JP6370102B2 - Substrate and image forming apparatus - Google Patents

Description

The present invention relates to an image forming apparatus including a lighting device having implemented the substrate and the substrate a plurality of light sources.

  Today, light-emitting diodes (hereinafter referred to as LEDs) have become widespread as small and inexpensive light sources, and not only applications as displays, but also substrates for mounting and lighting a plurality of LEDs are used in various products. For example, a fluorescent lamp type LED illumination, a backlight for a liquid crystal screen, an illumination that shines light on an original in an image reading apparatus such as a scanner, or a substrate on which a plurality of LEDs are mounted on a static elimination lamp in a laser printer is used. The neutralization lamp is a lamp that lowers the potential of the surface of the photosensitive drum after the transfer of the toner image is finished and irradiates light to make the potential distribution uniform in an image forming unit of an image forming apparatus such as a laser printer. It is. In the static elimination lamp, for example, a plurality of LEDs, which are light sources, are arranged linearly at predetermined intervals in the longitudinal direction on a substantially rectangular substrate having a long side having a width equivalent to that of the photosensitive drum, and the LEDs are turned on. In some cases, the longitudinal direction of the photosensitive drum is uniformly illuminated and the charge is eliminated.

  Here, a substrate protective film called a resist is generally green. This is said to be due to reasons such as making the eyes of the inspector less tired during visual inspection of the substrate at the time of shipment. On the other hand, when an LED is used as a light source, a red LED is often employed because of cost. However, since green has a low reflectance of red light, when a red chip LED is mounted as a static elimination lamp on a substrate provided with a green resist, the light that the LED illuminates the substrate is almost absorbed and not reflected. . For this reason, the efficiency of illumination is low, and between the LED and the LED becomes dark (the illuminance decreases), resulting in uneven illuminance on the target surface irradiated by the LED. As a result, unevenness occurs in the surface potential of the photosensitive drum illuminated by the static elimination lamp, which ultimately affects the image formed by the image forming apparatus.

  As a countermeasure, for example, Patent Document 1 proposes a method of coating the surface of a substrate with a white resist film in order to efficiently reflect LED light. Further, since the color of the substrate immediately below is transparent only with the white resist, for example, in Patent Document 2, white silk (silk printed portion for writing characters on the substrate) is formed on the white resist for the purpose of increasing the degree of whiteness. There has been proposed a method of applying a solid color. That is, it is a method of increasing the amount of light of the entire substrate by efficiently reflecting light scattered on the substrate by applying white silk having a high reflectance on the substrate surface. Also, in order to avoid incorrect mounting during board manufacturing, marks that indicate the orientation of the components in the vicinity of the LEDs and identification marks such as location numbers that make it easy to understand the correspondence with the components on the circuit diagram are drawn by silk printing. There is. Therefore, for example, in Patent Document 3, in order to suppress light absorption by the silk portion, an identification mark is formed on a substrate coated with a white resist having a high reflectance using a white silk having a reflectance lower than that of the white resist. Propose that.

JP 2001-77981 A JP 2010-193175 A JP 2010-219208 A

  However, as described in Patent Document 2 described above, even if white silk is applied over a wide area of the substrate, there is a manufacturing problem that if the silk is applied to the end of the substrate, the silk will hang from the substrate, which is difficult. If the substrate is divided after the silk is applied, this problem can be solved, but there arises a problem that a discarded substrate is generated. Moreover, when drawing the identification mark mentioned above, a silk layer other than white is separately required above the white silk layer. Regarding the identification mark, the method proposed in Patent Document 3 is difficult to discriminate because the identification mark is drawn with white silk on the white resist, although there is a difference in reflectance. Considering that the resist film on the substrate is originally green in order to prevent the inspector's eyes from fatigue, it is better that the identification mark is easily visible to the inspector. However, since the identification mark drawn on the surface of the substrate must be drawn in a color different from the color of the substrate surface as can be seen by the human eye, there is a problem that the reflectance falls at that portion. Further, in Patent Document 3, it is a condition that the LED to be used is a white LED, but generally, the white LED is expensive and causes a problem of cost increase. For this reason, unless the LED needs to be white, usually a colored LED such as red is often used.

  The present invention has been made under such circumstances, and an object of the present invention is to make it easy to see an identification mark by suppressing a decrease in the reflectance of the light source color light on the substrate surface.

  In order to solve the above-described problems, the present invention has the following configuration.

(1) A base material, a conductive layer provided on the base material, a resist layer provided on the conductive layer and formed of a resist film, and the conductive layer exposed to the resist layer A chip LED connected to a layer and mounted on the resist layer, the chip LED identification mark is silk-printed in the vicinity of the chip LED, and the emission color of the chip LED the resist layer is a red, a substrate, wherein the identification mark is white and.

(2) includes an image bearing member on which an electrostatic latent image is formed, a discharging means to equalize the potential on the image bearing member, wherein the charge removing means, have a substrate according to (1) an image forming apparatus comprising.

  According to the present invention, it is possible to make the identification mark easy to see by suppressing a decrease in the reflectance of the light source color light on the substrate surface.

The figure explaining the structure of the board | substrate of the illuminating device of Example 1. FIG. The figure explaining the structure of the board | substrate of the illuminating device of Example 2, 3, 4. Schematic diagram of image forming device

  Embodiments of the present invention will be described below in detail with reference to the drawings.

[Substrate structure]
FIG. 1 is a view showing a substrate made of paper phenolic resin on one side, on which a red chip LED (light emitting diode) is mounted, which is used in the lighting apparatus of the first embodiment. 1A is a top view of the substrate as viewed from above, and FIG. 1B shows a cross section when the substrate shown in FIG. 1A is cut along an AA plane (dashed line). It is sectional drawing. In addition, an object to be irradiated by the lighting apparatus of the present embodiment is an object created so as to have a strong sensitivity at a wavelength of 600 nm or more (red to infrared region). FIG. 1 is a diagram showing a part of the substrate of the lighting device. In the lighting device of the present embodiment, a plurality of chip LEDs are provided at predetermined intervals in the longitudinal direction of the substrate shown in FIG. The configuration is implemented side by side, and the same applies to the following embodiments. The chip LED used is a monochromatic light emitting diode.

  As shown in FIG. 1B, the substrate is composed of a paper phenol resin base material 105 and three layers formed on the base material 105. That is, the conductive layer 104 is formed on the base material 105, the resist layer 103 is formed with a resist film above the conductive layer 104, and the silk layer 102 is silk-printed on the resist layer 103. If the color of the resist layer 103 is white, (W) is added, and if the color is red, (R) is added to the end of the code. Similarly, for the color of the silk layer 102, (W) is added to the end of the code for white and (R) for red. As shown in FIG. 1A, 101 is a red chip LED, 102 (W) is a white silk layer, 106 is an identification mark, and 107 is a check pad for continuity inspection. Reference numeral 108 denotes a conductive line formed in the conductive layer 104 that can be seen through the white silk layer 102 (W) and the red resist layer 103 (R). Reference numeral 109 denotes a gap between the edge of the substrate (the edge in the short direction in FIG. 1A) and the white silk layer 102 (W), and the red resist layer 103 (R) is exposed. Part.

  In FIG. 1B, each layer is drawn to make it easy to see the tomogram of the substrate, and there is no portion where there is no conductive layer 104 between the red resist layer 103 (R) and the base material 105, that is, there is no conductive line 108. The part is a gap (space). Actually, the portion where the conductive line 108 is not present in the conductive layer 104 is formed with no gap between the red resist layer 103 (R) and the base material 105 in direct contact. Further, the identification mark 106 shown in FIG. 1A is marked for the purpose of preventing a mistake from occurring when a human visually mounts or inspects a component in a mounting process or an inspection process. Specifically, the identification mark 106 is a mark or letter for the purpose of displaying or instructing an abbreviation of each part on the board, the polarity of the part, a place to be careful, etc. , Which is a sign. For example, “LED001” in FIG. 1A indicates an abbreviation for a component (chip LED 101), and “CP001” indicates an abbreviation for the check pad 107 for continuity inspection. Further, an identification mark 106 indicated by a circle (circle) around the continuity check check pad 107 in FIG. 1A indicates a place to be noted, and an arc drawn on the left side of the chip LED 101 indicates the chip. The direction which LED101 should be mounted is shown.

[Method of forming identification mark]
The feature of this embodiment is that the white silk layer 102 (W) is removed in the shape of the identification mark 106 to expose the red resist layer 103 (R) below (immediately below) the silk layer 102 (W). Thus, the identification mark 106 is formed. That is, for example, the letters “LED” are extracted from the white silk layer 102 (W) in the shape of “LED” (silk layer), so that the red resist layer 103 (R) below is in the shape of “LED”. Will be exposed. Therefore, when FIG. 1A is cut along the AA plane, as shown in FIG. 1B, the silk layer 102 (W) is cut off from the portion of “1” of the identification mark “LED001”, and the resist layer 103 (R) is exposed. As a result, it appears to the human eye that “LED” is written in red on a white background (white background). What is characteristic here is that the emission color of the red chip LED 101 as the light source and the color of the identification mark 106 are the same red.

  Originally, the white color of the silk layer 102 (W) reflects various colors of light, so it appears as a white color. White also has a high reflectance with respect to red light emitted from the red chip LED 101. However, in order to easily recognize the identification mark 106 with human vision, the identification mark 106 itself needs to be formed in a color other than white. The color of light that the illumination device of this embodiment wants to irradiate the target is the light emission color of the chip LED 101 as the light source, and the color that strongly reflects the color in the same way as white is red, which is the same as the light emission color. This is why the color red is viewed as red because it has the highest reflectivity for red and low reflectivity for other colors. In this way, the identification mark 106 is formed in a form that is clearly visible to human vision, and red, which is the color of light originally intended to be applied to the object, is a gap portion where the identification mark 106 or white silk cannot be applied. Even in 109, the light is efficiently reflected without being attenuated. As a result, high reflectivity can be maintained for the entire substrate. By forming the identification mark 106 in this manner, it is not necessary to provide a silk layer having a color different from that of the white silk layer 102 (W) in order to form the identification mark 106, thereby reducing costs. This leads to material savings. Furthermore, since the identification mark 106 with high contrast is formed, it is easy for the inspector to recognize and has the effect of preventing erroneous mounting of components.

  Further, for example, a red LED on a substrate on which a red identification mark is formed, and a light emission color of a chip LED that is a light source mounted on the substrate, such as a blue chip LED on a substrate on which a blue identification mark is formed. Match the color of the identification mark. Thereby, since the operator can intuitively recognize the light emission color of the component (chip LED) to be mounted, there is a further effect of preventing erroneous mounting. In this embodiment, an object having a strong sensitivity to red is assumed as an irradiation target of the illumination device, and therefore, the red chip LED 101 and the red resist layer 103 (R) are used. For example, if the object to be irradiated is an object having strong sensitivity to blue, a blue chip LED and a blue resist layer may be used. In other words, the light emission color of the light source (chip LED) and the color of the silk layer or resist layer are selected to be the same so that the sensitivity of light emitted from the light source is the strongest according to the wavelength of light required. To do.

  As described above, according to this embodiment, it is possible to suppress a decrease in the reflectance of the light source color light on the substrate surface and make the identification mark easy to see. In particular, using a silk layer as the main reflective surface and using a resist layer with the same color as the color of the light source to make an identification mark with letters, the identification mark that cannot be reflected by the silk layer and the resist layer at the edge of the substrate are exposed. Even in the portion where the light is present, the light from the light source can be reflected efficiently. Further, since the identification mark is formed by removing the silk layer as the main reflection surface, it is not necessary to provide a new silk layer for the identification mark. Furthermore, since the identification mark made of a letter is a color different from that of the silk layer, it is very easy for the inspector to see, reduces fatigue, and prevents erroneous mounting.

[Substrate structure]
In the first embodiment, the lighting device in which the light emission color of the chip LED 101 as the light source and the color of the resist layer 103 (R) of the substrate are the same red has been described. In the second embodiment, a lighting device in which the light emission color of the chip LED 101 as a light source and the color of the silk layer 102 (R) are the same red will be described.

  FIG. 2 is a diagram illustrating a substrate used for the lighting device of the second embodiment, on which a red chip LED is mounted and made of paper phenol resin on one side. FIG. 2A is a top view of the substrate when the substrate is viewed from above, and FIG. 2B shows a cross section when the substrate shown in FIG. 2A is cut along the AA plane (broken line). It is sectional drawing. In addition, an object to be irradiated by the lighting apparatus of the present embodiment is an object created so as to have a strong sensitivity at a wavelength of 600 nm or more (red to infrared region). FIG. 2 is a diagram showing a part of the substrate of the lighting device. The configuration of the substrate of the lighting device of the present embodiment shown in FIG. 2 is the same as the configuration of the substrate of the lighting device of the first embodiment. Reference numerals are assigned and description is omitted.

[Method of forming identification mark]
In FIG. 2 (a), 201 is an identification mark, 202 is a gap part from the edge part (edge part of FIG. 2 (a) short direction) of a board | substrate to the red silk layer 102 (R), This is a portion where the white resist layer 103 (W) is exposed. In Example 1, the chip LED 101 and the resist layer 103 (R) were the same red color, whereas in this example, the chip LED 101 and the silk layer 102 (R) were the same red color. As in the first embodiment, the identification mark 201 is formed by extracting the red silk layer 102 (R) into the shape of the identification mark 201 and exposing the white resist layer 103 (W) below the silk layer 102 (R). It is formed by letting. For example, FIG. 2B shows a state in which the silk layer 102 (R) of the “1” portion of “LED001” of the identification mark 201 is removed (cut out) and the resist layer 103 (W) is exposed. ing. As a result, it appears to human eyes that letters and symbols are written in white on a red background (red background).

  The feature of this embodiment is that the silk layer 102 (R), which is the main reflection part of the light emitted from the chip LED 101 that is the light source, has a red color, thereby specializing in the reflectance with respect to red. Is mentioned. In Example 1 described above, white, which has a high reflectance for all colors, occupies a large area, and therefore light other than red was also reflected. However, when the dominant color in the reflecting portion is red as in the present embodiment, light of a color other than red is absorbed, and light having a red wavelength is selectively reflected. Therefore, when you do not want to irradiate the target device with light other than red light, for example, when the object to be irradiated has characteristics that cause damage when irradiated with light having a wavelength shorter than red. The configuration of this embodiment is effective. Also, in the identification mark 201 formed in white, white has high reflectivity for all colors, and thus the reflectivity of red irradiation light does not decrease.

  As described above, according to this embodiment, it is possible to suppress a decrease in the reflectance of the light source color light on the substrate surface and make the identification mark easy to see.

[Substrate structure]
In the first and second embodiments, the illumination device in which the identification mark is formed by extracting the silk layer of the substrate into the shape of the identification mark and exposing the resist layer below the silk layer has been described. In Example 3, an illumination device in which an identification mark is formed by exposing a resist layer except for a portion of a silk layer that forms the identification mark will be described.

  FIGS. 2C and 2D are diagrams illustrating a substrate made of paper phenolic resin on one side, on which a red chip LED is mounted, which is used in the lighting device of the third embodiment. 2C is a top view of the substrate when the substrate is viewed from above, and FIG. 2D shows a cross section when the substrate shown in FIG. 2C is cut along the AA plane (broken line). It is sectional drawing. In addition, as in the first and second embodiments, the object to be irradiated by the lighting apparatus according to the present embodiment is an object created so as to have a strong sensitivity at a wavelength of 600 nm or more (red to infrared region). 2 (c) and 2 (d) are diagrams showing a part of the substrate of the illumination device. In the configuration of the substrate of the illumination device of the present embodiment shown in FIGS. 2 (c) and 2 (d), FIG. The same components as those of the substrates of the illumination devices of Examples 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

[Method of forming identification mark]
In FIG. 2C, reference numeral 301 denotes an identification mark. In Examples 1 and 2, the identification mark was formed by extracting the silk layer into the shape of the identification mark 301 and exposing the resist layer below the silk layer. In this embodiment, the part of the silk layer that forms the identification mark 301 is left as it is, the part of the silk layer other than the identification mark 301 is removed, and the resist layer is exposed to form the identification mark 301. For example, in FIG. 2D, the silk layer 102 (W) is cut out except for the silk layer 102 (W) of “1” of “LED001” of the identification mark 301, and the resist layer 103 (R) is formed. The exposed state is shown. That is, in Example 2, the red silk layer 102 (R) was removed and the white resist layer 103 (W) was exposed to form the white identification mark 201 with the red background. On the other hand, in this embodiment, the red resist layer 103 (R) is exposed by removing portions other than characters (for example, “LED001”) constituting the identification mark 301 of the white silk layer 102 (W), A white identification mark 301 is formed against a red background.

  Further, in Examples 1 and 2, since the silk cannot be solidly applied to the end portion of the substrate, the gap portion 109 (FIG. 1 (FIG. 1 (B) where the resist layer 103 is exposed between the end portion of the substrate and the silk layer 102). a)), the gap portion 202 (FIG. 2A) was present. In Example 3, since the silk layer is cut out except for the silk layer where the identification mark 301 is formed, there is no gap at the edge of the substrate, and as a result, no color change occurs at the edge of the substrate, and white silk The amount of use is also reduced.

  Further, as in the second embodiment, the feature of this embodiment is that the color of the silk layer 102 (R), which is the main reflection part of the light emitted from the chip LED 101 that is the light source, is red. Specializing in the reflectivity for. Therefore, when you do not want to irradiate the target device with light other than red light, for example, when the irradiated object has characteristics that cause damage when irradiated with light having a wavelength shorter than red, The configuration of this embodiment is effective. Also, in the identification mark 301 formed in white, white has high reflectivity for all colors, and thus the reflectivity of red irradiation light does not decrease.

  As described above, according to this embodiment, it is possible to suppress a decrease in the reflectance of the light source color light on the substrate surface and make the identification mark easy to see.

[Substrate structure]
In the third embodiment, the illumination device in which the identification mark is formed by exposing the resist layer except the silk layer portion of the substrate on which the identification mark is formed has been described. In the fourth embodiment, the method for forming the identification mark is the same as that of the third embodiment. However, an illumination device in which the color relationship between the silk layer and the resist layer is opposite to that in the third embodiment is described.

  FIGS. 2E and 2F are views showing a substrate made of paper phenolic resin on one side, on which a red chip LED is mounted, which is used in the illumination device of the fourth embodiment. 2E is a top view of the substrate when the substrate is viewed from above, and FIG. 2F shows a cross section when the substrate shown in FIG. 2E is cut along the AA plane (broken line). It is sectional drawing. Moreover, the object of irradiation of the illuminating device of the present embodiment is an object created so as to have a strong sensitivity at a wavelength of 600 nm or more (red to infrared region) as in the first to third embodiments. 2 (e) and 2 (f) are diagrams showing a part of the substrate of the lighting device. In the configuration of the substrate of the lighting device of the present embodiment shown in FIGS. 2 (e) and 2 (f), FIG. The same components as those of the substrates of the illumination devices of Examples 1 to 3 are denoted by the same reference numerals and description thereof is omitted.

[Method of forming identification mark]
In FIG. 2E, 401 is an identification mark. In Example 3, the portion of the white silk layer 102 (W) that forms the identification mark 301 is left as it is, the portion of the silk layer 102 (W) other than the identification mark 301 is removed, and the red resist layer 103 (R) is removed. By exposing, a white identification mark 301 was formed on a red background. On the other hand, in this embodiment, the portion of the red silk layer 102 (R) that forms the identification mark 401 is left as it is, the portion of the silk layer 102 (R) other than the identification mark 401 is removed, and the white resist layer 103 (W ) Is exposed. As a result, a red identification mark 401 is formed on a white background. Also, in this embodiment, similarly to the third embodiment, the silk layer is cut out except for the silk layer where the identification mark 401 is formed. There is no color change and the amount of red silk used is reduced. In the present embodiment, the color of the resist layer, which is a main reflection portion, becomes white, so that the reflectivity is high for all colors. Further, red light from the LED is reflected without being attenuated even at the identification mark 401 portion of the silk layer, and high reflectance can be maintained over the entire substrate. As described above, according to this embodiment, it is possible to suppress a decrease in the reflectance of the light source color light on the substrate surface and make the identification mark easy to see.

[Application to image forming apparatus]
The illumination devices described in Embodiments 1 to 4 can be used as various light sources in the image forming apparatus. A configuration of an image forming apparatus to which the illumination device of the above-described embodiment is applied will be described below with reference to the drawings.

  A laser beam printer will be described as an example of the image forming apparatus. FIG. 3 is an example of an electrophotographic printer, and shows a schematic configuration of a laser beam printer having a reader unit 600 (reading unit) as an image reading apparatus. In the reader unit 600 of FIG. 3, a document 602 placed on a document table glass 601 is irradiated by an illumination lamp 603 using the illumination device of the above-described embodiment. Then, the reflected light of the original 602 is imaged on the image sensor 609 by the lens 608 through the mirrors 604, 605 and 606. As shown in FIG. 3, the mirror 604, the mirror unit 637 on which the illumination lamp 603 is placed, and the mirror unit 607 on which the mirrors 605 and 606 are placed are moved in the arrow direction in the drawing by a motor (not shown), thereby 602 is scanned.

  The laser beam printer 500 includes a photosensitive drum 511 as an image carrier on which an electrostatic latent image is formed, a charging unit 517 (charging unit) that uniformly charges the photosensitive drum 511, and an electrostatic latent image formed on the photosensitive drum 511. A developing unit 512 (developing unit) that develops an image with toner is provided. Further, the laser beam printer 500 includes an exposure device 530 (exposure means) that forms an electrostatic latent image on the photosensitive drum 511 and a static elimination lamp 519 (static elimination means) that equalizes the potential distribution on the photosensitive drum. For the lamp 519, the illumination device of the above-described embodiment is used. Further, in the exposure apparatus 530, based on the image data read by the reader unit 600, a light beam is emitted from a light source 531 that is a light irradiation unit that uses the illumination apparatus of the above-described embodiment. The light beam emitted from the light source 531 is deflected by the rotary polygon mirror 532 and forms an electrostatic latent image on the photosensitive drum 511 via the mirror.

  The toner image developed on the photosensitive drum 511 is transferred to a sheet (not shown) which is a recording material supplied from the cassette 516 by a transfer unit 518 (transfer means), and the toner image transferred to the sheet is transferred to a fixing device 514 ( The image is fixed by a fixing unit) and discharged to a tray 515. The photosensitive drum 511, the charging unit 517, the exposure device 530, the developing unit 512, the transfer unit 518, and the charge eliminating lamp 519 are image forming units. The laser beam printer 500 also includes a controller 520 that controls an image forming operation by the image forming unit and a sheet conveying operation. Note that the image forming apparatus to which the illumination device of the above-described embodiment can be applied is not limited to the one illustrated in FIG. 3, and may be an image forming apparatus including a plurality of image forming units, for example. The image forming apparatus further includes a primary transfer unit that transfers a toner image on the photosensitive drum 511 to an intermediate transfer belt that is an intermediate transfer member, and a secondary transfer unit that transfers the toner image on the intermediate transfer belt to a sheet. Also good.

101 chip LED
102 (W) Silk layer (white)
103 (R) Resist layer (red)

Claims (4)

A substrate;
A conductive layer provided on the substrate;
A resist layer provided on the conductive layer and formed of a resist film;
A chip LED connected to the conductive layer and mounted on the exposed portion of the resist layer;
Have
On the resist layer, an identification mark of the chip LED is silk-printed in the vicinity of the chip LED ,
Wherein the resist layer and the emission color of the chip LED is red, a substrate, wherein the identification mark is white. The substrate of claim 1, wherein the identification mark, symbol, letter, at least one of the indicia. Substrate according to claim 1 or 2 wherein the substrate, wherein a plurality of said chip LED is mounted. An image carrier on which an electrostatic latent image is formed;
Neutralizing means for making the potential on the image carrier uniform ;
With
The charge-eliminating unit, image forming apparatus characterized by having a substrate according to any one of claims 1 to 3.

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