JP5795172B2 - Semiconductor manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus in which a large number of substrates are arranged side by side on a single tray and a process is performed on all the substrates simultaneously.

  In recent years, in order to improve the production efficiency of semiconductor devices, the diameter of a substrate (wafer) on which semiconductor devices are mounted has been increased. Along with this tendency, there is a tendency to increase the diameter of the tray (Patent Document 1) that supports the substrate when performing the process. As a conventional tray, in order to stably support the substrate, a tray having a larger area than the substrate to be placed is used. And by enlarging a tray with a board | substrate, many semiconductor devices can be mounted in a board | substrate and it can process simultaneously with respect to each semiconductor device.

  However, since the tray having an increased diameter increases in weight, there is a possibility that stable conveyance of the substrate placed on the tray may be hindered. Therefore, it is necessary to select a transfer robot and a gate valve that are strong enough to withstand the increase in the weight of the tray. In this case, a large-scale apparatus modification is required.

  Further, when processing is performed using a tray having a larger area than the substrate to be placed, the ratio of the area of the processing region to the tray area (processing efficiency) is low. Even if a plurality of small substrates are placed and the processing area is increased as much as possible, the processing efficiency does not increase dramatically. For example, when nine nine-inch substrates are placed on a 300 mm tray for processing, the processing efficiency is only about 53%. The low processing efficiency means that the processing material is distributed at a high ratio to those other than the substrate, resulting in an extra cost.

JP-A-9-219440

  The present invention has been made in consideration of the above points, and is a tray that supports a part of the non-processed surface of the substrate that protrudes, and a portion that holds the substrate is located on the side surface of the substrate. An object of the present invention is to provide a semiconductor manufacturing apparatus including a tray provided on a main surface so as to be in contact with and enclose.

According to a first aspect of the present invention, there is provided a semiconductor manufacturing apparatus, a chamber for performing a process, a support base disposed in the chamber and having a flat surface, and one main surface being in contact with the one surface of the support base. And a single plate-like tray, and a plurality of wafer-like substrates are placed on the other main surface of the tray, and a part of each of the substrates is By protruding from the other main surface of the tray, the substrate has a contact area and a non-contact area with the tray, and at least the center of gravity of the substrate is included in the contact area. The holding part of the substrate is provided so as to be in contact with and surround the side surface of the substrate in a region of the other main surface of the tray that is not in contact with the non-processing surface of the substrate. And

A semiconductor manufacturing apparatus according to a second aspect of the present invention is the semiconductor manufacturing apparatus according to the first aspect, wherein the area of the tray is smaller than the total area of the plurality of wafer-like substrates, and the holding portion is provided on a side surface of the substrate. It is characterized by surrounding more than half.

  A semiconductor manufacturing apparatus according to a third aspect of the present invention is the semiconductor manufacturing apparatus according to the first or second aspect, wherein the distance between the holding portion and the substrate increases as the distance from the other main surface of the tray increases. And

  A semiconductor manufacturing apparatus according to a fourth aspect of the present invention is characterized in that, in any one of the first to third aspects, the height of the holding portion is equal to the thickness of the substrate.

  A semiconductor manufacturing apparatus according to a fifth aspect of the present invention is the semiconductor manufacturing apparatus according to the first or second aspect, wherein the holding portion includes a first portion provided so as to be in contact with the side surface of the substrate and a side surface of the substrate in a thickness direction. It is provided on the first part so as to be in contact with and enclose the curved surface expanded to the second part, and the distance between the curved surface and the second part increases as the distance from the other main surface of the tray increases. It is characterized by that.

  A semiconductor manufacturing apparatus according to a sixth aspect of the present invention is characterized in that, in any one of the first to fifth aspects, the holding portion has a wall shape.

  A semiconductor manufacturing apparatus according to a seventh aspect of the present invention is characterized in that, in any one of the first, second, and fourth aspects, the holding portion has a pin shape.

  A semiconductor manufacturing apparatus according to an eighth aspect of the present invention is the semiconductor manufacturing apparatus according to the first or second aspect, wherein a region of the other main surface of the tray that is in contact with the non-processed surface of the substrate is a flat shape. The region where the non-processed surface is not in contact has a rough surface shape, and the latter functions as the holding portion.

  A semiconductor manufacturing apparatus according to a ninth aspect of the present invention is characterized in that, in any one of the first to eighth aspects, the holding portion is integral with the tray.

  The tray provided in the semiconductor manufacturing apparatus according to the present invention has a portion (holding portion) that supports a plurality of substrates in a state in which each of the trays protrudes from the main surface, and surrounds and holds the side surfaces of each substrate. It is formed on the main surface. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the present invention, since the substrate can be stably processed even when the substrate has a non-contact area with the tray, the total area of the plurality of substrates placed on the tray May exceed the area of the tray. That is, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, a tray can be reduced in weight and the stable conveyance of a board | substrate can be implement | achieved.

  Further, according to the configuration of the present invention, since the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, the ratio of the area of the processing region to the area of the tray (processing efficiency) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

(A) It is sectional drawing seen from the side surface of the process processing apparatus which concerns on 1st embodiment. (B) It is the figure which looked at the board | substrate and its supporting tray vicinity from the upper surface among process processing apparatuses. (A), (b) It is sectional drawing seen from the side surface of the board | substrate and tray which concern on 1st embodiment. (A), (b) It is sectional drawing seen from the side surface of the board | substrate and tray which concern on the modification 1. As shown in FIG. (A), (b) It is sectional drawing seen from the side surface of the board | substrate and tray which concern on the modification 2. As shown in FIG. It is the figure which looked at the tray which concerns on the modification 3, and the board | substrate supported by a tray from the upper surface. (A), (b) It is the figure seen from the side surface of the board | substrate which concerns on the modification 3, and its support tray. It is the figure which looked at the tray which concerns on the modification 4, and the board | substrate supported by a tray from the upper surface. (A), (b) It is sectional drawing seen from the side surface of the board | substrate which concerns on the modification 5, and a tray. (C) It is the figure which expanded the holding | maintenance part vicinity of the board | substrate which concerns on the modification 5, and was seen from the side surface. It is the figure which looked at the tray concerning the modification 6, and the board | substrate supported by a tray from the upper surface.

  Hereinafter, based on a preferred embodiment, the present invention will be described with reference to the drawings.

<First embodiment>
FIG. 1A is a diagram showing a schematic configuration of a plasma processing apparatus 100 in a state where plasma is generated according to the first embodiment. The plasma processing apparatus 100 includes a chamber 101, a support base 102 of a tray 103 on which a substrate 104 to be processed is placed, a support base 102 that forms an upper electrode 106 and a lower electrode, which are disposed on the bottom surface inside the chamber 101. Means for generating a plasma atmosphere P, and magnetic field generation means M that is disposed outside the chamber 101 and controls the distribution of the plasma atmosphere P.

  The support table 102 has a flat shape at least in a region where the tray is placed, and includes a suction electrode pair (not shown) inside, and sucks the tray 103 by electrical attraction.

  The tray 103 has a single flat plate shape at least in an area where the substrate 104 is disposed in contact. The tray 103 is arranged such that one main surface 103S thereof is in contact with and overlaps the one surface 102S of the support base 102, and the other main surface 103T has a plurality of wafer-like substrates 104 on its non-processed surface 104B. Support by overlapping in contact. FIG. 1B is an enlarged view of a region A in the vicinity of the tray 103 on which a plurality of substrates 104 are placed in FIG.

  A part of each substrate 104 is placed so as to protrude from the other main surface 103T of the tray 103. That is, the substrate 104 has a contact region R1 and a non-contact region R2 with the tray 103. There is no restriction on the area ratio between the contact region R1 and the non-contact region R2, but at least the center of gravity of the substrate 104 needs to be included in the contact region R1 in order to prevent the substrate 104 from dropping from the tray 103.

  2 (a) and 2 (b) are cross-sectional views taken along lines BB and CC in FIG. 1 (b), respectively. A portion 105 (holding portion) for holding the substrate is provided in a region R3 of the other main surface 103T of the tray where the non-processing surface 104B of the substrate is not in contact with the side surface 104S of the substrate. As described above, since the center of gravity of the substrate 104 needs to be included in the contact region R1 with the tray 103, the holding unit 105 is desirably formed so as to surround more than half of the side surface 104S of the substrate. The side surface 104S of the substrate and the holding portion 105 may be in close contact, but may be separated as long as the substrate 104 does not slip.

  The holding unit 105 performs a film forming process in a state where a mask is disposed in the region R1 where the non-processing surface 104B of the substrate is in contact with the other main surface 103T of the tray, and only the region R3 where the non-processing surface 104B of the substrate is not in contact is performed. Further, it can be formed by laminating the materials constituting the holding portion 105. At this time, the material constituting the holding unit 105 may be the same as or different from the material constituting the tray 103.

  In the method using the film forming process, there is no need to process the other main surface 103T of the tray. Therefore, damage to the tray 103 due to processing can be prevented.

  In addition, the holding unit 105 performs an etching process in a state where a mask is disposed in the region R3 where the non-processing surface 104B of the substrate is not in contact with the other main surface 103T of the tray, and the region R1 where the non-processing surface 104B of the substrate is in contact It is also possible to form only by digging in the thickness direction of the tray 103.

  In the etching method, the holding portion 105 having a desired size and shape is formed by finely controlling the etching amount of the tray 103 in accordance with the thickness of the substrate to be placed, the shape of the side surface, and the like. be able to.

  The holding part 105 needs to be formed so as not to block the process processing on the processing surface 104U of the substrate. Therefore, it is desirable that the height H of the holding portion 105 from the other main surface 103T of the tray is approximately the same as the thickness of the substrate 104.

  By setting the height H of the holding unit 105 to be approximately the same as the thickness of the substrate 104, it is possible to prevent the holding unit 105 from blocking processing from obliquely above the outer periphery of the processing surface 104 </ b> U of the substrate 104.

  The tray included in the semiconductor manufacturing apparatus according to the first embodiment supports a plurality of substrates in a state in which each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit) ) Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the first embodiment, since the substrate can be stably processed even when the substrate has a non-contact area with the tray, the plurality of substrates placed on the tray can be processed. The total area may exceed the area of the tray. That is, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the first embodiment, since the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, the ratio of the area of the processing region to the area of the tray (processing (Efficiency) can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

[Modification 1]
3 (a) and 3 (b) are views corresponding to cross sections cut along the BB line and the CC line of the tray supporting the substrate shown in FIG. 1 (b), respectively. It is a figure which shows the modification 1. FIG. As shown in FIGS. 3A and 3B, in the holding unit 115 in the first modification, the distance between the other main surface 113T of the tray and the side surface 114S of the substrate is far from the other main surface 113T of the tray. It has a shape that becomes wider according to. The configuration other than the holding unit 115 is the same as that of the first embodiment.

  According to the configuration of the first modification, the side surface 114 </ b> S of the substrate does not contact the holding unit 115 while the substrate 114 is placed on the tray 113. Therefore, damage such as breakage of the side surface 114S of the substrate due to contact with the holding portion 115 can be prevented.

  The tray included in the semiconductor manufacturing apparatus according to Modification 1 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the first modification, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, and thus the total of the plurality of substrates placed on the tray. The area may exceed the area of the tray. That is, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the first modification, the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, so the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

[Modification 2]
4 (a) and 4 (b) are views corresponding to sections cut along the BB line and the CC line of the tray supporting the substrate shown in FIG. 1 (b), respectively, according to the first embodiment. It is a figure which shows the modification 2. FIG. As shown in FIGS. 4A and 4B, the holding portion 125 in the second modification is configured by a first part 125a and a second part 125b provided on the first part 125a. The first portion 125a is provided on the other main surface 123T of the tray so as to be in contact with the side surface 124S of the substrate. The second portion 125b surrounds the first portion 125a in contact with a virtual curved surface obtained by extending the side surface 124S of the substrate in the thickness direction, and the distance from the curved surface is the other main surface of the tray. It is provided so that it becomes wider as it gets away from 123T. The configuration other than the holding unit 125 is the same as that of the first embodiment.

  In the configuration of the second modification, the height (H1 + H2) of the holding unit 125 is larger than the height H of the holding unit 105 according to the configuration of the first embodiment. Therefore, it is possible to make it difficult for the substrate 124 to ride on the holding unit 125 during the process processing or the substrate transport. Even if the height (H1 + H2) of the holding portion 125 is larger than the thickness of the substrate 124, the configuration of the second portion 125b prevents the processing from obliquely above the outer periphery of the processing surface 124U of the substrate 124 from being blocked. Can be prevented.

  The tray provided in the semiconductor manufacturing apparatus according to Modification 2 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the modified example 2, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, and thus the total of the plurality of substrates placed on the tray. The area may exceed the area of the tray. Therefore, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the modification example 2, the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, and therefore the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

[Modification 3]
FIG. 5 is a view seen from the upper surface side of the tray 133 on which a plurality of substrates 134 are placed, and corresponds to a third modification of the first embodiment. FIGS. 6A and 6B are cross-sectional views taken along lines DD and EE in FIG. 5, respectively. As shown in FIGS. 5 and 6, the holding portion 135 in Modification 3 has a shape of a wall provided along the side surface 134 </ b> S of the substrate, and of the other main surface 133 </ b> T of the tray, the non-processed surface of the substrate The difference from the first embodiment is that the holding portion 135 is not provided in a partial region R4 of the region R3 that is not in contact with 134B. The configuration other than the holding unit 135 is the same as that of the first embodiment.

  The tray provided in the semiconductor manufacturing apparatus according to Modification 3 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the modified example 3, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, and thus the total of the plurality of substrates placed on the tray. The area may exceed the area of the tray. Therefore, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the third modification, the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, so the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

  Moreover, the volume can be made smaller than the holding part of 1st embodiment by making a holding part into a wall shape. Therefore, since the holding portion can be reduced in weight and the burden on the tray can be reduced, further stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber. .

[Modification 4]
FIG. 7 is a view as seen from the upper surface side of the tray 143 on which a plurality of substrates 144 are placed, and is a view corresponding to Modification 4 of the first embodiment. As shown in FIG. 7, the holding portion 145 in the modified example 4 has a shape including a plurality of pins provided so as to be distributed along the side surface 144S of the substrate, and of the other main surface 143T of the tray, The point from which the holding | maintenance part 145 is not provided in the one part area | region of area | region R3 which the non-processing surface 144B is not contacting differs from 1st embodiment. The configuration other than the holding unit 145 is the same as that of the first embodiment.

  The tray included in the semiconductor manufacturing apparatus according to Modification 4 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the modified example 4, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, so the total of the plurality of substrates placed on the tray The area may exceed the area of the tray. That is, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the modification example 4, since the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

  Moreover, the volume can be made smaller than the holding part of 1st embodiment by making a holding part into the shape which consists of a some pin. Therefore, since the holding portion can be reduced in weight and the burden on the tray can be reduced, further stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber. .

[Modification 5]
FIGS. 8A and 8B are views corresponding to cross sections cut along lines BB and CC of the tray supporting the substrate shown in FIG. 1B, respectively. It is a figure which shows the modification 5. FIG. FIG. 8C is a diagram for explaining the shape of the substrate holding portion 155 according to Modification 5 by enlarging the region F in the vicinity of the side surface 154S of the substrate shown in FIG. The configuration other than the holding unit 155 is the same as that of the first embodiment.

  As shown in FIGS. 8A and 8B, the holding portion 155 in the modification 5 is provided along the side surface 154S of the substrate. Further, as shown in FIG. 8C, the holding portion 155 has a rough surface shape in which unevenness is randomly distributed in a region R3 where the substrate 154 is not in contact with the other main surface 153T of the tray. . It is desirable that the unevenness is distributed so that the integral of the height H (depth) of the holding portion in the entire portion having the rough surface shape in the main surface 153T becomes zero. The height H of the holding portion needs to be at least high enough to prevent the substrate from sliding. FIGS. 8A and 8B show examples in which the entire region R3 has a rough surface shape, but at least the vicinity of the region surrounding the side surface 154S of the substrate may have a rough surface shape. That's fine.

  The tray provided in the semiconductor manufacturing apparatus according to the modified example 5 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the modified example 5, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, and thus the total of the plurality of substrates placed on the tray. The area may exceed the area of the tray. That is, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the modified example 5, since the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

  Moreover, the volume can be made smaller than the holding | maintenance part of 1st embodiment by making a holding | maintenance part into a rough surface shape. Therefore, since the holding portion can be reduced in weight and the burden on the tray can be reduced, further stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber. .

[Modification 6]
FIG. 9 is a diagram viewed from the upper surface side of the tray on which the plurality of substrates 164 are placed, and corresponds to a sixth modification of the first embodiment. As long as the center of gravity of the substrate 164 is included in the contact area R1 with the tray, as shown in FIG. 9, the substrates placed on the tray can be spaced from each other. The configuration other than the point where the side surfaces of the substrates are spaced apart is the same as that of the first embodiment.

  According to the configuration of the modified example 6, it is possible to prevent damage such as breakage due to contact between the side surfaces of the substrates. Moreover, it can prevent that a part of film | membrane formed in the side surface of each board | substrate contacts a side surface of another board | substrate, and deform | transforms and changes in quality. Furthermore, it is possible to prevent the foreign matter adhering to the side surface of the substrate from being propagated to the side surface of another substrate that is in contact.

  The tray provided in the semiconductor manufacturing apparatus according to Modification 6 supports a plurality of substrates in a state where each of the trays protrudes from the main surface, and holds and surrounds the side surfaces of each substrate (holding unit). Is formed. In order to prevent the substrate from slipping on the main surface of the tray or part of the substrate from being tilted and separated from the tray, the holding unit stably processes the substrate on the tray. Processing can be performed.

  Therefore, according to the configuration of the modified example 6, even if the substrate has a region that is not in contact with the tray, it is possible to perform processing stably, so the total of the plurality of substrates placed on the tray The area may exceed the area of the tray. Therefore, the tray area can be reduced regardless of the total area of the plurality of substrates that can be placed. Thereby, the tray can be reduced in weight, and stable conveyance of the substrate can be realized between the outside of the chamber and the support base in the chamber.

  Further, according to the configuration of the modified example 6, since the area of the tray can be made smaller than the total area of the plurality of substrates placed on the tray, the ratio of the area of the processing region to the area of the tray (processing efficiency) ) Can be increased. Thereby, the ratio of the processing material distribute | arranged to things other than a board | substrate can be made low, and extra cost can be suppressed.

  In the first embodiment and its modifications 1 to 6, the description has been given using the example in which three substrates are mounted on a circular tray. However, in the present invention, there are restrictions on the shape of the tray and the number of substrates. Absent.

  Further, in the first embodiment and the modifications 1 to 6 thereof, as a process processing chamber provided with a tray, a chamber for performing plasma processing is used as an example. The present invention is also applicable to a chamber to be performed.

  The present invention can be widely applied to a case where a process is performed in a state where a substrate to be processed is placed on a support member.

DESCRIPTION OF SYMBOLS 100 ... Plasma processing apparatus, 101 ... Chamber, 102 ... Support stand,
102S ... one side, 103, 113, 123 ... tray,
103S, 113S, 123S, 103T, 113T, 123T ... main surface,
104, 114, 124 ... substrate, 104B, 114B, 124B ... non-processed surface,
104S, 114S, 124S ... side face, 105, 115, 125 ... holding part,
106: upper electrode, H, H1, H2 ... height P ... plasma atmosphere, R2, R3 ... region.

Claims (9)

A chamber for process processing;
A support base disposed in the chamber and having a flat surface;
One main surface is placed so as to be in contact with and overlap the one surface of the support base, and has a single flat plate-like tray,
A plurality of wafer-like substrates are placed on the other main surface of the tray, and a part of each of the substrates protrudes from the other main surface of the tray, so that the substrate does not contact with the tray. The tray is shaped so that it has a contact area and at least the center of gravity of the substrate is included in the contact area ;
A holding part of the substrate is provided in a region of the other main surface of the tray that is not in contact with the non-processed surface of the substrate so as to be in contact with and surround the side surface of the substrate. manufacturing device. 2. The semiconductor manufacturing method according to claim 1 , wherein an area of the tray is made smaller than a total area of the plurality of wafer-like substrates, and the holding portion surrounds half or more of a side surface of the substrate. apparatus.   3. The semiconductor manufacturing apparatus according to claim 1, wherein an interval between the holding unit and the substrate is widened as the distance from the other main surface of the tray increases.   The height of the said holding | maintenance part is equal to the thickness of the said board | substrate, The semiconductor manufacturing apparatus in any one of Claims 1-3 characterized by the above-mentioned. The holding portion is provided with a first portion provided so as to be in contact with the side surface of the substrate, and
A second surface is provided on the first portion so as to surround and surround the side surface of the substrate in the thickness direction, and a distance from the curved surface increases as the distance from the other main surface of the tray increases. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor manufacturing apparatus is configured by a portion.   The semiconductor manufacturing apparatus according to claim 1, wherein the holding portion has a wall shape.   The semiconductor manufacturing apparatus according to claim 1, wherein the holding portion has a pin shape.   Of the other main surface of the tray, a region where the non-processing surface of the substrate is in contact is a flat shape, a region where the non-processing surface of the substrate is not in contact is a rough surface shape, and the latter is the holding surface. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor manufacturing apparatus functions as a unit.   The semiconductor manufacturing apparatus according to claim 1, wherein the holding unit is integral with the tray.

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