JP6380533B2 - Resin multilayer board - Google Patents

Description

  The present invention relates to a resin multilayer substrate.

  In some cases, a resin multilayer substrate is used by being bonded to a housing, a mother substrate, or the like. Such bonding is performed by terminal electrodes formed on the surface of the resin multilayer substrate. When the resin multilayer substrate is bonded using a terminal electrode for connecting to a mother substrate or the like with the terminal portion bent, the resin multilayer substrate is not sufficiently rigid in the vicinity of the terminal electrode. There is a possibility that a defect occurs in the multilayer substrate or an undesirable deformation or breakage occurs in the terminal electrode itself.

  As a method for supplementing the rigidity of the portion where the terminal electrode is disposed, reinforcement with a metal plate or the like can be considered. Japanese Patent Application Laid-Open No. 4-48677 (Patent Document 1) describes a configuration in which a reinforcing plate is provided on a flexible printed wiring.

JP-A-4-48677

  In order to save space, there is also a demand for a structure that can be joined to a housing, a mother board, or the like with the vicinity of the terminal electrode bent.

  Therefore, an object of the present invention is to provide a resin multilayer substrate that enables bonding in a state where the vicinity of the terminal electrode is bent, and can improve the bonding reliability.

  In order to achieve the above object, a resin multilayer substrate according to the present invention has a terminal section and has a first main surface and a second main surface which is a surface opposite to the first main surface. In the terminal section, the first electrode and the second electrode are disposed on the first main surface, and in the terminal section, a shape holding member is joined to the second main surface. Accordingly, the resin multilayer substrate is maintained in a bent state, and the posture is maintained such that the first electrode and the second electrode are in different directions.

  ADVANTAGE OF THE INVENTION According to this invention, in the resin multilayer substrate, joining in the state which bent the vicinity of the terminal electrode is enabled, and joining reliability can be improved.

It is a top view of the resin multilayer substrate in Embodiment 1 based on this invention. It is arrow sectional drawing regarding the II-II line | wire in FIG. It is a bottom view of the resin multilayer substrate in Embodiment 1 based on this invention. It is a perspective view of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the state which joined the resin multilayer substrate in Embodiment 1 based on this invention with the mother member. It is sectional drawing of the resin multilayer substrate in Embodiment 2 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 3 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 4 based on this invention. It is a top view of the resin multilayer substrate in Embodiment 5 based on this invention. It is arrow sectional drawing regarding the XX in FIG. It is a bottom view of the resin multilayer substrate in Embodiment 5 based on this invention. It is a perspective view of the resin multilayer substrate in Embodiment 5 based on this invention. It is explanatory drawing of a mode that the resin multilayer substrate in Embodiment 6 based on this invention is joined with a mother member.

  The “resin multilayer substrate” described below typically has a terminal section and a non-terminal section, and the non-terminal section has flexibility, and serves as a cable as a whole.

(Embodiment 1)
With reference to FIGS. 1-5, the resin multilayer substrate in Embodiment 1 based on this invention is demonstrated.

  A plan view of the resin multilayer substrate 101 in this embodiment is shown in FIG. FIG. 2 shows a cross-sectional view taken along the line II-II in FIG. In FIG. 2, for convenience of explanation, the mother member 15 as a bonding partner of the resin multilayer substrate 101 is virtually indicated by a two-dot chain line. A bottom view of the resin multilayer substrate 101 is shown in FIG. A perspective view of the resin multilayer substrate 101 is shown in FIG.

  The resin multilayer substrate 101 is a resin multilayer substrate having a terminal section 41 and having a first main surface 1a and a second main surface 1b which is a surface opposite to the first main surface 1a. In the terminal section 41, the first electrode 8 and the second electrode 9 are arranged on the first main surface 1a. In the terminal section 41, since the shape holding member 3 is bonded to the second main surface 1b, the resin multilayer substrate 101 is maintained in a bent state, and the first electrode 8 and the second electrode 9 are in different directions. The posture is held so that

  The resin multilayer substrate 101 includes a laminate 1 formed by laminating a plurality of resin layers 2. The first electrode 8 and the second electrode 9 are formed as conductor films on the first main surface 1a which is one surface of the laminate 1. The resin multilayer substrate 101 has a non-terminal section 42 separately from the terminal section 41.

  In the present embodiment, the resin multilayer substrate 101 has a shape extending along the longitudinal direction 91. In particular, the non-terminal portion section 42 extends along the longitudinal direction 91. The terminal section 41 includes a portion that protrudes and extends in a direction different from the longitudinal direction 91.

FIG. 5 shows a state where the resin multilayer substrate 101 is bonded to the mother member 15.
In the present embodiment, since the resin multilayer substrate 101 is maintained in a bent state by joining the shape maintaining member 3 to the second main surface 1b in the terminal section 41, the vicinity of the terminal electrode is Bonding in a bent state is possible, and bonding reliability can be improved.

  If the shape holding member 3 is formed of a non-conductor, it can be avoided that the shape holding member 3 adversely affects the electrical characteristics of the surrounding wiring.

  The shape holding member 3 is preferably made of a thermosetting resin. By adopting this configuration, the shape holding member 3 can be easily formed in a desired shape.

  As shown in the present embodiment, the resin multilayer substrate has a non-terminal portion section 42 separately from the terminal portion section 41, the resin multilayer substrate has a longitudinal shape, and the terminal portion section 41 is one of the longitudinal shapes. Preferably, the non-terminal section 42 is located between the terminal section 41 and the other end, and is located between the terminal section sections 41. By adopting this configuration, it is convenient to join the terminal section 41 in a bent posture. The non-terminal section 42 can be a transmission line, for example.

(Production method)
A method for manufacturing the resin multilayer substrate 101 will be described. First, the laminated body 1 contained in the resin multilayer substrate 101 is produced. The laminate 1 can be produced by a known method. The method for producing the laminate 1 is, for example, as follows.
(1) Prepare a resin sheet with copper foil. The resin sheet contained in this resin sheet with copper foil is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer (LCP), polyetheretherketone (PEEK), thermoplastic polyimide (thermoplastic PI), thermoplastic fluororesin, or the like.
(2) A resist pattern is printed on the surface of the resin sheet with copper foil where the copper foil is present.
(3) Unnecessary portions of the copper foil are removed by etching with acid using the resist pattern as a mask.
(4) The resist pattern is peeled off with an alkali solution, and then neutralized.
(5) A hole is made in the resin sheet by laser processing.
(6) Fill the hole formed by laser processing with a conductive paste.
(7) Stack a plurality of resin sheets.
(8) Press the stacked resin sheets. That is, it pressurizes, heating at the temperature (for example, 250 degreeC or more and 300 degrees C or less) which does not exceed the glass transition temperature of a resin sheet. In this way, the laminated body 1 can be obtained. The laminate 1 just obtained may be flat.

Next, the following steps are performed in order to form the shape maintaining member 3 in the laminate 1.
(9) The laminate 1 and the thermosetting resin to be the shape holding member 3 are arranged inside the mold. The space in the mold corresponds to a shape obtained by combining the outer shape of the laminate 1 and the shape planned as the shape holding member 3. As the thermosetting resin, for example, an epoxy resin can be employed. The epoxy resin may be granular or liquid.

  In addition, when the initial state of an epoxy resin is granular, the temporary press through a metal mold is performed at 150-200 degreeC, and it is once cooled. Next, it pressurizes over 150-200 degreeC as a main press through a metal mold | die over time longer than a temporary press.

When the initial state of the epoxy resin is liquid, it is semi-cured at 100 to 130 ° C. through a mold and then completely cured at 120 to 180 ° C.
(10) The laminate 1 with the shape maintaining member 3 bonded thereto is taken out from the mold.

  In this way, the shape holding member 3 bonded to the laminate 1, that is, the resin multilayer substrate 101 can be obtained. In addition to the epoxy resin, a phenol resin, a bismaleimide resin, an addition type polyimide resin, a cyanate resin, or the like can be used as the thermosetting resin.

  The resin multilayer substrate described in the following embodiments can also be manufactured using a mold in the same manner.

(Embodiment 2)
With reference to FIG. 6, the resin multilayer substrate in Embodiment 2 based on this invention is demonstrated. The resin multilayer substrate 102 in the present embodiment has a shape bent in a convex shape at an angle of 90 °. Similar to the resin multilayer substrate 101 shown in FIG. 1, the resin multilayer substrate 102 has a terminal section and a non-terminal section. FIG. 6 shows a cross section when the resin multilayer substrate 102 and the mother member 15i are cut along a plane passing through the terminal section of the resin multilayer substrate 102 in a state where the resin multilayer substrate 102 is bonded to the mother member 15i. In the terminal section 41 of the resin multilayer substrate 102, the first electrode 8 and the second electrode 9 are disposed on the first main surface 1a. The resin multilayer substrate 102 is maintained in a bent state by the shape holding member 3i being bonded to the second main surface 1b which is the surface on the back side of the bent portion.

  The resin multilayer substrate 102 is bonded to a mother member 15i having a shape bent concavely at an angle of 90 °.

  In the present embodiment, the entire resin multilayer substrate 102 is a terminal section, and the shape retaining member 3i is bonded to the second main surface 1b in the terminal section so that the resin multilayer substrate 102 is bent. Therefore, it is possible to perform bonding in a state where the vicinity of the terminal electrode is bent, and it is possible to improve bonding reliability.

  In the present embodiment, the angle of bending is 90 °, but the angle of bending is not limited to this and may be any angle. The same applies to other embodiments.

(Embodiment 3)
With reference to FIG. 7, a resin multilayer substrate according to Embodiment 3 of the present invention will be described. Resin multilayer substrate 103 in the present embodiment includes a portion bent into a convex shape and a portion bent into a concave shape. In the resin multilayer substrate 103, a portion extending to the left from the lower convex curve in FIG. 7 is a non-terminal section, and the other portions are terminal sections. In the present embodiment, the shape retaining member 3j is joined to the second main surface 1b not only in the terminal section but also in the non-terminal section, but such a configuration may be used. Further, as shown in the present embodiment, the shape maintaining member 3j may not be disposed over the entire terminal section, and may be disposed only in a part of the terminal section.

  In the present embodiment, in the terminal section that is a part of the resin multilayer substrate 103, the shape maintaining member 3j is joined to the second main surface 1b, whereby the resin multilayer substrate 103 is maintained in a bent state. Therefore, it is possible to perform bonding in a state where the vicinity of the terminal electrode is bent, and it is possible to improve bonding reliability.

(Embodiment 4)
With reference to FIG. 8, the resin multilayer substrate in Embodiment 4 based on this invention is demonstrated. The resin multilayer substrate 104 in the present embodiment includes a bent portion. A bent portion in the resin multilayer substrate 104 is a terminal section. In the terminal section of the resin multilayer substrate 104, the first electrode 8 and the second electrode 9 are disposed on the first main surface 1a. The resin multilayer substrate 104 is maintained in a bent state by the shape holding member 3q being bonded to the second main surface 1b, which is the back side surface of the bent portion, and the first electrode 8 and the second electrode 9 are The postures are held so that they are in different directions.

  Bonding partners of the resin multilayer substrate 104 are the printed wiring boards 16 a and 16 b arranged in the housing 17. The casing 17 includes printed wiring boards 16a, 16b, and 16c on the inner surface. Each of the printed wiring boards 16a, 16b, and 16c has an electrode for electrical connection on the surface. The first electrode 8 and the second electrode 9 are joined to the printed wiring boards 16a and 16b, respectively. Components 4a and 4b are mounted on the printed wiring board 16c.

  Also in this embodiment, the same effects as those of the embodiments described so far can be obtained. Even when the internal space of the housing 17 is narrow and the electrodes to be joined are arranged in different directions in the internal space, the resin multilayer substrate 104 is maintained in a desired bent shape by the shape holding member 3q in this way. And it can join smoothly with respect to a joining other party.

(Embodiment 5)
With reference to FIGS. 9-12, the resin multilayer substrate in Embodiment 5 based on this invention is demonstrated. FIG. 9 is a plan view of the resin multilayer substrate 105 in the present embodiment. FIG. 10 shows a cross-sectional view taken along the line XX in FIG. In FIG. 10, for convenience of explanation, the mother member 15 k as a bonding partner of the resin multilayer substrate 105 is virtually indicated by a two-dot chain line. A bottom view of the resin multilayer substrate 105 is shown in FIG. A perspective view of the resin multilayer substrate 105 is shown in FIG. The basic structure of the resin multilayer substrate 105 in the present embodiment is the same as that of the resin multilayer substrate 101 described in Embodiment 1, but is different in the following points.

  The resin multilayer substrate 105 has a non-terminal section 42 separately from the terminal section 41. The non-terminal portion section 42 has a non-terminal portion bent portion to be used by being bent.

  The shape holding member 3k extends so as to be joined to at least one main surface of the resin multilayer substrate 105 at the non-terminal portion bent portion. The non-terminal bent portion is maintained in a desired bent shape by the shape holding member 3k.

  The resin multilayer substrate 105 has the wiring 10 built therein. The wiring 10 is arrange | positioned inside the laminated body. The wiring 10 extends over the non-terminal section 42. In the example shown in the present embodiment, the entire non-terminal portion section 42 is a non-terminal portion bent portion. Actually, the non-terminal portion bent portion may be a part of the non-terminal portion section 42.

  In the present embodiment, the terminal section 41 is disposed at both ends of the non-terminal section 42, and the electrode 8 and the electrode 9 are disposed in one terminal section 41. The electrode 8 in one terminal section 41 and the electrode 8 in the other terminal section 41 are electrically connected by a wiring 10. Further, the electrode 9 in one terminal section 41 and the electrode 9 in the other terminal section 41 are electrically connected by a wiring 10.

  The shape holding member 3k not only maintains the terminal section 41 in a bent state, but also maintains the bent portion of the non-terminal section in the non-terminal section 42 in a bent state.

  Also in the present embodiment, the effects described in the first embodiment can be obtained. In the present embodiment, the bent portion of the non-terminal portion in the non-terminal portion section 42 is also maintained in a bent state. Therefore, when it is desired to arrange the resin multilayer substrate in a limited narrow space, contact with other products is not possible. This is effective when it is desired to keep the bent portion of the non-terminal portion bent to avoid it. According to the present embodiment, it is possible to mount the resin multilayer substrate while maintaining not only the terminal section 41 but also the non-terminal section 42 in a bent state.

(Embodiment 6)
With reference to FIG. 13, the resin multilayer substrate in Embodiment 6 based on this invention is demonstrated. FIG. 13 shows a cross-sectional view of the terminal section of the resin multilayer substrate 106 in the present embodiment.

  In the first to fifth embodiments, the bent portion of the resin multilayer substrate is bent so as to be convex toward the bonding partner, but is not necessarily convex. In this Embodiment, as shown in FIG. 13, it is bent so that it may become concave shape toward a joining partner. The first electrode 8 and the second electrode 9 are arranged on the first main surface 1c in such a bent state. In the terminal section, the shape maintaining member 3n is joined to the second main surface 1d. Accordingly, the resin multilayer substrate 106 is maintained in a bent state, and the posture is maintained such that the first electrode 8 and the second electrode 9 are in different directions.

  In the present embodiment, the mother member 15n serving as the joining partner has a convex shape. FIG. 13 shows how the resin multilayer substrate 106 is joined to the mother member 15n.

  In the present embodiment, the relationship between the concave and convex shapes of the resin multilayer substrate and the bonding partner is reversed compared to the first embodiment and the like, but in such a case, the present invention is also applicable. Bonding in a state where the vicinity of the terminal electrode is bent can be performed, and the bonding reliability can be improved. That is, the same effect as in the first embodiment can be obtained.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Laminated body, 1a, 1c 1st main surface, 1b, 1d 2nd main surface, 2 Resin layer, 3, 3i, 3j, 3k, 3q Shape holding member, 4a, 4b Parts, 8 1st electrode, 9 2nd Electrode, 10 wiring, 15, 15i, 15j, 15n Mother member, 16a, 16b, 16c Printed wiring board, 17 housing, 41 terminal section, 42 non-terminal section, 91 longitudinal direction, 101, 102, 103, 104 , 105, 106 Resin multilayer substrate.

Claims (5)

A resin multilayer substrate having a terminal section and having a first main surface and a second main surface that is a surface opposite to the first main surface,
In the terminal section, the first electrode and the second electrode are disposed on the first main surface,
In the terminal section, a shape holding member formed of only a non-conductor is bonded to the second main surface, whereby the resin multilayer substrate is maintained in a bent state, and the first electrode and the first electrode The posture is maintained so that the two electrodes are in different directions,
Comprising one end in the first direction and the other end;
A first electrode group is disposed at the one end,
A second electrode group is disposed at the other end;
When one electrode group is selected from the first electrode group and the second electrode group, a plurality of electrodes belonging to the one electrode group are arranged along a direction different from the first direction, the first electrode and the second electrode is to belong to the one electrode group,
A resin multilayer substrate in which the first electrode and the second electrode are connected to another substrate. In addition to the terminal section section, it has a non-terminal section section, and the non-terminal section section has a non-terminal section bent portion to be used by bending,
The shape holding member extends so as to be bonded to at least one main surface of the resin multilayer substrate at the non-terminal portion bent portion, and the non-terminal portion bent portion is desired by the shape holding member. The resin multilayer substrate according to claim 1, wherein the bent shape is maintained.   The resin multilayer substrate according to claim 1, wherein the shape holding member is formed of a thermosetting resin.   A non-terminal section is provided separately from the terminal section, the resin multilayer substrate has a longitudinal shape, the terminal section is present at one end and the other end of the longitudinal shape, and the non-terminal section The resin multilayer substrate according to any one of claims 1 to 3, wherein the section is located between the terminal section sections. In the terminal section, a third electrode and a fourth electrode are disposed on the first main surface,
In the terminal section, the shape holding member is bonded to the second main surface, so that the resin multilayer substrate is maintained in a bent state, and the third electrode and the fourth electrode are in different directions. The posture is held so that
When the electrode group that is not selected as the one electrode group out of the first electrode group and the second electrode group is referred to as the other electrode group, a plurality of electrodes belonging to the other electrode group are The resin multilayer substrate according to any one of claims 1 to 4, wherein the third electrode and the fourth electrode are arranged along a direction different from the first direction, and the third electrode and the fourth electrode belong to the other electrode group.

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