JP6448732B2 - モジュール型冷却装置を利用した放熱装置 - Google Patents
モジュール型冷却装置を利用した放熱装置 Download PDFInfo
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- JP6448732B2 JP6448732B2 JP2017172393A JP2017172393A JP6448732B2 JP 6448732 B2 JP6448732 B2 JP 6448732B2 JP 2017172393 A JP2017172393 A JP 2017172393A JP 2017172393 A JP2017172393 A JP 2017172393A JP 6448732 B2 JP6448732 B2 JP 6448732B2
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- heat
- cooling device
- heat dissipation
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- 238000001816 cooling Methods 0.000 title claims description 126
- 230000017525 heat dissipation Effects 0.000 title claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000008859 change Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
10:発熱素子
20,25,27:放熱プレート
30,35,37:放熱フィン
40,42,43,45,47:ハウジング
50,55:風向ガイド部材
60:ベントホール
70,71,72,73:冷却ファン
80:ケース
Claims (9)
- 発熱素子が配置される放熱プレートを備える複数のモジュール型冷却装置;及び
複数の前記モジュール型冷却装置を着脱可能に結合させるハウジングを含み、
前記ハウジングは、
外部フレーム;
前記外部フレームの内部に貫通するように形成される開口部;及び
前記外部フレームに設けられて前記開口部を区切り、前記開口部に挿入された前記モジュール型冷却装置を支持する、少なくとも一つのブリッジを含み、
前記モジュール型冷却装置は、前記放熱プレートの長さ方向に前記放熱プレートの下部にそれぞれ配置される複数の放熱フィンをさらに含み、
前記放熱フィンは、前記開口部に挿入されて、
前記放熱プレートは、前記外部フレーム及び前記ブリッジに置かれ、
複数の前記モジュール型冷却装置の間に挿入されて、前記モジュール型冷却装置の内部に流入する空気の流れを制御する、少なくとも一つの風向ガイド部材をさらに含む放熱装置。 - 前記風向ガイド部材の幅は、複数の前記モジュール型冷却装置の間の幅に対応して、
前記風向ガイド部材の長さは、前記モジュール型冷却装置の長さに対応して、
前記風向ガイド部材は、その前面の高さが前記放熱フィンの高さに対応して、後面に行くほどその高さは減少するように形成される、請求項1に記載の放熱装置。 - 前記放熱フィンを配置する部分の幅方向の長さは、前記放熱プレートの幅方向の長さより狭く配置される、請求項1に記載の放熱装置。
- 前記放熱フィンを配置する部分の長さ方向の長さは、前記放熱プレートの長さ方向の長さより狭く配置される、請求項1に記載の放熱装置。
- 発熱素子が配置される放熱プレートを備える複数のモジュール型冷却装置;及び
複数の前記モジュール型冷却装置を着脱可能に結合させるハウジングを含み、
前記ハウジングは、
外部フレーム;
前記外部フレームの内部に貫通するように形成される開口部;及び
前記外部フレームに設けられて前記開口部を区切り、前記開口部に挿入された前記モジュール型冷却装置を支持する、少なくとも一つのブリッジを含み、
前記モジュール型冷却装置の取り付けのために前記ハウジングの内部に形成された空間は、前記ブリッジにより区切られ、
前記ブリッジは、前記外部フレームに位置変化が可能に設けられて、
前記ブリッジの位置変化に従って、前記ブリッジにより区切られた空間の大きさ又は形状が変化される放熱装置。 - 前記外部フレームにはレールが形成され、
前記レールには、移動部が前記レールに沿って移動可能に設けられて、
前記ブリッジは、前記移動部に結合されて、前記外部フレームに移動可能に設けられる、請求項5に記載の放熱装置。 - 前記外部フレーム及び前記ブリッジには、前記放熱プレートの置かれる段差が形成される、請求項1〜6のいずれかに記載の放熱装置。
- 前記放熱プレートは長方形または正方形の形状である、請求項1〜6のいずれかに記載の放熱装置。
- 前記放熱プレートは金属材質からなる、請求項1〜6のいずれかに記載の放熱装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20-2017-0000907 | 2017-02-23 | ||
KR2020170000907U KR200494468Y1 (ko) | 2017-02-23 | 2017-02-23 | 모듈형 냉각장치를 이용한 방열 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018137418A JP2018137418A (ja) | 2018-08-30 |
JP6448732B2 true JP6448732B2 (ja) | 2019-01-09 |
Family
ID=59923213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017172393A Expired - Fee Related JP6448732B2 (ja) | 2017-02-23 | 2017-09-07 | モジュール型冷却装置を利用した放熱装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10251319B2 (ja) |
EP (1) | EP3367432A1 (ja) |
JP (1) | JP6448732B2 (ja) |
KR (1) | KR200494468Y1 (ja) |
CN (1) | CN108513490B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102148314B1 (ko) * | 2018-10-19 | 2020-08-26 | 에스티씨 주식회사 | 절연패드가 구비된 냉각모듈 및 냉각모듈의 제조방법 |
KR102248914B1 (ko) * | 2020-08-03 | 2021-05-04 | 정민호 | 절연패드가 구비된 냉각모듈 |
CN214240677U (zh) * | 2020-09-16 | 2021-09-21 | 深圳市英维克信息技术有限公司 | 新能源车及其电控盒 |
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-
2017
- 2017-02-23 KR KR2020170000907U patent/KR200494468Y1/ko active Active
- 2017-08-29 EP EP17188349.9A patent/EP3367432A1/en not_active Withdrawn
- 2017-09-05 US US15/695,040 patent/US10251319B2/en active Active
- 2017-09-07 JP JP2017172393A patent/JP6448732B2/ja not_active Expired - Fee Related
- 2017-09-14 CN CN201710827709.2A patent/CN108513490B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108513490B (zh) | 2020-06-16 |
KR20180002608U (ko) | 2018-08-31 |
KR200494468Y1 (ko) | 2021-10-18 |
CN108513490A (zh) | 2018-09-07 |
JP2018137418A (ja) | 2018-08-30 |
US10251319B2 (en) | 2019-04-02 |
EP3367432A1 (en) | 2018-08-29 |
US20180242474A1 (en) | 2018-08-23 |
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