CN206961798U - Substrate processing apparatus and head cleaning apparatus - Google Patents

Abstract

The present disclosure provides a substrate processing device and a nozzle cleaning device. The substrate processing device comprises: a substrate holding portion for holding a substrate; at least one process liquid spraying unit, comprising a nozzle, for spraying a process liquid along a path above the substrate; and a nozzle cleaning device, arranged outside the periphery of the substrate holding portion, for spraying a cleaning liquid on the nozzle of the at least one process liquid spraying unit placed on the nozzle cleaning device.

Description

Substrate processing device and nozzle cleaning device

technical field

The disclosure relates to a substrate processing device and a nozzle cleaning device, in particular to a substrate processing device for wet etching, which has a nozzle cleaning device for cleaning the nozzle.

Background technique

Nowadays, in the semiconductor process, the wet etching or cleaning of the wafer is performed by a single wafer spin processor. In the process of wet etching or cleaning, there will be multiple etching and cleaning procedures. For example, the wafer is first etched with the first chemical liquid, and then the wafer is etched with the second chemical liquid for the second time. , and finally rinse off the residual chemical solution on the wafer with cleaning solution. Generally speaking, in order to make the overall configuration of the machine relatively simple and miniaturized, the pipelines for supplying chemical liquid, gas or cleaning liquid will be integrated on the same process liquid spraying unit, so that the spray head of the process liquid spraying unit Appropriate fluids may be sprayed according to current procedures.

However, after the chemical liquid is sprayed by the process liquid spraying unit, the problem that the chemical liquid remains in the spray head is likely to occur, so that when the process liquid spraying unit continues to spray the cleaning liquid, the remaining chemical liquid will pollute the current Cleaning fluid, thereby affecting the quality of the product.

In view of this, it is necessary to propose a substrate processing device and a nozzle cleaning device to solve the problems existing in the prior art.

Utility model content

In order to solve the above-mentioned problems in the prior art, the purpose of the present disclosure is to provide a substrate processing device and a nozzle cleaning device, so as to prevent the remaining chemical liquid from polluting the current when spraying the cleaning liquid due to the chemical liquid remaining in the nozzle in the prior art. The cleaning fluid will affect the quality of the product.

To achieve the above object, the present disclosure provides a substrate processing device, comprising: a substrate holding part for holding a substrate; at least one process liquid spraying unit including a spray head for spraying a process liquid along a path above the substrate a process liquid; and a nozzle cleaning device, disposed outside the periphery of the substrate holding part, for spraying a cleaning liquid on the nozzles of the at least one process liquid spraying unit placed on the nozzle cleaning device.

In one of the preferred embodiments of the present disclosure, the nozzle cleaning device comprises: a hollow base including an annular wall and a pipeline section connected to one end of the annular wall, wherein the interior of the annular wall forms There is an accommodating space for accommodating the spray head therein; a cleaning liquid spraying pipeline extending to the interior of the pipeline section, wherein the outlet of the cleaning liquid spraying pipeline is aligned with the accommodating a space for spraying the cleaning liquid on the nozzle accommodated in the accommodating space; and a liquid discharge pipe connected to the pipeline section for discharging the cleaning liquid after cleaning the nozzle.

In one of the preferred embodiments of the present disclosure, the drain pipe further includes an on-off valve for controlling the on-off of the drain pipe.

In one of the preferred embodiments of the present disclosure, the at least one process liquid spraying unit further includes: a moving mechanism connected with the spray head for controlling the spray head to move from a standby position to the substrate holding part, The process liquid is sprayed along the path over the substrate.

In one of the preferred embodiments of the present disclosure, the moving mechanism includes: a rotary driving part, used to control the rotation of the at least one process liquid spraying unit on a plane around a rotating shaft; and a lifting driving part, used to Controlling the at least one process liquid spraying unit to vertically lift along a direction perpendicular to the plane.

In one of the preferred embodiments of the present disclosure, the nozzle cleaning device is set at the standby position.

In one of the preferred embodiments of the present disclosure, the spray head of the at least one process liquid spraying unit includes: at least one nozzle for spraying the process liquid; and a shield set around the at least one process liquid around the nozzle.

In one of the preferred embodiments of the present disclosure, the nozzle cleaning device includes an annular wall, and an accommodating space is formed inside the annular wall for accommodating the nozzle therein, and the accommodating space The configuration corresponds to and cooperates with the configuration of the shield of the spray head.

In one of the preferred embodiments of the present disclosure, the nozzle cleaning device further includes an air supply pipeline, and the air outlet of the air supply pipeline is aligned with the accommodating space, so as to The shower head provides a gas to dry the cleaning liquid remaining in the shower head.

The disclosure also provides a nozzle cleaning device for cleaning a nozzle of a substrate processing device, the nozzle is used to spray a process liquid on a substrate, and the nozzle cleaning device includes: a hollow base containing a a space for accommodating the spray head therein; a cleaning liquid ejection pipeline, including an outlet aligned with the accommodating space, so as to spray the cleaning liquid to the spray head contained in the accommodating space to clean the nozzle; and a liquid discharge pipe for discharging the cleaning liquid after cleaning the nozzle.

Compared with the prior art, the disclosure provides a nozzle cleaning device that can be used to clean the nozzle in the substrate processing device, so that when the process liquid spraying unit finishes spraying the process liquid and returns to the standby position, the nozzle cleaning device can The process liquid remaining on the nozzle of the process liquid spraying unit is cleaned, thereby avoiding the problem of cross-contamination between different process liquids.

Description of drawings

FIG. 1 shows a schematic diagram of a substrate processing apparatus according to a preferred embodiment of the present disclosure;

Figure 2 shows a partial schematic view of the process liquid spraying unit of Figure 1;

Fig. 3 shows the corresponding schematic diagram of the process liquid spraying unit and the nozzle cleaning device in Fig. 1 when they are separated;

Fig. 4 shows the corresponding schematic diagram when the process liquid spraying unit and the nozzle cleaning device of Fig. 3 are combined;

Figure 5 shows a cross-sectional view along section line A-A of Figure 4; and

FIG. 6 shows a flowchart of a method for cleaning a nozzle according to a preferred embodiment of the present disclosure.

Detailed ways

In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with accompanying drawings.

Please refer to FIG. 1 , which shows a schematic diagram of a substrate processing apparatus 1 according to a preferred embodiment of the present disclosure. The substrate processing apparatus 1 includes a substrate holding part 10, a process liquid spraying unit 20, and a nozzle cleaning device 30, wherein in this embodiment, the number of process liquid spraying units 20 is two, however, in other embodiments, one Or the design of more than two process liquid spraying units 20, but not limited thereto. The substrate processing apparatus 1 is used to perform various treatments on the substrate, such as performing wet etching or removing particles on the surface of the substrate.

As shown in FIG. 1 , the substrate holding unit 10 includes a rotating disk 11 and a recovery ring 12 surrounding the rotating disk 11 . The rotating disk 11 is used to hold the substrate thereon. For example, the substrate can be adsorbed on the rotating disk 11 by vacuum suction, or the substrate can be clamped and fixed on the rotating disk 11 by a clamping mechanism, but it is not limited thereto. When the substrate is processed by the substrate processing apparatus 1, the substrate is first kept on the rotating disk 11, then the process liquid is sprayed along a path above the substrate by the process liquid spraying unit 20, and then the corresponding process liquid is recovered by the recovery ring 12 and the The process liquid spraying unit 20 moves to the standby position to clean the nozzles of the process liquid spraying unit 20 through the nozzle cleaning device 30 (the specific steps and the specific structure of each component will be described in detail later).

Please refer to FIG. 1 and FIG. 2 . FIG. 2 shows a partial schematic view of the process liquid spraying unit 20 in FIG. 1 . The process liquid spraying unit 20 includes a spray head 21 , a rotating lifting base 22 , and a long arm 23 , wherein the spraying head 21 and the rotating lifting base 22 are respectively connected to opposite ends of the long arm 23 . The rotating lifting base 22 and the long arm 23 serve as the moving mechanism of the process liquid spraying unit 20 for controlling the spray head 21 to move from the standby position to the substrate holding part 10 to spray the corresponding process liquid along a path above the substrate. The rotating lifting base 22 is set on the same platform as the substrate holding part 10 , and the rotating lifting base 22 is set outside the periphery of the recovery ring 12 of the substrate holding part 10 , with a distance from the substrate holding part 10 . The rotating lifting base 22 is respectively connected with a rotating driving part (not shown in the figure) and a lifting driving part (not shown in the figure), wherein the rotating driving part and the lifting driving part can adopt the rotating lifting base 22 to be respectively connected with two Different driving devices (such as motors) are connected to implement, or the rotating driving part and the lifting driving part are integrated on the same driving device (such as a motor), and further connected to the rotating lifting base 22 to implement. The rotating lifting base 22 can be driven to rotate around a rotating shaft by the driving of the rotating driving part, and then the long arm 23 is driven to drive the spray head 21 to move along a path on the XY plane. And, driven by the lifting driving part, the rotating lifting base 22 can be driven to perform vertical lifting movement along the direction perpendicular to the XY plane (ie, the Z direction).

As shown in FIG. 2 , the process liquid spraying unit 20 is a design that integrates pipelines for supplying various process liquids (such as chemical liquid, gas or cleaning liquid). For example, in this embodiment, the spray head 21 of the process liquid spray unit 20 is designed to include a first nozzle 211 , a second nozzle 212 and a third nozzle 213 . Preferably, the first nozzle 211, the second nozzle 212 and the third nozzle 213 can be respectively designed as nozzles for providing deionized water, providing high-pressure water column, or providing chemical liquid, wherein the nozzles for providing chemical liquid Either a single-fluid nozzle or a two-fluid nozzle design can be used. In addition, a shroud 210 surrounds the second nozzle 212 and the third nozzle 213 . The second nozzle 212 and the third nozzle 213 can avoid splashing of the process liquid when the second nozzle 212 and the third nozzle 213 are sprayed by the shielding cover 210 . That is to say, the process liquid will remain on the mask 210 when the spray head 21 finishes spraying the process liquid. Therefore, in the present disclosure, after the substrate is processed by the process liquid spraying unit 20, the spray head 21 of the process liquid spray unit 20 will be moved to be placed on the spray head cleaning device 30, so that the plurality of nozzles of the spray head 21 And the mask 210 is cleaned.

Please refer to FIG. 1 and FIG. 3 . FIG. 3 shows a corresponding schematic diagram of the separation of the process liquid spraying unit 20 and the nozzle cleaning device 30 in FIG. 1 . The nozzle cleaning device 30 is arranged on the same platform as the rotary lifting base 22 and the substrate holding part 10, and is arranged on the outside of the recovery ring 12 of the substrate holding part 10, for cleaning the nozzles placed on the nozzle cleaning device 30. The spray head 21 of the process liquid spray unit 20 sprays a cleaning liquid 34 . Preferably, the nozzle cleaning device 30 is arranged at the standby position of the process liquid spraying unit 20 .

Please refer to FIG. 3 to FIG. 5 , FIG. 4 shows a corresponding schematic diagram of the combination of the process liquid spraying unit 20 and the nozzle cleaning device 30 in FIG. 3 , and FIG. 5 shows a cross-sectional view along section line A-A of FIG. 4 . The nozzle cleaning device 30 includes a hollow base 31 , a cleaning liquid ejection pipeline 32 and a drain pipe 33 . The base 31 includes an annular wall 310 and a pipeline section 311, wherein the pipeline section 311 is connected to one end of the annular wall 310, so that the annular wall 310 and the pipeline section 311 communicate with each other. An accommodating space 312 is formed inside the annular wall 310 for accommodating the spray head 21 therein. Two openings are formed at the other end of the pipeline section 311 connected to the annular wall 310 , and the cleaning liquid spray pipeline 32 extends to the interior of the pipeline section 311 through one of the openings of the pipeline section 311 . The drain pipe 33 is connected to the pipeline section 311 and corresponds to another opening of the pipeline section 311 (ie, the drain hole 313 ). The outlet 320 of the cleaning liquid spraying pipeline 32 is aligned with the accommodating space 312 of the base 31 to spray the cleaning liquid 34 on the spray head 21 accommodated in the accommodating space 312 . Preferably, the cleaning liquid 34 is sprayed in the form of a water mist. It can be understood that in the present disclosure, the spraying range of the cleaning liquid 34 can be adjusted by adjusting the angle of the spray outlet 320 , thereby increasing the cleaning speed. Furthermore, the cleaning liquid 34 after cleaning the spray head 21 can be discharged through the liquid discharge pipe 33 .

As shown in FIGS. 4 and 5 , the configuration of the accommodating space 312 of the base 31 corresponds to and cooperates with the configuration of the shield 210 of the spray head 21 , thereby ensuring that the cleaning liquid spraying pipe 32 is sprayed properly. The cleaning liquid 34 is kept inside the shield 210 to prevent the cleaning liquid 34 or the mixture mixed with the process liquid from splashing outside, thereby causing damage to other components of the substrate processing apparatus 1 . It can be understood that, in this disclosure, since the cleaning liquid spraying pipe 32 and the drain pipe 33 are both designed independently, the cleaning liquid 34 can enter and exit through different pipes to quickly supply cleaning Liquid 34 or discharge cleaning liquid 34, thereby increasing the speed of cleaning.

In the present disclosure, the nozzle cleaning device 30 may further include an air supply pipeline. In this embodiment, the air supply pipeline is integrated with the cleaning liquid spray pipeline 32 . That is to say, the gas outlet of the gas supply pipeline is also aligned with the accommodating space 312 of the base 31, so as to provide a gas to the shower head 21 accommodated in the accommodating space 312, so as to remove the cleaning liquid 34 remaining in the shower head 21. blow dry.

In this disclosure, the discharge pipe 33 further includes a switch valve (not shown in the figure) for controlling the on-off of the discharge pipe 33 . Through the design of the switch valve, when the switch valve of the discharge pipe 33 is closed, the cleaning liquid 34 can be filled with the inside of the base 31, and then the nozzle 21 is soaked in the cleaning liquid 34, thereby ensuring that each nozzle of the nozzle 21 The corners can be cleaned, and on the other hand, the nozzles for spraying the chemical liquid on the shower head 21 can be kept moist, so as to prevent the shower head from being blocked due to the drying of the chemical liquid.

Please refer to FIG. 6 , which shows a flowchart of a shower head cleaning method according to a preferred embodiment of the present disclosure, wherein the cleaning method is applicable to the substrate processing apparatus of the present disclosure. The cleaning method includes the following steps. First, step S11 is performed to provide a substrate processing apparatus 1 as shown in FIG. 1 . The substrate processing apparatus 1 includes a substrate holding part 10, a process liquid spraying unit 20, and a nozzle cleaning device 30, wherein the process liquid spraying unit 20 includes a nozzle 21 and a moving device (composed of a rotating lifting base 22 and a long arm 23). It should be understood that the specific structure of each component of the substrate processing apparatus 1 is as described above, and will not be repeated here. Next, proceed to step S12 , placing a substrate on the substrate holding part 10 , wherein the substrate holding part 10 can hold the substrate on the substrate holding part 10 by means of vacuum suction or clamping.

After the substrate is kept in the substrate holding part 10, then, step S13 is performed, and the spray head 21 of the process liquid spraying unit 20 is controlled by the mobile device to spray a process liquid along a path above the substrate, so as to perform various treatments on the substrate, for example, Wet etching or removal of particles on the surface of the substrate, etc. After the substrate is processed, in order to prevent the process liquid from remaining on the nozzle 21, step S14 will be carried out, and the nozzle 21 of the process liquid spraying unit 20 will be controlled by the moving device to move to be placed on the nozzle cleaning device 30, and finally the step S14 will be carried out. S15 , controlling the nozzle cleaning device 30 to spray the cleaning liquid 34 toward the nozzle 21 , so as to remove the remaining process liquid on the nozzle 21 .

Preferably, in order to ensure that the nozzle cleaning device 30 can clean the nozzle 21 more completely, when step S15 is performed, the nozzle 21 of the process liquid spraying unit 20 and the nozzle cleaning device 30 can be controlled to perform relative vertical lifting movement through the mobile device. , thereby improving the cleaning efficiency and increasing the spraying range of the cleaning liquid 34 . Specifically, as shown in FIG. 1 , the lifting drive part of the process liquid spraying unit 20 can be controlled to drive the rotating lifting seat 22 to move up and down along the Z direction, so that the nozzle 21 and the nozzle cleaning device 30 are relatively vertical. And move up and down back and forth.

In this disclosure, the discharge pipe 33 also includes a switch valve that can be used to control the on-off of the discharge pipe 33 . When performing step S15, when the cleaning liquid 34 is sprayed by the nozzle cleaning device 30 for a period of time, the on-off valve of the discharge pipe can be closed so that the cleaning liquid 34 fills the inside of the base 31 of the nozzle cleaning device 30, and then the Shower head 21 is soaked in cleaning liquid 34, can guarantee that every corner of shower head 21 can be cleaned by this, on the other hand also can make the nozzle that is used for spraying chemical medicine liquid on the shower head 21 keep wet, and then avoids due to chemical The liquid medicine dries up and the nozzle is blocked. Finally, after soaking the nozzle 21 for a period of time, the on-off valve of the discharge pipe is opened to discharge the cleaning liquid 34 after cleaning the nozzle 21 through the discharge pipe 33 .

In the present disclosure, the nozzle cleaning device 30 may further include an air supply pipeline. In this embodiment, the air supply pipeline is integrated with the cleaning liquid spray pipeline 32 . That is to say, the air outlet of the air supply pipeline is also aligned with the accommodating space 312 of the base 31 . When the nozzle cleaning device 30 stops spraying the cleaning liquid 34 and the nozzle 21 is not soaked in the cleaning liquid 34, then the gas supply pipeline can also be controlled to provide a gas to the nozzle 21 accommodated in the accommodating space 312, so that The cleaning liquid 34 of the spray head 21 is blown dry.

In summary, the present disclosure provides a nozzle cleaning device that can be used to clean the nozzle in the substrate processing device, so that when the process liquid spraying unit sprays the process liquid and returns to the standby position, the residual The process liquid on the nozzle of the process liquid spraying unit is cleaned, thereby avoiding the problem of cross-contamination between different process liquids.

Although the disclosure has been disclosed above with preferred embodiments, it is not intended to limit the disclosure. Those skilled in the art to which the disclosure belongs can make various modifications without departing from the spirit and scope of the disclosure. and retouching, so the scope of protection of this disclosure should be defined by the appended claims.

Claims (12)

1. A substrate processing device, characterized in that, comprising: a substrate holding part for holding a substrate; at least one process liquid spraying unit comprising a spray head for spraying a process liquid along a path above the substrate; and a nozzle cleaning device, arranged outside the periphery of the substrate holding part, for spraying a cleaning liquid on the nozzles of the at least one process liquid spraying unit placed on the nozzle cleaning device, wherein the nozzle The cleaning unit contains: A hollow base, comprising an annular wall and a pipe section connected to one end of the annular wall, wherein an accommodating space is formed inside the annular wall for accommodating the spray head therein; A cleaning liquid ejection pipeline extending to the interior of the pipeline section, wherein the outlet of the cleaning liquid ejection pipeline is aligned with the accommodating space, so as to control the nozzles accommodated in the accommodating space spraying said cleaning liquid; and A liquid discharge pipe is connected with the pipeline section and is used for discharging the cleaning liquid after cleaning the spray head. 2 . The substrate processing apparatus according to claim 1 , wherein the drain pipe further comprises an on-off valve for controlling the on-off of the drain pipe. 3 . 3. The substrate processing apparatus according to claim 1, wherein the at least one process liquid spraying unit further comprises: a moving mechanism connected to the shower head for controlling the shower head to move from a standby position to The substrate holding part to spray the process liquid along the path above the substrate. 4. The substrate processing apparatus according to claim 3, wherein the moving mechanism comprises: a rotary drive part, used to control the rotation of the at least one process liquid spraying unit on a plane around a rotating shaft; and A lifting driving part is used to control the vertical lifting of the at least one process liquid spraying unit along a direction perpendicular to the plane. 5. The substrate processing apparatus according to claim 3, wherein the nozzle cleaning device is arranged at the standby position. 6. The substrate processing apparatus according to claim 1, wherein the spray head of the at least one process liquid spray unit comprises: at least one nozzle for spraying said process liquid; and A shield is arranged to surround the at least one nozzle. 7. The substrate processing apparatus according to claim 6, wherein the nozzle cleaning device comprises an annular wall, and an accommodating space is formed inside the annular wall for accommodating the nozzle therein, and Wherein the configuration of the accommodating space corresponds to and cooperates with the configuration of the shielding cover of the spray head. 8. The substrate processing apparatus according to claim 7, wherein the nozzle cleaning apparatus further comprises a gas supply pipeline, the gas outlet of the gas supply pipeline is aligned with the accommodating space, so as to accommodate the The spray head in the accommodating space provides a gas to dry the cleaning liquid remaining in the spray head. 9. A nozzle cleaning device, used to clean the nozzle of a substrate processing device, the nozzle is used to spray a process liquid on a substrate, it is characterized in that the nozzle cleaning device comprises: a hollow base, including an accommodating space for accommodating the nozzle; a cleaning liquid spraying pipeline, including a spray port aligned with the accommodating space, so as to spray cleaning liquid on the nozzles accommodated in the accommodating space to clean the nozzles; and A liquid discharge pipe is used to discharge the cleaning liquid after cleaning the nozzle. 10 . The nozzle cleaning device according to claim 9 , wherein the discharge pipe further comprises a switch valve for controlling the on-off of the discharge pipe. 11 . 11. The nozzle cleaning device according to claim 9, characterized in that, the nozzle cleaning device further comprises a gas supply pipeline, the gas outlet of the gas supply pipeline is aligned with the accommodating space, so as to accommodate the The spray head in the accommodating space provides a gas to dry the cleaning liquid remaining in the spray head. 12. The nozzle cleaning device according to claim 9, wherein the base further comprises an annular wall and a pipeline section connected to one end of the annular wall, wherein the accommodating space is formed by the An annular wall defines; wherein the cleaning liquid discharge line extends into the interior of the line section; and wherein the drain pipe is connected to the line section.