JP6593827B2 - Electronic circuit board, power converter - Google Patents

Description

  The present invention relates to an electronic circuit board including a magnetic component configured using a pattern coil of a printed board, and a power converter.

  For example, in a power conversion device configured with an electronic circuit board, there is a configuration in which a surface-mount type semiconductor element is mounted on a printed board on which a pattern coil is formed, and the lower surface of the printed board is brought into contact with a cooler to radiate heat. In order to reduce the temperature of the pattern coil and the semiconductor element, in addition to the cooling performance of the lower surface of the printed circuit board, thermal interference between the pattern coil and the semiconductor element is also important. For example, as in Patent Document 1 below, there is a device that suppresses thermal interference by providing a through hole in a wiring that electrically connects a semiconductor element and a pattern coil, and radiating heat by bringing the through hole into contact with a cooler. .

JP 2010-109309 A

  When the printed circuit board is reduced in area, the position of the semiconductor element and the pattern coil, that is, the coil pattern is close, and the semiconductor element and the coil pattern interfere with each other in a portion other than the wiring connecting the semiconductor element and the coil pattern. When there are a plurality of semiconductor elements, the semiconductor elements also interfere with each other.

  An object of the present invention is to obtain a semiconductor element, an electronic circuit board, and a power conversion device that suppress thermal interference between mounting parts including a magnetic part formed of a coil pattern and a magnetic core, and the like.

The present invention relates to a multilayer printed board on which a coil pattern formed by a circuit pattern and a magnetic component formed by a magnetic core and a semiconductor element connected to the circuit pattern are mounted, and a side opposite to the mounting surface of the multilayer printed board A cooler disposed on the multi-layer printed circuit board, a heat-insulating insulating member disposed between the multi-layer printed circuit board and the cooler, and the coil pattern and the semiconductor element. And a plurality of screw fixing parts for fixing the cooler, and when viewed from a direction perpendicular to the main surface of the multilayer printed circuit board, the coil pattern and the semiconductor element are disposed between at least two of the coil patterns and the semiconductor element. comprising a radiating pattern, a, when viewed from a direction perpendicular to the main surface of the multilayer printed circuit board, the semiconductor element on a line connecting the two screw fixing portion There is disposed, in the heat radiation pattern and the screw fixing portion and the cooler electronic circuit board or the like connected respectively directly to have the thermal and electrical conductivity.

  According to the present invention, it is possible to provide an electronic circuit board and a power conversion device in which thermal interference is suppressed between a semiconductor element, a mounting part made of a magnetic part formed of a coil pattern and a magnetic core, and the like.

It is a perspective view of an example of a schematic structure of a power converter by each embodiment of this invention. It is an upper surface perspective view of an example of the multilayer printed circuit board of the power converter by each embodiment of this invention. It is a disassembled perspective view of the part of the magnetic component which is a component of the power converter device by each embodiment of this invention. It is a circuit diagram of an example of the power converter device by Embodiment 1 of this invention. It is a top perspective view of the copper foil pattern of each layer of the multilayer printed circuit board of the power conversion device according to embodiment 1 of the present invention. It is a figure for demonstrating the thermal radiation path | route of the power converter device by Embodiment 1 of this invention. It is a circuit diagram of an example of the power converter device by Embodiment 2 of this invention. It is an upper surface perspective view of the copper foil pattern of each layer of the multilayer printed circuit board of the power converter device by Embodiment 2 of this invention. It is a circuit diagram of an example of the power converter device by Embodiment 3 of this invention. It is an upper surface perspective view of the copper foil pattern of each layer of the multilayer printed board of the power converter device by Embodiment 3 of this invention. It is a figure explaining the curvature suppression of the printed circuit board in Embodiment 3 of this invention. It is a figure explaining the switching noise shielding in Embodiment 3 of this invention. It is sectional drawing of the screw fixing | fixed part in the power converter device by this invention. It is an image figure for demonstrating the thermal radiation path | route in the power converter device by this invention. It is a figure explaining the positional relationship of the screw fixing | fixed part and semiconductor element in Embodiment 3 of this invention. It is a figure explaining the positional relationship of the some semiconductor element in Embodiment 3 of this invention, and the screw fixing part of the circumference | surroundings.

In this invention, when the printed circuit board is viewed from a direction perpendicular to the substrate, a heat radiation pattern is provided between and around the semiconductor element and the coil pattern to be connected to the screw fixing portion disposed around the semiconductor element and the coil pattern. The screw fixing part is directly connected to the cooler with heat conductivity and conductivity.
Since heat transmitted in the planar direction between the plurality of semiconductor elements and the coil pattern is radiated to the cooler via the heat radiation pattern, thermal interference between the mounted components of the electronic circuit board is suppressed. Thereby, mounting components can be arranged close to each other, and the area of the printed circuit board can be reduced.

  Hereinafter, an electronic circuit board according to the present invention will be described with reference to the drawings according to each embodiment, taking as an example a power conversion device that constitutes a transformer by a coil pattern. In each embodiment, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

Embodiment 1 FIG.
FIG. 1 shows a perspective view of an example of a schematic configuration of a power converter according to each embodiment of the present invention. As shown in FIGS. 5 and 6 to be described later, the power conversion device includes a switching element 11 and a rectifying element 31 which are surface-mounted semiconductor elements mounted on the front surface of a multilayer printed circuit board 8. . As shown in FIG. 3 to be described later, the power conversion device also forms a pattern coil 81 formed by a coil pattern formed of, for example, a copper foil pattern, which is a circuit pattern on the printed board 8, and a magnetic path of the pattern coil. The transformer 2 and the smoothing coil 42, which are magnetic components, are formed from the front surface to the back surface, which are formed of the magnetic cores (23, 24) that pass through the printed circuit board 8. The power conversion device also includes an input capacitor 14 and an output capacitor 41 mounted on the front surface of the printed circuit board 8, and a control circuit 5 shown in FIG. On the back side of the printed circuit board 8, a cooler 75 having high thermal conductivity that absorbs heat from the heat generating semiconductor elements (11, 31) and the magnetic parts (2, 42), which are components of the power conversion device, is disposed. ing. By cooling the cooler 75 with air cooling or water cooling, the components of the power converter are cooled. In addition, the cooler 75 may be integrated with an outer case of the power conversion device (not shown).
FIG. 2 shows a top perspective view of an example of a printed circuit board in the power converter of the present invention. As shown in FIG. 2, screw fixing portions 76 are arranged around the semiconductor elements (11, 31), around the coil pattern that hits the magnetic component (2, 42), and at the end of the printed circuit board 8. At the screw fixing portion 76, the printed circuit board 8 is fixed to the cooler 75 with screws 77. A heat dissipation pattern 82 is connected to the screw fixing portion 76. 1 and FIG. 2 and each embodiment described later, the layout of the mounted elements and the heat radiation pattern on the printed circuit board 8 is slightly different, but the basic structure is the same.
Further, in a place where electrical insulation is required between the printed circuit board 8 and the cooler 75, a heat radiation effect with good heat conduction between the printed circuit board 8 and the cooler 75 as shown in FIGS. An insulating sheet 78 which is an insulating member having a high electrical insulation is disposed.
For example, both main surfaces of the printed circuit board 8 are defined as a front surface and a back surface, and the “front surface” and the “front surface” of the printed circuit board 8 are distinguished. The mounting surface of the semiconductor element or the like becomes the “front surface”.

  FIG. 3 is an exploded perspective view of the magnetic part (2, 42) which is a component of the power conversion device according to each embodiment of the present invention. The pattern coil 81 is arranged around the through holes 84A, 84B, 84C opened in the printed circuit board 8. Further, the middle leg portion 23C and the outer leg portions 23A, 23B of the E-type core 23 are inserted through the through holes 84C, 84A, 84B from one surface of the printed circuit board 8, respectively, and the end surface of each leg portion is the other surface. A magnetic path of a magnetic field generated by the pattern coil 81 is formed by being coupled to the I-type core 24 on the side. In this embodiment, the shape of the core is the EI type. For example, a combination of the E type core and the E type core, an EER type core whose cross section perpendicular to the magnetic path direction of the middle leg portion is circular, A combination of a U-type core and an I-type core or a combination of a U-type core and a U-type core may be used.

  FIG. 4 shows a circuit diagram of an example of the power conversion apparatus according to Embodiment 1 of the present invention. The primary side drive circuit 1 includes switching elements 11A and 11B, 11C and 11D connected in series. The switching element is, for example, an Nch type MOSFET. The positive side of the input capacitor 14 to which the input voltage Vin is supplied is connected to the drain terminals of the switching elements 11A and 11C. Further, the negative side of the input capacitor 14 is connected to the source terminals of the switching elements 11B and 11D. Between the connection point 12 between the source side of the switching element 11A and the drain side of the switching element 11B and the connection point 13 between the source side of the switching element 11C and the drain side of the switching element 11D, the primary side winding of the transformer 2 21A is connected. The rectifier circuit 3 includes rectifier elements 31A and 31B. The anode sides of the rectifying elements 31A and 31B are connected to one ends of the secondary windings 22A and 22B of the transformer 2, and the cathode sides are both connected to one end of the smoothing coil. The other end of the smoothing coil 42 is connected to one end of an output capacitor 41 serving as an output of the power converter. The other end of the output capacitor 41 and the other ends of the secondary windings 22A and 22B of the transformer 2 are connected to a reference potential 71 on the output side of the power converter.

In the present embodiment, the primary side winding 21A of the transformer 2 has four turns and the secondary side windings 22A and 22B have one turn. Accordingly, the secondary windings 22A and 22B have positive and negative values that become a quarter of the input voltage Vin during the period when the switching elements 11A and 11D are on and during the period when the switching elements 11B and 11C are on. Is generated. The rectifying elements 31A and 31B rectify the positive and negative voltages, and a voltage smoothed to direct current by the smoothing coil 42 and the output capacitor 41 is generated. The output voltage Vo of the power converter is determined by the ratio of the number of turns of the primary side winding 21A and the secondary side windings 22A and 22B of the transformer 2 and the on / off period of the switching element 11A-11D.
The control circuit 5 feeds back and inputs the output voltage Vo between both ends of the output capacitor 41, and is connected to the gate terminal of each switching element 11A-11D. Then, the control circuit 5 controls the on / off period of the switching elements 11A-11D so that the output voltage Vo becomes a predetermined set value. In the present embodiment, the turns ratio of the transformer 2 is 4: 1. However, when the ratio of the input voltage Vin and the output voltage Vo is large, the turns ratio is 6: 1 or 8: 1, and the voltage ratio is If it is small, it may be 3: 1 or 2: 1.

  FIG. 5 is a top perspective view of the copper foil pattern of each layer of the multilayer printed board of the power conversion device according to Embodiment 1 of the present invention. As shown in FIGS. 6 and 14, which will be described later, the multilayer printed circuit board is formed by overlapping a plurality of layers each having a heat dissipation pattern, a coil pattern, and a circuit pattern formed on a thin insulating layer. 5 and FIG. 10, which will be described later, are diagrams in which copper foil patterns forming each pattern of each layer seen through the insulating layer are arranged side by side. FIG. 13 shows a cross-sectional view of the screw fixing portion of the power converter according to the present invention. The multilayer printed circuit board 8 is in contact with the first outer layer shown in FIG. 5A on which a surface mount type semiconductor element or the like is mounted, and the cooler 75 directly or through an insulating sheet 78 (d). (B) and (c) sandwiched between these outer layers, and the four inner copper foil layers of the first inner layer and the second inner layer shown in FIG. Each layer is electrically connected by copper plating formed on the inner wall of the through hole 86 and the screw fixing portions 76A to 76K (note that 76I is a missing number). FIG. 13 shows the screw fixing portion 76A-76K in a state where each layer of the printed circuit board 8 is electrically connected by copper plating composed of a heat radiation pattern 82 formed on the inner wall of the screw hole. 8 shows a state in which the printed circuit board 8 and the cooler 75 are fixed by extending through the screw holes 8 to the inside of the cooler 75 without using the insulating sheet 78. When the screw fixing portion 76 has a large diameter and the inner wall cannot be plated with copper, a through hole 86 is disposed around the screw fixing portion 76. The four copper foil layers are insulated by a resin such as glass epoxy.

  The ten screw fixing portions 76A to 76K that are arranged on the outer periphery of the printed circuit board 8 and are screwed to the cooler 75 are the second outer layer (d) without using the insulating sheet 78 as shown in FIG. It is in contact with the cooler 75 and has the same potential as the reference potential 71 on the output side of the power converter. The input of the power converter is connected to the input units (Vi) 17A and (N) 17B shown in the upper part of FIG. 5A, and the output is the output unit (Vo) shown in the lower right part of FIG. ) 18A and a cooler 75 having a reference potential 71.

  The transformer 2 including the pattern coil 81 including the coil pattern arranged as shown in FIG. 3 around the through-hole 84C1 indicated by the reference numeral 84C1 in FIG. The secondary side winding 22A is on the first outer layer, the secondary side winding 22B is on the second outer layer (d), and the primary side is on the first inner layer (b) and the second inner layer (c). Winding 21A is arranged. The secondary windings 22A and 22B each have one turn, and one end is connected to the screw fixing portions 76C and 76H. The primary winding 21A has two turns in each of the first inner layer and the second inner layer, and is connected by a through hole 86 indicated by reference numeral 86 in FIG.

  The smoothing coil 42 composed of the pattern coil 81 arranged as shown in FIG. 3 around the through-hole 84C2 indicated by reference numeral 84C2 at the lower part of FIG. )-(D), one turn is arranged in each layer, the parallel connection of the first outer layer of (a) and the first inner layer of (b), the second inner layer of (c), and (d) The parallel connection of the second outer layer is connected in series through a through hole 86 indicated by reference numeral 86 in (b), resulting in a total of two turns.

As shown in the upper part of FIG. 5A, the switching elements 11A-11D are arranged in the order of 11B, 11A, 11C, 11D from the left side of the page between the input units (Vi) 17A, (N) 17B and the transformer 2. Is done.
As shown in the middle of FIG. 5A, the rectifying elements 31B and 31A are arranged between the transformer 2 and the smoothing coil 42 in the order of 31B and 31A from the left side of the drawing.

  Next, the position of the heat radiation pattern 82 with high thermal conductivity that is connected between the components and connected to the screw fixing portions 76A to 76K having the same potential as the cooler 75 will be described.

The first outer layer in FIG.
A heat dissipation pattern 82Z1 connected to the upper left screw fixing portion 76A and disposed between the screw fixing portion 76A and the input portion 17B;
A heat dissipation pattern 82Z2 connected to the upper right screw fixing portion 76K and disposed between the screw fixing portion 76K and the input portion 17A;
A heat dissipation pattern 82Z25, 82Z6, 82Z7 for connecting the left screw fixing portions 76B, 76C, 76D, 76E;
Heat dissipation patterns 82Z3, 82Z4, 82Z8 for connecting the right screw fixing portions 76J, 76H, 76G, 76F;
A heat dissipation pattern 82B connected between the screw fixing portions 76B and 76J and disposed between the switching elements 11A and 11C and the secondary winding 22A;
A heat dissipating pattern 82Z5 connected to the screw fixing portion 76C and disposed between the secondary winding 22A and the rectifying element 31B, and a part of which is integrated with the secondary winding 22A;
A heat dissipation pattern 82D connected to the screw fixing portion 76F and disposed between the smoothing coil 42, the output portion (Vo) 18A, and the output capacitor (C) 41;

The first inner layer in FIG.
A heat radiation pattern 82Z10 for connecting the screw fixing portions 76B and 76C indicated by reference numerals 76B and 76C in FIG.
A heat radiation pattern 82Z9 for connecting the screw fixing portions 76J and 76H;
A radiation pattern 82Z11 disposed between the primary winding 21A and the rectifying element 31B;
A heat radiation pattern 82F disposed between the primary winding 21A and the rectifying element 31A.

The second inner layer of FIG.
A heat radiation pattern 82Z12 for connecting the screw fixing portions 76B and 76C indicated by reference numerals 76B and 76C in FIG.
A heat radiation pattern 82Z15 for connecting the screw fixing portions 76J and 76H;
A heat radiation pattern 82Z13 disposed between the primary winding 21A and the rectifying element 31B;
A heat radiation pattern 82Z14 disposed between the primary winding 21A and the rectifying element 31A.

The second outer layer in FIG.
A heat dissipation pattern 82Z16 connected to the screw fixing portion 76A indicated by reference numeral 76A in the upper left of FIG. 5A and disposed between the screw fixing portion 76A and the input portion 17B;
A heat radiation pattern 82Z17 connected to the screw fixing portion 76K indicated by reference numeral 76K in the upper right of FIG. 5A and disposed between the screw fixing portion 76K and the input portion 17A;
Heat radiation patterns 82Z19, 82Z21, 82Z23 for connecting the screw fixing portions 76B, 76C, 76D, 76E indicated by the reference numerals 76B, 76C, 76D, 76E on the left side of FIG.
Heat radiation patterns 82Z20, 82Z22, 82Z24 for connecting the screw fixing portions 76J, 76H, 76G, 76F indicated by reference numerals 76J, 76H, 76G, 76F on the right side of FIG.
A heat radiation pattern 82C connected between the screw fixing portions 76B and 76J and disposed between the switching elements 11A and 11C and the secondary winding 22B;
A heat dissipation pattern 82Z18 connected to the screw fixing portion 76B and disposed between the switching elements 11A and 11B;
A heat dissipation pattern 82A connected to the screw fixing portion 76J and disposed between the switching elements 11C and 11D;
A heat dissipation pattern 82G connected to the screw fixing portion 76H and disposed between the secondary side winding 22B and the rectifying element 31A, and a part of which is integrated with the secondary side winding 22B;
A heat dissipation pattern 82E connected to the screw fixing portion 76F and disposed between the smoothing coil 42, the output portion 18A and the output capacitor 41;
The screw fixing portions 76D and 76G are connected to each other, and the heat dissipation pattern 82H is disposed between the rectifying elements 31A and 31B and the smoothing coil 42.
In each figure including the subsequent figures, the switching element 11 and the rectifying element 31 which are semiconductor elements mounted on the printed circuit board 8, the transformer 2 and the smoothing coil 42 which are magnetic parts, the input capacitor 14 and the output capacitor 41, etc. A circuit pattern for an electric circuit for electrically connecting the mounted components is not illustrated because it is complicated to illustrate and the heat radiation pattern is difficult to understand.

  Next, using the top perspective view of the copper foil pattern shown in FIG. 5 and the cross-sectional view of the power conversion device of the present embodiment shown in FIG. 6, the switching elements 11A-11D, the rectifying elements 31A, 31B, and the transformer 2 The heat dissipation path of the primary side winding 21A, the secondary side windings 22A and 22B, and the pattern coil 81 of the smoothing coil 42 will be described. 6, (a) is a top perspective view of the first outer layer shown in (a) of FIG. 5, and (b)-(d) are respectively along the sectional lines A1, A2, A3 of (a). FIG.

  As shown in FIGS. 6B and 6D, the heat generated by the switching elements 11A-11D and the rectifying elements 31A and 31B passes through the through-holes 86 arranged around the elements, and the four-layer board of the printed board 8. From the uppermost first outer layer to the lowermost second outer layer and from the second outer layer to the cooler 75 via the insulating sheet 78.

As shown in FIG. 6C, the heat generated in the primary side winding 21A of the transformer 2 arranged in the first inner layer and the second inner layer of the printed circuit board 8 passes through the insulating resin of the printed circuit board 8. 5 (a) and 5 (d) are transmitted to the first outer layer and the second outer layer, respectively, along with the heat generation of the secondary windings 22A and 22B arranged in the first outer layer and the second outer layer. As described above, the heat is transmitted from the screw fixing portions 76C and 76H connected to one end of the secondary windings 22A and 22B to the cooler 75. Further, the heat generated in the primary winding 21A is transmitted to the second outer layer through the through hole 86 connecting the two turns of the first inner layer and the second turn of the second inner layer, and the insulating sheet 78 is transferred from the second outer layer. There is also a path that passes through the cooler 75 via the via.
Heat generation of the pattern coil indicated by reference numeral 42 in FIGS. 5A, 5B, and 5C of the smoothing coil 42 arranged in the first outer layer, the first inner layer, and the second inner layer of the printed circuit board 8 is as follows. Through the insulating resin between the layers of the printed circuit board 8 and the through holes 86 connecting the pattern coils of each layer, the heat is transmitted from the second outer layer to the second outer layer, along with the heat generation of the pattern coils arranged in the second outer layer. It is transmitted to the cooler 75 via the insulating sheet 78.

  The heat generated by each component is transmitted through the above-described path, and most of the heat is transmitted to the cooler 75. However, when the components are close to each other, part of the heat generated in the plane direction through the insulating resin may be transmitted to different components. However, according to the present invention, in order to suppress thermal interference between components, a heat radiation pattern 82 connected to the screw fixing portions 76A to 76K and having the same potential as the cooler 75 is provided. Next, the effect of the heat radiation pattern 82 will be described.

  Referring to the cross section A1 in FIG. 6B, a heat radiation pattern 82A is disposed in the second outer layer between the switching elements 11C and 11D as shown in FIG. 5D, and the switching elements 11C and 11D. Heat transmitted in the plane direction between the two is transmitted to the heat radiation pattern 82A. Although the heat transmitted in the plane direction of the first outer layer, the first inner layer, and the second inner layer between the switching elements 11C and 11D can be considered, the switching elements in the first outer layer, the first inner layer, and the second inner layer The distance in the planar direction between the switching elements 11C and 11D and the heat radiation pattern 82A in the second outer layer is shorter than the distance in the planar direction between 11C and 11D, and most of the distance is transmitted to the heat radiation pattern 82A.

  The heat radiation pattern 82A is connected to the screw fixing portion 76J with a copper foil pattern of about 400 W / mK with respect to an insulating resin having a thermal conductivity of about 0.3 W / mK. Since heat is transferred to the cooler 75 without passing through the sheet 78, the heat transferred to the heat radiation pattern 82A is easily transferred to the cooler 75. Thereby, the thermal interference between switching element 11C, 11D can be suppressed.

With reference to the cross section A2 in FIG. 6C, the heat transmitted in the planar direction between the first outer layer switching element 11C and the secondary winding 22A is transmitted to the heat radiation pattern 82B. The heat transferred in the planar direction between the second outer layer switching element 11C and the secondary winding 22B is transferred to the heat radiation pattern 82C.
Here, considering the thermal resistance of the heat transfer path from the primary side winding 21A of the first inner layer to the pattern below the switching element 11C,
λ: thermal conductivity of insulating resin,
d: the distance in the planar direction of the primary side winding 21A adjacent to the switching element 11C of the first inner layer,
t: thickness of the copper foil pattern,
w: width of contact between the primary winding 21A and the pattern under the switching element 11C,
R1: thermal resistance,
As
R1 = d / (λ × w × t)
It becomes.

Considering the thermal resistance of the heat transfer path from the primary side winding 21A of the first inner layer to the heat radiation pattern 82B of the first outer layer,
a: the thickness of the insulating resin between the first outer layer and the first inner layer,
s: area where the primary side winding 21A of the first inner layer and the heat radiation pattern 82B of the first outer layer overlap,
R2: thermal resistance,
As
R2 = a / (λ × s)
It becomes. Then, if R1 >> R2, that is, d / (w × t) >> a / s, the heat generation of the primary side winding 21A of the first inner layer is the heat radiation pattern 82B of the first outer layer than in the plane direction. It is transmitted to. For example, if d = 2 mm, w = 20 mm, t = 0.1 mm, a = 0.2 mm, s = 50 mm ² ,
d / (w × t) = 1, a / s = 0.004
It becomes.

  Similarly, the heat generation of the primary side winding 21A of the second inner layer is also transmitted to the heat radiation pattern 82C of the second outer layer from the plane direction. The heat transmitted to the heat radiation patterns 82B and 82C is transmitted to the cooler 75 from the screw fixing portions 76B and 76J. Thereby, the thermal interference between the switching element 11C and the transformer 2 can be suppressed.

  With reference to the cross section A3 in FIG. 6D, heat radiation patterns 82D-82H are disposed between and around the transformer 2, the rectifying element 31A, and the smoothing coil 42. Similarly, thermal interference between each component can be suppressed. Furthermore, since the heat transferred from the smoothing coil 42 to the output capacitor 41 can be suppressed by the heat radiation patterns 82D and 82E, the temperature of the output capacitor 41 can be reduced.

  The image of the above heat dissipation path will be described with reference to a cross-sectional view and a top view of FIG. 14A and 14B are diagrams for explaining a heat dissipation path of the power conversion device according to the present invention. FIG. 14A is a cross-sectional view, and FIG. 14B is a top view. An arrow H indicates a heat dissipation path. The heat generated by the switching element 11, the rectifying element 31, and the pattern coil 81 mainly passes through the through hole 86 and the insulating layer between the copper foil patterns of each layer of the multilayer printed board 8, and the second outer layer (the lowermost layer of the printed board 8). d) to the cooler 75 via the insulating sheet 78. Further, some of the heat generated by the switching element 11, the rectifying element 31, and the pattern coil 81 spreads in the plane direction of the printed circuit board 8, but the cooler 75 passes through the heat radiation pattern 82 and the screw fixing portion 76 having thermal conductivity, respectively. It is transmitted to. Thereby, the heat spread in the plane direction is not transmitted to other parts, and thermal interference is suppressed.

  For example, in FIG. 6, the cross sections A1, A2, and A3 are illustrated and described, but the heat radiation pattern 82 provided in other portions also has the same effect, and thermal interference between each component can be suppressed. Furthermore, in addition to the output capacitor 41 described above, heat transmitted to the input capacitor 14 and the control circuit 5 that is only shown in the circuit diagram can be suppressed, so that components having a low heat-resistant temperature can be used for these components.

Embodiment 2. FIG.
While the step-down transformer 2 of FIG. 4 is a step-down circuit in the first embodiment, the second embodiment is different in that a step-up circuit is provided.
FIG. 7 shows a circuit diagram of an example of a power converter according to Embodiment 2 of the present invention. The step-up transformer 2 in FIG. 7 constitutes a step-up circuit. The primary side drive circuit 1 includes switching elements 11E and 11F. The switching element is, for example, a Pch type MOSFET. The drain terminals of the switching elements 11E and 11F are connected to one ends of the primary side windings 21B and 21C of the transformer 2, respectively. The positive side of the input capacitor 14 to which the input voltage Vin is supplied is connected to the source terminals of the switching elements 11E and 11F. The reference potential 72 on the input side of the power converter is connected to the other ends of the primary windings 21B and 21C of the transformer 2 and the negative side of the input capacitor 14. The rectifier circuit 3 includes rectifier elements 31C, 31D, 31E, and 31F. The secondary winding 22C of the transformer 2 is connected between a connection point 32 between the anode of the rectifying element 31C and the cathode of the rectifying element 31D, and a connection point 33 between the anode of the rectifying element 31E and the cathode of the rectifying element 31F. A connection point between the cathode of the rectifying element 31C and the anode of the rectifying element 31D is connected to one end of the smoothing coil 42, and the other end of the smoothing coil 42 is connected to the plus side of the output capacitor 41 serving as an output of the power converter. A connection point between the cathode of the rectifying element 31E and the anode of the rectifying element 31F is connected to the negative side of the output capacitor 41.

In the present embodiment, the primary side windings 21B and 21C of the transformer 2 have one turn and the secondary side winding 22C has four turns, and the switching element 11E is in the secondary side winding 22C. In addition, a positive / negative voltage that is four times the input voltage Vin is generated while the switching element 11F is on. The rectifying elements 31C-31F rectify the positive and negative voltages, and a DC smoothed voltage is generated by the smoothing coil 42 and the output capacitor 41. The output voltage Vo of the power conversion device is determined by the ratio of the number of turns of the primary side windings 21B and 21C and the secondary side winding 22C of the transformer 2 and the on / off periods of the switching elements 11E and 11F.
The control circuit 5 feeds back and inputs the output voltage Vo between both ends of the output capacitor 41, and is connected to the gate terminals of the switching elements 11E and 11F. The control circuit 5 controls the on / off periods of the switching elements 11E and 11F so that the output voltage Vo becomes a predetermined set value. In the present embodiment, the turns ratio of the transformer 2 is 1: 4. However, when the ratio of the input voltage Vin and the output voltage Vo is large, the turns ratio is 1: 6 or 1: 8, and the voltage ratio is If it is small, it may be 1: 3 or 1: 2.

  FIG. 8 is a top perspective view of the copper foil pattern of each layer of the multilayer printed board of the power conversion device according to the second embodiment of the present invention. As in the first embodiment, the multilayer printed board 8 includes a first outer layer shown in FIG. 8A on which a surface-mount type semiconductor element or the like is mounted, a cooler 75, and an insulating sheet 78. A second outer layer shown in (d), and four copper foil layers of an inner first inner layer and a second inner layer shown in (b) and (c) sandwiched between these outer layers. Have. Each layer is electrically connected by the copper plating formed in the inner wall of the hole of through-hole 86 and screw fixing | fixed part 76A-76K. The detailed configuration is the same as that described above with reference to FIG. When the screw fixing portion 76 has a large diameter and the inner wall cannot be plated with copper, a through hole 86 is disposed around the screw fixing portion 76. The four copper foil layers are insulated by a resin such as glass epoxy.

  Ten screw fixing portions 76A to 76K (note that 76I is a missing number) disposed on the outer periphery of the printed circuit board 8 and screwed to the cooler 75 are insulated as shown in FIG. 13 in the second outer layer of (d). It is in contact with the cooler 75 without passing through the sheet 78 and has the same potential as the reference potential 72 on the input side of the power converter. The input of the power converter is connected to the input unit (Vi) 17A shown in the upper part of FIG. 8A and the cooler 75 serving as a reference potential, and the output is shown in the lower right part of FIG. 8A. It is connected to the output units (Vo) 18A and (N) 18B.

  The transformer 2 including the pattern coil 81 arranged as shown in FIG. 3 around the through-hole 84C1 indicated by the reference numeral 84C1 in FIG. 8A of the printed circuit board 8 is the first outer layer of FIG. Primary winding 21B, primary winding 21C on the second outer layer (d), and secondary winding 22C on the first inner layer (b) and the second inner layer (c). Is done. The primary windings 21B and 21C each have one turn, and one end is connected to the screw fixing portions 76B and 76J. The secondary winding 22C has two turns in each of the first inner layer and the second inner layer, and is connected by a through hole 86 indicated by reference numeral 86 in FIG.

  The smoothing coil 42 composed of the pattern coil 81 arranged as shown in FIG. 3 around the through-hole 84C2 indicated by reference numeral 84C2 at the lower part of FIG. )-(D), two turns are arranged in each layer, and are connected by three through holes 86 indicated by reference numeral 86 in FIG.

As shown in the upper part of FIG. 8A, the switching elements 11E and 11F are arranged between the input unit (Vi) 17A and the transformer 2 in the order of 11E and 11F from the left side of the drawing.
As shown in the middle of FIG. 8A, the rectifying elements 31C-31F are arranged between the transformer 2 and the smoothing coil 42 in the order of 31D, 31C, 31E, 31F from the left side of the drawing.

  Next, the position of the heat radiation pattern 82 that is arranged between the components and connected to the screw fixing portions 76A to 76K having the same potential as the cooler 75 will be described.

The first outer layer in FIG.
A heat radiation pattern 82Z32 connected to the upper right screw fixing portion 76K and disposed between the screw fixing portion 76K and the input portion 17A;
A heat dissipating pattern 82Z31, 82Z35 connecting the upper left screw fixing portions 76A, 76B, 76C;
A heat dissipating pattern 82Z33, 82Z36 connecting the screw fixing portions 76K, 76J, 76H on the upper right side;
A heat dissipation pattern 82Z38 for connecting the screw fixing portions 76D and 76E on the lower left side;
A heat dissipation pattern 82Z34 connected to the screw fixing portion 76J and disposed between the primary side winding 21B and the switching element 11F, and a part thereof is integrated with the primary side winding 21B;
A heat dissipation pattern 82Z37 connected between the screw fixing portions 76C and 76H and disposed between the rectifying element 31C-31F and the primary winding 21B;
The heat radiation pattern 82Z39 is connected to the lower right screw fixing portion 76F and disposed between the smoothing coil 42, the output portion 18A, and the output capacitor (C) 41.

The second outer layer in FIG.
Heat radiation patterns 82Z40, 82Z43 connecting the screw fixing portions 76A, 76B, 76C indicated by reference numerals 76A, 76B, 76C on the upper left side of FIG.
Heat radiation patterns 82Z41, 82Z42 for connecting screw fixing portions 76K, 76J, 76H indicated by reference numerals 76K, 76J, 76H on the upper right side of FIG.
A heat radiation pattern 82Z47 for connecting screw fixing portions 76D and 76E indicated by reference numerals 76D and 76E to the lower left side of FIG.
8 (a) is connected to a screw fixing portion 76C indicated by reference numeral 76C in the center on the left side and is disposed between the primary side winding 21C and the switching element 11E, and a part of the heat dissipation is integrated with the primary side winding 21C. Pattern 82Z49,
8A is connected to the screw fixing portions 76C and 76H indicated by reference numerals 76C and 76H, and the heat radiation pattern 82Z44 is disposed between the rectifying element 31C-31F and the primary winding 21C. A heat radiation pattern 82Z45 disposed between the rectifying elements 31C and 31D connected to the screw fixing portion 76C indicated by the reference numeral 76C at the left center of (a) of FIG.
A heat radiation pattern 82Z46 connected between the rectifying elements 31E and 31F connected to the screw fixing portion 76H indicated by reference numeral 76H at the center on the right side of FIG.
8 (a), a heat radiation pattern 82Z48 connected to the screw fixing portion 76F indicated by reference numeral 76F and disposed between the smoothing coil 42, the output portion 18A and the output capacitor 41 is provided.

  The effects of the main heat dissipation paths of the switching elements 11E and 11F, the rectifier elements 31C-31F, the transformer 2, and the smoothing coil 42 and the heat dissipation pattern (82) provided between and around these components are the same as in the first embodiment. Similarly, it has the effect of suppressing thermal interference of each component and suppressing heat transfer to the control circuit 5 which is shown only in the circuit diagram.

Embodiment 3 FIG.
While the first and second embodiments have one transformer 2, this embodiment uses two transformers 2A and 2B to cope with a high voltage and large current, and the primary side of the transformer is connected in series. The difference is that the secondary side is connected in parallel and the primary side voltage and the secondary side current are distributed.

  FIG. 9 shows a circuit diagram of an example of a power converter according to Embodiment 3 of the present invention. The primary side drive circuit 1 includes switching elements 11G and 11H and 11J and 11K connected in series to each other. The switching element is, for example, an Nch type MOSFET. The positive side of the input capacitor 14 to which the input voltage Vin is supplied is connected to the drain terminals of the switching elements 11G and 11J. Note that two power capacitors 14 are connected in parallel to the first embodiment because the power is large. The source terminals of the switching elements 11H and 11K are connected to the negative side of the input capacitor 14. Between the connection point 12 of the switching elements 11G and 11H and the connection point 13 of the switching elements 11J and 11K, the primary side winding 21D of the transformer 2A and the primary side winding 21E of the transformer 2B are connected in series. The rectifier circuit 3 includes rectifier elements 31G, 31H, 31J, and 31K. The anode sides of the rectifying elements 31G and 31H are respectively connected to one ends of the secondary windings 22D and 22E of the transformer 2A, and the cathode sides are both connected to one end of the smoothing coil 42A. The anode sides of the rectifying elements 31J and 31K are respectively connected to one ends of the secondary windings 22F and 22G of the transformer 2B, and the cathode sides are both connected to one end of the smoothing coil 42B. The other ends of the smoothing coils 42A and 42B are connected to one end of an output capacitor 41 serving as an output of the power converter. The other end of the output capacitor 41 and the other ends of the secondary windings 22D, 22E, 22F, and 22G of the transformers 2A and 2B are connected to a reference potential 71 on the output side of the power converter. Note that two output capacitors 41 are connected in parallel to the first embodiment because the power is large.

In the present embodiment, the primary side windings 21D and 22E of the transformers 2A and 2B have four turns, the secondary side windings 22D, 22E, 22F and 22G have one turn, and the secondary side windings 22D, 22E and 22F. , 22G generates a positive / negative voltage that is one-eighth of the input voltage Vin during the period when the switching elements 11G and 11K are on and during the period when the switching elements 11H and 11J are on. The rectifying elements 31G, 31H, 31J, and 31K rectify the positive and negative voltages, and a DC smoothed voltage is generated by the smoothing coils 42A and 42B and the output capacitor 41. The output voltage Vo of the power converter is determined by the ratio of the number of turns of the primary side winding and the secondary side winding of the transformers 2A and 2B and the on / off period of the switching element 11G-11K.
The control circuit 5 feeds back and inputs the output voltage Vo between both ends of the output capacitor 41, and is connected to the gate terminal of each switching element 11G-11K. Then, the control circuit 5 controls the on / off period of the switching element 11G-11K so that the output voltage Vo becomes a predetermined set value. In this embodiment, two transformers 2A and 2B are used, and the primary side of the transformer is connected in series and the secondary side is connected in parallel. Since the number of turns per contact can be reduced, the wiring width of the pattern coil 81 shown in FIG. 3 can be increased. Further, since the secondary side of the transformers 2A and 2B and the smoothing coils 42A and 42B are arranged in parallel, the current on the secondary side can be dispersed and a high voltage and large current can be handled.

  FIG. 10 is a top perspective view of the copper foil pattern of each layer of the multilayer printed board of the power conversion device according to the third embodiment of the present invention. Similar to the first embodiment, the multilayer printed circuit board 8 includes a first outer layer shown in FIG. 10A on which a surface-mount type semiconductor element or the like is mounted, a cooler 75 and either directly or via an insulating sheet 78. The second outer layer shown in FIG. 10 (d) and the four copper foil layers of the first inner layer and the second inner layer shown in FIGS. 10 (b) and 10 (c) sandwiched between these outer layers. Have Each layer is electrically connected by copper plating formed on the inner wall of the through hole 86 and the screw fixing portions 76A to 76M (note that 76I is a missing number). The detailed configuration is the same as that described above with reference to FIG. When the screw fixing portion 76 has a large diameter and the inner wall cannot be plated with copper, a through hole 86 is disposed around the screw fixing portion 76. The four copper foil layers are insulated by a resin such as glass epoxy.

  The twelve screw fixing portions 76A to 76M that are arranged on the outer periphery and the center of the printed circuit board 8 and are screwed to the cooler 75 are insulating sheets as shown in FIG. 13 in the second outer layer of FIG. 78 is in contact with the cooler 75 without going through 78, and has the same potential as the reference potential 71 on the output side of the power converter. The input of the power converter is connected to the input units (Vi) 17A and (N) 17B shown in the upper part of FIG. 10A, and the output is the output part (Vo) shown in the lower center of FIG. ) 18A and a cooler 75 serving as a reference potential.

  The transformer 2A formed of the pattern coil 81 arranged as shown in FIG. 3 around the through-hole 84C3 indicated by the reference numeral 84C3 in FIG. 10A of the printed circuit board 8 is the first outer layer of FIG. The secondary winding 22D, the secondary winding 22E on the second outer layer (d), the primary winding 21D on the first inner layer (b) and the second inner layer (c). Be placed. The transformer 2B formed of the pattern coil 81 arranged as shown in FIG. 3 around the through-hole 84C4 indicated by reference numeral 84C4 in FIG. 10A of the printed circuit board 8 is the first outer layer of FIG. The secondary winding 22F, the secondary winding 22G on the second outer layer (d), and the primary winding 21E on the first inner layer (b) and the second inner layer (c). Be placed. Each of the secondary windings 22D-22G has one turn, and one end thereof is a screw fixing portion 76B, 76D, 76H indicated by reference numerals 76B, 76D, 76H, 76K in FIG. Connected to 76K. The primary windings 21D and 21E each have two turns in the first inner layer and the second inner layer, and are connected by a through hole 86 in FIG. It becomes a turn.

  A smoothing coil 42A composed of a pattern coil 81 arranged as shown in FIG. 3 around a through hole 84C5 indicated by a reference numeral 84C5 in the lower left of FIG. 10A of the printed circuit board 8, and FIG. The smoothing coil 42B similarly configured around the through-hole 84C6 indicated by reference numeral 84C6 in the lower right of FIG. 10 is arranged in one turn in each layer, and the first outer layer in FIG. The parallel connection of the first inner layer in (b) and the second inner layer in (c) of FIG. 10 and the second outer layer in (d) of FIG. 10 are indicated by reference numeral 86 in (b). They are connected through through-holes 86, each for a total of 2 turns.

As shown in the upper part of FIG. 10A, the switching element 11G-11K is arranged between the input units 17A and 17B and the transformers 2A and 2B in the order of 11H, 11G, 11J, and 11K from the left side of the drawing.
As shown in the middle of FIG. 10A, the rectifying elements 31G-31K are arranged in the order of rectifying elements 31H and 31G in order from the paper to the left of the transformer 2A, and in order of rectifying elements 31K to the right of the transformer 2B from the paper. Arranged in the order of 31J.

Next, the position of the heat radiation pattern 82 disposed between the components and connected to the screw fixing portions 76A to 76M having the same potential as the cooler 75 will be described.
The first outer layer in FIG.
A heat dissipation pattern 82Z51 connected to the upper middle screw fixing portion 76M and disposed on the upper left screw fixing portion 76A side and a heat radiation pattern 82Z52 disposed on the upper right screw fixing portion 76L;
A heat dissipation pattern 82Z53 for connecting the upper left screw fixing portions 76A and 76C, a heat dissipation pattern 82Z82 for connecting the screw fixing portions 76A and 76C and the screw fixing portion 76B,
A heat dissipation pattern 82Z54 connected to the left middle screw fixing portion 76C and disposed on the lower left screw fixing portion 76E;
A heat dissipating pattern 82Z61 for connecting the upper right screw fixing portions 76L and 76J, a heat dissipating pattern 82Z60 for connecting the screw fixing portions 76L and 76J and the screw fixing portion 76K,
A heat radiation pattern 82Z59 connected to the right middle screw fixing portion 76J and disposed on the lower right screw fixing portion 76G;
A heat radiation pattern 82Z55 connected to the lower left screw fixing portion 76D and disposed between the smoothing coil 42A and the output portion 18A and the output capacitor 41;
A heat radiation pattern 82Z58 connected to the lower right screw fixing portion 76H and disposed between the smoothing coil 42B and the output portion 18A and the output capacitor 41;
A heat radiation pattern 82Z56 connected between the smooth coil 42A and the output capacitor 41 and connected to the screw fixing part 76F and connected between the smoothing coil 42B and the output capacitor 41. And a heat radiation pattern 82Z57.

The first outer layer in (d) of FIG.
10A is connected to a screw fixing portion 76M indicated by reference numeral 76M at the upper center, and is disposed on the heat dissipation pattern 82Z63 arranged on the left screw fixing portion 76A side and on the right screw fixing portion 76L side. Heat dissipation pattern 82Z64,
A heat radiation pattern 82Z62 connected between the switching elements 11G and 11H, connected to the screw fixing portion 76B indicated by reference numeral 76B on the left side of FIG.
A heat radiation pattern 82Z65 connected to the screw fixing portion 76K indicated by reference numeral 76K on the right side of FIG. 10 (a) and disposed between the switching elements 11J and 11K,
A heat dissipation pattern 82Z81 for connecting the screw fixing portions 76A and 76C indicated by reference numerals 76A and 76C on the left side of FIG. 10A, a heat dissipation pattern 82Z80 for connecting the screw fixing portions 76A and 76C and the screw fixing portion 76B,
A heat radiation pattern 82Z77 connected to a screw fixing portion 76C indicated by reference numeral 76C at the left center of FIG. 10A and disposed on the lower left screw fixing portion 76E side;
A heat dissipation pattern 82Z66 for connecting the screw fixing portions 76L and 76J indicated by reference numerals 76L and 76J on the right side of FIG. 10 (a), a heat dissipation pattern 82Z67 for connecting the screw fixing portions 76L and 76J and the screw fixing portion 76K,
A heat radiation pattern 82Z70 connected to a screw fixing portion 76J indicated by reference numeral 76J at the right center of FIG. 10A and disposed on the lower right screw fixing portion 76G;
A heat radiation pattern 82Z79 connected to the screw fixing portion 76B indicated by reference numeral 76B on the left side of FIG. 10A and disposed between the secondary winding 22E and the rectifying element 31H,
A heat radiation pattern 82Z68 connected to the screw fixing portion 76K indicated by reference numeral 76K on the right side of FIG. 10 (a) and disposed between the secondary winding 22G and the rectifying element 31K;
A heat radiation pattern 82Z76 connected to the screw fixing portion 76D indicated by reference numeral 76D on the left side of FIG. 10A and disposed between the secondary winding 22E and the rectifying element 31G;
A heat radiation pattern 82Z71 connected to the screw fixing portion 76H indicated by reference numeral 76H on the right side of FIG. 10A and disposed between the secondary winding 22G and the rectifying element 31J,
A heat radiation pattern 82Z75 connected to the screw fixing portion 76D indicated by reference numeral 76D on the left side of FIG. 10A and disposed between the smoothing coil 42A, the output portion 18A and the output capacitor 41,
A heat radiation pattern 82Z72 connected to the screw fixing portion 76H indicated by reference numeral 76H on the right side of FIG. 10A and disposed between the smoothing coil 42B, the output portion 18A and the output capacitor 41,
10 (a) is connected to a screw fixing portion 76F indicated by reference numeral 76F at the lower center, and is connected to the heat radiation pattern 82Z74 disposed between the smoothing coil 42A and the output capacitor 41, and the screw fixing portion 76F. 42B and the heat radiation pattern 82Z73 disposed between the output capacitors 41.

  The effect of the heat radiation pattern (82) provided between the switching elements 11G-11K and the rectifying elements 31G-31K, the transformers 2A and 2B, the smoothing coils 42A and 42B, and between and around these components is It is the same as that of the first embodiment, and has the effect of suppressing thermal interference of each component and suppressing heat transfer to the control circuit 5 that is shown only in the circuit diagram.

  In the present embodiment, the transformers 2A and 2B are arranged in the center of the printed circuit board 8, and the switching elements 11G-11K and the rectifying elements 31G-31K are arranged around the transformers 2A and 2B. The screw fixing portions 76A-76M arranged at the same position also serve as the electrical connection of the reference potential at one end of the secondary windings 22D-22G and the heat conduction connection from the heat radiation pattern 82, and are arranged around the printed circuit board 8. The screw fixing portion 76 thus used serves both as fixing the substrate and conducting heat conduction from the heat radiation pattern 82. Thereby, in order to cope with a high voltage and large current, even if the number of component parts increases, thermal interference of the component parts can be suppressed without increasing the number of screw fixing points.

  As shown in FIG. 11A, when a soft insulating sheet 78 is disposed between the printed circuit board 8 and the cooler 75 and the insulating sheet 78 is crushed and fixed, the screw fixing portion 76 is connected to the switching element 11 or the rectifier. If the insulating sheet 78 is provided at a position far from the element 31, the insulating sheet 78 is not completely crushed, and the insulating sheet 78 immediately below the switching element 11 and the rectifying element 31 becomes thick, so that heat dissipation may be deteriorated. FIG. 15 shows the characteristics of the positional relationship between the switching element 11 or the rectifying element 31 and the screw fixing portion 76 in the third embodiment. In the present embodiment, for example, as shown in FIGS. 10 and 15, the switching element 11 or the rectifying element 31 is arranged on a line segment connecting the centers of two screw fixing portions 76 arranged in the vicinity of each element. Has been. Accordingly, as shown in FIG. 11B, the insulating sheet 78 is uniformly crushed and the insulating sheet 78 is not partially thickened, so that the heat dissipation of the switching element 11 and the rectifying element 31 is deteriorated. There is no. When the thickness of the printed circuit board 8 is 1.0 to 2.0 mm, the distance between the centers of the two screw fixing portions 76 disposed in the vicinity of the switching element 11 and the rectifying element 31 is, for example, about 10 to 30 mm. In addition, as the switching element 11 or the rectifying element 31 is arranged at a position closer to the midpoint of the line segment connecting the centers of the two screw fixing portions 76, the insulating sheet 78 is more crushed and the heat dissipation is deteriorated. Can be suppressed.

  As shown in FIG. 12, the switching element 11 and the rectifying element 31 are switched in the range of several tens of k to several hundreds of kHz, and high-frequency noise may be superimposed on the output of the power converter. However, in the present embodiment, the cores 23 of the transformers 2A and 2B and the smoothing coils 42A and 42B are arranged between the switching element 11, the rectifying element 31, the output capacitor 41, and the output unit 18A. 23, high-frequency noise that propagates in the air and propagates to the output capacitor 41 and the output unit 18A can be shielded.

In addition, this invention is not limited to said each embodiment, All these possible combinations are included.
In addition, as described above, the present invention is not limited to the power conversion device, but is similar to the power conversion device, in which a printed circuit board on which a magnetic element having a coil pattern and a magnetic core and a semiconductor element are mounted is cooled by a screw fixing portion. The present invention can also be applied to various electronic circuit boards that are fixed to the circuit board.

In the electronic circuit board according to the present invention described above, the magnetic pattern (FIG. 3) formed by the coil pattern (81) formed by the circuit pattern and the magnetic core (23, 24) and the semiconductor element ( 11, 31) mounted multilayer printed circuit board (8), a cooler (75) disposed on the opposite side of the multilayer printed circuit board mounting surface, and disposed between the multilayer printed circuit board and the cooler. Screw fixing to fix the multilayer printed circuit board (8) and the cooler (75) disposed around the insulating member (78) having thermal conductivity, the coil pattern (81) and the semiconductor element (11, 31). And the heat radiation disposed between at least two of the coil pattern (81) and the semiconductor elements (11, 31) when viewed from the direction perpendicular to the main surface of the portion (76) and the multilayer printed circuit board (8). A pattern (82). Then, the heat radiation pattern (82: FIG. 5 and the like), the screw fixing portion (76), and the cooler (75) are directly connected with heat conductivity and conductivity, respectively.
With the above configuration, heat transmitted in the plane direction between the plurality of semiconductor elements (11, 31) and the coil pattern (81) is dissipated to the cooler (75) via the heat dissipation pattern (82). Thermal interference between the substrate and the components of the power converter is suppressed. Thereby, component parts can be arranged close to each other, and the multilayer printed circuit board can be reduced in area.

Further, in the electronic circuit board according to the present invention, the heat radiation pattern (82) has the coil pattern (81) and the semiconductor elements (11, 31) when viewed from the direction perpendicular to the main surface of the multilayer printed board (8). Also arranged around at least one of the above.
With this configuration, in addition to the effect of suppressing thermal interference between the plurality of semiconductor elements (11, 31) and the coil pattern (81), heat transmitted in the plane direction of the plurality of semiconductor elements (11, 31) and the coil pattern (81). However, since it is not transmitted to other mounting parts constituting the power conversion device such as the input capacitor (14), the output capacitor (41), and the control circuit (5), a low heat-resistant component should be used for the other mounting parts. Can do.

In the electronic circuit board according to the present invention, when viewed from the direction perpendicular to the main surface of the multilayer printed board (8), the heat radiation pattern (82) electrically connects the coil pattern (81) or the mounted components. It is arranged so as to overlap with the circuit pattern to be performed.
With this configuration, even if the heat radiation pattern (82) is disposed between and around the plurality of semiconductor elements (11, 31) and the coil pattern (81), the coil pattern (81), the heat radiation pattern (82)), and the mounted component Since the circuit patterns that connect each other are arranged so as to overlap each other, the distance between the plurality of semiconductor elements (11, 31) and the coil pattern (81) can be reduced.

Further, in the electronic circuit board according to the present invention, the coil pattern (81) arranged so as to overlap when viewed from the direction perpendicular to the main surface of the multilayer printed board (8), the transformer (2) which is a magnetic component is arranged. The primary side winding (21) and the secondary side winding (22) are constituted, and one end of the winding having the smaller number of turns of the primary side winding (21) and the secondary side winding (22) is It is connected to the screw fixing part (76) so as to be electrically connected to the cooler (75).
With this configuration, since one end of the coil pattern (81) is thermally connected to the cooler (75), the heat dissipation of the coil pattern (81) can be improved. Further, since the screw fixing portion (76) for connecting the heat radiation pattern (82) and the screw fixing portion (76) for connecting one end of the coil pattern (81) are shared, the number of screw fixing portions (76) does not increase. .

In the power converter according to the present invention, one end of the coil pattern (81) is connected to the screw fixing portion (76).
With this configuration, the screw fixing portion (76) connecting one end of the coil pattern (81) is also used as the screw fixing portion (76) connecting the heat radiation pattern (82), and one screw fixing portion (76) is shared. can do.

The power converter according to the present invention includes the above-described electronic circuit board, and includes a step-up transformer (2: FIG. 7) or a step-down transformer (2: FIG. 4) and a smoothing coil (42) as magnetic components. The switching element (11) connected to the primary side and the rectifying element connected to the secondary side of the step-up transformer (2: FIG. 7) or the step-down transformer (2: FIG. 4) as the semiconductor elements (11, 31) (31). The switching element (11), the step-up transformer (2: FIG. 7) or the step-down transformer (2: FIG. 4), the rectifier element (31), and the smoothing coil (42) are arranged in this order on the multilayer printed circuit board (8). Is done.
With this configuration, the screw fixing portion (76) and the heat radiation pattern (82) can be easily arranged and shared, and thus the number can be reduced.

The power conversion device according to the present invention includes the electronic circuit board described above, and includes two step-down transformers (2A, 2B) and two smoothing coils (42A, 42B) as magnetic components, and a semiconductor element ( 11, 31) includes a plurality of switching elements (11) connected to the primary side of the two step-down transformers (2A, 2B) and a rectifying element (31) connected to each of the secondary side. . The primary windings (21D, 21E) of the two step-down transformers (2A, 2B) are connected in series, and the secondary winding (22), the rectifier element (31G-31K), and the smoothing coils (42A, 42B). ) Are connected in parallel. As shown in FIG. 16, when viewed from the direction perpendicular to the main surface of the multilayer printed circuit board (8), the two step-down transformers (2A, 2B) are arranged in the center, and the two step-down transformers (2A, 2B) are arranged. ), A plurality of switching elements (11), a rectifying element (31), and a smoothing coil (42) are arranged, and the plurality of switching elements (11) and the rectifying element (31) are arranged in a U-shape, Screw fixing portions (76) are arranged on the triangular lattice around the two step-down transformers (2A, 2B) and around the plurality of switching elements (11), the rectifying elements (31), and the smoothing coil (42). .
With this configuration, since two or more screw fixing portions (76) are arranged around the semiconductor elements (11, 31) and the coil pattern (81), the warpage of the substrate is suppressed, and the warpage of the substrate is caused. Deterioration of heat dissipation can be suppressed. Further, since the smoothing coil (42) is disposed between the semiconductor element (11, 31) serving as a noise source and another circuit that receives noise, the other circuit is provided by the core (23, 24) of the smoothing coil (42). Radiation noise can be suppressed.

Furthermore, in the electronic circuit board according to the present invention, the semiconductor elements (11, 31) are arranged on a line segment connecting the centers of the two screw fixing portions (76). Thereby, the curvature of the printed circuit board in the portion of the semiconductor element (11, 31) can be suppressed, and the semiconductor element (11, 31) having a large amount of heat can be efficiently radiated.
Further, the step-down transformer (2A, 2B), the smoothing coil (42), the semiconductor element (11, 31), and the screw fixing portion (76) are arranged on the printed circuit board 8 as shown in FIG. . The screw fixing portion (76) serving as a reference for a line segment for determining the arrangement position of the semiconductor element is shared as the screw fixing section (76) serving as a reference for the line segment for determining the arrangement position of another semiconductor element. That is, the plurality of semiconductor elements (11, 31) are arranged so that one screw fixing portion (76) serves as a reference for a line segment that determines the arrangement position of the plurality of semiconductor elements (11, 31). Thereby, the number of screw fixing | fixed parts (76) can be reduced.

  DESCRIPTION OF SYMBOLS 1 Primary side drive circuit, 2, 2A, 2B transformer, 3 Rectifier circuit, 5 Control circuit, 8 Printed circuit board, 11, 11A-11K Switching element, 12, 13 Connection point, 14 Input capacitor, 17A, 17B Input part, 18A , 18B Output part, 21A-21E Primary side winding, 22A-22G Secondary side winding, 23 E type core, 23A, 23B Outer leg part, 23C Middle leg part, 24 I type core, 31, 31A-31K Rectification Element, 32, 33 Connection point, 41 Output capacitor, 42, 42A, 42B Smooth coil, 71, 72 Reference potential, 75 Cooler, 76, 76A-76M Screw fixing part, 78 Insulation sheet, 81 Pattern coil (coil pattern) , 82 Heat dissipation pattern, 84A-84C Through hole, 86 Through hole, H arrow.

Claims (9)

A multilayer printed circuit board on which a coil pattern formed by a circuit pattern and a magnetic component formed by a magnetic core and a semiconductor element connected to the circuit pattern are mounted;
A cooler disposed on the side opposite to the mounting surface of the multilayer printed circuit board;
An insulating member having thermal conductivity disposed between the multilayer printed circuit board and the cooler, and disposed around the coil pattern and the semiconductor element, and fixes the multilayer printed circuit board and the cooler. A plurality of screw fixing portions;
When viewed from a direction perpendicular to the main surface of the multilayer printed circuit board, a heat dissipation pattern disposed between at least two of the coil pattern and the semiconductor element,
With
When viewed from the direction perpendicular to the main surface of the multilayer printed circuit board, the semiconductor element is disposed on a line segment connecting two screw fixing portions,
An electronic circuit board in which the heat radiation pattern, the screw fixing portion, and the cooler are directly connected with heat conductivity and conductivity, respectively. 2. The electronic circuit board according to claim 1 , wherein the plurality of semiconductor elements are arranged such that one screw fixing portion serves as a reference of a line segment that determines an arrangement position of the plurality of semiconductor elements. When viewed from the direction perpendicular to the main surface of the multilayer printed circuit board, the coil pattern arranged to overlap constitutes the primary side winding and the secondary side winding of the transformer, which is the magnetic component, and the primary side 3. The electronic circuit according to claim 1 , wherein one end of a winding having a smaller number of turns among the winding and the secondary winding is connected to the screw fixing portion and electrically connected to the cooler. substrate. The electronic circuit board according to claim 1 , wherein one end of the coil pattern is connected to the screw fixing portion. A multilayer printed circuit board on which a coil pattern formed by a circuit pattern and a magnetic component formed by a magnetic core and a semiconductor element connected to the circuit pattern are mounted;
A cooler disposed on the side opposite to the mounting surface of the multilayer printed circuit board;
An insulating member having thermal conductivity disposed between the multilayer printed circuit board and the cooler, and disposed around the coil pattern and the semiconductor element, and fixes the multilayer printed circuit board and the cooler. A screw fixing part;
A circuit pattern and a coil pattern which are arranged between at least two of the coil pattern and the semiconductor element and connected to the semiconductor element when viewed from a direction perpendicular to the main surface of the multilayer printed circuit board ; Is a heat dissipation pattern that is not connected ,
With
An electronic circuit board in which the heat radiation pattern, the screw fixing portion, and the cooler are directly connected with heat conductivity and conductivity, respectively. 6. The heat dissipation pattern according to claim 1, wherein the heat radiation pattern is also arranged around at least one of the coil pattern and the semiconductor element when viewed from a direction perpendicular to a main surface of the multilayer printed circuit board . 2. An electronic circuit board according to item 1 . The heat dissipation pattern overlaps with the circuit pattern that connects between the coil pattern or the mounted components when viewed from a direction perpendicular to the main surface of the multilayer printed circuit board . 2. An electronic circuit board according to item 1 . The electronic circuit board according to any one of claims 1 to 7,
The magnetic component includes a step-up transformer or a step-down transformer, and a smoothing coil,
The semiconductor element includes a switching element connected to the primary side of the step-up transformer or the step-down transformer, and a rectifying element connected to the secondary side,
A power conversion device in which the switching element, step-up transformer or step-down transformer, rectifier element, and smoothing coil are arranged in this order on the multilayer printed board. The electronic circuit board according to any one of claims 1 to 7,
The magnetic component includes two step-down transformers and two smoothing coils,
As the semiconductor element, a plurality of switching elements connected to the primary side of the two step-down transformers, and a rectifying element connected to each secondary side,
The primary side windings of the two step-down transformers are connected in series, and the secondary side winding, the secondary side circuit formed by the rectifying element and the smoothing coil are connected in parallel,
When viewed from the direction perpendicular to the main surface of the multilayer printed circuit board, the two step-down transformers are arranged in the center, and the plurality of switching elements, rectifying elements, and smoothing coils are arranged around the two step-down transformers. The plurality of switching elements and rectifying elements are arranged in a U-shape,
A power conversion device in which the screw fixing portion is disposed on a triangular lattice around the two step-down transformers and around the plurality of switching elements, rectifying elements, and smoothing coils.

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