JP5768664B2 - Semiconductor device assembly method and semiconductor device assembly jig - Google Patents

Description

  The present invention relates to a semiconductor device assembly method and a semiconductor device assembly jig for assembling a semiconductor device having a semiconductor element such as a power semiconductor element (IGBT: Insulated Gate Bipolar Transistor).

2. Description of the Related Art Generally, a semiconductor device has a structure in which a circuit part in which an insulating substrate on which a semiconductor element is mounted is mounted on a metal base plate for heat dissipation is covered with an enclosing case.
When assembling the semiconductor device, a process of heating and fixing the circuit portion and the outer case using an adhesive is performed. Thereafter, a step of connecting the wiring between the terminal portion formed in the surrounding case and the insulating substrate by soldering with paste solder is performed.

  When bonding the circuit part and the enclosing case, apply the adhesive to the circuit part or enclosing case, and heat the adhesive surface while keeping the enclosing case under moderate pressure, so that the adhesive is cured. The circuit portion and the outer case are fixed.

  As a conventional technique for assembling a semiconductor device, there is a technique in which a case frame is provided with a groove and a stepped portion to be fitted to a lead frame, and the bonding between the case frame and the metal base plate and the solder bonding on the upper and lower sides of the insulating substrate are synchronized It has been proposed (Patent Document 1).

  In addition, the outer resin case is overlaid on the circuit assembly, and the soldering between the external lead-out terminal and the main circuit and the control circuit block and the bonding between the outer resin case and the metal base plate are collectively performed. A technique performed in the same process has been proposed (Patent Document 2).

  Furthermore, a technique has been proposed in which soldering between the metal base plate and the insulating substrate, soldering between the conductor pattern of the insulating substrate and the internal terminals, and adhesion between the metal base plate and the outer resin case are performed simultaneously (Patent Document 3). .

Japanese Patent Laid-Open No. 10-242338 JP-A-10-233484 Japanese Patent Laid-Open No. 7-32285

As a conventional assembly process of a semiconductor device, two processes are performed as described above, and heat treatment is performed in both processes.
That is, in the first step, after the adhesive is applied to the circuit part or the outer case, the outer case is set on the circuit part, and the circuit part and the outer case are uniformly bonded on the hot plate. Then, an appropriate pressure is applied and heated from the top of the outer case to cure the adhesive.

  In the second step, paste solder is applied to the terminal part formed in the outer case or the solder part of the circuit part, and heated by a reflow furnace or the like to perform connection by soldering. .

  Thus, in the conventional assembly process of the semiconductor device, since heat treatment is performed for both the first process and the second process, it takes a long thermal history to assemble the semiconductor device. become.

For this reason, there is a possibility that the circuit portion is oxidized and deformed by heat, and there is a problem that the quality and dimensional accuracy of the semiconductor device are deteriorated.
The present invention has been made in view of these points, and an object of the present invention is to provide a semiconductor device assembling method in which the number of assembling steps is shortened and the thermal history is reduced.

  Another object of the present invention is to provide a semiconductor device assembly jig capable of reducing the number of assembly steps and reducing the thermal history.

  In order to solve the above problems, a semiconductor device assembly method is provided. In the semiconductor device assembling method, an adhesive is applied to at least one bonding surface of a circuit part on which an insulating substrate on which a semiconductor element is mounted is mounted on a metal base plate and an outer case that houses the circuit part. Solder is applied to at least one of the terminal portion formed in the outer case and the solder portion of the circuit portion.

In addition, by preparing a jig having a tray part and a fixed frame part, combining the circuit part and the outer case between the tray part and the fixed frame part, and connecting the tray part and the fixed frame part to each other, the circuit part Then, the outer case is brought into a state of being pressed and fixed uniformly between the tray portion and the fixed frame portion, and subjected to heat treatment. The semiconductor device is assembled by collectively bonding the circuit portion and the enclosing case and soldering the terminal portion and the circuit portion by heat treatment.
Further, the tray portion is provided with a fixing bar provided with a pin, and the fixing frame portion is provided with a fixing device in which a fitting port for fitting with the pin is formed, and the adhesive surface of the outer case is attached to the circuit portion. Overlay and combine on the adhesive surface, press the upper part of the fixed frame part, fit the pin of the fixed bar to the fitting port of the fixing device, and connect the tray part and the fixed frame part to each other, The surrounding case is pressed and fixed uniformly between the tray portion and the fixing frame portion, and the fixing device includes a lever that releases the fitting with the fixing bar.

  In the semiconductor device assembly method, when the outer casing is assembled to the circuit section, the tray section and the fixed frame section are connected to each other, and the circuit section and the outer casing are pressed uniformly between the tray section and the fixed frame section. The semiconductor device was assembled by performing a heat treatment on the fixed state. As a result, the number of assembly steps can be shortened and the thermal history can be reduced, and the quality of the semiconductor device can be improved.

  In addition, when assembling the semiconductor device to the circuit portion of the outer case, the tray portion and the fixed frame portion are connected to each other, and the circuit portion and the outer case are connected between the tray portion and the fixed frame portion. It was set as the structure which presses uniformly and fixed. By assembling the semiconductor device using such a jig, it is possible to reduce the number of assembling steps and the heat history, and to improve the quality of the semiconductor device.

It is a figure which shows the semiconductor device assembly method. It is a figure which shows the assembly process of a semiconductor device. It is a figure which shows the assembly process of a semiconductor device. It is a figure which shows the assembly process of a semiconductor device. It is a figure which shows the assembly process of a semiconductor device. It is a figure which shows the semiconductor device assembly method. It is a figure which shows the semiconductor device assembly method. It is a figure which shows the semiconductor device assembly method. It is a top view of the tray part of a semiconductor device assembly jig. It is a side view of the tray part of a semiconductor device assembly jig. It is a figure which shows the mounting location of the circuit part on a tray part. It is a top view of the fixed frame part of a semiconductor device assembly jig. It is a figure which shows the state which the tray part and the fixed frame part have fitted. It is a figure which shows the state before the fitting of a fixing bar and a fixing device. It is a figure which shows the state which the fixing bar and the fixing device have fitted. It is a figure which shows the assembly flow of a semiconductor device. It is a figure which shows the assembly flow of a semiconductor device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a semiconductor device assembling method. In the semiconductor device assembling method, the semiconductor device assembly tool 30 is used to assemble the semiconductor device by housing the circuit portion 10 in the outer case 20.

  The circuit unit 10 includes a metal base plate 11 for heat dissipation, an insulating substrate 12 and a semiconductor element 13. The circuit unit 10 has a configuration in which an insulating substrate 12 on which a semiconductor element 13 is mounted is mounted on a metal base plate 11.

  The outer case 20 includes a terminal portion 21 connected to the insulating substrate 12 on which a circuit pattern or a conductive material is laid by soldering. The semiconductor device assembly jig 30 includes a tray part 31 and a fixed frame part 32.

The semiconductor device assembly method will be described below.
First, as shown in FIG. 1A, an adhesive is applied to at least one bonding surface of the circuit unit 10 and the outer case 20 with an adhesive application device or the like (in FIG. 1A, the adhesive is bonded to the outer case 20 side). Agent is applied). Also, solder is applied to at least one of the terminal portion 21 formed in the outer case 20 and the solder portion of the circuit portion 10 by a solder application device or the like (in the figure, solder is applied to the terminal portion 21 side). ing).

  Next, the positions of the circuit unit 10 and the outer case 20 are combined so that the bonding surface of the outer case 20 overlaps the bonding surface of the circuit unit 10. At this time, for example, a position-dedicated jig that is not shown may be used. Then, the circuit unit 10 and the surrounding case 20 are placed on a metal tray portion 31 as shown in FIG. 1B, and the fixed frame portion 32 is mounted on the upper portion of the surrounding case 20. At this time, by pressing the upper portion of the fixed frame portion 32, the fixing bar 31a provided in the tray portion 31 and the fixing device 32b provided in the fixed frame portion 32 are connected (fitted) to each other.

  By connecting the fixing bar 31 a and the fixing device 32 b, the circuit unit 10 and the outer case 20 are uniformly pressed and fixed between the tray unit 31 and the fixing frame unit 32. Thereafter, as shown in FIG. 1C, the circuit unit 10 and the surrounding case 20 are pressed and fixed uniformly between the tray unit 31 and the fixed frame unit 32 by reflow or the like. Heat treatment is performed. The mechanism of the fixing bar 31a and the fixing device 32b will be described later.

  Thus, the adhesive is cured and the solder is melted at the same time, and the bonding between the circuit unit 10 and the outer case 20 and the soldering between the terminal unit 21 and the circuit unit 10 are performed collectively to assemble the semiconductor device.

  As described above, in the semiconductor device assembling method, the circuit unit 10 and the enclosing case 20 are connected by connecting the tray unit 31 and the fixed frame unit 32 to each other when the enclosing case 20 is combined with the circuit unit 10. Then, the tray unit 31 and the fixed frame unit 32 are uniformly pressed and fixed. And it decided to assemble a semiconductor device by heat-processing with respect to this connection state. This makes it possible to shorten the number of assembly steps and reduce the heat history.

Next, a general assembly process of the semiconductor device will be described. 2 to 5 are views showing the assembly process of the semiconductor device.
In a conventional assembly process of a semiconductor device, as a first step, the circuit portion 40 and the outer case 50 are bonded by an adhesive, and as a second step, the terminal portions of the circuit portion 40 and the outer case 50 are provided. Connection with 51 is performed by soldering. 2 and 3 show the first step, and FIGS. 4 and 5 show the second step.

  FIG. 2 shows a state in which an adhesive is applied to the outer case 50. The circuit unit 40 includes a metal base plate 41, an insulating substrate 42, and a semiconductor element 43. The metal base plate 41 is, for example, a copper base plate. An insulating substrate 42 is mounted on the metal base plate 41, and a semiconductor element 43 is mounted on the insulating substrate 42.

  The surrounding case 50 is a case made of resin, and includes a metal (for example, copper) terminal portion 51. The terminal portion 51 is integrally formed with the outer case 50, and one end 51a of the terminal portion 51 is fixed to the side wall 50a of the outer case 50 with resin.

  Further, the other end 51b of the terminal portion 51 is a portion to be soldered with the solder portion of the insulating substrate 42 on which the circuit pattern or the conductive material is laid in the second step. Although the number of terminal portions is one in the drawing, a plurality of terminal portions are actually provided in the enclosing case 50.

  In assembling a semiconductor device using the circuit unit 40 and the outer case 50 having such a configuration, an adhesive is applied to the bottom of the outer case 50 by an adhesive application device or the like. An adhesive may be applied to the bonding surface of the circuit unit 40.

  FIG. 3 shows a state in which the heat treatment is performed with the circuit unit 40 and the outer case 50 overlapped. First, a metal fixing jig 61 is mounted on the heating hot plate 70. The surrounding case 50 to which the adhesive is applied is integrated with the bonding surface of the metal base plate 41 of the circuit unit 40. Next, the outer case 50 and the metal base 41 are fixed by a fixing jig 61. Thereafter, the heating hot plate 70 heats the bonding surface between the outer case 50 and the metal base plate 41 from below through the fixing jig 61.

  Further, at this time, the pressurizing jig 62 applies pressure from above the surrounding case 50 and presses the surrounding case 50 so as to be uniformly bonded to the metal base plate 41. As described above, by performing the heating and pressurizing treatment, the adhesive is uniformly cured, and the metal base plate 41 of the circuit unit 40 and the outer case 50 are uniformly fixed at predetermined positions.

  FIG. 4 shows a state in which paste solder is applied to the terminal portion 51 provided in the outer case 50 and heat treatment is performed. The assembly in which the circuit unit 40 and the enclosing case 50 are bonded is placed on the transport tray 80 and transported to the solder coating apparatus. The solder application device applies paste solder to the terminal portion 51 provided in the outer case 50.

Thereafter, the assembly to which the paste solder is applied is transferred to the reflow furnace while being placed on the transfer tray 80.
In the reflow furnace, the product is heated with a gradual temperature rise. For this reason, the rapid thermal shock to the circuit part 40 can be relieved. Thereafter, as the temperature rises, the solder portion between the terminal portion 51 of the surrounding case 50 and the insulating substrate 42 is soldered.

  FIG. 5 shows a state in which the terminal portion 51 provided in the outer case 50 and the solder portion between the insulating substrate 42 of the circuit portion 40 are soldered. When the second step is completed, the process proceeds to the cleaning step.

  Thus, in the conventional assembly process of the semiconductor device, the first process and the second process are performed independently. Further, adhesion of the circuit part 40 and the enclosing case 50 in the first process with an adhesive, and soldering of the terminal part 51 of the enclosing case 50 and the solder part of the circuit part 40 in the second process. In both steps, heat treatment is performed.

  Therefore, since the heat treatment is performed in two steps before the semiconductor device is assembled, the heat history takes a long time. Then, for example, the surface of the wiring pattern on the insulating substrate 42 may be oxidized by heat, or the terminal portion 51 of the outer case 50 may be deformed, and a plurality of terminal portions may contact each other. There was a problem that the quality of the apparatus and the dimensional accuracy deteriorated.

The present technology has been made in view of these points, and provides a semiconductor device assembling method and a semiconductor device assembling jig in which the number of assembling steps is shortened and the thermal history is reduced.
Next, the semiconductor device assembly method of the present technology will be described in detail. 6 to 8 are views showing a semiconductor device assembling method. FIG. 6A shows a state in which an adhesive is applied to the bottom of the outer case 20 and paste solder is applied to the terminal portion 21 of the outer case 20.

  The circuit unit 10 includes a metal base plate 11, an insulating substrate 12, and a semiconductor element 13. The metal base plate 11 is, for example, a copper base plate. An insulating substrate 12 is mounted on the metal base plate 11, and a semiconductor element 13 is mounted on the insulating substrate 12.

  The outer case 20 is a case made of resin, and includes a metal (for example, copper) terminal portion 21. The terminal portion 21 is integrally formed with the outer case 20, and one end 21 a of the terminal portion 21 is fixed to the side wall 20 a of the outer case 20 with resin.

  The other end portion 21b of the terminal portion 21 is a soldered portion of the insulating substrate 12 on which a circuit pattern or a conductive material is laid, and a soldered portion. In the drawing, one terminal portion is shown, but a plurality of terminal portions are actually provided in the outer case 20.

  In assembling a semiconductor device using the circuit unit 10 and the outer case 20 having such a configuration, a semiconductor device assembly jig 30 is prepared. As shown in FIG. 6B, the semiconductor device assembly jig 30 includes a metal tray portion 31 and a metal fixing frame portion 32. The tray portion 31 is provided with a fixing bar 31a, and the fixing frame portion 32 is provided with a fixing device 32b.

  The circuit unit 10 is mounted on the tray unit 31. In addition, an adhesive is applied to the adhesive surface of the bottom of the outer case 20 with respect to the outer case 20 by an adhesive application device or the like. Further, paste solder is applied to the terminal portion 21 of the outer case 20 by a solder application device or the like.

  Then, the circuit unit 10 and the outer case 20 are aligned and assembled so that the bonding surface of the outer case 20 and the bonding surface of the circuit unit 10 overlap, and the circuit unit 10 and the outer case 20 are mounted on the tray unit 31. Then, the fixed frame portion 32 is mounted on the upper part of the outer casing 20 in a state where both the adhesive and the paste solder are applied.

  In the illustrated example, the circuit unit 10 and the outer case 20 are assembled in advance and then placed on the tray unit 31 and the outer case 20 is attached. Instead, the circuit unit 10 is replaced with the tray unit 31. After mounting the fixed frame portion 32 on the outer case 20, the outer frame 20 may be aligned and assembled so that the bonding surface of the outer case 20 and the bonding surface of the circuit unit 10 overlap each other.

  FIG. 7 is a diagram illustrating a state in which heat treatment for curing the adhesive and melting the solder is performed. First, the outer case 20 to which the fixed frame portion 32 is attached is aligned with the bonding surface of the metal base plate 11 of the circuit portion 10 and the upper portion of the fixed frame portion 32 is pressed.

  At this time, the fixing device 32b provided in the fixed frame portion 32 and the fixing bar 31a provided in the tray portion 31 are fitted to each other, so that the circuit portion 10 and the surrounding case 20 are connected to the tray portion 31. It will be in the state where it was pressed uniformly between fixed frame parts 32, and was fixed.

  Thereafter, the circuit unit 10 and the outer case 20 fixed while receiving a uniform pressing force between the tray unit 31 and the fixed frame unit 32 are conveyed to the reflow furnace in this state, and the tray unit 31 is moved by the reflow furnace. Heat treatment is performed through the fixed frame portion 32.

  Thereby, the adhesive surface of the outer case 20 and the metal base plate 11 is heated, and the adhesive is uniformly cured. In addition, the paste solder applied to the terminal portion 21 of the outer case 20 is melted, and the terminal portion 21 and the solder portion of the insulating substrate 12 are soldered.

FIG. 8 shows a state when the heat treatment is completed and the fixed frame portion 32 is removed from the tray portion 31. When the assembly of the semiconductor device is completed, the process proceeds to a cleaning process.
Next, the connection mechanism of the semiconductor device assembly jig 30 will be described. FIG. 9 is a plan view of the tray portion of the semiconductor device assembly jig. FIG. 10 is a side view of the tray portion of the semiconductor device assembly jig (showing a side view of FIG. 9 viewed from the direction A).

  The tray unit 31 is a tray-shaped metal jig on which the circuit unit 10 is mounted. Further, in the example of the figure, a configuration in which two circuit units 10 can be mounted is shown, and two sets of fixing bars 31a-1 and 31a-2 are provided on two opposite sides of the four surrounding sides. Yes. The fixing bars 31a-1 and 31a-2 are provided with pins 3a-3 protruding toward the inside of the tray portion 31.

  FIG. 11 is a diagram illustrating a mounting position of the circuit unit on the tray unit. The positioned circuit unit 10 and the enclosing case 20 are mounted in the hatched region r (the region r indicates a place where the circuit unit 10 and the enclosing case 20 for one semiconductor device are mounted).

  FIG. 12 is a plan view of the fixed frame portion of the semiconductor device assembly jig. The fixed frame portion 32 is a metal jig attached to the upper part of the outer case 20. It is used for pressing the pre-assembled circuit unit 10 and the outer case 20 against the tray unit 31. Of the four sides around the fixed frame portion 32, one set of fixing devices 32b is provided on two opposite sides. The fixed frame portion 32 is made of, for example, a metal square member, and these square members come into contact with the outer case 20 and press against the tray portion 31. The surface of the fixed frame portion 32 that comes into contact with the outer case 20 may be flat, or a convex portion or a concave portion for positioning may be formed. Further, an elastic member such as a spring may be sandwiched between the fixed frame portion 32 and the outer case 20. By using the elastic member, the circuit portion 10 and the outer case 20 can be more evenly pressed.

  FIG. 13 is a view showing a state in which the tray portion and the fixed frame portion are fitted. The circuit unit 10 is mounted on the tray unit 31. In addition, the fixed frame portion 32 is attached to the upper portion of the outer case 20, and the outer case 20 with the fixed frame portion 32 attached is superposed on the circuit portion 10.

  In this case, the fixing bar 31a-1 provided in the tray part 31 and the fixing device 32b provided in the fixed frame part 32 are fitted, and the circuit part 10 and the outer case 20 are connected to the tray part 31. It fixes in the state pressed uniformly between the fixed frame part 32.

  FIG. 14 is a diagram showing a state before the fixing bar and the fixing device are fitted together, and FIG. 15 is a diagram showing a state where the fixing bar and the fixing device are fitted together. In the fixing bar 31a, the bottom 3a-1 is fixedly installed on the tray surface of the tray 31, and the protrusion 3a-2 is fixed in a direction perpendicular to the tray surface. A pin 3a-3 is inserted near the center of the protrusion 3a-2. The pins 3a-3 protrude toward the inside of the tray portion 31.

  The fixing device 32 b is fixedly installed on the side wall of the fixed frame portion 32. The fixing device 32b includes a lever 3b-1, a fitting frame portion 3b-2, and a fitting movable portion 3b-3. With the lever 3b-1, the fitting frame portion 3b-2, and the fitting movable portion 3b-3, A fitting port 3b-4 is formed.

  Here, when the fixing tool 32b is pushed into the fixing bar 31a while pressing the fixing frame portion 32 from above, the fitting movable portion 3b-3 is moved upward, and the pin 3a-3 is fitted into the fitting port. Insert in 3b-4.

  When the pin 3a-3 is inserted, the fitting movable part 3b-3 returns to the original position, and the pin 3a-3 is fitted and fixed to the fitting port 3b-4 (fixed with the tray part 31). The frame portion 32 is locked).

  Further, when the lever 3b-1 is tilted downward to the right, the fitting port 3b-4 is opened, and the pin 3a-3 is detached from the fitting port 3b-4, and the fixing bar 31a and the fixing frame portion 32 is released.

  As described above, the semiconductor device assembling jig 30 includes the tray portion 31 and the fixed frame portion 32, the tray portion 31 includes the fixing bar 31a, and the fixed frame portion 32 includes the fixing device 32b. Thus, when the outer casing 20 is combined with the circuit section 10, the tray section 31 and the fixed frame section 32 are fitted to each other, so that the circuit section 10 and the outer casing case 20 are connected to the tray section 31 and the fixed frame section 32. Can be pressed and fixed uniformly. Further, the connection between the tray portion 31 and the fixed frame portion 32 can be easily released by the lever 3b-1 provided in the fixed frame portion 32.

  Next, a semiconductor device assembly method will be described using a flowchart while comparing with a conventional assembly method. FIG. 16 is a diagram showing an assembly flow of the semiconductor device. An example of the flow of the conventional semiconductor device assembly process shown in FIGS.

[S1] The circuit unit 40 in which the insulating substrate 42 on which the semiconductor element 43 is mounted is mounted on the metal base plate 41 is generated.
[S2] The operator sets the outer case on an outer case fixing jig for applying an adhesive to the outer case 50.

[S3] The adhesive application device applies an adhesive to a predetermined portion of the outer case 50.
[S4] The operator combines the outer case 50 coated with the adhesive with the circuit unit 40.
[S5] The operator places and sets the combination of the circuit unit 40 and the enclosing case 50 on the fixing jig 61 mounted on the heating plate 70 for heating.

[S6] The adhesive curing device having the pressing device (pressure jig) 62 and the heating hot plate 70 heats the heating hot plate 70 to cure the adhesive.
[S7] The operator sets a combination product of the circuit portion 40 and the outer case 50 cured with an adhesive in a solder application jig for applying solder.

[S8] The solder application device applies solder to the terminal portion 51 of the outer case 50.
[S9] The operator places the combined product of the circuit part 40 and the outer case 50 after the solder application on the transport tray 80.

[S10] The reflow furnace performs soldering on the combination of the circuit unit 40 and the enclosing case 50.
[S11] The worker transports the soldered product to the next process (cleaning process).

FIG. 17 is a diagram showing an assembly flow of the semiconductor device. An example of the flow of the semiconductor device assembling method of the present technology shown in FIGS. 6 to 8 is shown.
[S21] The circuit unit 10 in which the insulating substrate 12 on which the semiconductor element 13 is mounted is mounted on the metal base plate 11 is generated.

[S22] The worker sets the outer case on the outer case fixing jig for applying the adhesive to the outer case 20.
[S23] The adhesive application device applies the adhesive to a predetermined portion of the outer case 20.

[S24] The operator sets the outer case 20 on a solder application jig for applying solder.
[S25] The solder application device applies solder to the terminal portion 21 of the outer case 20.

[S26] The operator combines the outer casing 20 coated with the adhesive and solder with the circuit unit 10.
[S27] The operator attaches the fixed frame portion 32 of the semiconductor device assembly jig 30 to the upper part of the outer case 20, and puts the combination of the circuit unit 10 and the outer case 20 into the tray of the semiconductor device assembly jig 30. Set in section 31.

  Then, the fixing bar 31a provided on the tray part 31 and the fixing device 32b provided on the fixing frame part 32 are fitted to each other so that the circuit part 10 and the outer case 20 are connected to the tray part 31 and the fixing frame part. 32 to be in a fixed state where it is uniformly pressed.

  [S28] The reflow furnace performs heat treatment on the state of step S27, and simultaneously cures the adhesive and melts the solder to bond the circuit unit 10 and the enclosing case 20, and to connect the terminal unit 21 and the circuit. Soldering with the part 10 is performed collectively.

[S29] After completion of bonding and soldering, the operator removes the semiconductor device assembly jig 30 and sends the semiconductor device to a cleaning step (next step).
Thus, it can be seen that the semiconductor device assembling method shown in FIG. 17 has fewer steps than the conventional method shown in FIG. Conventionally, heat treatment has been performed in both steps of adhesion between the circuit portion and the enclosing case with an adhesive and soldering between the terminal portion of the enclosing case and the solder portion of the circuit portion.

  On the other hand, in the semiconductor device assembly method of the present technology, by using a semiconductor device assembly jig that is easy to attach and detach, the circuit portion and the outer case are bonded with an adhesive by one heat treatment, and the outer case is removed. The soldering of the terminal part and the solder part of the circuit part was performed collectively. This makes it possible to shorten the number of assembly steps and reduce the heat history.

  As in the above example, step S26 may be performed after step S25, or the order may be changed, for example, step S26 may be performed after step S23, and then step S25 may be performed. In addition, for the step S1 in the above example, the circuit unit 10 in which the semiconductor element 43, the insulating substrate 42, and the metal base plate 41 are bonded in advance may be prepared. The circuit unit 10 with a solder plate sandwiched therebetween may be prepared, and soldering may be performed in step S28.

  As mentioned above, although embodiment was illustrated, the structure of each part shown by embodiment can be substituted by the other thing which has the same function. Moreover, other arbitrary structures and processes may be added.

DESCRIPTION OF SYMBOLS 10 Circuit part 11 Metal base board 12 Insulating board 13 Semiconductor element 20 Outer case 21 Terminal part 30 Semiconductor device assembly jig 31 Tray part 32 Fixing frame part 31a Fixing bar 32b Fixing tool

Claims (2)

Preparing a semiconductor element, an insulating substrate on which the semiconductor element is mounted, a circuit unit having a metal base plate on which the insulating substrate is mounted, and an enclosing case for housing the circuit unit;
Applying an adhesive to at least one adhesive surface of the circuit portion and the surrounding case;
Applying solder to at least one of the terminal part formed in the outer case and the solder part of the circuit part;
Combining the circuit portion and the outer case between the tray portion and the fixed frame portion, and connecting the tray portion and the fixed frame portion to each other, the circuit portion and the outer case can be combined with the tray portion. A state of being pressed and fixed uniformly between the fixed frame portion and performing a heat treatment,
Wherein the heat treatment, the assembled semiconductor device performed together the soldering between the circuit portion and the adhesive and the terminal portion with the outer covering case and the circuit portion,
The tray portion is provided with a fixing bar provided with a pin, and the fixing frame portion is provided with a fixing device in which a fitting port for fitting with the pin is formed,
The adhesive surface of the outer case is combined with the adhesive surface of the circuit part, and the upper part of the fixing frame part is pressed, and the pin of the fixing bar is fitted to the fitting port of the fixing device, By connecting the tray part and the fixed frame part to each other, the circuit part and the outer case are in a state of being pressed and fixed uniformly between the tray part and the fixed frame part,
The fixing device includes a lever for releasing the fitting with the fixing bar.
A method for assembling a semiconductor device. A semiconductor element, a tray portion on which a circuit portion having an insulating substrate on which the semiconductor element is mounted and a metal base plate on which the insulating substrate is mounted;
A fixed frame portion mounted on an upper portion of an outer case that houses the circuit portion;
With
By combining the outer case and the circuit unit between the tray unit and the fixed frame unit, and connecting the tray unit and the fixed frame unit to each other, the circuit unit and the outer case are uniformly pressed. And fix it
The tray portion has a fixing bar provided with a pin, and the fixing frame portion has a fixing device in which a fitting port for fitting with the pin is formed,
The outer case is combined with the circuit part, the upper part of the fixing frame part is pressed, the pin of the fixing bar is fitted to the fitting port of the fixing device, and the circuit part and the outer part are fitted. The case is in a state of being pressed and fixed uniformly between the tray part and the fixed frame part,
The fixing device includes a lever for releasing the fitting with the fixing bar.
A semiconductor device assembling jig.

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