JP6258726B2 - 縦型熱処理装置 - Google Patents
縦型熱処理装置 Download PDFInfo
- Publication number
- JP6258726B2 JP6258726B2 JP2014041607A JP2014041607A JP6258726B2 JP 6258726 B2 JP6258726 B2 JP 6258726B2 JP 2014041607 A JP2014041607 A JP 2014041607A JP 2014041607 A JP2014041607 A JP 2014041607A JP 6258726 B2 JP6258726 B2 JP 6258726B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- furnace port
- heat treatment
- furnace
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0034—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities
- F27D2003/0065—Lifts, e.g. containing the bucket elevators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0085—Movement of the container or support of the charge in the furnace or in the charging facilities
- F27D2003/0086—Up or down
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
前記熱処理炉の前記炉口に配置され、前記炉口を塞ぐ炉口遮蔽部と、前記炉口遮蔽部を複数の弾性体を介して支持する支持部材とを有する蓋部と、
前記蓋部を前記支持部材の下面側から片持ち支持する蓋部開閉機構と、
トグル機構を備え、前記蓋部を前記炉口に配置した際に前記蓋部を前記支持部材の下面側から押圧する補助手段とを有し、
前記補助手段が前記支持部材を前記支持部材の下面側から押圧する際、前記補助手段は前記支持部材と前記複数の弾性体との接点で囲まれた領域内を押圧する
縦型熱処理装置を提供する。
(熱処理ユニット)
熱処理ユニット11は、熱処理炉エリア111と、ローディングエリア112とを有することができる。熱処理炉エリア111には熱処理炉1111を配置できる。また、ローディングエリア112は熱処理炉1111にウエハを供給するため、又は、熱処理炉1111で処理を行ったウエハを搬出するため、運搬容器15と保持具1121との間でウエハを移載できる。
(搬送保管ユニット)
搬送保管ユニット12は、複数の運搬容器15を保管する第1保管部(第1キャリアステージ)121を有することができる。また、必要に応じて複数の運搬容器15を保管する第2保管部(第2キャリアステージ)122を設けることもできる。
(搬入搬出ユニット)
搬入搬出ユニット13は搬送保管ユニット12に隣接して配置することができ、ウエハを複数枚収納した運搬容器15を縦型熱処理装置10に搬入搬出するユニットとすることができる。
1111a 炉口
1126 蓋部
1127 蓋部開閉機構
1128 補助手段
231 炉口遮蔽部
232 支持部材
233 弾性体
Claims (1)
- 下端部に炉口を備えた熱処理炉と、
前記熱処理炉の前記炉口に配置され、前記炉口を塞ぐ炉口遮蔽部と、前記炉口遮蔽部を複数の弾性体を介して支持する支持部材とを有する蓋部と、
前記蓋部を前記支持部材の下面側から片持ち支持する蓋部開閉機構と、
トグル機構を備え、前記蓋部を前記炉口に配置した際に前記蓋部を前記支持部材の下面側から押圧する補助手段とを有し、
前記補助手段が前記支持部材を前記支持部材の下面側から押圧する際、前記補助手段は前記支持部材と前記複数の弾性体との接点で囲まれた領域内を押圧する
縦型熱処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014041607A JP6258726B2 (ja) | 2014-03-04 | 2014-03-04 | 縦型熱処理装置 |
TW104105957A TWI632630B (zh) | 2014-03-04 | 2015-02-25 | 立式熱處理裝置 |
KR1020150027559A KR101924675B1 (ko) | 2014-03-04 | 2015-02-26 | 종형 열처리 장치 |
US14/633,367 US9803924B2 (en) | 2014-03-04 | 2015-02-27 | Vertical heat treatment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014041607A JP6258726B2 (ja) | 2014-03-04 | 2014-03-04 | 縦型熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015167194A JP2015167194A (ja) | 2015-09-24 |
JP6258726B2 true JP6258726B2 (ja) | 2018-01-10 |
Family
ID=54017013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014041607A Active JP6258726B2 (ja) | 2014-03-04 | 2014-03-04 | 縦型熱処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9803924B2 (ja) |
JP (1) | JP6258726B2 (ja) |
KR (1) | KR101924675B1 (ja) |
TW (1) | TWI632630B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117542767B (zh) * | 2024-01-10 | 2024-03-26 | 合肥费舍罗热工装备有限公司 | 一种半导体立式熔接炉 |
CN117702082B (zh) * | 2024-02-06 | 2024-04-09 | 湖南德智新材料有限公司 | 炉体组件、气相沉积设备、以及气相沉积方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4943235A (en) * | 1987-11-27 | 1990-07-24 | Tel Sagami Limited | Heat-treating apparatus |
JP3228508B2 (ja) | 1990-10-11 | 2001-11-12 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JPH0661164A (ja) * | 1992-08-07 | 1994-03-04 | Kokusai Electric Co Ltd | 半導体製造装置の炉口シャッタ装置 |
JP3134137B2 (ja) * | 1993-01-13 | 2001-02-13 | 東京エレクトロン株式会社 | 縦型処理装置 |
JPH07235545A (ja) * | 1994-02-23 | 1995-09-05 | Shinko Electric Co Ltd | 半導体製造用熱処理炉のキャップ固定構造 |
JP3982844B2 (ja) * | 1995-01-12 | 2007-09-26 | 株式会社日立国際電気 | 半導体製造装置及び半導体の製造方法 |
JP3471144B2 (ja) | 1995-09-06 | 2003-11-25 | 東京エレクトロン株式会社 | 縦型熱処理装置及びその断熱構造体並びに遮熱板 |
JP3562164B2 (ja) * | 1996-09-12 | 2004-09-08 | 東芝ライテック株式会社 | 水銀供給装置 |
US6499933B2 (en) * | 1997-04-03 | 2002-12-31 | Tokyo Electron Limited | Elevating mechanism, carrier conveying apparatus and heat treatment installation |
TW438958B (en) * | 2000-10-16 | 2001-06-07 | Promos Technologies Inc | Furnace boat-push device |
JP3769238B2 (ja) * | 2002-03-26 | 2006-04-19 | 松下電器産業株式会社 | プラズマ処理装置 |
JP4421806B2 (ja) * | 2002-04-05 | 2010-02-24 | 東京エレクトロン株式会社 | 縦型熱処理装置及びそのシャッター機構並びにその作動方法 |
JP3369165B1 (ja) * | 2002-04-09 | 2003-01-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP2007073746A (ja) * | 2005-09-07 | 2007-03-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4838083B2 (ja) * | 2006-09-20 | 2011-12-14 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
JP4327206B2 (ja) * | 2007-01-30 | 2009-09-09 | 東京エレクトロン株式会社 | 縦型熱処理装置及び縦型熱処理方法 |
JP5606174B2 (ja) * | 2010-01-27 | 2014-10-15 | 株式会社日立国際電気 | 基板処理装置、基板処理方法、半導体装置の製造方法および反応室の閉塞方法。 |
JP5960028B2 (ja) * | 2012-10-31 | 2016-08-02 | 東京エレクトロン株式会社 | 熱処理装置 |
JP6106501B2 (ja) * | 2013-04-12 | 2017-04-05 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
US9234703B2 (en) * | 2013-12-17 | 2016-01-12 | Honda Motor Co., Ltd. | Automatic charge hearth access door assembly |
-
2014
- 2014-03-04 JP JP2014041607A patent/JP6258726B2/ja active Active
-
2015
- 2015-02-25 TW TW104105957A patent/TWI632630B/zh active
- 2015-02-26 KR KR1020150027559A patent/KR101924675B1/ko active Active
- 2015-02-27 US US14/633,367 patent/US9803924B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015167194A (ja) | 2015-09-24 |
US9803924B2 (en) | 2017-10-31 |
TWI632630B (zh) | 2018-08-11 |
TW201543599A (zh) | 2015-11-16 |
US20150253082A1 (en) | 2015-09-10 |
KR20150104035A (ko) | 2015-09-14 |
KR101924675B1 (ko) | 2018-12-03 |
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