JP6081170B2 - Imaging apparatus, endoscope, and manufacturing method of imaging apparatus - Google Patents

Description

  The present invention relates to an imaging device including an imaging device chip, an endoscope including the imaging device, and a manufacturing method of the imaging device, and more particularly, an imaging including a signal cable connected to the imaging device chip via a relay substrate. The present invention relates to a device, an endoscope including the imaging device, and a method for manufacturing the imaging device.

  An imaging device including an imaging element chip is used, for example, provided at the distal end portion of an electronic endoscope. In order to relieve the pain of the subject, it is important to reduce the diameter of the distal end portion of the endoscope.

  The imaging device includes a signal cable for transmitting and receiving signals to and from the imaging unit of the imaging element chip. The joint between the image sensor chip and the signal cable receives stress when the direction of the distal end portion of the endoscope is changed. For this reason, if the bonding strength is insufficient, disconnection or the like may occur at the bonded portion.

  As shown in FIG. 1, Japanese Patent Application Laid-Open No. 2011-188375 discloses an image pickup apparatus 101 including a signal cable 150 connected to an image pickup element chip 120 via a wiring board 140. The imaging element chip 120 has an imaging unit 121 on the front surface 120SA, and has a junction terminal 123 formed with a plurality of bumps 124 connected to the imaging unit 121 via the through wiring 122 on the back surface 120SB.

  The conductor 151 of the signal cable 150 is connected / fixed by being inserted into the connection hole 140H of the wiring board 140. For this reason, the imaging apparatus 101 has high connection reliability at the joint.

  As shown in FIG. 2, Japanese Patent Application Laid-Open No. 2010-069186 discloses an imaging apparatus 201 in which a connecting portion between a circuit board 240 and a cable 250 connected to the imaging board 220 is reinforced by a coupling body 260. Yes. The chassis 210 at the front end portion in which the circuit board 240 is accommodated is fixed by the arm 260A of the connection body 260, and the cable 250 is fixed by the half cylindrical member 260B of the connection body 260. In the imaging apparatus 201, even if a tensile stress is applied to the cable 250, the stress is applied to the chassis 210, not to the joint between the conducting wire 251 and the terminal 241. For this reason, the imaging apparatus 201 has high connection reliability.

  However, the imaging apparatus 101 may not have sufficient connection reliability against a strong stress. Further, the image pickup apparatus 201 has a high effect on the tensile stress in the cable longitudinal direction, but has a small effect on the stress in the vertical direction (lateral direction), and the connection reliability may not be sufficient.

JP 2011-188375 A JP 2010-069186 A

  An object of the present invention is to provide an imaging device with high connection reliability between an imaging element chip and a signal cable, a method for manufacturing the imaging device, and an endoscope including the imaging device.

An imaging apparatus according to an embodiment of the present invention has an imaging unit on the front surface, an imaging element chip on the back surface having a junction terminal connected to the imaging unit through a through wiring, the imaging unit and a signal signal cable and the first major surface having a conductive line for transmitting and receiving is connected to the conductor, and the electrode portion second major surface comprises a metal plate which is bonded to the bonding terminals, connecting the lead to the electrode portion A fixed portion that has a positioning function in the long axis direction and is deformed by an external urging force to crimp and fix the conductive wire, and the metal plate that is integral with the electrode portion and extends from the electrode portion An extension portion comprising: a relay substrate; a first main surface side connected to the conductor of the electrode portion of the relay substrate; and a joint portion between the fixing portion and the electrode portion of the conductor. A mold resin .

An endoscope of an imaging apparatus according to another embodiment includes an imaging element chip having an imaging unit on a front surface and a junction terminal connected to the imaging unit via a through wiring on the back surface, and the imaging unit a signal cable and a first major surface having a conductive line for transmitting and receiving signals are connected to the conductor, and the electrode portion second major surface comprises a metal plate which is bonded to the bonding terminals, the conductor said electrode portion A fixed portion that has a positioning function in the major axis direction when connected to the wire and is deformed by an external urging force to crimp and fix the conducting wire, and is extended from the electrode portion and is integral with the electrode portion Joining of a relay substrate having an extending portion made of the metal plate, a first main surface side connected to the conductive wire of the electrode portion of the relay substrate, the fixing portion, and the electrode portion of the conductive wire and the molding resin covering the part, the imaging device tip having a It includes an insertion portion which is set, and the insertion portion of the base end disposed in the operation unit, and a universal cord extending from the operating portion.

In another embodiment, the manufacturing method includes a step of manufacturing an imaging element chip having an imaging unit on the front surface and having a junction terminal connected to the imaging unit via a through-wiring on the back surface; A portion is connected to the outer lead of the outer peripheral portion via a lead that is an extended portion, and the electrode portion has a fixing portion that is deformed by an external biasing force, and a step of producing a lead frame made of a metal plate; A step of positioning the lead wire of the signal cable in the lead frame by positioning the lead wire in the long axis direction by the fixing portion of the lead frame, and applying the biasing force from the outside to deform the fixing portion, a step of crimped, a step of connecting the lead and the electrode portion of the lead frame, covering the first main surface side of the lead of the lead frame are connected by the resin, the electrode portion, the fixed And a step of molding a joint portion of the lead wire with the electrode portion, a step of cutting the lead of the lead frame to remove the outer lead, and producing a joined wiring board, and the electrode of the joined wiring board Joining the second main surface of the part and the joining terminal of the imaging device chip.

  ADVANTAGE OF THE INVENTION According to this invention, the imaging device with high connection reliability of an image pick-up element chip | tip and a signal cable, the endoscope which comprises the said imaging device, and the manufacturing method of the said imaging device can be provided.

It is sectional drawing of the conventional imaging device. It is a side view of the conventional imaging device. It is an exploded sectional view of the imaging device of a 1st embodiment. It is a flowchart for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view of the lead frame for manufacturing the imaging device of a 1st embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is an exploded sectional view for explaining a manufacturing method of an imaging device of an embodiment. It is sectional drawing of the imaging device of 2nd Embodiment. It is a partial see-through plan view of a relay board of an imaging device of a 2nd embodiment. It is sectional drawing of the imaging device of 3rd Embodiment. It is a perspective view of the fixing | fixed part of the imaging device of 3rd Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 3rd Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 3rd Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 3rd Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 3rd Embodiment. It is a perspective view of the endoscope of a 4th embodiment.

<First Embodiment>
First, the structure of the imaging apparatus according to the first embodiment will be described.

  As shown in FIG. 3, the imaging apparatus 1 according to the present embodiment includes a prism 10, a cover glass 11, an imaging element chip 20, a relay substrate 40, a signal cable (hereinafter referred to as “cable”) 50, and a mold. And a resin 60. A light ray incident from the left direction in FIG. 3 is reflected by the prism 10 and enters the imaging unit 21. That is, the incident direction of incident light and the light receiving surface of the imaging unit 21 are parallel.

  As will be described later, the imaging apparatus 1 includes a bonding wiring in which an imaging substrate unit 80 including a cover glass 11 and an imaging element chip 20 includes a relay substrate 40, a cable 50, and a mold resin 60 via a sealing resin 31. It is joined to the plate 70.

  The relay substrate 40 relays between the image sensor chip 20 and the signal cable 50. The joint between the image sensor chip 20 and the relay substrate 40 is sealed with a sealing resin (underfill) 31. The cable 50 includes a plurality of conductive wires 51 for transmitting and receiving signals to and from the imaging unit 21. The other end of the cable 50 is connected to a signal processing device or the like (not shown).

  In addition, the figure is a schematic diagram for explanation, and a vertical / horizontal dimensional ratio and the like are different from actual ones. In addition, some components are not shown, and in the cross-sectional view, some components are displayed as viewed from the side.

  The prism 10 which is a transparent optical member made of glass or the like and the cover glass 11 are joined with a transparent adhesive (not shown). The imaging element chip 20 has an imaging unit 21 formed on the front surface 20SA, and has a plurality of junction terminals 23 connected to the imaging unit 21 via the through wiring 22 on the back surface 20SB. Bumps 24 are disposed on the junction terminals 23.

  As will be described in detail later, the relay substrate 40 includes a plurality of electrode portions 41, extension portions 44 extending from the respective electrode portions 41, and a fixing portion 42. The fixing part 42 includes two claw parts 43 (43A, 43B). The plurality of electrode portions 41 and the like are manufactured from the same single metal plate, but are separated from each other because they are separated.

  The conducting wire 51 of the cable 50 is crimped and fixed by the deformed claw portion 43 and joined to the first main surface 40SA of the electrode portion 41 by the solder 59. On the other hand, the joint terminal 23 of the imaging element chip 20 is joined to the second main surface 40SB of the electrode part 41 of the relay substrate 40 via the bumps 24.

  Then, the first main surface side of the relay substrate 40 and the leading end portion of the conducting wire 51 are molded with a molding resin 60. For this reason, the plurality of electrode portions 41 and the like of the relay substrate 40 are integrated by the mold resin 60 to constitute a bonded wiring board 70 in which the cable 50 is extended.

  In addition, since the conducting wire 51 is disposed between the two claw portions 43 </ b> A and 43 </ b> B, the major axis direction thereof coincides with the longitudinal direction of the fixing portion 42. That is, the fixing portion 42 has a function of positioning in the long axis direction when the conducting wire 51 is joined to the electrode portion 41.

  Next, a manufacturing method of the imaging device will be described along the flowchart of FIG.

<Step S11: Image Sensor Chip Manufacturing Process>
Using a known semiconductor technology, for example, a plurality of imaging units 21 made of a CCD or CMOS image sensor are formed on the front surface 20SA of a wafer made of a semiconductor such as silicon. The micro lens group may be formed on the imaging unit 21. After a plurality of wirings (not shown) connected to the imaging unit 21 are formed, a cover glass wafer that protects the imaging unit 21 is bonded to the front surface 20SA.

  Then, the through wiring 22 is formed from the back surface 20SB side, and a plurality of junction terminals 23 connected to the imaging unit 21 of the front surface 20SA via the through wiring 22 are formed. Further, bumps 24 are formed on the respective junction terminals 23. Then, by cutting the wafer, a large number of image pickup device chips 20 to which the cover glass 11 is bonded are manufactured in a lump.

  The chip-size package type image pickup device chip 20 has an image pickup unit 21 on the front surface 20SA, and a plurality of joint terminals 23 (bumps 24) connected to the image pickup unit 21 through the respective through wirings 22 on the back surface. To 20SB.

<Step S12: Lead frame manufacturing process>
As shown in FIG. 5, for example, a lead made of a metal plate in which a plurality of substantially circular electrode portions 41 having a diameter of 50 to 100 μm are connected to outer outer leads 45 through extending portions 44 that are leads. A frame 40R is produced. The arrangement of the plurality of electrode portions 41 corresponds to the arrangement of the plurality of junction terminals 23 of the imaging element chip 20.

  The lead frame 40R further extends from the electrode portion 41 in the long axis direction of the conducting wire, and has a fixing portion 42 having claw portions 43A and 43B on both sides. The extending direction of the fixing portion 42 is designed in consideration of the arrangement of the plurality of conducting wires 51.

  For example, the lead frame 40R made of a copper alloy such as CuFeP is manufactured by die-cutting a metal plate by a press method. The lead frame 40R can also be manufactured by a laser processing method or an etching method. For example, a NiCo plating film and a NiFeP plating film are preferably laminated on at least the electrode portion 41 of the lead frame 40R in order to improve solderability.

  In FIG. 6A, the boundaries of the electrode portion 41, the fixing portion 42, the claw portions 43A and 43B, and the extending portion 44 are indicated by broken lines, but the boundaries are not strictly defined.

<S13: Conductor arrangement process>
Since the lead frame 40R is made of, for example, a thin metal plate having a thickness of about 10 μm, the claw portions 43A and 43B of the fixing portion 42 can be deformed by an external urging force. As shown in FIG. 6B, the claw portions 43A and 43B are bent so as to be substantially perpendicular to the first main surface 40SA. The width of the elongated fixing portion 42 is set to be substantially the same as or slightly wider than the diameter of the conducting wire 51. And the extending direction of the fixing | fixed part 42 is set so that it may correspond with the major axis direction of the conducting wire 51 to arrange | position. For this reason, as shown to FIG. 6C and FIG. 6D, the major axis direction of the conducting wire 51 is set by inserting the conducting wire 51 between the two claw parts 43A and 43B.

  Note that the fixing portion 42 may have two claw portions 43A and 43B on one side surface. The major axis direction of the conducting wire 51 can be set by pressing the conducting wire 51 against the two claw portions 43A and 43B. Further, the number of claw portions may be three or more.

<S14: Crimp fixing process>
As shown in FIG. 6E, the claw portions 43A and 43B in which the conducting wire 51 is arranged are deformed so that the urging force is again applied from the outside and the conducting wire 51 is fixed by crimping. That is, the claw portions 43 </ b> A and 43 </ b> B are bent along the outer peripheral direction of the conducting wire 51.

<S15: Conductor connection process>
As shown in FIG. 6F, the conductive wire 51, strictly speaking, the conductor portion (core wire) 51 </ b> M of the conductive wire is connected to the first main surface 40 SA of the electrode portion 41 by solder 49. The length of the core wire 51M is set to about the diameter of the substantially circular electrode portion 41.

  6E and the like show an example in which the covering portion 51C of the conducting wire 51 made of the resin-coated core wire 51M is crimped and fixed in the crimping and fixing step. However, by conducting the crimping and fixing of the core wire 51M of the conducting wire 51, the conducting wire 51 may be connected to the electrode part 41 substantially. That is, the crimping fixing process may also serve as the connection process. Further, the core wire 51M connected to the electrode part 41 in the crimping and fixing process may be further soldered in the connecting process.

<S16: Molding process>
As shown in FIG. 7, the first main surface 40SA of the lead frame 40R is covered with a mold resin 60. In other words, the plurality of electrode portions 41, the plurality of fixing portions 42, the tip portions of the plurality of conductive wires 51, and a part of the plurality of extending portions 44 are molded with resin. At this time, at least the second main surface 40SB of the electrode portion 41 is not covered with the mold resin 60. Further, the rear end side of the conducting wire 51 is not covered with the mold resin 60.

  As the mold resin 60, various resins such as an epoxy resin, a phenol resin, an acrylic resin, or a silicone resin are used. The mold may be cured by pouring an uncured curable resin into the mold, or may be molded by pressing the thermoplastic resin in a heated state.

<S17: Outer lead removal process>
As shown in FIG. 8, the extended portion 44 of the lead frame 40R is cut and the outer lead 45 is removed, whereby the bonded wiring board 70 is manufactured. The end surface 44S of the extended portion 44 of the bonded wiring board 70 becomes a cut surface. That is, strictly speaking, a part of the extended portion of the lead frame 40R becomes the extended portion 44 of the bonded wiring board 70, and the remaining portion 44R of the extended portion of the lead frame 40R is removed together with the outer lead 45.

  In FIG. 8, the side surface of the mold resin 60 of the bonded wiring board 70 and the end surface 44 </ b> S of the extending portion 44 coincide with each other, but the end surface 44 </ b> S may protrude from the side surface of the mold resin 60.

<S18: Joining Step of Bonded Wiring Board>
As shown in FIG. 9, the second main surface 40SB of the plurality of electrode portions 41 of the relay substrate 40 exposed on the surface of the bonding wiring board 70 and the plurality of bonding terminals 23 of the back surface 20SB of the imaging element chip 20 are exposed. (Bump 24) is joined. That is, the imaging substrate unit 80 is bonded to the bonded wiring board 70. At this time, the joint surface is sealed with the sealing resin 31.

  In addition, you may perform an outer lead removal process after the joining process of a joining wiring board.

  The sealing resin 31 seals the periphery of the joint portion to increase connection reliability, and at the same time, enhances the joint strength between the imaging element chip 20 and the joint wiring board 70. As the sealing resin 31, an epoxy resin, a silicone resin, an acrylic resin, a phenol resin, or the like is used.

  Further, the prism 10 is bonded to the cover glass 11 to complete the imaging device 1. Of course, in the bonding wiring board bonding step, the imaging substrate unit 80 to which the prism 10 is bonded may be bonded to the bonding wiring board 70.

  The imaging device 1 uses a junction wiring board 70 made of a relay substrate 40 in which a joint portion with the cable 50 is resin-molded for electrical connection between the imaging element chip 20 and the cable 50. Furthermore, the conducting wire 51 is fixed to the fixing portion 42 of the relay substrate 40 by pressure bonding. For this reason, since the stress applied to the cable 50 is not transmitted to the joint portion, it is possible to prevent peeling or disconnection of the joint portion. That is, the imaging device 1 has high connection reliability between the imaging element chip 20 and the signal cable 50. In addition, since the bonded wiring board 70 is located below the imaging element chip 20 and is approximately the same size as the imaging element chip 20, the imaging device 1 is small.

  Moreover, since the manufacturing method of the imaging device 1 uses the lead frame 40R in which a plurality of electrode portions 41 and the like can be collectively disposed at a predetermined position, the manufacturing is easy and can be manufactured at low cost.

<Modification of First Embodiment>
Next, an imaging apparatus 1A according to a modification of the first embodiment will be described with reference to FIGS. Since the image pickup apparatus 1A is similar to the image pickup apparatus 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 10, in the imaging apparatus 1A, the imaging element chip to which the rewiring board 29 is bonded is bonded to the bonded wiring board 70A. Although not shown in FIG. 10, the rewiring board 29 is a multilayer wiring board having a structure in which a multilayer wiring layer composed of a plurality of wiring layers is insulated by a plurality of insulating layers, and is made of glass epoxy, ceramic, or Aluminum or the like is used as a base material. The rewiring board 29 may be a component built-in board in which an electronic component such as a chip capacitor is built.

  Furthermore, as shown in FIG. 11, the second main surface 40SB of the bonded wiring board 70 </ b> A is covered with an insulating layer 47 except for the electrode portion 41 covered with the plating electrode layer 48. The plated electrode layer 48 is for improving solderability, and is, for example, Ni / Au formed by electrolytic copper plating or electroless copper plating.

  That is, in the junction wiring board 70 </ b> A, the relay substrate 40 covered with the plating electrode layer 48 and the insulating layer 47 and the conductive wire 51 are integrated with the mold resin 60. Further, the imaging substrate unit 80 </ b> A includes the cover glass 11, the imaging element chip 20, and the rewiring substrate 29.

  The image pickup apparatus 1 </ b> A has the same effect as the image pickup apparatus 1, can be easily designed, and is unlikely to cause a short circuit when the image pickup element chip 20 and the bonded wiring board 70 are bonded.

Second Embodiment
Next, an imaging apparatus 1B according to the second embodiment will be described with reference to FIGS. Since the imaging device 1B is similar to the imaging devices 1 and 1A, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 12, in the imaging apparatus 1B, the conducting wire 51 is arranged perpendicular to the main surface of the electrode portion 41B, and the fixing portion 42B having the hole 42H into which the core wire at the tip of the conducting wire 51 is inserted is an electrode. It is joined to the portion 41B. That is, the electrode part 41B and the fixing part 42B are separate members.

  In the imaging apparatus 1B, the incident direction of incident light and the light receiving surface of the imaging unit 21 are perpendicular to each other. As will be described later, the bonding wiring board 70B is bonded to the electrode portion 41B (relay substrate 40B) covered with the plating electrode layer 48 and the insulating layer 47 with the fixing portion 42B with the high-temperature solder 49A and the solder 49B. The conductive wire 51 is integrated with the mold resin 60B. In addition, the imaging substrate unit 80 </ b> B includes the cover glass 11, the imaging element chip 20, and the rewiring substrate 29.

  Note that the size (planar dimension) of the bonded wiring board 70B is the same as or slightly smaller than the size (planar dimension) 20S of the imaging element chip 20 (imaging substrate part 80B).

  As shown in FIG. 13, the fixing portion 42B is, for example, a cylindrical body having a length of 300 μm and having a hole 42H formed therein, and a slit 42S is formed on the upper side surface. The fixing portion 42B is made of, for example, a copper alloy or a NiFe alloy. The upper part (slit forming part) of the fixing part 42B is easily deformed by an external biasing force.

  The manufacturing method of the imaging device 1B is substantially the same as the manufacturing method of the imaging device 1 shown in FIG. However, the lead frame manufacturing process to the conductor connecting process are different.

  The lead frame 40RB used for manufacturing the imaging device 1B is similar to the lead frame 40R shown in FIG. However, no fixed portion extends from the electrode portion 41B of the lead frame 40RB.

  As shown in FIG. 14A, the fixing portion 42B of the imaging device 1B is joined (brazed) to the electrode portion 41B of the lead frame 40RB with a high-temperature solder 49A having a melting temperature higher than that of the solder 49B.

  As shown in FIG. 14B, in the lead wire arranging step, the leading end portion of the lead wire 51 is inserted into the hole 42H of the fixing portion 42B. Since the inner diameter of the hole 42H of the fixing portion 42B is substantially the same as or slightly larger than the outer diameter of the conducting wire 51, the major axis direction of the conducting wire 51 is set perpendicular to the main surface of the electrode portion 41B. And in the conducting wire connecting step, the conducting wire 51 is joined by the solder 49B.

  As shown in FIG. 14C, in the crimping and fixing step, the conducting wire 51 is crimped and fixed to the fixing portion 42B by applying an urging force to the upper portion of the fixing portion 42B from the outside. That is, compared with the manufacturing method of the imaging device 1, the manufacturing method of the imaging device 1B has the order of the lead wire connecting step and the crimping fixing step reversed. However, it is clear that this order is not important because the conductors 51 may be connected by crimping.

  That is, in FIG. 14C and the like, an example in which the covering portion 51C of the conducting wire 51 is crimped and fixed is shown, but also in the imaging device 1B, the conducting wire 51 is substantially fixed to the electrode portion 41B by crimping and fixing the core wire 51M. You may connect with. That is, joining with the solder 49B is not essential.

  Further, as shown in FIG. 15, by inserting the lead 51 into the hole 42HB of the fixing portion 42B after the lead 51 having the core wire 51M covered with the solder 49BB by solder plating or the like is heated to melt the solder 49BB, You may join the conducting wire 51. FIG. Further, the hole of the fixing portion 42B is not a through hole but may be a bottomed via hole like the hole 42HB.

  The imaging device 1B has the same effect as the imaging devices 1 and 1A. Further, since the planar view size is the planar view size 20S of the image sensor chip 20, it can be arranged in a particularly narrow space.

<Third Embodiment>
Next, an endoscope 9 according to a third embodiment will be described.

  As shown in FIG. 16, the endoscope 9 is provided with the imaging device 1, the imaging device 1 </ b> A, or the imaging device 1 </ b> B provided at the distal end portion 2 and the proximal end side of the insertion portion 3. An operation unit 4 and a universal cord 5 extending from the operation unit 4 are provided.

  Since the endoscope 9 includes the imaging device 1 and the like having high connection reliability between the imaging element chip 20 and the signal cable 50, the endoscope 9 has high reliability.

  In particular, the endoscope 9 having the imaging device 1B having a small planar view size 20S1 can easily reduce the diameter of the distal end portion 2.

  The present invention is not limited to the above-described embodiment or modification, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Imaging device, 9 ... Endoscope, 10 ... Prism, 11 ... Cover glass, 21 ... Imaging part, 22 ... Through wiring, 23 ... Joining terminal, 24 ... Bump, 29 ... Rewiring board, 31 ... Sealing resin, 40 ... Relay substrate, 40R ... Lead frame, 41 ... Electrode part, 42 ... Fixing part, 43 (43A, 43B) ... Claw part, 44 ... Extension part, 45 ... Outer lead, 47 ... Insulating layer , 48 ... Electrode layer, 49 ... Solder, 50 ... Signal cable, 51 ... Lead wire, 59 ... Solder, 60 ... Mold resin, 70 ... Bonded wiring board, 80 ... Imaging board part

Claims (8)

An imaging element chip having an imaging unit on the front surface and having a junction terminal on the back surface connected to the imaging unit via a through-wiring;
Signal cable and the first major surface having a conductive line for sending and receiving the image pickup unit and the signal is connected to the conductor, and the electrode portion second major surface comprises a metal plate which is bonded to the bonding terminals, the a fixed portion which is deformed by crimping fixing the conductive wire by the urging force from the outside has a function of positioning the long axis direction when connecting the leads to the electrode portion, is extended from the electrode portion, the An extended portion made of the metal plate integral with the electrode portion, and a relay substrate,
A first resin main surface side connected to the conductor of the electrode portion of the relay substrate, and a molding resin covering a joint portion between the fixing portion and the electrode portion of the conductor. An imaging device. The imaging apparatus according to claim 1, wherein an end surface of the extending portion is a cut surface.   The conducting wire is arranged in parallel to the main surface of the relay board;
  The said fixing | fixed part consists of the said metal plate extended in the major axis direction of the said conducting wire from the said electrode part, and has a nail | claw part which crimps and fixes the said conducting wire. Imaging device.   The conducting wire is disposed perpendicular to the main surface of the relay board;
  The imaging device according to claim 2, wherein the fixing portion has a hole into which a leading end portion of the conducting wire is inserted and is joined to the electrode portion.   The imaging device according to any one of claims 1 to 4, wherein the imaging device is disposed at a distal end portion thereof, an operation portion disposed on a proximal end side of the insertion portion, and extending from the operation portion. An endoscope comprising: a universal cord that exits.   Producing an image pickup device chip having an image pickup unit on the front surface and having a junction terminal connected to the image pickup unit via a through-wiring on the back surface;
  A step of producing a lead frame made of a metal plate, in which the electrode portion is connected to the outer outer lead through a lead that is an extended portion, and the electrode portion has a fixing portion that is deformed by an external biasing force. When,
  Positioning the lead wire of the signal cable in the lead frame by positioning in the long axis direction by the fixing portion of the lead frame; and
  A step of crimping and fixing the conducting wire by applying an urging force from the outside and deforming the fixing portion;
  Connecting the conductive wire to the electrode portion of the lead frame;
  Covering the first main surface side of the lead frame to which the conductive wire is connected with resin, and molding the electrode portion, the fixing portion, and the joint portion of the conductive wire with the electrode portion; and
  Cutting the leads of the lead frame and removing the outer leads to produce a bonded wiring board;
  A step of bonding the second main surface of the electrode portion of the bonded wiring board and the bonding terminal of the imaging element chip.   The conducting wire is disposed in parallel to the principal surface of the electrode portion;
  The method of manufacturing an imaging apparatus according to claim 6, wherein the fixing portion is a part of the lead frame extending from the electrode portion.   The conducting wire is disposed perpendicular to the principal surface of the electrode portion;
  The method of manufacturing an imaging apparatus according to claim 6, wherein the fixing portion has a hole into which a leading end portion of the conducting wire is inserted and is joined to the electrode portion.

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