JP5985302B2 - Vacuum deposition apparatus and organic EL device manufacturing method - Google Patents

Description

The present invention relates to a vacuum deposition apparatus, and more particularly to a vacuum deposition apparatus capable of forming a plurality of thin film layers in one film forming chamber. The vacuum evaporation apparatus of the present invention is suitable as an apparatus for manufacturing an organic EL (Electro Luminescence) apparatus.
The present invention also relates to a method for manufacturing an organic EL device.

In recent years, an organic EL device has attracted attention as a lighting device that replaces an incandescent lamp and a fluorescent lamp, and many studies have been made. An organic EL device is obtained by laminating an organic EL element on a base material such as a glass substrate or a transparent resin film.
In addition, the organic EL element has two or more light-transmitting electrodes facing each other, and a light emitting layer made of an organic compound is laminated between the electrodes.
Since the organic EL device is a self-luminous device, a high-contrast image can be obtained when used as a display material. In addition, light of various wavelengths can be emitted by appropriately selecting the material of the light emitting layer. Furthermore, since the thickness is extremely thin compared to incandescent lamps and fluorescent lamps, and light is emitted in a planar shape, there are few restrictions on the installation location.

The layer structure of a typical organic EL device is as shown in FIG. In the organic EL device 200 shown in FIG. 20, a transparent electrode layer 203, a functional layer 205, and a back electrode layer 206 are laminated on a glass substrate 202, and these are sealed by a sealing portion 207. . The organic EL device 200 has a so-called bottom emission type configuration in which light is extracted from the glass substrate 202 side.
The functional layer 205 is formed by stacking a plurality of thin films of organic compounds or conductive oxides. A typical functional layer 205 has a hole injection layer 208, a hole transport layer 210, a light emitting layer 211, an electron transport layer 212, and an electron injection layer 215 in this order from the transparent electrode layer 203 side.

The organic EL device is manufactured by sequentially forming the above-described layers on a glass substrate 202.
Here, among the layers described above, the functional layer 205 is formed by laminating a plurality of thin films of organic compounds as described above, and each thin film is formed by a vacuum deposition method.
That is, as described above, the functional layer 205 is formed by laminating a plurality of thin films of organic compounds. Therefore, in order to form the functional layer 205, it is necessary to perform vacuum deposition a plurality of times.
The back electrode layer 206 is a metal thin film such as aluminum or silver, and is formed by a vacuum deposition method.

Therefore, when manufacturing one organic EL device, it is necessary to perform vacuum evaporation many times.
Here, the conventional vacuum deposition apparatus can deposit only one kind of thin film. For example, the functional layer 205 of the organic EL device includes a hole injection layer 208, a hole transport layer 216, a light emitting layer 211, an electron transport layer 212, and an electron injection layer 215. The film was formed by a separate vacuum deposition apparatus.
Therefore, in the past, it has been necessary to frequently perform the work of taking the substrate in and out of the vacuum deposition apparatus. For this reason, the conventional method has low work efficiency and has been desired to be improved.
As means for solving this problem, Patent Documents 1 and 2 propose vacuum deposition apparatuses capable of forming a plurality of thin film layers in one film forming chamber.

In the vacuum vapor deposition apparatus disclosed in Patent Documents 1 and 2, three dispersion containers are installed in the film forming chamber.
Each dispersion apparatus is connected to a plurality of evaporation units, and vapor of the film forming material is supplied from each evaporation unit to the dispersion container. Then, vapor of the film forming material is discharged from each dispersion container into the film forming chamber, and a film is formed on the substrate.

In the vacuum vapor deposition apparatus disclosed in Patent Documents 1 and 2, a plurality of thin film layers can be formed in one film formation chamber by selecting a dispersion container for releasing vapor.
Moreover, in the vacuum evaporation apparatus disclosed in Patent Documents 1 and 2, the film forming material supplied to the dispersion container can be changed by switching the evaporation unit, and a plurality of thin film layers are formed in one film forming chamber. be able to.

JP 2008-75095 A JP 2009-256705 A

According to the vacuum evaporation apparatus disclosed in Patent Documents 1 and 2, a plurality of thin film layers can be formed in one film formation chamber. However, the vacuum evaporation apparatus disclosed in Patent Documents 1 and 2 has a problem that it takes an excessive amount of time to reach a desired degree of vacuum in the film forming chamber.
That is, in order to perform vacuum deposition, it is necessary to make the film forming chamber have a high vacuum. However, in the vacuum vapor deposition apparatuses disclosed in Patent Documents 1 and 2, since the dispersion container is installed in the film forming chamber, the volume of the film forming chamber is large. For this reason, it takes time to exhaust the air in the film forming chamber and reach a high vacuum.
Accordingly, the present invention focuses on the above-mentioned problems of the prior art, and it is an object to develop a vacuum vapor deposition apparatus that can achieve downsizing of the film forming chamber and can reduce the time required for evacuation. It is what.

The invention described in claim 1 for solving the above-described problem includes a film forming chamber that can be decompressed and in which a base material can be installed, and a plurality of discharge openings that release vapor of the film forming material to the base material. In a vacuum vapor deposition apparatus that has a provided film forming material discharge section and releases film forming material vapor from the film forming material discharge section to form a film on a substrate, the apparatus has a plurality of evaporation sections that evaporate the film forming material. A set of evaporation units composed of one or a plurality of evaporation units, a manifold unit, and a set of opening groups composed of a plurality of discharge openings provided in the manifold unit directly or via extension tubes; The evaporation unit group, the manifold unit, and the opening group are connected to form one discharge system, and the flow path configuration includes a plurality of the discharge systems , and includes at least one discharge system. Has multiple evaporation units And, a plurality of manifold portion is disposed outside the deposition chamber, apart from the pressure reducing means for maintaining a space in the deposition chamber in a vacuum state, the manifold portion arranged outside the deposition chamber It is a vacuum evaporation apparatus characterized by having a decompression means connected .

The vacuum deposition apparatus of the present invention includes a plurality of discharge systems, and each discharge system includes an evaporation unit group, a manifold unit, and an opening group. The thin film layer can be formed.
Further, the film forming material supplied to the manifold part can be changed by switching the evaporation part, and a plurality of thin film layers can be formed in one film forming chamber.

According to a second aspect of the present invention, in the vacuum vapor deposition apparatus according to the first aspect, each of the plurality of manifold portions and the pressure reducing means are connected to each other by piping, and an on-off valve is provided for each piping individually. is there.

The invention according to claim 3 is characterized in that a film thickness sensor and a discharge opening for checking the film thickness are provided in the film forming chamber, and the manifold part and the discharge opening for checking the film thickness communicate with each other. Item 3. The vacuum evaporation apparatus according to Item 1 or 2 .

  In the vacuum deposition apparatus of the present invention, since the film thickness sensor is provided in the film forming chamber, the film thickness sensor is placed in the same vacuum environment as the base material to be formed. Therefore, the correspondence between the thickness of the film detected by the film thickness sensor and the thickness of the film stacked on the substrate is excellent, and the thickness of the film stacked on the substrate can be accurately detected.

The invention according to claim 4 has a main on-off valve for each of the evaporation units, and opens the main on-off valve to introduce steam generated in the evaporation unit into the manifold unit, and the evaporation unit group includes: The target discharge amount per unit time and / or the target film thickness and / or the target partial pressure of the vapor in the film forming chamber and / or the target pressure of the vapor in the vicinity of the opening end of the discharge opening for each film forming material The vacuum vapor deposition apparatus according to any one of claims 1 to 3 , wherein the ones that are approximated to each other are selected so as to form one group.

  In the vacuum vapor deposition apparatus of the present invention, the discharge systems are grouped based on the target discharge amount of vapor and the like.

In the invention according to claim 5 , a diaphragm is provided in the vicinity of the opening end of the discharge opening, and the diaphragm arranged in one discharge system is set based on a standard with a constant opening area. The vacuum deposition apparatus according to any one of claims 1 to 4 , wherein a diaphragm provided in at least one discharge system is set according to a different standard.

  In the vacuum vapor deposition apparatus of the present invention, the aperture used for one discharge system is different from the aperture used for another discharge system. Therefore, an appropriate aperture can be selected according to the properties of the film forming material, the required film thickness, and the like.

The invention described in claim 6 has a shutter member that covers substantially the entire surface of the film forming material discharge portion. During film formation, the main on-off valve is individually opened and closed, and the shutter member is opened to open all the discharge openings. and to release the vapors of the film forming material from a particular discharge opening, according to any one of claims 1 to 5 at the time of non-deposition, characterized in that closing all discharge opening to close the shutter member It is a vacuum evaporation system.

In the vacuum deposition apparatus of the present invention, the film forming material is switched by the main on-off valve. For this reason, the function of the shutter member is limited to the point that the discharge opening of the film forming material discharge part is closed until the film forming material discharge is stabilized, and the entire surface of the film forming material discharge part is simultaneously opened and closed. Is enough.
The vacuum vapor deposition apparatus of the present invention has a simple shutter member structure and is easy to manufacture.

The invention according to claim 7 is characterized by comprising residual vapor removing means for removing vapor of the film forming material remaining between the outlet of the evaporation section and the discharge opening when the discharge opening is closed. It is a vacuum evaporation system in any one of Claims 1 thru | or 6 .

  According to the present invention, contamination that is a concern when a plurality of thin film layers are formed in one film formation chamber can be prevented.

In the invention described in claim 8, the residual vapor removing means is a trap space for cooling and solidifying or liquefying the vapor of the film forming material , and a decompression means connected to the manifold portion is connected to the trap space. The vacuum deposition apparatus according to claim 7 .

  According to the present invention, the remaining vapor of the film forming material can be captured efficiently.

A ninth aspect of the present invention is a co-deposition method in which a main film-forming material and a sub-film-forming material are simultaneously released using the vacuum vapor deposition apparatus according to any one of the first to eighth aspects to form a co-deposition organic layer. A method of manufacturing an organic EL device that performs a process a plurality of times to manufacture an organic EL device including a plurality of co-deposited organic layers, wherein a plurality of types of main film forming materials are applied to evaporation units belonging to the same evaporation unit group A plurality of types of sub-film forming materials are selectively input to evaporation sections belonging to other evaporation section groups, and the film forming materials are evaporated by the evaporation sections to form a co-deposited organic layer on the substrate. An organic EL device manufacturing method is characterized by forming a film.

  In the present invention, co-evaporation is performed using the vacuum deposition apparatus described above. As is well known, co-evaporation is a method in which a plurality of film forming materials (a main film forming material and a sub film forming material) are discharged simultaneously to form a film. The amount is quite different. Specifically, the co-deposited layer generally contains 70 to 99 weight percent of one (eg, main film forming material) and the remaining 1 to 30 weight percent of the other (eg, sub film forming material). . Therefore, the optimum conditions for the discharge opening are naturally different. The present invention selectively inputs a plurality of types of main film forming materials into evaporation units belonging to the same evaporation unit group, and selectively inputs a plurality of types of sub film formation materials into evaporation units belonging to other evaporation unit groups. In addition, since the film forming material is evaporated by the evaporation unit and the co-deposited organic layer is formed on the substrate, the main film forming material and the sub film forming material can be released under preferable conditions.

A tenth aspect of the present invention is the method of manufacturing an organic EL device according to the ninth aspect, further comprising a step of discharging vapor of the film forming material from the manifold portion by a decompression unit connected to the manifold portion .

According to an eleventh aspect of the present invention, in the co-evaporation step, the main film forming material is evaporated by a single evaporation section belonging to a single discharge system, and the vapor of the main film formation material is discharged from the discharge opening belonging to the discharge system. And evaporating the sub-film forming material in a single evaporation unit belonging to a single emission system different from the emission system, and releasing the vapor of the sub-film formation material from the emission opening belonging to the emission system. The method of manufacturing an organic EL device according to claim 9 or 10 .

Here, the sub-film forming material is a concept including a material for forming a light emitting layer in addition to a dopant material such as a p-type dopant and an n-type dopant. In short, it is a material that is contained in the deposited layer and has a lower content than the main film-forming material.
According to the present invention, the main film forming material and the sub film forming material can be released under favorable conditions.

According to a twelfth aspect of the present invention, in the vacuum evaporation apparatus, the large-capacity discharge system having a large total area of the discharge openings of the aperture group to which the vacuum deposition apparatus belongs, and the total area of the discharge openings of the aperture group to which the vacuum deposition apparatus belongs The main film-forming material is a component that is contained in a large amount in the formed layer, and the sub-film-forming material is contained in the formed layer more than the main film-forming material. It is a component with a small amount, and the main film-forming material is selectively introduced into the evaporation section belonging to the large-capacity discharge system, and the sub-film formation material is selectively introduced into the evaporation section belonging to the small-capacity discharge system. 12. The method of manufacturing an organic EL device according to claim 9 , wherein the organic EL device is a manufacturing method.

  In the present invention, the main film forming material is discharged through the large capacity discharge system, and the sub film forming material is discharged through the small capacity discharge system. It can be released under favorable conditions.

According to a thirteenth aspect of the present invention, the vacuum vapor deposition apparatus has a structure in which a film thickness sensor and a discharge opening for checking the film thickness are provided in the film forming chamber, and the manifold portion and the discharge opening for checking the film thickness communicate with each other. The main film-forming material is discharged from the discharge openings belonging to one or more discharge systems, and the sub-film formation material is discharged from the discharge openings belonging to one or more other discharge systems to form a co-deposited organic layer. conduct co-deposition process, 9 through claim, characterized in that it is capable of detecting the film formation state only by film formation state and / or the auxiliary component film material by only ShuNarumaku material in the practice of the co-deposition process 12. A method for producing an organic EL device according to any one of 12 above.

  According to the present invention, when performing co-evaporation, it is possible to individually confirm the release amount of the main film forming material and the discharge amount of the sub film forming material.

The vacuum deposition apparatus of the present invention does not require a long time to evacuate the inside because the volume of the film forming chamber is not excessively large. Therefore, the total time required for film formation can be shortened.
Further, according to the method for manufacturing an organic EL device of the present invention, the main film forming material and the sub film forming material can be released under preferable conditions.

It is a block diagram of the vacuum evaporation system which concerns on embodiment of this invention. It is a conceptual diagram of the evaporation part of the vacuum evaporation system of FIG. FIG. 2 is a perspective view conceptually showing a manifold part and a film forming material discharge part of the vacuum evaporation apparatus of FIG. 1. FIG. 4 is a perspective view conceptually showing a manifold part and a film forming material discharge part similar to FIG. 3, and is a perspective view illustrating a state in which a plate constituting a part of the film forming material discharge part is removed. It is a perspective view which shows the state which isolate | separated the manifold part and board which are shown in FIG. It is a cross-sectional perspective view of the manifold part and film-forming material discharge | release part of FIG. It is sectional drawing which shows the aperture_diaphragm | restriction provided in the discharge | release opening of the vacuum evaporation system of FIG. It is sectional drawing of the manifold part of FIG. It is the top view which displayed notionally the film-forming material discharge | emission part employ | adopted with the vacuum evaporation system of FIG. It is a top view of the film-forming material discharge | release part employ | adopted with the vacuum evaporation system of FIG. It is a perspective view of the shutter member employ | adopted with the vacuum evaporation system of FIG. It is a top view which shows the relationship between the film-forming material discharge | release part and shutter member which are employ | adopted with the vacuum evaporation system of FIG. 1, (a) shows the state which was the state at the time of film-forming, and open | released all the discharge openings, (B) shows a state in a preparatory stage in which all the discharge openings are closed. It is a block diagram of the vacuum evaporation system which concerns on other embodiment of this invention. FIG. 14 is a perspective view conceptually showing a manifold part and a film forming material discharge part of the vacuum evaporation apparatus of FIG. 13. It is a block diagram of the vacuum evaporation system which concerns on other embodiment of this invention. It is a block diagram of the vacuum evaporation system which concerns on other embodiment of this invention. It is a schematic diagram of the layer structure of the organic electroluminescent apparatus which can be formed into a film using the vacuum evaporation system of FIG. It is sectional drawing which shows the modification of a manifold part. It is sectional drawing which shows the other modification of a manifold part. It is a schematic diagram of the layer structure of a general organic EL device.

  Below, the vacuum evaporation system which concerns on 1st Embodiment of this invention is demonstrated in detail, referring drawings.

  The vacuum vapor deposition apparatus 1 of 1st Embodiment of this invention is equipped with the film-forming chamber 2 and the series of discharge | release circuits 3 which vaporize and discharge | release film-forming material toward a base material like FIG.

The film forming chamber 2 is airtight and is provided with a decompression means 7. The decompression means 7 is a device for maintaining the space in the film forming chamber 2 in a vacuum state, and is a known decompression pump.
The “vacuum state” herein refers to a state having a degree of vacuum of 10 ⁻³ (10 to the third power) Pa or less. The lower the degree of vacuum, the better. The specific degree of vacuum of this embodiment is in the range of 1 × 10 ⁻³ (10 to the third power) to 1 × 10 ⁻⁹ (10 to the ninth power) Pa, and 1 × 10 ⁻⁵ (10 to the negative power). The range from the fifth power) to 1 × 10 ⁻⁹ (10 to the ninth power) Pa is desirable.

The film forming chamber 2 includes a substrate transfer device 12 that transfers a substrate (base material) 11, and a carry-in port and a carry-out port (not shown) are provided on the wall surface of the film forming chamber 2.
The substrate transport device 12 is a device that transports the substrate 11 (base material), and has a function of moving the substrate 11 in and out of the film forming chamber 2 and fixing the substrate 11 at a desired film forming position. That is, the substrate transfer device 12 transfers the substrate 11 to a predetermined film formation position, carries the substrate 11 from the outside of the film formation chamber 2 into the film formation chamber 2 via the carry-in port, and the film formation chamber. It is possible to carry the substrate 11 from the inside of 2 to the outside of the film forming chamber 2 through the carry-out port.
In the present embodiment, there are film thickness sensors 27, 28 and 29 in the film forming chamber 2.

  The discharge circuit 3 includes evaporation units 10a to 10j, a manifold group 6, a film forming material discharge unit 13, and a shutter member 8. Although the shutter member 8 is actually located at a position close to the film forming material discharge portion 13, in FIG. 1, the shutter member 8 is shown separated from the film forming material discharge portion 13 for the reason of drawing. .

The evaporation unit 10a (evaporation units 10b to 10j) is a device for evaporating the film forming material 16a (film forming materials 16b to 16j) as shown in FIG. 2, and includes an evaporation chamber 21, a crucible 22, and heating means 23 and 24. And each.
The evaporation chamber 21 includes an evaporation space 25 that converts the solid or liquid film forming material 16a (film forming materials 16b to 16j) into a gaseous film forming vapor 18a (18b to 18j).
In the following description, in order to distinguish the properties of the film forming materials 16a to 16j, the film forming material 16 (16a to 16j) that has become vapor is referred to as film forming vapor 18 (18a to 18j).

The crucible 22 is a container that stores a desired film forming material 16.
The heating means 23 is a member that heats the crucible 22, and the heating means 24 is a member that heats the entire evaporation chamber 21. As the heating means 23 and 24, known heaters are used.
That is, a heating means 23 is provided around the crucible 22, and the film forming material 16a (16b to 16j) can be heated by the heating means 23 to be vaporized or sublimated. A heating means 24 is also provided around the evaporation chamber 21 and can be maintained at a temperature slightly higher than the vaporization temperature of the film forming material 16a (16b to 16j) during film formation.

The film forming material 16 (16a to 16j) is a desired material for forming each layer of the organic EL device 100 described later.
As the properties of the film forming material 16, powder, pellet-like solid, semi-kneaded fluid, liquid, or the like can be used. That is, the film forming material 16 is a liquid, powder, or granular substance. In the present embodiment, a powdery film forming material 16 is used.

  In the present embodiment, the ten evaporation units 10a to 10j are divided into three evaporation unit groups. That is, the evaporation units 10a to 10d belong to the first evaporation unit group, the evaporation units 10e to 10g belong to the second evaporation unit group, and the evaporation units 10h to 10j belong to the third evaporation unit group.

Next, the manifold group 6 will be described. In the present embodiment, the manifold group 6 includes three manifold portions 66, 67, 68 as shown in FIGS. 3, 4, 5, and 6, and the manifold group 6 is composed of the three manifold portions 66, 67. 68 are stacked in the height direction.
As shown in FIG. 5, the manifold portions 66, 67, 68 constituting the manifold group 6 have plate-shaped main body portions 37, 38, 39 each having a substantially square outer shape. As shown in FIG. 6, the insides of the main body portions 37, 38, 39 are hollow. That is, as shown in FIG. 6, the manifold portions 66, 67, 68 have an upper plate 70, a lower plate 71, and a peripheral wall 72 that connects them, and has a hollow portion 73 inside. A large number of extension pipes 75, 76, 77 are provided on the upper surfaces (upper plates 70) of the manifold portions 66, 67, 68. In view of drawing, the number of extension pipes is considerably smaller than the actual number.

As shown in FIG. 5, the lengths of the extension pipes 75, 76, 77 are different for each of the manifold portions 66, 67, 68.
That is, the extension pipes 75 provided in the uppermost manifold part (hereinafter referred to as the upper manifold part) 66 are all short, and the extension pipes 76 provided in the lower manifold (hereinafter referred to as the intermediate manifold part) 67 are of medium length. Have The extension pipe 77 provided in the lowermost manifold (hereinafter referred to as the lower manifold portion) 68 is the longest.

Each manifold part 66, 67, 68 is opened upward through the extension pipes 75, 76, 77 described above. The openings of the extension tubes 75, 76, 77 function as discharge openings 80, 81, 82. Further, the discharge openings 80, 81, 82 to which the manifold parts 66, 67, 68 belong constitute one opening group.
That is, the discharge openings 80 attached to the upper manifold portion 66 all belong to the first opening group, and the discharge openings 81 attached to the intermediate manifold portion 67 all belong to the second opening group, and the discharge openings attached to the lower manifold portion 68. 82 all belong to the third opening group.

Further, in the vicinity of the opening ends of the extension pipes 75, 76, 77, as shown in FIGS. 6 and 7, throttles 85, 86, 87 are provided. The opening areas of the apertures 85, 86, and 87 differ for each of the manifold portions 66, 67, and 68. More specifically, a stop 85 provided in the discharge opening 80 belonging to the first opening group, a stop 86 provided in the discharge opening 81 belonging to the second opening group, and a discharge opening 82 belonging to the third opening group. The aperture 87 provided in is different in opening diameter. That is, as shown in FIG. 7, the aperture 85 provided in the emission aperture 80 belonging to the first aperture group has a large aperture area, and the aperture 86 provided in the emission aperture 81 belonging to the second aperture group has a medium aperture area. Degree. The diaphragm 87 provided in the discharge opening 82 belonging to the third opening group has a small opening area.
In the present embodiment, the aperture diameters and the aperture areas of the apertures 85, 86, 87 provided in the emission apertures 80, 81, 82 belonging to the individual aperture groups are the same.

That is, the diaphragms 85 provided in the emission openings 80 belonging to the first opening group are all 0.48 square centimeters, for example, and the diaphragms 86 provided in the emission openings 81 belonging to the second opening group are all 0.12 All the apertures 87 provided in the discharge openings 82 that are square centimeters and belong to the third opening group are 0.03 square centimeters.
The largest discharge opening 80 and the smallest discharge opening 80 are 16 times larger than the small discharge opening 80. It is desirable that the magnification of both is 2 to 30 times. Further, in the case where the opening is provided in three stages, it is appropriate that each difference is about 2 to 6 times.

Residual vapor removing means 15 is provided in the main body portions 37, 38, 39 of the manifold portions 66, 67, 68. The residual vapor removing means 15 is specifically a cleaning hatch 30 and a heating means 36 described later. As shown in FIG. 8, the hatch 30 is joined to another part by a screw 31, and can be separated from the other part by removing the screw 31.
In the present embodiment, heating means 35 and 36 are provided on the entire surfaces of the manifold portions 66, 67 and 68. That is, the heating means 35 is provided in the main body portions 37, 38, and 39 of the manifold portions 66, 67, and 68 except the hatch 30 and the extension pipes 75, 76, and 77. The hatch 30 is provided with another heating means 36.
Both the heating means 35 and 36 use a known heater.

In the present embodiment, heating means 35 and 36 are provided on the entire surfaces of the manifold portions 66, 67 and 68, and the temperature is maintained at a slightly higher temperature than the vaporization temperature of the film forming material 16a (16b to 16j) during film formation. can do.
Moreover, in this embodiment, the heating means 36 provided in the hatch 30 is independent of the heating means 35 provided in other parts. As shown in FIG. 8, the heating means 36 provided in the hatch 30 is turned on / off by the relay 50, and the heating means 35 provided in other parts is turned on / off by the relay 51. Therefore, only the heating means 36 provided in the hatch 30 can be stopped independently.

Tunnel pipes 88 and 89 are provided in the upper manifold portion 66 and the lower intermediate manifold portion 67 among the three manifold portions 66, 67 and 68. The tunnel pipes 88 and 89 connect the upper plate 70 and the lower plate 71 of the respective manifold portions 66 and 67 in a tunnel shape and do not communicate with the hollow portion 73 in the manifold portions 66 and 67.
The lower manifold portion 68 has no tunnel pipe.

  The number of tunnel pipes 88 and 89 is greater in the upper manifold portion 66 than in the intermediate manifold portion 67. That is, the upper manifold portion 66 has a tunnel pipe 88 above the tunnel pipe 89 of the intermediate manifold portion 67, and the upper manifold portion 66 also has a tunnel pipe 88 above the extension pipe 76 of the intermediate manifold portion 67. There is.

As described above, the three manifold portions 66, 67, 68 are stacked in the height direction, and the extension pipe 75 provided in the upper manifold portion 66 projects upward.
Further, the extension pipe 76 provided in the intermediate manifold section 67 passes through the tunnel pipe 88 of the upper manifold section 66 and protrudes above the upper manifold section 66.
Further, the extension pipe 77 provided in the lower manifold section 68 passes through the tunnel pipe 89 provided in the intermediate manifold section 67 and the tunnel pipe 88 of the upper manifold section 66 and protrudes above the upper manifold section 66. Accordingly, the discharge openings 80, 81, 82 belonging to all the manifold portions 66, 67, 68 are on the upper side of the manifold group 6. The heights of the discharge openings 80, 81, 82 are all the same.

  The film forming material discharge portion 13 is constituted by the tip portions of the extension pipes 75, 76, 77 of the manifold group 6 and a plate body 92 that fixes the tip portion. In the film forming material discharge portion 13, discharge openings 80, 81, 82 communicating with the manifold portions 66, 67, 68 are distributed on the upper surface of the plate body 92 in a planar manner.

The layout of the discharge openings 80, 81, 82 protruding from the film forming material discharge portion 13 is as shown in FIG. 9, and the figure connecting the adjacent discharge openings 80, 81, 82 has a shape in which equilateral triangles are arranged closely. Become. In FIG. 9, the numbers 1, 2, and 3 represent the aperture groups to which the group belongs.
That is, the opening numbered 1 is the discharge opening 80 belonging to the first group, the opening numbered 2 is the discharge opening 81 belonging to the second group, and the opening numbered 3 is This is the discharge opening 82 belonging to the third group.
Note that the total number of the discharge openings 80, 81, 82 shown in FIG. 9 is 18 due to the drawing, but in reality, the number is considerably large as shown in FIG. doing.
The same applies to the number of extension pipes 75, 76, 77.

In the present embodiment, there are always discharge openings 80, 81, 82 belonging to different opening groups around the discharge openings 80, 81, 82 belonging to one opening group.
For example, the discharge openings adjacent to the discharge openings 80 belonging to the first opening group are either the discharge openings 81 belonging to the second opening group or the discharge openings 82 belonging to the third opening group. Further, the discharge openings adjacent to the discharge openings 81 belonging to the second opening group are either the discharge openings 80 belonging to the first opening group or the discharge openings 82 belonging to the third opening group. The discharge openings adjacent to the discharge openings 82 belonging to the third opening group are either the discharge openings 80 belonging to the first opening group or the discharge openings 81 belonging to the second opening group.

The shutter member 8 is a plate having an opening 93 provided at a position corresponding to each of the discharge openings 80, 81, 82 described above, and is moved in the horizontal direction by a power source such as an air cylinder 95.
The shutter member 8 has an area that can cover substantially the entire surface of the film forming material discharge portion 13 as shown in FIG. The shutter member 8 is provided with a heating means (not shown), and is maintained at a temperature slightly higher than the vaporization temperature of the film forming material 16a (16b to 16j) during film formation.

Next, the connection flow path 5 that connects the members of the discharge circuit will be described.
As shown in FIG. 1, the connection flow path 5 includes a first supply flow path 32 that supplies film formation vapors 18 a to 18 d to the upper manifold section 66 and a second supply that supplies film formation vapors 18 e to 18 g to the intermediate manifold section 67. It has the flow path 33, the 3rd supply flow path 34 which supplies the film-forming vapor | steam 18h-18j to a lower manifold part, and the branch flow paths 41a-41j connected to each evaporation part 10a-10j.

Moreover, main on-off valves 40a to 40j are provided in the middle of the branch flow paths 41a to 41j. In other words, the main on-off valves 40a to 40j are located in the middle flow direction of the film forming vapors 18a to 18j in the branch flow paths 41a to 41j. Thus, in this embodiment, there are main on-off valves 40a to 40j for each of the evaporation units 10a to 10j.
The main on-off valves 40a to 40j are known on-off valves and can be opened and closed in response to a command from the control device 26.

The vacuum evaporation apparatus 1 of this embodiment is provided with three discharge systems.
That is, in the vacuum evaporation apparatus 1, the evaporation units 10 a to 10 d belonging to the first evaporation unit group and the upper manifold unit 66 are connected via the first supply flow channel 32, and the upper manifold unit 66 and the upper manifold unit 66 are connected. There is a first discharge system 57 connected to the discharge opening 80 of the associated first opening group.
In addition, the evaporation units 10 e to 10 g of the second evaporation unit group and the intermediate manifold unit 67 are connected to the vacuum deposition apparatus 1 via the second supply flow path 33, and are attached to the intermediate manifold unit 67 and the intermediate manifold unit 67. There is a second discharge system 58 formed by connecting the discharge openings 81 of the second opening group.
Furthermore, the evaporation units 10 h to 10 j of the third evaporation unit group and the lower manifold unit 68 are connected to the vacuum deposition apparatus 1 via the third supply flow path 34, and are attached to the lower manifold unit 68 and the intermediate manifold unit 68. There is a third discharge system 59 connected to the discharge openings 82 of the third opening group.

  A heating means (not shown) is attached to the connection channel 5 and is heated to a temperature equal to or higher than the vaporization temperature of the film forming material 16 at the time of film formation. Therefore, even if the gaseous film-forming vapor | steam 18 passes the inside of the connection flow path 5, a state change does not occur, but it can flow to each manifold part 66,67,68 with a gaseous state. Therefore, it is possible to prevent the film forming vapors 18 a to 18 j from being solidified on the inner side surface of the pipe forming the connection flow path 5 and the film forming material 16 from being fixed.

In the vacuum vapor deposition apparatus 1, a release opening 46 for confirming the film thickness is connected to the upper manifold portion 66 as shown in FIG. 1, and vapor of the film forming material can be released to the film thickness sensor 27. Further, a discharge opening 47 for checking the film thickness is connected to the intermediate manifold portion 67, and vapor of the film forming material can be discharged to the film thickness sensor 28. Further, a discharge opening 48 is connected to the lower manifold portion 68, and vapor of the film forming material can be discharged to the film thickness sensor 29.
The vacuum deposition apparatus 1 has a structure in which information read by the film thickness sensors 27, 28, and 29 is transmitted to the control apparatus 26.
The film thickness sensors 27, 28, and 29 are known film thickness sensors, and can transmit information contributing to the film thickness to be formed to the control device 26.
The control device 26 is a device capable of controlling the opening / closing of the main opening / closing valves 40a to 40j, and can transmit an opening / closing command to the main opening / closing valves 40a to 40j in accordance with information on the film thickness sensors 27, 28, and 29. Yes.

Next, the positional relationship between the film forming chamber 2 and the emission circuit 3 will be described.
In the vacuum deposition apparatus 1 of this embodiment, most of the emission circuit 3 is outside the film forming chamber 2.
That is, in the vacuum vapor deposition apparatus 1 of this embodiment, as shown in FIG. 1, the main body portions 37, 38, 39 of the three manifold portions 66, 67, 68 are all provided outside the film forming chamber 2.
Only the distal ends of the extension pipes 75, 76, and 77 attached to the manifold portions 66, 67, and 68 and the film forming material discharge portion 13 are provided in the film forming chamber 2.
The plate body 92 of the film forming material discharge portion 13 is arranged in a horizontal posture, and the discharge openings 80, 81, 82 are all directed toward the substrate 11.
The film thickness sensors 27, 28, and 29 are in the film forming chamber 2 and are placed in the same vacuum environment as the substrate 11.

Further, as shown in FIG. 1, the substrate transfer device 12 is disposed at a position away from the discharge surface of the film forming material discharge unit 13 by a predetermined distance in the discharge direction, and the shutter member 8 is disposed therebetween. . Specifically, the shutter member 8 is provided between the substrate transfer device 12 and the film forming material discharge unit 13.
As described above, the shutter member 8 can be moved in the horizontal direction by the air cylinder 95. Further, as described above, the shutter member 8 has an area that can cover substantially the entire surface of the film forming material discharge portion 13, and the opening 93 is provided at a position corresponding to the discharge openings 80, 81, 82. When the opening 93 of the shutter member 8 is made to coincide with the discharge openings 80, 81, 82 of the film forming material discharge portion 13 as shown in FIG. 12A, all of the discharge openings 80, 81, 82 of the film formation material discharge portion 13. Becomes an open state. When the air cylinder 95 is operated and the shutter member 8 is displaced, the opening 93 of the shutter member 8 deviates from the discharge openings 80, 81, 82 of the film forming material discharge portion 13 as shown in FIG. All the discharge openings 80, 81, 82 of the material discharge part 13 are closed.

Next, a film forming method of the organic EL device 100 (see FIG. 17) performed using the vacuum vapor deposition apparatus 1 of the present invention will be described. Prior to the description of the film formation procedure, the vacuum vapor deposition apparatus 1 at the start of film formation. The state of each part will be described.
First, the film formation chamber 2 will be described. The film formation chamber 2 is always decompressed by the decompression means 7 and is in an ultrahigh vacuum state. Here, the “ultra-high vacuum state” represents a state where the degree of vacuum is 10 ⁻⁵ Pa or less.
In the vacuum vapor deposition apparatus 1 of the present embodiment, since most of the manifold portions 66, 67, and 68 are outside the film forming chamber 2, the volume of the film forming chamber 2 is small, and the "ultra-high vacuum state" is reached. It takes a relatively short time.
The main on-off valves 40a to 40j are all closed. The crucibles 22 of the respective evaporation units 10a to 10j are filled with desired film forming materials 16a to 16j.

Here, in the present embodiment, the film forming materials 16a to 16j to be put in the crucible 22 are considered so that those having a necessary film thickness approximate can be put in the evaporation units 10a to 10j in the same group.
In the embodiment shown in FIG. 1, ten evaporation portions 10 a to 10 j are provided, and a maximum of ten kinds of film forming vapors 18 a to 18 j having different compositions can be released.
For this purpose, ten kinds of film forming materials 16a to 16j are put into the crucible 22 of the evaporation units 10a to 10j. At this time, the film thickness required for the substrate 11 is examined. A film forming material group with a large required film thickness (hereinafter referred to as a thick film group), a film forming material group with an intermediate required film thickness (hereinafter referred to as an intermediate thick film group), and a film forming with a small required film thickness. Group into material groups (hereinafter thin film groups).

Then, the film forming material 16 belonging to the thick film group is put into the evaporation units 10a to 10d of the first group. In addition, the film forming material 16 belonging to the intermediate thick film group is put into the second group evaporation units 10e to 10g, and the film forming material 16 belonging to the thin film group is put into the third group evaporation units 10h to 10j.
And the film-forming material 16a (16b-16j) is heated by the heating means 23 provided around the crucible 22, and the film-forming material 16a (16b-16j) is vaporized or sublimated. The inside of the evaporation chamber 21 is maintained at a temperature slightly higher than the vaporization temperature of the film forming material 16a (16b to 16j) by the heating means 24 provided around the evaporation chamber 21.

Further, the heating means of the connection channel 5 (not shown) is energized to keep the connection channel 5 at a temperature slightly higher than the vaporization temperature of the film forming material 16a (16b to 16j). Similarly, the heating means 35, 36 provided in the manifold portions 66, 67, 68 are energized to heat the hatch 30, the other main body portions 37, 38, 39 and the extension pipes 75, 76, 77.
That is, the heating means 36 keeps the hatch 30 at a temperature slightly higher than the vaporization temperature of the film forming material 16a (16b to 16j). Also, the heating means 36 heats the other portions of the main body portions 37, 38, 39 and the respective extension pipes 75, 76, 77, and the entire manifold portions 66, 67, 68 are entirely made of the film forming material 16a (16b-16j). It is maintained at a temperature slightly higher than the vaporization temperature.

Next, a film forming procedure of the organic EL device 100 (see FIG. 17) performed by the vacuum vapor deposition device 1 of the present embodiment will be described.
When manufacturing the organic EL device 100 using the vacuum vapor deposition device 1, the substrate 11 is transferred from a preliminary chamber (not shown) to the film formation chamber 2.
Here, the preliminary chamber (not shown) is in a vacuum state in advance, and in this state, the entrance (not shown) of the film formation chamber 2 is opened, and the substrate 11 is carried into the film formation chamber 2.
Here, although the preliminary chamber is in a vacuum state, the pressure is not reduced to such an extent that it can be said to be an “ultra-high vacuum state”. Therefore, the degree of vacuum in the film forming chamber 2 is slightly lowered by opening a carry-in entrance (not shown) of the film forming chamber 2.

  However, since the decompression means 7 continues to be operated at least until the film formation is started, the degree of vacuum in the film formation chamber 2 is restored to the “ultra high vacuum state”. In particular, in the vacuum deposition apparatus 1 of the present embodiment, most of the manifold portions 66, 67, 68 are outside the film forming chamber 2, and the volume of the film forming chamber 2 is relatively small. It does not take much time to recover to a “high vacuum state”.

The substrate 11 carried into the film forming chamber 2 by the substrate transfer device 12 is fixed so as to face the ejection surface of the film forming material discharge unit 13.
Note that a transparent conductive film or the like is formed in advance on the substrate 11 to be transported by another process, and the substrate 11 in this state is carried into the vacuum evaporation apparatus 1. As a method for forming a transparent conductive film on a substrate, there are known means such as sputtering.

  Then, as shown in FIG. 12B, all the release openings 80, 81, 82 of the film forming material discharge portion 13 are closed by placing the shutter member 8 in the closed posture. That is, the opening 93 of the shutter member 8 is shifted from the discharge openings 80, 81, 82 of the film forming material discharge unit 13, and all the discharge openings 80, 81, 82 of the film forming material discharge unit 13 are closed.

  Thereafter, one of the main on-off valves 40a to 40j is opened. Here, since the main on-off valves 40a to 40j are provided for each of the evaporation units 10a to 10j, by opening one of the main on-off valves 40a to 40j, The film-forming vapors 18a to 18j generated in any of the evaporation units 10a to 10j are introduced into any of the manifold units 66, 67, and 68, and are discharged from the discharge openings 80, 81, and 82 of any of the opening groups. The For example, when the main opening / closing valve 40a related to the evaporation unit 10a belonging to the first evaporation unit group is opened and the other main opening / closing valves 40b to 40j are maintained in the closed state, only the film formation vapor 18a produced by the evaporation unit 10a is obtained. The upper manifold section 66 is entered via the first supply flow path 32 of the connection flow path 5 and discharged from all the discharge openings 80 belonging to the first opening group.

  That is, the film forming material 16a (film forming vapor 18a) vaporized or sublimated from the crucible 22 in the evaporation unit 10a flows from the evaporation unit 10a through the main on-off valve 40a to the branch flow path 41a, and further to the first supply flow. It passes through the passage 32, reaches the upper manifold portion 66, and is discharged from all of the discharge openings 80.

Here, when the main opening / closing valve 40a is initially opened, the film-forming vapor 18a discharged from the discharge opening 80 is unstable and is prevented from reaching the substrate 11 side by the shutter member 8.
When the deposition vapor 18a discharged from the discharge opening 80 becomes stable as the predetermined time A elapses, the shutter member 8 is moved in the horizontal direction by the air cylinder 95, and the discharge opening 80 as shown in FIG. , 81, 82 are aligned with the openings of the shutter member 8 to open all the discharge openings 80, 81, 82 of the film forming material discharge portion 13. However, as described above, in the present embodiment, there are the main on-off valves 40a to 40j for each of the evaporation units 10a to 10j, and the main on-off valves 40a to 40j are selectively opened. , 81 and 82, the specific film-forming vapor 18a is ejected from the specific openings (discharge openings 80).

More specifically, the discharge openings 80, 81, 82 are divided into three groups, but vapor is discharged only from the discharge openings 80 belonging to the first opening group, and the discharge openings 81 belonging to the other groups. , 82 does not generate steam.
Further, the film formation vapor 18 released from the discharge opening 80 is limited to the film formation vapor 18a generated by the evaporation unit 10a, and the film formation vapors 18b to 18j in the other evaporation units 10b to 10j are not released. Therefore, although all the discharge openings 80, 81, and 82 are opened, the vapor deposition on the substrate 11 is limited to the film forming vapor 18a generated by the evaporation unit 10a.

The predetermined time A (waiting time until the shutter member 8 is opened) is preferably 1 to 10 seconds.
By opening the shutter member 8, the film formation vapor 18 a reaches the substrate 11 and is formed on the substrate 11.

Here, in the evaporation section 10a that generates the film-forming vapor 18a, a film-forming material belonging to a film-forming material group (thick film group) having a finally large required film thickness is introduced. The evaporation unit 10a belongs to the first evaporation unit group and communicates with the first opening group. As described above, the aperture 85 having the largest opening area is provided in the emission opening 80 of the first opening group. For this reason, the film-forming vapor 18a is released in a large amount per unit time.
Therefore, the film thickness after film formation becomes thick and meets the requirements.

At the time of film formation, the film thickness sensor 27 monitors information about the film thickness (film formation amount and the like), and constantly transmits the information to the control device 26.
The film thickness sensor 27 is in the film formation chamber 2 and is exposed to the same vacuum conditions as the substrate 11. The film deposition vapor 18 reaching the film thickness sensor 27 is the same as that formed on the substrate 11 and is supplied from the same manifold section 66. Therefore, the film adhering to the film thickness sensor 27 has a strong correlation with the film formed on the substrate 11 and accurately reflects the film thickness of the substrate 11. Therefore, the control device 26 can accurately grasp the film formation state.

  When the film forming material 16a is formed on the substrate 11 to a desired film thickness (deposition complete), the shutter member 8 is closed and the main on-off valve 40a is closed as shown in FIG.

  In this embodiment, only the heating means 36 for heating the hatch 30 of the manifold portion 66 is stopped before and after the operation of closing the shutter member 8. That is, as described above, only the hatch 30 is heated by the heating means 36 different from the others, and the power supply circuit is also independent from the others. Therefore, only the heating means 36 of the hatch 30 can be stopped by turning off the relay 50 shown in FIG.

As a result, only the portion of the hatch 30 rapidly decreases in temperature, and only the temperature of the portion of the hatch 30 decreases at a temperature lower than the vaporization temperature of the film forming material 16a (16b to 16j). Therefore, the deposition vapor 18a remaining in the main body portion 37 of the manifold portion 66 touches the portion of the hatch 30 to be solidified, and the deposition vapor 18a remaining in the main body portion 37 is removed. That is, according to the present embodiment, the vapor of the film forming material can be cooled and solidified or liquefied by the residual vapor removing means 15 constituted by the hatch 30 and the heating means 36 to remove the vapor of the film forming material.
The heating means 36 for heating the hatch 30 is restarted after a certain time has elapsed.

Subsequently, the other main opening / closing valve 40 is opened, and the film-forming vapor 18 in the other evaporation section 10 is released. For example, the main opening / closing valve 40f is opened, and the film-forming vapor 18f in the evaporation section 10f is introduced into the intermediate manifold section 67 and discharged from the discharge opening 81 of the second group. Also in this case, when the main on-off valve 40f is initially opened, the shutter member 8 is closed and is prevented from reaching the substrate 11 side.
When the predetermined time A elapses, the shutter member 8 is moved in the horizontal direction by the air cylinder 95, and the openings of the shutter member 8 are aligned with the discharge openings 80, 81, 82, and all the discharge openings 80, 81 of the film forming material discharge portion 13. , 82 are opened.
Also in this case, since the parts other than the main opening / closing valve 40f are closed, the specific film-forming vapor 18f is injected from the specific openings (discharge openings 81) of the plurality of discharge openings 80, 81, 82. Become.

More specifically, vapor is released only from the discharge openings 81 belonging to the second group, and no vapor is emitted from the discharge openings 80 and 82 belonging to other groups.
Moreover, the vapor | steam discharge | released from the discharge opening 81 is restricted to the film-forming vapor | steam 18f produced | generated by the evaporation part 10f, and the film-forming vapor | steam 18 in other evaporation parts 10a-10e and the evaporation parts 10g-10j is not discharge | released. Therefore, although all of the discharge openings 80, 81, 82 are opened, the deposition of the substrate is limited to the film-forming vapor 18f generated by the evaporation unit 10f.

Here, a film forming material belonging to a film forming material group (intermediate thick film group) having an intermediate required film thickness is introduced into the evaporation section 10f that generates the film forming vapor 18f. The evaporation unit 10f belongs to the second evaporation unit group and communicates with the second opening group. As described above, the discharge aperture 81 of the second aperture group is provided with the diaphragm 86 having a medium aperture area. Therefore, the amount of the film-forming vapor 18f that is released per unit time is medium.
Therefore, the film thickness after film formation is moderate and meets the requirements.

  When the film forming material 16f is formed on the substrate 11 to a desired film thickness (deposition complete), the shutter member 8 is closed and the main on-off valve 40f is closed as shown in FIG.

As before, only the heating means 36 for heating the hatch 30 of the manifold portion 67 is stopped before and after the operation of closing the shutter member 8, and only the portion of the hatch 30 is lowered. As a result, the film-forming vapor 18f remaining in the main body 38 of the manifold part 67 touches and solidifies the portion of the hatch 30, and the film-forming vapor 18f remaining in the main body 38 is removed.
The heating means 36 for heating the hatch 30 is restarted after a certain time has elapsed.

For example, when the main opening / closing valve 40j is opened, the film-forming vapor 18j in the evaporation section 10J is discharged from the third group discharge opening 82. In the evaporation section 10j that generates the film-forming vapor 18j, a film-forming material belonging to a film-forming material group (thin film group) having a thin film thickness is finally introduced. Since the discharge opening 82 of the third opening group is provided with the diaphragm 87 having the smallest opening area, the film deposition vapor 18j is released in a small amount per unit time.
Therefore, the film thickness after film formation is thin, and it meets the requirements.

Although the vacuum evaporation apparatus 1 of this embodiment is provided with three discharge | release systems, since the organic EL apparatus 100 is a thing by which many thin film layers were laminated | stacked, it uses each discharge | release system several times and is a board | substrate. 11 is required to form a film.
Here, the vacuum vapor deposition apparatus 1 of the present embodiment reduces the temperature of only a part of the manifold portions 66, 67, 68 (hatch portion 30), thereby causing the film-forming vapor 18 remaining in the manifold portions 66, 67, 68 to remain. Can be removed. Therefore, even if the same emission system is used a plurality of times or the same emission system is used continuously during the process for manufacturing one organic EL device 100, it is formed in the manifold portions 66, 67, 68. The film vapor 18 is not mixed. That is, in this embodiment, different film-forming vapors 18 are introduced into the manifold portions 66, 67, 68, but there is no fear of causing contamination.

When film formation is completed over a predetermined layer, an unillustrated unloading port is opened and the substrate 11 is unloaded by the substrate transfer device 12. By opening a carry-out port (not shown) of the film forming chamber 2, the degree of vacuum in the film forming chamber 2 is slightly lowered.
However, since the decompression means 7 is continuously operated until the next substrate 11 is carried in, the vacuum degree of the film forming chamber 2 is restored to the “ultra-high vacuum state”. In particular, in the vacuum vapor deposition apparatus 1 of the present embodiment, the vacuum vapor deposition apparatus 1 of the present embodiment has most of the manifold portions 66, 67, 68 outside the film formation chamber 2, and the volume of the film formation chamber 2 is relatively large. Since it is small, it does not take much time to recover the reduced vacuum level to the “ultra-high vacuum state”.

In the above-described embodiment, film formation was performed on the substrate 11 by selectively opening one of the main on-off valves 40a to 40j. According to this measure, one layer is vapor-deposited with only one film-forming material component. That is, according to the above-described method, single vapor deposition is performed.
However, the use of the vacuum vapor deposition apparatus 1 of this embodiment is not limited to single vapor deposition, and co-evaporation can also be performed using the vacuum vapor deposition apparatus 1. That is, it is possible to perform co-evaporation on the substrate 11 by selecting a plurality of main on-off valves 40a to 40j and opening them simultaneously.
For example, the main on-off valve 40b and the main on-off valve 40g are opened, and the film formation vapor 18b generated by the evaporation unit 10b and the film formation vapor 18g generated by the evaporation unit 10g are simultaneously released to perform evaporation on the substrate 11. Thus, co-evaporation can be performed.
In this case, the film formation vapor 18b is released from the discharge opening 80 belonging to the first group, and the film formation vapor 18g is released from the discharge opening 81 belonging to the second group.

  That is, in the co-evaporation process, the main film-forming material is evaporated by the single evaporation section 10b belonging to the single emission system (first emission system 57), and the main film-forming material is released from the emission opening 80 belonging to the emission system 57. The vapor deposition material is evaporated by a single evaporating part 10g belonging to a single release system (second release system 58) different from the first release system 57, and belongs to the second release system 58. The vapor of the secondary film forming material is discharged from the discharge opening 81.

  In this case, since the film forming vapor is released from the single manifold portions 66, 67, 68 to the film thickness sensors 27, 28, 29, respectively, the main film forming material and the sub film forming when co-deposition is performed. The amount of material released can be individually detected.

  Further, even if two or more main opening / closing valves 40 of the evaporation section 10 belonging to the same group are selected and opened, and the film-forming vapor 18 is mixed and discharged in the manifold sections 66, 67, 68 belonging to the group, co-evaporation is performed. be able to.

Next, a recommended layer configuration of the organic EL device 100 will be described.
As shown in FIG. 17, the organic EL device 100 includes a first electrode layer 103, a functional layer 105, and a second electrode layer 106 stacked on a light-transmitting substrate 102 and sealed with a sealing layer 130. Is.

  In addition, the functional layer 105 has, for example, a first hole injection layer 107, a first hole transport layer 108, a blue light emitting layer 109, and a first layer in order from the first electrode layer 103 side as shown in FIG. Blue light emitting unit composed of electron transport layer 110, second hole injection layer 114, second hole transport layer 115, red light emission layer 116, green light emission layer 117, second electron transport layer 118, and electron injection layer A tandem structure in which the red-green light emitting unit composed of 119 is electrically connected by a connection layer composed of the first connection layer 111, the second connection layer 112, and the third connection layer 113. Can do. Here, from the viewpoint of manufacturing an organic EL device with high productivity and high material use efficiency by using the vacuum vapor deposition apparatus of the present invention, the total film thickness of each light emitting unit should be about 50 nm to 300 nm. The film thickness of each light emitting layer is preferably about 5 nm to 50 nm.

  Here, the blue light-emitting layer 109 is a layer in which a host material is doped with a blue fluorescent material, and the red light-emitting layer 116 and the green light-emitting layer 117 are layers in which the host material is doped with a phosphorescent material of each color. A hybrid structure is preferable from the viewpoint of obtaining an organic EL element having high luminance, high color rendering properties, and a long lifetime. In addition, it is also preferable from the viewpoint of obtaining high luminance that the blue light emitting layer 109 is a layer obtained by doping a host material with a blue phosphorescent material.

  In such an organic EL element having a tandem structure, the film thickness of each light emitting layer is directly related to the emission spectrum intensity of each color, and each light emitting layer is connected in series in the film thickness direction. Since the movement of carriers in the in-plane direction is extremely limited compared to the direction, the film thickness of each light emitting layer is closely related to the emission spectra of other colors.

  In addition, when the organic EL device has a hybrid structure using phosphorescence, which is long-lived triplet exciton light emission, particularly when the red and green light emitting layers are adjacent to each other or consist of one layer, the light emission is on the long wavelength side. Red shift tends to occur, and it is important to control the film thickness of each light emitting layer as designed.

  The first hole injection layer 107, the first hole transport layer 108, the second hole injection layer 114, and the second hole transport layer 115 may each be a single hole injection transport layer. Each layer can be a layer made of a hole transport material or a layer made of a hole transport material doped with an organic p-type dopant.

Further, for example, the first connection layer 111 is made of an organic electron transport material doped with an organic n-type dopant, the second connection layer 112 is made of an organic electron transport material, and the third connection layer 113 is made of an organic p-type dopant. It can be a layer made of a doped organic hole transport material.
Such a host material or the like is used as a main film forming material according to the present invention, and such a dopant or a light emitting material is used as a sub film forming material according to the present invention. The main film-forming material is preferably assigned to the evaporation part belonging to the part group, preferably independently, and the film-forming material according to the evaporation part belonging to the evaporation part group connected to the aperture group having a small aperture according to the present invention, preferably It is preferable to assign it alone, and the co-deposition composition can be controlled accurately and stably.

  In the organic EL element having the tandem structure as described above, since it is necessary to stack many different types of layers including the layer having such a co-evaporation composition, the configuration of the present invention makes it possible to achieve the effects of the present invention. It does not take a long time to evacuate the inside. Therefore, it is extremely effective to form the functional layer 105 using a vacuum evaporation apparatus that can shorten the time required for film formation.

  The phosphorescent light emitting layer described above is included in the host material that is the main film forming material according to the present invention and the sub film forming material according to the present invention, and includes at least two kinds of light emitting dopants that are used as the first sub film forming material. It is preferable to set it as the layer formed by co-evaporating the compound. In addition to these, it is also preferable to form a layer obtained by co-evaporating at least three kinds of compounds including the second secondary film-forming material as an electron and / or hole transporting enhancing dopant. The preferred content of the first sub-film forming material is 1 to 30% by weight, more preferably 1 to 10% by weight, the preferred content of the second sub-film forming material is 1 to 30% by weight, and more Preferably it is 10 to 30% by weight.

  Such a main opening group corresponding to the main film forming material, a first sub opening group corresponding to the first sub film forming material, and an opening group corresponding to the second sub film forming material. A vacuum deposition apparatus including a film forming chamber having three second sub-opening groups is excellent in controllability and inexpensive as an apparatus for forming an organic EL device including a phosphorescent light emitting layer as a functional layer. Is a preferred embodiment.

  A plurality of evaporation sections belong to the evaporation section group connected to each opening group, and preferably, by switching the evaporation section of a single, vapor deposition and co-deposition from the plurality of opening groups, the organic functional layer Forming all the layers in one film forming chamber is a preferred embodiment as a method for manufacturing the organic EL device of the present invention.

  Moreover, it can be set as the vacuum evaporation system which has the 2 or more group of opening groups discharge | released in a different direction, and can make it each group have 3 sets of opening groups. It is preferable that all of the functional layer 105 be formed with one vacuum deposition apparatus of the present invention by connecting the same evaporation section according to the present invention to a plurality of opening groups via the supply switching unit according to the present invention. . That is, it is preferable that the above-described electron transport material and hole transport material can be supplied by evaporating the same material from the same evaporation section even when different layers are formed.

  Each layer constituting the functional layer 105 and the second electrode layer 106 are formed by the vacuum vapor deposition apparatus 1.

The substrate 102 has translucency and insulation. The material of the substrate 102 is not particularly limited, and is appropriately selected from, for example, a flexible film substrate or a plastic substrate. In particular, a glass substrate or a transparent film substrate is preferable in terms of transparency and good workability.
The substrate 102 has a planar shape. Specifically, it is polygonal or circular, and is preferably square. In this embodiment, a rectangular substrate is employed.
The shortest side (shortest axis) of the substrate 102 is 300 mm or more, preferably 350 mm or more, and particularly preferably 500 mm or more.
Area of the substrate 102, 900 cm ² (square centimeters) or more, 40000Cm ² has a (square centimeter) or less, 1200 cm ² (square centimeters) or more, it is preferable to have a 15000 cm ² (square centimeter) or less, 2500 cm ² (square centimeter) It is particularly preferably 11000 cm ² (square centimeter) or less.

The material of the first electrode layer 103 is not particularly limited as long as it is transparent and has conductivity. For example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation Transparent conductive oxides such as tin (SnO ₂ ) and zinc oxide (ZnO) are employed. ITO or IZO, which has high transparency, is particularly preferable in that light generated from the light emitting layer in the functional layer 105 can be effectively extracted. In this embodiment, ITO is adopted.

  As materials for the first hole injection layer 107 and the second hole injection layer 114, known substances can be used. For example, 1,3,5-tricarbazolylbenzene, 4,4'-biscarbazolylbiphenyl, polyvinylcarbazole, m-biscarbazolylphenyl, 4,4'-biscarbazolyl-2,2'-dimethylbiphenyl 4,4 ′, 4 ″ -tri (N-carbazolyl) triphenylamine, 1,3,5-tri (2-carbazolylphenyl) benzene, 1,3,5-tris (2-carbazolyl-5- Methoxyphenyl) benzene, bis (4-carbazolylphenyl) silane, N, N′-bis (3-methylphenyl) -N, N′-diphenyl- [1,1-biphenyl] -4,4′-diamine (TPD), N, N′-di (naphthalen-1-yl) -N, N′-diphenylbenzidine (α-NPD), N, N′-diphenyl-N, N′-bis (1-naphthy) )-(1,1′-biphenyl) -4,4′-diamine (NPB), poly (9,9-dioctylfluorene-co-N- (4-butylphenyl) diphenylamine) (TFB) or poly (9, 9-dioctylfluorene-co-bis-N, N-phenyl-1,4-phenylenediamine (PFB) or the like can be used.

  As materials for the first hole transport layer 108 and the second hole transport layer 115, known materials can be used. For example, benzine, styrylamine, triphenylmethane, porphyrin, triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole, anthracene, fluorenone, hydrazone, stilbene, and their derivatives, polysilane compounds, vinylcarbazole Heterocyclic conjugated monomers, oligomers, polymers and the like such as compounds, thiophene compounds, and aniline compounds can be employed.

  As a material for the blue light emitting layer 109, a distyrylarylene derivative, an oxadiazole derivative, and a polymer thereof, a polyvinylcarbazole derivative, a polyparaphenylene derivative, a polyfluorene derivative, or the like can be employed. Of these, polymer materials such as polyvinyl carbazole derivatives, polyparaphenylene derivatives, and polyfluorene derivatives are preferred.

  As a material for the red light emitting layer 116, a coumarin derivative, a thiophene ring compound, and a polymer thereof, a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyfluorene derivative, or the like can be employed. Among these, polymer materials such as polyparaphenylene vinylene derivatives, polythiophene derivatives, and polyfluorene derivatives are preferable.

  As a material for the green light emitting layer 117, a quinacridone derivative, a coumarin derivative, and a polymer thereof, a polyparaphenylene vinylene derivative, a polyfluorene derivative, or the like can be used. Of these, polymer materials such as polyparaphenylene vinylene derivatives and polyfluorene derivatives are preferred.

As materials for the first electron transport layer 110 and the second electron transport layer 118, known substances can be used. For example, benzine, styrylamine, triphenylmethane, porphyrin, triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole, anthracene, fluorenone, hydrazone, stilbene, and their derivatives, polysilane compounds, vinyl Heterocyclic conjugated monomers, oligomers, polymers and the like such as carbazole compounds, thiophene compounds, and aniline compounds can be employed.
In particular, tris (8-quinolinolato) aluminum (Alq3), tris (5-methyl-8-quinolinolato) aluminum (Almq3), bis (10-hydroxybenzo [h] -quinolinato) beryllium (BeBq2), bis (2-methyl) A metal complex having a quinoline skeleton or a benzoquinoline skeleton, such as -8-quinolinolato) -4-phenylphenolato-aluminum (BAlq), can be preferably used. In addition, bis [2- (2-hydroxyphenyl) -benzoxazolate] zinc (Zn (BOX) 2), bis [2- (2-hydroxyphenyl) -benzothiazolate] zinc (Zn (BTZ) 2) A metal complex having an oxazole-based or thiazole-based ligand such as can also be used. In addition to metal complexes, 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole (PBD), 1,3-bis [5- ( p-tert-butylphenyl) -1,3,4-oxadiazol-2-yl] benzene (OXD-7), 3- (4-tert-butylphenyl) -4-phenyl-5- (4-biphenylyl) ) -1,2,4-triazole (TAZ), 3- (4-tert-butylphenyl) -4- (4-ethylphenyl) -5- (4-biphenylyl) -1,2,4-triazole (p -EtTAZ), bathophenanthroline (BPhen), bathocuproin (BCP) and the like can also be used.

As a material of the electron injection layer 119, a known substance can be used. For example, an alkali metal or alkaline earth metal compound such as lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ₂ ), or the like can be employed. Further, as the electron injecting layer, a layer made of a substance having an electron transporting property containing an alkali metal or an alkaline earth metal, for example, a material containing magnesium (Mg) in Alq3 is preferably used. Can do.

  The material of the 2nd electrode layer 106 is not specifically limited, For example, metals, such as silver (Ag) and aluminum (Al), are mentioned.

  According to the vacuum deposition apparatus 1 of the present embodiment, almost all the layers of the organic EL device 100 (excluding the substrate 102, the first electrode layer 103, and the sealing layer 130) are formed in one film formation chamber 2. be able to.

  In the embodiment described above, the evaporation units 10a to 10j are those in which the crucible 22 is arranged in the evaporation chamber 21, but the entire evaporation chamber 21 may also function as a crucible.

  In any of the embodiments described above, the film forming material discharge portion 13 is arranged horizontally. However, the present invention is not limited to this configuration, and the film formation material discharge portion 13 may be arranged in a vertical posture. Good.

  In the embodiment described above, the extension pipes 75, 76, 77 are provided in the manifold portions 66, 67, 68. However, for example, in the uppermost manifold portion 66, the discharge opening 80 may be directly provided in the main body portion 37. .

  In the embodiment described above, an example in which three manifold portions 66, 67, and 68 are provided has been described. However, the number of manifold portions is arbitrary, and may be four or more. Also, it may be less than 3.

  In the embodiment described above, the configuration including the ten evaporation units 10a to 10j is illustrated, but the number of the evaporation units 10a to 10j is arbitrary. However, the number of the evaporation units 10 is preferably 9 or more, and more preferably 13 pieces. In practice, about 12 to 20 is appropriate.

  In the above-described embodiment, the film forming materials 16a to 16j to be put in the crucible 22 are considered so that those having a similar required film thickness can be put in the evaporation units 10a to 10j in the same group. Alternatively, in addition to this, the vapor discharge units 10a to 10j of the same group are approximated based on the target discharge amount per unit time of vapor for each film forming material and the target partial pressure of vapor in the film forming chamber. You may choose to be put in. It is also recommended to select a group that has a similar target pressure of steam in the vicinity of the opening end of the discharge opening.

  In the embodiment described above, the residual vapor removing means 15 is provided in order to prevent contamination. That is, in the vacuum vapor deposition apparatus 1, the heating means 35, 36 for keeping the manifold portions 66, 67, 68 is made into a plurality of systems, and a low-temperature portion is intentionally formed in a part of the manifold portions 66, 67, 68, thereby forming film vapor. 18a-18j were removed. This may be further developed to forcibly cool a part of the manifold portions 66, 67, 68 and capture the remaining film-forming vapors 18a to 18j.

In the above-described embodiment, the low temperature portion is formed in the main body portions 37, 38, 39 of the manifold portions 66, 67, 68. However, the low temperature portion may be formed in other portions.
For example, in the vacuum vapor deposition apparatus 62 shown in FIGS. 13 and 14, the residual vapor removing means 78 having another configuration is employed. The residual vapor removing means 78 is provided with a trap space 63 separately from the main body portions 37, 38, 39. The trap space 63 is always kept at a lower temperature than the manifold portions 66, 67 and 68. Then, a pipe connection is made between the trap space 63 and the main body portions 37, 38, 39. The trap space 63 and the body portions 37, 38, 39 are preferably provided with on-off valves 64a, b, c.

In the case where the on-off valves 64 a, b, and c are provided, it is desirable to provide a separate decompression means 65 in the trap space 63 so that the trap space 63 is decompressed to the same extent as the film formation chamber 2.
In the vacuum vapor deposition apparatus 62 shown in FIGS. 13 and 14, the on-off valves 64a, b, and c are opened each time film formation is completed, and the manifold portions 66, 67, 68 and the trap space 63 are communicated. As a result, the film-forming vapors 18a to 18j flowing into the trap space 63 from the manifold portions 66, 67, and 68 are cooled and solidified in the trap space 63 and captured. Therefore, even if the same release system is used a plurality of times or the same release system is used continuously, the film forming vapor 18 is not mixed in the manifold portions 66, 67, 68.

  13 and 14 exemplify a configuration in which one trap space 63 is provided for a plurality of manifold portions 66, 67, 68. However, a trap space 63 is provided for each manifold portion 66, 67, 68 individually. Also good. When providing the individual trap space 63, it is not necessary to provide the on-off valves 64a, b, c and the pressure reducing means 65. However, in the case where the individual trap space 63 is provided, it is recommended to provide a separate heating means as in the hatch 30 described above, and it is desirable to reduce only the temperature of the trap space 63 after film formation.

The vacuum deposition apparatus 1 described above has three manifold portions 66, 67, 68, and all of the main body portions 37, 38, 39 are arranged outside the film forming chamber 2. However, the present invention is not limited to this configuration. For example, an upper manifold portion 66 is arranged in the film forming chamber 43 as in the vacuum vapor deposition apparatus 96 shown in FIG. It may be arranged outside the membrane chamber 43.
Further, like the vacuum deposition apparatus 97 shown in FIG. 16, the main body portion 37 of the upper manifold portion 66 and the upper portion of the main body portion 38 of the intermediate manifold portion 67 are arranged in the film forming chamber 45, and the main body portion 38 of the intermediate manifold portion 67. The lower part may be arranged outside the film forming chamber 45.

In the embodiment described above, three discharge systems 57, 58, 58 are provided, and heating means 23, 24, 35, 36 are provided in each discharge system. These heating means 23, 24, 35, and 36 are all heaters and have only a temperature raising function, but may have a cooling function in addition to this.
For example, as shown in FIG. 18, the temperature of each manifold 66, 67, 68 is provided by measures such as providing a heat medium pipe 198 in each manifold 66, 67, 68, or providing a heat medium jacket 199 as shown in FIG. Configurations that make adjustments are also recommended. In the present embodiment, the heat medium pipe 198 and the heat medium jacket 199 serve as a heat medium flow path, and a high or low temperature heat medium can be passed through the heat medium pipe 198 and the temperature of each manifold section 66, 67, 68 can be adjusted.
Therefore, the temperatures of the manifold portions 66, 67, 68 can be adjusted to a temperature suitable for the film forming material. Therefore, when the film forming material having a high vaporization temperature is released and subsequently the film forming material having a low vaporization temperature is released using the same release system, the discharge system can be cooled, and the film can be cooled at a low temperature. The vapor deposition of the film forming material to be vaporized can be started at an early stage, and the switching time of the film forming material to be released can be shortened.

In the vacuum vapor deposition apparatus 1, 62, 96, 97 of this embodiment, the film forming chambers 2, 43, 45 are small, and the time required for evacuation is short. In addition, since many of the piping systems are outside the film forming chambers 2, 43, 45, maintenance is easy.
In particular, since the cleaning hatch 30 is outside the film forming chambers 2, 43, 45, it is easy to remove the film forming material attached to the hatch 30.

1, 62, 96, 97 Vacuum deposition apparatus 2, 43, 45 Deposition chamber 3 Release circuit 6 Manifold group 8 Shutter members 10a to 10j Evaporating section 11 Substrate (base material)
13 Film-forming material discharge part 15, 78 Residual vapor removing means 16a-16j Film-forming material 18a-18j Film-forming vapor 21 Evaporating chamber 22 Crucible 27, 28, 29 Film thickness sensors 37, 38, 39 Main body parts 40a-40j Main opening / closing Valves 46, 47, 48 Emission openings 66, 67, 68 for confirming the film thickness Manifold part 73 Cavity parts 75, 76, 77 Extension pipes 80, 81, 82 Emission openings 85, 86, 87 Restriction 93 Opening 100 Organic EL device

Claims (13)

A film forming chamber that can be decompressed and in which a base material can be installed, and a film forming material discharge part provided with a plurality of discharge openings for discharging vapor of the film forming material to the base material. In a vacuum vapor deposition apparatus that releases a vapor of film forming material from a film to form a film on a substrate,
There are a plurality of evaporation sections that evaporate the film forming material, a set of evaporation section groups configured by one or a plurality of evaporation sections, a manifold section, and a plurality of sections provided in the manifold section directly or via an extension pipe A flow group including a plurality of discharge systems, each having a set of opening groups each formed by a discharge opening, the evaporation unit group, the manifold unit, and the opening group being connected to form one discharge system. It has a road configuration,
At least one discharge system has a plurality of evaporation sections;
The plurality of manifolds are arranged outside the film formation chamber ,
A vacuum deposition apparatus comprising: a decompression unit connected to a manifold portion arranged outside the deposition chamber, in addition to the decompression unit for maintaining the space in the deposition chamber in a vacuum state. 2. The vacuum deposition apparatus according to claim 1, wherein each of the plurality of manifold portions is connected to a decompression unit by piping, and an on-off valve is provided for each piping individually. A film thickness sensor and a discharge opening for checking the film thickness are provided in the film forming chamber, and a manifold portion arranged outside the film forming chamber and the discharge opening for checking the film thickness communicate with each other. Item 3. The vacuum evaporation apparatus according to Item 1 or 2 . There is a main on-off valve for each evaporation section, and the main on-off valve is opened to introduce the steam generated in the evaporation section into the manifold section. The evaporation section group contains the vapor for each film forming material. A target discharge amount per unit time and / or a target film thickness and / or a target partial pressure of steam in the film forming chamber and / or a target pressure of steam near the opening end of the discharge opening are approximated as one group. The vacuum vapor deposition apparatus according to any one of claims 1 to 3, wherein the vacuum vapor deposition apparatus is selected as follows. An aperture is provided in the vicinity of the opening end of the emission opening, and the aperture arranged in one emission system has an opening area set based on a certain standard, and is provided in at least one other emission system. The vacuum evaporation apparatus according to any one of claims 1 to 4 , wherein the aperture is set according to a different standard. A shutter member that covers substantially the entire surface of the film forming material discharge portion;
At the time of film formation, the main on-off valve is individually opened and closed, and the shutter member is opened to open all the discharge openings to release the vapor of the film formation material from the specific discharge opening,
Non-deposition vapor deposition apparatus described in any one of claims 1 to 5, characterized in that for closing all the discharge opening to close the shutter member at the time. To any one of claims 1 to 6 discharge opening is characterized by comprising a residual vapor removal means for removing the vapor of the film forming material remaining between reaching the discharge opening from the outlet of the evaporator unit when it is closed The vacuum evaporation apparatus as described. Residual vapor removal means is a trapping volume of solidified or liquefied by cooling the vapor of the film forming material, according to claim 7, characterized in that pressure-reducing means connected to said manifold portion to the trap space is connected Vacuum deposition equipment. The co-deposition process of forming a co-deposited organic layer was to release the main film forming material and auxiliary component film material simultaneously using the vacuum vapor deposition apparatus according to any one of claims 1 to 8 performed multiple times, a plurality of An organic EL device manufacturing method for manufacturing an organic EL device including a co-evaporated organic layer, wherein a plurality of types of main film forming materials are selectively introduced into evaporation units belonging to the same evaporation unit group, An organic material characterized in that a sub-film forming material is selectively introduced into an evaporation unit belonging to another evaporation unit group, and the evaporation material is evaporated at each of the evaporation units to form a co-deposited organic layer on a substrate. Manufacturing method of EL device. 10. The method of manufacturing an organic EL device according to claim 9, further comprising a step of discharging vapor of the film forming material from the manifold portion by a decompression unit connected to the manifold portion. In the co-evaporation step, the main film forming material is evaporated in a single evaporation unit belonging to a single discharge system, and the vapor of the main film forming material is discharged from the discharge opening belonging to the discharge system. to claim 9 or 10, characterized in that to release the different single evaporator sections belonging to a single release system to evaporate the minor component film material from the discharge opening belonging to said discharge line to the minor component film material vapor The manufacturing method of the organic electroluminescent apparatus of description. The vacuum evaporation apparatus includes a large capacity discharge system having a large total area of the discharge openings of the opening group to which the vacuum deposition apparatus belongs, and a small capacity discharge system having a total area of the discharge openings of the opening group to which the total belongs.
The main film-forming material is a component that is contained in a large amount in the formed layer, and the sub-film formation material is a component that has a lower content than the main film-forming material in the formed layer,
Selectively introduced to the evaporation sections belonging to the main film-forming material in the mass for releasing strain, 9 through claim, wherein the selectively introducing auxiliary component film material in the evaporation unit belonging to a small volume for release systems 11. A method for producing an organic EL device according to any one of 11 above. The vacuum deposition apparatus has a film thickness sensor in the film forming chamber and a discharge opening for checking the film thickness, and has a configuration in which the manifold portion and the discharge opening for checking the film thickness communicate with each other. A co-evaporation process is performed, in which a main film-forming material is released from an emission opening belonging to, and a subsidiary film-forming material is simultaneously released from an emission opening belonging to one or more other emission systems to form a co-deposition organic layer. The organic EL according to any one of claims 9 to 12 , wherein when performing the process, the film formation state only by the main film formation material and / or the film formation state only by the sub film formation material can be detected. Device manufacturing method.

Images