JP6127088B2 - Adhesive and substrate manufacturing method - Google Patents

Description

The present invention relates to adhesives and manufacturing how the substrate.

  When flattening or thinning a substrate (for example, a semiconductor wafer, a metal plate, a ceramic plate, a single crystal plate, etc.) by grinding (for example, chemical mechanical polishing), the side opposite to the first surface to be ground on the substrate The first surface is ground while holding the second surface. For example, a suction mechanism is used to hold the second surface. However, the second surface of the substrate is often not flat and has irregularities that can be formed during processing. Moreover, there may be a relatively large unevenness due to bumps or the like on the second surface of the substrate like a semiconductor substrate. For this reason, if the suction mechanism is used to suck the second surface having irregularities and hold the substrate, the substrate is held by the suction mechanism in a tilted state, or suction by the suction mechanism cannot be performed well, and the holding power of the substrate is insufficient. As a result, grinding may not be performed as intended. Therefore, in order to remove or correct irregularities on the second surface of the substrate, an auxiliary member such as a resin, tape, or sheet for flattening the surface is attached (attached or formed) to the second surface of the substrate. ing. By attaching the auxiliary member to the second surface of the substrate, the inclination of the substrate is corrected, the suction by the suction mechanism can be performed well, the holding force of the substrate can be ensured, The two surfaces can be protected from foreign substances such as drugs and particles.

  However, when it is necessary to peel the auxiliary member from the substrate after grinding the substrate, a part of the auxiliary member (for example, an adhesive) may remain on the substrate. Therefore, various devices have been made to ensure that the auxiliary member can be peeled off from the substrate. For example, a technique for reducing the adhesive force of the auxiliary member by irradiating light such as ultraviolet rays before peeling the auxiliary member from the substrate (see, for example, Patent Document 1), a technique for reducing the adhesive force of the auxiliary member by heating (see, for example, Patent Document 1) For example, refer to Patent Document 2), and a technique (for example, refer to Patent Document 3) for reducing the adhesive force of the auxiliary member by chemical treatment with a stripping solution or the like has been proposed.

JP 2003-218073 A JP-A-11-204551 JP 2005-229053 A

  The following analysis is given by the inventor.

  However, in any of the above techniques, since the auxiliary member is peeled off after the process of reducing the adhesive force of the auxiliary member at the time of peeling of the auxiliary member, the time for peeling off the auxiliary member becomes longer, and the substrate Productivity may be reduced.

  In addition, in the technology for reducing the adhesive strength of the auxiliary member by light irradiation or heat treatment, it is necessary to incorporate a special layer for reducing the adhesive strength of the auxiliary member in the auxiliary member. Cost may increase. In addition, if such a special layer is incorporated in the auxiliary member, the auxiliary member becomes thick, so there is a possibility that the tilt of the substrate cannot be sufficiently removed. If the substrate is tilted and ground, There is a possibility that the yield of the substrate will decrease and the productivity of the substrate will decrease.

  Furthermore, in the technology for reducing the adhesive force of the auxiliary member by the chemical treatment, there is a possibility that the chemical component may permeate into the substrate, and the component of the chemical (such as an insulating layer or metal for a semiconductor substrate) due to the soaked chemical component. If the layer) deteriorates, the yield of the substrate decreases, and the productivity may not be improved. In addition, since such a chemical solution often contains various special components, the chemical solution becomes expensive and there is a possibility that the production cost cannot be reduced.

The main object of the present invention, the production cost does not increase, and, without reducing productivity, to provide a manufacturing how the adhesive and substrate planarization and thinning of the substrate can be reliably performed That is. The main object of the present invention, the production cost does not increase, and, without reducing the productivity, the substrate is processed to provide a manufacturing how the adhesive and substrate that can reliably process That is.

The adhesive according to the first aspect is an adhesive that bonds the substrate and the sheet by being interposed and cured between the substrate and the sheet, and in a cured state, the adhesive surface to the substrate The adhesive force in the direction of peeling from the adhesive surface is set to be smaller than the adhesive force in the direction parallel to the adhesive surface, and in the cured state, the adhesive force between the adhesive and the substrate is It is set to be smaller than the adhesive force between the adhesive and the sheet.
The adhesive according to the first modified example of the first viewpoint is an adhesive that bonds the substrate and the sheet by being interposed between the substrate and the sheet, and is cured, In the adhesive surface with the substrate, the adhesive force in the direction of peeling from the adhesive surface is set to be smaller than the adhesive force in the direction parallel to the adhesive surface, and in a cured state, the adhesive and the substrate The adhesive force is set to be smaller than the adhesive force between the adhesive and the sheet, and the adhesive is made of an ultraviolet curable resin that is cured by irradiation of ultraviolet rays, and an acrylic resin, a urethane resin, and an epoxy resin. The main component is any or all of a silicon resin and a urethane acrylate resin, and the sheet is made of a light-transmitting resin, and acrylic, polycarbonate, polyvinyl chloride, The main component is any one or all of lyimide and glass, and the substrate is any one of a semiconductor substrate, a ceramic substrate, a metal plate, and a resin plate, and is in a shear direction with respect to the substrate after curing of the adhesive. The adhesive force is 0.1 MPa or more and 50 MPa or less, and the adhesive force in the peeling direction from the substrate after the adhesive is cured is greater than 0 N / mm and 1 N / mm or less, and the adhesive is cured. The previous viscosity is 100 mPa · s or more and 100000 mPa · s or less, the elongation after curing of the adhesive is 50% or more and 700% or less, and the hardness of the adhesive after curing is from pencil 1B. also soft rather, the substrate has an uneven surface in the bonding surface of at least the adhesive.
The adhesive according to Modification 2 of the first viewpoint is an adhesive that bonds the substrate and the sheet by being interposed between the substrate and the sheet and is cured, and in the cured state, In the adhesive surface with the substrate, the adhesive force in the direction of peeling from the adhesive surface is set to be smaller than the adhesive force in the direction parallel to the adhesive surface, and in a cured state, the adhesive and the substrate The adhesive force is set to be smaller than the adhesive force between the adhesive and the sheet, and the adhesive is made of an ultraviolet curable resin that is cured by irradiation of ultraviolet rays, and an acrylic resin, a urethane resin, and an epoxy resin. The main component is any or all of a silicon resin and a urethane acrylate resin, the sheet is made of a light-transmitting resin, and the surface of the adhesive surface with the adhesive is treated with PET and It is a sheet mainly composed of any or all of polypropylene, and the substrate is any one of a semiconductor substrate, a ceramic substrate, a metal plate, and a resin plate, and is sheared with respect to the substrate after curing of the adhesive The adhesive force in the direction is 0.1 MPa or more and 50 MPa or less, and the adhesive force in the peeling direction from the substrate after curing of the adhesive is greater than 0 N / mm and 1 N / mm or less, and the adhesive The viscosity before curing is 100 mPa · s or more and 100000 mPa · s or less, the elongation after curing of the adhesive is 50% or more and 700% or less, and the hardness of the adhesive after curing is pencil. soft rather than 1B, the substrate has an uneven surface in the bonding surface of at least the adhesive.

The substrate manufacturing method according to the second aspect includes a step of forming an adhesive according to the first viewpoint on one of the substrate and the sheet, and bonding the other of the substrate and the sheet to the adhesive, A step of applying pressure so that the thickness of the agent becomes a predetermined thickness, a step of curing the adhesive, a step of grinding a surface of the substrate opposite to the surface of the adhesive, and the bonding And peeling the sheet together with the adhesive from the substrate without altering the agent.
The substrate manufacturing method according to a modification of the second aspect includes the steps of forming the substrate and one on the adhesives of the sheet, bonded to the substrate and the other of said sheet to said adhesive, said adhesive The step of applying pressure so that the thickness becomes a predetermined thickness, the step of curing the adhesive after the step of applying pressure, and the step of curing the adhesive, the adhesive on the substrate A step of grinding the surface opposite to the side surface, and a step of peeling the sheet together with the adhesive from the substrate without performing any of heat treatment, light treatment, and chemical treatment after the grinding step. When, only contains the adhesive in the cured state, so that the direction of the adhesive strength to peel from the adhesive surface in the adhesion surface with the substrate is reduced relative to the parallel direction of the adhesive force to the adhesive surface Set the said glue Is set so that the adhesive force between the adhesive and the substrate is smaller than the adhesive force between the adhesive and the sheet in a cured state, and the adhesive is an ultraviolet ray that is cured by irradiation with ultraviolet rays. It is made of a cured resin and has urethane acrylate resin as a main component, the sheet is made of a light transmissive resin and has polyvinyl chloride as a main component, and the substrate is made of a glass plate, an aluminum plate, or a silicon wafer. Any one, and the adhesive force of the shear direction with respect to the said board | substrate after hardening of the said adhesive agent is 0.1 MPa or more and 50 MPa or less, and the adhesive force of the peeling direction from the said board | substrate after hardening of the said adhesive agent Is greater than 0 N / mm and not more than 1 N / mm, and the viscosity of the adhesive before curing is not less than 100 mPa · s and not more than 100,000 mPa · s, The elongation after curing of the agent is 50% or more and 700% or less, the hardness of the adhesive after curing is softer than the pencil 1B, and the substrate has an uneven surface at least on the adhesive surface with the adhesive. Have .

  The board | substrate holding sheet | seat which concerns on a 3rd viewpoint is provided with the adhesive agent which concerns on a 1st viewpoint, and the sheet | seat adhere | attached on the surface on the opposite side with respect to the said substrate side surface of the said adhesive agent.

  According to the present invention, it is possible to surely flatten or thin a substrate without increasing production costs and reducing productivity.

FIG. 5 is a process cross-sectional view schematically showing the method for manufacturing a substrate according to the first embodiment. FIG. 6 is a process cross-sectional view schematically showing a method for manufacturing a substrate according to Embodiment 2. It is the table | surface which showed the conditions of the peeling test, and the result. It is process sectional drawing which showed the manufacturing method of the board | substrate concerning Embodiment 4 typically.

  Hereinafter, embodiments will be described with reference to the drawings. Note that, in the present application, where reference numerals are attached to the drawings, these are only for the purpose of helping understanding, and are not intended to be limited to the illustrated embodiments.

[Embodiment 1]
A substrate manufacturing method according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is a process cross-sectional view schematically showing the method for manufacturing a substrate according to the first embodiment.

  The substrate manufacturing method according to the first embodiment is a substrate manufacturing method suitable for flattening the first surface 11 to be ground or grinding the substrate 10 by grinding. In the substrate manufacturing method according to the first embodiment, the adhesive 20 and the sheet 30 for facilitating holding the substrate 10 on the second surface 12 with respect to the first surface 11 of the substrate 10 by the suction holding device 110 before grinding. Are separately formed, and after the grinding, both the adhesive 20 and the sheet 30 are peeled off. Details are as follows.

  First, the adhesive 20 is formed on the second surface 12 opposite to the first surface 11 to be ground of the substrate 10 (step A1; see FIG. 1A).

  Next, the sheet 30 is bonded to the adhesive 20 and pressure is applied so that the thickness of the layer of the adhesive 20 becomes a predetermined thickness (step A2; see FIG. 1B).

  Next, the adhesive 20 is cured (step A3).

  Next, the sheet 30 is held by the suction holding device 110 and the first surface 11 of the substrate 10 is ground (step A4; see FIG. 1C).

  Finally, the sheet 30 is peeled off together with the adhesive 20 from the substrate 10 without altering the adhesive 20 (without performing light treatment, heat treatment, chemical treatment, or the like) (step A5; see FIG. 1D). ).

  Here, the substrate 10 includes, for example, a semiconductor wafer (for example, a silicon substrate; whether or not a circuit is formed), a metal plate, a ceramic plate (for example, ferrite, sapphire, SiC, BaN, etc.), a single crystal A plate-like member such as a plate or a resin plate can be used. It does not matter whether the first surface 11 and the second surface 12 of the substrate 10 have irregularities (including irregularities due to bumps or the like).

  The adhesive 20 is an adhesive that exhibits an adhesive force when cured. The adhesive 20 is preferably used for holding and grinding the substrate 10 and may be used for holding the substrate 10 and performing other operations. The adhesive 20 is preferably a photocurable adhesive, and may be a thermosetting or solvent volatile curable adhesive. In the case of using a thermosetting adhesive, it is desirable that it is cured by heating as low as possible. The adhesive 20 is liquid and can be formed on the substrate 10 or the sheet 30 by a spin coating method, a coating method, a printing method, a dispense coating method, or the like.

  The adhesive 20 has a strong adhesive force in a direction parallel to the second surface 12 of the substrate 10 (shear direction) in a cured state, and has an adhesive force in a direction of peeling from the second surface of the substrate (exfoliation direction). Used in a state having weak properties (minimum with respect to the adhesive force in the shear direction). That is, the adhesive 20 is set so that the adhesive force in the direction of peeling from the adhesive surface on the adhesive surface with the substrate 10 is smaller than the adhesive force in the direction parallel to the adhesive surface in the cured state. . The adhesive 20 is set according to the material of the substrate 10 and the sheet 30 of the part to be bonded, and is determined by the relationship between the adhesive force between the adhesive 20 and the substrate 10 and the adhesive force between the adhesive 20 and the sheet 30. can do. As the adhesive 20, for example, an adhesive mainly composed of any or all of acrylic resin, urethane resin, epoxy resin, silicon resin, and urethane acrylate resin can be used. The adhesive 20 is set so that it can be peeled off without being altered when it is peeled off from the substrate 10 (without performing light treatment, heat treatment, chemical treatment, or the like).

  As the adhesive 20, a mixture of a plurality of commercially available products can be used. For example, a mixture of the following commercially available products with the following composition can be used. By blending as follows, (1) when uncured, the viscosity is low enough to fill small irregularities and can be cured in seconds, and (2) flexibility and stretchability in the cured state. It can be easily peeled off from the substrate 10 without damaging bumps and the like, and (3) has a shearing adhesive force that can withstand grinding resistance and an appropriate peeling adhesive force that can be easily peeled off. By developing such an adhesive, the adhesive 20 and the sheet 30 can be pulled from the substrate 10 without deteriorating the adhesive 20 (without performing light treatment, heat treatment, chemical treatment, etc.). It became possible to peel off. The adhesive 20 is not limited to this.
Company name Commercial product name Composition
SARTOMER CN996 10wt% to 30wt%
SARTOMER SR506NS 20wt% to 60wt%
Shin-Nakamura Chemical Co., Ltd. UAW2A 10wt% or more and 30wt% or less
BASF IRGACURE184 0wt% to 5wt%
BASF IRGACURE819 0wt% to 5wt%
Shin-Etsu Chemical KBM-5103 0wt% to 5wt%

  The adhesive 20 is desirably as thin as possible. When the second surface 12 of the substrate 10 has irregularities, it is desirable that the adhesive is filled in the recesses and that the projections be as thin as possible. The thickness of the adhesive 20 (the thickness of the minimum portion) can be, for example, larger than 0 μm and 500 μm or less. If the thickness exceeds 500 μm, the adhesive may be stretched and may be difficult to peel off from the substrate. The thickness of the adhesive 20 is preferably 10 μm or more and 200 μm or less, and more preferably 10 μm or more and 50 μm or less in consideration of suppressing the shrinkage during curing of the adhesive 20 to a small value. Note that the second surface 12 of the substrate 10 and the sheet 30 may partially contact each other.

  The adhesive force in the shear direction (corresponding to the tensile shear bond strength JISK6850 (1999)) to the substrate 10 after the adhesive 20 is cured can be 0.1 MPa or more and 50 MPa or less, and can be 1 MPa or more and 30 MPa or less. It is preferable. If it is less than 0.1 MPa, there is a possibility that the grinding resistance cannot be endured. On the other hand, when it exceeds 50 MPa, it may be difficult to peel off from the substrate 10.

  The adhesive strength (equivalent to the peel adhesive strength JISK6854 (1999)) in the peeling direction (180 ° in this case) from the substrate 10 after the adhesive 20 is cured may be greater than 0 N / mm and not greater than 1 N / mm. Preferably, it is 0.1 N / mm or more and 0.8 N / mm or less. If it exceeds 1 N / mm, the adhesive strength is too strong and it may be difficult to peel off from the substrate.

  The viscosity of the adhesive 20 before curing can be 100 mPa · s or more and 100,000 mPa · s or less, and preferably 500 mPa · s or more and 5000 mPa · s or less. If it exceeds 100,000 mPa · s, there is a possibility that relatively large irregularities such as bumps cannot be filled. If it is less than 100 mPa · s, the adhesive may flow down from the substrate.

  The elongation of the adhesive 20 after curing can be 50% or more and 700% or less, and preferably 100% or more and 500% or less. If it is smaller than 50%, bumps or the like may be removed. If it exceeds 700%, the hardness of the adhesive may be insufficient. The hardness of the adhesive 20 after curing is preferably softer than the pencil 1B in terms of the hardness by the pencil scratch hardness test method according to “JIS K 5600”.

  The sheet 30 is a member for use as a reinforcing material for the adhesive 20. The sheet 30 is formed in a film shape and has flexibility. The material of the sheet 30 can be determined by the relationship between the adhesive force between the adhesive 20 and the substrate 10 and the adhesive force between the adhesive 20 and the sheet 30. For example, PET (polyethylene terephthalate), acrylic, polypropylene, The main component may be any or all of polycarbonate, polyvinyl chloride, polyimide, glass and the like. The sheet 30 is made of a light transmissive material when the adhesive 20 is photocurable.

  A commercially available product can be used for the sheet 30, and for example, Svironstat (commercial product name; 0.2 mm thickness) manufactured by Sekisui Molding Co., Ltd. can be used.

  The thickness of the sheet 30 can be set to 50 μm or more, for example. If the thickness is less than 50 μm, the sheet is difficult to function as a reinforcing material and may be difficult to peel off from the substrate 10. Note that a flexible sheet that can be bent even with a thickness of 1 mm can be peeled off, but the production cost may increase. The thickness of the sheet 30 depends on the material, but considering practicality and economy, it is preferably 50 μm or more and 500 μm or less, and more preferably 100 μm or more and 300 μm or less.

  The suction holding device 110 is a device that holds the object to be held (here, the substrate 10) by suction. Note that the apparatus is not limited to the suction holding apparatus 110, and any apparatus may be used as long as the object to be held can be held.

  In the first embodiment, the example in which the sheet 30 is pasted after the adhesive 20 is formed on the substrate 10 is shown. However, the substrate 10 is pasted after the adhesive 20 is formed on the sheet 30. Also good.

  According to the first embodiment, since there is sufficient adhesive force (shear strength) with respect to the grinding force (grinding resistance) in the shear direction when the first surface 11 of the substrate 10 is ground, the substrate 10 is surely ground thinly. be able to. Further, since the adhesive force between the adhesive 20 and the substrate 10 is weak and the adhesive force between the adhesive 20 and the sheet 30 is strong, the substrate 10 is not left on the substrate 10 when the sheet 30 is peeled off. The sheet 30 and the adhesive 20 can be peeled off. Even if the second surface 12 of the substrate 10 has irregularities (for example, bumps) that cannot be absorbed by a tape or sheet, the irregularities are absorbed by the adhesive 20 layer without tilting the first surface of the substrate. Therefore, the first surface 11 of the substrate 10 can be surely flattened without generating dimples by grinding, so that the substrate 10 can be surely thinned and the yield of the substrate can be reduced. And the productivity of the substrate can be improved. Further, when the adhesive 20 and the sheet 30 adhered (adhesion-cured) to the substrate 10 are peeled off, the adhesive 20 is peeled off without being altered (without performing light treatment, heat treatment, chemical treatment, etc.). Therefore, it is possible to shorten the time for the step of peeling off the adhesive 20 and the sheet 30, and the productivity of the substrate 10 can be improved. In addition, when peeling off the adhesive 20 and the sheet 30 adhered (adhesion cured) to the substrate 10, it is not necessary to incorporate a special layer for modifying the adhesive 20 to make it easy to peel off. There is no increase. Further, since it is not necessary to incorporate a special layer for modifying the adhesive 20 so that it can be easily peeled off, the layer of the adhesive 20 can be thinned, and the substrate can be sufficiently removed from the inclination and ground. As a result, the yield of the substrate 10 can be improved, and the productivity of the substrate can be improved. Since the adhesive 20 and the sheet 30 bonded (bonded and cured) to the substrate 10 can be peeled off, the adhesive 20 can be peeled off without using chemicals for changing the quality of the adhesive 20 and making it easy to peel off. Does not increase. In addition, since the adhesive 20 can be peeled off without using a chemical solution for modifying and facilitating the peeling, the components of the substrate are not deteriorated by the components of the chemical solution, and the yield of the substrate 10 is improved. The productivity of the substrate 10 can be improved.

[Embodiment 2]
A substrate manufacturing method according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 2 is a process cross-sectional view schematically showing the method for manufacturing a substrate according to the second embodiment.

  The substrate manufacturing method according to the second embodiment is a modification of the first embodiment, and the adhesive (20 in FIG. 1) and the sheet (30 in FIG. 1) are separately applied to the second surface 12 of the substrate 10 before grinding. The adhesive 41 of the board | substrate holding sheet | seat 40 in which the adhesive agent 41 and the sheet | seat 42 were preset is bonded together. Other processes and configurations are the same as those in the first embodiment. The substrate holding sheet 40 is a sheet for holding the substrate 10 and includes an adhesive 41 and a sheet 42 (see FIG. 2A).

  The adhesive 41 is a layer that exhibits an adhesive force by being cured. The adhesive is gel-like and can be deformed before curing. The adhesive 41 is formed on one side of the sheet 42. The adhesive 41 adheres to the substrate 10 by bonding and curing the second surface 12 of the substrate 10 on the surface opposite to the surface on the sheet 42 side. The other configuration of the adhesive 41 can be the same as that of the adhesive of the first embodiment (20 in FIG. 1).

  The sheet 42 is a member for functioning as a reinforcing material for the adhesive 41. As the sheet 42, the same sheet as that of the first embodiment can be used.

  As a method for manufacturing a substrate according to the second embodiment, first, the adhesive 41 of the substrate holding sheet 40 in which the adhesive 41 is formed on the sheet 42 and the second surface 12 of the substrate 10 are bonded together, and the thickness of the adhesive 41 is increased. The pressure is applied so as to have a predetermined thickness (step B1; see FIG. 2B). Here, when the adhesive 41 and the second surface 12 of the substrate 10 are bonded together, the adhesive 41 may be subjected to a treatment such as light or heat to reduce the viscosity of the adhesive 41 (liquefaction). .

  Next, the adhesive 41 is cured (step B2).

  Next, the sheet | seat 42 is hold | maintained by the adsorption holding apparatus 110, and the 1st surface 11 of the board | substrate 10 is ground (step B3; refer FIG.2 (C)).

  Finally, the sheet 42 is peeled off together with the adhesive 41 from the substrate 10 without altering the adhesive 41 (without performing light treatment, heat treatment, chemical treatment, or the like) (step B4; see FIG. 1D). ).

  According to the second embodiment, as in the first embodiment, the production cost does not increase and the substrate can be reliably flattened and thinned without decreasing the productivity. The step of forming the adhesive on the substrate can be omitted, and the productivity can be further improved.

[Embodiment 3]
  A method for manufacturing a substrate according to the third embodiment will be described.

  In the substrate manufacturing method according to the third embodiment, instead of grinding the substrate in the substrate manufacturing method according to the first and second embodiments, for example, dicing, cutting, cutting, drilling, surface processing, welding, etching (wet etching, Examples include dry etching), film formation (or deposition), surface mounting (flip chip bonding), printing, plating treatment, drug treatment (acid treatment, alkali treatment), mechanical processing such as cleaning, physical treatment, and chemical treatment. Other steps are the same as those in the first and second embodiments.

  According to the third embodiment, as in the first and second embodiments, when the sheet is peeled, the sheet and the adhesive can be peeled from the substrate without leaving the adhesive on the substrate, which increases the production cost. In addition, the substrate can be reliably processed and processed without reducing productivity. With dicing, the substrate can be cut so as not to completely separate the adhesive or the sheet, so that it is not necessary to replace the sheet. In the case of surface mounting, it was confirmed that the adhesive and the sheet can withstand heating for 30 minutes at 250 ° C., which is higher than the temperature for surface mounting. In addition, the adhesive and the sheet can function as a protective film during processing of the substrate, and can be protected from foreign substances such as drugs and particles.

[Embodiment 4]
  A method for manufacturing a substrate according to Embodiment 4 will be described. This will be described with reference to the drawings. FIG. 4 is a process cross-sectional view schematically showing the substrate manufacturing method according to the fourth embodiment.

  The substrate manufacturing method according to the fourth embodiment is a modification of the first and second embodiments, and an adsorption holding device (110 in FIGS. 1C and 2C) is used as a means for holding the substrate 10. The holding plate 50 and the adhesive 51 are used. Other processes and configurations are the same as those in the first and second embodiments.

  Here, the holding plate 50 is a plate-like member for holding the substrate 10. As the holding plate 50, for example, a ceramic plate, a metal plate, or the like can be used, but is not limited thereto. A commercially available product can be used for the holding plate 50, for example, a ceramic sticking board (diameter 383 mm, thickness 20 mm) manufactured by Nippon Engis Co., Ltd. can be used.

  The pressure-sensitive adhesive 51 is a pressure-sensitive adhesive that bonds objects together with a pressure-sensitive adhesive force. For example, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, or a rubber-based pressure-sensitive adhesive can be used as the pressure-sensitive adhesive 51 according to the material of the holding plate 50 or the sheet 30, but is not limited thereto. A commercial item can be used for the adhesive 51, for example, BPS5079-1 by Toyochem Co., Ltd. can be used. The pressure-sensitive adhesive 51 is preferably one that can be easily peeled off due to a decrease in viscosity by heating (for example, heating to a temperature of 100 ° C. or lower). The pressure-sensitive adhesive 51 can be liquid and can be formed on the sheet 30 or above by a spin coat method, a coating method, a printing method, a dispense coating method, or the like. The thickness of the pressure-sensitive adhesive is desirably as thin as possible, and can be, for example, larger than 0 μm and 50 μm or less, and is preferably 10 μm or more and 30 μm or less in consideration of practicality and economy.

  As a method for manufacturing a substrate according to Embodiment 4, first, the sheet 30 (or 41, the same applies below) is applied to the second surface 12 of the substrate 10 by Steps A1 to A3 or Steps B1 to B2. Or 42, the same applies hereinafter), pressure is applied so that the thickness of the adhesive 20 becomes a predetermined thickness, and then the adhesive 20 is cured (step C1).

  Next, the pressure-sensitive adhesive 51 is formed on the surface of the sheet 30 opposite to the adhesive 20 side (step C2; see FIG. 4A). The pressure-sensitive adhesive 51 may be formed on a holding plate (50 in FIG. 4B).

  Next, the substrate 10 is held on the holding plate 50 by bonding the holding plate 50 to the adhesive 51 (step C3; see FIG. 4B).

  Next, the first surface 11 of the substrate 10 is ground (step C4; see FIG. 4C). As in the third embodiment, instead of grinding, for example, dicing, cutting, cutting, drilling, surface processing, welding, etching (wet etching, dry etching), film formation (or deposition), surface mounting (flip chip) Bonding), printing, plating treatment, drug treatment (acid treatment, alkali treatment), mechanical processing such as washing, physical treatment, and chemical treatment may be performed.

  Next, the unit including the substrate 10, the adhesive 20, the sheet 30, the pressure-sensitive adhesive 51, and the holding plate (50 in FIG. 4C) is heated to remove the holding plate (FIG. 4C) from the unit. 50) is removed (step C5; see FIG. 4D). Note that the adhesive 51 may or may not adhere to the sheet 30.

  Finally, the sheet 30 is peeled off from the substrate 10 together with the adhesive 20 without altering the adhesive 20 (without performing light treatment, heat treatment, chemical treatment, or the like) (step C6; see FIG. 4E). ).

  According to the fourth embodiment, it is not necessary to bring the adhesive 51 into contact with the substrate 10 even when it is necessary to securely hold the substrate 10 by being attached to the holding plate 50 using the adhesive 51, and the sheet 30 is peeled off. Since the sheet 30 and the adhesive 20 can be peeled from the substrate 10 without leaving the adhesive 20 and the pressure-sensitive adhesive 51 on the substrate 10, the production cost does not increase as in the first to third embodiments. In addition, the substrate can be reliably processed and processed without reducing productivity.

  The grinding test and peeling test in the substrate manufacturing method will be described.

[Grinding test]
In the grinding test, in accordance with the substrate manufacturing method (see FIG. 1) according to the first embodiment, the sheet 30 was attached to the substrate 10 via the adhesive 20, and then it was tested whether the substrate 10 could be ground. . Specifically, a silicon wafer having a thickness of 500 μm is used as the substrate 10, and a uniform thickness is obtained by dispensing a photocurable adhesive (main component: urethane acrylate resin) as the adhesive 20 on the second surface 12 of the silicon wafer. Then, a 200 μm-thick vinyl chloride sheet is bonded to the photocurable adhesive as the sheet 30, and then the photocurable adhesive is uniformly 20 μm (thinnest thickness). Then, light (ultraviolet light) was irradiated to cure the photocurable adhesive, and then it was tested whether the first surface 11 of the silicon wafer could be ground.

  As a result, even if the second surface 12 of the silicon wafer had irregularities, it could be ground flat so that the first surface 11 did not have irregularities. In addition, the silicon wafer could be ground to a thickness of 50 μm.

  When a solvent volatile curable adhesive or a thermosetting adhesive was used instead of the photocurable adhesive, it took longer to cure than the photocurable adhesive.

[Peel test]
In the peel test, the peel test was performed by changing the type of the substrate 10 or changing the thickness of the adhesive and the sheet. A glass plate, aluminum plate, or silicon wafer having a thickness of 500 μm is used as a substrate, an ultraviolet curable adhesive mainly composed of urethane acrylate resin is used as an adhesive, and PET (thickness 50 μm) is used as a sheet. Polyvinyl chloride resin (thickness 0.2, 0.3, 0.5, 1 mm) was used.

  As a peeling test method, an adhesive is applied to the second surface (adhesion surface) of the substrate (dispensing application), and then a sheet cut to a width of 100 mm and a length of 200 mm is bonded to the adhesive, and then the adhesive. Are uniformly pressed to 50 μm and 200 μm, and then the adhesive is cured by irradiating the adhesive with light (ultraviolet rays), and then the backgrinding release tape is applied to the peripheral portion of the side having a width of 100 mm on the sheet. Then, a test was conducted as to whether or not the adhesive could be peeled off together with the sheet when the sheet was peeled off. Here, grinding is not performed. Further, the backgrinding release tape is a trigger when the sheet is peeled off.

As a result, in the case of the PET sheet, only the PET sheet was peeled off regardless of the substrate, and the adhesive remained on the substrate. Therefore, it is necessary to remove the adhesive remaining on the substrate again. To avoid re-peeling process, it is necessary to have use a PET sheet surface-treated.

  In the case of the polyvinyl chloride sheet, the result shown in FIG. 3 was obtained. That is, the sheet and the adhesive could be peeled from the substrate according to the sheet thickness, the adhesive thickness, and the type of the substrate. Regardless of the type of substrate, the thinner the sheet thickness and the adhesive thickness, the easier it was to peel off the seal and the adhesive. The substrate tended to easily peel off the sheet and adhesive in the order of an aluminum plate, a glass plate, and a silicon wafer. If it is used at least with a sheet thickness of 0.3 mm or less and an adhesive thickness of 50 μm or less, the sheet and the adhesive can be peeled from any kind of substrate.

When a polypropylene sheet is used instead of the vinyl chloride sheet, the adhesive strength between the sheet and the adhesive is weak when the sheet is peeled off, and the adhesive remains on the silicon wafer as in the case of the PET sheet. It was. However, even with a polypropylene sheet, the adhesive surface of the adhesive surface treatment (e.g., corona discharge treatment) if put use a polypropylene sheet, can be made to the adhesive does not remain on the silicon wafer. Furthermore, when only the adhesive is used without using a sheet, it is necessary to increase the thickness of the adhesive layer in order to ensure the strength at the time of peeling, which is not economical.

(Appendix)
The adhesive according to the first aspect is an adhesive that bonds the substrate and the sheet by being interposed and cured between the substrate and the sheet, and in a cured state, the adhesive surface to the substrate The adhesive force in the direction of peeling from the adhesive surface is set to be smaller than the adhesive force in the direction parallel to the adhesive surface. Further, in the cured state, the adhesive force between the adhesive and the substrate is set to be smaller than the adhesive force between the adhesive and the sheet.

  In the adhesive according to the first aspect, the adhesive is made of an ultraviolet curable resin that is cured by irradiation of ultraviolet rays, and any or all of an acrylic resin, a urethane resin, an epoxy resin, a silicon resin, and a urethane acrylate resin. Is the main component.

  In the adhesive according to the first aspect, the adhesive is used between the substrate and the sheet at a thickness greater than 0 μm and not greater than 500 μm.

  In the adhesive according to the first aspect, the adhesive force in the shear direction to the substrate after the adhesive is cured is 0.1 MPa or more and 50 MPa or less. Moreover, the adhesive force in the peeling direction from the substrate after the adhesive is cured is greater than 0 N / mm and not greater than 1 N / mm.

  In the adhesive according to the first aspect, the viscosity of the adhesive before curing is not less than 100 mPa · s and not more than 100,000 mPa · s. The elongation of the adhesive after curing is 50% or more and 700% or less. Furthermore, the hardness of the adhesive after curing is softer than the pencil 1B.

  A method for manufacturing a substrate according to a second aspect includes a step of forming an adhesive according to the first viewpoint on one of a substrate and a sheet, and bonding the other of the substrate and the sheet to the adhesive, Applying a pressure so that the thickness of the adhesive becomes a predetermined thickness, curing the adhesive, grinding a surface of the substrate opposite to the adhesive-side surface, Peeling the sheet together with the adhesive from the substrate without altering the adhesive.

  In the method for manufacturing a substrate according to the second aspect, the sheet is made of a light transmissive resin. The sheet contains, as a main component, any or all of PET, acrylic, polypropylene, polycarbonate, polyvinyl chloride, polyimide, and glass. Furthermore, the thickness of the sheet can be 50 μm or more.

  In the substrate manufacturing method according to the second aspect, the substrate is one of a semiconductor substrate, a ceramic substrate, a metal plate, and a resin plate. Further, the substrate has an uneven surface at least on an adhesive surface with the adhesive.

  In the method of manufacturing a substrate according to the second aspect, in the step of peeling the sheet together with the adhesive, the sheet together with the adhesive from the substrate is not performed without any of heat treatment, light treatment, and chemical treatment. Tear off.

  The board | substrate holding sheet | seat which concerns on a 3rd viewpoint is provided with the adhesive agent which concerns on the said 1st viewpoint, and the sheet | seat adhere | attached on the surface on the opposite side with respect to the said substrate side surface of the said adhesive agent.

  The manufacturing method of the board | substrate which concerns on a 4th viewpoint WHEREIN: The process of forming the adhesive agent as described in any one of Claims 1 thru | or 5 on one side of a board | substrate and a sheet | seat, and the other of the said board | substrate and the said sheet | seat on the said adhesive agent And applying a pressure so that the thickness of the adhesive becomes a predetermined thickness, curing the adhesive, performing a predetermined process on the substrate, and the adhesive And the step of peeling the sheet together with the adhesive from the substrate without deteriorating the material.

  In the substrate manufacturing method according to the fourth aspect, the predetermined processing includes dicing, cutting, cutting, drilling, surface processing, welding, etching, film formation, surface mounting, printing, plating processing, drug processing of the substrate. And either cleaning.

  In the substrate manufacturing method according to the fourth aspect, the sheet is made of a light-transmitting resin. The sheet contains, as a main component, any or all of PET, acrylic, polypropylene, polycarbonate, polyvinyl chloride, polyimide, and glass. Furthermore, the thickness of the sheet can be 50 μm or more.

  In the substrate manufacturing method according to the fourth aspect, the substrate is one of a semiconductor substrate, a ceramic substrate, a metal plate, and a resin plate. Further, the substrate has an uneven surface at least on an adhesive surface with the adhesive.

  In the method for manufacturing a substrate according to the fourth aspect, in the step of peeling the sheet together with the adhesive, the sheet together with the adhesive from the substrate is not performed without any of heat treatment, light treatment, and chemical treatment. Tear off.

  In the method for manufacturing a substrate according to the fourth aspect, after the step of curing the adhesive and before the step of performing the predetermined processing, the sheet is adhered to the surface opposite to the adhesive side. A step of bonding the holding plate through an agent is performed, and after the step of performing the predetermined processing and before the step of peeling off the sheet, a step of peeling at least the holding plate from the sheet is performed.

  In the substrate manufacturing method according to the fourth aspect, the pressure-sensitive adhesive is used between the holding plate and the sheet at a thickness of greater than 0 μm and less than or equal to 50 μm.

  Each disclosure of the above-mentioned patent documents and non-patent documents is incorporated herein by reference. Within the scope of the entire disclosure (including claims and drawings) of the present invention, the embodiments and examples can be changed and adjusted based on the basic technical concept. In addition, various combinations or selections of various disclosed elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are possible within the framework of the entire disclosure of the present invention. It is. That is, the present invention naturally includes various variations and modifications that could be made by those skilled in the art according to the entire disclosure including the claims and the drawings, and the technical idea. Further, regarding numerical values and numerical ranges described in the present application, it is considered that any intermediate value, lower numerical value, and small range are described even if not specified.

[Significance of priority claim]
  This application claims the priority of the previous application / Japanese Patent Application No. 2015-64926 (filing date: March 26, 2015) and enjoys the benefits thereof, and the claims described in the previous application Should be interpreted based solely on the entire description (including claims, specification and drawings) of the earlier application, with the earlier filing date as the reference date.
  Further, the interpretation of the scope of claims with the later filing date as the reference date shall be interpreted based on the entire description of the specification and drawings as of the later filing date.
(Note that items added or changed on a later filing date are underlined.)

DESCRIPTION OF SYMBOLS 10 Board | substrate 11 1st surface 12 2nd surface 20 Adhesive 30 Sheet 40 Substrate holding sheet 41 Adhesive 42 Sheet
50 Retaining plate
51 Adhesive 100 Grinder 110 Adsorption holding device

Claims (6)

Forming a substrate and one on the adhesives of the sheet,
Bonding the other of the substrate and the sheet to the adhesive and applying pressure so that the thickness of the adhesive is a predetermined thickness;
After the step of applying the pressure, curing the adhesive;
After the step of curing the adhesive, grinding the surface of the substrate opposite to the adhesive side surface;
After the grinding step, without performing any of heat treatment, light treatment, and chemical treatment, the step of peeling the sheet together with the adhesive from the substrate;
Only including,
In the cured state, the adhesive is set so that the adhesive force in the direction of peeling from the adhesive surface on the adhesive surface with the substrate is smaller than the adhesive force in the direction parallel to the adhesive surface,
The adhesive is set in a cured state so that the adhesive force between the adhesive and the substrate is smaller than the adhesive force between the adhesive and the sheet,
The adhesive is made of an ultraviolet curable resin that is cured by ultraviolet irradiation, and has a urethane acrylate resin as a main component,
The sheet is made of a light-transmitting resin, and has polyvinyl chloride as a main component,
The substrate is any one of a glass plate, an aluminum plate, and a silicon wafer,
The adhesive force in the shear direction with respect to the substrate after curing of the adhesive is 0.1 MPa or more and 50 MPa or less,
The adhesive force in the peeling direction from the substrate after curing of the adhesive is greater than 0 N / mm and not greater than 1 N / mm,
The viscosity of the adhesive before curing is 100 mPa · s or more and 100,000 mPa · s or less,
The elongation after curing of the adhesive is 50% or more and 700% or less,
The hardness of the adhesive after curing is softer than the pencil 1B,
The substrate has a concavo-convex surface at least in an adhesive surface with the adhesive,
A method for manufacturing a substrate, comprising: The thickness of the sheet, a manufacturing method of a substrate according to claim 1, wherein a is 50μm or more. Forming an adhesive on one of the substrate and the sheet;
Bonding the other of the substrate and the sheet to the adhesive and applying pressure so that the thickness of the adhesive is a predetermined thickness;
After the step of applying the pressure, curing the adhesive;
After the step of curing the adhesive, performing a predetermined process on the substrate;
After the step of performing the predetermined processing, without performing any of heat treatment, light treatment, and chemical treatment, the step of peeling the sheet together with the adhesive from the substrate;
Only including,
In the cured state, the adhesive is set so that the adhesive force in the direction of peeling from the adhesive surface on the adhesive surface with the substrate is smaller than the adhesive force in the direction parallel to the adhesive surface,
The adhesive is set in a cured state so that the adhesive force between the adhesive and the substrate is smaller than the adhesive force between the adhesive and the sheet,
The adhesive is made of an ultraviolet curable resin that is cured by ultraviolet irradiation, and has a urethane acrylate resin as a main component,
The sheet is made of a light-transmitting resin, and has polyvinyl chloride as a main component,
The substrate is any one of a glass plate, an aluminum plate, and a silicon wafer,
The adhesive force in the shear direction with respect to the substrate after curing of the adhesive is 0.1 MPa or more and 50 MPa or less,
The adhesive force in the peeling direction from the substrate after curing of the adhesive is greater than 0 N / mm and not greater than 1 N / mm,
The viscosity of the adhesive before curing is 100 mPa · s or more and 100,000 mPa · s or less,
The elongation after curing of the adhesive is 50% or more and 700% or less,
The hardness of the adhesive after curing is softer than the pencil 1B,
The substrate has a concavo-convex surface at least in an adhesive surface with the adhesive,
A method for manufacturing a substrate, comprising: The predetermined processing is any of dicing, cutting, cutting, drilling, surface processing, welding, etching, film formation, surface mounting, printing, plating processing, drug processing, and cleaning of the substrate. The method for manufacturing a substrate according to claim 3 . After the step of curing the adhesive, and before the step of performing the predetermined processing, performing a step of attaching a holding plate to the surface on the opposite side to the adhesive side of the sheet via an adhesive,
5. The method for manufacturing a substrate according to claim 3 , wherein a step of peeling at least the holding plate from the sheet is performed after the step of performing the predetermined processing and before the step of peeling off the sheet. The adhesive method of manufacturing a substrate according to any one of claims 1 to 5, characterized in that use large and at 500μm or less than the thickness 0μm between the substrate and the sheet.

Images