JP5994850B2 - バルク波共振子 - Google Patents
バルク波共振子 Download PDFInfo
- Publication number
- JP5994850B2 JP5994850B2 JP2014516753A JP2014516753A JP5994850B2 JP 5994850 B2 JP5994850 B2 JP 5994850B2 JP 2014516753 A JP2014516753 A JP 2014516753A JP 2014516753 A JP2014516753 A JP 2014516753A JP 5994850 B2 JP5994850 B2 JP 5994850B2
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- electrode
- wave resonator
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- protective layer
- bulk wave
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- 239000011241 protective layer Substances 0.000 claims description 34
- 229910052706 scandium Inorganic materials 0.000 claims description 29
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 19
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011796 hollow space material Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 91
- 238000010586 diagram Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/0211—Means for compensation or elimination of undesirable effects of reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/547—Notch filters, e.g. notch BAW or thin film resonator filters
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2…基板
3…ScAlN膜
4,5…第1,第2の電極
6…空間
7…質量付加膜
11,21,31…バルク波共振子
32…基板
33…枠部材層
34…下部保護層
35,37…第1,第2の電極
36…ScAlN膜
37a…質量付加膜
38…上部保護層
39…質量付加膜
41…バルク波共振子
P1,P2…並列腕共振子
S1〜S3…直列腕共振子
Claims (7)
- 基板と、
前記基板の上に、間接的に設けられている下部保護層と、
前記下部保護層の上に、直接的に設けられている第1の電極と、
前記第1の電極の上に設けられている、下面と上面とを有するスカンジウム含有窒化アルミニウム膜と、
前記スカンジウム含有窒化アルミニウム膜の上に形成されており、前記第1の電極と前記スカンジウム含有窒化アルミニウム膜を介して重なり合っている第2の電極と、
前記スカンジウム含有窒化アルミニウム膜の前記上面と前記第2の電極とを保護するように設けられている上部保護層と、
を備え、
前記第1の電極と第2の電極とが重なり合っている部分により圧電振動部が構成されており、
前記スカンジウム含有窒化アルミニウム膜におけるスカンジウムとアルミニウムとの合計を100原子%としたときに、スカンジウム含有濃度が37〜39.5原子%の範囲にあり、
前記基板と前記下部保護層との間に中空の空間が形成されており、
前記上部保護層及び前記下部保護層が、AlN及びScAlNの少なくとも一方で構成されており、
前記スカンジウム含有窒化アルミニウム膜は、六方晶構造である、バルク波共振子。 - 前記上部保護層及び前記下部保護層が、ScAlNからなることを特徴とする、請求項1記載のバルク波共振子。
- 前記下部保護層は、AlN層とScAlN層との積層体で構成されていることを特徴とする、請求項1または2に記載のバルク波共振子。
- 前記圧電振動部の外周部分の少なくとも一部において、前記圧電振動部に質量を付加するための質量付加膜が形成されている、請求項1〜3のいずれか1項に記載のバルク波共振子。
- 前記質量付加膜が前記第2の電極と同じ材料からなる、請求項4に記載のバルク波共振子。
- 前記圧電振動部の平面形状が楕円形である、請求項1〜5のいずれか1項に記載のバルク波共振子。
- 前記圧電振動部の平面形状が互いに平行な辺を有しない多角形状である、請求項1〜5のいずれか1項に記載のバルク波共振子。
Priority Applications (1)
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JP2014516753A JP5994850B2 (ja) | 2012-05-22 | 2013-05-13 | バルク波共振子 |
Applications Claiming Priority (4)
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JP2012116791 | 2012-05-22 | ||
JP2012116791 | 2012-05-22 | ||
JP2014516753A JP5994850B2 (ja) | 2012-05-22 | 2013-05-13 | バルク波共振子 |
PCT/JP2013/063303 WO2013175985A1 (ja) | 2012-05-22 | 2013-05-13 | バルク波共振子 |
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JPWO2013175985A1 JPWO2013175985A1 (ja) | 2016-01-12 |
JP5994850B2 true JP5994850B2 (ja) | 2016-09-21 |
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Country Status (4)
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US (1) | US9461616B2 (ja) |
JP (1) | JP5994850B2 (ja) |
CN (1) | CN104321965B (ja) |
WO (1) | WO2013175985A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11533041B2 (en) | 2019-11-06 | 2022-12-20 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic wave resonator |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9991871B2 (en) * | 2011-02-28 | 2018-06-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator comprising a ring |
WO2013125371A1 (ja) * | 2012-02-20 | 2013-08-29 | 株式会社村田製作所 | 圧電バルク弾性波素子の製造方法及び圧電バルク弾性波素子 |
JP5966199B2 (ja) * | 2013-05-31 | 2016-08-10 | 株式会社デンソー | 圧電体薄膜及びその製造方法 |
JP6432299B2 (ja) * | 2014-11-17 | 2018-12-05 | 株式会社デンソー | 弾性表面波素子 |
JP2017201050A (ja) | 2016-05-06 | 2017-11-09 | 学校法人早稲田大学 | 圧電体薄膜及びそれを用いた圧電素子 |
KR102066960B1 (ko) * | 2016-08-03 | 2020-01-16 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
CN106385242B (zh) * | 2016-09-12 | 2018-11-09 | 重庆大学 | GHz硅基ScAlN薄膜谐振器及其制作方法 |
KR102345116B1 (ko) * | 2017-03-23 | 2021-12-30 | 삼성전기주식회사 | 음향 공진기 및 그 제조방법 |
CN107244645B (zh) * | 2017-06-20 | 2018-12-28 | 重庆大学 | 硅基ScAlN薄膜GHz谐振器及其制备方法 |
KR102097322B1 (ko) * | 2017-08-17 | 2020-04-06 | 삼성전기주식회사 | 체적 음향 공진기 |
KR20200011141A (ko) * | 2018-07-24 | 2020-02-03 | 삼성전기주식회사 | 체적 음향 공진기 |
KR102097320B1 (ko) | 2018-07-24 | 2020-04-06 | 삼성전기주식회사 | 탄성파 필터 장치 |
US11595016B2 (en) * | 2018-10-05 | 2023-02-28 | Samsung Electro-Mechanics Co., Ltd. | Bulk-acoustic wave resonator |
US11509287B2 (en) | 2018-12-14 | 2022-11-22 | Qorvo Us, Inc. | Bi-polar border region in piezoelectric device |
CN112054779B (zh) * | 2019-07-19 | 2024-04-05 | 中芯集成电路(宁波)有限公司上海分公司 | 薄膜体声波谐振器及其制造方法 |
CN111654261B (zh) * | 2020-04-21 | 2021-08-10 | 诺思(天津)微系统有限责任公司 | 体声波谐振器及其设计方法、滤波器、电子设备 |
CN111786645B (zh) * | 2020-05-07 | 2021-04-16 | 诺思(天津)微系统有限责任公司 | 体声波谐振器、滤波器、电子设备和调整机电耦合系数的方法 |
US12034050B1 (en) * | 2020-08-24 | 2024-07-09 | National Technology & Engineering Solutions Of Sandia, Llc | CMOS compatible low-resistivity Al—Sc metal etch stop |
WO2022202615A1 (ja) * | 2021-03-24 | 2022-09-29 | 株式会社村田製作所 | 弾性バルク波装置 |
JP2024532483A (ja) * | 2021-09-02 | 2024-09-05 | アプライド マテリアルズ インコーポレイテッド | スカンジウムドープ窒化アルミニウムの選択的エッチング |
CN114301411B (zh) * | 2021-09-23 | 2023-02-17 | 武汉敏声新技术有限公司 | 一种体声波谐振器和体声波滤波器 |
CN114640322B (zh) * | 2022-03-25 | 2023-05-12 | 电子科技大学 | 一种调控fbar滤波器中心频率的方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01157108A (ja) * | 1987-12-14 | 1989-06-20 | Victor Co Of Japan Ltd | 圧電薄膜共振子 |
US5903087A (en) * | 1997-06-05 | 1999-05-11 | Motorola Inc. | Electrode edge wave patterns for piezoelectric resonator |
US6215375B1 (en) | 1999-03-30 | 2001-04-10 | Agilent Technologies, Inc. | Bulk acoustic wave resonator with improved lateral mode suppression |
JP3514224B2 (ja) * | 1999-11-11 | 2004-03-31 | 株式会社村田製作所 | 圧電共振子、フィルタ及び電子機器 |
TWI365603B (en) * | 2004-10-01 | 2012-06-01 | Avago Technologies Wireless Ip | A thin film bulk acoustic resonator with a mass loaded perimeter |
US7280007B2 (en) | 2004-11-15 | 2007-10-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Thin film bulk acoustic resonator with a mass loaded perimeter |
US7388454B2 (en) * | 2004-10-01 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using alternating frame structure |
WO2006129532A1 (ja) * | 2005-06-02 | 2006-12-07 | Murata Manufacturing Co., Ltd. | 圧電共振子及び圧電薄膜フィルタ |
EP2003775A4 (en) | 2006-04-05 | 2011-04-27 | Murata Manufacturing Co | PIEZOELECTRIC RESONATOR AND PIEZOELECTRIC FILTER |
WO2008126473A1 (ja) * | 2007-04-11 | 2008-10-23 | Murata Manufacturing Co., Ltd. | 圧電薄膜フィルタ |
DE102008025691B4 (de) | 2007-05-31 | 2011-08-25 | National Institute Of Advanced Industrial Science And Technology | Piezoelektrischer Dünnfilm, piezoelektrisches Material und Herstellungsverfahren für piezoelektrischen Dünnfilm |
JP5190841B2 (ja) * | 2007-05-31 | 2013-04-24 | 独立行政法人産業技術総合研究所 | 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー |
JP2008306280A (ja) * | 2007-06-05 | 2008-12-18 | Ngk Insulators Ltd | 圧電薄膜デバイス |
JP2009111623A (ja) * | 2007-10-29 | 2009-05-21 | Murata Mfg Co Ltd | 圧電振動装置 |
JP4997448B2 (ja) * | 2007-12-21 | 2012-08-08 | 独立行政法人産業技術総合研究所 | 窒化物半導体の製造方法および窒化物半導体デバイス |
WO2010095640A1 (ja) * | 2009-02-20 | 2010-08-26 | 宇部興産株式会社 | 薄膜圧電共振器およびそれを用いた薄膜圧電フィルタ |
JP5598948B2 (ja) | 2009-07-01 | 2014-10-01 | 独立行政法人産業技術総合研究所 | 圧電体薄膜の製造方法および当該製造方法により製造される圧電体薄膜 |
JP2011160232A (ja) * | 2010-02-01 | 2011-08-18 | Ube Industries Ltd | 薄膜圧電共振器およびそれを用いた薄膜圧電フィルタ |
WO2011099319A1 (ja) | 2010-02-10 | 2011-08-18 | 太陽誘電株式会社 | 圧電薄膜共振子、通信モジュール、通信装置 |
US8896395B2 (en) * | 2011-09-14 | 2014-11-25 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having multiple lateral features |
JP5286396B2 (ja) * | 2011-09-14 | 2013-09-11 | 昭和電工株式会社 | 半導体素子 |
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- 2013-05-13 CN CN201380026199.9A patent/CN104321965B/zh active Active
- 2013-05-13 WO PCT/JP2013/063303 patent/WO2013175985A1/ja active Application Filing
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11533041B2 (en) | 2019-11-06 | 2022-12-20 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic wave resonator |
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CN104321965B (zh) | 2017-04-12 |
WO2013175985A1 (ja) | 2013-11-28 |
US20150084719A1 (en) | 2015-03-26 |
US9461616B2 (en) | 2016-10-04 |
CN104321965A (zh) | 2015-01-28 |
JPWO2013175985A1 (ja) | 2016-01-12 |
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