JP6383742B2 - Substrate chuck device - Google Patents

Description

  The present invention relates to a substrate chuck apparatus, and more particularly to a configuration for holding a substrate in a substrate processing apparatus configured to perform predetermined processing by immersing a substrate in a liquid.

  2. Description of the Related Art Conventionally, there has been provided a substrate processing apparatus in which a predetermined processing is performed by immersing a substrate such as semiconductor silicon in a liquid. As an example of the substrate processing apparatus, a lift-off apparatus is known (see, for example, Patent Document 1). When a circuit pattern is generated on a substrate, the lift-off device uses a photoresist, which is a coating attached to the substrate, and a metal film formed on the photoresist in a wet environment such as immersing the substrate in a liquid. It is a device for removing from.

  8A to 8G are diagrams illustrating the operation of the lift-off process described in Patent Document 1. First, as shown in FIG. 8A, the substrate SS is placed on the stage 100 by a loader (loading mechanism) (not shown). Next, as shown in FIG. 8B, the inner valve 18 is closed, the peeling liquid PL is supplied from the liquid supply nozzle 201 to the liquid container 14, the motor 13 is driven, and the stage 100 is lowered to move the stage 100 onto the stage 100. The placed substrate SS is immersed in the peeling liquid PL.

  Then, as shown in FIG. 8C, in a state where the substrate SS is immersed in the peeling liquid PL, the ultrasonic wave is superposed on the substrate SS via the peeling liquid PL from the ultrasonic irradiation unit of the horn type ultrasonic generator 202. By irradiating the sound wave, almost all of the metal film on the substrate SS and the photoresist are removed from the substrate SS. At this time, the ultrasonic generator 202 is translated along the surface of the substrate SS as indicated by an arrow A, and at the same time, the substrate SS is rotated at a low speed as indicated by an arrow B to irradiate the entire surface of the substrate SS with ultrasonic waves. Like that. Further, the outer valve 19 is opened to drain the peeling liquid PL overflowing from the liquid container 14.

  When almost all of the metal film on the substrate SS and the photoresist are removed from the substrate SS, as shown in FIG. 8D, the stage 100 is moved upward and the inner valve 18 is opened to remove the peeling liquid PL from the liquid container 14. Drain the liquid. At this time, the outer valve 19 is closed, but it may be left open.

  Thereafter, as shown in FIG. 8E, the substrate SS in a state where almost all of the metal film and the photoresist are removed is subjected to rinse cleaning in which a rinse liquid is sprayed from the rinse liquid supply nozzle 203 to the substrate SS. The photoresist remaining on the substrate SS is removed. At this time, the rinsing liquid supply nozzle 203 is translated along the surface of the substrate SS as indicated by an arrow A, and at the same time, the substrate SS is rotated at a medium speed as indicated by an arrow B, whereby the rinsing liquid is applied to the entire surface of the substrate SS. Like to spray.

  When the photoresist remaining on the substrate SS can be removed from the substrate SS, as shown in FIG. 8F, the purified gas is blown from the gas supply nozzle 204 to the surface of the substrate SS to dry the substrate SS. . At this time, the gas supply nozzle 204 is translated along the surface of the substrate SS as indicated by an arrow A, and at the same time, the substrate SS is rotated at a high speed as indicated by an arrow B, whereby gas is blown over the entire surface of the substrate SS. Try to dry. Finally, as shown in FIG. 8G, the substrate SS is removed from the stage 100 by an unloader (unloading mechanism) (not shown), and a series of lift-off processes are completed.

  However, since the lift-off device described in Patent Document 1 has a configuration in which the substrate SS is simply placed on the stage 100, the substrate SS is immersed in the peeling liquid PL as shown in FIG. When performing the film removal process, there is a problem that the substrate SS is separated from the stage 100 and floats in the peeling liquid PL.

  On the other hand, a chuck device that can prevent the substrate from being lifted is known (see, for example, Patent Document 2). FIG. 8 and FIG. A shows a state in which the substrate 9 is held by the claw portion 421 of the movable chuck member 412. In this holding state, the claw portion 421 chucks the substrate 9. The claw portion 421 is fixed on the base portion 422. The base portion 422 is supported so as to be rotatable about a rotation shaft 401.

  On the other hand, FIG. 11 and FIG. B shows a state in which the holding of the substrate 9 by the claw portion 421 is released. When the holding of the substrate 9 is released, the abutting portion 311 moves together with the arm 314 and moves up by the cylinder 313, and the lever portion 423 of the movable chuck member 412 is pushed by the abutting portion 311. 412 rotates around the rotation shaft 401, and the claw portion 421 moves radially outward. As a result, the position of the movable chuck member 412 is changed from the chuck position to the unchuck position.

Japanese Patent No. 5345507 Japanese Patent Laying-Open No. 2015-188010

  If the movable chuck member 412 described in Patent Document 2 is used, the substrate 9 can be prevented from floating by moving the movable chuck member 412 to the chuck position. However, in Patent Document 2, in order to switch between chucking and unchucking, a complicated structure such as a moving mechanism 312 including a cylinder 313, an arm 314, and a contact portion 311 is required, and power for driving these is also required. I need it. Therefore, there has been a problem that the manufacturing cost and operating cost of the apparatus increase.

  The present invention has been made to solve such a problem, and an object thereof is to enable switching between a chuck and an unchuck with a simple structure without using power.

  In order to solve the above-described problem, in the present invention, a substrate mounting table is provided on a stage that is movable up and down in a liquid container, and a rotating member that is rotatable with respect to the mounting table. On the other hand, the contact member is erected on the bottom surface of the liquid container or on the side surface near the bottom surface. The portion outside the pivot point of the pivot member is pushed by the contact member and pivots upward when the stage moves downward and approaches the bottom surface of the liquid container, while the stage moves upward. When it is separated from the bottom surface of the liquid container, it rotates downward. Further, when the outer portion of the rotating member rotates upward, the inner portion rotates downward from the rotating fulcrum of the rotating member, and the tip of the inner portion moves to the chuck position, while the rotating member When the outer portion of the inner member rotates downward, the inner portion of the rotating member rotates upward, and the tip of the inner portion moves to the unchuck position.

  According to the present invention configured as described above, as the stage moves up and down, the rotating member rotates as a result of the outer portion of the rotating member abutting or separating from the abutting member. The tip of the inner part of the member moves to the chuck position or the unchuck position. Accordingly, the chuck and the unchuck can be switched without using power and without providing a complicated structure such as a moving mechanism that transmits power to the rotating member.

It is a figure which shows the example of a side cross-section structure of the lift-off apparatus which is an example of the substrate processing apparatus with which the substrate chuck apparatus by this embodiment was mounted. It is a figure which shows the plane structural example of the stage by this embodiment. It is a block diagram which expands and shows the substrate chuck apparatus by this embodiment. It is the top view which looked at the state which mounted the board | substrate on the mounting base and moved the rotation member to the chuck | zipper position from right above. It is a figure which shows the modification of the stage by this embodiment. It is a figure which shows the modification of the contact member by this embodiment. It is a figure which shows the modification of the contact member by this embodiment. It is a figure which shows the example (board | substrate loading) of the conventional lift-off process. It is a figure which shows the example (liquid supply) of the conventional lift-off process. It is a figure which shows the example (metal film removal) of the conventional lift-off process. It is a figure which shows the example (drainage) of the conventional lift-off process. It is a figure which shows the example (photoresist removal) of the conventional lift-off process. It is a figure which shows the example (drying) of the conventional lift-off process. It is a figure which shows the example (board | substrate unloading) of the conventional lift-off process.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a side cross-sectional configuration example of a lift-off apparatus that is an example of a substrate processing apparatus on which the substrate chuck apparatus according to the present embodiment is mounted. The lift-off device according to the present embodiment, when generating a pattern such as a circuit on the flat substrate SS, forms a photoresist from the substrate SS and a metal film formed thereon (hereinafter, both are collectively covered). Are removed in a wet environment except for the circuit pattern portion.

  In the lift-off apparatus according to the present embodiment, the covering is removed from the substrate SS by performing a lift-off process in a two-stage liquid process. In the first stage, almost all of the metal film and the photoresist are removed by irradiating the substrate with a strong ultrasonic wave while the substrate SS is immersed in a stripping liquid PL such as NMP that is soluble in the photoresist. To do. In the second stage, the peeling liquid PL remaining on the substrate SS is removed by using a soluble liquid that is soluble in the peeling liquid PL.

  In addition, the lift-off apparatus shown in FIG. 1 is shown by patent document 1, and what attached | subjected the code | symbol same as the code | symbol shown to FIG. 8A-FIG. 8G has the same function. Therefore, detailed description is omitted here, and only the portion related to the substrate chuck apparatus of the present embodiment will be described mainly.

  As shown in FIG. 1, the lift-off device of this embodiment includes a stage 10 on which a substrate SS is placed, and a liquid container 14 that contains a peeling liquid PL.

  The stage 10 is supported by a drive shaft 12 in a direction perpendicular to the surface, and the drive shaft 12 is supported by a seal bearing 11. The drive shaft 12 is translated in the vertical direction by the motor 13 and rotated in the horizontal direction. As a result, the stage 10 translates in the vertical direction in the liquid container 14 by driving the motor 13 and rotates in the horizontal direction around the drive shaft 12.

  As shown in FIG. 1, by moving the stage 10 below the upper edge of the liquid container 14, the substrate SS placed on the stage 10 can be immersed in the peeling liquid PL. A hood 15 is provided outside the liquid container 14. The hood 15 guides the peeling liquid PL overflowing from the liquid container 14 to the outer pipe 17, and the rinsing liquid discharged from the rinsing liquid supply nozzle 203 is horizontal due to the centrifugal force generated by the rotation of the substrate SS. This is to prevent the liquid container 14 from jumping out in the direction.

  FIG. 2 is a diagram illustrating a planar configuration example of the stage 10 according to the present embodiment. As shown in FIG. 2, the stage 10 of the present embodiment includes an arm 21 extending in four directions from the center. The four arms 21 extend in a direction that forms an angle of 90 degrees with each other, and have a cross shape when viewed from directly above.

  Each of the four arms 21 is provided with a mounting table 22 on which a substrate SS, which is an example of a substrate, is mounted, and a rotating member 23 that is rotatably attached to the mounting table 22. . That is, in the present embodiment, the mounting tables 22 are provided at a plurality of locations on the stage 10, and the rotatable 23 is attached to the mounting tables 22 at the plurality of locations. The mounting table 22 and the rotating member 23 are provided near the tip of the arm 21.

  As shown in FIG. 1, a contact member 20 is erected on the bottom surface of the liquid container 14. The contact member 20 contacts the rotating member 23 when the stage 10 stops rotating and moves downward. In the present embodiment, the abutting member 20 is configured by rod-like pins that are erected at a plurality of locations on the bottom surface of the liquid container 14. Further, a hole 24 through which the abutting member 20 passes is formed at the distal end side of the arm 21.

  In this embodiment, when the rotation of the stage 10 is stopped, the arm 21 is controlled so as to be positioned at a predetermined home position. The four contact members 20 erected on the bottom surface of the liquid container 14 are provided at positions facing the holes 24 when the arm 21 is stopped at the home position.

  FIG. 3 is an enlarged configuration diagram illustrating the substrate chuck apparatus according to the present embodiment. As shown in FIG. 3, the mounting table 22 is provided with a recess 31 on the inner peripheral side of the upper surface. The edge of the substrate SS mounted on the mounting table 22 is fitted in the recess 31. Since the mounting table 22 in the vicinity of the tips of the four arms 21 provided in a cross shape has the recesses 31, the horizontal displacement of the mounted substrate SS can be suppressed. .

  The rotating member 23 is rotatably attached to the mounting table 22 by a rotating shaft 32. That is, the rotation member 23 is configured to be rotatable about the rotation shaft 32 as a rotation fulcrum. The rotating member 23 is configured such that the weight of the outer portion 23 a from the rotating shaft 32 is heavier than the weight of the inner portion 23 b from the rotating shaft 32. As a result, in a steady state where the rotating member 23 does not receive external force, as shown in FIG. 3A, the outer portion 23a of the rotating member 23 rotates downward and the inner portion 23b rotates upward. It has become a state.

  When the stage 10 moves downward and approaches the bottom surface of the liquid container 14, the outer portion 23a of the rotating member 23 comes into contact with the contact member 20 as shown in FIG. It is pushed by the contact member 20 and rotates upward. At this time, the inner portion 23b rotates downward from the rotation shaft 32. The inner portion 23b is set to a length such that the tip protrudes toward the concave portion 31 in a state where it is rotated downward (chuck position).

  FIG. 4 is a plan view of the state in which the substrate SS is mounted on the mounting table 22 and the rotating member 23 is moved to the chuck position, as viewed from directly above. The tip of the inner portion 23 b of the rotating member 23 covers the edge of the substrate SS placed in the recess 31 of the placement table 22 from above. Thereby, it is possible to prevent the substrate SS placed in the recess 31 from being lifted upward.

  When the inner portion 23b of the rotating member 23 rotates downward and the tip of the inner portion 23b moves to the chuck position, the distance between the bottom surface of the recess 31 and the tip of the inner portion 23b is the substrate to be placed. It may be larger than the thickness of SS.

  On the other hand, when the stage 10 moves upward and moves away from the bottom surface of the liquid container 14, the outer portion 23a of the rotating member 23 moves away from the contact member 20 and moves downward as shown in FIG. Rotate. At this time, the inner portion 23b rotates upward from the rotating shaft 32, and the tip of the inner portion 23b moves to the unchuck position. Thereby, the loading / unloading of the substrate SS with respect to the recess 31 can be performed.

  As described above in detail, in the present embodiment, the mounting table 22 for the substrate SS is provided on the stage 10 that is movable up and down in the liquid container 14, and is rotatable with respect to the mounting table 22. While the rotating member 23 is provided, the contact member 20 is erected on the bottom surface of the liquid container 14. The outer portion 23a of the rotation member 23 from the rotation fulcrum is pushed downward by the contact member 20 and rotated upward when the stage 10 moves downward and approaches the bottom surface of the liquid container 14. When 10 moves upward and moves away from the bottom surface of the liquid container 14, it rotates downward. Further, when the outer portion 23a of the turning member 23 is turned upward, the inner portion 23b is turned downward from the turning fulcrum of the turning member 23, and the tip of the inner portion 23b is moved to the chuck position. On the other hand, when the outer portion 23a of the rotating member 23 rotates downward, the inner portion 23b of the rotating member 23 rotates upward, and the tip of the inner portion 23b moves to the unchuck position. Yes.

  According to the substrate chuck apparatus of the present embodiment configured as described above, the outer portion 23a of the rotating member 23 contacts or separates from the contact member 20 as the stage 10 moves up and down during the lift-off process. As a result, the rotating member 23 is rotated, whereby the tip of the inner portion 23b of the rotating member 23 is moved to the chuck position or the unchuck position. Accordingly, the chuck and the unchuck can be switched without using power and without providing a complicated structure such as a moving mechanism for transmitting the power to the rotating member 23.

  In the above embodiment, an example has been described in which the stage 10 is configured by the four arms 21 formed in a cross shape, and the mounting table 22 for the substrate SS is provided for each of the four arms 21. It is not limited to. For example, the number of arms 21 may be two or five or more.

  Alternatively, instead of the structure of the arm 21, as shown in FIG. 5, the stage 10 ′ may have a disk shape, and a ring-shaped mounting table 22 ′ may be provided along the outer periphery thereof. In this case, it is possible to provide concave depressions at four locations on the mounting table 22 ′ and attach the rotating member 23 through the rotation shaft 32 in the depressions.

  Moreover, although the said embodiment demonstrated the structure which attaches the four rotation members 23 with respect to the four mounting bases 22, this invention is not limited to this. For example, the rotating member 23 may be provided in a smaller number than the mounting table 22. For example, the rotating member 23 may be attached only to the two mounting tables 22 at the opposing positions among the four mounting tables 22. Or you may make it attach the rotation member 23 only with respect to the mounting base 22 among four.

  Moreover, although the said embodiment demonstrated the example which erects the pin-shaped contact member 20 from the bottom face of the liquid container 14, this invention is not limited to this. For example, as shown in FIG. 6, a contact member 20 ′ having a pin shape or a planar shape may be erected from the side surface near the bottom surface of the liquid container 14.

  Moreover, although the said embodiment demonstrated the example which fixedly mounts this section member 20 on the bottom face of the liquid container 14, this invention is not limited to this. For example, as shown in FIG. 7, the bottom surface of the liquid container 14 and the end of the contact member 20 are connected by a spring 25, or a part of the contact member 20 is made an elastic body to The member 20 may be configured to be movable or variable in the vertical direction. In this way, even when the thickness of the substrate SS placed on the placement table 22 is different, the outer portion 23a of the rotating member 23 can suppress the substrate SS without damage by a constant pressing force. It becomes.

  Moreover, although the said embodiment demonstrated the example comprised so that the weight of the outer side part 23a of the rotation member 23 might become heavier than the weight of the inner side part 23b of the rotation member 23, this invention is not limited to this. . For example, in a state where the outer portion 23a is not pressed by the contact member 20, that is, in a steady state where no external force is applied, the outer portion 23a may be urged by a coil spring or the like so as to rotate downward. In addition, according to the said embodiment, since only the weight balance of the outer part 23a and the inner part 23b of the rotation member 23 can make the outer part 23a rotate below in a steady state, the number of parts This is preferable in that the configuration can be simplified by reducing the number of.

  Moreover, although the said embodiment demonstrated the example which applies the board | substrate chuck | zipper apparatus of this invention to the lift-off apparatus made to immerse the board | substrate SS in the liquid stored in the liquid container 14 and to perform a lift-off process, an application example Is not limited to this. The present invention can be applied to any substrate processing apparatus that performs a predetermined process by immersing a substrate in a liquid stored in a liquid container.

  In addition, each of the above-described embodiments is merely an example of implementation in carrying out the present invention, and the technical scope of the present invention should not be construed in a limited manner. That is, the present invention can be implemented in various forms without departing from the gist or the main features thereof.

DESCRIPTION OF SYMBOLS 10 Stage 21 Arm 22, 22 'Mounting stand 23 Rotating member 23a Outer part of rotating member 23b Inner part of rotating member 31 Recessed part 32 Rotating shaft

Claims (3)

A substrate chuck device used in a substrate processing apparatus adapted to perform predetermined processing by immersing a substrate in a liquid stored in a liquid container,
A stage that is movable up and down in the liquid container;
A mounting table provided on the stage for mounting the substrate;
A rotating member attached to the mounting table in a rotatable manner;
A contact member erected on the bottom surface of the liquid container or a side surface near the bottom surface,
The outer part of the pivoting member of the pivoting member comes into contact with the contact member when the stage moves downward and approaches the bottom surface of the liquid container, and is pushed upward by the contact member. While moving, the stage is moved upward and separated from the bottom surface of the liquid container so as to move away from the contact member and rotate downward.
When the outer portion of the rotating member is rotated upward, the inner portion is rotated downward from the rotation fulcrum of the rotating member, and the tip of the inner portion is moved to the chuck position, while the rotation portion is rotated. When the outer portion of the moving member rotates downward, the inner portion of the rotating member rotates upward, and the tip of the inner portion moves to the unchuck position. A substrate chuck device.   The substrate chuck apparatus according to claim 1, wherein the weight of the outer portion of the rotating member is configured to be heavier than the weight of the inner portion of the rotating member. The mounting table is provided at a plurality of locations on the stage,
The rotating member is rotatably attached to the plurality of mounting tables,
The substrate chuck apparatus according to claim 1, wherein the abutting member is configured by pins erected at a plurality of locations on a bottom surface of the liquid container.