JP5874552B2 - Joining member - Google Patents

Description

  The present invention relates to a joining member for connecting a plurality of electronic elements having a first terminal and a second terminal in series.

  2. Description of the Related Art Conventionally, as shown in, for example, Patent Document 1, a capacitor mounting circuit in which four lands for mounting two multilayer ceramic capacitors connected in series are formed in plane symmetry positions on the front and back surfaces of a circuit board A substrate has been proposed.

JP 2003-324030 A

  As described above, the capacitor mounting circuit board disclosed in Patent Document 1 describes a land for connecting two multilayer ceramic capacitors in series. In this configuration, three or more capacitors (electronic elements) are used. Could not be connected in series.

  In view of the above problems, an object of the present invention is to provide a bonding member that can connect two or three or more electronic elements in series.

In order to achieve the above-described object, the present invention provides a joining member for connecting a plurality of electronic elements (31 to 33) having a first terminal and a second terminal in series, the first member of the first electronic element (31). A first mounting portion (11) for mounting one terminal, a second mounting portion (12) for mounting the remaining second terminals, and a third mounting portion for mounting the first terminals of the second electronic elements (32) ( 13), a fourth mounting portion (14) for mounting the remaining second terminals, and a connecting portion (21) for electrically and mechanically connecting the second mounting portion and the third mounting portion to each other. The connecting portion can be removed according to the number of electronic elements to be mounted, and the second mounting portion can include a third electronic element (in addition to the region where the second terminal of the first electronic element is mounted). 33) a region for mounting the first terminal, and the third mounting portion includes a third electronic element in addition to the region for mounting the first terminal of the second electronic element. Characterized that you have has an area for mounting the second terminal of the.

According to this, when the first electronic element (31) and the second electronic element (32) are mounted on the first to fourth mounting portions (11 to 14), the connection portion (21) is not cut off. Thus, the first electronic element (31) and the second electronic element (32) are connected in series via the second mounting portion (12), the connecting portion (21), and the third mounting portion (13). Is done. When the first electronic element (31), the second electronic element (32), and one third electronic element (33) are mounted on the first to fourth mounting portions (14), the connecting portion (21 ) Are cut off so that the first electronic element (31) and the second electronic element (32) have the second mounting part (12), the third electronic element (33), and the third mounting part (13). Connected in series. As a result, the first electronic element (31), the second electronic element (32), and the third electronic element (33) are connected in series. Thus, in the case of the joining member (100) according to the present invention, two or three electronic elements can be connected in series.

Furthermore, the present invention has at least one fifth mounting portion (15, 16) disposed between the second mounting portion and the third mounting portion, and the fifth mounting portion is interposed via the connecting portion. The fifth mounting portion is electrically and mechanically connected to the second mounting portion and the third mounting portion, and the fifth mounting portion includes a region for mounting the first terminal of a certain third electronic element, and a third mounting portion of another third electronic element. a region for mounting two terminals, that have a configuration is preferable.

According to this, the first electronic element (31), the second electronic element (32), and the plurality of third electronic elements (33 to 35) are mounted on the first to fifth mounting portions (11 to 16). In this case, the first electronic element (31) and the second electronic element (32) are connected to the second mounting portion (the second electronic component (32) by cutting off the connecting portion between the mounting portions electrically connected via the third electronic device. 12), the fifth mounting portion (15, 16), the plurality of third electronic elements (33 to 35), and the third mounting portion (13) are connected in series. Thus, in the case of the joining member according to the present invention, two or three or more electronic elements can be connected in series. In addition, between said mounting parts is between a 2nd mounting part (12) and a 5th mounting part (15), between two 5th mounting parts (15,16), and a 5th mounting part ( 16) and at least one between the third mounting portion (13).

  Furthermore, according to the present invention, each of the first to fourth mounting portions has a mounting surface on which an electronic element is mounted along a prescribed plane defined by an x direction and a y direction that are orthogonal to each other. The first mounting portion and the second mounting portion are arranged in the x direction, the third mounting portion and the fourth mounting portion are arranged in the x direction, and the second mounting portion and the third mounting portion are arranged in the y direction. A configuration in which these are aligned is preferable.

  According to this, when the three electronic elements (31 to 33) are mounted on the mounting portions (11 to 14), the three electronic elements (31 to 33) are arranged in a zigzag manner in the y direction. 31-33) partly opposes in the x direction. Therefore, in the y direction, an increase in the size in the y direction of the member in which the electronic elements (31 to 33) are mounted on the bonding member (100) is suppressed as compared with a configuration in which the three electronic elements are not opposed in the x direction. Is done.

It is a top view which shows schematic structure of the joining member which concerns on 1st Embodiment. FIG. 2 is a top view illustrating a state in which two capacitors are mounted on the bonding member illustrated in FIG. 1. FIG. 3 is a top view showing a state where a non-mounting region is removed in the joining member shown in FIG. 2. It is sectional drawing which shows the state in which the joining member shown in FIG. 1 was mounted in the board | substrate. FIG. 5 is a cross-sectional view illustrating a state where two capacitors are mounted on the bonding member illustrated in FIG. 4. FIG. 6 is a cross-sectional view showing a state where a non-mounting region is removed in the joining member shown in FIG. 5. It is sectional drawing which shows the state by which the board | substrate and the joining member were coat | covered with mold resin. FIG. 8 is a block diagram of the electronic device shown in FIG. 7. FIG. 2 is a top view illustrating a state where three capacitors are mounted on the bonding member illustrated in FIG. 1. FIG. 10 is a top view showing a state where the non-mounting area is removed together with the connecting portion in the joining member shown in FIG. 9. FIG. 5 is a cross-sectional view illustrating a state where three capacitors are mounted on the bonding member illustrated in FIG. 4. In the joining member shown in FIG. 11, it is sectional drawing which shows the state from which the non-mounting area | region was removed with the connection part. It is sectional drawing which shows the state by which the board | substrate and the joining member were coat | covered with mold resin. FIG. 14 is a block diagram of the electronic device shown in FIG. 13. It is a top view which shows the modification of the joining member which concerns on 1st Embodiment. FIG. 16 is a top view illustrating a state where two capacitors are mounted on the bonding member illustrated in FIG. 15. FIG. 16 is a top view illustrating a state in which three capacitors are mounted on the bonding member illustrated in FIG. 15 and a non-mounting region is removed together with a connecting portion. FIG. 16 is a cross-sectional view illustrating a state where the bonding member illustrated in FIG. 15 is mounted on a substrate. FIG. 19 is a cross-sectional view illustrating a state where three capacitors are mounted on the bonding member illustrated in FIG. 18. FIG. 20 is a cross-sectional view showing a state where the non-mounting region is removed together with the connecting portion in the joining member shown in FIG. 19. It is sectional drawing which shows the state by which the board | substrate and the joining member were coat | covered with mold resin. It is a top view which shows schematic structure of the joining member which concerns on 2nd Embodiment. FIG. 23 is a top view showing a state where two capacitors are mounted on the joining member shown in FIG. 22. FIG. 23 is a top view illustrating a state in which three capacitors are mounted on the bonding member illustrated in FIG. 22 and a connecting portion and a non-mounting region are removed. FIG. 23 is a top view illustrating a state in which three capacitors are mounted on the bonding member illustrated in FIG. 22 and a connecting portion and a non-mounting region are removed. FIG. 23 is a top view illustrating a state where four capacitors are mounted on the bonding member illustrated in FIG. 22 and a connecting portion and a non-mounting region are removed. It is a top view which shows the modification of the joining member which concerns on 2nd Embodiment. FIG. 28 is a top view showing a state where two capacitors are mounted on the joining member shown in FIG. 27. FIG. 28 is a top view illustrating a state in which three capacitors are mounted on the bonding member illustrated in FIG. 27 and a connecting portion and a non-mounting region are removed. FIG. 28 is a top view showing a state where four capacitors are mounted on the joining member shown in FIG. 27 and the connecting portion and the non-mounting region are removed. It is a top view which shows the modification of the joining member which concerns on 2nd Embodiment. FIG. 32 is a top view showing a state where two capacitors are mounted on the joining member shown in FIG. 31. FIG. 32 is a top view showing a state where three capacitors are mounted on the bonding member shown in FIG. 31 and the connecting portion and the non-mounting region are removed. FIG. 32 is a top view showing a state where three capacitors are mounted on the bonding member shown in FIG. 31 and the connecting portion and the non-mounting region are removed. FIG. 32 is a top view showing a state where three capacitors are mounted on the bonding member shown in FIG. 31 and the connecting portion and the non-mounting region are removed. FIG. 32 is a top view showing a state where four capacitors are mounted on the joining member shown in FIG. 31 and the connecting portion and the non-mounting region are removed. FIG. 32 is a top view showing a state where four capacitors are mounted on the joining member shown in FIG. 31 and the connecting portion and the non-mounting region are removed. FIG. 32 is a top view showing a state where five capacitors are mounted on the bonding member shown in FIG. 31 and the connecting portion and the non-mounting region are removed.

Hereinafter, an embodiment in which a capacitor is mounted as an electronic element on the joining member according to the present invention will be described with reference to the drawings.
(First embodiment)
Based on FIGS. 1-14, the joining member which concerns on this embodiment is demonstrated. In the following, three directions that are orthogonal to each other are referred to as an x direction, a y direction, and a z direction. A plane defined by the x direction and the y direction is referred to as a defined plane.

  The joining member 100 connects a plurality of capacitors having a first terminal (first electrode) and a second terminal (second electrode) in series. As shown in FIG. 1, the joining member 100 according to this embodiment includes mounting portions 11 to 14 and a first connecting portion 21. The mounting parts 11 to 14 are sequentially arranged in the y direction, and the mounting parts 12 and 13 are electrically and mechanically connected via the first connecting part 21. The constituent members 11 to 14 and 21 of the joining member 100 are formed by removing unnecessary portions of one lead frame.

  Each of the mounting portions 11 to 14 and the first connecting portion 21 has a flat plate shape whose main surface is aligned with a prescribed plane. The mounting portions 11 and 14 have the same shape, and the mounting portions 12 and 13 have the same shape. Yes. The mounting parts 11 and 14 have a mounting area for mounting the capacitor terminals. The mounting parts 12 and 13 have a mounting area other than the mounting area where the capacitor terminals are not mounted (indicated by the broken lines in FIG. 1). An enclosed area). The 1st connection part 21 is connected with this non-mounting area | region, and is removed according to the number of the capacitors mounted. The main surface of the mounting area described above corresponds to the mounting surface described in the claims. Further, the non-mounting area is removed as necessary.

  The first mounting part 11 has a mounting area for mounting the first terminal of the first capacitor 31, and the second mounting part 12 has a mounting area for mounting the second terminal of the first capacitor 31. The third mounting portion 13 has a mounting area for mounting the first terminal of the second capacitor 32, and the fourth mounting portion 14 has a mounting area for mounting the second terminal of the second capacitor 32. Further, the second mounting part 12 has a mounting area for mounting the first terminal of the third capacitor 33, and the third mounting part 13 has a mounting area for mounting the second terminal of the third capacitor 33.

  Next, the case where the capacitors 31 and 32 are mounted on the mounting portions 11 to 14 will be described. In this case, as shown in FIG. 2, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31, and the mounting portions 13 and 14 are mounted by the second capacitor 32. The second capacitor 32 is mounted on the mounting portions 13 and 14 so as to be bridged. Thereby, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the first connecting portion 21, and the third mounting portion 13. At this time, as shown in FIG. 3, a part of the non-mounting area may be removed.

  Such a joining member 100 is applied to electrical connection with a circuit 41 formed on the substrate 40. As such a configuration, an electronic device 200 shown in FIGS. 7 and 8 can be considered. The electronic device 200 includes capacitors 31 and 32, a bonding member 100, a substrate 40, and a mold resin 50. In order to manufacture the electronic device 200, first, as illustrated in FIG. 4, the bonding member 100 is mounted on the substrate 40. At this time, the mounting region of the joining member 100 is mounted on the substrate 40, and the first connecting portion 21 and the non-mounting region are arranged outside. Next, as shown in FIG. 5, the capacitors 31 and 32 are mounted on the joining member 100. Next, as shown in FIG. 6, unnecessary non-mounting regions are removed. Finally, as shown in FIG. 7, the bonding member 100, the capacitors 31, 32, and the substrate 40 are covered with a mold resin 50 so that the first connecting portion 21 is exposed to the outside. Through the above steps, the electronic device 200 shown in FIG. 7 is manufactured, and the capacitors 31 and 32 are connected in series to the circuit 41 as shown in FIG.

  Next, the case where the capacitors 31 to 33 are mounted on the mounting portions 11 to 14 will be described. In this case, as shown in FIG. 9, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31, and the mounting portions 13 and 14 are mounted by the second capacitor 32. The second capacitor 32 is mounted on the mounting portions 13 and 14 so as to be bridged. The third capacitor 33 is mounted on the mounting portions 12 and 13 so that the mounting portions 12 and 13 are bridged by the third capacitor 33. In the configuration shown in FIG. 9, since the mounting portions 12 and 13 are electrically connected via the first connecting portion 21, the first capacitor 31 and the second capacitor 32 are connected to the second mounting portion 12 and the second mounting portion 21. The first connection portion 21 and the third mounting portion 13 are connected in series, and the capacitors 31 to 33 are not connected in series. Therefore, as shown in FIG. 10, a part of the non-mounting area is removed together with the first connecting portion 21. Thus, the second mounting portion 12 and the third mounting portion 13 are connected via the third capacitor 33, and the first capacitor 31 and the second capacitor 32 are connected to the second mounting portion 12, the third capacitor 33, and The third mounting part 13 is connected in series. As a result, the capacitors 31 to 33 are connected in series. Note that the non-mounting area may not be removed.

  In order to manufacture the electronic device 200 having the capacitors 31 to 33, the bonding member 100, the substrate 40, and the mold resin 50, after the bonding member 100 is mounted on the substrate 40, as shown in FIG. Capacitors 31 to 33 are mounted on the bonding member 100. Next, as shown in FIG. 12, the non-mounting area is removed together with the first connecting portion 21. Finally, as shown in FIG. 13, the bonding member 100, the capacitors 31 to 33, and the substrate 40 are covered with the mold resin 50 so that a part of the non-mounting area is exposed to the outside. Through the above steps, the electronic device 200 shown in FIG. 13 is manufactured, and capacitors 31 to 33 are connected in series to the circuit 41 as shown in FIG. As a specific example of the circuit 41, a DCDC converter or the like can be employed. As described above, the voltage supplied to the DCDC converter can be increased by connecting three capacitors 31 to 33 in series instead of two.

  As described above, in the case of the bonding member 100 according to the present embodiment, two or three capacitors can be connected in series.

  In the present embodiment, an example in which the mounting portions 11 to 14 are sequentially arranged in the y direction is shown. However, as shown in FIG. 15, the first mounting unit 11 and the second mounting unit 12 are arranged in the x direction, the third mounting unit 13 and the fourth mounting unit 14 are arranged in the x direction, and the second mounting unit 12 is arranged. It is also possible to adopt a configuration in which the third mounting portion 13 is arranged in the y direction. In this case, as shown in FIG. 16, the capacitors 31 and 32 are mounted on the mounting portions 11 to 14. And as shown in FIG. 17, the capacitors 31-33 are mounted in the mounting parts 11-14, and a part of non-mounting area | region is removed with the 1st connection part 21. As shown in FIG. According to this, when the three capacitors 31 to 33 are mounted on the mounting portions 11 to 14, the three capacitors 31 to 33 are arranged in a zigzag manner in the y direction, and a part of the capacitors 31 and 33 and the capacitors 32 and 33 are arranged. Are opposed to each other in the x direction. Therefore, as shown in FIG. 9, capacitors 31 to 33 are mounted on the joining member 100 as compared with a configuration in which a part of the capacitors 31 and 33 and a part of the capacitors 32 and 33 do not face each other in the x direction. An increase in the size of the member in the y direction is suppressed. Of course, in the configuration shown in FIG. 9, if the arrangement is devised, a part of the capacitors 31 and 33 and a part of the capacitors 32 and 33 face each other in the x direction. However, in the joining member 100 shown in FIG. 15, a part of the capacitors 31 and 33 and a part of the capacitor 32.33 are more likely to face each other in the x direction, and the facing area is also likely to increase. Therefore, an increase in the size of the above-described member in the y direction is easily suppressed.

  Incidentally, in order to manufacture the electronic device 200 having the capacitors 31 to 33, the joining member 100 shown in FIG. 15, the substrate 40, and the mold resin 50, first, as shown in FIG. The joining member 100 is mounted. At this time, a part of the mounting area of the joining member 100 is mounted on the substrate 40, and a part of the remaining mounting area, the first connecting portion 21, and the non-mounting area are arranged outside. Next, as shown in FIG. 19, capacitors 31 to 33 are mounted on the bonding member 100. Next, as shown in FIG. 20, the non-mounting area is removed together with the first connecting portion 21. Finally, as shown in FIG. 21, the bonding member 100, the capacitors 31 to 33, and the substrate 40 are covered with a mold resin 50 so as to cover the third capacitor 33 that protrudes from the substrate 40. Through the above steps, the electronic device 200 shown in FIG. 21 is manufactured. According to this, since it is not necessary to secure a mounting area for mounting the third capacitor 33 on the substrate 40, an increase in the size of the substrate 40 is suppressed.

(Second Embodiment)
Next, 2nd Embodiment of this invention is described based on FIGS. Since the joining member 100 according to the second embodiment is often in common with that according to the first embodiment, a detailed description of the common parts will be omitted below, and different parts will be described mainly. In addition, the same code | symbol is provided to the element same as the element shown in 1st Embodiment.

  In 1st Embodiment, the joining member 100 showed the example which has the mounting parts 11-14 and the 1st connection part 21. As shown in FIG. On the other hand, this embodiment is characterized in that the joining member 100 according to the first embodiment has one fifth mounting portion 15 and a second connecting portion 22. With this configuration, in the first embodiment, in addition to the two capacitors 31 and 32, one third capacitor 33 can be connected in series, but in this embodiment, in addition to the two capacitors 31 and 32, Two third capacitors 33 and 34 can be connected in series. In the following, for the sake of convenience, the reference numerals are also increased as the numbering of the capacitors increases. Therefore, the third capacitor 34 is denoted as the fourth capacitor 34.

  The fifth mounting unit 15 has a region for mounting the first terminal of a certain capacitor (for example, the third capacitor 33) and a region for mounting the second terminal of another capacitor (for example, the fourth capacitor 34). As shown in FIG. 22, they are disposed between the connecting portions 12 and 13 in the mounting portions 11 to 14 that are sequentially arranged in the y direction. The mounting portions 12 and 15 are electrically and mechanically connected via the first connecting portion 21, and the mounting portions 13 and 15 are electrically and mechanically connected via the second connecting portion 22. The second connecting portion 22 is located closer to the mounting area of the mounting portions 11 to 15 than the first connecting portion 21.

  As shown in FIG. 23, when capacitors 31 and 32 are mounted on mounting portions 11 to 15, first capacitor 31 is mounted on mounting portions 11 and 12 so that mounting portions 11 and 12 are bridged by first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. As a result, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the first connecting portion 21, the fifth mounting portion 15, the second connecting portion 22, and the third mounting portion 13. Connected.

  As shown in FIG. 24, when the capacitors 31 to 33 are mounted on the mounting portions 11 to 15, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 15 so that the mounting portions 12 and 15 are bridged by the third capacitor 33, and the mounting portions 12 and 15 are electrically connected via the third capacitor 33. A part of the non-mounting region is removed together with the first connecting portion 21 therebetween. As a result, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, the fifth mounting portion 15, the second coupling portion 22, and the third mounting portion 13. Is done. As a result, the capacitors 31 to 33 are connected in series.

  As shown in FIG. 25, when the capacitors 31 to 33 are mounted on the mounting portions 11 to 15, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. Then, the third capacitor 33 is mounted on the mounting portions 12 and 13 so that the mounting portions 12 and 13 are bridged by the third capacitor 33, and the mounting portions 12 and 13 are electrically connected via the third capacitor 33. A part of the non-mounting area is removed together with the connecting portions 21 and 22 therebetween. Thereby, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, and the third mounting portion 13. As a result, the capacitors 31 to 33 are connected in series. Incidentally, in the case of this configuration, the fifth mounting portion 15 is removed, and it becomes easier to adopt a capacitor having a larger capacity than the capacitors 31 and 32 as the third capacitor 33.

  As shown in FIG. 26, when the capacitors 31 to 34 are mounted on the mounting portions 11 to 15, the first capacitor 31 is connected to the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 15 so that the mounting portions 12 and 15 are bridged by the third capacitor 33, and the fourth capacitors 34 and 15 are bridged by the fourth capacitor 34. A capacitor 34 is mounted on the mounting portions 13 and 15. And between the 1st connection part 21 between the mounting parts 12 and 15 electrically connected via the 3rd capacitor | condenser 33, and the mounting parts 13 and 15 electrically connected via the 4th capacitor | condenser 34 A part of the non-mounting area is removed together with the second connecting portion 22. As a result, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, the fifth mounting portion 15, the fourth capacitor 34, and the third mounting portion 13. The As a result, the capacitors 31 to 34 are connected in series.

  As described above, in the case of the bonding member 100 according to this embodiment, two to four capacitors can be connected in series.

  As described above, the second connecting portion 22 is located closer to the mounting area of the mounting portions 11 to 15 than the first connecting portion 21. Therefore, unlike the configuration in which the second connecting portion 22 and the first connecting portion 21 are arranged in the y direction, as shown in FIG. 24, the second connecting portion 22 and the first connecting portion 21 are arranged along the y direction. By removing the non-mounting regions of the mounting portions 12, 13, and 15 between the first connecting portion 21 and the first mounting portion 21, the first connecting portion 21 can be removed. Needless to say, although the above-described effects are not achieved, it is possible to employ a configuration in which the connecting portions 21 and 22 are arranged in the y direction.

  In this embodiment, the 5th mounting part 15 showed the example arrange | positioned between the connection parts 12 and 13 in the mounting parts 11-14 sequentially arranged in ay direction. However, as shown in FIG. 27, the first mounting unit 11 and the second mounting unit 12 are arranged in the x direction, the third mounting unit 13 and the fourth mounting unit 14 are arranged in the x direction, and the second mounting unit 12 is arranged. It is also possible to employ a configuration in which the third mounting portion 13 and the third mounting portion 13 are arranged in the y direction via the fifth mounting portion 15. In this case, as shown in FIG. 28, the capacitors 31 and 32 are mounted on the mounting portions 11 to 15. And as shown in FIG. 29, the capacitors 31-33 are mounted in the mounting parts 11-15, and a part of non-mounting area | region is removed with the 1st connection part 21. As shown in FIG. Further, as shown in FIG. 30, capacitors 31 to 34 are mounted on the mounting portions 11 to 15, and a part of the non-mounting area is removed together with the connecting portions 21 and 22. According to this modification, it is possible to obtain the same effects as those of the modification shown in the first embodiment.

  In this embodiment, the example which has the 5th connection part 15 and the 2nd connection part 22 in addition to the mounting parts 11-14 and the 1st connection part 21 was shown. However, the number of the fifth connecting portions 15 and the second connecting portions 22 is not limited to the above example, and may be any number. For example, as shown in FIG. 31, a configuration having two fifth mounting portions 15 and 16 and second connection portions 22 and 23 may be employed. Hereinafter, for convenience, the fifth mounting portion 16 is referred to as a sixth mounting portion 16, and the second connecting portion 23 is referred to as a third connecting portion 23.

  In the modification shown in FIG. 31, the mounting portions 11 to 14 are sequentially arranged in the y direction, and the connecting portions 15 and 16 are arranged side by side between the connecting portions 12 and 13. The mounting parts 12 and 15 are electrically and mechanically connected via the first connecting part 21, and the mounting parts 15 and 16 are electrically and mechanically connected via the second connecting part 22, and the mounting part 13 and 16 are electrically and mechanically connected via the third connecting portion 23. The third connecting part 23 is located closer to the mounting area of the mounting parts 11 to 16 than the connecting parts 21 and 22, and the second connecting part 22 is more than the first connecting part 21 to the mounting parts 11 to 16. It is located on the mounting area side.

  As shown in FIG. 32, when capacitors 31 and 32 are mounted on mounting portions 11 to 16, first capacitor 31 is mounted on mounting portions 11 and 12 so that mounting portions 11 and 12 are bridged by first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. Thus, the first capacitor 31 and the second capacitor 32 are connected to the second mounting portion 12, the first connecting portion 21, the fifth mounting portion 15, the second connecting portion 22, the sixth mounting portion 16, and the third connecting portion 23. And connected in series via the third mounting portion 13.

  As shown in FIG. 33, when the capacitors 31 to 33 are mounted on the mounting portions 11 to 16, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 15 so that the mounting portions 12 and 15 are bridged by the third capacitor 33, and the mounting portions 12 and 15 are electrically connected via the third capacitor 33. A part of the non-mounting region is removed together with the first connecting portion 21 therebetween. As a result, the first capacitor 31 and the second capacitor 32 are connected to the second mounting part 12, the third capacitor 33, the fifth mounting part 15, the second connecting part 22, the sixth mounting part 16, the third connecting part 23, And they are connected in series via the third mounting portion 13. As a result, the capacitors 31 to 33 are connected in series.

  As shown in FIG. 34, when the capacitors 31 to 33 are mounted on the mounting portions 11 to 16, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 16 so that the mounting portions 12 and 16 are bridged by the third capacitor 33, and the mounting portions 12 and 16 are electrically connected via the third capacitor 33. A part of the non-mounting area is removed together with the connecting portions 21 and 22 therebetween. Thereby, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, the sixth mounting portion 16, the third connecting portion 23, and the third mounting portion 13. Is done. As a result, the capacitors 31 to 33 are connected in series. Incidentally, in this configuration, a capacitor having a larger capacity than the capacitors 31 and 32 can be easily adopted as the third capacitor 33.

  As shown in FIG. 35, when the capacitors 31 to 33 are mounted on the mounting portions 11 to 16, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. Then, the third capacitor 33 is mounted on the mounting portions 12 and 13 so that the mounting portions 12 and 13 are bridged by the third capacitor 33, and the mounting portions 12 and 13 are electrically connected via the third capacitor 33. A part of the non-mounting area is removed together with the connecting parts 21 to 23 therebetween. Thereby, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, and the third mounting portion 13. As a result, the capacitors 31 to 33 are connected in series. Incidentally, in this configuration, a capacitor having a larger capacity than the capacitors 31 and 32 can be easily adopted as the third capacitor 33.

  As shown in FIG. 36, when the capacitors 31 to 34 are mounted on the mounting portions 11 to 16, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 15 so that the mounting portions 12 and 15 are bridged by the third capacitor 33, and the fourth capacitors 34 and 15 are bridged by the fourth capacitor 34. A capacitor 34 is mounted on the mounting portions 15 and 16. And between the 1st connection part 21 between the mounting parts 12 and 15 electrically connected via the 3rd capacitor | condenser 33, and the mounting parts 15 and 16 electrically connected via the 4th capacitor | condenser 34 A part of the non-mounting area is removed together with the second connecting portion 22. As a result, the first capacitor 31 and the second capacitor 32 are connected to the second mounting portion 12, the third capacitor 33, the fifth mounting portion 15, the fourth capacitor 34, the third connection portion 23, and the third mounting portion 13. Are connected in series. As a result, the capacitors 31 to 34 are connected in series.

  As shown in FIG. 37, when capacitors 31 to 34 are mounted on mounting portions 11 to 16, first capacitor 31 is mounted on mounting portions 11 and 12 so that mounting portions 11 and 12 are bridged by first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 16 so that the mounting portions 12 and 16 are bridged by the third capacitor 33, and the fourth capacitor 34 is bridged by the fourth capacitor 34. A capacitor 34 is mounted on the mounting portions 13 and 16. And between the connection parts 21 and 22 between the mounting parts 12 and 16 electrically connected via the 3rd capacitor | condenser 33, and between the mounting parts 13 and 16 electrically connected via the 4th capacitor | condenser 34 A part of the non-mounting area is removed together with the third connecting portion 23. As a result, the first capacitor 31 and the second capacitor 32 are connected in series via the second mounting portion 12, the third capacitor 33, the sixth mounting portion 16, the fourth capacitor 34, and the third mounting portion 13. The As a result, the capacitors 31 to 34 are connected in series. Incidentally, in this configuration, a capacitor having a larger capacity than the capacitors 31, 32, and 34 can be easily adopted as the third capacitor 33.

  As shown in FIG. 38, when the capacitors 31 to 35 are mounted on the mounting portions 11 to 16, the first capacitor 31 is mounted on the mounting portions 11 and 12 so that the mounting portions 11 and 12 are bridged by the first capacitor 31. The second capacitor 32 is mounted on the mounting portions 13 and 14 so that the mounting portions 13 and 14 are bridged by the second capacitor 32. The third capacitor 33 is mounted on the mounting portions 12 and 15 so that the mounting portions 12 and 15 are bridged by the third capacitor 33, and the fourth capacitors 34 and 15 are bridged by the fourth capacitor 34. A capacitor 34 is mounted on the mounting portions 15 and 16. Then, the fifth capacitor 35 is mounted on the mounting portions 13 and 16 so that the mounting portions 13 and 16 are bridged by the fifth capacitor 35. In addition, the first connecting portion 21 between the mounting portions 12 and 15 electrically connected via the third capacitor 33 and the second between the mounting portions 15 and 16 electrically connected via the fourth capacitor 34 are provided. A part of the non-mounting region is removed together with the connecting portion 22 and the third connecting portion 23 between the mounting portions 13 and 16 electrically connected via the fifth capacitor 35. Thus, the first capacitor 31 and the second capacitor 32 are connected to the second mounting part 12, the third capacitor 33, the fifth mounting part 15, the fourth capacitor 34, the sixth mounting part 16, the fifth capacitor 35, and They are connected in series via the third mounting portion 13. As a result, the capacitors 31 to 35 are connected in series.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In this embodiment, the example which employ | adopted the capacitor | condenser was shown as an electronic element. However, the electronic element mounted on the bonding member 100 is not limited to the above example, and any electronic element having two terminals (passive element, active element) can be used as appropriate. For example, a resistor or a diode can be employed.

DESCRIPTION OF SYMBOLS 11 ... 1st mounting part 12 ... 2nd mounting part 13 ... 3rd mounting part 14 ... 4th mounting part 21 ... Connection part 31 ... 1st electronic element 32 ... Second electronic element 33 ... third electronic element 100 ... joining member

Claims (3)

A joining member for connecting a plurality of electronic elements (31 to 33) having a first terminal and a second terminal in series,
A first mounting portion (11) for mounting the first terminal of the first electronic element (31), a second mounting portion (12) for mounting the remaining second terminals,
A third mounting portion (13) for mounting the first terminal of the second electronic element (32), a fourth mounting portion (14) for mounting the remaining second terminals,
A connecting portion (21) for electrically and mechanically connecting the second mounting portion and the third mounting portion to each other;
The connecting portion is removable according to the number of the electronic elements to be mounted,
The second mounting portion has a region for mounting the first terminal of the third electronic element (33) in addition to the region for mounting the second terminal of the first electronic element,
The third mounting portion, in addition to the region for mounting the first terminal of the second electronic element, the bonding member, wherein that you have has an area for mounting the second terminal of the third electronic device . Having at least one fifth mounting portion (15, 16) disposed between the second mounting portion and the third mounting portion;
The fifth mounting part is electrically and mechanically connected to the second mounting part and the third mounting part via the connecting part,
The fifth mounting portion, a region for mounting a first terminal of a third electronic device, and characterized that you have has a region mounting the second terminal of the other of the third electronic device, the The joining member according to claim 1. Each of the first to fourth mounting portions has a mounting surface on which the electronic element is mounted along a prescribed plane defined by an x direction and a y direction that are orthogonal to each other.
The first mounting portion and the second mounting portion are arranged in the x direction,
The third mounting portion and the fourth mounting portion are arranged in the x direction,
The joining member according to claim 1, wherein the second mounting portion and the third mounting portion are arranged in the y direction.

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