JP2014158563A - Endoscope, imaging device, and method for manufacturing imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope 9 in which connection reliability between an imaging element chip 20 and a signal cables 53 is high.SOLUTION: An endoscope 9 includes an imaging device 1 having: an imaging element chip 20 having an imaging part 21 provided on a front surface 20SA, and a bonding pad 24 provided at an outer periphery of a rear surface 20SB, connected with the imaging part 21 and having a bonding surface parallel to a main surface; a cable group 50 composed of a plurality of signal cables 53 in each of which a core wire 51 is coated by an insulation resin 52, a tip of the core wire 51 from which the insulation resin 52 is peeled is bonded with solder to the bonding pad 24 in a state of being disposed parallel to the bonding surface, and a rear end side from a bent part bending toward a center of the imaging element chip 20 vertically extends with respect to the bonding surface; and a binding part 60 for binding the plurality of signal cables 53.

Description

  The present invention relates to an endoscope including an imaging device having a signal cable joined to an imaging element chip at a distal end portion of an insertion portion, the imaging device, and a method for manufacturing the imaging device.

  An imaging device including an imaging element chip is used, for example, provided at the distal end portion of an insertion portion of an electronic endoscope. The imaging apparatus includes a signal cable for transmitting and receiving signals and the like with the imaging unit of the imaging element chip. In order to relieve pain of the subject, it is important to reduce the diameter and shorten the hard portion of the distal end portion of the insertion portion.

  As shown in FIG. 1, Japanese Patent Application Laid-Open No. 2012-55570 discloses an imaging apparatus 101 in which a wiring board 130 is disposed between an imaging element chip 120 and a signal cable 153. In the imaging device 101, the core wire 151 of the signal cable 153 is joined to the main surface of the wiring board 130 in a state of being arranged vertically. For this reason, the bonding area of the core wire 151 is narrow.

  The imaging device 101 with a small joint area may not have sufficient connection reliability.

  On the other hand, as shown in FIG. 2, Japanese Patent Laid-Open No. 2005-278760 discloses an imaging apparatus 201 in which a wiring board 230 is disposed between an imaging element chip 220 and a signal cable 253. In the imaging device 201, the core wire 251 of the signal cable 253 is arranged in parallel with and joined to the joint surface of the joint terminal 231 of the wiring board 230. For this reason, the imaging device 201 has a large joint area between the core wire 251 and the junction terminal 231, and has higher connection reliability than the imaging device 101.

  However, since the imaging device 201 has a joint surface on which the wiring board 230 forms the joint terminal 231, the longitudinal dimension of the hard portion is long, and shortening is not easy.

JP 2012-55570 A JP 2005-278760 A

  An object of the present invention is to provide an endoscope including a small-sized imaging device with high connection reliability between an imaging element chip and a signal cable, the imaging device, and a method for manufacturing the imaging device.

  An endoscope according to an embodiment of the present invention has an imaging unit on a front surface, and an imaging device having a bonding pad connected to the imaging unit and having a bonding surface parallel to a main surface on an outer peripheral portion on the back surface The chip and the core wire are covered with an insulating resin, and the core wire at the tip portion where the insulating resin is peeled is solder-bonded to the bonding pad in a state of being arranged in parallel to the bonding surface, A cable assembly having a plurality of signal cables each having a rear end side extending perpendicularly to the joint surface with respect to the bent portion bent toward the center side of the imaging element chip, and the plurality of signal cables are bundled together An imaging device including a binding unit is provided at the distal end of the insertion unit.

  An imaging device according to another embodiment includes an imaging device chip having an imaging unit on a front surface and having a bonding pad connected to the imaging unit and having a bonding surface parallel to a main surface on an outer peripheral portion of the back surface. The core wire is covered with an insulating resin, and the core wire at the front end portion where the insulating resin is peeled is solder-bonded to the bonding pad in a state of being arranged in parallel to the bonding surface, and the rear end of the bent portion And a signal cable extending perpendicularly to the joining surface.

  Furthermore, the manufacturing method of the imaging device according to another embodiment has an imaging unit on the front surface, and a bonding pad connected to the imaging unit and having a bonding surface parallel to the main surface is provided on the outer peripheral portion of the back surface. A step of producing an image pickup device chip, a step of peeling off the insulating resin at the tip of a signal cable including a core wire covered with an insulating resin, and a tip of the core wire parallel to the joint surface. And a bonding step in which the bonding pad is soldered to the bonding pad.

  ADVANTAGE OF THE INVENTION According to this invention, the endoscope which comprises the small imaging device with high connection reliability of an image pick-up element chip | tip and a signal cable, the said imaging device, and the manufacturing method of the said imaging device can be provided.

It is sectional drawing of the conventional imaging device. It is a back perspective view of the conventional imaging device. It is a perspective view of the imaging device of a 1st embodiment. It is a top view of the imaging device of a 1st embodiment. It is a side view of the imaging device of a 1st embodiment. It is a flowchart for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is an exploded view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is an exploded view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is an exploded view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view of the imaging device of 2nd Embodiment. It is an exploded view for demonstrating the manufacturing method of the imaging device of 2nd Embodiment. It is sectional drawing of the junction part of the signal cable and joining pad for demonstrating the joining method of the imaging device of 2nd Embodiment. It is an external view of the endoscope of 3rd Embodiment.

<First Embodiment>
First, the structure of the imaging device 1 of the first embodiment will be described.

  As shown in FIGS. 3, 4 </ b> A, and 4 </ b> B, the imaging device 1 includes an imaging element chip 20, a cable assembly 50, and a binding unit 60. That is, in the imaging device 1, unlike the conventional imaging devices 101 and 201, the cable assembly 50 is directly joined without the imaging element chip 20 and the wiring board or the like. In addition, the figure is a schematic diagram for explanation, and a vertical / horizontal dimensional ratio and the like are different from actual ones. In addition, some components are not shown or displayed with broken lines, or in the cross-sectional view, some components are displayed as viewed from the side.

  The imaging element chip 20 has an imaging unit 21 formed at a substantially central portion of the front surface 20SA. The outer surface of the front surface 20SA has a plurality of connection terminals 22 connected to the imaging unit 21 via wiring (not shown). A side surface wire 23 is provided on the side surface 20SS of the image pickup element chip 20, and a joint parallel to the main surface is connected to the outer peripheral portion of the back surface 20SB through the side surface wire 23 and connected to the image pickup unit 21 (connection terminal 22). A plurality of bonding pads 24 having a surface are provided.

  The cable assembly 50 has a plurality of signal cables 53 in which a core wire 51 made of a conductor such as copper is covered with an insulating resin 52. The insulating resin 52 is peeled off from the front end of the signal cable 53, and the exposed core wire 51 is bonded to the bonding pad 24 by the solder 40 in a state where the exposed core wire 51 is arranged in parallel to the bonding surface. The signal cable 53 is bent toward the center of the image pickup device chip 20 at the bent portion, and the rear end side of the bent portion extends perpendicular to the joint surface. The other end of the extended cable assembly 50 is connected to a signal processing device or the like (not shown).

  A joint portion of the second main surface 20SB of the imaging element chip 20 is sealed with a sealing resin 41 (indicated by a broken line).

  The binding unit 60 binds a plurality of signal cables 53. As will be described later, the plurality of signal cables 53 are soldered to the imaging element chip 20 while being bound by the binding portion 60. In addition, you may remove the binding part 60 after a joining process.

  The imaging device 1 is bonded in a state where the core wire 51 of the cable assembly 50 is arranged in parallel to the bonding surface of the bonding pad 24 of the imaging element chip 20. For this reason, since the imaging device 1 has a large joining area compared to the case where the core wire 51 is joined in a state of being arranged perpendicular to the joining surface, the imaging device chip 20 and the cable assembly 50 High connection reliability.

  Furthermore, in the imaging device 1, the cable assembly 50 is soldered to the imaging element chip 20 without using a wiring board or the like. For this reason, the imaging device 1 has a short dimension in the longitudinal direction.

  Further, in the imaging device 1, the rear end side of the signal cable 53 is bent substantially perpendicularly to the center side of the imaging element chip 20, and the planar dimension is the planar dimension of the imaging element chip 20. For this reason, the imaging device 1 has a small diameter.

  In the imaging apparatus 1, five signal cables 53 are joined together along the four sides of the outer peripheral portion of the rectangular second main surface 20SB. However, the signal cable 53 is bonded along at least one side, for example, along only two sides, and the bonding pad 24 may not be formed along the other side.

  Next, the manufacturing method of the imaging device 1 will be described along the flowchart of FIG.

<Step S11> Fabrication of imaging device chip The imaging unit 21 is provided on the front surface 20SA, and a plurality of bonding pads 24 connected to the imaging unit 21 and having a bonding surface parallel to the main surface are provided on the outer peripheral portion of the back surface 20SB. The image pickup device chip 20 is produced.

  That is, first, using a known semiconductor technology, for example, an image pickup unit 21 made of a CCD or CMOS image sensor is formed in the approximate center of the front surface 20SA of the image pickup element chip 20 made of a semiconductor such as silicon. The micro lens group may be formed on the imaging unit 21.

  Then, the connection terminal 22 of the front surface 20SA connected to the imaging unit 21, the bonding pad 24 of the back surface 20SB, and the side surface wiring 23 of the side surface 20SS connecting the connection terminal 22 and the bonding pad 24 are made of copper or the like. The conductive material is formed.

  The connection terminal 22 and the bonding pad 24 may be connected by a through wiring.

<Step S12> Preparation of Signal Cable The insulating resin 52 at the tip of the signal cable 53 having the core wire 51 made of a conductor covered with the insulating resin 52 is peeled off. The length to be peeled is about the same as the length of the bonding pad 24.

  6A, 6B and 6C, only the insulating resin 52 in the region facing the core wire 51 may be peeled off. In this case, one peeling region 52A becomes an injection port for injecting solder as a bonding material, and the opposing region 52B is bonded to the bonding pad 24. That is, the insulating resin 52 at the distal end of the signal cable 53 includes an inner portion (opposing region 52B) where the core wire 51 is bonded to the bonding surface and an outer portion (peeling region) facing the inner portion and the core wire 51. 52A), and the solder 40 that joins the core wire 51 and the joint surface is supplied to the joint through the outer portion.

  Then, the spread of the solder 40 at the time of bonding is suppressed, and the area of the bonding portion is limited to the facing region 52B. For this reason, the plurality of signal cables 53 can be joined at a higher pitch. In other words, the arrangement pitch of the plurality of bonding pads 24 can be reduced.

<Step S13> Bending of Signal Cable The front end side of the signal cable 53 is bent at a substantially right angle with respect to the rear end side. The signal cable 53 is a material / structure that maintains the shape of the bent portion. In the case of a signal cable that does not maintain its shape even when it is bent, for example, the bent portion is molded with resin or the like so as to maintain the shape. “Vertical (right angle)” does not mean “90 degrees”, and the bending angle may be 90 ± 10 degrees, for example. Further, the bending angles of the plurality of signal cables 53 may not be the same.

<Step S14> Bundling of Signal Cables A plurality of bent signal cables 53 are bundled by the bundling portion 60 in a state of being arranged in accordance with the positions of the plurality of bonding pads 24 to be bonded. In order to arrange the signal cables 53 in a predetermined arrangement, it is preferable to use a jig.

  In addition, although the rectangular parallelepiped binding part 60 was illustrated in FIG. 3, the shape of the binding part may be, for example, a columnar shape or a conical shape. The formation of the bundling portion, that is, the bundling step of the signal cable 53 is not essential, but is preferably performed for improving workability as will be described later.

  Further, the order of steps S12, S13, and S14 is not limited. For example, after the bundling step, the insulating resin 52 may be peeled off and the bending step may be performed. In the illustrated example, at least five signal cables 53 arranged linearly may be bundled as one unit. That is, the binding part 60 may be configured by a plurality of bound parts.

<Step S <b>15> Joining As shown in FIG. 7, the distal end portion of the core wire 51 of the signal cable 53 is arranged in parallel to the joining surface of the joining pad 24. Then, the signal cable 53 is soldered to the bonding pad 24. The solder 40 is preferably disposed in advance on at least one of the bonding pad 24 and the core wire 51 by, for example, solder plating. In the manufacturing method of the present embodiment, since a plurality of signal cables 53 that are bundled in advance can be joined together, workability is improved, thereby improving productivity.

  And the imaging device 1 is completed by sealing a junction part with the sealing resin 41. FIG. The sealing resin 41 is, for example, a thermosetting resin obtained by adding a silica filler or the like to an epoxy resin, and prevents moisture and the like from entering the joint portion and improves mechanical strength.

  When the bundling portion 60 is removed after the signal cable 53 is joined, the joining portion 60 is sealed with the sealing resin 41, whereby the imaging device 1 is completed. The imaging device that does not include the binding unit 60 is smaller than the imaging device 1.

  In addition, you may connect the extension part of the signal cable 53 with the wiring board in which the electronic component was mounted as needed. Noise resistance characteristics and the like are improved by firstly processing a signal from the image sensor chip 20 with an electronic component disposed in the vicinity of the image sensor chip 20 and then transmitting the signal to the signal processing device.

Second Embodiment
Next, a manufacturing method of the imaging device 1A and the imaging device 1A according to the second embodiment will be described. Since the imaging device 1A and the like are similar to the imaging device 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 8, in the imaging apparatus 1 </ b> A, the rear end side of the signal cable 53 is bent at a substantially right angle to the outer peripheral side of the imaging element chip 20. For this reason, the manufacturing method of the imaging device 1 </ b> A has the effect of the manufacturing method of the imaging device 1, and it is easy to perform the bending process after soldering the core wire 51 of the signal cable 53 to the bonding pad 24. FIG. 9 shows an example in which five signal cables 53 bound by the binding portion 60A are joined and then bent together.

  In the imaging apparatus 1 </ b> A, the space surrounded by the extending portion of the signal cable 53 is wider than that of the imaging apparatus 1. For this reason, the image pickup apparatus 1A has the effect of the image pickup apparatus 1, and it is easy to dispose an additional function unit such as a wiring board on which electronic components are mounted in the space.

<Third Embodiment>
Next, an endoscope 9 according to a third embodiment will be described.

  As shown in FIG. 10, the endoscope 9 includes an imaging unit 1 and an insertion unit 3 in which 1A is disposed at the distal end portion 2 of the insertion unit, and an operation unit 4 that is disposed on the proximal end side of the insertion unit 3. And a universal cord 5 extending from the operation unit 4. The universal cord 5 is connected to a signal processing device or the like.

  Since the endoscope 9 includes the imaging devices 1 and 1A having high connection reliability between the imaging element chip 20 and the cable assembly 50, the endoscope 9 has high reliability. Moreover, since the endoscope 9 can shorten the hard part of the insertion part front-end | tip part 2, it can reduce a patient's pain.

  The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1A ... Imaging device 2 ... Insertion part front-end | tip part 3 ... Insertion part 4 ... Operation part 5 ... Universal cord 9 ... Endoscope 20 ... Imaging element chip 21 ... Imaging part 22 ... Connection terminal 23 ... Side wiring 24 ... Bonding pad 40 ... solder 41 ... sealing resin 50 ... cable assembly 51 ... core wire 52 ... insulating resin 52A ... peeling region 52B ... opposite region 53 ... signal cables 60, 60A ... bundling part

Claims (10)

An imaging element chip having an imaging part on the front surface and having a bonding pad connected to the imaging part and having a bonding surface parallel to the main surface on the outer periphery of the back surface;
The core wire is covered with an insulating resin, and the core wire at the tip portion from which the insulating resin is peeled is solder-bonded to the bonding pad in a state of being arranged in parallel to the bonding surface, and the imaging element chip A cable assembly having a plurality of signal cables whose rear end side extends perpendicularly to the joint surface with respect to the bent portion bent to the center side of
An endoscope comprising: an imaging device including a bundling unit that binds the plurality of signal cables at a distal end portion of an insertion unit. An imaging element chip having an imaging part on the front surface and having a bonding pad connected to the imaging part and having a bonding surface parallel to the main surface on the outer periphery of the back surface;
The core wire is covered with an insulating resin, and the core wire at the front end portion from which the insulating resin has been peeled is solder-bonded to the bonding pad in a state of being arranged in parallel to the bonding surface, and the rear end side from the bent portion And a signal cable extending perpendicularly to the joint surface.   The imaging apparatus according to claim 2, wherein a rear end side of the signal cable is bent toward a center side of the imaging element chip by the bent portion.   The imaging apparatus according to claim 3, further comprising a binding unit that binds the plurality of signal cables.   The insulating resin at the distal end of the signal cable is peeled off at an inner portion where the core wire is bonded to the bonding surface and an outer portion where the inner wire and the core wire are opposed to each other, and the core wire 5. The imaging device according to claim 2, wherein solder that joins the joint surface to the joint surface is supplied to the joint portion via the outer portion. 6. A step of producing an imaging element chip having an imaging unit on the front surface and having a bonding pad connected to the imaging unit and having a bonding surface parallel to the main surface on the outer periphery of the back surface;
A step of peeling off the insulating resin at the tip of the signal cable composed of a core wire covered with insulating resin;
A method of manufacturing an imaging apparatus, comprising: a joining step in which a tip portion of the core wire is disposed in parallel to the joining surface and soldered to the joining pad.   The method of manufacturing an imaging apparatus according to claim 6, further comprising a step of bending a rear end side of the signal cable perpendicularly to the bonding surface after the bonding step.   8. The method according to claim 7, further comprising a step of binding the plurality of signal cables to be bent at the same time in a state of being aligned with the positions of the plurality of bonding pads to be bonded before the bonding step. Manufacturing method of imaging apparatus.   The method of manufacturing an imaging apparatus according to claim 6, further comprising a processing step in which a front end side of the signal cable is bent perpendicularly to a rear end side before the joining step.   10. The method according to claim 9, further comprising a step of binding the plurality of bent signal cables in a state of being arranged in accordance with positions of the plurality of bonding pads to be bonded before the bonding step. Manufacturing method of imaging apparatus.

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