JP6149502B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging apparatus.

There is known a camera module in which an opening of a ceramic package is sealed with a transparent glass plate.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  There has been a problem that the imaging chip may be greatly deformed due to a pressure difference generated between the space for housing and sealing the imaging chip and the external space.

  In the first aspect of the present invention, the imaging unit includes an imaging chip, a mounting substrate on which the imaging chip is mounted, a housing portion that forms a housing space that houses and seals the imaging chip together with the mounting substrate, And a deforming portion that is arranged on at least one of the mounting substrate and the accommodating portion and deforms according to a pressure difference between the accommodating space and the external space outside the imaging unit.

  In the second aspect of the present invention, an imaging apparatus includes the imaging unit described above.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is sectional drawing which shows typically the camera 10 which is an example of an imaging device. 2 is a perspective view schematically showing a part of an imaging unit 40. FIG. It is sectional drawing which shows typically the state by which the imaging chip 100 is sealed. It is sectional drawing which shows typically the imaging unit 40 returned to normal temperature. It is a perspective view which shows typically a part of imaging unit 390 in another form. It is sectional drawing which shows typically the imaging unit 390 returned to normal temperature. It is sectional drawing which shows typically the imaging unit 490 in another form. 6 is a cross-sectional view schematically showing an imaging unit 490 when the pressure in the accommodation space 180 is lowered. FIG. It is a plane sectional view showing typically image pick-up unit 590 in other forms. FIG. 10 is a cross-sectional view schematically showing an imaging unit 590 when the pressure in the accommodation space 180 is lowered. It is sectional drawing which shows typically the imaging unit 690 in another form. It is sectional drawing which shows the imaging unit 690 typically.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a cross-sectional view schematically showing a camera 10 that is an example of an imaging apparatus. The camera 10 includes a lens unit 20 and a camera body 30. The lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides an incident subject light flux to the imaging unit 40 of the camera body 30.

  The direction in which the subject luminous flux enters the imaging chip 100 included in the imaging unit 40 is defined as the z-axis direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction, and the lateral direction is defined as the y-axis direction. The direction in which the subject light flux travels toward the imaging chip 100 is defined as the z-axis plus direction. In FIG. 1, the direction toward the front of the paper is defined as the x-axis plus direction, the direction toward the bottom of the paper as the y-axis plus direction, and the direction toward the right of the paper as the z-axis plus direction.

  The camera body 30 includes a main mirror 32 and a sub mirror 33 behind a body mount 26 coupled to the lens mount 24. Unless otherwise specified, the rear represents the z-axis plus direction. The main mirror 32 is pivotally supported so as to be rotatable between an entry position where it enters the optical path of the subject light beam incident from the lens unit 20 and a retreat position where it is retracted from the subject light beam. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32.

  When the main mirror 32 is at the entry position, a part of the subject light beam incident through the lens unit 20 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is disposed at a position conjugate with the imaging surface of the imaging chip 100 included in the imaging unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the viewfinder 86 through the pentaprism 82 and the viewfinder optical system 84.

  When the main mirror 32 is at the entry position, a part of the subject light beam incident on the main mirror 32 passes through the half mirror region of the main mirror 32 and enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the focusing optical system 70. The focusing optical system 70 guides the incident light beam to the focus detection sensor 72. The focus detection sensor 72 outputs the detection result to the CPU 51.

  The focus plate 80, the pentaprism 82, the main mirror 32, and the sub mirror 33 are supported by a mirror box 60 as a structure. When the main mirror 32 and the sub mirror 33 are retracted to the retracted position and the front curtain and the rear curtain of the shutter unit 38 are opened, the subject luminous flux passing through the lens unit 20 is an optical unit disposed behind the shutter unit 38. 50 passes through and reaches the imaging surface of the imaging chip 100.

  The imaging chip 100 has a pixel region and a circuit region formed around the pixel region. The pixel area of the imaging chip 100 has a plurality of photoelectric conversion elements that photoelectrically convert the received subject light flux, and forms an imaging surface. The circuit area of the imaging chip 100 includes a processing circuit that performs signal processing of pixel signals obtained by photoelectric conversion in the photoelectric conversion element. The processing circuit includes an AD conversion circuit that converts a pixel signal that is an analog signal into a digital signal. The pixel signal converted into a digital signal by the processing circuit is output from the imaging chip 100 as an output signal.

  A substrate 62 and a rear display unit 88 are sequentially arranged behind the imaging unit 40. As the rear display unit 88, a liquid crystal panel or the like can be applied. The display surface of the rear display unit 88 appears on the rear surface of the camera body 30. The rear display unit 88 displays an image generated from the output signal from the imaging chip 100.

  Electronic circuits such as a CPU 51 and an ASIC 52 are mounted on the substrate 62. The CPU 51 is responsible for overall control of the camera 10. An output signal from the imaging chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

  The ASIC 52 generates image data for display based on the output signal from the imaging chip 100. The rear display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates a recording image based on the output signal from the imaging chip 100. The recording image data generated by the ASIC 52 is recorded on a recording medium that is detachably attached to the camera 10.

  FIG. 2 is a perspective view schematically showing a part of the imaging unit 40. FIG. 3 is a cross-sectional view schematically showing a state where the imaging chip 100 is sealed.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is mounted on the mounting substrate 120 with an adhesive 150, for example. The mounting substrate 120 has a first surface 121 that is a mounting surface on which the imaging chip 100 is mounted, and a second surface 122 that is a surface opposite to the first surface 121. The imaging chip 100 may be mounted on the mounting substrate 120 with an LGA (Land Grid Array), a BGA (Ball Grid Array), or the like.

  The mounting substrate 120 is a substrate on which the imaging chip 100 is mounted. The mounting substrate 120 is a multilayer substrate. The mounting substrate 120 is a core substrate including a core layer. The mounting substrate 120 is a resin core substrate using a resin such as an epoxy resin as a core layer. The mounting substrate 120 has a plurality of wiring layers, an insulating layer that insulates the wiring layers from each other, and a core layer. The total thickness of the mounting substrate 120 is, for example, 0.8 mm to 3.0 mm. The wiring layer is made of metal. The wiring layer is a wiring pattern. The thickness of the wiring pattern is about 30 μm to 40 μm. The thickness is the length in the z-axis direction. The insulating layer is made of resin. The insulating layer insulates the wiring layer from the wiring layer. The thickness of the insulating layer is about 30 μm to 40 μm. The core layer is made of resin. The core layer is sandwiched between the wiring layer and the wiring layer. The core layer is thicker than the wiring layer. The core layer is thicker than the insulating layer. Specifically, the thickness of the core layer is about 0.1 mm to 0.4 mm. The mounting substrate 120 may be a metal core substrate using a metal such as an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, or aluminum as a core layer. When a metal core substrate is used as the mounting substrate 120, the core layer may be sandwiched between the insulating layer and the insulating layer. The mounting substrate 120 may be a multilayer substrate that does not include a core layer. As the mounting substrate 120 that does not include the core layer, a multilayer substrate made of, for example, ceramic may be used.

  An electronic component is mounted on the second surface 122 of the mounting substrate 120. Examples of the electronic component include a capacitor, a resistor, and a resistor. The electronic components constitute a power supply circuit that supplies power to the imaging chip 100 and the like. The electronic component is electrically connected to the wiring layer included in the mounting substrate 120 via solder or the like.

  A connector may be further mounted on the second surface 122. The connector is connected to, for example, a flexible printed board. In this case, the pixel signal output as an output signal from the imaging chip 100 is output to the connector via a via formed in the mounting substrate 120. The pixel signal output to the connector is output to the ASIC 52 as an example of an external processing circuit via the flexible printed board.

  The frame 140 surrounds the imaging chip 100. The frame 140 is fixed to the first surface 121 of the mounting substrate 120. The frame 140 is fixed to the first surface 121 of the mounting substrate 120 with an adhesive. The frame 140 includes a deforming part 200 and a support part 240. The deformable portion 200 is more flexible than the support portion 240.

  The support portion 240 is formed of a metal such as aluminum, brass, iron, or nickel alloy. In addition, the support part 240 may be formed with resin, and a metal and resin may be formed by insert molding. By using insert molding of metal or metal and resin as the support part 240, heat generated in the imaging chip 100 can be efficiently released from the frame 140.

  The deformation part 200 is formed of rubber such as silicon rubber. The deformation part 200 has an elasticity lower than that of the support part 240. The deformable portion 200 has elasticity lower than that of the cover glass 160.

  The deformable portion 200 has elasticity lower than that of the mounting substrate 120. The thickness of the deformable portion 200 in the x direction is the same as the thickness of the support portion 240 in the x direction. The deformation part 200 is fixed to the support part 240. The space between the deformable portion 200 and the support portion 240 is sealed with an adhesive.

  The cover glass 160 is fixed to a surface 141 opposite to the surface facing the mounting substrate 120 in the frame 140. The cover glass 160 is bonded to the upper surface 141 of the frame 140 with a sealing adhesive 170.

  As a material for the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, or the like can be used. The cover glass 160 is an example of a translucent optical element. The cover glass 160 functions as a seal member together with the mounting substrate 120 and the frame 140.

  A housing space 180 for housing the imaging chip 100 is formed by the mounting substrate 120, the frame 140, and the cover glass 160. When the mounting substrate 120, the frame 140, and the cover glass 160 are assembled, the accommodation space 180 is isolated from the external space. In this case, the accommodation space 180 is a sealed space in which the imaging chip 100 is disposed and sealed. By making the accommodation space 180 a sealed space, air and moisture can be prevented from flowing into the accommodation space 180 from the outside. Therefore, deterioration of the imaging chip 100 due to oxidation or the like can be suppressed.

  The sealing adhesive 170 is a thermosetting adhesive. The imaging unit 40 is assembled in a high temperature environment higher than normal temperature. For example, in the imaging unit 40, the sealing adhesive 170 is cured in a high temperature environment in a state where the cover glass 160 is bonded to the frame 140 by the sealing adhesive 170. As the sealing adhesive 170 is cured, the cover glass 160 is fixed to the frame 140. Thereby, the cover glass 160 functions as a seal member that seals the imaging chip 100 in a state of being fixed to the frame 140.

  FIG. 4 is a cross-sectional view schematically showing the imaging unit 40 moved from the high temperature environment to the normal temperature environment. When the imaging unit 40 is moved from the high temperature environment to the normal temperature environment, the deformation unit 200 is deformed.

  Since the storage space 180 is isolated from the external space, when the imaging unit 40 is moved from the high temperature environment during assembly to the normal temperature environment, the pressure in the storage space 180 decreases and becomes lower than the pressure in the external space. When the atmospheric pressure in the accommodation space 180 becomes lower than the atmospheric pressure in the external space, pressure is applied to the imaging unit 40 in a direction to reduce the volume of the accommodation space 180 due to a pressure difference generated between the accommodation space 180 and the external space. .

  In the imaging unit 40, since the deforming part 200 has elasticity, the deforming part 200 deforms in a direction in which the volume of the accommodation space 180 is reduced. By deforming the deforming portion 200, the pressure difference between the accommodation space 180 and the external space is reduced.

  By providing the deformation part 200 in the frame 140, distortion in the frame 140 due to a pressure difference is generated in the deformation part 200 rather than in the support part 240. By deforming the deformable portion 200, distortion of the support portion 240 due to the pressure difference can be suppressed. Thereby, it can suppress that the support part 240 of the flame | frame 140 deform | transforms.

  By deforming the deforming portion 200 provided on the frame 140, it is possible to suppress the force that reduces the volume of the accommodation space 180 due to the pressure difference from being applied to the cover glass 160. Thereby, it can suppress that the cover glass 160 deform | transforms. It is possible to prevent the mounting substrate 120 from being deformed by applying force to the mounting substrate 120 through the frame 140 due to the deformation of the cover glass 160.

  By deforming the deforming portion 200 provided in the frame 140, it is possible to suppress the force that reduces the volume of the accommodation space 180 due to the pressure difference from being applied to the mounting substrate 120. Thereby, the deformation | transformation of the mounting substrate 120, ie, curvature, can be suppressed.

  FIG. 5 is a perspective view schematically showing a part of an imaging unit 390 in another form. In the imaging unit 390, members having the same configuration as each part of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted. In FIG. 5, illustration of the cover glass 160 is omitted for convenience of explanation.

  The imaging unit 390 includes an inner part 310 and an outer part 320 as the deforming part 300 that deforms due to a pressure difference. An internal space 330 is formed between the inner part 310 and the outer part 320. The internal space 330 is formed by the mounting substrate 120, the inner part 310, the outer part 320, and the cover glass 160. The internal space 330 is isolated from the accommodation space 180 and the external space.

  The thickness of the inner part 310 in the x direction and the thickness of the outer part 320 in the x direction are smaller than the thickness of the support part 240 in the x direction. The inner part 310 and the outer part 320 have flexibility. It is preferable that the inner part 310 and the outer part 320 have plasticity. The inner part 310 and the outer part 320 may be low elastic bodies. The thin film 400 preferably has a large elastic limit. The inner part 310 and the inner part 310 may be formed of resin. The inner part 310 and the inner part 310 may be a rubber thin film such as silicon rubber.

  FIG. 6 is a cross-sectional view schematically showing the imaging unit 390 returned to room temperature. The imaging unit 390 has an inner part 310 and an outer part 320 that are deformed at room temperature.

  When the pressure in the internal space 330 decreases, the outer portion 320 deforms in a direction that reduces the pressure difference between the pressure in the internal space 330 and the pressure in the external space. Specifically, the outer portion 320 is deformed in a direction that reduces the volume of the inner space 330. More specifically, the outer portion 320 is deformed in a direction toward the inner portion 310.

  The inner portion 310 is deformed in a direction that reduces the pressure difference between the pressure in the internal space 330 and the pressure in the accommodation space 180. Specifically, the inner portion 310 is deformed in a direction that reduces the volume of the accommodation space 180. Thereby, the pressure difference between the accommodation space 180 and the external space can be reduced, and deformation of the cover glass 160 and the mounting substrate 120 can be suppressed.

  FIG. 7 is a cross-sectional view schematically showing an imaging unit 490 in another form. FIG. 8 is a cross-sectional view schematically showing the imaging unit 490 when the pressure in the accommodation space 180 is lowered. In the image pickup unit 490, members having the same configuration as each part of the image pickup unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  In the imaging unit 490, a communication hole 420 that communicates with the accommodation space 180 is formed in the support portion 240. The communication hole 420 penetrates from the inner surface 244 to the outer surface 243 of the support portion 240. The support part 240 has the extending | stretching part 410 extended | stretched toward the external space from the outer surface 243. FIG. The extending portion 410 surrounds the periphery of the opening of the communication hole 420 on the outer surface 243 of the frame 140.

  The leading end of the extending portion 410 is blocked by the thin film 400. The thin film 400 is an example of a deforming portion that deforms according to a pressure difference between the accommodation space 180 and the external space.

  The thin film 400 has flexibility. The thin film 400 may be a low elastic body. The thin film 400 has plasticity. The thin film 400 preferably has a large elastic limit. The thin film 400 may be formed of a resin. The thin film 400 may be a resin in a film state. The thin film 400 may be a rubber thin film such as silicon rubber.

  In the imaging unit 490, a space 430 is defined by the outer surface 243 of the support portion 240, the extending portion 410, and the thin film 400. The space 430 communicates with the accommodation space 180 through a communication hole 420 that penetrates the frame 140.

  As shown in FIG. 8, when the pressure in the accommodation space 180 decreases and becomes lower than the pressure in the external space, the thin film 400 is deformed in a direction that decreases the volume of the space 430. Specifically, the thin film 400 is deformed toward the outer surface 243 of the frame 140. Thereby, the pressure difference between the accommodation space 180 and the external space can be reduced, and deformation of the cover glass 160 and the mounting substrate 120 can be suppressed.

  FIG. 9 is a plan sectional view schematically showing an imaging unit 590 in another form. FIG. 10 is a cross-sectional view schematically showing the imaging unit 590 when the pressure in the accommodation space 180 is lowered. In the imaging unit 590, members having the same configurations as the respective parts of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  In the imaging unit 590, the support unit 240 has an internal space 530. A communication hole 520 that connects the external space and the internal space 530 is formed in the support portion 240.

  The support part 240 has an inner part 500 and an outer part 510. The internal space 530 is located between the inner part 500 and the outer part 510. The inner part 500 is in contact with the accommodation space 180 and the internal space 530. The outer portion 510 is in contact with the internal space 530 and the external space.

  The inner part 500 is more flexible than the outer part 510. The inner portion 500 has a shape that is more easily deformed by a pressure difference than the outer portion 510. The outer portion 510 has a thickness that supports the cover glass 160. The inner part 500 is thinner than the outer part 510. The inner part 500 is deformed by a pressure difference between the accommodation space 180 and the external space. On the other hand, the outer portion 510 is less likely to deform than the inner portion 500 due to a pressure difference.

  As shown in FIG. 10, when the pressure in the storage space 180 decreases and becomes lower than the pressure in the external space, the inner portion 500 is deformed in a direction that decreases the volume of the storage space 180. Thereby, the pressure difference between the accommodation space 180 and the external space can be reduced, and deformation of the cover glass 160 and the mounting substrate 120 can be suppressed.

  The material of the inner part 500 may be the same as the material of the outer part 510. The inner part 500 and the outer part 510 may be integrally formed as the support part 240. The material of the inner part 500 may be different from the material of the outer part 510. The inner part 500 may be formed of a material having a lower elastic modulus than the material forming the outer part 510.

  FIG. 11 is a cross-sectional view schematically showing an imaging unit 690 in another form. FIG. 11 shows a state in which the sealing adhesive 170 is being thermally cured. FIG. 12 is a cross-sectional view schematically showing the imaging unit 690. FIG. 12 shows the state after thermosetting. In the imaging unit 690, members having the same configuration as each part of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  In the imaging unit 690, a through hole 620 is formed in the mounting substrate 120. The through hole 620 penetrates in the thickness direction in the mounting substrate 120. The through hole 620 penetrates from the first surface 121 to the second surface 122.

  The sealing adhesive 170 is thermally cured with the accommodation space 180 and the external space communicating with each other. After the thermosetting process, the opening of the through hole 620 in the second surface 122 is closed with the seal thin film 600. For example, the opening of the through hole 620 is closed with the seal thin film 600 under a temperature environment lower than the curing temperature. For example, the opening of the through hole 620 is closed with the seal thin film 600 under a normal temperature environment.

  Thereby, the accommodation space 180 is isolated from the external space, and the imaging chip 100 is sealed. By closing the through-hole 620 with the seal thin film 600 after thermosetting, it is possible to prevent a large pressure difference from being generated between the accommodation space 180 and the external space. For this reason, deformation of the cover glass 160 and the mounting substrate 120 due to a large pressure difference can be suppressed.

  The seal thin film 600 may be formed by film formation. The seal thin film 600 may be an oxide, nitride, or metal thin film. The seal thin film 600 may be attached to the second surface 122 with an adhesive to close the through hole 620. For bonding the seal thin film 600, a thermosetting adhesive having a relatively low curing temperature may be used. The curing temperature of the thermosetting adhesive used for bonding the seal thin film 600 is preferably lower than the curing temperature of the sealing adhesive 170. For the adhesion of the seal thin film 600, an adhesive that cures at room temperature may be used. For the adhesion of the seal thin film 600, a photo-curing adhesive may be used.

  The seal thin film 600 is an example of a closing portion that closes the through hole 620 in order to relieve a pressure difference between the accommodation space 180 and the external space. The closed portion is not limited to the seal thin film 600. For example, the through hole 620 may be closed by filling with a sealing material. When an adhesive is used as the sealing material, the curing temperature of the thermosetting adhesive is preferably lower than the curing temperature of the sealing adhesive 170.

  In the above-described embodiment, the deforming portion and the closing portion for relieving the pressure difference may be disposed on any member that surrounds the accommodation space 180. For example, the cover glass 160 may be disposed.

  The embodiment described above can be modified as follows. The mounting substrate 120 may be composed of a single substrate or may be composed of a plurality of substrates. When the mounting substrate 120 includes a plurality of substrates, the plurality of substrates may be mounted with an LGA (Land Grid Array), a BGA (Ball Grid Array), or the like. The imaging chip 100 is disposed in the accommodation space 180 formed by the mounting substrate 120, the frame 140, and the cover glass 160. However, the imaging chip 100 is not limited to this, and is formed by the mounting substrate 120 and the cover glass 160 integrally formed with the frame. It may be arranged in a sealed space.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 50 Optical unit 51 CPU
52 ASIC
60 mirror box 62 substrate 70 focusing optical system 72 focus detection sensor 80 focus plate 82 penta prism 84 finder optical system 86 finder 88 rear display unit 100 imaging chip 120 mounting substrate 121 first surface 122 second surface 140 frame 141 surface 150 adhesion Agent 160 Cover glass 170 Sealing adhesive 180 Housing space 200 Deformation part 240 Support part 243 Outer surface 244 Inner surface 300 Deformation part 310 Inner part 320 Outer part 330 Internal space 390 Imaging unit 400 Thin film 410 Extending part 420 Communication hole 430 Space 490 Imaging unit 500 Inner part 510 Outer part 520 Communication hole 530 Internal space 590 Imaging unit 620 Through-hole 600 Sealing thin film 690 Imaging unit

Claims (16)

An imaging unit,
An imaging chip for imaging a subject ;
A mounting substrate on which the imaging chip is mounted;
An accommodating portion for forming an accommodation space in which the imaging chip is accommodated together with the mounting substrate;
The mounting is arranged on at least one of the substrate and the receiving portion, and a deformable portion which deformation due to the pressure difference between the housing space and the imaging unit outside the external space,
The deformation part is
An inner part provided in contact with the accommodation space;
An outer part provided apart from the inner part and in contact with the outer space, and forming an inner space isolated from the accommodating space and the outer space between the inner part and the inner part;
Have
The outer part and the inner part are deformed by the pressure difference.
Imaging unit. The imaging unit according to claim 1 wherein the deformable portion is to relieve the pressure differential to be deformed in the pressure difference. The accommodating portion is
A frame portion provided on the mounting substrate and surrounding the imaging chip;
Opposing to the mounting surface of the imaging chip on the mounting substrate, and an optical element provided in close contact with the frame portion,
The imaging unit according to claim 1, wherein the deforming portion is disposed on at least one of the frame portion and the mounting substrate. The flexible portion is disposed in said frame portion in contact with the housing space, to be deformed to the pressure difference,
The imaging unit according to claim 3, wherein the frame portion includes a support portion that is less likely to be deformed by the pressure difference than the deformation portion. The outer part and the inner part are formed of a member thinner than the support part.
The imaging unit according to claim 4 . The frame part is
An inner part provided in contact with the accommodation space;
An outer portion that is provided in contact with the outer space apart from the inner portion, and that forms an inner space isolated from the accommodating space, with the inner portion;
The frame portion is formed with a communication hole that communicates the external space and the internal space.
It said inner portion is thinner than the outer part, by more deformed to the pressure difference, the imaging unit according to claim 3 to relieve the pressure differential. The frame part is
A first surface in contact with the accommodation space;
A second surface opposite to the first surface;
The frame portion is formed with a through-hole penetrating from the first surface to the second surface,
The flexible portion is in the external space side of the second surface, wherein a space communicating with the accommodating space by the through-holes provided in contact with the external space, the pressure by more deformed to the pressure differential The imaging unit according to claim 3, wherein the difference is alleviated. The housing space is formed using a thermosetting adhesive,
The flexible portion has an imaging unit according to any one of claims 1 7 to mitigate arising the pressure difference after curing of the thermosetting adhesive material.   An imaging chip for imaging a subject;
  An accommodating portion having an accommodating space in which the imaging chip is accommodated;
  A deforming portion that is disposed in the housing portion and deforms due to a pressure difference between the housing space and an external space of the housing space;
  The deformation part is
  An inner portion of the accommodating space, and an outer portion that is provided in contact with the outer space and forms an inner space isolated from the accommodating space and the outer space,
  The outer part and the inner part are deformed by the pressure difference.
Imaging unit.   The deforming portion is deformed by the pressure difference to relieve the pressure difference.
The imaging unit according to claim 9.   The accommodating portion is
  A mounting substrate on which the imaging chip is mounted, a frame portion fixed to the mounting substrate and surrounding the imaging chip, and fixed to the frame portion, facing the mounting surface of the imaging chip on the mounting substrate An optical element to be disposed;
  The deformation portion is disposed on at least one of the frame portion and the mounting substrate.
The imaging unit according to claim 9 or 10.   The deforming portion is disposed on the frame portion and is deformed by the pressure difference,
  The frame portion has a support portion that is less likely to be deformed by the pressure difference than the deformation portion.
The imaging unit according to claim 11.   The outer part and the inner part are formed of a member thinner than the support part.
The imaging unit according to claim 12.   The frame part is
  A first surface in contact with the accommodation space;
  A second surface opposite to the first surface;
Have
  The frame portion is formed with a through-hole penetrating from the first surface to the second surface,
  The deforming portion is provided on the outer space side of the second surface in contact with the external space and the space communicating with the accommodating space through the through hole, and is deformed by the pressure difference to deform the pressure difference. Relieve
The imaging unit according to claim 11.   The housing space is formed using a thermosetting adhesive,
  The deforming portion relieves the pressure difference generated after the thermosetting adhesive is cured.
The imaging unit according to any one of claims 9 to 14.   An imaging device provided with the imaging unit as described in any one of Claims 1-15.

Images