JP6548607B2 - Socket for electronic component and manufacturing method having evaluation process using the same - Google Patents

Description

  The present invention relates to an electronic component socket on which an electronic component is mounted and a manufacturing method having an evaluation process using the same.

The attachment of the electronic component to the electronic device may be attached by soldering the electronic component to the substrate, but is often attached via a socket.
For example, Patent Document 1 describes a socket for holding a chip-type LED (Light Emitting Diode) element and electrically connecting the LED element and a cable. The socket is composed of a socket portion which is a rectangular parallelepiped housing, a fixed cover member, and a contact.

  The above-mentioned socket part has a chip attaching part opened in the upper surface and formed concavely. A contact insertion hole vertically penetrated is formed in the bottom of the chip mounting portion. A chip-type LED element is inserted into the inside of the chip mounting portion. The fixed cover member is attached to the socket portion so as to be able to open and close the opening of the chip attachment portion, and presses and fixes the LED element from above at a closed position closing the opening. The contact is in contact with the terminal of the LED element by being connected to the cable at one end and projecting from the bottom of the chip mounting portion through the contact insertion hole on the other side.

JP, 2008-71968, A

  The number of component terminals tends to increase with the recent increase in integration and mounting of semiconductor components, and various electronic components with different external shapes, terminal arrangement patterns, terminal numbers, etc. are used for electronic devices. ing. On the other hand, in the electronic device, in the manufacturing process, the electrical characteristics of the electronic component are measured for the purpose of removing defective products and the like, and the measurement results are evaluated. In this evaluation process, various electronic components as described above are to be evaluated.

  For evaluation of the electrical characteristics of the electronic component, for example, the electronic component is mounted on a board for measurement of electrical characteristics, and each terminal of the electronic component is electrically connected to a terminal for test signal supply provided on the measurement board. It is done by Therefore, in the related art, when the electronic component to be evaluated is changed and the arrangement pattern of the terminals is changed, it has been necessary to reconnect the terminals and the corresponding test signal supply terminals each time.

  For example, consider the case where an electronic component is mounted on a measurement board using a socket described in Patent Document 1. In this case, when the electronic component to be evaluated is changed and the arrangement pattern of the terminals is changed, it is necessary to physically reconnect the terminals of the changed electronic component to the test signal supply terminals corresponding to the terminals.

  This invention solves the above-mentioned subject, and it aims at obtaining a manufacturing method which has a socket for electronic parts which can change an electrode pattern according to an electronic part from which an arrangement pattern of a terminal differs, and an evaluation process using the same. Do.

The electronic component socket according to the present invention includes a component mounting portion and a socket portion.
The component mounting unit includes a plurality of first electrodes configured on the mounting surface of the electronic component and a plurality of second electrodes configured to be stretchable in a state of being electrically connected to the first electrode. Have a department. The socket portion has a plurality of electrode receiving portions which are each slidably configured. In this configuration, the second electrode portion extends from the component mounting portion, and is electrically connected to the electrode receiving portion facing in the extending direction according to the sliding position of the electrode receiving portion.

  According to the present invention, the second electrode portion electrically connected to the first electrode portion in contact with the terminal of the electronic component is in contact with the electrode receiving portion facing in the extending direction according to the sliding position of the electrode receiving portion And electrically connected. With this configuration, it is possible to switch the electrode pattern of the first electrode portion in accordance with electronic components having different terminal arrangement patterns.

It is a top view which shows the socket for electronic components which concerns on Embodiment 1 of this invention. It is a cross-sectional arrow which shows a mode that the socket for electronic components which concerns on Embodiment 1 was cut by the AA line of FIG. FIG. 3A is an enlarged cross-sectional view of the component mounting portion in the first embodiment. FIG. 3B is a cross-sectional view showing a component mounting portion in which the electronic component is disposed. FIG. 2 is a cross-sectional view showing a configuration of a socket portion in Embodiment 1; FIG. 7 is a cross-sectional view showing the upper electrode receiving portion connected to the first fixed electrode portion and the lower electrode receiving portion connected to the second fixed electrode portion in the electronic component socket according to the first embodiment. FIG. 7 is a cross-sectional view showing the upper electrode receiving portion connected to the second fixed electrode portion and the lower electrode receiving portion connected to the first fixed electrode portion in the electronic component socket according to the first embodiment. It is a top view which shows an example of the electrode pattern in a components mounting part. It is a top view which shows the relationship of the slide position of the upper electrode receiving part corresponding to the electrode pattern of FIG. 7, and a lower electrode receiving part. It is a top view which shows another example of the electrode pattern in a components mounting part. It is a top view which shows the relationship of the slide position of the upper electrode receiving part corresponding to the electrode pattern of FIG. 9, and a lower electrode receiving part. It is a top view which shows the state in which the plate-like-part of the components mounting part of the socket for electronic components which concerns on Embodiment 2 of this invention was closed. FIG. 21 is a top view showing a state in which the plate-like portion of the component mounting portion in Embodiment 2 is open. It is a cross-sectional arrow which shows a mode that the component mounting part in Embodiment 2 was cut by the FF line of FIG.

Embodiment 1
FIG. 1 is a top view showing an electronic component socket 1 according to Embodiment 1 of the present invention. FIG. 2 is a sectional arrow view showing the electronic component socket 1 taken along the line A-A in FIG. 1, and the arrow direction indicates the sliding direction B of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 Is shown.
FIG. 3A is an enlarged cross-sectional view of the component mounting portion 3. FIG. 3B is a cross-sectional view showing the component mounting portion 3 in which the electronic component C is disposed. FIG. 4 is a cross-sectional view showing the configuration of the socket 2, and shows the socket 2 cut along the line A-A in FIG.

  The socket 1 for electronic components is a socket used for the characteristic evaluation of an electronic component, for example, is used for the characteristic evaluation of the electronic component C comprised from the LED element which has two electrodes, a cathode and an anode. The electronic component socket 1 further includes a socket portion 2 and a component mounting portion 3.

The socket part 2 is comprised from the housing | casing 2b in which the opening part 2a was formed, and it fixes in the state in which the component mounting part 3 was engage | inserted by this opening part 2a. For example, the component mounting portion 3 is fixed to the inner peripheral side of the opening 2a by a fixing mechanism (not shown) by being fitted to the opening 2a.
Further, the housing 2b and the component mounting portion 3 of the socket portion 2 are made of an electrically insulating material such as resin, and the upper electrode receiving portion 8, the lower electrode receiving portion 9, the first fixed electrode portion 10, And a second fixed electrode portion 11.

The component mounting portion 3 is provided with a mounting surface 3a and an outer frame portion 3b at the outer edge of the mounting surface 3a, and has a component side electrode portion 4, a socket side electrode portion 5, a shaft portion 6 and an electrode spring 7.
The dimensions of the mounting surface 3a of the component mounting portion 3 are such that among the electronic components to be evaluated that the electronic components having different dimensions of the mounting surface can be disposed, the component having the largest dimension of the mounting surface can be disposed.

As shown in FIG. 1, a plurality of component side electrode portions 4 arranged at equal intervals are provided on the mounting surface 3 a of the component mounting portion 3. As shown in FIG. 3B, each of the plurality of component side electrode units 4 is electrically connected to the terminal of the electronic component C mounted on the mounting surface 3a.
The component-side electrode unit 4 is a component that embodies the first electrode unit in the present invention, and is configured as, for example, a ball-shaped electrode unit.
When the electronic component C is disposed on the mounting surface 3 a, the component-side electrode unit 4 makes point contact with the terminal of the electronic component C. By the point contact, the component side electrode unit 4 and the terminal of the electronic component C are electrically connected.

  Further, by making the component-side electrode unit 4 a ball-shaped electrode unit, as shown in FIG. 3B, the diameter of the component-side electrode unit 4 is not in close contact with the terminals of the electronic component C and the mounting surface 3a. An interval D corresponding to Y is formed. The heat generated by the electronic component C is dissipated by the convection of air at this interval D, so that the characteristic deterioration of the electronic component C due to the heat can be suppressed.

The socket side electrode part 5 is connected to the axial part 6 via the electrode spring 7 as shown to FIG. 3A. In the first embodiment, as in the case of the component-side electrode unit 4, the socket-side electrode unit 5 is a ball-shaped electrode unit. In addition, the shape of the socket side electrode part 5 is not limited to ball shape, What is necessary is just a shape which can be fitted in electrode receiving recessed part 8a, 9b. For example, it may be a columnar electrode portion which can be passed through the electrode receiving concave portions 8a and 9b.
Further, the second electrode portion in the present invention is an electrode portion configured to be able to expand and contract in a state of being electrically connected to the component side electrode portion 4, and in the first embodiment, the socket side electrode portion 5, the shaft The structure has a portion 6 and an electrode spring 7. However, since the socket-side electrode unit 5 is a component that contacts the electrode receiving concave portions 8a and 9b, hereinafter, the socket-side electrode unit 5 will be described as the second electrode portion.

The shaft portion 6 is a rod-like member having electrical conductivity, and one end thereof is electrically and mechanically connected to the component-side electrode portion 4. Moreover, as shown to FIG. 3A, the axial part 6 is the state which penetrated the component mounting part 3 from the mounting surface 3a to the socket part 2 side.
One end of an electrode spring 7 is electrically and mechanically connected to the portion of the shaft 6 that protrudes from the component mounting portion 3 toward the socket 2.

  Moreover, the axial part 6 is arrange | positioned at the inner peripheral side of the electrode spring 7 so that the electrode spring 7 may expand-contract, without bending sideways. That is, when the electrode spring 7 extends toward the socket portion 2, the axial portion 6 contacts the inner periphery of the electrode spring 7 even if a lateral force is applied to the electrode spring 7. Lateral breakage is prevented. The shaft 6 may be omitted and the electrode spring 7 may be connected to a lead wire extended from the component side electrode 4. However, in this configuration, since the function of preventing the lateral bending of the electrode spring 7 is lost, it is necessary to select a spring with little lateral bending as the electrode spring 7.

The electrode spring 7 is a spring member made of an electrically conductive material, and one end is electrically and mechanically connected to the shaft 6 and the other end to the socket-side electrode 5. . That is, the component side electrode unit 4 and the socket side electrode unit 5 are electrically connected to each other through the shaft 6 and the electrode spring 7. Further, as shown in FIG. 3A, the electrode spring 7 is extended by the weight of the socket side electrode unit 5 so that the socket side electrode unit 5 is the electrode receiving recess 8 a of the upper electrode receiving unit 8 or the lower electrode receiving unit 9. The electrode receiving recess 9b is reached and fitted.
Thus, the socket-side electrode unit 5 and the upper electrode receiving unit 8 or the lower electrode receiving unit 9 are electrically connected.

The upper electrode receiving portion 8 and the lower electrode receiving portion 9 are constituent elements embodying the electrode receiving portion in the present invention, and are provided in two stages along the expansion and contraction direction of the socket-side electrode portion 5.
The upper electrode receiving portion 8 is a strip-shaped member which is provided on the side of the opening 2 a in the housing 2 b and slides along the slide guide portion 2 c in the housing 2 b and made of an electrically conductive material. Further, as described later with reference to FIGS. 8 and 10, a plurality of upper electrode receiving portions 8 are provided side by side in a direction orthogonal to the slide direction B in the same step. In each upper electrode receiving portion 8, a plurality of electrode receiving recessed portions 8a are provided side by side on the component mounting portion 3 side along the slide direction B, and the engaging protruding portions 8b are provided corresponding to the respective electrode receiving recessed portions 8a. Is provided on the lower electrode receiving portion 9 side.

The lower electrode receiving portion 9 is provided on the lower side of the upper electrode receiving portion 8 with the insulating wall portion 9a interposed therebetween, and slides in a direction parallel to the slide guide portion 2c inside the recess 2d of the housing 2b. Is a belt-like member made of a material of
Further, as described later with reference to FIGS. 8 and 10, a plurality of lower electrode receiving portions 9 are provided side by side in the direction orthogonal to the slide direction B in the same step. In each lower electrode receiving portion 9, a plurality of electrode receiving recesses 9 b are formed side by side along the sliding direction B.
The insulating wall portion 9 a extending from the lower electrode receiving portion 9 to the upper electrode receiving portion 8 side is made of an electrically insulating material such as resin, and between the upper electrode receiving portion 8 and the lower electrode receiving portion 9. Is insulated by the insulating wall 9a.

The first fixed electrode portion 10 and the second fixed electrode portion 11 are respectively disposed at both ends in the sliding direction B of the lower electrode receiving portion 9 in the recess 2 d.
The first fixed electrode portion 10 is a strip-shaped member made of an electrically conductive material, and the longitudinal direction is a lower electrode receiving portion 9 on one side of the concave portion 2 d as described later with reference to FIGS. 8 and 10. Are arranged orthogonal to the sliding direction B of

  In the first fixed electrode portion 10, an engagement protrusion 10a is provided on the bottom surface side of the recess 2d, and an engagement recess 10b is provided on the component mounting portion 3 side. The upper electrode receiving portion 8 and the first fixed electrode portion 10 are electrically connected by the engagement convex portion 8b being fitted in the engagement concave portion 10b. In addition, the lower electrode receiving portion 9 and the first fixed electrode portion 10 are electrically connected by fitting the engaging convex portion 10a into the electrode receiving recess 9b.

The second fixed electrode portion 11 is a strip-shaped member made of an electrically conductive material, and the longitudinal direction of the second fixed electrode portion 11 is the lower electrode receiving portion 9 on the other side of the concave portion 2d as described later with reference to FIGS. Are arranged orthogonal to the sliding direction B of
Similar to the first fixed electrode portion 10, the second fixed electrode portion 11 is provided with the engagement protrusion 11a on the bottom surface side of the recess 2d, and is provided with the engagement recess 11b on the component mounting portion 3 side. ing. The upper electrode receiving portion 8 and the second fixed electrode portion 11 are electrically connected by the engagement convex portion 8b being fitted in the engagement concave portion 11b. Further, the lower electrode receiving portion 9 and the second fixed electrode portion 11 are electrically connected by the engagement convex portion 11 a being fitted in the electrode receiving recess 9 b.

Also, different potentials are applied to the first fixed electrode unit 10 and the second fixed electrode unit 11.
For example, consider a case where the electronic component C is a component configured of a plurality of LED elements, and a negative potential or a positive potential is applied to the terminal of the electronic component C. In this case, one of the minus potential and the plus potential is applied to the first fixed electrode unit 10, and the other potential is applied to the second fixed electrode unit 11. In this state, the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are slid to electrically connect to the fixed electrode portion to which a desired potential is applied, and the socket side electrode portion 5 becomes the potential of the corresponding terminal. The upper electrode receiving portion 8 or the lower electrode receiving portion 9 is electrically connected.

The socket unit 2 may be provided with, for example, a slide mechanism shown in FIG.
In FIG. 4, the slide lever 12 is a member for sliding the lower electrode receiving portion 9 in the recess 2d, and the slide dial 13 is a member for sliding the upper electrode receiving portion 8 along the slide guide portion 2c. is there.
The slide lever 12 is provided for each lower electrode receiving portion 9, one end of which is connected to the lower electrode receiving portion 9, and the other end is through the through groove provided in the bottom of the recess 2d. Exposed to the outside of 2b. By moving this exposed end along the slide direction B, the lower electrode receiver 9 slides.

Two slide dials 13 are provided for each upper electrode receiving portion 8 and are gear-shaped members with which the engaging convex portions 8 b of the upper electrode receiving portion 8 mesh. As shown in FIG. 4, the two slide dials 13 are rotatably provided at both ends sandwiching the recess 2d.
Further, a part of the slide dial 13 is exposed to the outside from a through groove provided in the housing 2b. When the slide dial 13 is rotated through the exposed portion, the rotational force is converted into a force in the sliding direction B by the engagement convex portion 8 b. Thereby, the upper electrode receiving portion 8 slides.

The slide mechanism shown in FIG. 4 is an example, and the upper electrode receiving portion 8 and the lower electrode receiving portion 9 may be slid by another mechanism.
That is, in the case of a mechanism capable of sliding the upper electrode receiving portion 8 and the lower electrode receiving portion 9 along the slide direction B, the slide dial 13 engaged with the engagement convex portion 8 b of the upper electrode receiving portion 8 is It may be omitted, and it can be adopted for the socket portion 2 regardless of manual operation or automatic operation.

FIG. 5 is a cross-sectional view showing how the upper electrode receiving portion 8 is connected to the first fixed electrode portion 10 and the lower electrode receiving portion 9 is connected to the second fixed electrode portion 11 in the electronic component socket 1. is there.
In FIG. 5, the upper electrode receiving portion 8 is slid toward the first fixed electrode portion 10, and the engagement convex portion 8 b is fitted in the engagement concave portion 10 b of the first fixed electrode portion 10. Thus, the upper electrode receiving portion 8 has the same potential as the first fixed electrode portion 10.
On the other hand, the lower electrode receiving portion 9 is slid toward the second fixed electrode portion 11, and the engagement convex portion 11 a of the second fixed electrode portion 11 is fitted in the electrode receiving recess 9 b. Thus, the lower electrode receiving portion 9 has the same potential as the second fixed electrode portion 11.

The socket-side electrode unit 5 extends from the component mounting unit 3 and is opposed to the extending direction E according to the slide position of the upper electrode receiving unit 8 and the lower electrode receiving unit 9. Are electrically connected in contact with
In the socket-side electrode unit 5 described on the rightmost side in FIG. 5, the upper electrode receiving portion 8 slides in the left direction and does not face the extending direction E, and the lower electrode receiving portion 9 in the lower stage extends It is facing E. Therefore, as shown in FIG. 5, the socket side electrode portion 5 extends to the lower electrode receiving portion 9 and fits in the electrode receiving recess 9 b, and the second fixed electrode portion 11 is inserted through the lower electrode receiving portion 9. It becomes an electric potential. Further, the upper electrode receiving portion 8 is opposed to the other socket side electrode portion 5 in FIG. 5 in the extending direction E. Therefore, these socket side electrode parts 5 are extended to the upper electrode receiving part 8 and fitted in the electrode receiving recess 8 a to become the potential of the first fixed electrode part 10 via the upper electrode receiving part 8 .

6 is a cross-sectional view showing how the upper electrode receiving portion 8 is connected to the second fixed electrode portion 11 and the lower electrode receiving portion 9 is connected to the first fixed electrode portion 10 in the electronic component socket 1. is there.
In FIG. 6, the upper electrode receiving portion 8 is slid toward the second fixed electrode portion 11, and the engagement convex portion 8 b is fitted in the engagement concave portion 11 b of the second fixed electrode portion 11. Thus, the upper electrode receiving portion 8 has the same potential as the potential of the second fixed electrode portion 11.
On the other hand, the lower electrode receiving portion 9 is slid toward the first fixed electrode portion 10, and the engagement convex portion 10a of the first fixed electrode portion 10 is fitted in the electrode receiving recess 9b. Thus, the lower electrode receiving portion 9 has the same potential as the first fixed electrode portion 10.

  In the socket-side electrode unit 5 described on the leftmost side in FIG. 6, the upper electrode receiving portion 8 slides in the right direction and does not face the extending direction E, and the lower electrode receiving portion 9 in the lower stage extends It is facing E. Therefore, as shown in FIG. 6, the socket side electrode portion 5 extends to the lower electrode receiving portion 9 and fits in the electrode receiving recess 9 b, and the lower electrode receiving portion 9 is used to connect the socket side electrode portion 5 to the first fixed electrode portion 10. It becomes an electric potential. Further, the upper electrode receiving portion 8 is opposed to the other socket side electrode portion 5 in FIG. 6 in the extending direction E. Therefore, these socket side electrode parts 5 are extended to the upper electrode receiving part 8 and fitted in the electrode receiving recess 8 a to become the potential of the second fixed electrode part 11 via the upper electrode receiving part 8 .

  FIG. 7 is a top view showing an example of the electrode pattern in the component mounting portion 3. FIG. 8 is a top view showing the relationship between the sliding position of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 corresponding to the electrode pattern of FIG. In the electrode pattern shown in FIG. 7, among the terminals of the electronic component C, a positive potential is applied to the terminals in contact with the component side electrode portions 4 in the regions 3a-1 and 3a-3 of the mounting surface 3a. It is a pattern which applies negative potential to the terminal which contacts the component side electrode part 4 in two.

  When realizing this electrode pattern, a positive potential is applied to the first fixed electrode unit 10 shown in FIG. 8 and a negative potential is applied to the second fixed electrode unit 11. Then, the two upper electrode receiving portions 8 corresponding to the region 3a-2 are slid to a position out of the range corresponding to the mounting surface 3a. The four upper electrode receiving portions 8 corresponding to the regions 3a-1 and 3a-3 are electrically connected to the first fixed electrode portion 10 as slide positions that fall within the range immediately below the mounting surface 3a. In addition, the six lower electrode receiving portions 9 are also electrically connected to the second fixed electrode portion 11 as slide positions that fall within the range immediately below the mounting surface 3a.

  In the state of the socket portion 2 described above, the component mounting portion 3 of the electrode pattern shown in FIG. 7 is attached to the opening 2a. At this time, since the two upper electrode receiving portions 8 corresponding to the area directly below the area 3a-2 are out of the range immediately below the mounting surface 3a, the socket electrode section 5 immediately below the area 3a-2 is a lower electrode The receiving portion 9 is opposed to the extending direction E. As a result, the socket-side electrode portion 5 immediately below the region 3a-2 extends to the lower electrode receiving portion 9 and fits in the electrode receiving recess 9b, and becomes negative potential via the lower electrode receiving portion 9.

  On the other hand, since the four upper electrode receiving portions 8 located immediately below the regions 3a-1 and 3a-3 are slide positions that fall within the range immediately below the mounting surface 3a, sockets immediately below the regions 3a-1 and 3a-3 The upper electrode receiving portion 8 is opposed to the side electrode portion 5 in the extending direction E. As a result, the socket side electrode portion 5 immediately below the regions 3a-1 and 3a-3 extends to the upper electrode receiving portion 8 and fits into the electrode receiving recess 8a, and the positive electrode potential 5 Become.

  FIG. 9 is a top view showing another example of the electrode pattern in the component mounting portion 3. FIG. 10 is a top view showing the relationship between the slide position of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 corresponding to the electrode pattern of FIG. Among the terminals of the electronic component C, the electrode pattern shown in FIG. 9 applies a negative potential to the terminals in contact with the component side electrode portions 4 in the regions 3a-4 and 3a-5 of the mounting surface 3a, It is a pattern which applies plus electric potential to the terminal which contacts component side electrode part 4 in -6.

When realizing this electrode pattern, a positive potential is applied to the first fixed electrode unit 10 shown in FIG. 10, and a negative potential is applied to the second fixed electrode unit 11.
Then, the four upper electrode receiving portions 8 are slid so as to be electrically connected to the first fixed electrode portion 10 so that the upper electrode receiving portion 8 is released from the range immediately below the regions 3a-4, 3a-5.
The two upper electrode receiving parts 8 adjacent to the area immediately below the area 3a-4, 3a-5 are electrically connected to the first fixed electrode section 10 as a sliding position that falls within the area immediately below the mounting surface 3a. Connecting. In addition, the six lower electrode receiving portions 9 are electrically connected to the second fixed electrode portion 11 as a slide position that falls within the range immediately below the mounting surface 3a.

  In the state of the socket portion 2 described above, the component mounting portion 3 of the electrode pattern shown in FIG. 9 is attached to the opening 2a. At this time, since the upper electrode receiving portion 8 is out of the range corresponding to the region directly below the regions 3a-4, 3a-5, the socket electrode portion 5 immediately below the regions 3a-4, 3a-5 receives the lower electrode The portion 9 faces in the extension direction E. As a result, the socket-side electrode portion 5 immediately below the regions 3a-4, 3a-5 extends to the lower electrode receiving portion 9 and is fitted into the electrode receiving recess 9b and becomes a negative potential via the lower electrode receiving portion 9. .

  On the other hand, since the upper electrode receiving portion 8 corresponding to the area directly below the area 3a-6 is a slide position that falls within the range immediately below the mounting surface 3a, the socket electrode section 5 immediately below the area 3a-6 is the upper electrode The receiving portion 8 is opposed to the extension direction E. Therefore, the socket-side electrode portion 5 immediately below the region 3a-6 extends to the upper electrode receiving portion 8 and fits in the electrode receiving recess 8a, and becomes a positive potential via the upper electrode receiving portion 8.

  Among the potentials applied to the first fixed electrode portion 10 and the second fixed electrode portion 11, only by changing the slide position of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 in this manner, the socket side electrode The potential to be applied to the part 5 can be switched. Thus, it is not necessary to facilitate the socket for each arrangement pattern of the terminals of the electronic component as in the prior art, and one electronic component socket 1 can correspond to various arrangement patterns of the terminals.

  In addition, although the case where the electrode receiving part was 2 steps | paragraphs of the upper electrode receiving part 8 and the lower electrode receiving part 9 was shown, you may provide three or more steps of electrode receiving parts. For example, the configuration may be such that the slide directions are orthogonal in each step. That is, in the electronic component socket 1 according to the first embodiment, it is sufficient if there is an electrode receiving portion corresponding to the potential or signal to be applied to the terminal of the electronic component.

Further, although the configuration in which the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are provided in two stages along the expansion and contraction direction of the socket side electrode section 5 is shown, the configuration may not be provided in multiple stages.
For example, a plurality of electrode receiving portions may be arranged side by side on the same plane facing the socket side electrode portion 5. Also in this configuration, the socket-side electrode unit 5 comes into contact with the electrode receiving portion opposed in the extension direction according to the sliding position of the electrode receiving portion. The lower surfaces of these electrode receiving portions may be used as electrode receiving portions of the ground potential.

  Furthermore, although the structure which provided two fixed electrode parts, the 1st fixed electrode part 10 and the 2nd fixed electrode part 11, was shown, three or more fixed electrode parts may be provided and it fixes on the contrary It is not necessary to provide an electrode part. For example, the fixed electrode portion may be provided for each electrode receiving portion or for each predetermined number of electrode receiving portions. Further, without providing the fixed electrode portion, a desired potential may be directly applied to each electrode receiving portion.

  As described above, in the electronic component socket 1 according to the first embodiment, the upper electrode receiver in which the socket side electrode unit 5 faces in the extension direction according to the sliding position of the upper electrode receiving unit 8 and the lower electrode receiving unit 9 It is electrically connected in contact with the portion 8 or the lower electrode receiving portion 9. Further, the socket-side electrode unit 5 is electrically connected to the component-side electrode unit 4 in contact with the terminal of the electronic component C. With this configuration, the electrode patterns can be switched according to various electronic components having different terminal arrangement patterns.

Further, in the electronic component socket 1 according to the first embodiment, the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are provided in two stages in the expansion and contraction direction of the socket side electrode portion 5.
With such a configuration, the socket side electrode unit 5 can be connected to the electrode receiving unit for each desired stage by the slide position of the upper electrode receiving unit 8 and the lower electrode receiving unit 9.

  Furthermore, in the electronic component socket 1 according to the first embodiment, the component side electrode unit 4 is a ball-shaped electrode unit. With such a configuration, the terminals of the electronic component C and the mounting surface 3 a are not in close contact with each other, and the distance D corresponding to the diameter of the component-side electrode portion 4 is formed. The heat generated by the electronic component C is dissipated by the convection of air at this interval D, so that the characteristic deterioration of the electronic component C due to the heat can be suppressed.

Second Embodiment
FIG. 11 is a top view showing a state in which the plate-like portion 3c of the component mounting portion 3A of the electronic component socket 1 according to Embodiment 2 of the present invention is closed. FIG. 12 is a top view showing a state in which the plate-like portion 3c of the component mounting portion 3A is opened. FIG. 13 is a cross-sectional arrow view showing a state in which the component mounting portion 3A is cut along the line F-F in FIG. The component mounting portion 3A is provided with four plate-like portions 3c configured to be slidable along the mounting surface 3a and in contact with the electronic component C from four directions.

The plate-like portion 3c is a substantially triangular plate-like member as shown in FIGS. 11 and 12 and slides along the mounting surface 3a via the through groove 3b-1 provided in the outer frame 3b.
In a state in which the four plate-like parts 3c are brought into contact with the electronic component C disposed on the mounting surface 3a from four directions, the four plate-like parts 3c are screwed with screws 3d provided on the outer frame 3b. Thereby, the electronic component C is fixed on the mounting surface 3a of the component mounting portion 3A.

By configuring in this manner, electronic components of any size can be sandwiched and fixed by the plate-like portion 3c as long as the electronic components can be disposed within the outer frame portion 3b.
Moreover, if it is the shape which can be inserted in the plate-like-part 3c, even if the shape seen from the upper side is not a rectangular shape, it can fix.

In addition, although the structure which sandwiches and fixes the electronic component C by the plate-like part 3c from four directions was shown, five directions or more may be sufficient, and it may be two directions or more and three directions or less conversely.
That is, the plate-like portion 3c of the component mounting portion 3A may be any number and arrangement that can surround the electronic component C without deviation on the mounting surface 3a.

  As described above, the electronic component socket 1 according to the second embodiment includes the four plate-like portions 3 c. Each of the four plate-like portions 3c is configured to be freely slidable along the mounting surface 3a, and contacts and fixes the electronic component C arranged on the mounting surface 3a from four directions. With this configuration, electronic components of any size or shape can be fixed as long as they can be disposed inside the outer frame portion 3b.

  Further, in the manufacturing process of the electronic device, an evaluation step of evaluating the characteristics by mounting the electronic component constituting the electronic device on the electronic component socket 1 shown in the first embodiment and the second embodiment is performed. As a result, it is possible to evaluate the characteristics of various electronic components having different terminal arrangement patterns using one electronic component socket 1.

  In the scope of the present invention, free combination of each embodiment, or modification of any component of each embodiment, or omission of any component in each embodiment is possible within the scope of the invention. .

  DESCRIPTION OF SYMBOLS 1 Socket for electronic components, 2 socket part, 2a opening part, 2b case, 2c slide guide part, 2d recessed part, 3, 3A component mounting part, 3a mounting surface, 3a-1 to 3a-6 area, 3b outer frame part , 3b-1 through groove portion, 3c plate portion, 3d screw, 4 component side electrode portion, 5 socket side electrode portion, 6 shaft portion, 7 electrode spring, 8 upper electrode receiving portion, 8a, 9b electrode receiving recess, 8b, DESCRIPTION OF SYMBOLS 10a, 11a engagement convex part, 9 lower electrode receptacle part, 9a insulating wall part, 10 1st fixed electrode part, 10b, 11b engagement recessed part, 11 2nd fixed electrode part, 12 slide lever, 13 slide dial .

Claims (5)

A plurality of first electrode portions provided on the mounting surface of the electronic component and a plurality of second electrode portions configured to be stretchable in a state of being electrically connected to the first electrode portion Parts mounting part,
And a socket portion having a plurality of electrode receiving portions which are each slidably configured,
The second electrode portion extends from the component mounting portion, and is electrically connected in contact with the electrode receiving portion opposed in the extending direction according to the slide position of the electrode receiving portion. Socket for electronic components.   The electronic component socket according to claim 1, wherein the plurality of electrode receiving portions are provided in a plurality of stages in the expansion and contraction direction of the second electrode portion.   A plurality of plate-like portions configured to be slidable along the mounting surface and fixed in contact from a plurality of directions surrounding the electronic component disposed on the mounting surface are provided. Or the socket for electronic components of Claim 2.   The electronic component socket according to any one of claims 1 to 3, wherein the first electrode portion is a ball-shaped electrode portion.   The manufacturing method of the electronic device which had the evaluation process of mounting the electronic component which comprises an electronic device to the socket for electronic components of any one of Claims 1-4, and evaluating a characteristic.

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