JP5975085B2 - Resin sealing mold, resin sealing device, and method of manufacturing molded product - Google Patents

Description

  The present invention relates to a resin comprising a first mold and a second mold for sealing an electronic component by placing the electronic component in a cavity formed by clamping and injecting a sealing resin into the cavity. The present invention relates to a sealing mold, a resin sealing device, and a resin sealing method.

Electronic components such as semiconductor elements, resistance elements, and capacitors are sealed with a sealing resin for the purpose of protection.
For example, DIP (Dual Inline Package), QFP (Quad Flat Package), PLCC (Plastic leaded chip carrier) and other semiconductor devices with semiconductor elements mounted on them, BGA (Ball grid array) and LGA (Land grid array) In a semiconductor device in which a semiconductor element is mounted on a resin substrate such as a substrate, the entire semiconductor element is sealed with a sealing resin.

When sealing a semiconductor element mounted on a resin substrate with a sealing resin, the sealing resin is injected into the cavity where the semiconductor element is located with the resin substrate sandwiched between the upper mold and the lower mold. To do.
The semiconductor element is covered by sealing the entire electronic component with a sealing resin. However, a semiconductor element that generates a large amount of heat generates a part of the semiconductor element or a heat sink provided on the semiconductor element from the sealing resin. It is employed that the heat is released by sealing so as to be exposed.
As a technique related to sealing of such an electronic component, one described in Patent Document 1 is known.

  As shown in FIG. 15, a “semiconductor device and a method for manufacturing a semiconductor device” of Patent Document 1 includes a heat conductor 1191 disposed opposite to a main surface of a semiconductor element 1101, a semiconductor element 1101, and a heat conductor 1191. It is described that a sealing resin body 1106 for sealing a part thereof is provided. The heat conductor 1191 is provided with an opening 1111 penetrating in the plate thickness direction. In addition, the heat conductor 1191 is formed with a support portion 1192 that is bent at the corner portion and protrudes in the lower surface direction, and the bottom surface of the support portion 1192 is in contact with the substrate 1103.

JP 2008-135688 A

  However, in the heat conductor 1191 shown in FIGS. 15 and 16, the support portion 1192 supports the entire heat conductor 1191, so that the sealing resin body 1106 is placed in the heat conductor 1191 between the support portions 1192. There is a gap for inflow. The heat conductor 1191 has a sealing resin body 1106 flowing into the heat conductor 1191 from the opening 1111.

As described above, the heat conductor 1191 described in Patent Document 1 is bent in order to use the corners as the support portions 1192 in order to allow the sealing resin body 1106 to flow into the heat conductor 1191, Drilling or the like for opening the opening 1111 is required, and man-hours are required for manufacturing the heat conductor 1191. In addition, there is a problem that a resin burr is generated on the exposed surface due to the variation in height due to the processing accuracy of the support portion 1192, and there is a trouble that a separate mold is required when the height of the support portion 1192 is different.
For this reason, it is desirable that the mounting body that covers the electronic component has a simple structure and can cope with various electronic components.

  Accordingly, the present invention provides a resin sealing mold, a resin sealing device, and a method of manufacturing a molded product that can seal a mounting body that can be formed with a simple structure together with electronic components. Objective.

In the present invention, an electronic component mounted on a base is disposed in a cavity formed by clamping a first mold and a second mold, and a sealing resin is injected into the cavity. In the resin sealing mold for sealing the electronic component, a suction hole for adsorbing the mounting body mounted on the electronic component to the first mold is formed in the first mold. The mounting body is adsorbed by the suction holes, the mounting body is disposed in a non-contact state with respect to the base, and the sealing resin is injected between the mounting body and the electronic component. A space is formed, and the first mold has a first concavo-convex portion that fits with a third concavo-convex portion formed in a mounting body transport device that transports the mounting body to the first mold. And the second mold is fitted with the first concavo-convex portion when the mold is clamped with the first mold. Wherein the concavo-convex portion is formed.

According to the present invention, an electronic component mounted on a base is disposed in a cavity formed by clamping the first mold and the second mold, and the cavity is sealed. In the resin sealing device for injecting resin and sealing the electronic component, a suction hole for adsorbing the mounting body mounted on the electronic component to the first mold is provided in the first mold. Formed, sucking the mounting body through the suction holes, placing the mounting body in a non-contact state with respect to the base, and the sealing resin between the mounting body and the electronic component. A space to be injected is formed , a first uneven portion is formed in the first mold, and the second mold is clamped with the first mold when the first mold is clamped. A second concavo-convex portion that is fitted to the first concavo-convex portion is formed, and when the mounting body is transported to the first mold, Further comprising a third mounting-body conveying device irregular portion is formed for engagement and said.

According to the present invention, the suction hole for attracting the mounting body mounted on the electronic component to the first mold is formed in the first mold. By adsorbing the mounting body through the suction holes and placing the mounting body in a non-contact state with respect to the base, a space for injecting the sealing resin is formed between the mounting body and the electronic component. The By doing so, there is no need to provide the mounting body with legs that stand on the base and support the mounting body.
Moreover, the 1st uneven | corrugated | grooved part of a 1st metal mold | die and the 2nd uneven | corrugated | grooved part of a 2nd metal mold | die are formed in each metal mold | die as positioning at the time of clamping. Therefore, the mounting body transporting device that transports the mounting body to the first mold is formed with a third uneven portion that fits the first uneven portion, thereby positioning the mounting body transporting device with respect to the first mold. Therefore, it is not necessary to newly provide the uneven portion for the first mold.

  It is preferable that the first mold is formed with a restricting portion that contacts an outer peripheral portion of the mounting body and restricts a suction position of the mounting body. When the restricting portion comes into contact with the outer peripheral portion of the mounting body, when the mounting body is sucked, the mounting body is sucked while correcting the position within the range of the restricting portion, so that the sucking position of the mounting body is restricted.

  It is desirable that the restricting portion is a convex portion corresponding to the contour shape of the mounting body. The mounting body can be adsorbed to the first mold while the convex portion corrects the position of the mounting body to a position surrounded by the convex portion. Moreover, the convex part surrounding the mounting body can stop the flow of the sealing resin that is about to enter between the mounting body and the first mold.

  The sealing resin enters the top surface of the mounting body when the convex portion comes into contact with the stepped portion from the attracted surface of the mounting body formed on the periphery of the mounting body from the outside. Therefore, the sealing resin can be reliably prevented from entering.

  Furthermore, in the case of the resin-sealing mold according to the present invention, the second concavo-convex portion is formed on the electronic component transport device when the electronic component is transported by the electronic component transport device. It is desirable to fit with the uneven part.

Further, when a resin sealing apparatus of the present invention, the electronic component when conveying to the second mold, for a fourth electronic component concave convex portion formed to mate with the second uneven portion It is desirable to have a transport device.

  By forming the fourth concavo-convex portion that fits into the second concavo-convex portion of the second mold in the electronic component transport device, the electronic component can be accurately placed on the second mold. Therefore, the mounting body is positioned and arranged in the first mold, and the electronic component is positioned and arranged in the second mold so that the positional relationship between the mounting body and the electronic component can be accurately matched. it can.

  When a plurality of the suction holes are formed, the suction force for adsorbing the mounting body can be dispersed, so that the tube diameter per suction hole can be formed thin. Therefore, it is possible to prevent the suction hole from being attached to the mounting body.

According to the present invention, an electronic component mounted on a base is placed in a cavity formed by clamping a first mold and a second mold, and a sealing resin is placed in the cavity. Injecting and sealing the electronic component to manufacture a molded product,
A mounting body mounted on the electronic component via a sealing resin is transported to the first mold by a mounting body transport device , and the first uneven portion formed on the first mold and the The mounting body is moved to the first mold by the step of fitting the third concavo-convex portion formed on the mounting body conveying device and the suction from the suction hole formed in the first mold. Arranging the mounting body in a non-contact state with respect to the base body in order to adsorb and form a space into which the sealing resin is injected between the mounting body and the electronic component; The first concavo-convex portion formed on the first mold on which the electronic component is disposed and the second concavo-convex portion formed on the second mold are fitted and clamped to form the cavity. The step of injecting a sealing resin and the first mold and the second mold were opened to seal the electronic component with resin. Characterized in that it comprises a step of the molded article release.

  According to the method for manufacturing a molded product of the present invention, a mounting body that does not have leg portions that stand on a base and support the mounting body can be sealed together with an electronic component to form a molded product.

  According to the present invention, the mounting body can be formed with a simple structure because it is not necessary to provide the mounting body with the legs that stand on the base and support the mounting body. Therefore, this invention can seal such a mounting body with an electronic component.

It is a figure which shows the resin sealing apparatus which concerns on embodiment of this invention. It is a figure of the semiconductor device with which the semiconductor element mounted in the printed wiring board was sealed by the resin sealing apparatus shown in FIG. It is a perspective view which shows the heat sink of the molded article shown in FIG. It is a figure of the heat sink conveyance part of the metal mold | die for resin sealing used for the resin sealing apparatus shown in FIG. 1, and the resin sealing apparatus. It is a figure explaining the manufacturing method of the molded article using the resin sealing apparatus shown in FIG. 1, and is a figure of the state which raised the conveying apparatus and located the heat sink in the recessed part of the upper mold | type. FIG. 6 is a partially enlarged view of the resin sealing device shown in FIG. 5. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 5, and after a heat sink is made to adsorb | suck to an upper mold | type, it is a figure of the state which a heat sink conveyance part evacuates. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 7, and is a figure of the state which the board | substrate conveyance part of the resin sealing apparatus positioned the printed wiring board which mounted the semiconductor element on the lower mold | type. is there. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 8, and is a figure of the state which the board | substrate conveyance part has arrange | positioned the printed wiring board which mounted the semiconductor element in the lower mold | type cavity block of a lower mold | type. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 9, and is a figure of the state which a board | substrate conveyance part evacuates after arrange | positioning the printed wiring board which mounted the semiconductor element in a lower mold | type. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 10, and is a figure of the state which the board | substrate conveyance part evacuated. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 11, and is a figure of the state which clamped the upper mold | type and the lower mold | type. It is a figure of the resin sealing apparatus for demonstrating the process following FIG. 12, and is a figure of the state which open | released the upper mold | type and the lower mold | type. It is a figure of the resin sealing device for demonstrating the process following FIG. 13, and is a figure of the state which takes out and conveys the semiconductor device from which a product conveyance part is a molded article from a lower mold | type. 10 is a cross-sectional view showing a semiconductor device described in Patent Document 1. FIG. It is a perspective view of the heat conductor of the semiconductor package structure shown in FIG.

A resin sealing mold and a resin sealing device using the same according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 2, the resin sealing device 1000 shown in FIG. 1 includes a semiconductor element 120 (electronic component) mounted on the printed wiring board 110 (base), and a gap between the printed wiring board 110 and the semiconductor element 120. The wired wires 121 and the heat sink 130 (mounting body) that dissipates heat from the semiconductor element 120 are collectively sealed with the sealing resin 140 with the heat dissipation surface of the heat sink 130 exposed. Thus, the semiconductor device 150 (molded product) is manufactured.

  The heat sink 130 shown in FIG. 3 is a metal plate formed in a disk shape. On the outer peripheral portion of the heat sink 130, a stepped portion 133 whose plane is shifted from the position of the top surface 132 that becomes the suction surface of the heat sink body 131 is formed. On the outside of the stepped portion 133, a flange portion 134 is formed by an inclined surface.

A resin sealing device 1000 illustrated in FIG. 1 includes a substrate supply unit 1011, a substrate alignment unit 1012, a tablet supply unit 1013, and a heat sink distribution unit 1014.
The board supply unit 1011 has a printed wiring board 110 on which the semiconductor element 120 before resin sealing is mounted (hereinafter, the printed wiring board 110 on which the semiconductor element 120 is mounted may be simply referred to as a printed wiring board 110). Is supplied to the substrate alignment unit 1012. The board aligning unit 1012 aligns the printed wiring board 110 supplied from the board supplying unit 1011. The tablet supply unit 1013 supplies the sealing resin tablet into the resin storage unit placed on the substrate transfer unit 1022 of the inloader carrier 1023 described later. The heat sink distributor 1014 arranges the heat sinks 130 arranged in columns and rows in two rows in accordance with the arrangement of the resin sealing molds 40.

The resin sealing device 1000 includes an inloader carrier 1023 and a press unit 1024. The inloader carrier 1023 includes a heat sink transport unit 1021 (mounting device transport device) that transports the heat sink and a substrate transport unit 1022 (electronic component transport device) that transports the printed wiring board 110.
The heat sink transport unit 1021 receives the heat sinks 130 arranged in two rows on the heat sink distribution unit 1014 and transports them to the mold unit 1025 of the press unit 1024. The board conveyance unit 1022 receives the printed wiring boards 110 arranged in two rows on the board alignment unit 1012 and conveys them to the mold unit 1025 of the press unit 1024. The press unit 1024 clamps the resin sealing mold 40 including an upper mold and a lower mold to seal the semiconductor element.

Furthermore, the resin sealing device 1000 includes an unloader carrier 1032, a digger unit 1033, and a product storage unit 1034. The unloader carrier 1032 includes a product transport unit 1031 that transports a molded product after resin sealing.
The product transport unit 1031 picks up the molded product in which the semiconductor element 120 is sealed and transports the molded product to the digger unit 1033. The digator part 1033 removes unnecessary resin parts (for example, resin parts such as a cull part and a runner part) from the molded product in which the semiconductor element 120 is sealed. The product storage unit 1034 transports and stores the molded product from the digger unit 1033 by a product transport unit (not shown).

Here, the heat sink transport unit 1021, the substrate transport unit 1022, and the product transport unit 1031 will be described in detail based on the drawings.
As shown in FIG. 4, the heat sink conveyance unit 1021 includes an apparatus main body 1021 a and a stage 1021 b on which the heat sink 130 is placed. In addition, the heat sink conveying portion 1021 is formed with a fitting convex portion 1021c (third uneven portion) that fits into the fitting concave portion 241 of the upper mold set block 240. The entire heat sink transport unit 1021 is raised or lowered and horizontally moved by an elevating device (not shown), and the stage 1021b is raised or lowered.

  As shown in FIG. 8, the board transport unit 1022 includes an apparatus main body 1022 a and a support arm 1022 b that supports the printed wiring board 110 from below. In addition, the board conveying portion 1022 is formed with a fitting recess 1022 c (fourth uneven portion) that fits into the fitting protrusion 321 of the lower chess block 320. The entire substrate transport unit 1022 is moved up or down and horizontally moved by a lifting device (not shown).

  As shown in FIG. 14, the product transport unit 1031 includes an apparatus main body 1031a and a support arm 1031b that supports the printed wiring board 110 from below. The product transport unit 1031 ascends or descends as a whole and moves horizontally by a lifting device (not shown).

  As shown in FIG. 4, the mold part 1025 of the resin sealing device 1000 is a resin sealing mold composed of an upper mold 20 (first mold) and a lower mold 30 (second mold). 40.

The upper mold 20 includes a suction block 210, an upper mold cavity block 220, an upper mold chess block 230, and an upper mold set block 240.
The suction block 210 and the upper mold cavity block 220 are combined together, and a recess 211 that becomes a cavity CV is formed by clamping the mold with the lower mold 30.
Further, a suction hole 212 is formed in the suction block 210 from the concave portion 211 to the opposite side. The suction hole 212 is connected to a pipe that leads to an exhaust device (not shown). A plurality of suction holes 212 are arranged in a circular shape centered on the heat sink 130.
A convex portion 213 is formed in the concave portion 211. The convex portion 213 is formed in a contour shape of the heat sink 130 at a position corresponding to the outer peripheral portion of the heat sink 130. The convex portion 213 functions as a restricting portion that comes into contact with the outer peripheral portion of the heat sink 130 as a mounting body and restricts the suction position of the heat sink 130.

The upper mold chess block 230 is a frame that surrounds the suction block 210 and the upper mold cavity block 220.
The upper mold set block 240 is provided on the fitting surface side with the lower mold 30 of the upper mold chess block 230. The upper mold set block 240 is formed with a fitting recess 241 (first concavo-convex section) that fits into each of the lower mold 30 and the heat sink transport section 1021.

  The lower mold 30 includes a lower mold cavity block 310 and a lower mold chess block 320. The lower mold cavity block 310 is formed with a flat portion 311 on which the printed wiring board 110 is disposed. Further, the lower mold chess block 320 is formed with a fitting convex part 321 (second uneven part) that fits into the fitting concave part 241 of the upper mold set block 240.

The operation and use state of the resin sealing apparatus 1000 according to the embodiment of the present invention configured as described above will be described with reference to the drawings.
In describing the operation and use state of the resin sealing device 1000, it is assumed that the heat sink 130 arranged by the heat sink distribution unit 1014 has already been received by the heat sink transport unit 1021. In addition, when the printed wiring board 110 is disposed in the resin sealing mold 40, it is assumed that the printed wiring board 110 is pulled from the board alignment unit 1012 to the substrate transport unit 1022.

As shown in FIG. 4, the heat sink conveyance unit 1021 on which the heat sink 130 is mounted moves to below the upper mold 20.
As shown in FIG. 5, the lifting device (not shown) raises the heat sink conveyance portion 1021, so that the fitting convex portion 1021 c of the heat sink conveyance portion 1021 fits with the fitting convex portion 321 of the lower mold chess block 320. It fits into the fitting recess 241 of the upper mold set block 240 for fitting.

Since the fitting convex portion 1021c that fits into the fitting concave portion 241 is formed in the heat sink conveyance portion 1021, the heat sink 130 that the heat sink conveyance portion 1021 conveys when the lifting device lifts the heat sink conveyance portion 1021. The suction block 210 and the upper mold cavity block 220 can be accurately positioned.
In addition, a fitting convex portion 1021c that fits into the fitting concave portion 241 of the upper mold set block 240 that is used for positioning when the upper mold 20 and the lower mold 30 are clamped is formed on the heat sink conveyance section 1021. Therefore, it is not necessary to newly provide a fitting recess in the upper mold 20 for positioning with respect to the upper mold 20 of the heat sink conveyance unit 1021.

Then, the stage 1021b is raised by moving the support leg 1021d of the stage 1021b to the suction block 210 side by a lifting / lowering device (not shown) into the recess 211 formed by the suction block 210 and the upper mold cavity block 220.
When the stage 1021b is raised and the heat sink 130 is in contact with the suction block 210, an exhaust device (not shown) is operated and degassed from the suction hole 212, whereby the heat sink 130 is sucked by the suction block 210. .

At this time, as shown in FIG. 6, the inner side surface 213 a of the convex portion 213 protruding from the concave portion 211 is in contact with the standing wall portion 133 a of the step portion 133 of the heat sink 130, and the tip end surface 213 b of the convex portion 213 is the step portion 133. The convex part 213 contacts the outside of the step part 133 by contacting the flat part 133b.
By doing so, even when the position of the heat sink 130 is slightly deviated from the sealed position when the stage 1021b is raised, the heat sink 130 is adsorbed while correcting the position within the range surrounded by the convex portion 213. Is done. As described above, since the protrusions 213 come into contact with the outer peripheral portion of the heat sink 130, the suction position of the heat sink 130 is regulated, so that the heat sink 130 is accurately connected to the suction block 210 and the upper mold cavity block 220 (see FIG. 5). It can be located in the recess 211 formed in.

A plurality of suction holes 212 are formed in the suction block 210. For example, when the heat sink 130 is sucked through one suction hole having a large tube diameter and is sucked into the suction block 210, the suction force is reduced to one by the suction force when dispersed in the plurality of suction holes 212. Since it is necessary to aggregate, it becomes a strong suction force. Further, when the heat sink 130 is sucked with a single suction hole having a large tube diameter, the suction range per suction hole in the top surface 132 of the heat sink 130 is wider than when the heat sink 130 is dispersed in the plurality of suction holes 212. Become. Therefore, the top surface 132 is easily bent. Therefore, if a wide range of the top surface 132 of the heat sink 130 is attracted to the suction block 210 with a strong suction force, the suction range of the heat sink 130 may be recessed, and the traces of the suction holes may be attached to the heat sink 130.
However, since the plurality of suction holes 212 are formed in the suction block 210, the suction force for sucking the heat sink 130 can be dispersed in the plurality of suction holes 212. Accordingly, it is possible to prevent the suction hole 212 from being attached to the heat sink 130.

As described above, first, the alignment of the heat sink conveying portion 1021 shown in FIG. 5 is performed by fitting the fitting convex portion 1021c of the heat sink conveying portion 1021 and the fitting concave portion 241 of the upper mold set block 240, By correcting the positional deviation of 130 with the convex part 213 and aligning the heat sink 130 in stages, the positioning accuracy of the suction block 210 and the heat sink 130 can be improved.
Next, as shown in FIG. 7, when the heat sink 130 is attracted to the upper mold 20, the heat sink conveyance unit 1021 moves down and then moves horizontally and retracts from a position below the upper mold 20.

Next, as shown in FIG. 8, the printed wiring board 110 on which the semiconductor element 120 is mounted and the wires 121 are wired is transferred to the lower mold 30 by the board transfer unit 1022.
As shown in FIG. 9, the substrate transport unit 1022 is lowered by a driving device (not shown). At this time, the fitting recess 1022 c of the substrate transport unit 1022 is fitted with the fitting protrusion 321 of the lower chess block 320. Further, the pair of support arms 1022b of the substrate transport unit 1022 are moved away from each other by a driving device (not shown), so that the printed wiring board 110 is disposed on the flat portion 311 of the lower mold cavity block 310.
The printed wiring board 110 can be disposed at a predetermined position of the lower mold cavity block 310 by fitting the fitting recess 1022c of the board transport section 1022 to the fitting convex section 321 of the lower mold chess block 320. . Positioning pins (not shown) are provided on the lower mold 30 and are fitted into positioning holes (not shown) formed in the printed wiring board 110, thereby improving positioning performance.

Therefore, as shown in FIG. 5, the heat sink 130 is arranged by fitting the fitting convex portion 1021c of the heat sink conveying portion 1021 into the fitting concave portion 241 of the upper mold set block 240, and as shown in FIG. Since the printed wiring board 110 is arranged by fitting the fitting concave portion 1022c of the conveying portion 1022 to the fitting convex portion 321 of the lower mold chess block 320, the printed wiring board 110 is accurately positioned with respect to the heat sink 130. Can be positioned.
In addition, a fitting recess 1022 c that fits into the fitting protrusion 321 of the lower mold chess block 320 that is used for positioning when the upper mold 20 and the lower mold 30 are clamped is formed in the substrate transport section 1022. Therefore, it is not necessary to newly provide a fitting protrusion on the lower mold 30 for alignment with the lower mold 30 of the substrate transport unit 1022.

  As shown in FIG. 10, when the printed wiring board 110 is disposed on the flat part 311 of the lower mold cavity block 310, the board transfer part 1022 moves up and then moves horizontally, as shown in FIG. Retreat from a position above 30.

Next, as shown in FIG. 12, the upper mold 20 and the lower mold 30 are clamped by bringing one of the upper mold 20 and the lower mold 30 close to the other mold. At this time, the fitting concave part 241 of the upper mold set block 240 and the fitting convex part 321 of the lower mold chess block 320 are fitted.
When the upper mold 20 and the lower mold 30 are clamped, the heat sink 130 in the state of being adsorbed in the recess 211 formed by the adsorption block 210 and the upper mold cavity block 220 is not limited to the semiconductor element 120 and the wire 121. The printed wiring board 110 is disposed in a non-contact state. As described above, according to the present invention, the heat sink 130 can be attached to the suction block 210 and the upper mold cavity even if there is no leg portion in contact with the printed wiring board as in a conventionally used heat sink (see, for example, Patent Document 1). Since the state is adsorbed to the recess 211 formed in the block 220, a space S1 into which a sealing resin is injected is formed between the heat sink 130, the printed wiring board 110, and the semiconductor element 120.

Then, a plunger (not shown) moves up in a pot (not shown) of the lower mold 30 by an elevating device, so that the sealing resin supplied into the pot of the lower mold 30 by the inloader carrier 1023 becomes a cull portion ( Further, when the plunger is raised, the sealing resin for the cull portion is injected into the cavity CV via the resin passage.
As a result, the injection of the sealing resin into the cavity CV is completed, and the semiconductor element 120 and the wire 121 are covered with the sealing resin 140 and molded to form the semiconductor device 150 (see FIG. 13) which is a molded product. .

As shown in FIG. 12, since the heat sink 130 is in close contact with the recess 211 formed by the suction block 210 and the upper mold cavity block 220, the semiconductor device 150 includes the top of the heat sink 130 as shown in FIG. Sealing is performed with the surface 132 exposed. Since the convex portion 213 protruding into the concave portion 211 is formed corresponding to the contour shape of the heat sink 130, the convex portion 213 not only contributes to the alignment of the heat sink 130 attracted to the suction block 210, but also the heat sink 130. Between the top surface 132 and the recess 211, the flow of the sealing resin 140 about to enter can be stopped.
Further, as shown in FIG. 6, since the convex portion 213 is in contact with the stepped portion 133 of the heat sink 130 from the outside, a path for the sealing resin 140 to enter the top surface 132 of the heat sink 130 becomes long. Intrusion of the sealing resin 140 can be reliably prevented.

  As shown in FIG. 14, the upper mold 20 and the lower mold 30 are opened by separating either the upper mold 20 or the lower mold 30 from the other. And as shown in FIG. 14, the product conveyance part 1031 moves horizontally between the upper mold | type 20 and the lower mold | type 30 by which the mold was opened, it descend | falls with the raising / lowering apparatus which is not shown in figure, and it lowers from the lower mold | type 30 with the support arm 1031b. The semiconductor device 150 is taken out. When the semiconductor device 150 is taken out and held by the support arm 1031b, the product transport unit 1031 moves up and then moves horizontally to transport the semiconductor device 150 to the digger unit 1033.

  As shown in FIG. 13, the heat sink 130 of the semiconductor device 150 in which the semiconductor element 120 is resin-sealed is formed with a flange portion 134 having an inclined surface. Therefore, the heat sink 130 is sealed with the sealing resin 140 in a state where the top surface 132 is exposed from the sealing resin 140 and the flange 134 is embedded in the sealing resin 140. Therefore, it is possible to prevent the heat sink 130 from being peeled off from the sealing resin 140.

  Thus, the heat sink 130 does not have a leg portion that stands on the printed wiring board 110 and supports the heat sink 130. Therefore, the heat sink 130 can be formed with a simple structure. The resin sealing mold 40 and the resin sealing device 1000 using the same seal the heat sink 130 that can be formed with a simple structure while maintaining heat dissipation, together with the semiconductor element 120. can do.

  Further, since the heat sink 130 does not have a leg portion, even if the height of the semiconductor element 120 changes, if the concave portion 211 formed by the suction block 210 and the upper mold cavity block 220 is raised, the heat sink 130 remains as it is. Can be used. Therefore, it is not necessary to change the heat sink 130 according to the height of the semiconductor device.

  In addition, when the heat sink is supported on the printed wiring board by the legs, the legs are fixed to the printed wiring board by an adhesive, so the legs may be affected by differences in expansion due to thermal stress or softening or deterioration of the adhesive. I am worried about peeling of the part. However, since the heat sink 130 does not have a leg portion, the heat sink 130 is not affected by the heat sink 130 even when heated, and thus the semiconductor device 150 has high heat resistance.

  In this embodiment, the convex portion 213 protruding from the concave portion 211 formed by the suction block 210 and the upper mold cavity block 220 is formed corresponding to the contour shape of the heat sink 130. In order to achieve this, it is only necessary that the protrusions protrude at several locations around the heat sink 130. However, by forming the convex portion 213 corresponding to the contour shape of the heat sink 130, it is possible to prevent the sealing resin from entering the top surface 132 side of the heat sink 130, so that the convex portion 213 has the contour shape of the heat sink 130. It is desirable that it is formed.

In the present embodiment, the fitting recess 241 is formed in the upper mold set block 240, the fitting protrusion 321 is formed in the lower chess block 320, and the fitting protrusion 1021c is formed in the heat sink transport section 1021. A fitting recess 1022c is formed in the substrate transfer unit 1022. On the contrary, the upper mold set block 240 is formed with a fitting convex part, the lower mold chess block 320 is formed with a fitting concave part, the heat sink conveying part 1021 is formed with a fitting concave part, and the board conveying part 1022 The fitting convex part may be formed.
However, if the second concavo-convex portion formed in the lower chess block 320 is a fitting recess, excess resin such as a resin beam generated during resin sealing may enter the recess of the fitting recess and accumulate. is there. If it becomes so, the precision of position alignment with each of the lower mold | type chess block 320, the upper mold | type set block 240, the heat sink conveyance part 1021, or the board | substrate conveyance part 1022 will fall. Therefore, it is desirable that the second concavo-convex portion formed on the lower chess block 320 is a fitting convex portion 321.

In the present embodiment, the heat sink is described as an example of the mounting body. However, if the top surface of the mounting body (the contact surface with the upper mold) is exposed and sealed together with the electronic component, The present invention can be applied as a mounting body.
In the present embodiment, as the mold part 1025 of the resin sealing device 1000, the first mold is described as the upper mold 20 and the second mold is defined as the lower mold 30, but the first mold is The lower mold and the second mold may be the lower mold, and all may be reversed.
Moreover, in this Embodiment, the resin sealing apparatus 1000 by the transfer molding method was demonstrated to the example. However, according to the present invention, an electronic component mounted on a base is disposed in a cavity formed by clamping the first mold and the second mold, and a sealing resin is injected into the cavity. If the electronic component is sealed, it can be adopted.
Furthermore, in the present embodiment, the printed wiring board is described as an example of the base body. However, for example, the base body may be a lead frame formed of a metal plate.

  In the present invention, an electronic component mounted on a base body is clamped by a first mold and a second mold, a sealing resin is injected into the cavity, and the mounting resin is used together with the mounting body by the sealing resin. It is suitable for resin sealing of a molded product in which components are sealed.

20 Upper mold 210 Adsorption block 211 Concave part 212 Suction hole 213 Convex part (regulation part)
213a Inner surface 213b Tip surface 220 Upper mold cavity block 230 Upper mold chess block 240 Upper mold set block 241 Fitting recess 30 Lower mold 310 Lower mold cavity block 311 Flat part 320 Lower mold chess block 321 Fitting convex part 40 Resin sealing Mold CV Cavity S1 Space 110 Printed Wiring Board 120 Semiconductor Element 121 Wire 130 Heat Sink 131 Heat Sink Main Body 132 Top Surface 133 Stepped Part 133a Standing Wall Part 133b Flat Part 134 Kite Part 140 Sealing Resin 150 Semiconductor Device 1000 Resin Sealing Device 1011 Substrate supply unit 1012 Substrate alignment unit 1013 Tablet supply unit 1014 Heat sink distribution unit 1021 Heat sink transfer unit 1021a Device main body 1021b Stage 1021c Fitting convex portion 1021 d Support leg 1022 Substrate transport part 1022a Device main body 1022b Support arm 1022c Fitting recess 1023 Inloader carrier 1024 Press part 1025 Mold part 1031 Product transport part 1031a Device main body 1031b Support arm 1032 Unloader carrier 1033 Degger part 1034 Product storage part

Claims (13)

An electronic component mounted on a base is disposed in a cavity formed by clamping the first mold and the second mold, and a sealing resin is injected into the cavity. In a mold for resin sealing that seals
A suction hole for adsorbing a mounting body mounted on the electronic component to the first mold is formed in the first mold,
The mounting body is adsorbed by the suction holes, the mounting body is disposed in a non-contact state with respect to the base, and the sealing resin is injected between the mounting body and the electronic component. A space is formed ,
The first mold is formed with a first concavo-convex portion that fits with a third concavo-convex portion formed in a mounting body transport device that transports the mounting body to the first mold,
A mold for resin sealing , wherein the second mold is formed with a second concavo-convex portion that fits into the first concavo-convex portion when the mold is clamped to the first mold.   2. The mold for resin sealing according to claim 1, wherein the first mold is formed with a regulating portion that contacts an outer peripheral portion of the mounting body and regulates an adsorption position of the mounting body.   The resin sealing mold according to claim 2, wherein the restricting portion is a convex portion corresponding to a contour shape of the mounting body.   4. The resin sealing mold according to claim 3, wherein the convex portion comes into contact with a stepped portion from the attracted surface of the mounting body formed on the periphery of the mounting body from the outside. Said second concave-convex portion, said when the electronic component is conveyed by the electronic component transporting apparatus, a resin sealing according to claim 1, wherein mating with a fourth uneven part formed on the electronic component transporting apparatus Mold.   The resin sealing mold according to claim 1, wherein a plurality of the suction holes are formed. An electronic component mounted on the base is placed in a cavity formed by clamping the first mold and the second mold, and a sealing resin is injected into the cavity. In a resin sealing device for sealing the electronic component,
A suction hole for adsorbing a mounting body mounted on the electronic component to the first mold is formed in the first mold,
The mounting body is adsorbed by the suction holes, the mounting body is disposed in a non-contact state with respect to the base, and the sealing resin is injected between the mounting body and the electronic component. A space is formed ,
The first mold is provided with a first uneven portion,
The second mold is formed with a second concavo-convex portion that fits into the first concavo-convex portion when clamped with the first mold,
A resin sealing device provided with a mounting body transporting device in which a third concavo-convex portion is formed to be fitted to the first concavo-convex portion when the mounting body is transported to the first mold . The resin sealing device according to claim 7, wherein the first mold is formed with a restricting portion that contacts an outer peripheral portion of the mounting body and restricts an adsorption position of the mounting body. The resin sealing device according to claim 8 , wherein the restricting portion is a convex portion corresponding to a contour shape of the mounting body. The resin sealing device according to claim 9 , wherein the convex portion comes into contact with a step portion from an attracted surface of the mounting body formed on a peripheral edge of the mounting body from the outside. 8. The resin sealing according to claim 7, further comprising: a transport device for an electronic component in which a fourth uneven portion that fits with the second uneven portion is formed when the electronic component is transported to the second mold. apparatus. The resin sealing device according to claim 7 , wherein a plurality of the suction holes are formed. An electronic component mounted on the base is placed in a cavity formed by clamping the first mold and the second mold, and a sealing resin is injected into the cavity. In the manufacturing method of a molded product for manufacturing the molded product by sealing the electronic component,
A mounting body mounted on the electronic component via a sealing resin is transported to the first mold by a mounting body transport device , and the first uneven portion formed on the first mold and the A step of fitting the third concavo-convex portion formed in the transport device for mounting body ;
The mounting resin is attracted to the first mold by suction from a suction hole formed in the first mold, and the sealing resin is interposed between the mounting body and the electronic component. Disposing the mounting body in a non-contact state with respect to the base body in order to form a space into which is injected,
The first concavo-convex portion formed on the first mold on which the electronic component is disposed and the second concavo-convex portion formed on the second mold are fitted and clamped to form the cavity. Injecting a sealing resin;
A method of manufacturing a molded article, comprising: opening the first mold and the second mold, and releasing a molded article in which the electronic component is resin-sealed.

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