JP5883662B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5883662B2 JP5883662B2 JP2012013760A JP2012013760A JP5883662B2 JP 5883662 B2 JP5883662 B2 JP 5883662B2 JP 2012013760 A JP2012013760 A JP 2012013760A JP 2012013760 A JP2012013760 A JP 2012013760A JP 5883662 B2 JP5883662 B2 JP 5883662B2
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- JP
- Japan
- Prior art keywords
- light emitting
- light
- wavelength conversion
- emitting element
- conversion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
Landscapes
- Led Device Packages (AREA)
Description
11a 基板
11b 枠体
12 発光素子
13 バンプ
14 波長変換層
15 透明板状部材
16 スペーサー
17 反射層
140 凸部
170 反射材料
Claims (5)
- 基板と、
前記基板上に配置された発光素子、前記発光素子上に配置されて蛍光体粒子を含有する波長変換層、及び前記波長変換層上に配置された透光性プレートからなる発光構造体と、を備える発光装置であって、
前記波長変換層は、前記発光素子の側面の少なくとも一部と前記透光性プレートの側面の少なくとも一部とを覆って外側に湾曲に突出した凸部を含み、
前記発光装置は、前記凸部の湾曲面を覆う反射層を備えることを特徴とする発光装置。 - 前記発光構造体を囲むように前記基板上に配置された環状の枠体を更に備え、
前記反射層は、前記発光構造体と前記枠体との間を埋めるように形成されていることを特徴とする請求項1記載の発光装置。 - 前記透光性プレートの前記波長変換層に面した裏面の大きさは前記発光素子の前記波長変換層に面した発光主面の大きさより小さいことを特徴とする請求項1又は2記載の発光装置。
- 前記凸部は、前記発光素子の側面全体を覆っていることを特徴とする請求項1〜3のいずれか1記載の発光装置。
- 前記波長変換層には粒子状の複数のスペーサーが混入され、前記複数のスペーサーによって前記波長変換層は所定の膜厚で形成されていることを特徴とする請求項1〜4のいずれか1記載の発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012013760A JP5883662B2 (ja) | 2012-01-26 | 2012-01-26 | 発光装置 |
US13/748,099 US9224925B2 (en) | 2012-01-26 | 2013-01-23 | Semiconductor light-emitting device and manufacturing method |
EP13000374.2A EP2620989B1 (en) | 2012-01-26 | 2013-01-25 | Semiconductor light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012013760A JP5883662B2 (ja) | 2012-01-26 | 2012-01-26 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013153094A JP2013153094A (ja) | 2013-08-08 |
JP5883662B2 true JP5883662B2 (ja) | 2016-03-15 |
Family
ID=47750388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012013760A Active JP5883662B2 (ja) | 2012-01-26 | 2012-01-26 | 発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9224925B2 (ja) |
EP (1) | EP2620989B1 (ja) |
JP (1) | JP5883662B2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6149487B2 (ja) | 2012-11-09 | 2017-06-21 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
JP2014138046A (ja) | 2013-01-16 | 2014-07-28 | Stanley Electric Co Ltd | 半導体発光素子パッケージ固定構造 |
JP6107475B2 (ja) * | 2013-06-28 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置 |
JP6477001B2 (ja) * | 2014-03-14 | 2019-03-06 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
US9590148B2 (en) * | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
WO2015157178A1 (en) * | 2014-04-07 | 2015-10-15 | Crystal Is, Inc. | Ultraviolet light-emitting devices and methods |
JP6484982B2 (ja) | 2014-09-30 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR102346798B1 (ko) * | 2015-02-13 | 2022-01-05 | 삼성전자주식회사 | 반도체 발광장치 |
DE102016208489A1 (de) | 2016-05-18 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauteils und optoelektronisches bauteil |
JP6724639B2 (ja) | 2016-08-01 | 2020-07-15 | 日亜化学工業株式会社 | 発光装置 |
JP6947997B2 (ja) * | 2016-08-01 | 2021-10-13 | 日亜化学工業株式会社 | 発光装置 |
JP6720814B2 (ja) | 2016-09-30 | 2020-07-08 | 日亜化学工業株式会社 | 発光装置 |
US10014450B1 (en) * | 2017-02-09 | 2018-07-03 | Asm Technology Singapore Pte Ltd | Method for manufacturing a light emitting diode device and the light emitting diode device so manufactured |
JP7014948B2 (ja) * | 2017-06-13 | 2022-02-02 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
JP7080625B2 (ja) * | 2017-12-01 | 2022-06-06 | スタンレー電気株式会社 | 発光装置 |
US10600937B1 (en) | 2018-09-17 | 2020-03-24 | Lumileds Holding B.V. | Precise bondline control between LED components |
KR102477355B1 (ko) * | 2018-10-23 | 2022-12-15 | 삼성전자주식회사 | 캐리어 기판 및 이를 이용한 기판 처리 장치 |
JP7522757B2 (ja) * | 2019-03-22 | 2024-07-25 | エルジー イノテック カンパニー リミテッド | 照明モジュール及びこれを備えた照明装置 |
JP7269792B2 (ja) * | 2019-05-16 | 2023-05-09 | スタンレー電気株式会社 | 発光装置 |
CN114883473B (zh) * | 2020-01-02 | 2024-06-14 | 泉州三安半导体科技有限公司 | 发光装置及发光设备 |
JP2023140834A (ja) * | 2022-03-23 | 2023-10-05 | スタンレー電気株式会社 | 発光装置及び発光装置の製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4733335A (en) | 1984-12-28 | 1988-03-22 | Koito Manufacturing Co., Ltd. | Vehicular lamp |
US5101326A (en) | 1990-09-27 | 1992-03-31 | The Grote Manufacturing Co. | Lamp assembly for motor vehicle |
US20040239243A1 (en) * | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
US6273596B1 (en) | 1997-09-23 | 2001-08-14 | Teledyne Lighting And Display Products, Inc. | Illuminating lens designed by extrinsic differential geometry |
JP2001077430A (ja) | 1999-09-02 | 2001-03-23 | Citizen Electronics Co Ltd | 発光ダイオード |
JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
JP4131845B2 (ja) | 2003-09-29 | 2008-08-13 | 株式会社小糸製作所 | 灯具ユニットおよび車両用前照灯 |
JP4115921B2 (ja) | 2003-11-04 | 2008-07-09 | 株式会社小糸製作所 | 車両用前照灯 |
JP4391870B2 (ja) | 2004-04-02 | 2009-12-24 | 株式会社小糸製作所 | 車両用照明灯具 |
KR100593919B1 (ko) | 2004-07-01 | 2006-06-30 | 삼성전기주식회사 | 차량 전조등용 발광 다이오드 모듈 및 이를 구비한 차량전조등 |
JP4375225B2 (ja) | 2004-12-14 | 2009-12-02 | 市光工業株式会社 | 車両用灯具 |
JP2007005182A (ja) | 2005-06-24 | 2007-01-11 | Ichikoh Ind Ltd | 車両用灯具及び車両用前照装置 |
JP4694427B2 (ja) | 2006-07-05 | 2011-06-08 | 株式会社小糸製作所 | 車両用前照灯 |
TWI380483B (en) * | 2008-12-29 | 2012-12-21 | Everlight Electronics Co Ltd | Led device and method of packaging the same |
JP5278023B2 (ja) * | 2009-02-18 | 2013-09-04 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP5406566B2 (ja) | 2009-03-11 | 2014-02-05 | スタンレー電気株式会社 | 車両用前照灯 |
JP5326705B2 (ja) | 2009-03-17 | 2013-10-30 | 日亜化学工業株式会社 | 発光装置 |
EP2412038B1 (en) * | 2009-03-19 | 2019-01-02 | Philips Lighting Holding B.V. | Illumination device with remote luminescent material |
JP5424771B2 (ja) | 2009-08-04 | 2014-02-26 | 株式会社小糸製作所 | 車両用前照灯の配光制御システム |
JP2011031808A (ja) | 2009-08-04 | 2011-02-17 | Koito Mfg Co Ltd | 車両用前照灯の配光制御システム |
JP2011100785A (ja) | 2009-11-04 | 2011-05-19 | Nippon Telegr & Teleph Corp <Ntt> | To−can形光モジュール用パッケージおよびto−can形光モジュール |
JP2011204376A (ja) * | 2010-03-24 | 2011-10-13 | Stanley Electric Co Ltd | 半導体発光装置 |
JP5577138B2 (ja) | 2010-04-08 | 2014-08-20 | スタンレー電気株式会社 | 車両用前照灯 |
JP5535739B2 (ja) | 2010-04-13 | 2014-07-02 | 株式会社ジャパンディスプレイ | 表示装置 |
JP5572013B2 (ja) * | 2010-06-16 | 2014-08-13 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
JP5505719B2 (ja) | 2010-06-28 | 2014-05-28 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
JP2012033823A (ja) | 2010-08-02 | 2012-02-16 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
JP5622494B2 (ja) | 2010-09-09 | 2014-11-12 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
JP2013038187A (ja) | 2011-08-05 | 2013-02-21 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
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2012
- 2012-01-26 JP JP2012013760A patent/JP5883662B2/ja active Active
-
2013
- 2013-01-23 US US13/748,099 patent/US9224925B2/en active Active
- 2013-01-25 EP EP13000374.2A patent/EP2620989B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2620989B1 (en) | 2018-07-25 |
US20130193458A1 (en) | 2013-08-01 |
US9224925B2 (en) | 2015-12-29 |
EP2620989A3 (en) | 2015-08-05 |
JP2013153094A (ja) | 2013-08-08 |
EP2620989A2 (en) | 2013-07-31 |
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