JP5969663B2 - Peeling device, peeling system and peeling method - Google Patents

Description

  The disclosed embodiments relate to a peeling apparatus, a peeling system, and a peeling method.

  In recent years, for example, in the semiconductor device manufacturing process, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport or polishing process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed.

  For example, in Patent Document 1, the semiconductor substrate is held using the first holding unit, the support substrate is held using the second holding unit, and the outer peripheral portion of the second holding unit is moved in the vertical direction. A technique for peeling a support substrate from a semiconductor substrate is disclosed.

JP2012-69914A

  However, the above-described conventional technology has room for further improvement in terms of increasing the efficiency of the peeling process. Such a problem is a problem that may also occur in a manufacturing process such as SOI (Silicon On Insulator) that involves peeling of the substrate.

  An object of one embodiment is to provide a peeling apparatus, a peeling system, and a peeling method that can improve the efficiency of a peeling process.

  A peeling apparatus according to an aspect of the embodiment includes a holding unit, a plurality of suction moving units, a peeling attraction unit, a push-down unit, a state detection unit, and a control unit. The holding unit holds the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate. The plurality of adsorption moving units adsorb the second substrate among the superposed substrates and move the second substrate in a direction away from the plate surface of the first substrate. The exfoliation inducer forms a part on the side surface on the one end side of the superposed substrate that causes the second substrate to exfoliate from the first substrate. The push-down portion is disposed above the peeling inducement portion and pushes down a dicing frame in which the superposed substrate is stuck to a sticking member that is stretched in an opening having a larger diameter than the superposed substrate. The state detection unit detects a peeling state of the second substrate from the first substrate. The controller moves the suction movement so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate based on the peeling state detected by the state detection unit. The operation timing of the unit is controlled.

  According to one aspect of the embodiment, the efficiency of the peeling process can be improved.

FIG. 1A is a schematic plan view showing the configuration of the peeling system according to the first embodiment. FIG. 1B is a schematic side view of a polymerization substrate. FIG. 2A is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 2B is a schematic side view of the superposed substrate held by the dicing frame. FIG. 2C is a schematic enlarged view around the dicing frame in FIG. 2B. FIG. 3A is a schematic side view showing the configuration of the peeling apparatus according to the first embodiment. FIG. 3B is a partially enlarged schematic side view showing a partially enlarged configuration of the peeling apparatus shown in FIG. 3A. FIG. 4A is an operation explanatory diagram of the peeling attraction process. FIG. 4B is an operation explanatory diagram of the peeling attraction process. FIG. 4C is an operation explanatory diagram of the peeling attraction process. FIG. 5 is a schematic plan view showing the positional relationship between the support substrate and the suction pads of the first to third suction moving units. FIG. 6 is a flowchart showing a processing procedure of the peeling process. FIG. 7A is an explanatory diagram of a peeling operation by the peeling device. FIG. 7B is an explanatory diagram of the peeling operation by the peeling device. FIG. 7C is an explanatory diagram of a peeling operation by the peeling device. FIG. 7D is an explanatory diagram of a peeling operation by the peeling device. FIG. 7E is an explanatory diagram of the peeling operation by the peeling device. FIG. 7F is an explanatory diagram of a peeling operation by the peeling device. FIG. 7G is an explanatory diagram of a peeling operation by the peeling device. FIG. 7H is an explanatory diagram of a peeling operation by the peeling device. FIG. 7I is an explanatory diagram of the peeling operation by the peeling device. FIG. 8A is a schematic plan view showing a modification of the second holding unit. FIG. 8B is a schematic plan view illustrating a modification of the second holding unit. FIG. 8C is a schematic plan view illustrating a modification of the second holding unit. FIG. 9 is a schematic plan view showing the positional relationship between the support substrate, the suction pads of the first to third suction moving units, and the peeling completion detection unit in a modification of the peeling device according to the first embodiment. FIG. 10 is a flowchart showing a processing procedure of the peeling process based on the detection result of the peeling completion detection unit. FIG. 11 is a schematic plan view showing the positional relationship between the support substrate, the suction pads of the first to third suction moving units, and the state detection unit in the peeling system according to the second embodiment. FIG. 12A is a schematic diagram illustrating a manufacturing process of an SOI substrate. FIG. 12B is a schematic diagram illustrating a manufacturing process of the SOI substrate.

  Hereinafter, embodiments of a peeling device, a peeling system, and a peeling method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<1. Peeling system>
First, the configuration of the peeling system according to the first embodiment will be described with reference to FIGS. 1A and 1B. FIG. 1A is a schematic plan view showing a configuration of a peeling system according to the first embodiment, and FIG. 1B is a schematic side view of a superposed substrate.

  In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  The peeling system 1 according to the first embodiment shown in FIG. 1A includes a polymerization substrate T (see FIG. 1B) in which a substrate to be processed W and a support substrate S are bonded with an adhesive G, and a substrate to be processed W and a support substrate. Peel to S.

  Hereinafter, as shown in FIG. 1B, the plate surface of the substrate W to be processed that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is referred to as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the target substrate W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 50 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 800 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. The thickness of the adhesive G that joins the substrate to be processed W and the support substrate S is about 10 to 150 μm.

  A dicing frame is attached to the superposed substrate T for protection. Here, the configuration of the dicing frame will be described with reference to FIGS. 2A to 2C. FIG. 2A is a schematic plan view of a superposed substrate T held by a dicing frame, and FIG. 2B is a schematic side view thereof. 2C is a schematic enlarged view around the dicing frame in FIG. 2B.

  As shown in FIGS. 2A and 2B, the dicing frame F is a substantially ring-shaped metal member in which an opening F1 having a larger diameter than the superposed substrate T is formed at the center. The thickness of the dicing frame F is about 1.5 mm.

  A sticking member called a dicing tape P is stretched in the opening F1 of the dicing frame F. Specifically, the peripheral portion of the dicing tape P is fixed to the back surface of the dicing frame F, so that the dicing tape P is stretched over the opening F1 of the dicing frame F.

  An adhesive layer is formed on the surface of the dicing tape P, and the polymerization substrate T is attached to the adhesive layer. As shown in FIG. 2C, the superposed substrate T has the back surface of the substrate W to be processed, that is, the non-bonded surface Wn attached to the surface of the dicing tape P. Thereby, the superposition | polymerization board | substrate T will be in the state hold | maintained at the dicing frame F via the dicing tape P. FIG.

  As shown in FIG. 1A, the peeling system 1 according to the first embodiment includes a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged in the X-axis direction in the order of the second processing block 20 and the first processing block 10.

  The first processing block 10 is a block that performs processing on the substrate held by the dicing frame F, specifically, the superposed substrate T or the target substrate W after peeling. The first processing block 10 includes a carry-in / out station 11, a first transfer area 12, a standby station 13, an edge cut station 14, a peeling station 15, and a first cleaning station 16.

  The second processing block 20 is a block that performs processing on a substrate that is not held by the dicing frame F, specifically, the support substrate S after being peeled off. The second processing block 20 includes a delivery station 21, a second cleaning station 22, a second transfer area 23, and a carry-out station 24.

  The first transfer area 12 of the first processing block 10 and the second transfer area 23 of the second processing block 20 are arranged side by side in the X-axis direction. In addition, on the Y axis negative direction side of the first transfer area 12, the carry-in / out station 11 and the standby station 13 are arranged side by side in the X-axis direction in the order of the carry-in / out station 11 and the standby station 13, and the second transfer area 23. An unloading station 24 is arranged on the Y axis negative direction side.

  Further, on the opposite side of the carry-in / out station 11 and the standby station 13 across the first transfer region 12, a peeling station 15 and a first cleaning station 16 are arranged in the X-axis direction in the order of the peeling station 15 and the first cleaning station 16. Are arranged side by side. In addition, the delivery station 21 and the second cleaning station 22 are arranged side by side in the X-axis direction in the order of the second cleaning station 22 and the delivery station 21 on the opposite side of the carry-out station 24 across the second transfer area 23. An edge cut station 14 is disposed on the positive X-axis direction side of the first transfer region 12.

  First, the configuration of the first processing block 10 will be described. At the carry-in / out station 11, the cassette Ct in which the superposed substrate T held in the dicing frame F is accommodated and the cassette Cw in which the substrate to be processed W after peeling are accommodated are carried in / out. The loading / unloading station 11 is provided with a cassette mounting table, and a plurality of cassette mounting plates 110a and 110b on which the cassettes Ct and Cw are respectively mounted are provided on the cassette mounting table.

  In the 1st conveyance area | region 12, the superposition | polymerization board | substrate T or the to-be-processed substrate W after peeling is conveyed. In the first transport region 12, a first transport device 31 that transports the superposed substrate T or the substrate W after being peeled is installed.

  The first transfer device 31 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. A substrate transfer device. The first transfer device 31 holds the substrate using the substrate holding unit and transfers the substrate held by the substrate holding unit to a desired place by the transfer arm unit.

  Note that the substrate holding unit provided in the first transfer device 31 holds the dicing frame F by suction or gripping to hold the superposed substrate T or the substrate to be processed W after being peeled substantially horizontally.

  The standby station 13 is provided with an ID reading device that reads an ID (Identification) of the dicing frame F, and the overlapped substrate T being processed can be identified by the ID reading device.

  In the standby station 13, in addition to the ID reading process described above, a standby process for temporarily waiting the superposed substrate T waiting for processing is performed as necessary. The standby station 13 is provided with a mounting table on which the superposed substrate T transferred by the first transfer device 31 is placed. The ID reading device and the temporary standby unit are placed on the mounting table. .

  In the edge cut station 14, an edge cut process is performed in which the peripheral edge portion of the adhesive G (see FIG. 1B) is dissolved and removed with a solvent. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S can be easily separated in the peeling process described later. The edge cut station 14 is provided with an edge cut device that dissolves the peripheral portion of the adhesive G with the solvent by immersing the polymerization substrate T in the solvent of the adhesive G.

  In the peeling station 15, a peeling process for peeling the superposed substrate T transported by the first transport device 31 into the target substrate W and the support substrate S is performed. The peeling station 15 is provided with a peeling device that performs a peeling process. The specific configuration and operation of such a peeling apparatus will be described later.

  In the first cleaning station 16, the substrate to be processed W after peeling is cleaned. The first cleaning station 16 is provided with a first cleaning device that cleans the substrate to be processed W after being peeled off while being held by the dicing frame F. As the first cleaning device, for example, a cleaning device described in JP2013-033395A can be used.

  In the first processing block 10, the ID reading process of the dicing frame F is performed at the standby station 13, the edge cut process of the superposed substrate T is performed at the edge cut station 14, and then the superposed substrate T is peeled off at the peeling station 15. I do. In the first processing block 10, the substrate to be processed W after separation is cleaned in the first cleaning station 16, and then the substrate to be processed W after cleaning is transferred to the carry-in / out station 11. Thereafter, the substrate to be processed W after cleaning is unloaded from the loading / unloading station 11.

  Next, the configuration of the second processing block 20 will be described. In the delivery station 21, a delivery process is performed in which the peeled support substrate S is received from the peeling station 15 and delivered to the second cleaning station 22. The delivery station 21 is provided with a third transport device 33 for holding and transporting the peeled support substrate S in a non-contact manner, and the delivery processing described above is performed by the third transport device 33.

  In the second cleaning station 22, a second cleaning process for cleaning the support substrate S after peeling is performed. The second cleaning station 22 is provided with a second cleaning device for cleaning the support substrate S after peeling. As such a second cleaning device, for example, a cleaning device described in JP2013-033925A can be used.

  In the second transfer region 23, the support substrate S cleaned by the second cleaning device is transferred. In the second transfer region 23, a second transfer device 32 that transfers the support substrate S is installed.

  The second transfer device 32 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. A substrate transfer device. The second transfer device 32 holds the substrate using the substrate holding unit, and transfers the substrate held by the substrate holding unit to the unloading station 24 by the transfer arm unit. The substrate holding unit provided in the second transfer device 32 is, for example, a fork that holds the support substrate S substantially horizontally by supporting the support substrate S from below.

  In the carry-out station 24, the cassette Cs in which the support substrate S is accommodated is carried in / out. The unloading station 24 is provided with a cassette mounting table, and a plurality of cassette mounting plates 24a and 24b on which the cassette Cs is mounted are provided on the cassette mounting table.

  In the second processing block 20, the support substrate S after peeling is transported from the peeling station 15 to the second cleaning station 22 via the delivery station 21 and cleaned in the second cleaning station 22. Thereafter, in the second processing block 20, the cleaned support substrate S is transported to the carry-out station 24, and the cleaned support substrate S is carried out from the carry-out station 24 to the outside.

  Further, the peeling system 1 includes a control device 40. The control device 40 is a device that controls the operation of the peeling system 1. The control device 40 is, for example, a computer, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 by reading and executing the program stored in the storage unit.

  Such a program may be recorded on a computer-readable recording medium and may be installed in the storage unit of the control device 40 from the recording medium. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  Next, operation | movement of the peeling system 1 mentioned above is demonstrated. First, the first transfer device 31 (see FIG. 1A) arranged in the first transfer region 12 of the first processing block 10 performs a process of loading the superposed substrate T into the standby station 13 based on the control of the control device 40. .

  Specifically, the first transport device 31 causes the substrate holding unit to enter the carry-in / out station 11, holds the superposed substrate T accommodated in the cassette Ct, and removes it from the cassette Ct. At this time, the superposed substrate T is held from above by the substrate holding portion of the first transfer device 31 with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface. Then, the first transport device 31 carries the superposed substrate T taken out from the cassette Ct into the standby station 13.

  Subsequently, in the standby station 13, the ID reading device performs an ID reading process for reading the ID of the dicing frame F based on the control of the control device 40. The ID read by the ID reading device is transmitted to the control device 40.

  Subsequently, based on the control of the control device 40, the first transport device 31 carries the superposed substrate T out of the standby station 13 and transports it to the edge cut station 14. In the edge cut station 14, the edge cut device performs an edge cut process based on the control of the control device 40. The edge portion of the adhesive G is removed by the edge cutting process, and the substrate to be processed W and the support substrate S are easily separated in the subsequent peeling process. Thereby, the time which a peeling process requires can be shortened.

  In the peeling system 1 according to the first embodiment, since the edge cut station 14 is incorporated in the first processing block 10, the superposed substrate T carried into the first processing block 10 is used using the first transfer device 31. It can be carried directly into the edge cut station 14. For this reason, according to the peeling system 1, the throughput of a series of substrate processing can be improved. Moreover, the time from the edge cut process to the peeling process can be easily managed, and the peeling performance can be stabilized. Note that the peeling system 1 does not necessarily include the edge cut station 14.

  Further, for example, when a superposed substrate T waiting for processing is generated due to a difference in processing time between apparatuses, the superposed substrate T can be temporarily kept waiting by using a temporary standby unit provided in the standby station 13, Loss time between a series of steps can be shortened.

  Subsequently, under the control of the control device 40, the first transport device 31 unloads the superposed substrate T after the edge cut processing from the edge cut station 14 and transports it to the peeling station 15. In the peeling station 15, the peeling device performs a peeling process based on the control of the control device 40.

  Thereafter, in the peeling system 1, the processing for the target substrate W after peeling is performed in the first processing block 10, and the processing for the supporting substrate S after peeling is performed in the second processing block 20. Note that the substrate to be processed W after peeling is held by the dicing frame F.

  First, in the first processing block 10, the first transport device 31 unloads the substrate to be processed W after the peeling from the peeling device based on the control of the control device 40 and transports it to the first cleaning station 16.

  Then, based on the control of the control device 40, the first cleaning device performs a processing substrate cleaning process for cleaning the bonding surface Wj of the processing target substrate W after peeling. By such a substrate cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed.

  Subsequently, based on the control of the control device 40, the first transfer device 31 carries out the processed substrate unloading process for unloading the cleaned substrate W from the first cleaning device and transporting it to the loading / unloading station 11. Thereafter, the substrate W to be processed is unloaded from the loading / unloading station 11 and collected. Thus, the process for the substrate to be processed W is completed.

  On the other hand, in the second processing block 20, the third transfer device 33 installed in the delivery station 21 performs delivery processing of the support substrate S after peeling based on the control of the control device 40. Specifically, the third transfer device 33 receives the support substrate S after peeling from the peeling device, and places the received support substrate S on the second cleaning device of the second cleaning station 22.

  Here, the support substrate S after peeling is in a state where the upper surface side, that is, the non-joint surface Sn side is held by the peeling device, and the third transport device 33 does not move the joint surface Sj side of the support substrate S from below. Hold in contact. The third transfer device 33 carries the held support substrate S into the second cleaning station 22, then reverses the support substrate S and places it on the second cleaning device. As a result, the support substrate S is placed on the second cleaning device with the bonding surface Sj facing upward. The second cleaning device performs a support substrate cleaning process for cleaning the bonding surface Sj of the support substrate S based on the control of the control device 40. The adhesive G remaining on the bonding surface Sj of the support substrate S is removed by the support substrate cleaning process.

  Subsequently, based on the control of the control device 40, the second transport device 32 carries out a support substrate carry-out process for carrying out the washed support substrate S from the second cleaning device and carrying it to the carry-out station 24. Thereafter, the support substrate S is unloaded from the unloading station 24 and collected. Thus, the process for the support substrate S is completed.

  As described above, the peeling system 1 according to the first embodiment is for the substrate front end (the carry-in / out station 11 and the first transfer device 31) held by the dicing frame F and for the substrate not held by the dicing frame F. The front end (the carry-out station 24 and the second transfer device 32) is provided. This makes it possible to perform in parallel the process of transporting the cleaned substrate W to the carry-in / out station 11 and the process of transporting the cleaned support substrate S to the carry-out station 24. Processing can be performed efficiently.

  In the peeling system 1 according to the first embodiment, the first processing block 10 and the second processing block 20 are connected by a delivery station 21. Thus, since the peeled support substrate S can be directly taken out from the peeling station 15 and carried into the second processing block 20, the peeled support substrate S can be smoothly transferred to the second cleaning device. it can.

  Therefore, according to the peeling system 1 which concerns on 1st Embodiment, the throughput of a series of substrate processing can be improved.

  Here, the superposed substrate T is carried in with being held by the dicing frame F. However, the present invention is not limited to this. For example, a mounting device for attaching the dicing frame F to the superposed substrate T is provided in the first processing block 10, the superposed substrate T to which the dicing frame F is not attached is carried in, and the superposed substrate T is provided inside the peeling system 1. It is good also as attaching the dicing frame F to. In this case, the edge cut station 14 may be moved to the second processing block 20, and the mounting device described above may be provided at the place where the edge cut station 14 was provided.

<2. Configuration of peeling apparatus>
Next, the structure of the peeling apparatus installed in the peeling station 15 and the peeling operation of the superposed substrate T performed using the peeling apparatus will be described. 3A is a schematic side view showing the configuration of the peeling device, and FIG. 3B is a partially enlarged schematic side view showing the configuration of the peeling device shown in FIG. 3A partially enlarged.

  As illustrated in FIG. 3A, the peeling device 5 includes a processing unit 100. A loading / unloading port (not shown) is formed on the side surface of the processing unit 100, and through this loading / unloading port, the superposed substrate T is loaded into the processing unit 100, and the target substrate W and the support substrate S after peeling are removed. Unloading from the processing unit 100 is performed. For example, an opening / closing shutter is provided at the loading / unloading exit, and the processing shutter 100 and other areas are partitioned by the opening / closing shutter, thereby preventing entry of particles. The carry-in / out port is provided on each of the side surface adjacent to the first transfer region 12 and the side surface adjacent to the delivery station 21.

  The peeling device 5 includes a first holding unit 110, a frame holding unit 120, a lower base unit 130, a rotary lifting mechanism 140, a second holding unit 150, an upper base unit 160, a positioning unit 170, and a push-down device. Part 180, peeling attraction part 190, and position adjustment part 200. These are arranged inside the processing unit 100.

  The first holding unit 110 holds the substrate W to be processed among the superposed substrates T from below, and the second holding unit 150 holds the support substrate S of the superposed substrates T from above. Then, the second holding unit 150 moves the held support substrate S in a direction away from the plate surface of the substrate W to be processed. Thereby, the peeling apparatus 5 peels the superposed substrate T into the support substrate S and the substrate W to be processed. Hereinafter, each component will be specifically described.

  The first holding unit 110 holds the substrate to be processed W constituting the superposed substrate T by suction through the dicing tape P.

  The first holding unit 110 includes a disk-shaped main body 111 and a support member 112 that supports the main body 111. The support member 112 is supported by the lower base portion 130.

  The main body 111 is made of a metal member such as aluminum. A suction surface 111 a is provided on the upper surface of the main body 111. The adsorption surface 111a has substantially the same diameter as the superposed substrate T, and comes into contact with the lower surface of the superposed substrate T, that is, the non-joint surface Wn of the substrate W to be processed. The adsorption surface 111a is formed of, for example, a porous body such as silicon carbide or a porous ceramic.

  Inside the main body 111, a suction space 111b communicating with the outside through the suction surface 111a is formed. The suction space 111b is connected to an intake device 114 such as a vacuum pump via an intake pipe 113.

  The first holding unit 110 uses the negative pressure generated by the intake air of the intake device 114 to adsorb the non-joint surface Wn of the substrate to be processed W to the adsorption surface 111a via the dicing tape P. As a result, the first holding unit 110 holds the substrate W to be processed. In addition, although the example in case the 1st holding | maintenance part 110 is a porous chuck | zipper was shown here, the 1st holding | maintenance part may be an electrostatic chuck etc., for example.

  A frame holding unit 120 that holds the dicing frame F from below is disposed outside the first holding unit 110. The frame holding unit 120 includes a plurality of suction pads 121 that suck and hold the dicing frame F, and a support member 122 that supports the suction pads 121.

  The suction pads 121 are formed of an elastic member such as rubber, and are provided at positions corresponding to, for example, four positions on the front, rear, left and right of the dicing frame F shown in FIG. 2A. In the above description, the suction pads 121 are provided at four locations. However, this is merely an example and is not limited, and may be, for example, three locations or less or five locations or more.

  The suction pad 121 is formed with an intake port (not shown), and an intake device 125 such as a vacuum pump is connected to the intake port via a support member 122 and an intake pipe 124. Further, the suction port of the suction pad 121 is positioned below the suction surface 111 a of the first holding unit 110 in the vertical direction.

  The column member 122 is supported by the lower base portion 130. The frame holding unit 120 configured as described above adsorbs the dicing frame F using the negative pressure generated by the intake air of the intake device 125. As a result, the frame holding unit 120 holds the dicing frame F.

  The lower base part 130 is disposed below the first holding part 110 and the frame holding part 120 and supports the first holding part 110 and the frame holding part 120. The lower base portion 130 is supported by a rotary lifting mechanism 140 fixed to the floor surface of the processing unit 100.

  The rotation elevating mechanism 140 rotates the lower base portion 130 around the vertical axis. Thereby, the 1st holding | maintenance part 110 and the frame holding | maintenance part 120 which were supported by the lower side base part 130 rotate integrally. Further, the rotary lifting mechanism 140 moves the lower base portion 130 in the vertical direction. Thereby, the 1st holding | maintenance part 110 and the flame | frame holding part 120 supported by the lower side base part 130 raise / lower integrally.

  Above the first holding unit 110, the second holding unit 150 is disposed to face the first holding unit 110. The second holding unit 150 includes a plurality of suction moving units. Specifically, the second holding unit 150 according to the first embodiment includes a first suction moving unit 210, a second suction moving unit 220, and a third suction moving unit 230. The first to third suction moving parts 210, 220, and 230 are supported by the upper base part 160. The upper base portion 160 is supported by the fixing member 101 attached to the ceiling portion of the processing unit 100 via the support column 102.

  The first suction moving unit 210 sucks and holds the peripheral edge of the support substrate S on the one end S1 side. The second suction moving unit 220 sucks and holds a region closer to the center of the support substrate S than the peripheral edge of the support substrate S. As will be described later, a plurality of, for example, two second suction moving units 220 are arranged in the X-axis direction. However, in FIGS. 3A and 3B, the second suction moving unit 220 on the back side of the drawing is omitted. .

  The third suction moving unit 230 sucks and holds the peripheral edge of the support substrate S on the other end S2 side. Then, the first to third suction moving units 210, 220, and 230 move the sucked and held regions in directions that are independently separated from the plate surface of the substrate W to be processed.

  The first suction moving unit 210 includes a suction pad 211, a support member 212, and a moving mechanism 213. Further, the second suction moving unit 220 includes a suction pad 221, a support member 222, and a moving mechanism 223. Similarly, the third suction moving unit 230 includes a suction pad 231, a support member 232, and a moving mechanism 233.

  The suction pads 211, 211, 231 are formed of an elastic member such as rubber. Each suction pad 211, 221, 231 is formed with an intake port (not shown), and an intake device 215, 225 such as a vacuum pump is connected to each intake port via intake pipes 214, 224, 234. , 235 are connected.

  The column members 212, 222, and 232 support the suction pads 211, 221, and 231 at the tip portions. The base end portions of the support members 212, 222, and 232 are supported by the moving mechanisms 213, 223, and 233. The moving mechanisms 213, 223, and 233 are fixed to the upper portion of the upper base portion 160, and move the column members 212, 222, and 232 in the vertical direction.

  The first to third suction moving units 210, 220, and 230 suck the support substrate S using negative pressure generated by the suction of the suction devices 215, 225, and 235. As a result, the first to third suction moving units 210, 220, and 230 hold the support substrate S.

  The first to third suction moving units 210, 220, and 230 hold the support substrate S and the support members 212, 222, and 232 and the suction pads 211, 221, and 231 are moved by the moving mechanisms 213, 223, and 233, respectively. Is moved along the vertical direction. Thereby, the support substrate S is moved along the vertical direction.

  The peeling apparatus 5 first operates the moving mechanism 213, then operates the moving mechanism 223, and finally operates the moving mechanism 233. That is, the peeling device 5 pulls the support substrate S first from the peripheral edge on the one end S1 side, then pulls the central part, and finally pulls the peripheral edge on the other end S2 side. Thereby, the peeling apparatus 5 peels the support substrate S from the to-be-processed substrate W gradually and continuously toward the other end S2 from the one end S1. The specific contents of this operation will be described later.

  A positioning unit 170 is disposed above the first holding unit 110. The positioning unit 170 is transported to the peeling station 15 by the first transport device 31, and positions the superposed substrate T placed on the first holding unit 110 at a predetermined position (for example, a position that coincides with the suction surface 111a). Center it.

  The positioning portions 170 are provided at positions corresponding to, for example, four positions on the front, rear, left and right of the outer periphery of the superposition substrate T shown in FIG. 2A. In addition, the place where the positioning part 170 is installed is not limited to the above-mentioned four places. For example, two places on the front and rear of the outer periphery of the superposed substrate T or two places on the left and right, and 120 at the center of the superposed substrate T. You may install in three places, or five places or more with the interval of the degree.

  The positioning unit 170 includes an arm unit 171 and a rotational movement mechanism 172, as well shown in FIG. 3B. The arm portion 171 is a long member, and a base end portion is rotatably connected to the rotational movement mechanism 172. Further, the length of the arm portion 171 in the longitudinal direction is a value such that, for example, the tip end portion comes into contact with the side surface of the superposed substrate T when the tip end portion is rotated by the rotational movement mechanism 172 until it is vertically downward. Set to

  The rotational movement mechanism 172 is fixed to the lower part of the upper base part 160, for example, and rotates the arm part 171 around the base end side. When the arm portion 171 of each positioning portion 170 is rotated by the rotational movement mechanism 172, the tip end portion of the arm portion 171 contacts the side surface of the superposed substrate T as indicated by an imaginary line in FIG. Thereby, the superposition | polymerization board | substrate T is positioned in a regular position. Thus, by providing the positioning unit 170, even if the superposed substrate T is placed on the first holding unit 110 in a state of being deviated from the specified position, the superposed substrate T is first held. It can be corrected by moving it to the correct position of the portion 110, specifically, for example, to a position that coincides with the suction surface 111a.

  A push-down unit 180 is disposed above each suction pad 121 of the frame holding unit 120. That is, the push-down portion 180 is disposed at a position corresponding to each suction pad 121, and specifically disposed at positions corresponding to, for example, four positions on the front, rear, left and right of the dicing frame F shown in FIG. 2A. In the above description, the push-down portions 180 are provided at the same four locations as the suction pads 121. However, this is an example, and may be changed according to the number of the suction pads 121.

  The above-described push-down unit 180 pushes the dicing frame F vertically downward and causes the suction pad 121 to suck the dicing frame F downward. Specifically, the suction port of the suction pad 121 is positioned below the suction surface 111a of the first holding unit 110 in the vertical direction as described above. Therefore, when the superposed substrate T transported to the peeling station 15 by the first transport device 31 is placed on the suction surface 111a of the first holding unit 110, between the dicing frame F and the suction pad 121, A gap is generated as much as the suction pad 121 is lowered. Therefore, the dicing frame F is pushed down to the suction pad 121 side by the push-down unit 180 so as to be sucked by the suction pad 121.

  Specifically, the push-down unit 180 includes a pressing pad 181, a support member 182, and a moving mechanism 183 as well shown in FIG. 3B.

  The pressing pad 181 is formed of an elastic member such as rubber. The support pad 182 has a pressing pad 181 connected to the tip. The base end portion of the column member 182 is supported by the moving mechanism 183. The moving mechanism 183 is fixed to the upper part of the upper base portion 160 and moves the column member 182 in the vertical direction.

  The push-down unit 180 moves the support member 182 and the pressing pad 181 along the vertical direction by the moving mechanism 183. Therefore, for example, when the support member 182 and the pressing pad 181 are moved vertically downward by the moving mechanism 183, the pressing pad 181 contacts the dicing frame F and presses the dicing frame F as indicated by an imaginary line in FIG. 3B. To move. Accordingly, the dicing frame F moves vertically downward and is sucked and held by the suction pad 121.

  As a result, on the side surface side of the superposed substrate T, a space into which a later-described peeling attraction portion 190 can enter is formed. As a result, the sharp member (described later) of the peeling attraction portion 190 can be brought into close contact with the side surface of the superposed substrate T, more precisely, the side surface of the support substrate S near the adhesive G.

  As illustrated in FIG. 3A, a peeling inducement unit 190 is disposed outside the second holding unit 150. The peeling inducement unit 190 forms a part that causes the support substrate S to peel from the substrate W to be processed on the side surface on the one end S1 side of the superposed substrate T.

  The peeling attraction part 190 includes a sharp member 191 and a moving mechanism 192. The sharp member 191 is, for example, a blade, and is supported by the moving mechanism 192 so that the tip protrudes toward the superposed substrate T. The sharp member 191 may be, for example, a razor blade, a roller blade, or an ultrasonic cutter.

  The moving mechanism 192 moves the sharp member 191 along a rail extending in the Y-axis direction. The peeling device 5 causes the sharp member 191 to abut on the side surface of the support substrate S near the adhesive G by moving the sharp member 191 using the moving mechanism 192. Thereby, the peeling apparatus 5 forms a part (hereinafter referred to as “a peeling start part”) that causes the support substrate S to peel from the substrate W to be processed on the side surface on the one end S1 side of the superposed substrate T.

  The moving mechanism 192 is supported from above by the position adjustment unit 200. The position adjustment unit 200 is fixed to, for example, the lower portion of the upper base unit 160 and moves the moving mechanism 192 along the vertical direction. Thereby, the height position of the sharp member 191, that is, the contact position with the side surface of the superposed substrate T can be adjusted.

  Here, the content of the peeling attraction process performed using the peeling attraction part 190 is demonstrated concretely with reference to FIG. 4A-FIG. 4C. 4A to 4C are operation explanatory diagrams of the peeling attraction process.

  In this peeling attraction process, the substrate W to be processed among the superposed substrates T is held by the first holding unit 110 (see FIG. 3A), the dicing frame F is held by the frame holding unit 120, and is supported. This is performed before the substrate S is held by the second holding unit 150. That is, the peeling attraction process is performed in a state where the support substrate S is free. Moreover, the peeling apparatus 5 performs the peeling induction process shown to FIG. 4A-FIG. 4C based on control of the control apparatus 40. FIG.

  The peeling device 5 adjusts the height position of the sharp member 191 using the position adjusting unit 200 and then moves the sharp member 191 toward the side surface of the superposed substrate T using the moving mechanism 192 (see FIG. 3A). Specifically, as shown in FIG. 4A, the sharp member 191 is moved substantially horizontally toward the side surface near the adhesive G of the support substrate S among the side surfaces on the one end S1 side of the superposed substrate T.

  The “side surface of the support substrate S near the adhesive G” is the side surface of the support substrate S that is closer to the bonding surface Sj than the position h1 that is half the thickness of the support substrate S. That is, the side surface of the support substrate S is formed in a substantially arc shape, and the “side surface of the support substrate S near the adhesive G” is sharp when the angle between the sharp member 191 and the bonding surface Sj is 0 degree. The angle θ formed with the member 191 is a side surface of 0 ° or more and less than 90 °.

  The peeling device 5 first advances the sharp member 191 to a predetermined position (preliminary advance). Thereafter, the peeling device 5 further advances the sharp member 191 to bring the sharp member 191 into contact with the side surface of the support substrate S near the adhesive G. Note that, for example, a load cell (not shown) is provided in the peeling inducement unit 190, and the peeling device 5 detects the load applied to the sharp member 191 using the load cell, so that the sharp member 191 is supported by the support substrate. Detecting contact with S.

  As described above, the side surface of the support substrate S is formed in a substantially arc shape. Therefore, when the sharp member 191 contacts the side surface of the support substrate S near the adhesive G, an upward force is applied to the support substrate S.

  Subsequently, as shown in FIG. 4B, the peeling device 5 further advances the sharp member 191. Thereby, the support substrate S is pushed upward along the curvature of the side surface. As a result, a part of the support substrate S is peeled off from the adhesive G, and a peeling start site M is formed.

  Since the support substrate S is not held by the second holding unit 150 and is in a free state, the upward movement of the support substrate S is not hindered. In this process, the distance a1 for moving the sharp member 191 forward is, for example, about 2 mm.

  Moreover, in the peeling apparatus 5, the confirmation apparatus which confirms the peeling state of the support substrate S by an above-described process, specifically, the confirmation apparatus (not shown) which confirms that the peeling start part M was formed is provided. You may comprise. Specifically, the confirmation device is, for example, an IR (Infrared) camera (not shown) installed above the support substrate S.

  Specifically, the reflectance of infrared rays varies depending on whether the support substrate S is peeled off from the substrate W to be processed or not. Therefore, first, the support substrate S is imaged by the IR camera, and image data showing a difference in the reflectance of infrared rays on the support substrate S is acquired. Then, the image data is transmitted to the control device 40, and the control device 40 can detect a part of the support substrate S that is peeled from the substrate W to be processed, that is, a peeling start part M.

  When the peeling start site M is detected in the control device 40, the peeling device 5 proceeds to the next process described later. On the other hand, when the peeling start site M is not detected in the control device 40, the peeling device 5 moves the sharp member 191 further forward or retracts the sharp member 191 once to separate it from the support substrate S, and thereafter in FIGS. 4A and 4B. The exfoliation start site M is formed by performing the illustrated operation again. Thus, the peeling start part M can be reliably formed by providing the confirmation apparatus which confirms the peeling state of the support substrate S, and operating the peeling apparatus 5 according to a peeling state.

  When the peeling start site M is formed, as shown in FIG. 4C, the peeling device 5 lowers the first holding unit 110 using the rotary lifting mechanism 140 (see FIG. 3A) while sharpening the member 191. To move further forward. Accordingly, a downward force is applied to the substrate W and the adhesive G, and an upward force is applied to the support substrate S supported by the sharp member 191. Thereby, the peeling start site | part M expands.

  In this process, the distance a2 for moving the sharp member 191 forward is, for example, about 1 mm.

  In this way, the peeling device 5 makes the peeling start site M that causes the support substrate S to be peeled from the target substrate W by contacting the sharp member 191 against the side surface of the support substrate S near the adhesive G. It can be formed on the side surface.

  The support substrate S has a thickness of about 5 to 15 times that of the adhesive G. Therefore, compared with the case where the sharpening member 191 is brought into contact with the adhesive G to form the peeling start portion, the vertical position control of the sharpening member 191 is easier.

  Further, the sharp member 191 is brought into contact with the side surface of the support substrate S near the adhesive G, whereby a force in the direction of peeling the support substrate S from the substrate W to be processed (that is, an upward force) is applied to the support substrate S. be able to. In addition, since the portion near the outermost edge portion of the support substrate S is lifted, a force in the direction of peeling the support substrate S from the substrate W can be efficiently applied to the support substrate S.

  Further, compared with the case where the sharp member 191 is abutted against the adhesive G, the possibility that the sharp member 191 contacts the substrate W to be processed can be reduced.

  The “side surface of the support substrate S near the adhesive G” is more preferably the side surface from the bonding surface Sj of the support substrate S to the position h2 that is ¼ of the thickness of the support substrate S, as shown in FIG. 4A. In other words, it is preferable that the angle θ formed with the sharp member 191 is a side surface of 0 degree or more and 45 degrees or less. This is because as the angle θ formed with the sharp member 191 is smaller, the force for lifting the support substrate S can be increased.

  Further, when the adhesive force between the support substrate S and the adhesive G is relatively weak, as shown in FIG. 4A, the peeling is started simply by bringing the sharp member 191 into contact with the side surface of the support substrate S near the adhesive G. Site M can be formed. In such a case, the peeling apparatus 5 can omit the operations shown in FIGS. 4B and 4C.

  When the adhesive force between the support substrate S and the adhesive G is relatively strong, the peeling device 5 further rotates the rotary lifting mechanism 140 from the state shown in FIG. 4C, for example, to hold the first holding unit 110 and the frame. For example, the unit 120 may be rotated 360 degrees around the vertical axis. Thereby, the peeling start site M is formed over the entire circumference of the bonding surface Sj of the support substrate S, and the support substrate S can be easily peeled from the substrate W to be processed.

  Next, arrangement | positioning etc. of the 1st-3rd adsorption | suction moving part 210,220,230 are demonstrated with reference to FIG. FIG. 5 is a schematic diagram showing the positional relationship among the support substrate S, the suction pad 211 provided in the first suction moving unit 210, the suction pad 221 provided in the second suction moving unit 220, and the suction pad 231 provided in the third suction moving unit 230. It is a top view.

  As shown in FIG. 5, the suction pad 211 provided in the first suction moving unit 210 sucks the peripheral edge portion on the one end S1 side of the support substrate S corresponding to the peeling start site M. In addition, a plurality of second suction moving parts 220 are arranged side by side in a direction (that is, the X-axis direction) that intersects a direction (that is, the Y-axis direction) from one end S1 to the other end S2 of the support substrate S, specifically, for example, Two are arranged in parallel. The suction pads 221 included in the second suction moving unit 220 suck the region between the one end S1 and the other end S2 of the support substrate S, specifically, the region closer to the center of the support substrate S than the peripheral portion on the one end S1 side. To do. Further, the suction pad 231 provided in the third suction moving unit 230 sucks the peripheral edge of the support substrate S on the other end S2 side.

  The suction pads 221 and 231 are formed to have substantially the same suction area, while the suction pad 211 is formed to have a smaller suction area than the suction pads 221 and 231. This is because by forming the suction pad 211 small, only the peripheral portion of the support substrate S corresponding to the portion where the peeling start site M is formed can be sucked and pulled up. Thereby, it can prevent that peeling force falls by adsorb | sucking and pulling up to the peripheral part in which the peeling start site | part M is not formed.

  The suction pad 211 is preferably formed smaller than the blade width in the X-axis direction of the sharp member 191, for example. Thereby, it can prevent reliably that the suction pad 211 adsorb | sucks the peripheral part of the support substrate S in which the peeling start site | part M is not formed. In other words, it is possible to accurately adsorb only the peripheral edge portion of the support substrate S on which the peeling start site M is formed. The suction pads 221 and 231 are formed larger than the blade width of the sharp member 191 in the X-axis direction.

  As shown in FIG. 5, the suction pads 211, 221, and 231 are arranged along the moving direction (Y-axis direction) of the sharp member 191. The peeling device 5 pulls up the suction pad 211 before the suction pads 221 and 231, and then pulls up the suction pad 221 before the suction pad 231, that is, pulls the support substrate S first from the peripheral edge on the one end S 1 side. Pull the suction pads 221 and 231 in this order. Thereby, the peeling apparatus 5 is made to peel the support substrate S from the to-be-processed substrate W gradually and continuously toward the other end S2 from the one end S1 through the central part vicinity.

  By the way, as described above, the support substrate S is gradually peeled from the substrate W to be processed from one end S1 to the other end S2. However, for example, when the region sucked by the second suction moving unit 220 of the support substrate S is not yet peeled from the substrate W to be processed, the second suction moving unit 220 sucks and lifts the support substrate S. If moved to, an excessive load acts on the second suction moving unit 220, and for example, the suction pad 221 may be detached from the support substrate S. The same applies to the third suction moving unit 230 when the region sucked by the third suction moving unit 230 of the support substrate S is not peeled off from the substrate W to be processed.

  Therefore, the peeling apparatus 5 according to the first embodiment includes a state detection unit that detects a peeling state of the support substrate S from the substrate W, and the control device 40 detects the peeling state detected by the state detection unit. Based on the above, the operation timing of the second and third suction moving units 220 and 230 is controlled so that the support substrate S is gradually separated from the substrate W to be processed from one end S1 to the other end S2 of the support substrate S. I made it.

  As a result, the support substrate S is sucked by the second and third suction moving units 220 and 230, and the operation of moving the support substrate S in the direction away from the plate surface of the substrate W to be processed can be performed at an appropriate timing. Therefore, it is possible to prevent an excessive load from acting on the second and third suction moving parts 220 and 230.

  Here, the state detection unit will be described in detail. As shown in FIG. 3A, the state detection unit according to the first embodiment is provided in, for example, the upper base unit 160, and measures the distances d1 and d2 from a predetermined measurement reference position to the support substrate S. 250. As the measurement units 240 and 250, for example, a laser displacement meter can be used. In FIG. 5, a portion corresponding to a position where the measurement units 240 and 250 are arranged on the support substrate S is indicated by a broken line.

  In the above description, the laser displacement meter is taken as an example of the measuring units 240 and 250. However, the present invention is not limited to this. For example, the distance d1 from a predetermined measurement reference position such as a capacitance sensor to the support substrate S is used. Any device can be used as long as d2 can be measured.

  As shown in FIG. 3B and FIG. 5, the measuring unit 240 is disposed at a position near the second suction moving unit 220 between the first suction moving unit 210 and the second suction moving unit 220. Specifically, the measurement unit 240 is provided close to a position above the region of the support substrate S that is sucked by the suction pad 221 of the second suction moving unit 220.

  As shown in FIGS. 3A and 5, the measuring unit 250 is disposed at a position near the third suction moving unit 230 between the second suction moving unit 220 and the third suction moving unit 230. Specifically, the measurement unit 250 is provided close to a position above the region of the support substrate S that is sucked by the suction pad 231 of the third suction moving unit 230. The measurement results of the measurement units 240 and 250 are transmitted to the control device 40.

  Based on the measurement results of the measurement units 240 and 250, the control device 40 determines whether or not the region adsorbed by the second adsorption movement unit 220 or the third adsorption movement unit 230 of the support substrate S is peeled from the substrate W to be processed. judge.

  Specifically, after the control device 40 moves the support substrate S in the direction away from the substrate W to be processed by the first suction moving unit 210, the distance d1 measured by the measurement unit 240 is equal to or greater than the threshold value D1. In this case, it is determined that the region sucked by the second suction moving unit 220 of the support substrate S has not yet been peeled from the substrate W to be processed. When the separation of the support substrate S progresses and the distance d1 becomes less than the threshold value D1, the control device 40 supports the support substrate S up to a predetermined position between the peripheral edge on the one end S1 side and the region near the center. Is determined to be peeled off. Precisely, the control device 40 determines that the region sucked by the second suction moving unit 220 of the support substrate S has been peeled from the substrate W to be processed. The threshold value D1 corresponds to the distance d1 when the region sucked by the second suction moving unit 220 of the support substrate S is peeled from the target substrate W.

  When the control device 40 determines that the above-described region has been peeled off from the substrate W, the control device 40 operates the second suction moving unit 220 that sucks the region to suck and hold the support substrate S. Move away from the plate surface. Thereby, it is possible to prevent an excessive load from acting on the second suction moving unit 220.

  Similarly, the control device 40 moves the support substrate S in the direction away from the target substrate W by the second suction moving unit 220, and then the distance d2 measured by the measurement unit 250 is equal to or greater than the threshold D2. It determines with the area | region adsorbed by the 3rd adsorption | suction movement part 230 of the support substrate S having not yet peeled from the to-be-processed substrate W. FIG. When the separation of the support substrate S progresses and the distance d2 becomes less than the threshold value D2, the control device 40 supports the support substrate up to a predetermined position between the region near the center and the peripheral edge on the other end S2 side. It is determined that S is peeled off. Precisely, the control device 40 determines that the region adsorbed by the third adsorption moving unit 230 of the support substrate S has been separated from the substrate W to be processed. The threshold value D <b> 2 corresponds to the distance d <b> 2 when the region sucked by the third suction moving unit 230 of the support substrate S is separated from the substrate W to be processed.

  When the control device 40 determines that the region attracted by the third suction moving unit 230 has been peeled off from the substrate W, the control device 40 operates the third suction moving unit 230 that sucks the region to support the support substrate S. Is moved away from the plate surface of the substrate W to be processed. Thereby, it is possible to prevent an excessive load from acting on the third suction moving unit 230.

  Specific contents of the above-described peeling operation will be described with reference to FIGS. 6 and 7A to 7I. FIG. 6 is a flowchart showing a processing procedure of the peeling process. 7A to 7I are explanatory diagrams of the peeling operation by the peeling device 5. FIG. Note that the peeling device 5 executes each processing procedure shown in FIG. 6 based on the control of the control device 40.

  First, the peeling device 5 is carried into the peeling station 15 by the first transport device 31 and centers the superposed substrate T placed on the first holding unit 110 by the positioning unit 170 (step S101). Thereby, the superposition | polymerization board | substrate T is positioned in the regular position of the 1st holding | maintenance part 110 (refer FIG. 7A).

  Next, the peeling device 5 uses the first holding unit 110 to suck and hold the substrate W to be processed through the dicing tape P (step S102). As a result, the substrate to be processed W is held on the superposed substrate T by the first holding unit 110.

  Subsequently, the peeling device 5 pushes down the dicing frame F vertically using the push-down unit 180, and sucks and holds the dicing frame F by the frame holding unit 120 (step S103). Thereby, a space in which the peeling inducement 190 can enter is formed on the side surface side of the superposed substrate T (see FIG. 7B).

  Thereafter, the peeling device 5 performs the peeling attraction process described with reference to FIGS. 4A to 4C while allowing the peeling attraction unit 190 to enter the above-described space (step S104). Thereby, the peeling start site | part M (refer FIG. 4B) is formed in the side surface by the side of the one end S1 of the superposition | polymerization board | substrate T (refer FIG. 7C).

  As described above, for example, when the adhesive force between the support substrate S and the adhesive G is relatively strong, the peeling device 5 further rotates the rotary elevating mechanism 140 in the process of S104, so that the first holding unit 110 is rotated. Alternatively, the frame holding unit 120 may be rotated, for example, 360 degrees around the vertical axis. Thereby, the peeling start site M is formed over the entire circumference of the bonding surface Sj of the support substrate S, and the support substrate S can be easily peeled from the substrate W to be processed.

  Subsequently, the peeling device 5 lowers the suction pads 211, 221, 231 of the first to third suction moving units 210, 220, 230 to the vicinity of the support substrate S (step S105, see FIG. 7D).

  Thereafter, the peeling device 5 suctions and holds the non-joint surface Sn of the support substrate S using the first suction moving unit 210 (step S106). As described above, the first suction moving unit 210 sucks and holds the peripheral edge on the one end S1 side of the support substrate S corresponding to the peeling start site M.

  Subsequently, the peeling device 5 raises the suction pad 211 of the first suction moving unit 210 (step S107). That is, the peeling device 5 pulls the peripheral edge portion on the one end S1 side of the support substrate S corresponding to the peeling start portion M. Thereby, the support substrate S starts to be continuously peeled from the substrate W to be processed from the peripheral edge portion toward the central portion (see FIG. 7E).

  Then, the peeling device 5 determines whether or not the distance d1 from the predetermined measurement reference position to the support substrate S measured by the measuring unit 240 is less than the threshold value D1 (step S108). When the distance d1 is equal to or greater than the threshold value D1 (No at Step S108), it is determined that the region sucked by the second suction moving unit 220 of the support substrate S has not yet been peeled off from the substrate W to be processed. Repeat the process.

  On the other hand, when the distance d1 is less than the threshold value D1 (step S108, Yes), it is determined that the region sucked by the second suction moving unit 220 of the support substrate S is peeled from the substrate W to be processed. Then, the peeling device 5 lowers the second suction moving unit 220 and sucks and holds the non-joint surface Sn of the support substrate S using the second suction moving unit 220 (step S109). As described above, the second suction moving unit 220 sucks and holds a region closer to the center than the peripheral edge on the one end S1 side of the support substrate S (see FIG. 7F).

  Thereafter, the peeling device 5 raises the suction pad 221 of the second suction moving unit 220 (step S110). That is, the peeling device 5 further pulls the vicinity of the center portion of the support substrate S while pulling the peripheral edge portion on the one end S1 side of the support substrate S (see FIG. 7G).

  Subsequently, the peeling device 5 determines whether or not the distance d2 from the predetermined measurement reference position to the support substrate S measured by the measuring unit 250 is less than the threshold value D2 (step S111). When the distance d2 is equal to or greater than the threshold value D2 (No in step S111), it is determined that the region sucked by the third suction moving unit 230 of the support substrate S has not yet been peeled off from the substrate W to be processed. Repeat the process.

  On the other hand, when the distance d2 is less than the threshold value D2 (step S111, Yes), it is determined that the region sucked by the third suction moving unit 230 of the support substrate S is peeled from the substrate W to be processed. Then, the peeling device 5 lowers the third suction moving unit 230 and holds the non-bonding surface Sn of the support substrate S by suction using the third suction moving unit 230 (Step S112). As described above, the third suction moving unit 230 sucks and holds the peripheral edge of the support substrate S on the other end S2 side (see FIG. 7H).

  Thereafter, the peeling device 5 raises the suction pad 231 of the third suction moving unit 230 (step S113). That is, the peeling device 5 further pulls the peripheral edge portion of the support substrate S on the other end S2 side while pulling the peripheral edge portion on the one end S1 side and the vicinity of the center portion of the support substrate S. As a result, the support substrate S is separated from the substrate W to be processed.

  Thereafter, the peeling device 5 leveles the support substrate S by raising only the second and third suction moving units 220 and 230, or lowering only the first and second suction moving units 210 and 220, and the like. The sharp member 191 is moved backward to complete the peeling process (see FIG. 7I).

  Thus, in the peeling apparatus 5 according to the first embodiment, after the first suction moving unit 210 moves the peripheral portion of the support substrate S away from the plate surface of the substrate W to be processed, The third suction moving units 220 and 230 move the central part and the other end S2 of the support substrate S in the direction away from the plate surface of the substrate W to be processed.

  Thereby, the superposition | polymerization board | substrate T can be peeled into the support substrate S and the to-be-processed substrate W, without applying big load with respect to the support substrate S. FIG.

  That is, for example, as in the technique described in Japanese Patent Publication No. 2007-526628, when a superposed substrate is peeled off by applying a tensile force to one peripheral portion of the superposed substrate as a fulcrum, the peeling proceeds. As a result, there is a problem that the support substrate is greatly warped. On the other hand, according to the peeling apparatus 5, peeling is performed using the first suction moving unit 210 that sucks and holds the peripheral portion of the support substrate S and the second suction moving unit 220 that sucks and holds the center portion of the support substrate S. By performing the operation, the peeling can be advanced while suppressing the deformation of the support substrate S.

  Moreover, in the peeling apparatus 5 which concerns on 1st Embodiment, it decided to control the operation timing of the 2nd, 3rd adsorption | suction movement parts 220 and 230 based on the peeling state detected by the state detection part. Thereby, for example, when the region adsorbed by the second adsorption moving unit 220 of the support substrate S is not yet peeled from the target substrate W, the second adsorption movement unit 220 adsorbs and pulls up the support substrate S. It is possible to prevent movement in the direction. As a result, an excessive load does not act on the second suction moving unit 220, and for example, the suction pad 221 does not come off the support substrate S.

  Note that the peeling device 5 may rotate the first holding unit 110 and the frame holding unit 120 by using the rotary lifting mechanism 140 after the target substrate W and the support substrate S are peeled off. Thereby, when there exists the adhesive G stuck across the support substrate S and the to-be-processed substrate W, this adhesive G can be threaded off.

  Further, the peeling device 5 may detect a load acting on the moving mechanisms 213, 223, and 233 when the support substrate S is peeled, and stop the peeling process in FIG. 6 halfway according to the detection result. Specifically, the peeling device 5 includes, for example, load cells (not shown) in the first to third suction moving units 210, 220, and 230, respectively, and moves the moving mechanism 213 when the support substrate S is sucked and peeled off. 223 and 233 detect the load received from the support substrate S. Then, when at least one of the detected loads of the moving mechanisms 213, 223, and 233 exceeds a threshold value, the peeling device 5 specifically has a load acting on the moving mechanisms 213, 223, and 233. If any of them increases excessively, the peeling process in FIG. 6 is stopped halfway. Accordingly, the first to third suction moving units 210, 220, and 230 do not separate the support substrate S from the substrate W to be processed with an excessive force, and thus, for example, prevent the polymerization substrate T from being cracked. be able to.

  When the peeling device 5 finishes the peeling process, the third transport device 33 (see FIG. 1) receives the support substrate S after peeling from the peeling device 5, and receives the received support substrate S in the second cleaning station 22 (see FIG. 1). ) To the second cleaning device.

  Here, the support substrate S after being peeled is in a state in which the non-bonding surface Sn side is held by the first suction moving unit 210 and the second suction moving unit 220, and the third transport device 33 is connected to the support substrate S. The joint surface Sj side is held from below without contact. In this way, the second holding unit 150 also functions as a delivery unit that delivers the support substrate S after peeling to the third transport device 33. In the first embodiment, since the second suction moving unit 220 sucks the vicinity of the central portion of the support substrate S, the support substrate S after peeling can be stably held.

  Further, the first transfer device 31 (see FIG. 1) carries the substrate to be processed W after peeling from the peeling device 5 and carries it to the first cleaning station 16. At this time, as shown in FIG. 7I, the substrate to be processed W after being peeled is held by the first holding unit 110 with the bonding surface Wj to be cleaned positioned on the upper surface. For this reason, the first transfer device 31 can transfer the substrate to be processed W after being peeled from the release device 5 to the first cleaning station 16 without inverting the substrate to be processed W.

  As described above, in the peeling apparatus 5, the first holding unit 110 holds the substrate to be processed W from below, and the second holding unit 150 holds the support substrate S of the superposed substrate T from above. It is not necessary to invert the processing substrate W, and the peeling process can be made efficient.

  As described above, the peeling device 5 according to the first embodiment includes the first holding unit (holding unit) 110, the plurality of suction moving units 210, 220, and 230, the measurement unit (state detection unit) 240, 250 and a control device (control unit) 40. The 1st holding | maintenance part 110 hold | maintains the to-be-processed substrate W among the superposition | polymerization substrates T with which the to-be-processed substrate W (an example of the 1st substrate) and the support substrate S (an example of the 2nd substrate) were joined. The plurality of adsorption moving units 210, 220, and 230 adsorb the support substrate S among the superposed substrates T and move the support substrate S in a direction away from the plate surface of the substrate W to be processed. The measuring units 240 and 250 detect the peeling state of the support substrate S from the substrate W to be processed. Based on the peeled state detected by the measuring units 240 and 250, the control device 40 performs suction movement so that the support substrate S is gradually peeled from the target substrate W from one end S1 to the other end S2 of the support substrate S. The operation timing of the units 210, 220, and 230 is controlled.

  Therefore, according to the peeling apparatus 5 which concerns on 1st Embodiment, efficiency improvement of a peeling process can be achieved. Moreover, according to the peeling apparatus 5 which concerns on 1st Embodiment, without applying big load to the 2nd, 3rd adsorption | suction moving parts 220 and 230 and the support substrate S, the superposition | polymerization board | substrate T and the support substrate S and the to-be-processed substrate It can peel to W. Furthermore, the superposition | polymerization board | substrate T can be peeled in a short time.

  Moreover, in the peeling apparatus 5 which concerns on 1st Embodiment, the peeling induction part 190 is the sharp member 191 and the to-be-processed substrate W and the support substrate S in the support substrate S among the side surfaces by the side of the one end S1 in the superposition | polymerization board | substrate T. And a moving mechanism 192 that moves the sharp member 191 toward the side surface near the adhesive G, which is a joint portion. In addition, the possibility that the sharp member 191 contacts the substrate to be processed W and the substrate to be processed W is damaged can be reduced.

  By the way, the structure of a state detection part is not limited to the structure shown in 1st Embodiment. For example, as indicated by an imaginary line in FIG. 3B, the state detection unit moves the first and second suction moving units 210 and 220, more precisely, the suction pads 211 of the first and second suction moving units 210 and 220. , 221 may be movement amount detection units 260 and 270 that detect the movement amount. The movement amount detection units 260 and 270 are encoders, for example. That is, the peeling state is determined by utilizing the movement amount of the first and second suction moving units 210 and 220 with the peeling of the support substrate S.

  In this case, the control device 40 moves the support substrate S in the direction away from the target substrate W by the first suction moving unit 210, and then the movement amount of the suction pad 211 detected by the movement amount detection unit 260 increases. When the threshold value is equal to or greater than the threshold value, it is determined that the support substrate S has been peeled to a predetermined position between the peripheral portion on the one end S1 side and the region closer to the central portion.

  Similarly, after the control device 40 moves the support substrate S in the direction away from the target substrate W by the second suction moving unit 220, the movement amount of the suction pad 221 detected by the movement amount detection unit 270 increases. If the threshold value is equal to or greater than the threshold value, it is determined that the support substrate S has been peeled to a predetermined position between the region near the center and the peripheral edge on the other end S2.

  In addition, as indicated by an imaginary line in FIG. 3B, the state detection unit moves the support substrate S in the direction away from the plate surface of the substrate W to be processed, so that the first and second suction moving units 210 and 220 support the support substrate. The load detection units 280 and 290 that detect the load received from S may be used. Load detectors 280 and 290 are, for example, load cells. That is, the peeling state is determined by utilizing the fact that the load acting on the first and second suction moving parts 210 and 220 decreases with the peeling of the support substrate S.

  In this case, the control device 40 moves the support substrate S in the direction away from the target substrate W by the first suction moving unit 210, and then the load detected by the load detection unit 280 decreases to be less than the threshold value. When it becomes, it determines with the support substrate S having peeled to the predetermined position between the peripheral part by the side of one end S1, and the area | region near a center part.

  Similarly, after the control device 40 moves the support substrate S in the direction away from the substrate W to be processed by the second suction moving unit 220, the load detected by the load detection unit 290 decreases to be less than the threshold value. When it becomes, it determines with the support substrate S having peeled to the predetermined position between the area | region near a center part, and the peripheral part by the side of the other end S2.

  Further, the configuration of the second holding unit is not limited to the configuration shown in the first embodiment. Therefore, in the following, a modified example of the second holding unit will be described with reference to FIGS. 8A to 8C. 8A to 8C are schematic plan views illustrating modifications of the second holding unit.

  In 1st Embodiment mentioned above, although the 1st adsorption | suction movement part showed the example in the case of adsorbing and hold | maintaining the peripheral part by the side of the one end S1 of the support substrate S in one place, for example, a 1st adsorption | suction movement part has a peripheral part. You may make it adsorb and hold in multiple places.

  Specifically, as shown in FIG. 8A, a plurality (for example, three) of suction pads 211A, 211B, and 211C of the first suction moving unit 210 are arranged along the peripheral edge on the one end S1 side of the support substrate S. As described above, the support substrate S is sucked and held using the plurality of suction pads 211A, 211B, and 211C, so that the one end S1 side of the support substrate S can be reliably peeled from the substrate W to be processed.

  Further, as shown in FIG. 8A, the third suction moving unit may be removed. Thereby, the structure of a 2nd holding | maintenance part can be simplified. In addition, although the case where the 3rd adsorption | suction movement part was removed was shown in FIG. 8A, this is an illustration to the last and it is not necessary to remove a 3rd adsorption | suction movement part.

  In FIG. 8A, the suction pads 211A, 211B, 211C, and 221 have substantially the same suction area. Thereby, the member of a suction pad can be made common, for example. Here, an example is shown in which the suction pads 211A, 211B, 211C, and 221 have substantially the same suction area. However, the present invention is not limited to this, and the suction areas may be different from each other.

  In the first embodiment described above, an example in which the second suction moving unit holds and holds the vicinity of the central portion of the support substrate S at a plurality of locations (two locations) has been described. The area to be held may be only the central part of the support substrate S.

  Specifically, as illustrated in FIG. 8B, the suction pad 221 </ b> A may be disposed at the center of the support substrate S and suck the center. Thereby, the structure of a 2nd holding | maintenance part can be simplified.

  In addition, the second holding unit arranges the plurality of second suction moving units in a straight line in parallel with the direction from the one end S1 to the other end S2 (Y-axis direction), and further holds the suction by holding from one end S1 to the other end S2. The area to be applied may be gradually increased.

  For example, as illustrated in FIG. 8C, the second holding unit includes a suction pad 221A disposed at the center of the support substrate S, and a suction pad 221B disposed between the suction pad 221A and the suction pad 211. . The suction pads 211, 221B, 221A, and 231A have a suction area that increases from one end S1 to the other end S2.

  Thus, as the support substrate S is peeled off, the support substrate S is sucked and held by the suction pad having a large suction area, so that the support substrate S can be efficiently peeled off and the peeled support substrate S is held in the second holding unit. Can be securely held. Note that the configuration of the second holding unit is not limited to the above-described example. For example, the third suction moving unit 230 may be removed to simplify the peeling system 1.

  In addition, the peeling apparatus 5 according to the first embodiment further detects a peeling completion detection unit that detects that all of the bonding surface Sj of the support substrate S to the target substrate W has been peeled off from the target substrate W and the peeling has been completed. You may make it provide. Below, the further modification of the peeling apparatus 5 which concerns on 1st Embodiment is demonstrated.

  FIG. 9 is a modified example of the peeling apparatus 5 according to the first embodiment. The support substrate S, the suction pads 211 of the first suction moving unit 210, the suction pads 221 of the second suction moving unit 220, and the third suction moving unit. 2 is a schematic plan view showing the positional relationship between a suction pad 231 and a peeling completion detection unit 300. FIG.

  The peeling completion detection unit 300 is, for example, a photoelectric sensor. As shown in FIG. 9, specifically, the peeling completion detection unit 300 is disposed near one end S1 of the support substrate S, and in a direction parallel to the direction from the one end S1 to the other end S2, A light projecting unit (peeling completion detecting light projecting unit) 300a that projects light toward a joint portion (for example, adhesive G) with the support substrate S is provided. Further, the peeling completion detection unit 300 is disposed on the opposite side of the light projecting unit 300a across the superposed substrate T, that is, near the other end S2, and receives a light from the light projecting unit 300a (light reception for peeling completion detection). Part) 300b. In FIG. 9, the above-described light is indicated by a broken line.

  Specifically, when all of the bonding surface Sj of the support substrate S to the target substrate W is peeled off from the target substrate W and the separation is completed, a gap is formed between the support substrate S and the target substrate W. The light receiving unit 300b is disposed at a position where the light from the light projecting unit 300a is received when the gap is formed. Then, when receiving the light, the light receiving unit 300b transmits a signal indicating that the light has been received to the control device 40.

  Thereby, the control apparatus 40 can determine whether peeling of the support substrate S was completed based on the detection result of the peeling completion detection part 300. FIG. That is, when the light is not received by the light receiving unit 300b, the control device 40 determines that the separation of the support substrate S is not completed, while when the light is received, the separation of the support substrate S is completed. judge. In addition, arrangement | positioning of the light projection part 300a and the light-receiving part 300b is not limited to the example of illustration, For example, the light projection part 300a may be arrange | positioned near other end S2, and the light-receiving part 300b may be arrange | positioned near one end S1. .

  Since it comprised as mentioned above, in the peeling apparatus 5, it can determine easily and simple structure that the peeling of the support substrate S was completed by peeling process. Note that the configuration of the peeling completion detection unit 300 is not limited to the above.

  That is, as shown by an imaginary line in FIG. 9, for example, light parallel to the X-axis direction passes through a joint portion of the other end S <b> 2 that is finally peeled off from the substrate W to be processed in the support substrate S. As described above, the light projecting unit 300a and the light receiving unit 300b may be arranged. Even in such a configuration, the control device 40 means that the other end S2 of the support substrate S is peeled off from the substrate W to be processed when the light receiving unit 300b receives light. It can be determined that the peeling of S has been completed.

  The completion of peeling on the support substrate S can also be detected from the distance d2 measured by the measurement unit 250 described above. Specifically, the control device 40 moves the support substrate S in a direction away from the plate surface of the substrate W to be processed by the third suction moving unit 230, for example, and then when the distance d2 becomes equal to or greater than the threshold value D3, You may determine with peeling of the support substrate S having been completed. The threshold value D3 is set to a value larger than the above-described threshold value D2.

  Furthermore, the control device 40 of the peeling device 5 may control the operation of the second holding unit 150 in which the peeling process is performed, for example, based on the detection result of the peeling completion detection unit 300. That is, in the peeling process, for example, when the peeling of the support substrate S is completed before the third suction moving unit 230 holds the support substrate S by suction, the third suction moving unit 230 does not suck and hold the support substrate S thereafter. May be.

  Therefore, when the control device 40 of the peeling device 5 determines that the peeling of the support substrate S is completed, the control device 40 interrupts the suction holding of the support substrate S by the remaining suction moving unit, specifically, the suction moving unit before suction. Then, the peeling process may be completed.

  FIG. 10 is a flowchart showing the processing procedure of the peeling process based on the detection result of the peeling completion detection unit 300. Note that the process of FIG. 10 is executed by the control device 40 of the peeling apparatus 5 in parallel with the process of the flowchart of FIG.

  First, the peeling device 5 is specifically configured to adsorb all of the first to third suction moving units 210, 220, and 230 to the support substrate S and move them away from the plate surface of the substrate W to be processed. Before the process of step S113 of FIG. 6, it is determined based on the detection result of the peeling completion detection unit 300 whether or not the peeling of the support substrate S is completed (step S201).

  The peeling apparatus 5 repeats the process of step S201, when it determines with peeling of the support substrate S not being completed (step S201, No). On the other hand, when it is determined that the peeling of the support substrate S is completed (Yes in step S201), the peeling device 5 sucks the remaining suction moving unit on the support substrate S and separates it from the plate surface of the substrate W to be processed. The process of moving is interrupted, and the process of separating the support substrate S from the substrate to be processed W is terminated (step S202). In S202, for example, when the peeling is completed before the processing after S111 in FIG. 6 is executed, the third suction moving unit 230 is sucked by the support substrate S and moved in a direction away from the plate surface of the substrate W to be processed. The process (the process after step S111 in FIG. 6) is interrupted, and the process of peeling the support substrate S from the target substrate W is completed.

  Thereby, for example, when the peeling of the support substrate S is completed before the operation of the third suction moving unit 230, the third suction moving unit 230 is not operated, and thus the time required for the peeling process can be shortened.

(Second Embodiment)
FIG. 11 shows the suction of the support substrate S, the suction pad 211 of the first suction movement unit 210, the suction pad 221 of the second suction movement unit 220, and the third suction movement unit 230 in the peeling system 1 according to the second embodiment. 3 is a schematic plan view showing a positional relationship between a pad 231 and state detection units 310 and 320. FIG. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The description will focus on differences from the first embodiment. In the peeling system 1 according to the second embodiment, the state detection unit 310 that detects the peeling state of the support substrate S from the substrate W to be processed, The configuration of 320 is different from that of the first embodiment.

  Specifically, the state detection units 310 and 320 are, for example, photoelectric sensors. As shown in FIG. 11, the state detection units 310 and 320 both have a substrate W to be processed and a support substrate S in a direction (X-axis direction) intersecting a direction (Y-axis direction) from one end S1 to the other end S2. Are provided with light projecting portions 310a and 320a that project light toward the joint portion. The state detection units 310 and 320 both include light receiving units 310b and 320b that are disposed on the opposite side of the light projecting units 310a and 320a with the superposed substrate T interposed therebetween and receive light from the light projecting units 310a and 320a.

  In the state detection unit 310, light parallel to the X-axis direction passes through the bonding portion of the support substrate S where the suction pad 221 of the second suction moving unit 220 is sucked to the target substrate W. As shown, the light projecting unit 310a and the light receiving unit 310b are arranged.

  Further, in the state detection unit 320, light parallel to the X-axis direction passes through the bonding portion of the support substrate S in the region sucked by the suction pad 231 of the third suction moving unit 230 with the target substrate W. Thus, the light projecting unit 320a and the light receiving unit 320b are arranged. When receiving the light, the light receiving units 310b and 320b arranged as described above transmit a signal indicating that the light is received to the control device 40.

  Thereby, the control apparatus 40 can determine the peeling state of the support substrate S based on the detection result of the state detection parts 310 and 320. FIG. That is, for example, when the control device 40 moves the support substrate S in the direction away from the substrate W to be processed by the first suction moving unit 210 and then receives light by the light receiving unit 310b of the state detection unit 310, the control substrate S It is determined that the region adsorbed by the second adsorbing / moving unit 220 is peeled from the substrate W to be processed.

  For example, the control device 40 moves the support substrate S in the direction away from the substrate W to be processed by the second suction moving unit 220 and then receives the light by the light receiving unit 320b of the state detection unit 320. It is determined that the region adsorbed by the third adsorption moving unit 230 is peeled from the substrate W to be processed.

  As described above, since the state detection units 310 and 320 are configured as described above, the peeling system 1 can easily and easily determine the peeling state between the support substrate S and the substrate W to be processed. it can. The remaining configuration and effects are the same as those in the first embodiment, and a description thereof will be omitted.

(Other embodiments)
In each of the embodiments described above, an example in which the superposed substrate to be peeled is the superposed substrate T in which the substrate to be processed W and the support substrate S are bonded by the adhesive G has been described. However, the superposition | polymerization board | substrate used as the peeling object of a peeling apparatus is not limited to this superposition | polymerization board | substrate T. FIG. For example, in the peeling apparatus of each embodiment described above, in order to generate an SOI substrate, a superposed substrate in which a donor substrate on which an insulating film is formed and a substrate to be processed are bonded can also be a peeling target. .

  Here, a method for manufacturing an SOI substrate will be described with reference to FIGS. 12A and 12B. 12A and 12B are schematic views showing a manufacturing process of the SOI substrate. As shown in FIG. 12A, the polymerization substrate Ta for forming the SOI substrate is formed by bonding the donor substrate K and the handle substrate H.

  The donor substrate K is a substrate in which the insulating film 6 is formed on the surface and the hydrogen ion implantation layer 7 is formed at a predetermined depth near the surface to be bonded to the handle substrate H. As the handle substrate H, for example, a silicon wafer, a glass substrate, a sapphire substrate, or the like can be used.

  In the peeling apparatus according to each of the embodiments described above, for example, the donor substrate K is held by the first holding unit and the peripheral portion of the overlapped substrate Ta is pulled while the handle substrate H is held by the second holding unit. A mechanical impact is given to the hydrogen ion implantation layer 7 formed on the donor substrate K. Thereby, as shown in FIG. 12B, the silicon-silicon bond in the hydrogen ion implantation layer 7 is cut, and the silicon layer 8 is peeled from the donor substrate K. As a result, the insulating film 6 and the silicon layer 8 are transferred onto the upper surface of the handle substrate H, and the SOI substrate Wa is formed. It is preferable that the donor substrate K is held by the first holding unit and the handle substrate H is held by the second holding unit, but the handle substrate H is held by the first holding unit and the donor is held by the second holding unit. The substrate K may be held.

  In the above-described embodiment, an example in which the substrate to be processed W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and are different for each region. An adhesive having an adhesive strength may be applied.

  In the above-described embodiment, an example in which the superposed substrate T is held by the dicing frame F has been described. However, the superposed substrate T is not necessarily held by the dicing frame F.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Peeling system 5 Peeling device 40 Control apparatus 110 1st holding | maintenance part 120 Frame holding | maintenance part 140 Rotation raising / lowering mechanism 150 2nd holding | maintenance part 170 Positioning part 180 Push-down part 190 Peeling induction part 200 Position adjustment part 210 1st adsorption | suction moving part 211 Adsorption pad 220 Second suction moving unit 221 Suction pad 230 Third suction moving unit 231 Suction pad 240, 250 Measurement unit 260, 270 Movement amount detection unit 280, 290 Load detection unit 300 Separation completion detection unit 310, 320 State detection unit F Dicing frame P Dicing tape S Support substrate T Polymerization substrate W Processed substrate

Claims (16)

A holding unit for holding the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling,
The state detection unit
A light projecting unit that projects light toward a joint portion between the first substrate and the second substrate in a direction crossing a direction from the one end to the other end;
A light receiving unit disposed on the opposite side of the light projecting unit across the superposition substrate, and receiving the light from the light projecting unit;
Peeling apparatus comprising: a. A holding unit for holding the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling the,
A peeling completion detection unit for detecting that all of the bonding surface of the second substrate to the first substrate is peeled off from the first substrate and the peeling is completed ;
The peeling completion detection unit is
A separation completion detection light projecting unit that projects light toward a joint portion between the first substrate and the second substrate in a direction parallel to the direction from the one end to the other end;
A separation completion detection light-receiving unit that is disposed on the opposite side of the peeling completion detection light projecting unit across the overlapping substrate, and that receives the light from the separation completion detection light projecting unit;
Peeling apparatus comprising: a. A holding unit for holding the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling the,
A peeling completion detection unit for detecting that all of the bonding surface of the second substrate to the first substrate is peeled off from the first substrate and the peeling is completed ;
The controller is
Based on the detection result of the peeling completion detection unit, the second substrate is peeled off before all of the plurality of suction moving units are sucked by the second substrate and moved away from the plate surface of the first substrate. When it is determined that the second substrate is moved, the remaining suction moving portion is sucked to the second substrate and moved in a direction away from the plate surface of the first substrate, and the second substrate is moved to the second substrate. The peeling apparatus characterized by ending the process of peeling from one substrate . A frame holding part that is disposed below the dicing frame and has a suction pad for sucking the dicing frame;
The pressing portion is
The peeling apparatus according to any one of claims 1 to 3, wherein the dicing frame is pressed down and held by the suction pad. The adsorption moving unit is
A first suction moving unit that sucks the peripheral edge on the one end side of the second substrate and moves the peripheral edge on the one end side in a direction away from the plate surface of the first substrate;
A second suction moving unit that sucks a region closer to the center of the second substrate than the peripheral portion and moves the region in a direction away from the plate surface of the first substrate;
The controller is
The first suction moving unit is operated to move the peripheral portion in a direction away from the plate surface of the first substrate, and then based on the detection result of the state detection unit, the peripheral portion on the one end side and the center When it is determined that the second substrate has been peeled to a predetermined position between the region close to the portion and the second suction moving unit is operated, the region close to the central portion is moved away from the plate surface of the first substrate. The peeling apparatus according to any one of claims 1 to 4, wherein the peeling apparatus is moved in a separating direction. The adsorption moving unit is
A third suction moving unit that sucks the peripheral edge of the second substrate on the other end and moves the peripheral edge of the other substrate in a direction away from the plate surface of the first substrate;
The controller is
The second suction moving unit is operated to move the region near the center in a direction away from the plate surface of the first substrate, and then the region near the center based on the detection result of the state detection unit. When the second substrate has been peeled off to a predetermined position between the first edge and the peripheral edge on the other end side, the third suction moving portion is operated to move the peripheral edge on the other end side to the first edge. The peeling apparatus according to claim 5 , wherein the peeling apparatus is moved in a direction away from the plate surface of the substrate. The second suction moving unit is
The peeling apparatus according to claim 5 or 6 , wherein a plurality of the peeling apparatuses are arranged side by side in a direction crossing a direction from the one end to the other end. The controller is
Based on the detection result of the state detection unit, when it is determined that the region adsorbed by the adsorption moving unit of the second substrate is peeled off from the first substrate, the adsorption moving unit that adsorbs the region is operated. The peeling device according to any one of claims 1 to 7 , wherein the region is moved in a direction away from the plate surface of the first substrate. The state detection unit
The peeling apparatus according to claim 2 , wherein the peeling apparatus is a measuring unit that measures a distance from a predetermined measurement reference position to the second substrate. The state detection unit
The peeling apparatus according to claim 2 , wherein the peeling apparatus is a movement amount detection unit that detects a movement amount of the adsorption movement unit. The state detection unit
4. The load detecting unit that detects a load that the suction moving unit receives from the second substrate when the second substrate is moved in a direction away from the plate surface of the first substrate. 5. The peeling apparatus described in 1. The peeling attraction part is
Sharp members,
The moving mechanism for moving the sharp member toward the side surface of the second substrate closer to the bonding portion between the first substrate and the second substrate, of the second substrate. peeling device according to any one of 1-11. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transported by the substrate transporting device into the first substrate and the second substrate is installed,
The peeling device is
A holding unit for holding the first substrate among the superposed substrates;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling,
The state detection unit
A light projecting unit that projects light toward a joint portion between the first substrate and the second substrate in a direction crossing a direction from the one end to the other end;
A light receiving unit disposed on the opposite side of the light projecting unit across the superposition substrate, and receiving the light from the light projecting unit;
Stripping system comprising: a. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transported by the substrate transporting device into the first substrate and the second substrate is installed,
The peeling device is
A holding unit for holding the first substrate among the superposed substrates;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling the,
A peeling completion detection unit for detecting that all of the bonding surface of the second substrate to the first substrate is peeled off from the first substrate and the peeling is completed ;
The peeling completion detection unit is
A separation completion detection light projecting unit that projects light toward a joint portion between the first substrate and the second substrate in a direction parallel to the direction from the one end to the other end;
A separation completion detection light-receiving unit that is disposed on the opposite side of the peeling completion detection light projecting unit across the overlapping substrate, and that receives the light from the separation completion detection light projecting unit;
Stripping system comprising: a. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transported by the substrate transporting device into the first substrate and the second substrate is installed,
The peeling device is
A holding unit for holding the first substrate among the superposed substrates;
A plurality of suction moving units for sucking the second substrate of the superposed substrates and moving the second substrate in a direction away from the plate surface of the first substrate;
A peeling attraction part for forming a part that causes the second substrate to peel from the first substrate on a side surface on one end side of the superposed substrate;
A push-down portion that is disposed above the peeling attraction portion and pushes down a dicing frame in which the superposed substrate is stuck to an adhesive member that is stretched to an opening having a larger diameter than the superposed substrate;
A state detection unit for detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected by the state detection unit, the operation timing of the suction moving unit so that the second substrate gradually peels from the first substrate from one end to the other end of the second substrate. and a control unit for controlling the,
A peeling completion detection unit for detecting that all of the bonding surface of the second substrate to the first substrate is peeled off from the first substrate and the peeling is completed ;
The controller is
Based on the detection result of the peeling completion detection unit, the second substrate is peeled off before all of the plurality of suction moving units are sucked by the second substrate and moved away from the plate surface of the first substrate. When it is determined that the second substrate is moved, the remaining suction moving portion is sucked to the second substrate and moved in a direction away from the plate surface of the first substrate, and the second substrate is moved to the second substrate. A peeling system characterized by terminating the process of peeling from one substrate . A holding step of holding the first substrate of the superposed substrates by a holding unit that holds the first substrate of the superposed substrates bonded to the first substrate and the second substrate;
A depressing step of depressing the dicing frame by a depressing section for depressing the dicing frame on which the superposed substrate is adhered to an adhesive member stretched to an opening having a larger diameter than the superposed substrate;
A peeling attraction step for forming the part on the side surface of the superposed substrate by a peel attraction part for forming a part that causes the second substrate to peel from the first substrate on the side face on one end side of the superposed substrate;
A state detection step of detecting a peeling state of the second substrate from the first substrate;
Based on the peeling state detected in the state detection step, a plurality of suction moving units that suck the second substrate among the superposed substrates and move the second substrate in a direction away from the plate surface of the first substrate. A control step of controlling the operation timing of the suction moving unit so that the second substrate is gradually peeled from the first substrate from one end to the other end of the second substrate ,
Look containing a release completion detection step of detecting that all of the joining surfaces of the first substrate of the second substrate is peeled off from the first substrate is completed,
The control step includes
Based on the detection result of the peeling completion detection step, the second substrate is peeled off before all of the plurality of suction moving parts are sucked by the second substrate and moved away from the plate surface of the first substrate. When it is determined that the second substrate is moved, the remaining suction moving portion is sucked to the second substrate and moved in a direction away from the plate surface of the first substrate, and the second substrate is moved to the second substrate. The peeling method characterized by ending the process which peels from 1 board | substrate .

Images