CN216213290U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
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- CN216213290U CN216213290U CN202122638383.3U CN202122638383U CN216213290U CN 216213290 U CN216213290 U CN 216213290U CN 202122638383 U CN202122638383 U CN 202122638383U CN 216213290 U CN216213290 U CN 216213290U
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Abstract
The utility model provides a wafer cleaning device, comprising: the wafer bearing assembly comprises a first fixing unit and a second fixing unit, wherein the wafer can be positioned at a first station and a second station, the first fixing unit adsorbs a central area of the back surface of the wafer and can drive the wafer to rotate on the first station, the second fixing unit adsorbs a non-central area of the back surface of the wafer on the second station, and the second fixing unit translates to switch the station where the wafer is positioned; the cleaning assembly comprises a first nozzle, a second nozzle and a brush respectively used for spraying inert gas and cleaning liquid to the back of the wafer and brushing the back of the wafer, wherein the first nozzle and the brush can move along the radial direction of the wafer, and through the matching between the wafer bearing assembly and the cleaning assembly, pollution particles on the wafer are effectively cleaned, the defocusing phenomenon of the wafer is further improved, and the product yield is improved.
Description
Technical Field
The utility model relates to the field of semiconductors, in particular to a wafer cleaning device.
Background
Immersion lithography is a step-and-scan exposure of photoresist in pure water, which has very high requirements on wafer levelness, but due to the alternate use of a large amount of new materials, the chance of contamination of the back of the wafer by particles, which are sandwiched between the worktable and the wafer, is increased, resulting in local protrusion of the wafer surface. The depth of focus of the existing 32nm node technology key layer is only about 100nm, the depth of focus of the 20nm node technology key layer is only about 60nm, and if the height of the protrusion exceeds the depth of focus during exposure, dead spots are formed, and the phenomenon of scorching is caused. Usually, the defocus phenomenon causes the photoresist profile obtained in the photolithography process to be abnormal and the photoresist value to be abnormal, thereby further causing the pattern after etching to be abnormal. Generally, the wafer with defocus that can be intercepted in the defect detection stage only accounts for 20% -30% of the abnormal wafer, and other wafers that are not intercepted will have different effects on the final yield.
In order to reduce the occurrence frequency of wafer scorching, different wafer cleaning devices are added by each lithography machine manufacturer. At present, the widely used wafer cleaning device mainly divides the back of the wafer into different areas, and uses the brush and the cleaning solution to clean the back of the wafer in sequence, generally, the central area, the non-central area and the edge area of the back of the wafer are cleaned in sequence, and finally the cleaning solution is thrown away from the back of the wafer by centrifugal force. However, the particles in the central area of the back of the wafer cannot be effectively removed only by the brush and the cleaning solution, and the cleaning solution and the particles remaining on the back of the wafer cannot be removed in a single spin-drying manner, so that the particles on the back of the wafer remain, and the particles can remain on a sample stage of the lithography machine to pollute the next wafer, thereby causing defects such as wafer scorching and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wafer cleaning device to remove particles on the back of a wafer and reduce the wafer scorching phenomenon.
In order to achieve the above object, the present invention provides a wafer cleaning apparatus, comprising:
the wafer bearing assembly comprises a first fixing unit and a second fixing unit, wherein the wafer can be positioned at a first station and a second station, the first fixing unit adsorbs a central area of the back surface of the wafer and can drive the wafer to rotate on the first station, the second fixing unit adsorbs a non-central area of the back surface of the wafer on the second station, and the second fixing unit translates to switch the station where the wafer is positioned;
and the cleaning assembly comprises a first nozzle, a second nozzle and a brush, and the first nozzle, the second nozzle and the brush are respectively used for spraying inert gas and cleaning liquid to the back surface of the wafer and brushing the back surface of the wafer, wherein the first nozzle and the brush can move along the radial direction of the wafer.
Optionally, the wafer cleaning apparatus further includes a protection component, and the protection component includes:
the workpiece table is provided with a cavity, and the wafer bearing assembly and the cleaning assembly are both positioned in the cavity;
a protective cover covering the cavity.
Optionally, the first fixing unit includes:
the rotary table is used for bearing and driving the wafer to rotate;
and the first vacuum adsorption holes are positioned in the turntable and are connected with the first vacuum assembly so as to adsorb the central area of the back surface of the wafer.
Optionally, the first fixing unit further includes:
the ejector pins are uniformly distributed on the outer side of the rotary table and used for jacking the wafer.
Optionally, the second fixing unit includes:
the bearing tables are distributed along the circumferential direction of the circle center of the wafer and are used for bearing and driving the wafer to translate;
and the second vacuum adsorption holes are positioned in the bearing table and are connected with the second vacuum assembly so as to adsorb the non-central area of the back surface of the wafer.
Optionally, the cleaning assembly further comprises:
the movable first manipulator is connected with the brush tool and is used for driving the brush tool to move;
the movable second mechanical arm is arranged below the wafer and used for driving the second nozzle to move;
the first nozzle is provided on the first manipulator or the second manipulator.
Optionally, the first nozzle is detachably disposed on the first manipulator or the second manipulator.
Optionally, the first nozzle sprays the inert gas towards the center of the wafer along the edge of the wafer, and the direction of the inert gas sprayed out and the back of the wafer form an included angle, and the included angle is smaller than 90 degrees.
Optionally, at least two of the second nozzles are uniformly distributed along the back side of the wafer.
Optionally, the spraying direction of the second nozzle is perpendicular to the back surface of the wafer.
The utility model provides a wafer cleaning device, comprising: the wafer bearing assembly comprises a first fixing unit and a second fixing unit, wherein the first fixing unit adsorbs a central area of the back surface of the wafer and can drive the wafer to rotate, and the second fixing unit adsorbs a non-central area of the back surface of the wafer and drives the wafer to translate; the cleaning assembly comprises a first nozzle, a second nozzle and a brush respectively used for spraying inert gas and cleaning liquid to the back of the wafer and brushing the back of the wafer, wherein the first nozzle and the brush can move along the radial direction of the wafer, the wafer cleaning device effectively cleans pollution particles on the wafer through the matching between the wafer bearing assembly and the cleaning assembly, and the first nozzle is used for further drying the pollution particles and the cleaning liquid remained on the wafer, so that the defocusing phenomenon of the wafer is improved, and the product yield is improved.
Drawings
Fig. 1 is a bottom view of a wafer cleaning apparatus according to an embodiment of the present invention;
fig. 2 is a bottom view of a wafer cleaning apparatus for cleaning a central region of a backside of a wafer according to an embodiment of the present invention;
FIG. 3 is a bottom view of a wafer cleaning apparatus for cleaning a non-central region of a backside of a wafer according to an embodiment of the present invention;
FIG. 4 is a bottom view of a wafer cleaning apparatus for cleaning a backside edge region of a wafer according to an embodiment of the present invention;
fig. 5 is a bottom view of a wafer cleaning apparatus for spin-drying a wafer according to an embodiment of the present invention;
wherein the drawings are described as follows:
100-a wafer; 102-a protective cover; 104-a clip; 106-a carrier table; 108-a turntable; 110-ejector pin; 112-a second nozzle; 114-a brush; 116-first nozzle.
Detailed Description
To further clarify the objects, advantages and features of the present invention, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
Fig. 1 is a bottom view of a wafer cleaning apparatus provided in this embodiment, as shown in fig. 1, the wafer cleaning apparatus includes: a wafer bearing component and a cleaning component.
The wafer carrier assembly includes a first fixing unit and a second fixing unit, the wafer 100 may be located at a first station and a second station, the first fixing unit adsorbs a central region of the back surface of the wafer 100 and can drive the wafer 100 to rotate at the first station, the second fixing unit adsorbs a non-central region of the back surface of the wafer 100 at the second station, and the second fixing unit translates to switch the station where the wafer 100 is located.
The first fixing unit includes: a turntable 108 and a plurality of first vacuum suction holes, wherein the plurality of first vacuum suction holes are located in the turntable 108 and connected to a first vacuum assembly to suck a central region of the backside of the wafer 100.
Further, when the wafer 100 is located at the first station, the turntable 108 is located at the center of the wafer 100, the first vacuum suction hole is opened, and the turntable 108 sucks a central region of the back surface of the wafer 100 and drives the wafer 100 to rotate.
The first fixing unit further includes: the ejector pins 110 are uniformly distributed on the outer side of the turntable 108, and are used for ejecting the wafer 100. Before the wafer 100 is cleaned, the thimble 110 can be lifted up and used for carrying the wafer 100, and the wafer 100 is transferred from the outside to the wafer cleaning device; or, after the wafer 100 is cleaned, the ejector pin 110 is lifted, and the wafer 100 is sent out of the wafer cleaning device; when the wafer 100 is switched from the first station to the second station, the ejector pin 110 is raised to assist the wafer 100 to be detached from the second fixing unit.
In the present embodiment, three pins 110 are provided to ensure the stability of the pins 110 when carrying the wafer 100.
Further, the second fixing unit includes: at least two susceptors 106 and a plurality of second vacuum suction holes, wherein the plurality of second vacuum suction holes are located in the susceptors 106 and connected to a second vacuum assembly to suck a non-central region of the backside of the wafer 100.
At least two of the loading platforms 106 are distributed along the circumferential direction of the center of the wafer 100, and are used for loading and driving the wafer 100 to translate. When the second vacuum suction hole is opened, the susceptor 106 sucks the back of the wafer 100, thereby fixing the wafer 100 and preventing the wafer 100 from being displaced and even falling off when the wafer 100 is cleaned by the brush 114; meanwhile, the susceptor 106 may drive the wafer 100 to move when moving, so as to facilitate the transfer of the wafer 100.
It should be understood that in the present embodiment, two symmetrical susceptors 106 are disposed on the back of the wafer 100, respectively, so as to further simplify the apparatus while ensuring the stability of the wafer 100. In other alternative embodiments, three or more of the susceptors 106 may be distributed along the circumference of the center of the wafer 100 at a non-central position on the back of the wafer 100.
With continued reference to fig. 1, the cleaning assembly includes: a first nozzle 116, a second nozzle 112, a brush 114, a moveable first robot and a moveable second robot.
The brush 114 is disposed on the first robot arm, and is configured to brush the back surface of the wafer 100, the first robot arm drives the brush 114 to rotate and swing, and the first robot arm can drive the brush 114 to radially move along the wafer 100, so as to better clean different areas on the back surface of the wafer 100. The brush 114 and the first manipulator are detachably connected, so that the brush 114 can be conveniently replaced after being damaged, and meanwhile, the contact strength between the bristles of the brush 114 and the back of the wafer 100 can be adjusted, and further, the cleaning force can be adjusted.
The first nozzle 116 is used for spraying an inert gas to the back side of the wafer 100, in this embodiment, the inert gas is nitrogen, and nitrogen has stable chemical properties, is cheap and convenient to prepare, and can effectively save cost.
The first nozzle 116 is connected to the inert gas supply assembly and disposed on the second robot, the second robot drives the first nozzle to move along the radial direction of the wafer 100, and the first nozzle 116 is detachably connected to the second robot, so that a worker can adjust the position of the first nozzle 116 conveniently.
In alternative embodiments, the first nozzle 116 may be disposed on the first robot such that the brush 114 moves in synchronization with the first nozzle 116. However, since the brush 114 may swing or rotate during the cleaning process, a fixing component needs to be additionally installed between the first nozzle 116 and the first manipulator to ensure that the first nozzle 116 does not fall off during the cleaning process.
In this embodiment, at least two second nozzles 112 are uniformly distributed along the back side of the wafer 100, the second nozzles 112 are connected to the cleaning solution supply assembly for spraying the cleaning solution onto the back side of the wafer 100, and the spraying direction of the second nozzles 112 is perpendicular to the back side of the wafer 100.
In other alternative embodiments, a different number of second nozzles 112 may be provided, so that only a uniform spray of the backside of the wafer 100 is required.
The wafer cleaning device further comprises a protection assembly, wherein the protection assembly comprises: a workpiece table and a protective cover 102.
The workpiece table is provided with a cavity, and the wafer bearing assembly and the cleaning assembly are both positioned in the cavity.
The protective cover 102 covers the cavity, and the cavity and the protective cover 102 form a closed space, so that cleaning liquid is prevented from splashing to other equipment in the cleaning process, and the other equipment is protected from being corroded by the cleaning liquid; and simultaneously creates conditions for the vacuum environment in the cleaning process.
Furthermore, the workpiece table is provided with clamps 104 which are clamped at two sides of the protective cover 102, and the protective cover 102 is fixed and the protective cover 102 is driven to move.
When the wafer 100 is cleaned, the wafer 100 is transferred into the wafer cleaning device, the thimble 110 is raised to bear the wafer 100, then the thimble 110 is lowered to place the wafer 100 on the bearing table 106, the bearing table 106 is opened to vacuum to absorb the wafer 100, and at the moment, a connection line of the two bearing tables 106 passes through the center of the wafer 100; the protective cover 102 is placed over the wafer 100.
Fig. 2 is a bottom view of the wafer cleaning apparatus provided in this embodiment when the wafer 100 is cleaned in the central area of the back, as shown in fig. 2, when the central area of the wafer 100 is to be cleaned, the workpiece stage drives the protective cover 102 to move, the susceptor 106 drives the wafer 100, so that the wafer 100 and the protective cover 102 move synchronously, when the brush 114 is aligned with the center of the wafer 100, the wafer 100 stops moving, the brush 114 rotates and swings, and at this time, the wafer 100 is located at the second station; adjusting the position of the second nozzle 112 to uniformly spray the cleaning solution on the back of the wafer 100, opening the second nozzle 112, and spraying the cleaning solution on the wafer 100; the first nozzle 116 is aligned with the brush 114, and the first nozzle 116 is opened to spray nitrogen gas to the central region of the back of the wafer 100 to assist the brush 114 in cleaning.
After the central area of the wafer 100 is cleaned, cleaning the non-central area, fig. 3 is a bottom view of the wafer cleaning apparatus provided in this embodiment when cleaning the non-central area on the back of the wafer, as shown in fig. 3, after the central area of the wafer 100 is cleaned, the brush 114 stops swinging and rotating, and the first nozzle 116 and the second nozzle 112 are closed; the workpiece stage 104 drives the protective cover 102 to return to the original position, the bearing stage 106 drives the wafer 100 to return to the first station, the bearing stage 106 closes the vacuum state and is separated from the wafer 100, the turntable 108 ascends and is in contact with the wafer 100, the state starts vacuum adsorption to the center position of the wafer 100, at the moment, the wafer 100 is located at the first station, and the turntable 108 drives the wafer 100 to rotate; the wafer cleaning device starts a vacuum mode, so that a vacuum state is formed between the cavity of the workpiece table and the interior of the protective cover 102, and pollution particles are conveniently separated from the wafer 100; the first robot drives the brush 114 to move along the radial direction of the wafer 100, so that the distance between the edge of the brush 114 and the edge of the wafer 100 is 2-3 mm, and the brush 114 rotates and swings to clean the non-central area of the wafer 100. When the wafer cleaning apparatus is in the vacuum-on state, the first nozzle 116 is closed, so as to avoid affecting the vacuum state in the apparatus.
After the non-central area of the wafer 100 is cleaned, the edge area is cleaned, fig. 4 is a bottom view of the wafer cleaning apparatus provided in this embodiment when the edge area on the back of the wafer is cleaned, as shown in fig. 4, after the wafer cleaning apparatus finishes cleaning the non-central area of the wafer 100, the apparatus is turned off in a vacuum state, the brush 114 stops swinging and rotating, and the wafer 100 continues to rotate; the second nozzle 112 is opened; the brush 114 moves to the edge region of the wafer 100, the first nozzle 116 moves to the edge region of the wafer 100 synchronously with the brush 114, and the first nozzle 116 is opened to assist the brush 114 in cleaning.
After the edge area of the wafer 100 is cleaned, the wafer is dried, fig. 5 is a bottom view of the wafer cleaning apparatus provided in this embodiment when the wafer is dried, as shown in fig. 5, after the wafer cleaning apparatus finishes cleaning the edge area of the wafer 100, the brush 114 leaves the back of the wafer 100, the second nozzle 112 is closed, the wafer 100 continuously rotates, and the first nozzle 116 continuously operates, so that the residual cleaning solution and the contaminant particles are thrown away from the wafer 100 by the centrifugal force and the action of nitrogen gas; the first nozzle 116 continues to operate until the wafer 100 is completely spun dry.
In summary, the present invention provides a wafer cleaning apparatus, comprising: the wafer bearing assembly comprises a first fixing unit and a second fixing unit, wherein the first fixing unit adsorbs a central area of the back surface of the wafer 100 and can drive the wafer 100 to rotate, and the second fixing unit adsorbs a non-central area of the back surface of the wafer 100 and drives the wafer 100 to translate; the cleaning assembly comprises a first nozzle 116, a second nozzle 112 and a brush 114, which are respectively used for spraying inert gas and cleaning liquid to the back surface of the wafer 100 and brushing the back surface of the wafer 100, wherein the first nozzle 116 and the brush 114 can move along the radial direction of the wafer 100, the wafer cleaning device effectively cleans the pollution particles on the wafer through the cooperation of the cleaning assemblies, and the first nozzle 116 is used for further drying the pollution particles and the cleaning liquid left on the wafer 100, so that the defocusing phenomenon of the wafer is improved, and the product yield is improved.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (10)
1. A wafer cleaning apparatus, comprising:
the wafer bearing assembly comprises a first fixing unit and a second fixing unit, wherein the wafer can be positioned at a first station and a second station, the first fixing unit adsorbs a central area of the back surface of the wafer and can drive the wafer to rotate on the first station, the second fixing unit adsorbs a non-central area of the back surface of the wafer on the second station, and the second fixing unit translates to switch the station where the wafer is positioned;
and the cleaning assembly comprises a first nozzle, a second nozzle and a brush, and the first nozzle, the second nozzle and the brush are respectively used for spraying inert gas and cleaning liquid to the back surface of the wafer and brushing the back surface of the wafer, wherein the first nozzle and the brush can move along the radial direction of the wafer.
2. The wafer cleaning apparatus as recited in claim 1, further comprising a protective assembly, the protective assembly comprising:
the workpiece table is provided with a cavity, and the wafer bearing assembly and the cleaning assembly are both positioned in the cavity;
a protective cover covering the cavity.
3. The wafer cleaning apparatus as set forth in claim 1, wherein the first fixing unit comprises:
the rotary table is used for bearing and driving the wafer to rotate;
and the first vacuum adsorption holes are positioned in the turntable and are connected with the first vacuum assembly so as to adsorb the central area of the back surface of the wafer.
4. The wafer cleaning apparatus as recited in claim 3, wherein the first fixing unit further comprises:
the ejector pins are uniformly distributed on the outer side of the rotary table and used for jacking the wafer.
5. The wafer cleaning apparatus as set forth in claim 1, wherein the second fixing unit comprises:
the bearing tables are distributed along the circumferential direction of the circle center of the wafer and are used for bearing and driving the wafer to translate;
and the second vacuum adsorption holes are positioned in the bearing table and are connected with the second vacuum assembly so as to adsorb the non-central area of the back surface of the wafer.
6. The wafer cleaning apparatus of claim 1, wherein the cleaning assembly further comprises:
the movable first manipulator is connected with the brush tool and is used for driving the brush tool to move;
the movable second mechanical arm is arranged below the wafer and used for driving the second nozzle to move;
the first nozzle is provided on the first manipulator or the second manipulator.
7. The wafer cleaning apparatus of claim 6, wherein the first nozzle is removably disposed on the first robot or the second robot.
8. The wafer cleaning apparatus of claim 1, wherein the first nozzle ejects the inert gas along the edge of the wafer toward the center thereof, and the direction of the ejected inert gas forms an angle with the back surface of the wafer, the angle being smaller than 90 degrees.
9. The wafer cleaning apparatus of claim 1, wherein at least two of the second nozzles are evenly distributed along the backside of the wafer.
10. The wafer cleaning apparatus as claimed in claim 1, wherein the spraying direction of the second nozzle is perpendicular to the back surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122638383.3U CN216213290U (en) | 2021-10-28 | 2021-10-28 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122638383.3U CN216213290U (en) | 2021-10-28 | 2021-10-28 | Wafer cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN216213290U true CN216213290U (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122638383.3U Active CN216213290U (en) | 2021-10-28 | 2021-10-28 | Wafer cleaning device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115228821A (en) * | 2022-08-18 | 2022-10-25 | 宁波芯丰精密科技有限公司 | Wafer cleaning device and cleaning method |
| CN117497401A (en) * | 2024-01-02 | 2024-02-02 | 宁波润华全芯微电子设备有限公司 | Wafer back surface cleaning method and device |
-
2021
- 2021-10-28 CN CN202122638383.3U patent/CN216213290U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115228821A (en) * | 2022-08-18 | 2022-10-25 | 宁波芯丰精密科技有限公司 | Wafer cleaning device and cleaning method |
| CN115228821B (en) * | 2022-08-18 | 2024-11-22 | 宁波芯丰精密科技有限公司 | Wafer cleaning device and cleaning method |
| CN117497401A (en) * | 2024-01-02 | 2024-02-02 | 宁波润华全芯微电子设备有限公司 | Wafer back surface cleaning method and device |
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