JP5942115B2 - 低温電気化学成長を用いた単結晶酸化銅(i)ナノ線アレイの製造方法 - Google Patents
低温電気化学成長を用いた単結晶酸化銅(i)ナノ線アレイの製造方法 Download PDFInfo
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- 239000002070 nanowire Substances 0.000 title claims description 70
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 title claims description 59
- 239000013078 crystal Substances 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 37
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 30
- 239000000243 solution Substances 0.000 claims description 30
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 16
- 230000003647 oxidation Effects 0.000 claims description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 16
- 238000007743 anodising Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 12
- 238000004070 electrodeposition Methods 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 235000006408 oxalic acid Nutrition 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 7
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 239000005751 Copper oxide Substances 0.000 claims description 6
- 239000000020 Nitrocellulose Substances 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000431 copper oxide Inorganic materials 0.000 claims description 6
- 238000003487 electrochemical reaction Methods 0.000 claims description 6
- 229920001220 nitrocellulos Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 4
- VMKYLARTXWTBPI-UHFFFAOYSA-N copper;dinitrate;hydrate Chemical compound O.[Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O VMKYLARTXWTBPI-UHFFFAOYSA-N 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 2
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 3
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims 2
- 239000002159 nanocrystal Substances 0.000 claims 2
- 230000009918 complex formation Effects 0.000 description 7
- 238000000354 decomposition reaction Methods 0.000 description 7
- 238000003491 array Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- -1 hydroxy ions Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 2
- 229940005991 chloric acid Drugs 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/045—Anodisation of aluminium or alloys based thereon for forming AAO templates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Description
<実施例1>
前記一次酸化過程により形成された多孔性アルミナ層を、6wt%リン酸(H3PO4)と1.8wt%クロム酸(CrO3)との混合溶液を用いて60℃の温度で24時間以上エッチング除去する。
<実施例2>
そして、用意されたナノ気孔鋳型枠を、電気化学反応溶液中で1mA/cm2の電流密度を所望の時間だけ加える。
Claims (10)
- 高純度アルミニウムシート(Al sheet)から2ステップ(two−step)の陽極酸化法を用いてナノ気孔アルミナ層(陽極酸化アルミナ、Anodized alumina、AAO)を製造するステップと、
前記ナノ気孔アルミナ層をナノ鋳型枠として用いて低温電気化学成長法による単結晶酸化銅(I)ナノ線アレイを製造するステップとからなる低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法であって、
前記高純度アルミニウムシート(Al sheet)から2ステップ(two−step)の陽極酸化法を用いてナノ気孔メンブレインを製造するステップは、
高純度アルミニウムシートを、電解研磨溶液中で直流電圧を印加して電解研磨するステップと、
前記電解研磨されたアルミニウムシートを、硫酸(H2SO4)またはシュウ酸(H2C2O4)水溶液中で一次陽極酸化するステップと、
前記一次陽極酸化過程により形成された多孔性アルミナ層を、リン酸(H3PO4)とクロム酸(CrO3)との混合溶液を用いてエッチング除去するステップと、
酸化アルミナ層の除去された前記アルミニウムシートを、硫酸(H2SO4)またはシュウ酸(H2C2O4)水溶液中で二次陽極酸化するステップと、
前記二次陽極酸化するステップの後、前記ナノ気孔アルミナ層にニトロセルロース(nitrocellulose)とポリエステル(polyester)との混合物を塗布し、エッチング過程から保護するステップと、
前記アルミナ気孔層を、一定温度でリン酸(H3PO4)溶液を用いてエッチングし、ナノ気孔チャネルを形成させるステップと、
前記ナノ気孔メンブレインの片面に白金(Pt)または金(Au)層を蒸着するステップとからなることを特徴とする、低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記電解研磨溶液は、
塩素酸(HClO4)とエタノールとの体積比が1:4であることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記電解研磨するステップは、
前記高純度アルミニウムシートを、電解研磨溶液中で+20Vの直流電圧を印加し、10℃で4分間電解研磨するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記一次陽極酸化するステップは、
前記電解研磨されたアルミニウムシートを、0.3M硫酸(H2SO4)または0.3Mシュウ酸(H2C2O4)水溶液中で+20Vの印加電圧を加え、10℃の温度で12時間一次陽極酸化するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記一次陽極酸化過程により形成された多孔性アルミナ層を、リン酸(H3PO4)とクロム酸(CrO3)との混合溶液を用いてエッチング除去するステップは、
前記一次陽極酸化過程により形成された多孔性アルミナ層を、リン酸(H3PO4)と1.8wt%クロム酸(CrO3)との混合溶液を用いて一定温度でエッチング除去するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記二次陽極酸化するステップは、
前記酸化アルミナ層の除去されたアルミニウムシートを、0.3M硫酸(H2SO4)または0.3Mシュウ酸(H2C2O4)水溶液中で+20Vの印加電圧を加え、10℃の温度で所望の時間さらに二次陽極酸化するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記エッチング過程から保護するステップは、
前記二次陽極酸化するステップの後、前記ナノ気孔アルミナ層にニトロセルロース(nitrocellulose)とポリエステル(polyester)との混合物を塗布し、エッチング過程から保護するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記ナノ気孔チャネルを形成させるステップは、
前記アルミナ気孔層を、30℃の温度で5wt%リン酸(H3PO4)溶液を用いて15分間エッチングし、ナノ気孔チャネルを形成させるステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 前記PtまたはAu層を蒸着するステップは、
前記ナノ気孔メンブレインの片面に白金(Pt)または金(Au)層を200nm以上の厚さに蒸着するステップであることを特徴とする、請求項1記載の低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。 - 高純度アルミニウムシート(Al sheet)から2ステップ(two−step)の陽極酸化法を用いてナノ気孔アルミナ層(陽極酸化アルミナ、Anodized alumina、AAO)を製造するステップと、
前記ナノ気孔アルミナ層をナノ鋳型枠として用いて低温電気化学成長法による単結晶酸化銅(I)ナノ線アレイを製造するステップとからなる低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法であって、
前記ナノ気孔アルミナ層をナノ気孔鋳型枠として用いて単結晶酸化銅(I)ナノ線アレイを製造するステップは、
銅硝酸塩水和物(Cu(NO3)2・2.5H2O)とヘキサメチレンテトラアミン(hexamethylenetetramine)とを混合した電気化学蒸着溶液を製造するステップと、
前記電気化学蒸着溶液を撹拌し、水浴環境で加熱するステップと、
前記電気化学蒸着溶液を一定温度で撹拌するステップと、
前記ナノ気孔鋳型枠を、電気化学反応溶液中で一定の電流密度を加えるステップと、
電気化学成長したナノ線をエタノールと脱イオン水で洗浄後乾燥するステップと、
前記ナノ線の結晶性を改善するために熱処理するステップと、
ナノ気孔メンブレインをNaOH水溶液で除去するステップとからなることを特徴とする、低温電気化学成長を用いた単結晶酸化銅(I)ナノ線アレイの製造方法。
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KR1020110001703A KR101332422B1 (ko) | 2011-01-07 | 2011-01-07 | 전기화학성장을 이용한 단결정 산화구리 (i) 나노선 어레이 제조 방법 |
PCT/KR2012/000076 WO2012093847A2 (ko) | 2011-01-07 | 2012-01-04 | 저온전기화학성장을 이용한 단결정 산화구리 (i) 나노선 어레이 제조 방법 |
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CN103754925B (zh) * | 2014-01-13 | 2016-03-30 | 复旦大学 | 一种氧化亚铜纳米线多孔薄膜及其制备方法和应用 |
CN104087997A (zh) * | 2014-06-16 | 2014-10-08 | 北京工业大学 | 异酸异压二次氧化制备规则小孔径阳极氧化铝模板的方法 |
KR102148857B1 (ko) | 2014-08-14 | 2020-08-28 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조 방법 |
CN104628411B (zh) * | 2015-02-05 | 2020-02-11 | 宁波大学 | 一种负载氧化铜纳米线的超大孔材料 |
WO2016138385A1 (en) * | 2015-02-26 | 2016-09-01 | Board Of Regents, The University Of Texas System | Two-dimensional nanosheets and methods of making and use thereof |
KR101745080B1 (ko) * | 2015-04-17 | 2017-06-09 | 연세대학교 산학협력단 | 알루미나 기반 광 디퓨저 제조방법 및 이를 통해 제작된 광 디퓨저 |
KR101795866B1 (ko) * | 2015-11-20 | 2017-11-09 | 연세대학교 산학협력단 | 나노와이어 번들 어레이, 이를 포함하는 멤브레인, 그 제작방법 및 이를 이용한 증기발생장치 |
CN105621353B (zh) * | 2015-12-31 | 2017-04-05 | 中山大学 | 一种基于多层阳极氧化铝模板的大面积纳米图形化方法 |
CN106493391B (zh) * | 2016-12-12 | 2019-05-17 | 中国科学技术大学 | 一种铜纳米线的提纯方法 |
KR102492733B1 (ko) | 2017-09-29 | 2023-01-27 | 삼성디스플레이 주식회사 | 구리 플라즈마 식각 방법 및 디스플레이 패널 제조 방법 |
CN108063187B (zh) * | 2017-12-18 | 2021-01-26 | 苏州大学 | 一种铝纳米粒子阵列、制备方法及其应用 |
CN111676498B (zh) * | 2020-06-24 | 2022-02-18 | 河北工业大学 | 一种氧化亚铜电极的制备方法 |
CN112164597B (zh) * | 2020-09-28 | 2022-05-27 | 桂林理工大学 | 氧化铜纳米阵列电极、氧化铜纳米阵列的非固态水系柔性储能器件及其制备方法 |
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US20090243584A1 (en) * | 2008-03-25 | 2009-10-01 | Guigen Zhang | Fabrication of microstructures integrated with nanopillars along with their applications as electrodes in sensors |
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JP5271790B2 (ja) * | 2009-04-24 | 2013-08-21 | 公益財団法人神奈川科学技術アカデミー | スタンパ製造用アルミニウム基材、およびスタンパの製造方法 |
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