size as the high-frequency transmission device 1 (see FIG. 1) according to the first embodiment. .

  In other words, when a high-frequency transmission device provided with the same number of signal lines as the high-frequency transmission device 1 shown in FIG. 1 is realized using the high-frequency transmission board 90 shown in FIG. It suffices if two high-frequency transmission boards 90 are provided. Therefore, the size of the high-frequency transmission device can be further reduced without reducing the number of signal lines.

  As described above, the high-frequency transmission device according to the present embodiment suppresses the crosstalk generated between the signal lines and reduces the mounting density of the signal lines by 2 in comparison with the high-frequency transmission device 1 according to the first embodiment. Can be doubled. In other words, the size can be further reduced while suppressing the crosstalk generated between the signal lines.

  Note that, in the high-frequency transmission device according to the present embodiment, as described in each of the second to fourth embodiments, an amplifier (or an amplifier group) may be inserted into each of the signal lines.

  When amplifiers are inserted in each of the signal lines 92 and 96, these amplifiers are arranged on both sides of the dielectric substrate 91 in a balanced manner. Therefore, the amplifier, which is a heat source, does not concentrate on one surface of the dielectric substrate 91, and the problem of warpage due to thermal contraction of the dielectric substrate 91 can be solved. Further, since the amplifiers are arranged on both the front and back surfaces of the dielectric substrate 91 in a well-balanced manner, the operation of the amplifier becomes unstable due to a rise in the temperature of one surface of the dielectric substrate, and thermal noise in the amplifier is reduced. It is possible to solve the problem that the S / N ratio of the high frequency signal is deteriorated due to the increase.

(Inner layer)
Further, as shown in FIG. 9B, the dielectric substrate 91 of the high-frequency transmission substrate 90 may include an inner layer 913 that separates the first dielectric layer 911 and the second dielectric layer 912. preferable. The inner layer 913 is a thin film or a thin plate made of a conductor, and is grounded via the grip 21. That is, the inner layer 913 functions as a ground.

  The inner layer 913 provided on the dielectric substrate 91 electromagnetically shields the signal lines 92 and 96 provided on the front and back of the dielectric substrate 91. Therefore, since the dielectric substrate 91 includes the inner layer 913, crosstalk between the signal lines 92 and 96 provided on the same dielectric substrate 91 can be suppressed.

(Application example of the present invention)
An application example of the present invention will be described with reference to FIG. FIG. 10A is a block diagram illustrating a configuration of a high-frequency signal transmission system 100 including the high-frequency transmission device 3 according to the second embodiment, and FIG. FIG. 2 is a block diagram illustrating a configuration of a signal transmission / reception system 110.

  The high-frequency signal transmission system 100 includes an antenna 101 that receives a high-frequency signal transmitted from a base station, a receiver 102 that receives a high-frequency signal received by the antenna 101, and a transmission that transmits a high-frequency signal from the antenna 101 to the receiver 102. And a cable 103 (see FIG. 10A). The transmission cable 103 may be a metal cable or an active optical cable.

  In such a high-frequency signal transmission system 100, the high-frequency transmission device 3 can be used by being inserted into a connection between the antenna 101 and the transmission cable 103 and a connection between the transmission cable 103 and the receiver 102.

  Note that, in this application example, the high-frequency transmission device 3 in which the high-frequency transmission board 30 (see FIG. 3) including the amplifier that amplifies the high-frequency signal transmitted by the signal line is accommodated in the housing 20 is described as an example. Instead of the high-frequency transmission board 30 shown in FIG. 3, a high-frequency transmission device in which a high-frequency transmission board not including an amplifier is housed in the housing 20 can be applied. For example, the high-frequency transmission board 10 shown in FIGS. The high-frequency transmission device 1 according to the first embodiment housed in the body 20 or the high-frequency transmission device 9 according to the fifth embodiment in which the high-frequency transmission board 90 shown in FIG. It can also be applied to systems. In that case, a separate amplifier may be inserted after the high-frequency transmission devices 1 and 9.

  Of course, in addition to the above, the high-frequency transmission device 7 according to the third embodiment in which the high-frequency transmission board 70 shown in FIG. The high-frequency transmission device 8 according to the fourth embodiment can also be applied to the above-described high-frequency signal transmission system.

  The high-frequency signal transmission / reception system 110 includes an antenna 111, a high-frequency transmission / reception device 112, transmission cables 113a and 113b, and a duplexer 114. The antenna 111 is an antenna that can transmit and receive a high-frequency signal. The high-frequency transceiver 112 receives a high-frequency signal received by the antenna 111 and generates a high-frequency signal to be transmitted via the antenna 111. The transmission cable 113a is a transmission cable for transmitting a high-frequency signal from the antenna 111 to the high-frequency transceiver 112, and the transmission cable 113b is a transmission cable for transmitting a high-frequency signal from the high-frequency transceiver 112 to the antenna 111. The duplexer 114 electrically separates the reception path and the transmission path of the high-frequency signal, and enables the antenna 111 to be shared.

  Also in such a high-frequency signal transmission / reception system 110, the high-frequency transmission device 3 includes a connection portion between the duplexer 114 and the transmission cable 113a, a connection portion between the transmission cable 113a and the high-frequency transceiver 112, and a high-frequency transmission / reception device 112 and the transmission cable 113b. And the connection between the transmission cable 113b and the duplexer 114 can be used.

  The present invention is not limited to the embodiments described above, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

[Summary]
In order to reduce the area required for mounting while suppressing crosstalk between signal lines, a high-frequency transmission device according to an embodiment of the present invention includes a plurality of high-frequency transmission boards and the plurality of high-frequency transmission boards. A housing for accommodating, each of the plurality of high-frequency transmission substrates includes a dielectric substrate, a signal line formed on a surface of the dielectric substrate, and a dielectric line of the dielectric substrate facing the signal line. A ground pattern formed on the back surface, wherein the plurality of high-frequency transmission boards are configured such that, of two adjacent high-frequency transmission boards, a signal line of one high-frequency transmission board is connected to a ground pattern of the other high-frequency transmission board. It is characterized by being supported by the housing so as to face each other.

  According to the above configuration, the plurality of high-frequency transmission boards are arranged in an overlapping manner. Therefore, the area required for mounting the high-frequency signal transmission device can be reduced as compared with the case where a plurality of high-frequency transmission substrates are arranged side by side. Moreover, the signal line of each high-frequency transmission board is sandwiched between the ground pattern of the high-frequency transmission board and the ground pattern of the high-frequency transmission board adjacent to the high-frequency transmission board, and is shielded by these two ground patterns. Therefore, crosstalk between signal lines of each high-frequency transmission board can be suppressed.

  Therefore, in the high-frequency transmission device having a plurality of signal lines, the area required for mounting the high-frequency transmission device can be reduced while suppressing crosstalk between the signal lines.

  Further, in the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission substrates is a ground pattern formed on a surface of the dielectric substrate, and is arranged so as to sandwich the signal line. It is preferable to further include a pair of ground patterns.

  According to the above configuration, a coplanar waveguide can be formed by the signal lines formed on the surface of the dielectric substrate and the pair of ground patterns.

In the high frequency transmission apparatus according to an embodiment of the present invention, the plurality in each of the high frequency transmission substrate, the effective wavelength of a high-frequency signal from which the signal line is transmitted as lambda _1, the pair of sandwiching the signal line interval of the ground pattern is preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, the signal lines and the pair of ground patterns formed on the surface of the dielectric substrate function as good coplanar waveguides. Therefore, the high-frequency transmission board can further suppress the crosstalk between the signal line on the front side and the signal line on the back side.

  Further, in the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission boards is a short-circuit post arranged in a fence along a side of the pair of ground patterns facing the signal line. Preferably, the apparatus further includes a group of short-circuit posts for short-circuiting the pair of ground patterns and the ground pattern.

  According to the above configuration, the pair of ground patterns sandwiching the signal line is short-circuited via the ground pattern formed on the back surface. Therefore, the potentials of the pair of ground patterns sandwiching the signal line better match in the vicinity of the signal line. Thereby, the high-frequency transmission circuit functions as a better coplanar waveguide.

In the high frequency transmission apparatus according to an embodiment of the present invention, in each of the plurality of high frequency transmission substrate, the effective wavelength of a high-frequency signal from which the signal line is transmitted as lambda _1, 2 single shorting belonging to the short posts group among the post, the central axis spacing of two short posts opposing each other via the signal line is preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, two ground patterns sandwiching each of the signal lines can be regarded as being in a state of being grounded at one point. Thus, the high-frequency transmission circuit functions as a better coplanar waveguide.

In the high frequency transmission apparatus according to an embodiment of the present invention, in each of the plurality of high frequency transmission substrate, the effective wavelength of a high-frequency signal from which the signal line is transmitted as lambda _1, 2 single shorting belonging to the short posts group among the post, the central axis spacing of two short posts adjacent to each other disposed along the same side of the ground pattern of the pair, preferably at 0.1 × lambda ₁ or less.

  According to the above configuration, the short-circuit post group functions as a shielding wall for an electric field generated by the high-frequency signal transmitted by the signal line. Accordingly, it is possible to prevent a high-frequency signal transmitted by a signal line from being transferred to another high-frequency signal transmitted by a signal line provided on a dielectric substrate of an adjacent high-frequency transmission substrate. Therefore, the present high-frequency transmission device can further suppress crosstalk between signal lines.

  In the high-frequency transmission device according to one embodiment of the present invention, in each of the plurality of high-frequency transmission boards, an amplifier that amplifies a high-frequency signal transmitted by the signal line is inserted in the signal line. preferable.

  According to the above configuration, it is possible to amplify the high-frequency signal transmitted by the signal line on the front side. That is, the present high-frequency transmission device also functions as a high-frequency amplifier.

  Further, in the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission substrates is arranged such that the front and back surfaces of the dielectric substrate are parallel to the xy plane, In each of the high-frequency transmission boards, the signal line extends in the y-axis direction, and in each of the plurality of high-frequency transmission boards, the amplifier inserted in the signal line is arranged in the x-axis direction and / or the y-axis direction. It is preferable that they are staggered.

  According to the above configuration, the distance between the amplifiers provided on each of the adjacent high-frequency transmission boards can be increased. According to this, since the influence of heat between the amplifiers provided on the respective adjacent dielectric substrates can be further suppressed, the deterioration of the S / N ratio due to thermal noise can be further suppressed.

  In the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission boards has an opening or notch for communicating a space on the front side and a space on the back side of the high-frequency transmission board. Preferably, it is formed.

  According to the above configuration, the space inside the housing and separated by the dielectric substrate communicates with each other. According to this, since the flow of the air in the space divided by the dielectric substrate is promoted, each part inside the housing can be cooled more efficiently.

  Further, in the high-frequency transmission device according to one embodiment of the present invention, each of the plurality of high-frequency transmission boards is arranged so that a front surface and a back surface of the dielectric substrate are parallel to a vertical direction, and It is preferable that an opening is formed in the wall surface.

  According to the above configuration, the cold air outside the housing can easily flow into the housing through the opening of the housing. In addition, the air warmed by the high-frequency transmission board inside the housing can easily flow out of the housing through the opening of the housing. According to this, the natural convection (circulation in the vertical direction) of the air inside and outside the housing is facilitated, so that the high-frequency transmission board can be cooled more efficiently.

  Further, in the high-frequency transmission device according to one embodiment of the present invention, the housing is made of a conductor and grounded, and each of the plurality of high-frequency transmission boards is such that the ground pattern is grounded via the housing. Is preferred.

  According to the above configuration, the signal lines included in each of the plurality of high-frequency transmission boards are surrounded on all sides by a conductor that is grounded. Thereby, the shielding effect can be further improved.

  In this specification, "A and / or B" represents both "A and B" and "A or B". Further, in this specification, “A and / or B” represents both “A and B” and “A or B”.

  INDUSTRIAL APPLICATION This invention can be utilized for the high frequency transmission apparatus provided with the several signal line which transmits a high frequency signal.

1,3,4,5,6,7,8,9 High frequency transmission device 10,30,40,50,60,70,80,90 High frequency transmission substrate 11,71,81,91 Dielectric substrate 11a Front surface 11b Back surface 12, 32, 42, 52a, 52b, 62a, 62b, 92 Signal line (front side)
13, 43, 53a, 53b, 83, 93 Ground pattern (front side)
14, 84, 87 Ground pattern (back side)
Reference Signs List 20 housing 21 gripping part 22 ventilation opening (opening)
35, 45, 55a, 55b, 65a, 65b, Amplifier group (amplifier)
801 notch 96 signal line (back side)
913 Inner layer

Claims (11)

A plurality of high-frequency transmission boards, and a housing for housing the plurality of high-frequency transmission boards,
Each of the plurality of high-frequency transmission boards is (1) a dielectric board, (2) a signal line on the front side formed on the surface of the dielectric board, and (3) a signal line formed on the surface of the dielectric board. A ground pattern on the front side, the ground pattern including a pair of ground patterns arranged so as to sandwich the signal line on the front side; and (4) facing the signal line on the front side. A ground pattern on the back surface formed on the back surface of the dielectric substrate,
The plurality of high-frequency transmission boards are arranged such that, of the two high-frequency transmission boards adjacent to each other, the signal line on the front side of one of the high-frequency transmission boards faces the ground pattern on the back side of the other high-frequency transmission board. Supported by
A high-frequency transmission device characterized by the above-mentioned. The shortest effective wavelength of the effective wavelength of a high-frequency signal, each of the signal lines of the surface side is transmitted as lambda _1, the spacing of the ground patterns of the above-mentioned surface side sandwiching the signal lines of the surface side, 0.1 × λ ₁ or less,
The high-frequency transmission device according to claim 1, wherein: Each of the plurality of high-frequency transmission boards further includes a signal line on the back side formed on the back side of the dielectric substrate,
The ground pattern on the back side includes a pair of ground patterns arranged so as to sandwich the signal line on the back side.
The plurality of high-frequency transmission boards are arranged such that, of two adjacent high-frequency transmission boards, the ground pattern on the front side of one high-frequency transmission board faces the signal line on the back side of the other high-frequency transmission board. Supported by the body,
As lambda ₁ shortest effective wavelength of the effective wavelength of a high-frequency signal, each of the signal lines and the back surface side of the signal line of the surface side is transmitted, the ground patterns of the above-mentioned surface side sandwiching the signal lines of the surface-side The interval between the ground patterns on the back side sandwiching the signal line on the back side is 0.1 × λ ₁ or less, respectively.
The high-frequency transmission device according to claim 1, wherein: In the case where the signal lines provided in each of the plurality of high-frequency transmission boards are only the signal lines on the front side, each of the signal lines on the front side has other members whose both ends constitute the high-frequency transmission board. Insulated from
When the signal line provided in each of the plurality of high-frequency transmission boards is both the front-side signal line and the back-side signal line, one of the front-side signal line and the back-side signal line or Both are insulated at both ends from other members constituting the high-frequency transmission board,
The high-frequency transmission device according to claim 2 or 3, wherein: When the signal lines provided on each of the plurality of high-frequency transmission boards are only the signal lines on the front side, each of the signal lines on the front side is the dielectric substrate on which the signal lines on the front side are formed. Is formed only on the surface of the dielectric substrate from one end to the other end of the dielectric substrate,
When the signal lines provided in each of the plurality of high-frequency transmission boards are both the signal line on the front side and the signal line on the back side, each of the signal lines on the front side is the signal line on the front side. Is formed only on the front surface of the dielectric substrate on which is formed from one end of the dielectric substrate to the other end, and / or each of the signal lines on the back surface side is Only on the back surface of the dielectric substrate on which the signal line on the back surface is formed, it is formed so as to extend from one end of the dielectric substrate to the other end,
The high-frequency transmission device according to any one of claims 2 to 4, wherein: Each of the plurality of high-frequency transmission boards is a first short-circuit post group arranged in a fence along a side of the ground pattern on the front side facing the signal line on the front side, and A first short-circuit post group that short-circuits the ground pattern and the ground pattern on the back side;
The high-frequency transmission device according to claim 1, wherein: Each of the plurality of high-frequency transmission substrates further includes a signal line on the back surface formed on the back surface of the dielectric substrate,
The ground pattern on the back side includes a pair of ground patterns arranged so as to sandwich the signal line on the back side.
Each of the plurality of high-frequency transmission boards short-circuits the ground pattern on the front surface and the ground pattern on the rear surface, which are arranged in a fence along the side facing the signal line on the rear surface of the ground pattern on the rear surface. A second group of shorting posts;
The high-frequency transmission device according to claim 6, wherein: In the case where the signal lines provided in each of the plurality of high-frequency transmission boards are only the signal lines on the front side, each of the signal lines on the front side has other members whose both ends constitute the high-frequency transmission board. Insulated from
When the signal line provided in each of the plurality of high-frequency transmission boards is both the front-side signal line and the back-side signal line, one of the front-side signal line and the back-side signal line or Both are insulated at both ends from other members constituting the high-frequency transmission board,
The high-frequency transmission device according to claim 7, wherein: When the signal lines provided on each of the plurality of high-frequency transmission boards are only the signal lines on the front side, each of the signal lines on the front side is the dielectric substrate on which the signal lines on the front side are formed. Is formed only on the surface of the dielectric substrate from one end to the other end of the dielectric substrate,
When the signal lines provided in each of the plurality of high-frequency transmission boards are both the signal line on the front side and the signal line on the back side, each of the signal lines on the front side is the signal line on the front side. Is formed only on the front surface of the dielectric substrate on which is formed from one end of the dielectric substrate to the other end, and / or each of the signal lines on the back surface side is Only on the back surface of the dielectric substrate on which the signal line on the back surface is formed, it is formed so as to extend from one end of the dielectric substrate to the other end,
The high-frequency transmission device according to claim 7 or 8, wherein: In each of the plurality of high-frequency transmission boards, the signal line on the front side and the ground pattern on the back side are opposed to each other, and the signal line on the back side and the ground pattern on the front side. Are facing each other,
The high-frequency transmission device according to any one of claims 7 to 9, wherein: Each of the plurality of high-frequency transmission boards is a first dielectric layer, a second dielectric layer, and interposed between the first dielectric layer and the second dielectric layer, and An inner layer separating the first dielectric layer and the second dielectric layer, the inner layer including an inner layer made of a conductor;
The high-frequency transmission device according to any one of claims 7 to 10, wherein:

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