JP6050602B2 - Liquid crystal display panel and manufacturing method thereof - Google Patents

Description

  The present invention relates to a liquid crystal display panel and a method for manufacturing the same, and more particularly to a liquid crystal display panel manufactured using a vacuum injection method and a method for manufacturing the same.

  The liquid crystal display panel includes, for example, a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate provided to face each other, a liquid crystal layer provided between the TFT substrate and the CF substrate, a TFT substrate, and a CF substrate. The substrate is bonded to each other, and a sealing material provided for sealing the liquid crystal layer between the TFT substrate and the CF substrate is provided. Here, the TFT substrate is provided so as to extend in parallel to each other in a direction orthogonal to each gate line, for example, an insulating substrate such as a glass substrate, a plurality of gate lines provided on the insulating substrate so as to extend in parallel to each other. A plurality of source lines, a plurality of TFTs provided at the intersections of the gate lines and the source lines, an interlayer insulating film provided so as to cover the TFTs, and a matrix on the interlayer insulating film And a plurality of pixel electrodes respectively connected to the TFTs.

  By the way, when manufacturing a TFT substrate, TFTs and the like are easily destroyed by electrostatic discharge (ESD) generated during the manufacturing process. For example, in order to manufacture a plurality of TFT substrates by multi-cavity. It is the mainstream to take ESD countermeasures such as providing a short ring at the peripheral edge of the large TFT substrate and connecting the display wiring such as the gate line and the source line to the short ring. Here, the short ring is formed by, for example, bonding a large TFT mother substrate in which a plurality of TFT substrates are arranged in a matrix and a large CF mother substrate in which a plurality of CF substrates are arranged in a matrix. It is removed when the TFT mother substrate (and CF mother substrate) is divided into cell units. Then, after the TFT mother substrate is divided, the end face of the wiring connected to the short ring is exposed at the divided end face, so that the end face of the wiring may be corroded.

  For example, Patent Document 1 discloses a wiring portion formed of a plurality of wirings formed on an array substrate, a lead portion from which each wiring is drawn to the outside, and a sealing material formed between the array substrate and the color filter substrate. In order to prevent corrosion due to intrusion of static electricity and moisture from the wiring portion and the drawing portion, a sealing material is formed at the position of the wiring portion and the drawing portion, and the wiring portion and the drawing portion are covered with the sealing material. It is described that it will be broken.

JP 2003-215605 A (FIG. 1)

  However, in the liquid crystal display panel disclosed in Patent Document 1, if it is considered that the lead portion of each wire corresponds to the wire connected to the short ring, even if a seal material is formed at the position of the lead portion, Since the end surface of the drawer portion is not necessarily covered with the sealing material on the substrate end surface, the end surface of the drawer portion may be exposed to the atmosphere. If so, there is room for improvement because the lead-out portion of each wiring is corroded.

  The present invention has been made in view of this point, and an object of the present invention is to reliably suppress corrosion of wiring caused by a short ring.

  In order to achieve the above object, according to the present invention, external wiring provided outside the display area is covered with a sealing material at the end face of the substrate.

Specifically, the liquid crystal display panel according to the present invention is provided with a rectangular first substrate provided with a plurality of external wirings so as to reach the substrate end surface outside the display region, and to face the first substrate. A rectangular second substrate formed, a liquid crystal layer provided between the first substrate and the second substrate, and the liquid crystal layer provided between the first substrate and the second substrate, A sealing material provided with a liquid crystal injection port; and a sealing material provided to seal the liquid crystal injection port. The display area of the first substrate includes a plurality of display regions extending in parallel to each other. Display wiring is provided, and in the first substrate, a terminal region is defined so as to protrude from the second substrate along a side opposite to a side where the liquid crystal injection port is disposed, Out of the external wiring, the terminal area above the specified side The substrate end face side of all provided so as to reach the substrate end face in the side of the external wiring is covered with the sealing material inside the liquid crystal injection port.

According to the above configuration, the external wiring is provided outside the display area of the first substrate so as to reach the end surface of the substrate. For example, the first mother in the state of the first mother substrate including the first substrate. By connecting the external wiring to the short ring provided at the peripheral edge of the substrate, the destruction of the elements provided on the first substrate due to ESD is suppressed. Since the external wiring (connected to the short ring) is covered with a sealing material that seals the liquid crystal injection port of the sealing material at the substrate end surface, the end surface of the external wiring at the substrate end surface is not exposed to the atmosphere. . Thereby, since corrosion of external wiring is suppressed reliably, corrosion of wiring resulting from a short ring is controlled reliably .

Upper Kigaibu wires may be connected to the respective display lines.

  According to the above configuration, in the first substrate, the external wiring provided outside the display area is connected to the plurality of display wirings extending in parallel with each other in the display area. The external wiring is connected to the short ring provided at the peripheral end portion of the first mother substrate in the state of the first mother substrate including, thereby suppressing the destruction of the elements provided in the display region of the first substrate due to ESD Is done.

  A plurality of subpixels may be arranged in a matrix in the display area, and each display line may be a capacitor line for adding an auxiliary capacitor to each subpixel.

According to said structure, since each display wiring is a capacitance line which is easy to accumulate | store static electricity generally, the effect of this invention is show | played effectively. Here, the capacity line for adding the auxiliary capacity to each sub-pixel is, for example, another display wiring such as a gate line or a source line in order to suppress waveform rounding of an electric signal transmitted at the time of image display. Therefore, it is easy to accumulate an amount of static electricity that causes destruction of the TFT due to the area in plan view .

The upper Symbol display region, a plurality of gate lines so as to extend parallel to each other along the respective display lines are provided, the plurality so as to extend parallel to each other in a direction intersecting the respective display wiring A source line is provided, and each of the terminal regions is provided with a plurality of other external wirings so as to reach the substrate end face by a transparent conductive film and to be connected to each of the gate lines and the source lines. Also good.

  According to the above configuration, in the first substrate, the plurality of other external wirings provided in the terminal region are respectively connected to the gate lines and the source lines that intersect with each other in the display region. Elements provided in the display area of the first substrate by connecting each other external wiring to a short ring provided at the peripheral end of the first mother substrate in the state of the first mother substrate including one substrate ESD damage is further suppressed. Since the substrate end face side of each other external wiring (connected to the short ring) is generally formed of an oxide-based transparent conductive film which is hardly oxidized, each other external wiring on the substrate end face is formed. Corrosion is suppressed.

In addition, the method for manufacturing a liquid crystal display panel according to the present invention includes a rectangular first substrate provided with a plurality of external wirings so as to reach the substrate end surface outside the display region, and the outer side of the first substrate. A first mother board preparation step of preparing a first mother board provided with a short ring connected to the external wiring at the peripheral end, and a second mother board including a rectangular second board facing the first board A second mother substrate preparing step of preparing a substrate, and bonding the first mother substrate and the second mother substrate through a sealing material in which a liquid crystal injection port is disposed, and then the first mother substrate and the second mother substrate. Removing a peripheral edge of each of the first and second substrates, a cell manufacturing step of manufacturing an empty cell in which the first substrate and the second substrate are bonded to each other via the sealing material, and the liquid crystal injection port inside the empty cell. Liquid crystal injector that injects liquid crystal material by vacuum injection method When, a sealing step of sealing through a sealing material a liquid crystal injection port of the empty cell of the liquid crystal material is injected, above the the display region of the first substrate, a plurality so as to extend parallel to each other And a terminal region is defined in the first substrate so as to protrude from the second substrate along a side opposite to the side where the liquid crystal injection port is disposed. In the first mother board preparation step, among the plurality of external wirings, the board end face side of all the external wirings provided so as to reach the board end face in the side other than the side where the terminal region is defined is the sealing material. The first mother substrate is prepared so as to be disposed inside the liquid crystal injection port.

  According to the above method, in the first mother substrate prepared in the first mother substrate preparation step, the external wiring is provided so as to reach the substrate end surface of the first substrate outside the display area of the first substrate. Therefore, in the first mother board, the external wiring is connected to the short ring provided at the peripheral end portion thereof, so that the destruction of the elements provided on the first board due to ESD is suppressed. In the first mother substrate preparation process, the first mother substrate is prepared so that the substrate end face side of the external wiring coincides with the liquid crystal injection port of the sealing material, and the second mother substrate preparation process, the cell manufacturing process, and the liquid crystal injection process In the sealing process to be performed later, since the liquid crystal injection port of the sealing material is sealed through the sealing material, the outside connected to the short ring until the peripheral end portion of the first mother substrate is removed in the cell manufacturing process. The wiring is covered with the sealing material at the substrate end surface, and the end surface of the external wiring on the substrate end surface is not exposed to the atmosphere. Thereby, since corrosion of external wiring is suppressed reliably, corrosion of wiring resulting from a short ring is controlled reliably.

  In the first mother substrate preparation step, the first mother substrate is prepared such that a plurality of the first substrates are arranged in a matrix and the short ring surrounds the plurality of first substrates, and the second mother substrate is prepared. In the substrate preparation step, the second mother substrate may be prepared such that a plurality of the second substrates are arranged in a matrix.

  According to the above method, in the first mother substrate preparation step, a first mother substrate in which a plurality of first substrates are arranged in a matrix is prepared, and in the second mother substrate preparation step, the plurality of second substrates is a matrix. Since the second mother substrate arranged in a shape is prepared, the effects of the present invention are specifically exhibited in the liquid crystal display panel manufactured by multi-cavity.

  According to the present invention, since the external wiring provided outside the display region is covered with the sealing material at the end face of the substrate, the corrosion of the wiring due to the short ring can be reliably suppressed.

3 is a plan view of the liquid crystal display panel according to Embodiment 1. FIG. It is sectional drawing of the liquid crystal display panel along the II-II line | wire in FIG. It is a schematic plan view of the large-sized bonding body for manufacturing the liquid crystal display panel which concerns on Embodiment 1 by multiple chamfering. It is the top view which expanded one cell unit in the large-sized bonding body of FIG. It is sectional drawing of the large-sized bonding body along the VV line of FIG. 6 is a plan view of a first modification of the liquid crystal display panel according to Embodiment 1. FIG. 6 is a plan view of a second modification of the liquid crystal display panel according to Embodiment 1. FIG. FIG. 6 is a schematic plan view of a large first mother board for manufacturing a liquid crystal display panel according to Embodiment 2 by multiple chamfering. It is the top view which expanded one cell unit in the bonding body provided with the 1st mother board of Drawing 8. FIG. 6 is a schematic plan view of a large first mother substrate for manufacturing a liquid crystal display panel according to Embodiment 3 by multiple chamfering. It is the top view to which one cell unit in the bonding body provided with the 1st mother board of Drawing 10 was expanded.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 7 show Embodiment 1 of a liquid crystal display panel and a manufacturing method thereof according to the present invention. Here, FIG. 1 is a plan view of the liquid crystal display panel 50a of the present embodiment. 2 is a cross-sectional view of the liquid crystal display panel 50a along the line II-II in FIG.

  As shown in FIGS. 1 and 2, the liquid crystal display panel 50a includes a TFT substrate 20a provided in a rectangular shape as a first substrate and a CF provided in a rectangular shape as a second substrate so as to face the TFT substrate 20a. A liquid crystal layer 40 provided between the substrate 30, the TFT substrate 20 a and the CF substrate 30, and a frame shape so as to enclose the liquid crystal layer 40 between the TFT substrate 20 a and the CF substrate 30, and a liquid crystal injection port 45 c And a sealing material 46 provided so as to seal the liquid crystal injection port 45c of the sealing material 45. Here, in the liquid crystal display panel 50a, as shown in FIG. 1, a display region D for displaying an image in which a plurality of subpixels P are arranged in a matrix is rectangular in the overlapping portion of the TFT substrate 20a and the CF substrate 30. It is stipulated in. Further, in the liquid crystal display panel 50a, as shown in FIG. 1, in the TFT substrate 20a protruding from the CF substrate 30, the side (lower side in the figure) opposite to the side (upper side in the figure) where the liquid crystal injection port 45 is arranged. ) Defines a terminal region T. Further, in the central portion of the terminal region T of the TFT substrate 20a, as shown in FIG. 1, a mounting region M for mounting a driving IC (Integrated Circuit) along the lower side of the display region D in the drawing. Is stipulated.

  As shown in FIGS. 1 and 2, the TFT substrate 20a includes an insulating substrate 10a, a plurality of gate lines 11a provided on the insulating substrate 10a as display wirings so as to extend in parallel with each other in the display region D, and a display. In the region D, a plurality of capacitor lines 11b provided on the insulating substrate 10a as display wirings so as to extend in parallel between the gate lines 11a, and the gate lines 11a and the capacitor lines 11b in a direction perpendicular to each other. A plurality of source lines 14a provided as display wirings so as to extend in parallel, and a plurality of TFTs 5 provided for each crossing portion of each gate line 11a and each source line 14a, that is, for each subpixel P, An interlayer insulating film 15 provided so as to cover each TFT 5, and a plurality of images provided in a matrix on the interlayer insulating film 15 and connected to each TFT 5. It includes an electrode 16a, and an alignment film 17 provided so as to cover the pixel electrode 16a. Here, in the TFT substrate 20a, as shown in FIG. 2, the capacitor line 11b provided on the insulating substrate 10a, the gate insulating film 12 provided so as to cover the capacitor line 11b, and the gate insulating film 12 are laminated. The auxiliary capacitor 6 is configured for each sub-pixel P by the interlayer insulating film 15 and the pixel electrode 16 a provided on the interlayer insulating film 15. Further, as shown in FIG. 1, the TFT substrate 20 a is provided with a common transition electrode 16 c for connecting to a common electrode 24 on the CF substrate 30 described later, outside the display region D.

  As shown in FIG. 2, the TFT 5 includes a gate electrode (11a) provided on the insulating substrate 10a, a gate insulating film 12 provided so as to cover the gate electrode (11a), and a gate on the gate insulating film 12. The semiconductor layer 13 is provided in an island shape so as to overlap the electrode (11a), and the source electrode (14a) and the drain electrode 14b are provided on the semiconductor layer 13 so as to be spaced apart from each other. Here, the gate electrode (11a) is a part of each gate line 11a for each sub-pixel P or a part where each gate line 11a protrudes laterally for each sub-pixel P. In addition, the source electrode (14a) is a part of each source line 14a for each sub-pixel P or a part where each source line 14a protrudes laterally for each sub-pixel P. The drain electrode 14b is connected to each pixel electrode 16a through a contact hole formed in the interlayer insulating film 15 for each subpixel P.

  As shown in FIG. 1, the gate line 11a is led out to the mounting region M of the terminal region T through a gate lead wire 14c formed in the same layer with the same material as the source line 14a.

  As shown in FIG. 1, the capacitor line 11 b is connected to an external wiring 11 c that is connected to a short ring 111 described later, and is drawn out to the terminal region T. As shown in FIG. 1, the capacitor line 11b drawn to the terminal region T is connected to a capacitor line terminal 16d formed in the same layer with the same material as the pixel electrode 16a. Here, as shown in FIGS. 1 and 2, the external wiring 11 c is provided so as to reach the substrate end surface outside the display region D, and the substrate end surface is covered with the sealing material 46.

  As shown in FIG. 1, the source line 14 a is led out to the mounting region M of the terminal region T.

  As shown in FIG. 1, the mounting area M is provided with a plurality of input terminals 16f arranged in a line on the upper side in the figure, and a plurality of terminals arranged in a line on the lower side in the figure. The output side terminal 16g is provided.

  As shown in FIG. 1, the input side terminal 16f is formed in the same layer with the same material as the pixel electrode 16a, and is connected to the gate line 11a, the source line 14a, and the like.

  As shown in FIG. 1, the output side terminal 16g is formed in the same layer with the same material as the pixel electrode 16a, and is connected to the pixel electrode 16a via the inter-terminal wiring 11e formed in the same layer with the same material as the gate line 11a. Are connected to the external connection terminal 16h formed in the same layer with the same material.

  The common transition electrode 16c is formed in the same layer with the same material as the pixel electrode 16a. Further, as shown in FIG. 1, the common transition electrode 16c is led out to the terminal region T via a common transition wiring 11d formed in the same layer with the same material as the gate line 11a. As shown in FIG. 1, the common transition wiring 11d drawn to the terminal region T is connected to a common transition terminal 16e formed in the same layer with the same material as the pixel electrode 16a.

  As shown in FIG. 1, the external connection terminal 16h and the common transition terminal 16e are connected to another external wiring 16b that was connected to a short ring 111 described later. Here, the other external wiring 16b is formed in the same layer with the same material as the pixel electrode 16a.

  As shown in FIG. 2, the CF substrate 30 includes an insulating substrate 10b, a black matrix 21 provided in a lattice shape on the insulating substrate 10b, and a red layer and a green layer provided between the lattices of the black matrix 21, respectively. And a plurality of colored layers 22 such as a blue layer, an overcoat film 23 provided so as to cover the black matrix 21 and each colored layer 22, a common electrode 24 provided on the overcoat film 23, and a common electrode 24 A plurality of photo spacers 25 provided in a columnar shape on the top, and an alignment film 26 provided so as to cover the common electrode 24 and each photo spacer 25 are provided.

  The liquid crystal layer 40 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.

  The liquid crystal display panel 50a configured as described above applies a predetermined voltage for each subpixel P to the liquid crystal layer 40 disposed between each pixel electrode 16a on the TFT substrate 20a and the common electrode 24 on the CF substrate 30. By changing the alignment state of the liquid crystal layer 40, the transmittance of light transmitted through the panel is adjusted for each sub-pixel P to display an image.

  Next, a method for manufacturing the liquid crystal display panel 50a of the present embodiment will be described. Here, FIG. 3 is a schematic plan view of a large-sized bonding body 150a for manufacturing the liquid crystal display panel 50a by multi-chamfering. FIG. 4 is an enlarged plan view of one cell unit in the bonded body 150a of FIG. Moreover, FIG. 5 is sectional drawing of the bonding body 150a along the VV line of FIG. The manufacturing method of this embodiment includes a TFT mother substrate preparation step, a CF mother substrate preparation step, a cell manufacturing step, a liquid crystal injection step, and a sealing step.

<TFT mother substrate preparation process>
First, for example, a metal film such as an aluminum film is sequentially formed on the entire substrate of a large insulating substrate 110a such as a glass substrate (thickness of about 0.7 mm) by sputtering, and the metal film is patterned by photolithography. Then, for each cell unit (display area D), the gate line 11a, the capacitor line 11b, the external wiring 11c, the common transfer wiring 11d, and the inter-terminal wiring 11e are short-circuited to the outer peripheral edge of the plurality of cell units. 111 is formed to a thickness of about 4000 mm.

  Subsequently, for example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film is formed on the entire substrate on which the gate lines 11a and the like are formed by a plasma CVD (Chemical Vapor Deposition) method. The gate insulating film 12 is formed to a thickness of about 4000 mm by patterning by lithography.

  Further, for example, an amorphous silicon film and an n + amorphous silicon film doped with phosphorus are continuously formed on the entire substrate on which the gate insulating film 12 is formed by plasma CVD, and the stacked film is gated by photolithography. Patterning in an island shape on the electrode (11a) forms a semiconductor layer forming layer in which an amorphous silicon layer having a thickness of about 2000 mm and an n + amorphous silicon layer having a thickness of about 500 mm are stacked for each cell unit.

  Then, for example, a metal film such as an aluminum film or a copper film is formed on the entire substrate on which the semiconductor layer forming layer is formed by sputtering, and the metal film is patterned by photolithography. The source line 14a, the drain electrode 14b, and the gate lead-out wiring 14c are formed to a thickness of about 2000 mm.

  Subsequently, by etching the n + amorphous silicon layer of the semiconductor layer forming layer using the source electrode (14a) and the drain electrode 14b as a mask, the channel region is patterned, and the semiconductor layer 13 and the semiconductor layer 13 are formed for each cell unit. The provided TFT 5 is formed.

  Furthermore, an inorganic insulating film such as a silicon nitride film or a silicon oxide film is formed on the entire substrate on which the TFT 5 is formed, for example, by plasma CVD, and the inorganic insulating film is patterned by photolithography to form an interlayer insulating film. 15 is formed to a thickness of about 4000 mm.

  Then, a transparent conductive film such as an ITO (Indium Tin Oxide) film or a tin oxide film is formed on the entire substrate on the interlayer insulating film 15 by sputtering, and the transparent conductive film is patterned by photolithography. For each cell unit, the pixel electrode 16a, other external wiring 16b, common transition electrode 16c, capacitor line terminal 16d, common transition terminal 16e, input side terminal 16f, output side terminal 16g, and external connection terminal 16h are 1000 mm thick. Form to the extent.

  Finally, a polyimide resin is applied to the entire substrate on which the pixel electrodes 16a and the like are formed by a printing method, and then a rubbing process is performed to form the alignment film 17 with a thickness of about 1000 mm.

  As described above, the TFT mother substrate 120a can be prepared.

<CF mother board preparation process>
First, for example, an acrylic photosensitive resin in which fine particles such as carbon are dispersed is applied to the entire substrate of a large insulating substrate 110b such as a glass substrate (thickness of about 0.7 mm) by spin coating. The coated photosensitive resin is exposed through a photomask and then developed to form a black matrix 21 with a thickness of about 1 μm for each panel unit.

  Subsequently, for example, an acrylic photosensitive resin colored in red, green, or blue is applied on the substrate on which the black matrix 21 is formed, and the applied photosensitive resin is exposed through a photomask. Subsequently, patterning is performed by developing, and a colored layer (for example, a red layer) of a selected color is formed to a thickness of about 2 μm for each cell unit. Further, the same process is repeated for the other two colors to form another two colored layers (for example, a green layer and a blue layer) with a thickness of about 2 μm for each cell unit.

  Further, an overcoat film 23 is formed to a thickness of about 3 μm by applying an acrylic resin on the substrate on which each colored layer 22 is formed, for example, by spin coating, and curing the applied acrylic resin. To do.

  Then, a transparent conductive film such as an ITO film or a tin oxide film is formed on the substrate on which the overcoat film 23 is formed, for example, by sputtering, and the common electrode 24 has a thickness of 1000 mm for each cell unit. Form to the extent.

  Thereafter, a phenol novolac photosensitive resin is applied to the entire substrate on which the common electrode 24 is formed by spin coating, and the applied photosensitive resin is exposed through a photomask and then developed. The photo spacer 25 is formed to a thickness of about 4 μm for each cell unit.

  Finally, a polyimide resin is applied to the entire substrate on which the photo spacers 25 are formed by a printing method, and then a rubbing process is performed to form the alignment film 26 with a thickness of about 1000 mm.

  As described above, the CF mother substrate 130 can be prepared.

<Cell manufacturing process>
First, for example, a sealing material 45 made of a thermosetting epoxy resin or the like is placed around the display area D of the CF mother substrate 130 prepared in the CF mother substrate preparation step by a screen printing so that the liquid crystal inlet 45c portion is provided. Print on the missing frame pattern.

  Subsequently, after bonding the CF mother substrate 130 on which the sealing material 45 is printed and the TFT mother substrate 120a prepared in the TFT mother substrate preparation step so that the display areas D overlap each other, the TFT mother substrate 120a and The large-sized bonding body 150 is produced by curing the sealing material 45 between the opposing mother substrates 130 by heating.

  Further, on the surface of the TFT mother substrate 120a of the bonded body 150, for example, the cutting edge of the disk-shaped cutting blade is brought into contact with the periphery of the portion constituting each TFT substrate 20a, and the cutting blade is rolled. Thus, a linear crack is formed, and the crack is grown in the thickness direction, whereby the TFT mother substrate 120a is divided for each cell unit, and the TFT substrate 20a is manufactured.

  Finally, after reversing the bonding body 150 from which the TFT mother substrate 120a has been divided, the outer surface of the CF mother substrate 130, for example, along the periphery of the portion constituting each CF substrate 30, for example, the cutting blade By rolling the cutting blade while abutting the blade edge, a linear crack is formed, and by growing the crack in the thickness direction, the CF mother substrate 130 is cut for each cell unit. Thus, the CF substrate 30 is manufactured.

  As described above, the empty cell 50e in which the TFT substrate 20a and the CF substrate 30 are bonded together with the sealing material 45 can be manufactured.

<Liquid crystal injection process>
A liquid crystal material (40) is injected between the TFT substrate 20a and the CF substrate 30 of the empty cell 50e manufactured in the cell manufacturing process via the liquid crystal injection port 45c by a vacuum injection method.

<Sealing process>
After applying the sealing material 46 made of UV curable resin to the liquid crystal injection port 45c of the empty cell 50e into which the liquid crystal material has been injected in the liquid crystal injection process, the liquid crystal injection port 45c is formed by curing the sealing material 46. The liquid crystal layer 40 is sealed (formed) by sealing through the sealing material 46.

  As described above, the liquid crystal display panel 50a of this embodiment can be manufactured.

  As described above, according to the liquid crystal display panel 50a of the present embodiment and the manufacturing method thereof, in the TFT mother substrate 120a prepared in the TFT mother substrate preparation step, the display region D is outside the display region D of the TFT substrate 20a. Since the external wirings 11c connected to the plurality of capacitance lines 11b extending in parallel to each other are provided so as to reach the substrate end surface of the TFT substrate 20a, they are provided at the peripheral end portions of the TFT mother substrate 120a. By connecting the external wiring 11c to the short ring 111, it is possible to suppress the destruction of each TFT 5 and the like provided in the display area D of the TFT substrate 20a due to ESD. In the TFT mother substrate preparation step, the TFT mother substrate 120a is prepared so that the substrate end surface side of the external wiring 11c coincides with the liquid crystal injection port 45c of the sealing material 45, and the second mother substrate preparation step, cell manufacturing step, and liquid crystal injection In the sealing process performed after the process, since the liquid crystal injection port 45c of the sealing material 45 is sealed through the sealing material 46, the short ring 111 is removed until the peripheral edge portion of the TFT mother substrate 120a is removed in the cell manufacturing process. The external wiring 11c connected to is covered with the sealing material 46 at the substrate end surface, and the end surface of the external wiring 11c on the substrate end surface is not exposed to the atmosphere. Thereby, since corrosion of the external wiring 11c can be reliably suppressed, corrosion of the wiring caused by the short ring 111 can be reliably suppressed.

  Further, according to the liquid crystal display panel 50a of the present embodiment, each of the gate lines 11a and the source lines intersecting each other in the display region D with the plurality of other external wirings 16b provided in the terminal region T on the TFT substrate 20a. 14a, the TFT mother substrate 120a including a plurality of TFT substrates 20a is connected to the short ring 111 provided at the peripheral end thereof, thereby connecting each other external wiring 16b to the TFT substrate 20a. It is possible to further suppress the ESD-induced breakdown of the TFT 5 or the like provided in the display area D. Since the substrate end face side of each of the other external wirings 16b connected to the short ring 111 is generally made of an oxide-based transparent conductive film such as an ITO film that hardly oxidizes, each other on the substrate end face Corrosion of the external wiring 16b can be suppressed.

  In the present embodiment, the liquid crystal display panel 50a in which the common transition terminal 16e and the plurality of external connection terminals 16h are connected to the short ring 111 via the other external wiring 16b is illustrated, but for example, the liquid crystal display of FIG. It may be the display panel 50aa, the liquid crystal display panel 50ab of FIG. Here, FIG. 6 is a plan view of a bonded body 150aa for manufacturing a liquid crystal display panel 50aa which is a first modification of the liquid crystal display panel 50a. FIG. 7 is a plan view of a bonded body 150ab for manufacturing a liquid crystal display panel 50ab which is a second modification of the liquid crystal display panel 50a.

  Specifically, in the large-sized liquid crystal display panel 50aa, as shown in FIG. 6, among the plurality of external connection terminals 16h, dummy external connection terminals 16h that are not connected to the output side terminal 16g are connected to the gate lines 11a. It is connected to the short ring 111 via another external wiring 11f formed in the same layer with the same material. Here, in the liquid crystal display panel 50aa, the external connection terminal 16h connected to the other external wiring 11f is not connected to the output side terminal 16g and does not contribute to the panel operation, so that corrosion occurs on the substrate end face of the other external wiring 11f. However, no particular problem occurs.

  Further, in the liquid crystal display panel 50ab, in a large format, as shown in FIG. 7, only the common transition terminal 16e and the plurality of external connection terminals 16h are connected to the short ring 111 via other external wirings 16b. The capacitor line terminal 16d is also connected to the short ring 111 via another external wiring 16ba.

<< Embodiment 2 of the Invention >>
FIG. 8 is a schematic plan view of a TFT mother substrate 120b for manufacturing the liquid crystal display panel 50b of this embodiment by multi-chamfering. FIG. 9 is an enlarged plan view of one cell unit in the bonded body 150b including the TFT mother substrate 120b of FIG. In addition, in each following embodiment, the same code | symbol is attached | subjected about the same part as FIGS. 1-7, and the detailed description is abbreviate | omitted.

  In the first embodiment, the method of manufacturing the liquid crystal display panel 50a using the TFT mother substrate 120a provided with the simple short ring 111 is exemplified. However, in the present embodiment, the short ring 111 having an inspection function is provided. A method for manufacturing the liquid crystal display panel 50b using the TFT mother substrate 120b will be described.

  In the TFT mother substrate 120b in which a plurality of TFT substrates 20b are arranged in a matrix, as shown in FIG. 8, the same material as the short ring 111 is formed in the same layer inside the short ring 111. A connected first inspection wiring 111a, second inspection wiring 111b, and a plurality of third inspection wirings 111c are provided.

  As shown in FIGS. 8 and 9, the first inspection wiring 111a has first inspection terminals 116a formed in the same layer with the same material as the pixel electrode 16a at both ends, and is the same with the same material as the gate line 11a. It is connected to the common transition electrode 16c through the external wiring 11g formed in one layer.

  As shown in FIGS. 8 and 9, the second inspection wiring 111b has second inspection terminals 116b formed in the same layer with the same material as the pixel electrode 16a at both ends, and is the same with the same material as the gate line 11a. Each capacitor line 11b is connected through an external wiring 11c formed in one layer.

  As shown in FIGS. 8 and 9, the plurality of third inspection wirings 111c have first inspection terminals 116c formed in the same layer with the same material as the pixel electrode 16a at both ends, for example, odd-numbered and even-numbered Provided for each of the second gate lines 11a, connected to the corresponding gate 11a via another external wiring 16b, and provided for each of the source lines 14a for red display, green display and blue display, Each is connected to the corresponding source line 14a via another external wiring 16b.

  In order to manufacture the liquid crystal display panel 50b using the TFT mother substrate 120b, the TFT mother substrate 120b is formed along the dividing line L in FIG. By disconnecting, after the connection of the first inspection wiring 111a, the second inspection wiring 111b, and each third inspection wiring 111c via the short ring 111 is released, the first inspection terminal 116a, the second inspection terminal 116b, and each third inspection wiring 111c. For example, an array inspection by a charge detection method is performed using the inspection terminal 116c, and then a CF mother substrate preparation process, a cell manufacturing process, a liquid crystal injection process, and a sealing process are performed as in the first embodiment. .

  As described above, according to the liquid crystal display panel 50b and the manufacturing method thereof according to the present embodiment, the external wiring 11c and the external wiring 11g connected to the short ring 111 are sealed at the end face of the substrate as in the first embodiment. Since the end face of the external wiring 11c and the external wiring 11g on the end face of the substrate is not exposed to the atmosphere because the liquid crystal injection port 45c of the material 45 is covered with the sealing material 46, the external wiring 11c and the external wiring 11g are corroded. Is reliably suppressed, and corrosion of the wiring due to the short ring 111 can be reliably suppressed.

<< Embodiment 3 of the Invention >>
FIG. 10 is a schematic plan view of a TFT mother substrate 120c for manufacturing the liquid crystal display panel 50c of this embodiment by multi-cavity. FIG. 11 is an enlarged plan view of one cell unit in a bonded body 150c including the TFT mother substrate 120c of FIG.

  In the first embodiment, the liquid crystal display panel 50b in which only the external wiring 11c connected to each capacitor line 11b is connected to the short ring 111 at the liquid crystal injection port 45c is illustrated. In the second embodiment, each capacitor The liquid crystal display panel 50b in which not only the external wiring 11c connected to the line 11b but also the external wiring 11g connected to the common transition electrode 16c is connected to the short ring 111 at the liquid crystal injection port 45c is illustrated. In the embodiment, a liquid crystal display panel 50c in which only the external wiring 11g connected to the common transition electrode 16c is connected to the short ring 111 at the portion of the liquid crystal injection port 45c is illustrated.

  In the TFT mother substrate 120c in which a plurality of TFT substrates 20c are arranged in a matrix, as shown in FIG. 10, they are formed in the same layer with the same material as the short ring 111 inside the short ring 111. A connected first inspection wiring 111d, second inspection wiring 111e, a plurality of third inspection wirings 111f, and a fourth inspection wiring 111g are provided.

  As shown in FIGS. 10 and 11, the first inspection wiring 111d has first inspection terminals 116d formed in the same layer with the same material as the pixel electrode 16a at both ends, and is the same with the same material as the gate line 11a. It is connected to the common transition electrode 16c through the external wiring 11g formed in one layer.

  As shown in FIGS. 10 and 11, the second inspection wiring 111e has first inspection terminals 116e formed in the same layer with the same material as the pixel electrode 16a at both ends, and is the same with the same material as the pixel electrode 16a. It is connected to the capacitor line terminal 16d on the left side in FIG. 11 through another external wiring 16bd formed in one layer.

  As shown in FIGS. 10 and 11, the plurality of third inspection wirings 111 f have first inspection terminals 116 f formed in the same layer with the same material as the pixel electrode 16 a at both ends. Provided for each of the second gate lines 11a, connected to the corresponding gate 11a via another external wiring 16b, and provided for each of the source lines 14a for red display, green display and blue display, Each is connected to the corresponding source line 14a via another external wiring 16b.

  As shown in FIGS. 10 and 11, the fourth inspection wiring 111g has fourth inspection terminals 116g formed in the same layer with the same material as the pixel electrode 16a at both ends, and is the same with the same material as the pixel electrode 16a. It is connected to the capacitor line terminal 16d on the right side in FIG. 11 through another external wiring 16be formed in one layer.

  In the present embodiment, the left capacitance line terminal 16d in FIG. 11 is connected to the second inspection wiring 111e, and the right capacitance line terminal 16d in FIG. 11 is connected to the fourth inspection wiring 111g. However, the configuration may be such that one of the second inspection wiring 111e and the fourth inspection wiring 111g is omitted.

  In order to manufacture the liquid crystal display panel 50c using the TFT mother substrate 120c, the TFT mother substrate 120b is formed along the dividing line L in FIG. By separating the first inspection wiring 111d, the second inspection wiring 111e, the third inspection wiring 111f, and the fourth inspection wiring 111g via the short ring 111, the first inspection terminal 116d and the second inspection wiring 111g are disconnected. Using the terminal 116e, each third inspection terminal 116f, and the fourth inspection terminal 116g, for example, an array inspection by a charge detection method is performed, and then, similarly to the first embodiment, a CF mother substrate preparation process, a cell manufacturing process, A liquid crystal injection process and a sealing process are performed.

  As described above, according to the liquid crystal display panel 50c and the manufacturing method thereof according to the present embodiment, the external wiring 11g connected to the short ring 111 is the liquid crystal of the sealing material 45 on the substrate end surface, as in the second embodiment. Since it is covered with the sealing material 46 that seals the inlet 45c, the end face of the external wiring 11g on the end face of the substrate is not exposed to the atmosphere, and corrosion of the external wiring 11g is reliably suppressed, resulting from the short ring 111. Wiring corrosion can be reliably suppressed.

  In each of the above embodiments, the liquid crystal display panel in which the side where the liquid crystal injection port is arranged and the side where the terminal region is arranged is illustrated. However, in the present invention, the side where the liquid crystal injection port is arranged and the terminal region are arranged. The present invention can also be applied to a liquid crystal display panel having adjacent sides.

  In each of the above embodiments, the TFT substrate using the TFT electrode connected to the pixel electrode as the drain electrode has been exemplified. However, the present invention is applied to the TFT substrate called the source electrode. Can also be applied.

  As described above, the present invention suppresses the corrosion of the external wiring connected to the short ring by the sealing material that seals the liquid crystal injection port, so that it is useful for the liquid crystal display panel manufactured by the vacuum injection method. is there.

D Display area P Sub-pixel T Terminal area 6 Auxiliary capacitor 11a Gate line 11b Capacitor line (display wiring)
11c, 11g External wiring 14a Source line 16b Other external wiring 20a-20c TFT substrate (first substrate)
30 CF substrate (second substrate)
40 Liquid crystal layer (Liquid crystal material)
45 Sealing material 45c Liquid crystal inlet 46 Sealing material 50a, 50aa, 50ab, 50b, 50c Liquid crystal display panel 50e Empty cell 111 Short ring 120a-120c TFT mother substrate (first mother substrate)
130 CF mother board (second mother board)

Claims (6)

A rectangular first substrate provided with a plurality of external wirings so as to reach the end face of the substrate outside the display area;
A rectangular second substrate provided to face the first substrate;
A liquid crystal layer provided between the first substrate and the second substrate;
A sealing material provided to enclose the liquid crystal layer between the first substrate and the second substrate, and having a liquid crystal injection port disposed thereon;
A sealing material provided to seal the liquid crystal injection port,
In the display area of the first substrate, a plurality of display wirings are provided so as to extend in parallel with each other,
In the first substrate, a terminal region is defined so as to protrude from the second substrate along a side opposite to a side where the liquid crystal injection port is disposed,
Among the plurality of external wirings, the substrate end surface side of all the external wirings provided so as to reach the substrate end surface on the side other than the side where the terminal region is defined is sealed inside the liquid crystal injection port. A liquid crystal display panel covered with a stopper. Upper Kigaibu wiring is connected to each display wiring, the liquid crystal display panel of claim 1. In the display area, a plurality of subpixels are arranged in a matrix,
The liquid crystal display panel according to claim 2, wherein each of the display wirings is a capacity line for adding an auxiliary capacity to each of the sub-pixels. The upper Symbol display region, a plurality of gate lines so as to extend parallel to each other along the respective display lines are provided, the plurality so as to extend parallel to each other in a direction intersecting the respective display wiring A source line is provided,
The terminal region is provided with a plurality of other external wirings so as to reach the substrate end face by a transparent conductive film and to be connected to the gate lines and the source lines, respectively. LCD display panel. A short ring connected to the external wiring is included at the outer peripheral end of the first substrate including a rectangular first substrate provided with a plurality of external wirings so as to reach the substrate end surface outside the display region. A first mother board preparation step of preparing the provided first mother board;
A second mother substrate preparation step of preparing a second mother substrate including a rectangular second substrate facing the first substrate;
After bonding the first mother substrate and the second mother substrate through a sealing material in which a liquid crystal injection port is disposed, by removing each peripheral edge of the first mother substrate and the second mother substrate, A cell production step of producing an empty cell in which the first substrate and the second substrate are bonded together via the sealing material;
A liquid crystal injection step of injecting a liquid crystal material into the empty cell via the liquid crystal injection port by a vacuum injection method;
A sealing step of sealing the liquid crystal injection port of the empty cell into which the liquid crystal material is injected through a sealing material,
In the display area of the first substrate, a plurality of display wirings are provided so as to extend in parallel with each other,
In the first substrate, a terminal region is defined so as to protrude from the second substrate along a side opposite to a side where the liquid crystal injection port is disposed,
In the first mother board preparation step, among the plurality of external wirings, the board end face side of all the external wirings provided so as to reach the board end face in the side other than the side where the terminal region is defined is the seal. A method for manufacturing a liquid crystal display panel, comprising preparing the first mother substrate so as to be disposed inside a liquid crystal injection port of a material. In the first mother substrate preparing step, the first mother substrate is prepared such that a plurality of the first substrates are arranged in a matrix and the short ring surrounds the plurality of first substrates,
6. The method of manufacturing a liquid crystal display panel according to claim 5, wherein in the second mother substrate preparation step, the second mother substrate is prepared such that a plurality of the second substrates are arranged in a matrix.

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