JP6287268B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6287268B2 JP6287268B2 JP2014014959A JP2014014959A JP6287268B2 JP 6287268 B2 JP6287268 B2 JP 6287268B2 JP 2014014959 A JP2014014959 A JP 2014014959A JP 2014014959 A JP2014014959 A JP 2014014959A JP 6287268 B2 JP6287268 B2 JP 6287268B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Luminescent Compositions (AREA)
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Description
(蛍光体)
(蛍光体原料)
(フラックス)
(蛍光体の製造方法)
(粒径)
(発光装置)
(発光素子10)
(蛍光体70)
(封止部材50)
(蛍光体の実施例)
(比較例1、実施例1〜6)
Claims (10)
- 発光素子と、
前記発光素子からの光により励起されて610nm以上650nm以下の範囲内に発光ピーク波長を有する第一の蛍光体と、
前記発光素子からの光により励起されて500nm以上560nm以下の範囲内に発光ピーク波長を有する第二の蛍光体と、
を備えており、
前記発光素子からの光と前記第一の蛍光体及び前記第二の蛍光体からの蛍光との混色光を発する発光装置であって、
前記混色光の発光スペクトルが、580nm以上620nm以下の範囲内に発光ピーク波長を有しており、
波長が620nmより大きい範囲において、前記混色光の発光強度が、発光ピーク波長の発光強度の30%となる発光波長と、発光ピーク波長との差が85nm未満であり、
前記第一の蛍光体が、SrtCavEuwAlxSiyNz(0.8<t<1.0、0<v<0.19、0.005<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5)で表される組成を含み、
前記第二の蛍光体が、Lu3Al5O12:Ce、Y3(Al,Ga)5O12:Ce、(Lu,Y,Gd,Tb)3(Al,Ga)5O12:Ceから選択された少なくとも一種で表される組成を含み、
前記第一の蛍光体の発光スペクトルの550nmにおける反射率が30%以下であり、
色温度が2500K以上4000K未満であり、平均演色性評価数Raが82よりも大きい発光装置。 - 請求項1に記載の発光装置であって、
前記第一の蛍光体の発光スペクトルの半値幅が85nm以下である発光装置。 - 請求項1又は2に記載の発光装置であって、
色温度が2500K以上2850K未満であり、前記発光ピーク波長における発光強度を100%として、550nmの発光強度が59%以下である発光装置。 - 請求項1又は2に記載の発光装置であって、
色温度が2850K以上3050K未満であり、前記発光ピーク波長における発光強度を100%として、550nmの発光強度が64%以下である発光装置。 - 請求項1又は2に記載の発光装置であって、
色温度が3050K以上3250K未満であり、前記発光ピーク波長における発光強度を100%として、550nmの発光強度が70%以下である発光装置。 - 請求項1又は2に記載の発光装置であって、
色温度が3250K以上3550K未満であり、前記発光ピーク波長における発光強度を100%として、550nmの発光強度が76.5%以下である発光装置。 - 請求項1又は2に記載の発光装置であって、
色温度が3550K以上4000K未満であり、前記発光ピーク波長における発光強度を100%として、550nmの発光強度が81.5%以下である発光装置。 - 請求項1〜7のいずれか一項に記載の発光装置であって、
前記発光素子の発光ピーク波長が430nm以上470nm以下の範囲内であって、前記混色光の発光ピーク波長における発光強度を100%として、前記発光素子の発光強度が120%未満である発光装置。 - 請求項1から8のいずれか一項に記載の発光装置であって、
前記tが、0.85≦t<1.0である発光装置。 - 請求項1から9のいずれか一項に記載の発光装置であって、
前記vが、0<v≦0.14である発光装置。
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