JP6580190B2 - Position detection device - Google Patents

Description

  The present invention relates to a capacitance type position detection apparatus that detects a position instructed by a position indicator by receiving a signal from the position indicator.

  In recent years, tablet-type information terminals equipped with a touch panel have been frequently used. As this type of technology, for example, as disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 08-179871), a plurality of electrode conductors are arranged vertically and horizontally on the substrate surface of the position detection sensor, and these electrode conductors are arranged. An electrostatic induction method is widely used in which signal points are obtained by sequentially selecting the intersections formed by, and obtaining an indication position by, for example, a pen-type position indicator (hereinafter referred to as an indication pen) based on the signal distribution.

  In Patent Document 1, the pointing pen includes an oscillation circuit inside, and applies an oscillation signal having a predetermined frequency from the oscillation circuit to a plurality of electrode conductors of the position detection sensor. In the position detection device, the position indicated by the pointing pen on the input surface of the position detection sensor is detected from the signal intensity (signal level) of the induction signal obtained from each of the electrode conductors arranged vertically and horizontally. .

  The above-described device is often used in combination with a display device such as an LCD (Liquid Crystal Display). In that case, since the noise generated by the display device is mixed, the position of the indicator cannot be obtained correctly or an incorrect position may be detected, which may cause a malfunction. For this reason, noise removal has been an important issue in this type of electrostatic induction position detector.

  As the most effective method for removing noise, a differential amplifier circuit has been conventionally used. That is, by selecting two electrode lines arranged in the same direction at the same time and connecting one to the positive input of the differential amplifier circuit and the other to the negative input of the differential amplifier circuit, the noise component is cancelled. Thus, only a signal difference due to the approach of an indicator such as an indicator pen is detected. Examples thereof include the techniques described in Patent Document 2 (Japanese Patent Laid-Open No. 5-6153) and Patent Document 3 (Japanese Patent Laid-Open No. 10-20992).

Japanese Patent Laid-Open No. 08-179871 JP-A-5-6153 Japanese Patent Laid-Open No. 10-20992

  By the way, this type of position detection sensor has conventionally been provided with a plurality of electrode conductors as described above by forming a conductor pattern on a substrate 1 made of, for example, resin as shown in FIG.

That is, in FIG. 11, for example, a plurality of first electrode conductors (hereinafter referred to as Y electrode conductors) Y ₁ , Y extending on the rectangular substrate 1 in the lateral direction (X-axis direction). ₂ ,..., Y _m (m is an integer greater than or equal to 2) and a plurality of second electrode conductors extending in the direction intersecting the horizontal direction, in this example, the orthogonal vertical direction (Y-axis direction). (Hereinafter referred to as the X electrode conductor) X ₁ , X ₂ ,..., X _n (n is an integer of 2 or more). In this case, the region where the intersections of the plurality of Y electrode conductors Y _{1 to} Y _m and the plurality of X electrode lines X _{1 to} X _n are formed (region surrounded by the dotted line 2s in FIG. 11) It becomes the detection area 2 of the indicator.

And the board | substrate 1 is equipped with the Y electrode terminal 3 and the X electrode terminal 4 which comprise a connection end with an external signal processing circuit as a protrusion part, as shown in FIG. A conductor pattern from each of the plurality of Y electrode conductors Y _{1 to} Y _m is extended to the Y electrode terminal 3, and is collected along the outer periphery of the substrate 1. Similarly, a conductor pattern from each of the plurality of X electrode conductors X _{1 to} X _n is extended to the X electrode terminal 4, and is collected along the outer periphery of the substrate 1.

Thus, in the conventional position detection sensor, the Y electrode terminal 3 and the X electrode terminal 4 are concentrated with the plurality of Y electrode conductors Y _{1 to} Y _m and the plurality of X electrode conductors X _{1 to} X _n , respectively. Therefore, it is necessary to wrap the lead conductor pattern formed extending from each electrode conductor along the outer periphery of the substrate 1. For this reason, in FIG. 11, it is necessary to provide a wiring area 5 (shown by hatching in FIG. 11) of the lead conductor pattern (connection line) shown surrounded by a dotted line 5s.

  For this reason, conventionally, due to the existence of the wiring area 5, the substrate 1 becomes larger than the size of the detection area 2 of the indicator, and there is a problem that convenience and design are deteriorated.

  Conventionally, in the case of an electromagnetic induction type position detection device that uses X-direction and Y-direction loop coils as position detection sensors instead of the electrostatic capacity type, the connection line is connected to the back side of the substrate through the through hole ( Attempts have been made to eliminate the wiring area 5 of the connection line by forming it on the side where the loop coil is not formed. In the case of the electromagnetic induction method, this is possible because the signal from the pointing pen is received by the loop coil and the connection line cannot receive the signal from the pointing pen. is there.

  However, in the case of a capacitance type position detection sensor, the signal from the pointing pen is also received in the connection line, so the connection line is simply connected to the substrate through the through hole without any ingenuity. If it is formed on the back side (the side where the X electrode conductor and the Y electrode conductor are not formed), there is a problem that it is difficult to detect the position of the indicator.

  In this capacitive position detection sensor, in order to remove noise generated by the sensor from the received signal obtained from the electrode conductor, the received signal from the two electrode conductors carrying approximate noise is differentially amplified. A differential amplifier circuit is used. In this case, it is desirable that the distance between the two electrode conductors connected to the non-inverting input terminal and the inverting input terminal of the differential amplifier circuit is as short as possible. If the distance between the two electrode conductors becomes long, the noise approximation will be lost, and the effect of improving the noise resistance obtained by differential amplification will not be obtained, but the circuit scale will increase. This is because.

  An object of the present invention is to provide an electrostatic capacitance type position detecting device that can solve the above-described problems.

In order to solve the above problems, the invention of claim 1
A position detection device for detecting the position of an object in a detection area,
A substrate comprising a surface having a size including the detection area;
In the detection area of the substrate, an electrode layer provided by laying a plurality of conductor patterns of a predetermined shape;
The plurality of conductive patterns provided in the detection area in a corresponding area overlapping the detection area of the electrode layer in the thickness direction at a position different from the electrode layer in the thickness direction of the substrate. of the, from each of the plurality of the conductive patterns are arranged along a first direction, towards the concentrator section of an end portion of the outside of the substrate of the detection area, the substrate in the corresponding area A wiring layer provided with a plurality of lines formed so as to extend in the first direction in a state of being close to each other while allowing an overlap with the conductor pattern in the thickness direction ;
A connection portion for connecting each of the plurality of lines and each of the plurality of conductor patterns arranged along the first direction in the detection area;
A signal processing circuit that is connected to the concentrator and detects the position of the object based on the amount of electric charge induced in each of the plurality of conductor patterns spread in the detection area;
A position detecting device is provided.

  In the invention of claim 1 having the above-described configuration, an electrode layer in which a plurality of conductor patterns having a predetermined shape are laid on the substrate, and a plurality of electrodes provided in the detection area below the electrode layer. A wiring layer provided with a plurality of lines formed so as to extend from each of the conductor patterns toward the concentrating portion at the end portion of the recording substrate outside the detection area is formed.

  Accordingly, the plurality of lines are electrostatically shielded by the plurality of conductor patterns, and for example, transmission signals from an indicator such as an indicator pen are prevented or reduced from being received by the plurality of lines.

  According to the present invention, in the capacitive position detection device, it is ensured that the indication position of the indicator is correctly detected, and the plurality of lines are provided below the electrode layer on which the plurality of conductor patterns are formed. Can be provided. Therefore, since it is not necessary to route the plurality of lines to the outer periphery of the board, the wiring area for routing the connection line can be eliminated, and the board can be made smaller by that amount, and convenience and design are improved. It is possible to prevent the decrease.

It is a figure for demonstrating the outline | summary of the whole embodiment of the position detection apparatus by this invention. It is the figure which looked at an example of the sensor used for 1st Embodiment of the position detection apparatus by this invention from the surface side of the board | substrate. It is the figure which looked at an example of the sensor used for 1st Embodiment of the position detection apparatus by this invention from the back surface side of the board | substrate. It is the elements on larger scale which looked at an example of the sensor used for 1st Embodiment of the position detection apparatus by this invention from the surface side of the board | substrate. It is the elements on larger scale which looked at an example of the sensor used for 2nd Embodiment of the position detection apparatus by this invention from the surface side of the board | substrate. It is a figure for demonstrating the shape of the board | substrate of an example of the sensor used for 2nd Embodiment of the position detection apparatus by this invention. It is a figure for demonstrating an example of the sensor used for 3rd Embodiment of the position detection apparatus by this invention. It is a figure for demonstrating the other example of the conductor pattern of the sensor used for embodiment of the position detection apparatus by this invention. It is a figure for demonstrating the other example of the conductor pattern of the sensor used for embodiment of the position detection apparatus by this invention. It is a figure for demonstrating the other example of the conductor pattern of the sensor used for embodiment of the position detection apparatus by this invention. It is a figure for demonstrating the conventional position detection apparatus.

[First Embodiment]
FIG. 1 is a diagram showing a schematic configuration of a first embodiment of a position detection apparatus according to the present invention. In FIG. 1, the position detection device includes a position detection sensor 10 (hereinafter simply referred to as a sensor for the sake of simplicity) and a signal for detecting a position indicated by the pointing pen 40 based on a signal received by the sensor 10. And a processing circuit 20.

  The sensor 10 is configured by forming a first electrode conductor group 12 and a second electrode conductor group 13 on a substrate 11 made of, for example, resin. In this example, the substrate 11 is a rectangular flat plate, and has a front surface 11a as a first surface and a back surface 11b (see FIG. 3) as a second surface facing each other.

The first electrode conductor group 12 includes, for example, a plurality of first electrode conductors 12Y ₁ , 12Y ₂ ,..., 12Y _m that extend in the lateral direction (X-axis direction) In this way, they are arranged in parallel while being separated by a predetermined interval. The second electrode conductor group 13 intersects the _first electrode conductors 12Y _{1 to} 12Y _m , and in this example, a plurality of second electrode conductors extending in the orthogonal vertical direction (Y-axis direction). 13X ₁ , 13X ₂ ,..., 13X _n are arranged in parallel while being separated from each other by a predetermined distance.

The first electrode conductors 12Y _{1 to} 12Y _m and the second electrode conductors 13X _{1 to} 13X _n are both formed on the surface 11a of the substrate 11. However, in the first embodiment, as will be described later, the first electrode conductors 12Y _{1 to} 12Y _m are all made of the substrate 11 including the intersections with the second electrode conductors 13X _{1 to} 13X _n. The second electrode conductors 13X _{1 to} 13X _n are electrically connected to the first electrode conductors 12Y _{1 to} 12Y _m on the back surface 11b side of the substrate 11 through the through holes. It is connected.

  In the first embodiment, the concentrator 14 for the first electrode conductor group 12 and the concentrator 15 for the second electrode conductor group 13 are arranged on one side of the rectangular substrate 11 in the Y-axis direction. Projections 14A and 15A are formed. The protruding portions 14A and 15A where the concentrating portions 14 and 15 are formed serve as connectors for connection to the signal processing circuit 20.

The concentrator 15 for the second electrode conductor group 13 is provided on the surface 11 a side of the substrate 11, and the concentrator 14 for the first electrode conductor group 12 is provided on the back side of the substrate 11. The concentrating portion 14 for the first electrode conductor group 12 is electrically connected to each of the first electrode conductors 12Y _{1 to} 12Y _m through through holes.

As described above, the position detection device according to the first embodiment is configured so that the extending direction of the first electrode conductor group 12 and the extending direction of the second electrode conductor group 13 are orthogonal to each other. An electrostatic capacitance type position detecting device including a sensor in which the group 12 and the second electrode group 13 are disposed is configured. Then, the position detecting device, based on a change in capacitance at intersections of the first electrode conductor _12Y 1 _{~12Y m} and a second electrode conductor _13X 1 _{~13X n,} the position indicating pen 40 to instruct To detect.

  The pointing pen 40 includes an oscillation circuit 41 inside. The oscillation circuit 41 is a circuit for generating a signal having a frequency of 1.8 MHz, for example. Then, the pointing pen 40 transmits the signal generated in the oscillation circuit 41 from the pen tip portion 42 to the outside. The sensor 10 receives the signal transmitted from the pointing pen 40 by the first electrode conductor group 12 and the second electrode conductor group 13. The signals received by the first electrode conductor group 12 and the second electrode conductor group 13 are respectively supplied to the signal processing circuit 20.

  The signal processing circuit 20 is a circuit for performing predetermined signal processing on the signal received by the sensor 10. The signal processing circuit 20 includes selection circuits 21 and 22, differential amplifier circuits 23 and 24, and a control circuit 25.

A signal received by the sensor 10 is input to the control circuit 25 via the selection circuits 21 and 22 and the differential amplifier circuits 23 and 24 of the signal processing circuit 20. The control circuit 25 checks the levels of received signals in the electrode conductors 12Y _{1 to} 12Y _m of the first electrode conductor group 12 and the electrode conductors 13X _{1 to} 13X _n of the second electrode conductor group 12 to 1 It is detected that the pointing pen 40 is present on the electrode conductor whose signal level of 8 MHz is high.

Each of the first electrode conductors 12Y _{1 to} 12Y _m is connected to the selection circuit 21 through the concentrator 14. Similarly, each of the second electrode conductors 13X _{1 to} 13X _n is connected to the selection circuit 22 through the concentrator 15. The selection circuit 21 and the selection circuit 22 are connected to the differential amplifier circuits 23 and 24.

Selection circuit 21 is constituted of, for example, a microprocessor, receives a selection control from the control circuit 25, among the first electrode conductor _12Y 1 _{~12Y m,} of the differential amplifier circuit 23 + side input terminal (non-inverting The electrode conductor connected to the input terminal) and the electrode conductor connected to the negative side input terminal (inverting input terminal) of the differential amplifier circuit 23 are selected. The selection circuit 22 receives a selection control from the control circuit 25, from among the second electrode conductor _13X 1 _{~13X n,} and the electrode conductor to be connected to the + side input terminal of the differential amplifier circuit 24, the difference The electrode conductor connected to the negative input terminal of the dynamic amplifier circuit 24 is selected.

The differential amplifier circuit 23 and the differential amplifier circuit 24 perform the first difference between the input signal to the + side input terminal and the input signal to the − side input terminal, thereby making the first electrode conductors 12Y _{1 to} 12Y _m and while canceling the noise mixed in the second electrode conductor _13X 1 ~13X _n, corresponding to the intensity of the first electrode conductor _12Y 1 _{~12Y m} and a second electrode conductor _13X 1 signal received by ～13X _n The output signal is output to the control circuit 25. In this case, although not shown, output signals of the differential amplifier circuit 23 and the differential amplifier circuit 24 are converted into digital signals by an ADC (Analog Digital Converter) and supplied to the control circuit 25.

The control circuit 25 is configured on the sensor 10 based on the intensity of the output signal of the differential amplifier circuit 23 and the first electrode conductor selected by the selection circuit 21 among the _first electrode conductors 12Y _{1 to} 12Y _m . The position coordinate in the Y-axis direction of the position indicated by the pointing pen 40 is detected, and the output signal intensity of the differential amplifier circuit 24 and the selection circuit 22 among the second electrode conductors 13X _{1 to} 13X _n are detected. The position coordinates in the X-axis direction of the position pointed by the pointing pen 40 on the sensor 10 are detected from the second electrode conductor selected in step. In this way, the control circuit 25 detects the coordinates of the position indicated by the pointing pen 30.

Note that the selection circuit 21 and the selection circuit 22 connect a plurality of electrode conductors to the + side input terminal and the − side input terminal of the differential amplifier circuit 23 and the differential amplifier circuit 24, so that all of the sensors 10 are connected. For the electrode conductor, the position indicated by the pointing pen 40 may be detected in a rough unit. In this case, when the rough position of the pointing pen 40 is detected, the plurality of first electrode conductors 12Y _{1 to} 12Y _m and the second electrode conductors 13X _{1 to} 13X _n near the detected position are detected by the pointing pen 40. Detailed detection of the indicated position is performed. In this detailed detection of the designated position, the selection circuit 21 and the selection circuit 22 are each one electrode conductor connected to the + side input terminal and the − side input terminal of the differential amplifier circuit 23 and the differential amplifier circuit 24. It is controlled by the control circuit 25 so as to select each one.

[Configuration Example of Sensor 10]
Next, the configuration of the conductor pattern including the first electrode conductor group 12, the second electrode conductor group 13, the concentrator 14 and the concentrator 15 formed in the sensor 10 will be described with reference to FIGS. To do. FIG. 2 shows a detailed configuration example of the conductor pattern on the surface 11 a side of the substrate 11 of the sensor 10. FIG. 3 shows a detailed configuration example of the conductor pattern on the back surface 11 b side of the substrate 11 of the sensor 10. 4 shows an enlarged view of a part of the sensor 10 as viewed from the surface 11a side of the substrate 11. As shown in FIG.

As shown in FIG. 2, a plurality of rhombus-shaped, in this example, square conductor patterns 31 are formed on the surface 11 a of the substrate 11. The conductor pattern 31 is formed such that one of the two diagonal lines is parallel to the extending direction of the first electrode conductors 12Y _{1 to} 12Y _m , that is, the X-axis direction. . Similarly, the direction of the other diagonal line of the conductor pattern 31 is formed so as to be parallel to the extending direction of the second electrode conductors 13X _{1 to} 13X _n , that is, the direction of the Y-axis direction. The conductive pattern 31 formed in this manner is formed so as to be spread on the upper surface 11b of the substrate 11 in the vertical direction, the horizontal direction, and the oblique direction. A slight gap g is formed between the adjacent conductor patterns 31. The gap g is formed between the conductor patterns 31 adjacent in the oblique direction, and the size d (see FIG. 4) is large enough to ensure insulation between the conductor patterns 31 adjacent in the oblique direction. Is set.

  As shown in FIG. 2, the plurality of conductor patterns 31 in each row arranged in the X-axis direction are formed so that one of the diagonal lines is aligned with the X-axis direction and in the Y-axis direction. The conductor patterns 31 in each row arranged are formed so that the other of the diagonal lines is in a straight line in the Y-axis direction. By forming the plurality of conductor patterns 31 in this manner, a plurality of rows of the plurality of conductor patterns 31 aligned in a straight line in the X-axis direction are formed on the surface 11a of the substrate 11 so as to be aligned in the Y-axis direction. The

As shown in FIG. 2, among the plurality of conductor patterns 31 in each row arranged in a straight line in the X-axis direction, the conductor pattern 31 formed at the right end in the X-axis direction is straight in the left-end direction. A first connection portion 32Y shown in FIG. 4 is formed between each of the plurality of conductor patterns 31 arranged in a row. The first connecting portion 32Y is for electrically connecting conductor patterns 31 adjacent in the X-axis direction, and is formed on the surface 11a of the substrate 11 so as to extend in the X-axis direction. The first connection portion 32Y, between the conductor patterns 31 adjacent in the X-axis direction are electrically connected to each configured the first electrode conductor _12Y 1 _{~12Y m} shown in FIG. Hereinafter, the conductor pattern 31 constituting the _first electrode conductors 12Y _{1 to} 12Y _m is referred to as a conductor pattern 31Y. The conductor pattern 31Y and the first connection portion 32Y are integrally formed as a printing pattern.

A plurality of conductor patterns 31 (hereinafter referred to as conductor patterns 31X) other than the plurality of conductor patterns 31Y constituting the _first electrode conductors 12Y _{1 to} 12Y _m are _one in the Y-axis direction as described below. The conductor patterns 31X included on the straight line are electrically connected to each other to constitute the second electrode conductors 13X _{1 to} 13X _n .

  As shown in FIGS. 3 and 4, the substrate 11 has a plurality of through holes 33 </ b> X. The through hole 33X is for electrically connecting the conductor patterns 31X adjacent in the Y-axis direction, and is disposed so as to overlap the conductor pattern 31X. Then, one through hole 33X is provided in the conductor pattern 31X disposed at both ends of the substrate 11 in the Y-axis direction, and two through holes 33X are provided in the other conductor patterns 31X. The through holes 33X are formed in a row along the Y-axis direction, and a plurality of through-holes 33X arranged in a row are formed in a row in the X-axis direction. The end portion on the surface 11a side of the through hole 33X and the conductor pattern 31X overlapping the through hole 33X are electrically connected.

As shown in FIGS. 3 and 4, a plurality of second connection portions 34 </ b> X for electrically connecting the conductor patterns 31 </ b> X adjacent in the Y-axis direction are provided on the back surface 11 b side of the substrate 11. Yes. The second connection portion 34X extends in the Y-axis direction and electrically connects two through holes 33X adjacent to each other among the through holes 33X formed to overlap each of the two adjacent conductor patterns 31X. Are formed to connect to each other. Thus, the conductor patterns 31X adjacent in the Y-axis direction are electrically connected to each other by the plurality of through holes 33X and the plurality of second connection portions 33X, and the second electrode conductor 13X ₁ extending in the Y-axis direction. ～13X _n constitute respectively (see FIGS. 2 and 3).

As shown in FIG. 2, a plurality of connection lines 35 </ b _> X _{1 to} 35 _</ b> _Xn are formed on the surface 11 a of the substrate 11. The plurality of connection lines 35X _{1 to} 35X _n are electrically connected to the conductor pattern 31X formed at the lower end in the Y-axis direction among the conductor patterns 31X constituting the second electrode conductors 13X _{1 to} 13X _n corresponding to one end thereof. And the other end is led to a concentrating portion 14 formed on the protruding portion 14A of the substrate 11. The plurality of connection lines 35X _{1 to} 35 _n are formed in the wiring area 36 provided on the lower end side in the Y-axis direction of the substrate 11 as in the conventional case, and are circulated along the outer periphery of the substrate 11. , And is configured to be guided to the concentrator 14.

On the other hand, a connection line _38Y 1 _{~38Y m} for the first electrode conductor _12Y 1 _{~12Y m,} as described below, the back surface 11b side of the substrate 11, a conductor pattern 31 which is laid on the surface 11a of the substrate 11 By being arranged in parallel and close to each other in a region facing (31Y, 31X), they are formed densely.

That is, as shown in FIGS. 3 and 4, the substrate 11, so as to overlap the one conductor pattern 31Y of the plurality of conductive patterns 31Y constituting the first electrode conductor _12Y 1 _{~12Y m,} through-hole 37Y is formed. The through hole 37Y is intended for connection to the first electrode conductor _12Y 1 _{~12Y m} to the corresponding connection line _38Y 1 _{~38Y m.} Of the through hole 37Y, the end portion on the surface 11a side of the substrate 11 is electrically connected to the conductor pattern 31Y overlapping the through hole 33X. Then, one end of each of the connection lines 38Y _{1 to} 38Y _m is electrically connected to a through hole 37Y formed in the conductor pattern 31Y constituting each of the corresponding first electrode conductors 12Y _{1 to} 12Y _m. .

Here, since the second connection portions 34X of the second electrode conductors 13X _{1 to} 13X _n are provided on the back surface 11b of the substrate 11, the through-holes formed so as to overlap the conductor pattern 31X adjacent in the Y-axis direction. The hole 37Y is formed with a slight shift in the X-axis direction. This is because the connection lines 38Y _{1 to} 38Y _m are not overlapped with the second connection portion 34X, but the length thereof is shortened.

Further, as shown in FIG. 3, each of the connection lines 38Y _{1 to} 38Y _{m is} connected through a through hole 37Y formed in the conductor pattern 31Y constituting the _first electrode conductors 12Y _{1 to} 12Y _m corresponding to one end thereof. Are electrically connected. Here, each of the connection lines 38Y _{1 to} 38Y _m is formed so as to extend linearly in the Y-axis direction at least in a region facing the conductor pattern 31. The other end of each of the connection lines 38Y _{1 to} 38Y _m is configured to be guided to the concentrating portion 15 of the protruding portion 15A provided at the lower end portion of the substrate 11 in the Y-axis direction.

Thus, the extending direction of the second connecting portions 34X, the connection line _38Y 1 and the extending direction of ～38Y _m is By forming parallel, closely coupled to the second connection portion 34X line 38Y ₁ it can be formed ~38Y _m. Therefore, the distance between the two electrode conductors connected to the non-inverting input terminal and the inverting input terminal of the differential amplifier circuit 23 can be shortened, and the noise resistance obtained by the differential amplification can be improved. I can plan. Furthermore, the distance between the connection lines _38Y 1 _{~38Y m,} it is possible to shorten, a decrease in the density of the connecting lines _38Y 1 _{~38Y m} can be minimized. Note that the connection line _35X 1 _{~35X n} to the second electrode conductor _13X 1 _{~13X n,} as in the prior art, is formed on the wiring area 36 on the surface 11a side of the substrate 11.

  Therefore, according to this embodiment, since the wiring area of the connection line can be made smaller as a whole than before, the substrate can be made smaller and it is possible to prevent the convenience and design from being lowered. .

The connection line _35X 1 _{~35X n} to the second electrode conductor _13X 1 _{~13X n} is, since the form in a conventional manner the wiring area and the received signal from the second electrode conductor _13X 1 _{~13X n} With respect to, the detection result of the pointing position by the pointing pen can be obtained with the same accuracy as in the prior art.

Incidentally, connection line _38Y 1 _{~38Y m} for the first electrode conductor _12Y 1 _{~12Y m,} in the rear surface 11b side of the substrate 11, the first electrode conductor group 12 and the second electrode conductor of the surface 11a of the substrate 11 Since the conductor pattern 31 (31X, 31Y) constituting the group 13 is formed so as to overlap, the influence of the jump of the transmission signal from the pointing pen 21 to the connection lines 38Y _{1 to} 38Y _m becomes a problem.

However, the connection lines 38Y _{1 to} 38Y _m are electrostatically shielded by the plurality of conductive patterns 31 (31X, 31Y) provided on the surface 11a of the substrate 11, and a transmission signal from the pointing pen 40 is transmitted to the connection lines 38Y _{1 to} 38Y. Reception or reception at _m is prevented or reduced. In addition, since the connection lines 38Y _{1 to} 38Y _m are arranged close to each other, even if signals or noises ride on the connection lines 38Y _{1 to} 38Y _m , the signals and noises are adjacent to each other. Since the lines ride in the same manner, the signals and noises superimposed on the connection lines 38Y _{1 to} 38Y _m are removed by calculating the difference between the signals from the plurality of electrode conductors in the differential amplifier circuit of the signal processing circuit. effective.

The connection line _38Y 1 _{~38Y m} for the first electrode conductor _12Y 1 _{~12Y m} is crossed in the back surface 11b side of the substrate 11, the X-axis direction in which the first electrode conductor _12Y 1 _{~12Y m} extends Since it is formed so as to extend in the (perpendicular) Y-axis direction, it is easy to form the connection lines 38Y _{1 to} 38Y _m in parallel and close to each other on the back surface 11b side of the substrate 11.

Furthermore, for the second electrode conductors 13X _{1 to} 13X _n whose extending direction is the direction in which the connection lines 38Y _{1 to} 38Y _m extend, the conductor patterns 31X are connected to each other on the back surface 11b side of the substrate 11 through a through hole. since connecting the second connection portion 34X of the Y-axis direction Te, it becomes parallel to the connecting line _38Y 1 _{~38Y m} and the second connection portion 34X. Therefore, even when the connection lines 38Y _{1 to} 38Y _m are formed so as to jump over the second connection portion 34X, the distance of the jump can be shortened, and the density of the connection lines 38Y _{1 to} 38Y _m is reduced. There is also an effect that it is possible to minimize to do.

[Second Embodiment]
The second embodiment is a modification of the first embodiment. In the sensor 10B according to the second embodiment, each of the conductor patterns 31X constituting the _first electrode conductors 12Y _{1 to} 12Y _m formed on the surface 11a of the substrate 11 of the sensor 10 according to the first embodiment includes the substrate 11. The _first embodiment is that the conductor patterns 31Y constituting the conductor patterns 31Y constituting the second electrode conductors 13X _{1 to} 13X _n are connected on the back surface 11b side of the substrate 11 on the front surface 11a. It differs from the sensor 10 in the form.

  FIG. 5 is a diagram for explaining a configuration example of a main part of the sensor 10B of the position detection device according to the second embodiment. The same reference numerals are given to the same parts as those in the first embodiment. is there. FIG. 5 corresponds to FIG. 4 in the first embodiment described above, and shows an enlarged view of a part of the sensor 10B viewed from the surface 11a side of the substrate 11 of the sensor 10B. FIG. 6 shows the positions of the projections 14B and 15B for the concentrator provided on the substrate 11 of the sensor 10B in the case of the second embodiment.

In the second embodiment, among the plurality of conductor patterns 31 in each row arranged in a straight line in the Y-axis direction, the conductor disposed at the upper end in the Y-axis direction when viewed from the surface 11a side of the substrate 11. Between each of the plurality of conductor patterns 31 arranged in a straight line with respect to the lower end direction in the Y-axis direction with respect to the pattern 31, a third connection portion 32X for electrically connecting the adjacent conductor patterns 31 to each other. Is formed. The third connection portion 32X is formed on the surface 11a of the substrate 11 so as to extend in the Y-axis direction. By the third connection portion 32X, the conductor patterns 31X adjacent in the Y-axis direction are electrically connected to each other, and the second electrode conductors 13X _{1 to} 13X _n shown in FIG. ₁ (in FIG. 5, 13X _j , 13X _{j + 1} , 13X _{j + 2} ). The conductor pattern 31X and the third connection portion 32X are integrally formed as a print pattern.

The plurality of conductor patterns 31Y other than the plurality of conductor patterns 31X constituting the second electrode conductors 13X _{1 to} 13X _n are conductors included on one straight line in the X-axis direction as described below. The patterns 31Y are electrically connected to each other to form first electrode conductors 12Y _{1 to} 12Y _m (12Y _i , 12Y _{i + 1} , 12Y _{i + 2 in} FIG. 5).

  That is, as shown in FIG. 5, the substrate 11 is formed with a through hole 33Y that is formed so as to overlap the plurality of conductor patterns 31Y and electrically connects the conductor patterns 31Y adjacent in the X-axis direction. ing. Although not shown, the through hole 33Y is provided for the conductor pattern 31Y disposed at both ends of the substrate 11 in the X-axis direction, and is provided for the other conductor pattern 31Y. The through holes 33Y are formed in a line along the X-axis direction, and a plurality of through-holes 33Y aligned in the line are formed in a line in the Y-axis direction. The through hole 33X is electrically connected to the end of the substrate 11 on the surface 11a side and the conductor pattern 31Y overlapping the through hole 33X.

As shown in FIG. 5, a fourth connection portion 34 </ b> Y for electrically connecting the conductor patterns 31 </ b> Y adjacent in the X-axis direction is formed on the back surface of the substrate 11. The fourth connection portion 34Y extends in the X-axis direction and electrically connects two through holes 33Y adjacent to each other among the through holes 33Y formed so as to overlap the two adjacent conductor patterns 31Y. Are formed to connect to each other. The conductor patterns 31Y adjacent in the X-axis direction are electrically connected to each other by the plurality of through holes 33Y and the plurality of fourth connection portions 34Y, and the first electrode conductors 12Y _{1 to} 12Y _n extending in the X-axis direction are Each is configured (see 12Y _i , 12Y _{i + 1} , 12Y _{i + 2 in} FIG. 5).

As shown in FIG. 6, projections 14 </ b> B and 15 </ b> B for the concentrating portions 14 ′ and 15 ′ are formed on the left end side when viewed from the surface side of the substrate 11, as in the first embodiment. . Although not shown in FIG. 6, the protruding portion 14 </ b> B of the substrate 11 extends from the leftmost conductor pattern 31 </ b> Y among the conductor patterns 31 </ b> Y constituting the _first electrode conductors 12 </ b> Y _{1 to} 12 </ b> Y _m on the surface of the substrate 11. A plurality of connection lines are formed so as to be led to the concentrating portion 14 ′ formed in the above. The plurality of connection lines are formed in a wiring area 36 </ b> B provided on the surface of the substrate 11 and on the left end side in the X-axis direction, as in the conventional case.

On the other hand, as shown in FIG. 5, connection line 38X of the second electrode conductor _13X 1 _{~13X n,} as in the first embodiment, the back surface side of the substrate 11, laid on the surface 11a of the substrate 11 The conductor patterns 31 (31Y, 31X) formed in close proximity to each other are arranged in parallel and close to each other.

That is, as illustrated in FIG. 5, a plurality of connection lines 38 </ b _> X are disposed on the substrate 11 so as to overlap one conductor pattern 31 _</ b _> X among the plurality of conductor patterns 31 _</ b _> X constituting the second electrode conductors 13 </ b _> X _{1 to} 13 _</ b _> Xn. Through-holes 37X are formed for connecting to the corresponding second electrode conductors 13X _{1 to} 13X _n . The through hole 37X is electrically connected to the end portion on the surface side of the substrate 11 and the conductor pattern 31X overlapping the through hole 37X. One end of each of the plurality of connection lines 38X corresponding second electrode conductor _13X 1 _{~13X n} is the corresponding second electrode conductor _13X 1 _~13X through holes formed in the conductor pattern 31X constituting each _n It is electrically connected to 37X.

  Then, as shown in FIG. 5, each of the connection lines 38 </ b> X is formed to extend linearly in the X-axis direction on the back surface side of the substrate 11. The other end of the connection line 38X is configured to be led to the concentrating portion 15 ′ of the protruding portion 15B provided at the left end portion of the substrate 11 in the X-axis direction. A through hole 37X of the conductor pattern 31X is formed so that portions of the plurality of connection lines 38X extending linearly in the X-axis direction are parallel to each other and close to each other.

  Here, also in the second embodiment, since the fourth connecting portion 34Y is provided on the back surface of the substrate 11, the through hole 37X formed so as to overlap the conductor pattern 31X adjacent in the X-axis direction is provided. , And slightly shifted in the Y-axis direction. This is because the connection line 38X does not overlap the fourth connection portion 34Y, but its length is shortened.

Each of the connection lines 38X is electrically connected to the second electrode conductors 13X _{1 to} 13X _n corresponding to one end thereof through the through holes 37X. Here, each connection line 38 </ b> X is formed so as to extend linearly in the X-axis direction at least in a region facing the conductor pattern 31. The other end of each connection line 38X is configured to be guided to the concentrating portion 14 'of the protruding portion 14B provided at the left end portion in the X-axis direction of the substrate 11.

In this case, the extending direction of the second electrode conductors 13X _{1 to} 13X _n is the X-axis direction, while the extending direction of each of the plurality of connection lines 38X is the X-axis direction. For this reason, the portions extending linearly in the X-axis direction of the connection line 38X can be arranged in parallel with each other and close to each other.

  As described above, also in the second embodiment, the extending direction of the second connecting portion 33Y and the extending direction of the connecting line 38 are formed in parallel, so that they are close to the fourth connecting portion 34Y. Thus, the connection line 38X can be formed. Therefore, the distance between the two electrode conductors connected to the non-inverting input terminal and the inverting input terminal of the differential amplifier circuit 23 can be shortened, and the noise resistance obtained by the differential amplification can be improved. I can plan. Furthermore, since the distance between the connection lines 38X can be further shortened, a decrease in the density of the connection lines 38X can be minimized.

Further, in the second embodiment, as described above, a first electrode conductor _12Y 1 _{~12Y m,} the second electrode conductor _13X 1 _{~13X n} conductor pattern 31 (31Y, 31X) for connection This method is different from the first embodiment only in the way in which the connection line is pulled out and the same effect as that of the first embodiment can be obtained.

[Third Embodiment]
In the first and second embodiments described above, the connection line of any one of the first electrode conductors 12Y _{1 to} 12Y _m and the second electrode conductors 13X _{1 to} 13X _n is formed on the back surface of the substrate 11. The case was illustrated. However, a first electrode conductor _12Y 1 _{~12Y m,} both connection lines of the second electrode conductor _13X 1 _{~13X n} formed on the back surface of the substrate 11, a first electrode conductor _12Y 1 _{~12Y m,} conductor patterns 31 constituting the second electrode conductor _{13X 1 ~13X n (31Y, 31X} ) may be allowed to face the. The third embodiment is an example in that case.

  FIG. 7 is a diagram for explaining the outline of the sensor 10D of the third embodiment.

  As shown in FIG. 7A, the sensor 10D in the third embodiment includes a first substrate 11D and a second substrate 11E, and the first substrate 11D and the second substrate 11E. It is set as the structure which bonded together.

  Instead of the through hole 34X in the second embodiment, the first substrate 11D and the second substrate 11E are bonded to the first substrate 11D when the first substrate 11D and the second substrate 11E are bonded together. Vias 37XD penetrating both of these are formed. In addition, instead of the through hole 33Y in the second embodiment, the conductor patterns 31Y adjacent in the X-axis direction are electrically connected to the first substrate 11D on the back surface 11Db of the first substrate 11D. A via 33YB is formed. The via 37XD and the via 33YB are formed at positions where the through holes 34X and 33Y in the second embodiment are formed.

As shown in FIG. 7B, a plurality of second connection portions 32X extending in the Y-axis direction are provided on the surface 11Da of the first substrate 11D. By this second connection portion 32X, conductor patterns 31X adjacent in the Y-axis direction are connected to each other, and second electrode conductors 13X _{1 to} 13X _n (in FIG. 7, 13X _j , 13X _{j + 1} , 13X _{j + 2} are shown) Are formed). A plurality of first connection portions 34Y extending in the X-axis direction are formed on the back surface 11Db of the first substrate 11D. The first connection portion 34Y is formed between conductor patterns 31Y adjacent in the X-axis direction. And this 1st connection part 34Y is electrically connected to the via | veer 33YB formed in each conductor pattern 31Y which both ends adjoin in the X-axis direction. As described above, the conductor patterns 31Y formed adjacent to each other in the X-axis direction are electrically connected via the via 33YB and the first connection portion 34Y, and the first electrode conductors 12Y _{1 to} 12Y _m are formed, respectively. (See 12Y _i , 12Y _{i + 1} , 12Y _{i + 2 in} FIG. 7).

  A via 37XD and a plurality of connection lines 38XD and 38YD are formed in the second substrate 11E. The front surface 11Ea of the second substrate 11E is affixed to the back surface 11Db side of the first substrate 11D as shown in FIG. A first connection portion 34Y is provided between the front surface 11Ea of the second substrate 11E and the back surface 11Db of the first substrate 11D.

Further, among the conductor patterns 31X constituting the second electrode conductors 13X _{1 to} 13X _n , the conductor patterns 31X arranged in the X-axis direction are each changed to the first conductor pattern 31X as shown in FIG. One end of each of the plurality of connection lines 38XD is connected through a via 37XB provided between the front surface 11Da and the back surface 11Db of the substrate 11D. As shown in FIG. 7, the plurality of connection lines 38XD are formed so as to extend in the X-axis direction, and are formed so as to be close to each other in parallel and close to each other. The plurality of connection lines 38XD are provided between the back surface 11Db of the first substrate 11D and the front surface 11Ea of the second substrate 11E.

Also, of the conductor pattern 31Y constituting the first electrode conductor _12Y 1 _{~12Y m,} the conductor pattern 31Y of one by one, which is arranged in the X-axis direction, as shown in FIG. 7 (B), first One end of each of the plurality of connection lines 38YD is connected through a via 37YD provided through the substrate 11D and the second substrate 11E.

  In this case, as shown in FIG. 7, the plurality of connection lines 38YD are formed so as to extend in the X-axis direction, and are formed so as to be close to each other in parallel and close to each other. Since the plurality of connection lines 38YD are provided on the back surface 11Eb of the second substrate 11E, there is no other conductor line to be avoided, and the density can be increased.

[Modified Example of Shape of Conductive Pattern 31]
<First example>
In the above-described embodiment, the conductor pattern 31 (31X, 31Y) is exemplified as a rhombus shape, particularly a square shape, but the shape of the conductor pattern 31 (31X, 31Y) is the first electrode conductor 12Y _1. and ～12Y _m, the detection sensitivity of the second electrode conductor _13X 1 _{~13X n} and is pointer is similar, and have a shape that can cover as much as possible the whole surface 11a of the substrate 11, what It may be a simple shape.

  FIG. 8 is a diagram illustrating a first example of another shape of the conductor pattern 31. This first example is different from the sensor 10 in the first embodiment described above only in the shape of the sensor. That is, as shown in FIG. 8 (A), the conductor pattern 311 of the first example deforms the square-shaped conductor pattern 31 of the above-described embodiment, so that four protruding portions 311a, 311b, 311c, 311d are obtained. It is made into the shape which has. Since other configurations are the same as those in the first embodiment, a detailed description thereof will be omitted.

The first electrode conductors 12Y _{1 to} 12Y _m (12Y _i , 12Y _{i + 1} , 12Y _{i + 2} are shown in FIG. 8B) and the second electrode conductors 13X _{1 to} 13X _n (in FIG. 8B). FIG. 8B shows 13X _j , 13X _{j + 1} , and 13X _{j + 2} ), each of which is composed of a plurality of conductor patterns 311X (see FIG. 8C) and conductor patterns 311Y (see FIG. 8D). Is done. As shown in FIG. 8B, the conductor pattern 311Y constituting each of the _first electrode conductors 12Y _{1 to} 12Y _m arranged in the X-axis direction, and the second electrode arranged in the Y-axis direction The conductor patterns 311X constituting each of the conductors 13X _{1 to} 13X _n are configured so that a part of the conductor patterns 311a, 311b, 311c, and 311d are partially inserted into and combined with each other using the protrusion portions 311a, 311b, 311c, and 311d Yes.

According to the conductor pattern 311 (311Y, 311X) shown in the first example, as shown in FIG. 8B, the adjacent conductor patterns 311 (311Y, 311X) are arranged in the conductor pattern region. Since the parts enter and combine, the second highest signal level is increased in the electrode conductor that has received the signal from the pointing pen, and the detection sensitivity of the pointing pen can be improved. For this reason, the formation pitches Py and Px of the first electrode conductors 12Y _{1 to} 12Y _m and the second electrode conductors 13X _{1 to} 13X _n shown in FIG. the number can be a reducing of the electrode conductor _12Y 1 _{~12Y m} and a second electrode conductor _13X 1 multiplexer to switch the ~13X _n.

<Second example>
FIG. 9 is a second example of a modification of the conductor pattern 31. The second example is an example of a conductor pattern obtained by further modifying the conductor pattern of the first example, and the same reference numerals are given to the same parts as those of the first example. As shown in FIG. 9A, the conductive pattern 312 of the second example includes a square portion 312e that is electrically disconnected (floating state) at the central portion including the protruding portions 311a, 311b, 311c, and 311d. Is formed. Other configurations are the same as those of the conductor pattern 311 shown in the first example.

The first electrode conductors 12Y _{1 to} 12Y _m (12Y _i , 12Y _{i + 1} , 12Y _{i + 2} are shown in FIG. 9B) and the second electrode conductors 13X _{1 to} 13X _n (second example). FIG. 9B shows 13X _j , 13X _{j + 1} , and 13X _{j + 2} ), each of which includes a plurality of conductor patterns 312X (see FIG. 9C) and a conductor pattern 312Y (see FIG. 9D). Is done. Similarly to the first electrode conductor _12Y 1 _{~12Y m} and a second electrode conductor _13X 1 _{~13X n} in the first example, the first electrode conductor _12Y 1 _{~12Y m} arranged in the X-axis direction a conductor pattern 312Y constituting the respective conductor patterns 312X constituting each second electrode conductor _13X 1 _{~13X n} arranged in the Y-axis direction, using another of the protruding portion 311a, 311b, 311 c, and 311d Thus, they are configured such that a part of them enters into each other's conductor pattern region and is combined.

  According to the second example, the square portion 312e formed in an electrically floating state does not contribute to the reception of the transmission signal of the pointing pen, so the signal from the pointing pen 40 (see FIG. 1) has been received. In the electrode conductor, the second largest signal level becomes larger, and further detection sensitivity can be improved.

<Third example>
FIG. 10 is a third example of a modification of the conductor pattern 31. This third example is an example of a conductor pattern obtained by further modifying the conductor pattern of the second example, and the same reference numerals are given to the same parts as those of the second example. As shown in FIG. 10A, the conductive pattern 313 of the third example has a region 313f where no conductive pattern is provided in a portion corresponding to the square portion 312e in the conductive pattern 312 of the second example. Is formed. A square portion 313g corresponding to the region 313f is formed on the protruding portion 311a of the conductor pattern 313 so as to protrude toward the adjacent conductor pattern 312. And this square part 313g is formed in the area | region 313f currently formed in the adjacent conductor pattern 313 in the electrically floating state with the said adjacent conductor pattern 313. FIG. Other configurations are similar to those of the second example.

  According to the third example, since the square portion 313g is formed so as to enter the adjacent conductor pattern 313, the detection sensitivity of the pointing pen is the same as that of the conductor patterns 311 and 312 in the first and second examples. Can be improved.

[Other Embodiments or Modifications]
In the above embodiment, the position indicated by the pointing pen 21 is detected based on a change in capacitance at the intersection of the first electrode conductor extending in the X-axis direction and the electrode conductor extending in the Y-axis direction. The case where it is applied to a sensor of the system has been described as an example. However, the present invention can also be applied to a sensor in which electrode conductors are arranged only in one of the X-axis direction and the Y-axis direction.

  Further, the conductive pattern constituting the first electrode conductor and the second electrode conductor is constituted by a transparent electrode conductor such as ITO, so that the sensor of the position detecting device of the present invention is superimposed on a display device such as a liquid crystal display. It is possible to arrange. Needless to say, the conductive patterns constituting the first electrode conductor and the second electrode conductor do not need to be made of a transparent conductor as long as they do not overlap with a display device such as a liquid crystal display.

10 ... sensor, 11 ... substrate, the surface of 11a ... substrate 11, the rear surface of the 11b ... substrate 11, 12 ... first electrode conductor group, 13 ... second electrode conductor _group, 12Y 1 _~12Y m _... first electrode conductor,
Second electrode conductors 13X _{1 to} 13X _n ... second electrode conductors, 14, 15 concentrators, 18, 19 ... differential amplifier circuits, 21 ... indicating pens, 31, 31X, 31Y ... conductive patterns, 32Y, 32X ... 1st connection part, 34X, 34Y ... 2nd connection part, 33X, 33Y ... through hole, 37Y, 37X ... through hole, 38X, 38Y ... connection line

Claims (11)

A position detection device for detecting the position of an object in a detection area,
A substrate comprising a surface having a size including the detection area;
In the detection area of the substrate, an electrode layer provided by laying a plurality of conductor patterns of a predetermined shape;
The plurality of conductive patterns provided in the detection area in a corresponding area overlapping the detection area of the electrode layer in the thickness direction at a position different from the electrode layer in the thickness direction of the substrate. of the, from each of the plurality of the conductive patterns are arranged along a first direction, towards the concentrator section of an end portion of the outside of the substrate of the detection area, the substrate in the corresponding area A wiring layer provided with a plurality of lines formed so as to extend in the first direction in a state of being close to each other while allowing an overlap with the conductor pattern in the thickness direction ;
A connection portion for connecting each of the plurality of lines and each of the plurality of conductor patterns arranged along the first direction in the detection area;
A signal processing circuit that is connected to the concentrator and detects the position of the object based on the amount of electric charge induced in each of the plurality of conductor patterns spread in the detection area;
A position detection device comprising: The plurality of connection portions are arranged along the first direction at positions inside the predetermined shape of the plurality of conductor patterns arranged along the first direction. The position detection device according to claim 1, wherein each of the plurality of conductor patterns is connected to each of the plurality of lines. The substrate includes a first surface and a second surface facing the first surface;
The plurality of conductor patterns are provided on the first surface side of the substrate, and the wiring layer is provided on the second surface side of the substrate,
The position detection device according to claim 2, wherein the connection portion is configured by a through hole or a via that connects the first surface and the second surface. The position detection device according to any one of claims 1 to 3, wherein the plurality of lines are extended in a direction orthogonal to an outer periphery of the corresponding area. The position detection device according to claim 4, wherein the plurality of lines are bundled in a predetermined unit and extended to a concentrating portion provided outside the corresponding area. The object is a pen-type position indicator that transmits a signal to the position detection device in a capacitive manner,
6. Each of the plurality of lines positioned below the electrode layer is shielded by the conductor pattern having the predetermined shape of the electrode layer. 6. Position detection device. A plurality of the conductor patterns of the electrode layer are also laid in a second direction intersecting the first direction;
Each of the plurality of conductor patterns arranged along the first direction is configured by sequentially connecting a predetermined number of the conductor patterns laid out in the second direction. One of the conductor patterns of the first electrode,
The position detection device according to any one of claims 1 to 6, wherein a plurality of the first electrodes are arranged in the first direction. The plurality of lines are adjacent to each other between the conductor patterns of the first electrodes adjacent in the second direction so as to allow overlap with the conductor patterns in the thickness direction of the substrate. The position detection device according to claim 7, wherein the position detection device is provided. A plurality of the conductor patterns that are not electrically connected to each of the plurality of lines of the plurality of conductor patterns of the electrode layer are arranged in the first direction. Each of which is connected via a connecting line portion and a connecting portion provided in a layer to constitute a second electrode,
A plurality of the second electrodes are arranged in the second direction;
The position detection device according to claim 7 or 8, wherein the plurality of lines connected to the conductor patterns of the plurality of first electrodes are provided in parallel to the connection line portion. . The signal processing circuit is provided for each of the plurality of first electrodes and the plurality of second electrodes, and is selected from the plurality of first electrodes or the plurality of second electrodes. 10. The position detection according to claim 9, further comprising: a differential amplifier circuit that calculates a difference between at least two electrodes, wherein a position indicated by the indicator is detected from an output of the differential amplifier circuit. apparatus. The substrate is provided so as to overlap with a display,
The position detection device according to claim 6, wherein the electrode layer is provided on a side of the substrate far from the display.

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