JP6292350B2 - RFID tag for wireless communication device and laundry - Google Patents

Description

  The present invention relates to a wireless communication device represented by an RFID tag, and in particular, a wireless communication device and a laundry RFID tag including a base sheet on which an antenna conductor is formed and an RFIC element mounted on the base sheet. About.

  For example, in the linen industry, RFID tags are attached to linens such as sheets, and ID information is read from each RFID tag using a reader / writer to manage collection, washing, heat treatment, delivery, etc. of linens. Has been introduced.

  The RFID tag includes an RFIC chip that stores and holds ID information and processes an RF signal, and an antenna connected to the RFIC chip. The linen is attached by covering the RFID tag with a cloth label and thermocompression bonding or sewing.

  As an RFID tag, for example, a structure as shown in Patent Document 1 is common. FIG. 9 is a plan view showing the structure of the main part of the RFID tag disclosed in Patent Document 1. FIG. The RFID tag conductor pattern includes a loop-shaped conductor pattern 10a that surrounds a substantially rectangular planar shape, and one end of each linear portion of the four linear portions that extend in a straight line of the loop-shaped conductor pattern 10a. It consists of a pair of radiation conductor pattern 10b extended in the reverse direction with the substantially same line | wire width. Each of these radiation conductor patterns 10b is composed of a plurality of parallel portions 10c extending substantially parallel to one straight portion and a plurality of vertical portions 10d extending substantially perpendicular to the parallel portions 10c. It is formed in a meander line shape.

Japanese Patent Laying-Open No. 2015-5794

  Linens are rubbed hard especially in the washing process. Therefore, an RFID tag attached to linens, that is, a laundry tag, is required to have reliability such as being hard to break in addition to lightness, thinness, and softness so as not to impair wearability. However, with the conventional structure as shown in FIG. 9, when concentrated in the washing process, stress concentrates on the connection portion between the loop-shaped conductor pattern 10a and the radiating conductor pattern 10b, and this portion is It may break. In addition, disconnection due to stress concentration may occur in the connection portion between the RFIC element and the loop-shaped conductor pattern.

  An object of the present invention is to provide a wireless communication device and a laundry RFID tag that can be used as a highly reliable RFID tag against external stress by suppressing breakage of a conductor pattern formed on a substrate.

(1) A wireless communication device of the present invention
A flexible substrate film;
An RFIC element comprising a first input / output terminal and a second input / output terminal, and mounted on the base film;
A first mounting land pattern and a second mounting land pattern formed on the base film, to which the first input / output terminal and the second input / output terminal are respectively connected;
A first radiating conductor pattern formed on the base film and having one end connected to the first mounting land pattern, and a second radiating conductor pattern having one end connected to the second mounting land pattern;
Formed on the base film, without being connected to the first radiation conductor pattern and the second radiation conductor pattern, a first end is connected to the first mounting land pattern, and a second end is the first radiation conductor pattern. A loop-like conductor pattern connected to the two mounting land patterns and disposed so as to surround the first mounting land pattern and the second mounting land pattern;
It is characterized by having.

  With the above configuration, the stress concentration on the connection portion between the loop-shaped conductor pattern and the first and second mounting land patterns is reduced. Similarly, the stress concentration at the connection portion between the first and second mounting land patterns and the first and second radiation conductor patterns is alleviated.

(2) In (1) above,
The base film is a long film having a longitudinal direction,
The first mounting land pattern, the second mounting land pattern, and the loop conductor pattern are formed at substantially the center in the longitudinal direction of the base film,
The first radiation conductor pattern is formed in a region extending in the first direction of the longitudinal direction from the formation position of the loop-shaped conductor pattern of the base film, and the second radiation conductor pattern is the base material. It is preferable that the film is formed in a region extending from the formation position of the loop-shaped conductor pattern in the second direction in the longitudinal direction.

  With the above configuration, the stress concentration at the connection portion between the loop-shaped conductor pattern and the first and second mounting land patterns, and the connection portion between the first and second mounting land patterns and the first and second radiation conductor patterns. The stress concentration is further relaxed.

(3) In the above (1) or (2), it is preferable that the first mounting land pattern and the second mounting land pattern are arranged substantially at the center of the loop-shaped conductor pattern. As a result, the stress concentration on the connection portion between the loop-shaped conductor pattern and the first and second mounting land patterns, and the connection portion between the first and second mounting land patterns and the first and second radiation conductor patterns. Stress concentration is effectively relieved by the loop-shaped conductor pattern.

(4) In any one of the above (1) to (3), the line width of the loop-shaped conductor pattern is preferably larger than the line widths of the first radiation conductor pattern and the second radiation conductor pattern. As a result, the rigidity of the region surrounded by the loop-shaped conductor pattern is increased, the connection portion between the loop-shaped conductor pattern and the first and second mounting land patterns, and the first and second mounting land patterns and the first and second mounting patterns. The stress on the connection portion with the two radiating conductor patterns is reduced.

(5) In any one of the above (1) to (4), an inner side of the loop-shaped conductor pattern in a plan view on a surface of the base film opposite to the surface on which the RFIC element is mounted. It is preferable that a reinforcing plate is provided in a region and in a range including the first mounting land pattern and the second mounting land pattern. Thereby, the rigidity in the vicinity of the first and second mounting land patterns is increased, the connection portion between the loop-shaped conductor pattern and the first and second mounting land patterns, and the first and second mounting land patterns and the first. The stress on the connection portion with the second radiation conductor pattern is reduced.

(6) In said (5), it is preferable that the said reinforcement board is comprised with the same material as the said base film, and is thicker than the thickness of the said base film. Thereby, since the joint part of a base film and a reinforcement board does not produce the distortion by a temperature change substantially, it is hard to apply the bending stress accompanying a temperature change to the 1st, 2nd mounting land pattern vicinity.

(7) In any one of the above (1) to (6), the RFIC element preferably includes an RFIC chip, a substrate on which the RFIC chip is mounted, and a sealing layer that seals the RFIC chip. Thereby, compared with the case where a RFIC chip is directly joined to a substrate film, high joint strength can be maintained.

(8) The RFID tag for laundry of the present invention is
A flexible substrate film;
An RFIC element comprising a first input / output terminal and a second input / output terminal, and mounted on the base film;
A first mounting land pattern and a second mounting land pattern formed on the base film, to which the first input / output terminal and the second input / output terminal are respectively connected;
A first radiating conductor pattern formed on the base film and having one end connected to the first mounting land pattern, and a second radiating conductor pattern having one end connected to the second mounting land pattern;
Formed on the base film, without being connected to the first radiation conductor pattern and the second radiation conductor pattern, a first end is connected to the first mounting land pattern, and a second end is the first radiation conductor pattern. A loop-like conductor pattern connected to the two mounting land patterns and disposed so as to surround the first mounting land pattern and the second mounting land pattern;
Have
It is attached to the article to be laundry.

  By attaching the laundry RFID tag to laundry (laundry articles) such as clothes and linens, the lifetime with respect to the number of washings is long, and reliability can be improved.

  According to the present invention, the stress concentration at the connection between the loop-shaped conductor pattern and the first and second mounting land patterns, and the first and second mounting land patterns and the first and second radiation conductor patterns Since stress concentration on the connection portion is alleviated, damage to the conductor pattern formed on the base material is suppressed, and a wireless communication device and a laundry RFID tag that can be used as a highly reliable RFID tag against external stress are obtained. It is done.

1A is a plan view of the wireless communication device 10 according to the first embodiment, FIG. 1B is a front view of the wireless communication device 10, and FIG. 1C is a bottom view of the wireless communication device 10. . FIG. 2 is an enlarged plan view of a central portion of the wireless communication device 10. FIG. 3 is a partial cross-sectional view showing the mounting structure of the RFIC element 12. FIG. 4 is an equivalent circuit diagram of the wireless communication device 10. FIGS. 5A, 5 </ b> B, and 5 </ b> C are cross-sectional views in each manufacturing process of the wireless communication device 10. FIG. 6 is a partial cross-sectional view showing a mounting structure of the RFIC element 12 included in the wireless communication device according to the second embodiment. FIG. 7 is an equivalent circuit diagram of the wireless communication device according to the second embodiment. FIG. 8 is a partial plan view of a wireless communication device as a comparative example of the wireless communication device 10 according to the first embodiment. FIG. 9 is a plan view showing the structure of the main part of the RFID tag disclosed in Patent Document 1. FIG.

<< First Embodiment >>
1A is a plan view of the wireless communication device 10 according to the first embodiment, FIG. 1B is a front view of the wireless communication device 10, and FIG. 1C is a bottom view of the wireless communication device 10. . FIG. 2 is an enlarged plan view of the central portion of the wireless communication device 10.

  The wireless communication device 10 is typically an RFID (Radio Frequency IDentification) tag having a UHF band as a communication frequency, and is used as a laundry RFID tag to be attached to clothes such as uniforms or linens such as sheets.

  The wireless communication device 10 includes a flexible base film 14, an RFIC element 12 that includes a first input / output terminal and a second input / output terminal and is mounted on the base film 14.

  As shown in FIG. 2, a first mounting land pattern 17 a and a second mounting land pattern 17 a to which the first input / output terminal and the second input / output terminal of the RFIC element 12 are connected, respectively, are formed on the upper surface of the base film 14. A land pattern 17b is formed.

  As shown in FIG. 1A and FIG. 2, the base film 14 is a long film having a uniaxial direction (X-axis direction in the figure) as a longitudinal direction, and on the upper surface of the base film 14, A first radiation conductor pattern 16a having one end connected to the first mounting land pattern 17a and a second radiation conductor pattern 16b having one end connected to the second mounting land pattern 17b are formed.

  A loop-shaped conductor pattern LP1 is formed on the upper surface of the base film 14 so as to surround the first mounting land pattern 17a and the second mounting land pattern 17b. The first mounting land pattern 17a and the second mounting land pattern 17b are disposed substantially at the center of the loop-shaped conductor pattern LP1.

  The first mounting land pattern 17a, the second mounting land pattern 17b, and the loop-shaped conductor pattern LP1 are formed at substantially the center of the base film 14 in the longitudinal direction.

  The first radiation conductor pattern 16a is formed in a region extending in the first direction in the longitudinal direction from the formation position of the loop conductor pattern LP1 of the substrate film 14, and the second radiation conductor pattern 16b is formed on the substrate film 14. The loop-shaped conductor pattern LP1 is formed in a region extending in the second longitudinal direction. The first radiation conductor pattern 16a has a meander pattern MPa extending meandering in a negative direction in the X-axis direction from the position where the loop-shaped conductor pattern LP1 is formed as a base end in the negative direction in the X-axis direction. The conductor pattern 16b has a meander pattern MPb that meanders in the positive direction in the X-axis direction from the position where the loop-shaped conductor pattern LP1 is formed as a base end in the X-axis direction.

  The tip of the meander pattern MPa reaches a position in the vicinity of the negative side end in the X-axis direction and in the vicinity of the negative side end in the Y-axis direction. The tip of the meander pattern MPb reaches a position in the vicinity of the positive side end in the X-axis direction and in the vicinity of the negative side end in the Y-axis direction.

  The first radiating conductor pattern 16a has a folded pattern RPa extending from the position of the tip of the meander pattern MPa to the positive side in the X-axis direction, and the second radiating conductor pattern 16b has the position of the tip of the meander pattern MPb. As a base end, a folded pattern RPb extending on the negative side in the X-axis direction is provided. The ends of the folded patterns RPa and RPb are open ends.

  As shown in FIG. 2, the loop-shaped conductor pattern LP1 is not connected to the first radiating conductor pattern 16a and the second radiating conductor pattern 16b, and the first end is connected to the first mounting land pattern 17a. The second end is connected to the second mounting land pattern 17b.

  The line width of the loop-shaped conductor pattern LP1 is larger than the line width of the first and second radiation conductor patterns 16a and 16b.

  On the lower surface of the base film 14 (the surface opposite to the surface on which the RFIC element 12 is mounted), in a plan view, in the inner region of the loop-shaped conductor pattern LP1, and the first mounting land pattern 17a and the second mounting pattern 17a. A reinforcing plate 18 is formed in a range including the mounting land pattern 17b.

  The base film 14 is a resin film having heat resistance and flexibility, such as polyimide and liquid crystal polymer. The first and second radiation conductor patterns 16a and 16b are metal foil patterns having heat resistance and flexibility such as Cu. The reinforcing plate 18 is preferably a member having a higher elastic modulus than that of the base film 14 and high adhesion to the base film 14. In particular, it is preferably made of the same material as the base film 14 and thicker than the thickness of the base film 14.

  For example, the thickness of the base film 14 is 25 μm, the total thickness of the first and second radiation conductor patterns 16a and 16b is 40 μm to 50 μm, and the thickness of the reinforcing plate 18 is 200 μm. The wireless communication device 10 includes a region where the first and second radiation conductor patterns 16a and 16b are formed in the softest region (first region), a region where the loop-shaped conductor pattern LP1 is formed slightly hard (second region), a reinforcing plate The formation region 18 is the hardest region (third region). Thus, the wireless communication device 10 has a hard structure in stages from the peripheral part to the central part. Moreover, as will be described later, there is no substantial boundary between the conductor patterns at the boundary between the first region and the second region, and there is no substantial boundary between the conductor patterns at the boundary between the second region and the third region.

  FIG. 3 is a partial cross-sectional view showing the mounting structure of the RFIC element 12. The RFIC element 12 includes a radio frequency integration circuit (RFIC) chip 12e, a substrate 12c on which the RFIC chip 12e is mounted, and a sealing layer 12d that seals the RFIC chip 12e. The RFIC chip 12e holds laundry identification information. The substrate 12c is, for example, a low-temperature fired laminated ceramic substrate (LTCC multilayer substrate).

  The first input / output terminal 12a and the second input / output terminal 12b of the RFIC element 12 are connected to the first mounting land pattern 17a and the second mounting land pattern 17b, respectively. The first input / output terminal 12a and the first mounting land pattern 17a are bonded via a conductive bonding material 22a, and the second input / output terminal 12b and the second mounting land pattern 17b are bonded via a conductive bonding material 22b. Are joined. The bonding materials 22a and 22b are, for example, Sn solder.

  FIG. 4 is an equivalent circuit diagram of the wireless communication device 10. As shown in FIG. 4, one end of the first radiating conductor pattern 16a and one end of the second radiating conductor pattern 16b are connected to the RFIC chip 12e, which is a power feeding circuit, respectively. Further, an inductor L (LP1) based on the loop-shaped conductor pattern LP1 is connected to the RFIC chip 12e. The inductor L (LP1) functions as an impedance matching circuit between the first and second radiation conductor patterns 16a and 16b and the RFIC chip 12e.

  Here, regarding the stress applied to the connecting portion between the loop-shaped conductor pattern LP1 and the first and second mounting land patterns 17a and 17b, and between the loop-shaped conductor pattern LP1 and the first and second radiation conductor patterns 16a and 16b. The stress applied to the connecting portion will be described.

  FIG. 8 is a partial plan view of a wireless communication device as a comparative example of the wireless communication device 10 of the present embodiment. FIG. 3 is an enlarged plan view of a central portion of the wireless communication device in a state before the RFIC is mounted as in FIG. 2. In the wireless communication device of this comparative example, first and second mounting land patterns 17a and 17b are formed (connected) at both ends of the loop-shaped conductor pattern LP1, and the first radiation conductor pattern 16a is formed from the loop-shaped conductor pattern LP1. And the 2nd radiation conductor pattern 16b is each pulled out.

  According to such a wireless communication device of the comparative example, stress is easily concentrated on the portions P1a, P1b, P2a, and P2b surrounded by a broken-line circle in FIG. 8, and the conductor pattern is easily broken. That is, since the RFIC element is mounted on the first and second mounting land patterns 17a and 17b, the first and second mounting land patterns 17a and 17b, which are mounting regions of the RFIC element, have high rigidity. On the other hand, since the rigidity of the loop-shaped conductor pattern LP1 is low, at the time of deformation of the wireless communication device, the boundary between the first and second mounting land patterns 17a, 17b and the loop-shaped conductor pattern LP1 (parts P1a, P1b). Stress is concentrated. Further, since the loop-shaped conductor pattern LP1 has a large line width and constitutes a loop, it has higher rigidity than the first and second radiation conductor patterns 16a and 16b. Therefore, when the wireless communication device is deformed, stress is concentrated on the boundaries (portions P2a and P2b) between the loop conductor pattern LP1 and the first and second radiation conductor patterns 16a and 16b.

  On the other hand, in the wireless communication device 10 of the present embodiment, as shown in FIG. 2, the loop conductor pattern LP1 is not connected to the first and second radiation conductor patterns 16a and 16b. Therefore, there is no connection between the loop-shaped conductor pattern LP1 and the first and second radiation conductor patterns 16a and 16b. The loop-shaped conductor pattern LP1 includes a first mounting land pattern 17a to which the first end of the loop-shaped conductor pattern LP1 is connected, and a second mounting land pattern to which the second end of the loop-shaped conductor pattern LP1 is connected. It arrange | positions so that 17b may be surrounded. The line width of the loop-shaped conductor pattern LP1 is large (at least larger than the line width of the first and second radiation conductor patterns 16a and 16b). Therefore, the rigidity of the region surrounded by the loop-shaped conductor pattern LP1 is high, and the stress concentration at the connection portion between the loop-shaped conductor pattern LP1 and the first and second mounting land patterns 17a and 17b is alleviated. Similarly, the stress concentration at the connection between the first and second mounting land patterns 17a and 17b and the first and second radiation conductor patterns 16a and 16b is alleviated.

  Next, a method for manufacturing the wireless communication device 10 of the present embodiment will be described with reference to FIGS. 5 (A) to 5 (C). As shown in FIG. 5A, first, a first radiation conductor pattern 16a and a second radiation conductor pattern 16b are formed on the upper surface of a polyimide base film 14. Specifically, a metal foil such as a Cu foil is attached to the upper surface of the base film 14, and this metal foil is patterned based on a thin film process such as photolithography. Thereafter, Ai-Au plating or Ni-Sn plating is applied to the surfaces of the first and second mounting land patterns 17a and 17b.

  Subsequently, as shown in FIG. 5B, a polyimide disk-shaped reinforcing plate 18 is bonded to the center of the lower surface of the base film 14 by heating and pressing. The diameter of the contour of the reinforcing plate 18 exceeds both the width and length of the RFIC element 12.

  When the formation of the reinforcing plate 18 is completed, the RFIC element 12 is mounted on the center of the upper surface of the base film 14 by a reflow method. Specifically, as shown in FIG. 3, the bonding materials 22a and 22b are printed on the first input / output terminal 12a and the second input / output terminal 12b, and the first input / output terminal 12a and the second input / output terminal 12b are The RFIC element 12 is placed at the center of the upper surface of the base film 14 so as to be connected to the first mounting land pattern 17a and the second mounting land pattern 17b, and the base film 14 on which the RFIC element 12 is placed is placed. Heat in a reflow oven. Thus, the wireless communication device 10 is completed.

  When the RFIC element 12 is placed at the center of the upper surface of the base film 14, the reinforcing plate 18 formed at the center of the lower surface of the base film 14 acts as a support.

  In addition, you may laminate | stack a coverlay sheet | seat, such as a polyimide sheet, on the 1st, 2nd radiation conductor pattern 16a, 16b formation surface.

<< Second Embodiment >>
In the second embodiment, a wireless communication device including an RFIC element 12 having a matching circuit is shown.

  FIG. 6 is a partial cross-sectional view showing the mounting structure of the RFIC element 12. The RFIC element 12 includes an RFIC chip 12e, a matching circuit substrate 12c on which the RFIC chip 12e is mounted, and a sealing layer 12d that seals the RFIC chip 12e. The matching circuit board 12c is formed in a plate shape using ceramic or resin as a material.

  The first input / output terminal 12a and the second input / output terminal 12b are formed on the lower surface of the matching circuit board 12c. Input / output terminals 12f and 12g are formed on the upper surface of the matching circuit board 12c. Input / output terminals 12h and 12i are formed on the lower surface of the RFIC chip 12e. Input / output terminals 12h and 12i are connected to input / output terminals 12f and 12g, respectively, by a conductive bonding material (not shown).

  FIG. 7 is an equivalent circuit diagram of the wireless communication device of this embodiment. The matching circuit 12fct is provided on the matching circuit board 12c. One end of the capacitor C1 is connected to the input / output terminal 12a, and the other end of the capacitor C1 is connected to the input / output terminals 12i and 12g. Further, one end of the capacitor C2 is connected to the input / output terminal 12b, and the other end of the capacitor C2 is connected to one end of the inductor L2. The other end of the inductor L2 is connected to the input / output terminals 12h and 12f. One end of inductor L1 is connected to the other end of capacitor C1, and the other end of inductor L1 is connected to the other end of capacitor C2.

  Thus, the matching circuit 12fct is configured on the matching circuit board 12c, and one end of the first radiating conductor pattern 16a and one end of the second radiating conductor pattern 16b are connected to the RFIC chip 12e, which is a power feeding circuit, via the matching circuit 12fct. Is done.

LP1 ... Loop conductor pattern MPa, MPb ... meander pattern RPa, RPb ... folded pattern 10 ... wireless communication device 12 ... RFIC element 12a ... first input / output terminal 12b ... second input / output terminal 12c ... matching circuit board 12d ... sealing Layer 12e ... RFIC chips 12f, 12g, 12h, 12i ... Input / output terminals 12fct ... Matching circuit 14 ... Base film 16a ... First radiation conductor pattern 16b ... Second radiation conductor pattern 17a ... First mounting land pattern 17b ... First 2 Land pattern 18 for mounting ... Reinforcing plates 22a, 22b ... Conductive bonding material

Claims (9)

A flexible substrate film;
An RFIC element comprising a first input / output terminal and a second input / output terminal, and mounted on the base film;
A first mounting land pattern and a second mounting land pattern formed on the base film, to which the first input / output terminal and the second input / output terminal are respectively connected;
A first radiating conductor pattern formed on the base film and having one end connected to the first mounting land pattern at a first connection portion , and one end connected to the second mounting land pattern at a second connection portion A second radiation conductor pattern to be connected;
Formed on the base film, without being connected to the first radiation conductor pattern and the second radiation conductor pattern, the first end is connected to the first mounting land pattern at a third connection portion , A second end is connected to the second mounting land pattern at a fourth connection portion , and is disposed so as to surround the first mounting land pattern and the second mounting land pattern, and the RFIC element and the A loop-shaped conductor pattern that acts as an impedance matching circuit between the first radiation conductor pattern and the second radiation conductor pattern;
I have a,
The first connection part and the second connection part are located between the third connection part and the fourth connection part,
A wireless communication device. The base film is a long film having a longitudinal direction,
The first mounting land pattern, the second mounting land pattern, and the loop conductor pattern are formed at substantially the center in the longitudinal direction of the base film,
The first radiation conductor pattern is formed in a region extending in the first direction of the longitudinal direction from the formation position of the loop-shaped conductor pattern of the base film, and the second radiation conductor pattern is the base material. 2. The wireless communication device according to claim 1, wherein the wireless communication device is formed in a region extending in a second direction in the longitudinal direction from a formation position of the loop-shaped conductor pattern of the film.   3. The wireless communication device according to claim 1, wherein the first mounting land pattern and the second mounting land pattern are arranged at a substantially central portion of the loop-shaped conductor pattern.   4. The wireless communication device according to claim 1, wherein a line width of the loop-shaped conductor pattern is larger than a line width of the first radiating conductor pattern and the second radiating conductor pattern. 5.   Of the base film, on a surface opposite to the surface on which the RFIC element is mounted, in a plan view, in an inner region of the loop-shaped conductor pattern, and the first mounting land pattern and the second mounting film The wireless communication device according to claim 1, wherein a reinforcing plate is provided in a range including a mounting land pattern.   The wireless communication device according to claim 5, wherein the reinforcing plate is made of the same material as the base film and is thicker than the thickness of the base film.   The wireless communication device according to claim 1, wherein the RFIC element includes an RFIC chip, a substrate on which the RFIC chip is mounted, and a sealing layer that seals the RFIC chip.   The width of the first mounting land pattern is wider than the line width of the first radiating conductor pattern in the first connection portion, and wider than the line width of the loop-like conductor pattern in the third connection portion,
  The width of the second mounting land pattern is thicker than the line width of the second radiating conductor pattern in the second connection portion, and wider than the line width of the loop-shaped conductor pattern in the fourth connection portion,
  The wireless communication device according to claim 1. A flexible substrate film;
An RFIC element comprising a first input / output terminal and a second input / output terminal, and mounted on the base film;
A first mounting land pattern and a second mounting land pattern formed on the base film, to which the first input / output terminal and the second input / output terminal are respectively connected;
A first radiating conductor pattern formed on the base film and having one end connected to the first mounting land pattern at a first connection portion , and one end connected to the second mounting land pattern at a second connection portion A second radiation conductor pattern to be connected;
Formed on the base film, without being connected to the first radiation conductor pattern and the second radiation conductor pattern, the first end is connected to the first mounting land pattern at a third connection portion , A second end is connected to the second mounting land pattern at a fourth connection portion , and is disposed so as to surround the first mounting land pattern and the second mounting land pattern, and the RFIC element and the A loop-shaped conductor pattern that acts as an impedance matching circuit between the first radiation conductor pattern and the second radiation conductor pattern;
I have a,
The first connection part and the second connection part are located between the third connection part and the fourth connection part,
An RFID tag for laundry that is attached to laundry items.

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