JP6528418B2 - 蛍光体及びこれを用いた発光装置 - Google Patents
蛍光体及びこれを用いた発光装置 Download PDFInfo
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- JP6528418B2 JP6528418B2 JP2015012038A JP2015012038A JP6528418B2 JP 6528418 B2 JP6528418 B2 JP 6528418B2 JP 2015012038 A JP2015012038 A JP 2015012038A JP 2015012038 A JP2015012038 A JP 2015012038A JP 6528418 B2 JP6528418 B2 JP 6528418B2
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- H10H20/80—Constructional details
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- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C09K11/7774—Aluminates
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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- Chemical & Material Sciences (AREA)
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Description
SrtCavEuwAlxSiyNz
(ただし、前記一般式中のt、v、w、x、yおよびzは、0.5≦t<1、0<v≦0.5、0.01<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5を満たす。)
(ただし、0.5≦t<1、0<v≦0.5、0.01<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5)
(蛍光体)
(フラックス)
(蛍光体の製造方法)
(粒径)
(発光装置)
(発光素子10)
(蛍光体70)
(封止部材50)
(蛍光体の実施例)
(比較例1、2、実施例1〜6)
(反射率)
(実施例11〜16、比較例11〜12)
(発光装置の発光スペクトル)
10…発光素子
20、30…リード電極
40…パッケージ
50…封止樹脂
60…導電性ワイヤ
70…蛍光体
Claims (8)
- 紫外線から可視光の領域の光を吸収して発光ピーク波長が600nm以上650nm以下の範囲内にある発光スペクトルを有する光を発光可能な蛍光体であって、
前記発光ピーク波長と前記発光スペクトルにおける半値幅との差が、543nmより大きく、
波長550nmにおける反射率が、15%〜28%であり、
F.S.S.S.による平均粒径が10μmよりも大きく、20μm以下であり、
下記一般式で示される組成を有することを特徴とする蛍光体。
SrtCavEuwAlxSiyNz
(ただし、前記一般式中のt、v、w、x、yおよびzは、0.5≦t<1、0<v≦0.5、0.01<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5を満たす。) - 請求項1に記載の蛍光体であって、
酸素含有量が0.5重量%以上2.0重量%以下であることを特徴とする蛍光体。 - 請求項1又は2に記載の蛍光体であって、
前記発光ピーク波長と前記発光スペクトルにおける半値幅との差が、640nmよりも小さいことを特徴とする蛍光体。 - 請求項1から3のいずれか一項に記載の蛍光体であって、
前記一般式において、Alのモル比xを1として、Srのモル比tが0.820以上0.828以下、Caのモル比vが0.089以上0.111以下、Euのモル比wが0.014以上0.016以下であり、
前記発光ピーク波長が610nm以上625nm以下の範囲内にあり、前記半値幅が79nm以下であることを特徴とする蛍光体。 - 請求項1から3のいずれか一項に記載の蛍光体であって、
前記一般式において、Alのモル比xを1として、Srのモル比tが0.775以上0.809以下、Caのモル比vが0.111以上0.181以下、Euのモル比wが0.015以上0.025以下であり、
前記発光ピーク波長が625nm以上635nm以下の範囲内にあり、前記半値幅が90nm以下であることを特徴とする蛍光体。 - 請求項1から5のいずれか一項に記載の蛍光体と、紫外線から可視光の領域の光を発する励起光源とを有することを特徴とする発光装置。
- 請求項6に記載の発光装置であって、
前記励起光源のピーク波長が、430nm以上470nm以下の範囲内にあることを特徴とする発光装置。 - 請求項6又は7に記載の発光装置であって、
前記蛍光体と、
(Y,Gd,Tb,Lu)3(Al,Ga)5O12:Ce
(Ba,Sr,Ca)2SiO4:Eu
Si6-zAlzOzN8-z:Eu(0<z<4.2)
(Ca,Sr)8MgSi4O16Cl2:Eu
Ca3Sc2Si3O12:Ce
CaSc2O4:Ce
SrGa2S4:Eu
からなる群より選ばれた少なくとも1種の蛍光体を含むことを特徴とする発光装置。
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JP2015012038A JP6528418B2 (ja) | 2014-01-29 | 2015-01-26 | 蛍光体及びこれを用いた発光装置 |
US14/608,191 US9515231B2 (en) | 2014-01-29 | 2015-01-29 | Phosphor and light emitting device using the same |
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JP2014014958 | 2014-01-29 | ||
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JP2015012038A JP6528418B2 (ja) | 2014-01-29 | 2015-01-26 | 蛍光体及びこれを用いた発光装置 |
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JP6528418B2 true JP6528418B2 (ja) | 2019-06-12 |
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JP6287268B2 (ja) * | 2014-01-29 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置 |
US9373761B2 (en) * | 2014-09-23 | 2016-06-21 | Osram Sylvania Inc. | Patterned thin-film wavelength converter and method of making same |
US9735323B2 (en) | 2015-06-30 | 2017-08-15 | Nichia Corporation | Light emitting device having a triple phosphor fluorescent member |
DE102015120775B4 (de) * | 2015-11-30 | 2025-04-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Hintergrundbeleuchtung für ein Display |
CN105623658B (zh) * | 2016-01-29 | 2017-04-12 | 江苏博睿光电有限公司 | 一种氮氧化物荧光粉及其制备方法、氮氧化物发光体和发光器件 |
US11230665B2 (en) | 2016-09-12 | 2022-01-25 | Lumileds Llc | Lighting system having reduced melanopic spectral content |
JP2020109850A (ja) * | 2016-10-31 | 2020-07-16 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP6669147B2 (ja) * | 2016-10-31 | 2020-03-18 | 日亜化学工業株式会社 | 発光装置 |
JP7428465B2 (ja) * | 2017-07-20 | 2024-02-06 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
JP6940764B2 (ja) | 2017-09-28 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置 |
JP6695461B1 (ja) * | 2019-02-20 | 2020-05-20 | 浜松ホトニクス株式会社 | 蛍光体パネルの製造方法、蛍光体パネル、イメージインテンシファイア、及び走査型電子顕微鏡 |
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TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
US20060083694A1 (en) * | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
CN101138278A (zh) * | 2005-03-09 | 2008-03-05 | 皇家飞利浦电子股份有限公司 | 包括辐射源和荧光材料的照明系统 |
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JP5130640B2 (ja) | 2005-04-01 | 2013-01-30 | 三菱化学株式会社 | 蛍光体の製造方法 |
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JP5181492B2 (ja) | 2006-02-28 | 2013-04-10 | 三菱化学株式会社 | 蛍光体原料及び蛍光体原料用合金の製造方法 |
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JP5864851B2 (ja) | 2010-12-09 | 2016-02-17 | シャープ株式会社 | 発光装置 |
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JP2012207228A (ja) | 2012-07-09 | 2012-10-25 | Mitsubishi Chemicals Corp | 蛍光体及びそれを使用した発光装置 |
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