JP6601385B2 - 学習用支持装置 - Google Patents
学習用支持装置 Download PDFInfo
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- JP6601385B2 JP6601385B2 JP2016253538A JP2016253538A JP6601385B2 JP 6601385 B2 JP6601385 B2 JP 6601385B2 JP 2016253538 A JP2016253538 A JP 2016253538A JP 2016253538 A JP2016253538 A JP 2016253538A JP 6601385 B2 JP6601385 B2 JP 6601385B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Control And Safety Of Cranes (AREA)
Description
1−1.学習用支持装置を用いた移載動作の学習
学習用支持装置の第一実施形態について、図面を参照して説明する。
図1に示すように、学習用支持装置1は、搬送対象の物品Wを支持する複数の物品支持部RPと、物品支持部RPから物品Wを受け取り又は物品支持部RPに物品Wを渡す移載動作を行う移載装置Tを備えると共に天井Cに沿って配置された軌道Rに沿って移動する天井搬送車Vと(図2も参照)、を備えた物品搬送設備Fに用いられる。
次に、本実施形態に係る学習用支持装置1の構成について図面を参照して説明する。
図1、図3〜図5に示すように、学習用支持装置1は、物品搬送設備Fが設置された建物内の固定構造体Sの垂直面に取り付けられる取付部10と、物品支持部RPと同様に物品Wを支持可能であって、移載装置Tによる移載動作のための調整量を計測する基準となる第一基準支持部20と、第一基準支持部20と取付部10とを連結する第一連結部30と、を備えている。第一基準支持部20が基準支持部に相当し、第一連結部30が連結部に相当する。
次に、学習用支持装置のその他の実施形態について説明する。
以下、上記において説明した学習用支持装置の概要について説明する。
10 :取付部
20 :第一基準支持部(基準支持部)
30 :第一連結部(連結部)
40 :第二基準支持部
50 :第二連結部
60 :規制部材
61 :第一リンク部材
62 :第二リンク部材
63 :支柱部材
F :物品搬送設備
FL :床面
P :処理装置
R :軌道
RP :物品支持部
S :固定構造体
T :移載装置
V :天井搬送車
W :物品
X :走行方向
Y :横方向
Z :垂直方向
Claims (5)
- 搬送対象の物品を支持する複数の物品支持部と、前記物品支持部から物品を受け取り又は前記物品支持部に物品を渡す移載動作を行う移載装置を備え、天井に沿って配置された軌道に沿って移動する天井搬送車と、を備えた物品搬送設備に用いられる学習用支持装置であって、
前記物品搬送設備が設置された建物内の固定構造体の垂直面に取り付けられる取付部と、
前記物品支持部と同様に物品を支持可能であって、前記移載装置による前記移載動作のための調整量を計測する基準となる基準支持部と、
前記基準支持部と前記取付部とを連結する連結部と、を備え、
前記連結部は、前記基準支持部が水平方向に沿う姿勢となり物品を支持可能なように展開された展開姿勢と、前記基準支持部が前記垂直面に沿う姿勢となるように折り畳まれた折り畳み姿勢とに、前記基準支持部の姿勢を変化させることができるように構成されている学習用支持装置。 - 前記物品支持部と同様に物品を支持可能であって、前記移載装置による前記移載動作のための調整量を計測する基準となる第二基準支持部を、前記基準支持部とは別に備えると共に、前記第二基準支持部と前記取付部とを連結する第二連結部を更に備え、
前記第二基準支持部は、前記基準支持部と垂直方向視での位置が同じであって高さが異なる位置に配置され、
前記第二連結部は、前記基準支持部とは独立に、前記第二基準支持部が水平方向に沿う姿勢となり物品を支持可能なように展開された展開姿勢と、前記第二基準支持部が前記垂直面に沿う姿勢となるように折り畳まれた折り畳み姿勢とに、前記第二基準支持部の姿勢を変化させることができるように構成されている請求項1に記載の学習用支持装置。 - 前記展開姿勢の前記基準支持部が、前記折り畳み姿勢に変化する側とは反対側に移動しないように規制する規制部材を更に備える請求項1又は2に記載の学習用支持装置。
- 前記規制部材は、前記基準支持部の姿勢変化に連動して、展開姿勢と折り畳み姿勢とに変化するように構成されている請求項3に記載の学習用支持装置。
- 前記規制部材は、第一リンク部材と、前記第一リンク部材と同じ長さを有し前記第一リンク部材と平行に前記第一リンク部材に対して上下方向に離間して配置された第二リンク部材と、支柱部材とを備え、
前記第一リンク部材及び前記第二リンク部材の一端部が前記取付部に回転自在に連結され、前記第一リンク部材及び前記第二リンク部材の他端部が前記支柱部材に回転自在に連結され、
前記基準支持部は、前記第一リンク部材及び前記第二リンク部材のいずれか一方である対象リンク部材に支持され、
前記支柱部材は、前記規制部材が展開姿勢である状態で前記支柱部材の下端部が床面に接地した支柱展開姿勢となり、前記規制部材が折り畳み姿勢である状態で前記支柱部材の下端部が床面から離れると共に前記支柱展開姿勢よりも前記取付部側に接近した支柱折り畳み姿勢となる請求項4に記載の学習用支持装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016253538A JP6601385B2 (ja) | 2016-12-27 | 2016-12-27 | 学習用支持装置 |
TW106139698A TWI752116B (zh) | 2016-12-27 | 2017-11-16 | 學習用支持裝置 |
KR1020170169356A KR102378775B1 (ko) | 2016-12-27 | 2017-12-11 | 학습용 지지 장치 |
CN201711445935.0A CN108242422B (zh) | 2016-12-27 | 2017-12-27 | 学习用支承装置 |
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JP2016253538A JP6601385B2 (ja) | 2016-12-27 | 2016-12-27 | 学習用支持装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018104150A JP2018104150A (ja) | 2018-07-05 |
JP6601385B2 true JP6601385B2 (ja) | 2019-11-06 |
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JP (1) | JP6601385B2 (ja) |
KR (1) | KR102378775B1 (ja) |
CN (1) | CN108242422B (ja) |
TW (1) | TWI752116B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS5132600Y2 (ja) * | 1971-02-18 | 1976-08-13 | ||
JPS6216707A (ja) * | 1985-07-17 | 1987-01-24 | 中村 一郎 | 壁面収納テ−ブル |
JP3000190U (ja) * | 1994-01-17 | 1994-08-02 | 曾 春 賢 | 折畳みブラケット |
JP2000243693A (ja) * | 1999-02-23 | 2000-09-08 | Nikon Corp | ステージ装置及び露光装置 |
JP4151002B2 (ja) * | 2001-10-19 | 2008-09-17 | 株式会社ダイフク | 吊下搬送設備とその学習装置 |
JP4277100B2 (ja) * | 2002-11-14 | 2009-06-10 | 東京エレクトロン株式会社 | 搬送機構の基準位置補正装置及び基準位置補正方法 |
JP2005230047A (ja) * | 2004-02-17 | 2005-09-02 | Yamaha Corp | 作業台 |
JP4720267B2 (ja) * | 2005-04-14 | 2011-07-13 | 村田機械株式会社 | 天井走行車システム |
JP5162899B2 (ja) * | 2006-12-28 | 2013-03-13 | 村田機械株式会社 | 被搬送物の保管装置 |
JP2009225937A (ja) * | 2008-03-21 | 2009-10-08 | Yazaki Ind Chem Co Ltd | 棚部を跳ね上げ可能なパイプ構造物 |
JP4688004B2 (ja) * | 2008-04-22 | 2011-05-25 | 株式会社ダイフク | 物品搬送装置 |
WO2010010795A1 (ja) * | 2008-07-23 | 2010-01-28 | 株式会社ダイフク | 物品搬送設備における学習装置及び学習方法 |
JP5403358B2 (ja) * | 2009-12-10 | 2014-01-29 | 株式会社ダイフク | 物品保管設備 |
JP5429570B2 (ja) * | 2010-03-08 | 2014-02-26 | 株式会社ダイフク | 物品搬送設備 |
JP5522477B2 (ja) * | 2010-12-17 | 2014-06-18 | 株式会社ダイフク | 搬送設備 |
JP5590420B2 (ja) * | 2011-12-21 | 2014-09-17 | 株式会社ダイフク | 物品搬送設備 |
JP2014010018A (ja) * | 2012-06-28 | 2014-01-20 | Seiko Epson Corp | ハンドラーおよび検査装置 |
JP6304084B2 (ja) * | 2015-03-16 | 2018-04-04 | 株式会社ダイフク | 物品搬送設備及び検査用治具 |
JP6487266B2 (ja) * | 2015-04-27 | 2019-03-20 | 日本電産サンキョー株式会社 | 製造システム |
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2016
- 2016-12-27 JP JP2016253538A patent/JP6601385B2/ja active Active
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2017
- 2017-11-16 TW TW106139698A patent/TWI752116B/zh active
- 2017-12-11 KR KR1020170169356A patent/KR102378775B1/ko active Active
- 2017-12-27 CN CN201711445935.0A patent/CN108242422B/zh active Active
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Publication number | Publication date |
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KR20180076300A (ko) | 2018-07-05 |
CN108242422A (zh) | 2018-07-03 |
TWI752116B (zh) | 2022-01-11 |
CN108242422B (zh) | 2023-04-11 |
JP2018104150A (ja) | 2018-07-05 |
TW201825378A (zh) | 2018-07-16 |
KR102378775B1 (ko) | 2022-03-24 |
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