JP6034343B2 - 重複露光を運用した多重露光画像ミキシングの検査方法 - Google Patents
重複露光を運用した多重露光画像ミキシングの検査方法 Download PDFInfo
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- JP6034343B2 JP6034343B2 JP2014171633A JP2014171633A JP6034343B2 JP 6034343 B2 JP6034343 B2 JP 6034343B2 JP 2014171633 A JP2014171633 A JP 2014171633A JP 2014171633 A JP2014171633 A JP 2014171633A JP 6034343 B2 JP6034343 B2 JP 6034343B2
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- 238000007689 inspection Methods 0.000 title claims description 69
- 238000000034 method Methods 0.000 title claims description 26
- 230000007547 defect Effects 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000003973 paint Substances 0.000 claims description 12
- 238000004458 analytical method Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 13
- 238000005286 illumination Methods 0.000 description 10
- 230000001678 irradiating effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 238000002073 fluorescence micrograph Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125041A TWI495867B (zh) | 2014-07-22 | 2014-07-22 | Application of repeated exposure to multiple exposure image blending detection method |
| TW103125041 | 2014-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016024185A JP2016024185A (ja) | 2016-02-08 |
| JP6034343B2 true JP6034343B2 (ja) | 2016-11-30 |
Family
ID=54343328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014171633A Active JP6034343B2 (ja) | 2014-07-22 | 2014-08-26 | 重複露光を運用した多重露光画像ミキシングの検査方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6034343B2 (zh) |
| KR (1) | KR101679314B1 (zh) |
| CN (1) | CN105277574B (zh) |
| TW (1) | TWI495867B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110146519A (zh) * | 2018-02-12 | 2019-08-20 | 志圣工业股份有限公司 | 电路板检测方法及电路板曝光方法 |
| CN110702031A (zh) * | 2019-11-19 | 2020-01-17 | 四川长虹电器股份有限公司 | 适用于深色表面的三维扫描装置及扫描方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11216936B2 (en) | 2016-02-19 | 2022-01-04 | SCREEN Holdings Co., Ltd. | Defect detection device, defect detection method, and program |
| CN108414530A (zh) * | 2018-03-13 | 2018-08-17 | 昆山国显光电有限公司 | 自动光学检测设备 |
| CN110006919A (zh) * | 2018-12-10 | 2019-07-12 | 浙江大学台州研究院 | 一种抛光石英晶片浅划痕检测的装置与方法 |
| CN111542218B (zh) * | 2020-04-23 | 2021-07-20 | 国网浙江省电力有限公司营销服务中心 | 一种电能表可信生产贴片环节采集验证方法及系统 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0459489B1 (en) * | 1990-05-30 | 1997-01-22 | Dainippon Screen Mfg. Co., Ltd. | Method of reading optical image of inspected surface and image reading system employable therein |
| US6201601B1 (en) * | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| JP3012602B2 (ja) * | 1998-08-06 | 2000-02-28 | 大分日本電気株式会社 | 表面欠陥検査装置 |
| US6552783B1 (en) * | 2000-06-28 | 2003-04-22 | Teradyne, Inc. | Optical system |
| JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
| JP2004150885A (ja) | 2002-10-29 | 2004-05-27 | Toppan Printing Co Ltd | ホログラムの検査装置および検査方法 |
| US7355692B2 (en) | 2004-03-05 | 2008-04-08 | Orbotech Ltd | System and method for inspecting electrical circuits utilizing reflective and fluorescent imagery |
| EP1612569A3 (en) * | 2004-06-30 | 2006-02-08 | Omron Corporation | Method and apparatus for substrate surface inspection using multi-color light emission system |
| JP2006047290A (ja) * | 2004-06-30 | 2006-02-16 | Omron Corp | 基板検査用の画像生成方法、基板検査装置、および基板検査用の照明装置 |
| JP2006220578A (ja) * | 2005-02-14 | 2006-08-24 | Nikon Corp | 表面検査装置 |
| JP2006295036A (ja) * | 2005-04-14 | 2006-10-26 | World Techno:Kk | プリント配線板の検査方法 |
| JP4809032B2 (ja) * | 2005-10-04 | 2011-11-02 | ヤマハ発動機株式会社 | 実装基板の検査装置および印刷装置 |
| CN101221122A (zh) * | 2007-01-08 | 2008-07-16 | 牧德科技股份有限公司 | 可调式光源装置和具有该光源装置的自动光学检测系统 |
| JP2009042202A (ja) * | 2007-08-08 | 2009-02-26 | Taniguchi Consulting Engineers Co Ltd | ウエハ検査装置およびウエハ検査方法 |
| CN201396645Y (zh) * | 2009-04-10 | 2010-02-03 | 厦门福信光电集成有限公司 | 自动光学检测设备的光源组合装置 |
| CN101887030A (zh) * | 2009-05-15 | 2010-11-17 | 圣戈本玻璃法国公司 | 用于检测透明基板表面和/或其内部的缺陷的方法及系统 |
| JP2010281580A (ja) * | 2009-06-02 | 2010-12-16 | Rexxam Co Ltd | 基板検査装置、照射装置、及び基板検査方法 |
| JP5582932B2 (ja) * | 2010-09-16 | 2014-09-03 | 日東電工株式会社 | 検査装置、および、配線回路基板の製造方法 |
| JP5760371B2 (ja) * | 2010-10-13 | 2015-08-12 | 富士通株式会社 | 塗装表面欠陥検査方法 |
| KR20130077813A (ko) * | 2011-11-08 | 2013-07-09 | 가부시키가이샤 메가 트레이드 | 프린트 기판의 검사 장치 |
| KR101361537B1 (ko) * | 2011-11-25 | 2014-02-13 | 주식회사 미르기술 | 적외선패턴조사부를 구비하는 비전검사장치 |
| TWM443197U (en) * | 2011-12-07 | 2012-12-11 | Zealtek Electronic Co Ltd | Dual lens photographic module capable of obtaining high resolution images |
-
2014
- 2014-07-22 TW TW103125041A patent/TWI495867B/zh active
- 2014-08-18 CN CN201410406034.0A patent/CN105277574B/zh active Active
- 2014-08-22 KR KR1020140109499A patent/KR101679314B1/ko active Active
- 2014-08-26 JP JP2014171633A patent/JP6034343B2/ja active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110146519A (zh) * | 2018-02-12 | 2019-08-20 | 志圣工业股份有限公司 | 电路板检测方法及电路板曝光方法 |
| CN110702031A (zh) * | 2019-11-19 | 2020-01-17 | 四川长虹电器股份有限公司 | 适用于深色表面的三维扫描装置及扫描方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105277574B (zh) | 2018-04-03 |
| CN105277574A (zh) | 2016-01-27 |
| KR20160011556A (ko) | 2016-02-01 |
| TW201604536A (zh) | 2016-02-01 |
| KR101679314B1 (ko) | 2016-11-24 |
| TWI495867B (zh) | 2015-08-11 |
| JP2016024185A (ja) | 2016-02-08 |
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