JP6241693B2 - パージ装置及びパージ方法 - Google Patents
パージ装置及びパージ方法 Download PDFInfo
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- JP6241693B2 JP6241693B2 JP2016550006A JP2016550006A JP6241693B2 JP 6241693 B2 JP6241693 B2 JP 6241693B2 JP 2016550006 A JP2016550006 A JP 2016550006A JP 2016550006 A JP2016550006 A JP 2016550006A JP 6241693 B2 JP6241693 B2 JP 6241693B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
Description
走行が自在でかつ容器を昇降させるホイストを備えるローカル台車と、
天井走行車の走行レールの下方でかつ容器受け渡し先の上方に設けられている、ローカル台車の走行レールと、
ローカル台車の走行レールの下方で、かつ容器受け渡し先の直上部を塞がないように設けられ、容器を載置自在なパージ台と、
パージ台に載置されている容器へパージガスを供給するパージガス供給装置、
とを備えている。
天井走行車の走行レールの下方でかつ容器受け渡し先の上方に設けられている、ローカル台車の走行レールと、
ローカル台車の走行レールの下方で、かつ容器受け渡し先の直上部を塞がないように設けられ、容器を載置自在なパージ台と、
パージ台に載置されている容器へパージガスを供給するパージガス供給装置、とを備えているパージ装置により、
天井走行車と容器受け渡し先との間で、容器をパージ台に一時的に載置し、パージガス供給装置により容器をパージガスでパージする。
スライド棚は、固定部上の位置と容器受け渡し先の直上部との間で、スライド自在であり、
パージガス供給装置は、スライド棚に設けられかつ容器内へパージガスを供給する給気ノズルと、固定部から給気ノズルへパージガスを供給する配管とを備え、
配管は屈曲自在な屈曲部を備え、
スライド棚と固定部との間には、屈曲部を屈曲自在に支持するケーブルガイドが設けられている。
ケーブルガイドに、荷重センサの電源線と信号線が、配管と共に支持されている。
8,72 天井走行車システム 10 走行レール
12 天井走行車 13 横送り装置 14 回動装置
15 昇降装置 16 昇降台 20 パージ装置
22 ローカル台車 24 走行レール 26 開口
28 スライド棚 29 固定部 30 固定棚 31 支柱
32 ガイド 33 プレート 34 シリンダ
36 ピストン 38 ミドル部 40 トップ部
42 カップリングピン 44 着座センサ 45 荷重センサ
46 給気ノズル 48 排気ノズル 50,52 配管
54 ケーブルガイド 56 走行部 58 昇降装置
60 昇降台 62 制御部 64,66 通信端末
68 パージ制御部 70 電磁弁 74〜76 走行レール
77 ベイ 78,79 コンベヤ 80 バッファ
Claims (8)
- 天井走行車と容器受け渡し先との間で容器をパージガスによりパージする装置であって、
走行が自在でかつ容器を昇降させるホイストを備えるローカル台車と、
天井走行車の走行レールの下方でかつ容器受け渡し先の上方に設けられている、ローカル台車の走行レールと、
ローカル台車の走行レールの下方で、かつ容器受け渡し先の直上部を塞がないように設けられ、容器を載置自在なパージ台と、
パージ台に載置されている容器へパージガスを供給するパージガス供給装置、
とを備えているパージ装置。 - 前記パージ台は、容器受け渡し位置の直上部とは異なる位置と前記直上部との間でスライド自在なスライド棚を備えていることを特徴とする、請求項1のパージ装置。
- 前記パージ台として、前記スライド棚以外に固定の棚が設けられ、
さらに前記受け渡し先へ渡す容器を優先的に前記スライド棚でパージするように、容器を載置するパージ台を選択して、ローカル台車を制御する制御部を備えていることを特徴とする、請求項2のパージ装置。 - クリーンルームの天井部に設置され、かつ前記天井部からパージガスの供給を受けるように構成されていることを特徴とする、請求項1〜3のいずれかのパージ装置。
- 前記容器は半導体ウェハーを収納するカセットであり、
かつ前記受け渡し先は半導体の処理装置のロードポートであることを特徴とする、請求項1〜4のいずれかのパージ装置。 - 前記パージ台は、容器受け渡し先の直上部とは異なる位置に、固定部をさらに備え、
前記スライド棚は、固定部上の位置と容器受け渡し先の直上部との間で、スライド自在であり、
前記パージガス供給装置は、前記スライド棚に設けられかつ容器内へパージガスを供給する給気ノズルと、前記固定部から前記給気ノズルへパージガスを供給する配管とを備え、
前記配管は屈曲自在な屈曲部を備え、
前記スライド棚と前記固定部との間には、前記屈曲部を屈曲自在に支持するケーブルガイドが設けられていることを特徴とする、請求項2のパージ装置。 - 前記スライド棚上に容器からの荷重を検出する荷重センサが設けられて、前記荷重センサにより容器からの荷重を検出すると、前記給気ノズルからパージガスを供給するように、前記パージガス供給装置が構成され、
前記ケーブルガイドに、荷重センサの電源線と信号線が、前記配管と共に支持されていることを特徴とする、請求項6のパージ装置。 - 走行が自在でかつ容器を昇降させるホイストを備えるローカル台車と、
天井走行車の走行レールの下方でかつ容器受け渡し先の上方に設けられている、ローカル台車の走行レールと、
ローカル台車の走行レールの下方で、かつ容器受け渡し先の直上部を塞がないように設けられ、容器を載置自在なパージ台と、
パージ台に載置されている容器へパージガスを供給するパージガス供給装置、とを備えているパージ装置により、
天井走行車と容器受け渡し先との間で、容器をパージ台に一時的に載置し、パージガス供給装置により容器をパージガスでパージするパージ方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014195152 | 2014-09-25 | ||
JP2014195152 | 2014-09-25 | ||
PCT/JP2015/071011 WO2016047260A1 (ja) | 2014-09-25 | 2015-07-23 | パージ装置及びパージ方法 |
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Publication Number | Publication Date |
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JPWO2016047260A1 JPWO2016047260A1 (ja) | 2017-06-15 |
JP6241693B2 true JP6241693B2 (ja) | 2017-12-06 |
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US (1) | US10325797B2 (ja) |
EP (1) | EP3200221B1 (ja) |
JP (1) | JP6241693B2 (ja) |
KR (2) | KR101942394B1 (ja) |
CN (1) | CN106796908B (ja) |
IL (1) | IL250119A (ja) |
SG (1) | SG11201700643UA (ja) |
TW (1) | TWI667437B (ja) |
WO (1) | WO2016047260A1 (ja) |
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WO2016047260A1 (ja) * | 2014-09-25 | 2016-03-31 | 村田機械株式会社 | パージ装置及びパージ方法 |
WO2017029871A1 (ja) * | 2015-08-14 | 2017-02-23 | 村田機械株式会社 | 搬送システム |
WO2017098805A1 (ja) * | 2015-12-08 | 2017-06-15 | 村田機械株式会社 | 搬送システム及び搬送方法 |
KR101852323B1 (ko) * | 2016-07-05 | 2018-04-26 | 로체 시스템즈(주) | 퍼지 모듈 지그 및 이를 포함한 퍼지 모듈 |
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KR102453738B1 (ko) * | 2018-06-15 | 2022-10-12 | 무라다기카이가부시끼가이샤 | 보관 선반 |
US11631603B2 (en) * | 2018-07-20 | 2023-04-18 | Murata Machinery, Ltd. | Storage shelf, and method for installing storage shelf |
US11942347B2 (en) * | 2018-12-26 | 2024-03-26 | Murata Machinery, Ltd. | Storage system |
SG11202108085UA (en) * | 2019-01-25 | 2021-08-30 | Murata Machinery Ltd | Transport system |
JP7224725B2 (ja) * | 2019-03-26 | 2023-02-20 | 株式会社ディスコ | 搬送システム |
WO2021090542A1 (ja) * | 2019-11-05 | 2021-05-14 | 村田機械株式会社 | 搬送車システム |
US12180002B2 (en) * | 2020-11-12 | 2024-12-31 | Murata Machinery, Ltd. | Storage rack |
JP7327425B2 (ja) * | 2021-02-19 | 2023-08-16 | 株式会社ダイフク | 搬送設備 |
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JP4807424B2 (ja) * | 2009-03-17 | 2011-11-02 | 村田機械株式会社 | 天井搬送システムと物品の移載方法 |
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JP5429570B2 (ja) * | 2010-03-08 | 2014-02-26 | 株式会社ダイフク | 物品搬送設備 |
JP5382470B2 (ja) * | 2010-11-04 | 2014-01-08 | 村田機械株式会社 | 搬送システム及び搬送方法 |
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CN103548130B (zh) * | 2011-05-25 | 2016-08-17 | 村田机械株式会社 | 载入机装置、搬运系统、以及容器搬出方法 |
KR101418812B1 (ko) * | 2012-10-31 | 2014-07-16 | 크린팩토메이션 주식회사 | 웨이퍼 퍼지 가능한 천장 보관 장치 |
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WO2016047260A1 (ja) * | 2014-09-25 | 2016-03-31 | 村田機械株式会社 | パージ装置及びパージ方法 |
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2015
- 2015-07-23 WO PCT/JP2015/071011 patent/WO2016047260A1/ja active Application Filing
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US20170278736A1 (en) | 2017-09-28 |
KR101942394B1 (ko) | 2019-01-25 |
EP3200221B1 (en) | 2021-05-05 |
CN106796908B (zh) | 2019-11-26 |
CN106796908A (zh) | 2017-05-31 |
EP3200221A4 (en) | 2018-05-16 |
KR20170058393A (ko) | 2017-05-26 |
TWI667437B (zh) | 2019-08-01 |
JPWO2016047260A1 (ja) | 2017-06-15 |
US10325797B2 (en) | 2019-06-18 |
IL250119A (en) | 2017-05-29 |
SG11201700643UA (en) | 2017-04-27 |
WO2016047260A1 (ja) | 2016-03-31 |
TW201612472A (en) | 2016-04-01 |
EP3200221A1 (en) | 2017-08-02 |
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