JP5766302B2 - Motor with built-in power converter, air conditioner with built-in motor, water heater, and ventilation fan - Google Patents

Description

  The present invention relates to a motor with a built-in power conversion device constituted by a power conversion circuit board using a semiconductor module, an air conditioner, a water heater, and a ventilating blower with a built-in motor.

  2. Description of the Related Art In recent years, motors with a built-in drive circuit that are connected to a high-voltage power conversion circuit and a stator and are formed of a thermosetting resin such as unsaturated polyester resin are often used for air conditioning fans. The direct current power source for driving the motor is increased to a maximum voltage of 325 V (for example, Patent Document 1 below). In addition, air-conditioning equipment is often used in areas where power supply conditions are poor, and the maximum value of the voltage of the DC power supply tends to further increase.

  In addition, packages for sealing integrated circuits (hereinafter abbreviated as ICs) have been miniaturized, and packages corresponding to surface mounting have come to be used in many cases. In particular, ICs mounted on a power converter inside a motor are increasingly used in the above-described surface mount packages because of the demand for miniaturization (for example, Patent Document 2 below). However, since an IC used for an air-conditioning blower motor or the like requires a relatively large allowable power consumption, ingenuity is required for mounting in order to effectively dissipate heat generated by the allowable power consumption. .

Japanese Patent Laying-Open No. 2011-61907 (paragraph “0040”, FIGS. 1 and 3) JP-A-5-91708 (paragraphs “0011” to “0016”, FIGS. 2, 3, and 4)

  However, the power conversion device disclosed in Patent Document 1 has a problem in that a human process is required for board mounting because an IC in which main parts of the power conversion circuit are integrated is a lead type. In addition, since the IC is disposed on the printed circuit board on the side opposite to the stator, there is a problem that the circuit becomes thick. Furthermore, when the inverter circuit in the IC causes a vertical short-circuit failure, the IC high voltage power supply terminal and the surrounding substrate copper foil are provided on the side opposite to the stator, so that the influence of the IC breakdown affects the outside of the motor. There is a problem that it is necessary to increase the thickness of the mold resin on the side opposite to the stator so that the motor becomes larger.

  Further, the power conversion device disclosed in Patent Document 2 has a problem in that the mechanical connection strength with the printed circuit board is weaker than that of lead mounting because the IC and the board are surface-mounted and the solder area cannot be increased. . Further, in the power conversion device shown in Patent Document 2, since the semiconductor chip of the switching power element is directly mechanically connected to the printed board, it is not a printed board using a resin base material for chip heat dissipation, Since it is necessary to use a substrate using a metal or a sintered base material, there is a problem that it is expensive. In addition, since the high heat dissipation substrate (a substrate using a metal or a sintered base) is generally a single-sided wiring, there is a problem that the wiring efficiency is lower than that of a double-sided board and the board area is increased. .

  On the other hand, when a surface mount IC is used for the power conversion main circuit including the switching power element and the heat of the IC is radiated from the heat spreader arranged in the IC package via the copper foil on the printed circuit board, the high voltage wiring from the IC terminal Cannot be placed under and around the IC. In this case, it is necessary to route a part of the high-voltage wiring to the anti-stator side of the printed circuit board. However, due to circumstances such as a die hole for holding the board being arranged on the anti-stator side of the printed circuit board, The routable area is very narrow. Accordingly, there is a problem in that a high-voltage wiring may not be arranged on a printed board having a copper foil only on the side opposite to the stator.

  The present invention has been made in view of the above, and it is possible to reduce the size of a printed circuit board and incorporate a power conversion device capable of suppressing the thickness of the mold resin on the anti-stator side. An object is to obtain a built-in air conditioner, water heater, and ventilation fan.

In order to solve the above-described problems and achieve the object, the power conversion device built-in motor of the present invention includes a substrate on which a semiconductor module that converts a voltage of an external power source into a high-frequency voltage and supplies it to a stator is mounted. A motor having a built-in apparatus, wherein a mold hole for resin is formed on a side surface opposite to a surface of the substrate facing the stator by a mold for pressing the opposite side surface, and the substrate having the mold hole formed therein the stator surface facing the one end said the external power supply high voltage input line electrically connected to the high pressure side wiring that is disposed to the other end is the high voltage electrode electrically connected to the semiconductor module .

  According to the present invention, since components such as semiconductor elements and high-voltage wiring are mounted on the surface of the printed circuit board on the stator side, the printed circuit board can be reduced in size and the thickness of the mold resin on the anti-stator side can be reduced. There is an effect that the thickness can be suppressed.

1A and 1B are a side sectional view and a top perspective view of a motor incorporating a power conversion device according to Embodiment 1 of the present invention. FIG. 2 is a configuration diagram of an inverter IC mounted on the power conversion device according to Embodiment 1 of the present invention. FIG. 3 is a structural diagram of an IC chip in the inverter IC of the power conversion device according to the first embodiment of the present invention. FIG. 4 is a circuit configuration diagram around the IC chip in the inverter IC of the power conversion device according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view of the power conversion apparatus according to Embodiment 1 of the present invention. FIG. 6 is a diagram for explaining merits when a plurality of printed circuit boards according to Embodiment 1 of the present invention are taken out from one circuit board. FIG. 7 is an overall external view of an air conditioner according to Embodiment 2 of the present invention. FIG. 8 is a cross-sectional view of the indoor unit in the air conditioner according to Embodiment 2 of the present invention.

  Hereinafter, embodiments of a motor with a built-in power conversion device, an air conditioner, a water heater, and a ventilation fan according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
(Configuration of power conversion device 60 and motor 61)
FIG. 1 is a side sectional view and a top perspective view of a motor 61 incorporating a power conversion device 60 according to Embodiment 1 of the present invention. A lower surface of FIG. 1 shows a surface on the stator side of the printed circuit board 1 viewed from the direction of arrow A in FIG. The power converter 60 mainly includes the printed circuit board 1 formed in a substantially arc shape, the inverter IC2, the motor terminal 5 that is an input terminal of each phase of the motor 61, and the rotational position of the rotor 16. It has a hall element 6 to be detected, a motor external connection lead 7, and an overheat detection element 14 for detecting an overheat state of the inverter IC 2. Moreover, the motor 61 is comprised including the power converter device 60, the stator 3, the rotor 16, and the bearing 9 as main structures.

  Inside the motor 61, a printed circuit board 1 on which a power conversion circuit for driving the motor 61 to rotate is mounted. An inverter IC 2 that is a part of the power conversion circuit is mounted on the printed board 1. The inverter IC2 incorporates a main circuit of a voltage type inverter for applying a voltage to a winding which is a copper wire or an aluminum wire of the stator 3 of the motor 61.

  In the motor 61, an annular stator 3 in which a winding is wound around a stator core (not shown) is disposed on the surface of the printed circuit board 1 on which the inverter IC 2 is mounted.

  The stator 3 and the printed circuit board 1 are mechanically connected by a thermosetting mold resin 4 such as unsaturated polyester. An outer shape of the motor 61 constituting the bearing housing 9a is formed by the mold resin 4 on the surface of the printed board 1 on the side opposite to the stator.

  In order to correctly maintain the positional relationship between the stator 3 and the printed circuit board 1 in the mold resin 4, the surface on the side opposite to the stator of the printed circuit board 1 is pressed by a mold (not shown) that contacts the position indicated by the reference numeral 100. In addition, the surface of the printed circuit board 1 on the stator side is pressed by the starter 3 and a mold that contacts the position indicated by reference numeral 101. More specifically, the surface of the anti-stator of the printed circuit board 1 is pressed by the mold on both the inner peripheral side and the outer peripheral side (six locations indicated by reference numeral 100 indicated by dotted circles). Further, since the surface on the stator side of the printed circuit board 1 is mechanically connected to the stator 3 via the motor terminals 5, the inner peripheral side of the printed circuit board 1 (two locations indicated by reference numeral 101 indicated by solid circles). Only) is held by the mold. Thereafter, a resin is poured into the mold to mold the mold resin 4. Since this mold is removed after the molding resin 4 is molded, holes are formed at locations indicated by reference numerals 100 and 101 so that the printed circuit board 1 is directly exposed.

  The printed circuit board 1 and the stator 3 are electrically connected by the motor terminal 5 by soldering so that a voltage from the printed circuit board 1 to the stator 3 is applied. A Hall element 6 disposed so as to be surrounded by the stator 3 is mounted on the surface of the printed circuit board 1 on the stator side, and an overheat detection element 14 is installed in the vicinity of the inverter IC2. A motor external connection lead 7 is installed on the surface of the printed circuit board 1 on the side opposite to the stator in order to electrically connect the printed circuit board 1 and the outside of the motor 61. A high-voltage input line 17 and a low-voltage input / output line 18 extend from the motor external connection lead 7 to the outside.

  A rotor penetration hole 8 that is not filled with the mold resin 4 and is hollow in a cylindrical shape is provided in the inner peripheral portion of the stator 3, and a rotor that is a rotor of the motor 61 is provided in the rotor penetration hole 8. 16 is arranged. A bearing through hole 10 is formed on the inner peripheral side of the printed circuit board 1. The bearing through-hole 10 communicates with the rotor through-hole 8 so that the main shaft (not shown) of the rotor 16 penetrates the mold resin 4 to the bearing housing 9a in a direction substantially perpendicular to the printed circuit board 1. A bearing 9 is accommodated in the bearing through hole 10, and a main shaft (not shown) of the rotor 16 is passed through an inner ring (not shown) of the bearing 9.

  The inverter IC2 includes a heat spreader 13, a high voltage electrode 11, and a low voltage electrode 12 as main components. One electrode (high voltage electrode 11) forming the dual in-line electrode of the inverter IC2 is provided in the inverter IC2 in a plurality (three as an example in FIG. 1). The high voltage electrode 11 inputs a high voltage DC voltage obtained by full-wave rectification or voltage double rectification of the commercial power supply outside the motor 61. In the inverter IC 2, the high-voltage DC voltage is converted into a high-frequency voltage, and the high-voltage electrode 11 outputs the high-frequency voltage to the motor terminal 5. Note that these high-voltage electrodes 11 are provided with an inverter IC 2 and a printed circuit board, for example, as shown in FIG. 1 in consideration of the installation position of the motor terminal 5 so that the wiring (motor output wiring 105) on the printed circuit board 1 is shortened. 1 is provided between the outer peripheral side of 1.

  The high voltage input line 17 is electrically connected to the high voltage DC input wiring 104 which is a copper foil provided on the surface of the printed circuit board 1 on the stator side via the motor external connection lead 7. One end of the high-voltage DC input wiring 104 is electrically connected to the high-voltage input line 17 by solder, and the other end of the high-voltage DC input wiring 104 is electrically connected to the high-voltage electrode 11 provided in the inverter IC2 by solder. Yes. A motor output wiring 105 (a chain line from the high voltage electrode 11 of the inverter IC 2 to the motor terminal 5) that is a copper foil provided on the surface on the side opposite to the stator of the printed circuit board 1 close to the high voltage DC input wiring 104 is on the side opposite to the stator. Are electrically connected to the motor terminal 5 by soldering. Further, the copper foil 50 (solid line from the high voltage electrode 11 of the inverter IC 2 to the motor terminal 5) provided on the surface of the printed circuit board 1 near the high voltage DC input wiring 104 is connected to the motor terminal 5 on the stator side. And are electrically connected by solder. Since the high voltage electrode 11 of the inverter IC 2 shown in FIG. 1 is provided on the outer peripheral side of the printed circuit board 1, the high voltage DC input wiring 104 is based on the space between the inverter IC 2 and the outer periphery of the printed circuit board 1. 1 is disposed along the outer peripheral side of 1 and is connected to the high voltage electrode 11 of the inverter IC2. By providing the high-voltage DC input wiring 104 in this way, it is possible to supply high-voltage DC power to the inverter IC 2 without interfering with the heat spreader 13 provided in the inverter IC 2 or the overheat detecting element 14 on the printed circuit board 1. is there.

(Configuration of inverter IC2)
FIG. 2 is a configuration diagram of the inverter IC2 mounted on the power conversion device 60 according to Embodiment 1 of the present invention. FIG. 2 shows an IC package 23, a metal lead frame 22, a bonding wire 21, a heat spreader 13, a high voltage electrode 11, and a low voltage electrode 12, which are components of the inverter IC2. The IC chip 20, the bonding wire 21, and the metal lead frame 22 are covered with an IC package 23 that is a highly heat conductive resin. The IC chip 20 is composed of a wide band gap semiconductor such as silicon or SiC. The bonding wire 21 is made of a metal wire such as gold, copper, or aluminum, and one end thereof is electrically connected to a metal electrode (an aluminum wiring 25 described later) on the IC chip 20 by ultrasonic melting, and the other end. Is electrically connected to the metal lead frame 22. The IC chip 20 is provided on a heat spreader 13 having a large plate thickness in order to efficiently release heat, and is thermally and mechanically connected to the heat spreader 13 by soldering or silver paste.

  In the inverter IC2, since the IC chip 20 is mounted on the heat spreader 13, the transient heat generation among the heat generated from the IC chip 20 is stored in the heat spreader 13, and the transient temperature rise of the IC chip 20 is suppressed. The In the inverter IC 2, the IC chip 20 and the heat spreader 13 are disposed close to the metal lead frame 22, and the IC chip 20 is thermally and mechanically connected to the IC package 23. Therefore, regarding the heat generation from the IC chip 20, the steady heat generation is radiated from the high voltage electrode 11 and the low voltage electrode 12 to the outside of the IC chip 20 through the metal lead frame 22, and further, the IC chip through the IC package 23. 20 is radiated to the outside.

(Configuration of IC chip 20)
FIG. 3 is a structural diagram of the IC chip 20 in the inverter IC2 of the power conversion device 60 according to the first embodiment of the present invention. The IC chip 20 is provided with a plurality of semiconductor elements constituting switching elements, and an electrical connection between the semiconductor elements and external electrodes (such as the metal lead frame 22 shown in FIG. 2) is provided above each semiconductor element. A plurality of aluminum wirings 25 for obtaining are provided. These aluminum wirings 25 are electrically connected to the metal lead frame 22 described above. On the IC chip 20, a silicon oxide film 26 having high insulation performance for insulating the aluminum wirings 25 is formed. Therefore, the IC chip 20 according to the first embodiment is compared with a general IC, that is, an IC in which a plurality of semiconductor elements are arranged on the metal lead frame 22 and electrical connection is made between the semiconductor elements by bonding wires 21. Thus, the arrangement of the aluminum wiring 25 has a degree of freedom. Further, by using the IC chip 20, the high voltage electrode 11 and the low voltage electrode 12 can be provided separately in a very small space.

Further, the IC chip 20 is provided with an insulating isolation layer 29 (for example, silicon oxide) having a high insulating property in order to provide electrical insulation between the plurality of semiconductor single crystal islands 27 constituting the semiconductor element and the polycrystalline silicon 28 covering the periphery thereof. ) Is formed. The polycrystalline silicon 28 is thermally and mechanically connected to the heat spreader 13 described above. The insulating separation layer 29 is made of, for example, silicon oxide (SiO ₂ ) that can ensure sufficient insulation performance even with a thin film.

  As described above, the IC chip 20 can dispose the semiconductor single crystal island 27 in an island shape on the same chip by providing the insulating isolation layer 29 having a high insulating property, and can provide a switching element that requires high voltage insulation. Can be mixed. The IC chip 20 is smaller than a general IC, that is, an IC in which a plurality of semiconductor elements are arranged with a predetermined insulation distance and each of these semiconductor elements is mounted on a metal lead frame 22. Therefore, the inverter IC 2 body can be downsized. Further, in the IC chip 20, since a low-voltage circuit can be configured on the same chip, a control low-pressure chip or a chip for high-low pressure separation is not required outside, and they are also mounted on the metal lead frame 22 and the printed circuit board 1. There is no need to electrically connect the wires. Thereby, a power converter circuit and by extension, the power converter 60 whole can be made remarkably small.

  FIG. 4 is a circuit configuration diagram around the IC chip 20 in the inverter IC of the power conversion device 60 according to the first embodiment of the present invention. The high-voltage DC power supply 38 is a high-voltage DC voltage obtained by full-wave rectification or voltage doubler rectification of the commercial power supply outside the motor 61, and this voltage is input to the IC chip 20. The IGBT 34 is a switching element formed on the semiconductor single crystal island 27 of the IC chip 20 described above. The IGBT 34 is ON / OFF driven by the upper arm driving circuit 35a and the lower arm driving circuit 35b, and converts the input DC voltage into a high frequency voltage. Convert. Each of the six IGBTs 34 shown in FIG. 4 has a reflux diode connected in antiparallel. The high frequency voltage from the IGBT 34 is applied from the high voltage electrode 11 to the winding of the stator 3 via the motor terminal 5.

  The rotation position signal of the rotor 16 detected by the Hall element 6 is converted into a low-pressure pulse signal by a logic circuit inside the IC chip 20 and output from the rotation speed output line 31 to the outside. Further, the IC chip 20 adjusts the output voltage of the inverter by changing the switching pulse width of the six IGBTs 34 based on the low-voltage analog signal voltage input from the outside via the output voltage command input line 32. To do. At this time, the power supply of the upper arm drive circuit 35a that drives the IGBT 34 of the upper arm among the inverters constituted by the six IGBTs 34 is generated by the charge pump diode 33 and the external capacitors C1 and C2. Further, the opposite side of the winding of the stator 3 connected to the motor terminal 5 (see FIG. 1) is electrically connected by a neutral point connection 39 to form a star connection motor.

  A positive temperature resistance element having a steep resistance characteristic with respect to temperature is used as the overheat detection element 14, and the overheat detection element 14 converts the detected temperature into a resistance value. This resistance value is input to the overcurrent protection terminal RS. The overheat detection element 14 detects the overheat state of the inverter IC2 by giving the overcurrent protection level a temperature characteristic, and detects that the inverter IC2 and the stator 3 are overheated. In this case, the inverter IC2 limits or stops the current supplied to the stator 3 via the high-voltage electrode 11, and prevents the inverter IC2 and the like from being destroyed due to overheating.

  Here, since the overheat detecting element 14 is made of a ceramic material, it cannot be provided on the IC chip 20 packaged with a thermally conductive resin. Although it is conceivable to provide the overheat detecting element 14 using a semiconductor on the IC chip 20, elements using a semiconductor have poor temperature characteristics and variations. Therefore, when this characteristic is taken into consideration, the design value of the protection level must be set low, and the output range of the motor 61 in which such a low design value is set is extremely narrow compared to the conventional configuration. Become. Furthermore, the inverter IC 2 according to the first embodiment is disposed on the surface of the printed circuit board 1 on the stator side, and therefore, compared with the case of being disposed on the surface of the printed circuit board 1 on the side opposite to the stator, copper loss and iron It is disadvantageous in terms of temperature because it easily receives heat from the stator 3 which is a heat source having a loss.

  Therefore, the overheat detection element 14 according to the first embodiment is disposed close to the heat spreader 13 having a thermally strong connection with the IGBT 34 in the inverter IC2. The overheat detecting element 14 is electrically and thermally connected to the low voltage electrode 12 through a copper foil 50 described later. The metal lead frame 22 which is the low voltage electrode 12 is electrically and thermally connected to the IC chip 20 by the bonding wire 21 as described above. Further, the overheat detection element 14 is thermally connected to the inverter IC 2 by the mold resin 4 having a low thermal resistance (see FIG. 1). With this configuration, the overheat detecting element 14 can accurately detect the temperature of the IGBT 34 that generates the most circuit loss and is most likely to be destroyed by overheating.

  In addition, the six IGBTs 34 constituting the inverter are arranged in an island shape on the IC chip 20 which is the same silicon chip and separated by the insulating separation layer 29. Further, the IC chip 20 includes the heat spreader 13 and Has a strong thermal connection. For this reason, even when the heat generation of the IGBTs 34 on the IC chip 20 varies, the IGBTs 34 are on the same solid and thus have substantially the same temperature, and the temperature distribution of the IGBTs 34 is smoothed.

  In addition, with the above-described configuration, it is possible to avoid deterioration in temperature detection performance due to variations in temperature distribution between the IGBTs 34 when the IGBTs 34 are configured as separate chips. Furthermore, it is not necessary to arrange a plurality of overheat detecting elements 14 in order to detect temperature variations in each IGBT 34, and the cost can be reduced.

  Thus, by improving the temperature detection performance of the overheat detection element 14, the inverter IC2 suppresses a decrease in the operating range of the motor 61 caused by an increase in the ambient temperature due to being arranged on the stator side on the printed circuit board 1. be able to. In particular, a single-chip IC such as the inverter IC2 has a higher ON voltage (2.0V) than a single IGBT (for example, 1.6V in the 600V withstand voltage class), and has a large steady loss. The above-mentioned effect that the output reduction of the motor due to the operation range limitation for prevention can be covered is great.

  The semiconductor single crystal island 27 constituting the IGBT 34 may be made of a wide band gap semiconductor such as GaN (gallium nitride), SiC (silicon carbide), or diamond. Since the wide band gap semiconductor has high heat resistance and withstand voltage and high allowable current density, the IGBT 34 molded on the IC chip 20 can be downsized, and the inverter IC 2 can be downsized. In addition, since the wide band gap semiconductor has low power loss, it is possible to configure the IGBT 34 that can operate with high efficiency.

(Arrangement configuration of each element on the printed circuit board 1 in the power conversion device 60)
FIG. 5 is a cross-sectional view of power conversion device 60 according to Embodiment 1 of the present invention. The copper foil 50 shown in FIG. 5 is formed of a circuit wiring pattern on the printed circuit board 1 or lands for electrically, thermally, and mechanically connecting the printed circuit board 1 and components with solder. . A Hall element 6, an overheat detection element 14, and an inverter IC 2 are disposed on the surface of the printed circuit board 1 on the stator side via a copper foil 50. The inverter IC2 is connected to the copper foil 50 by solder via the high voltage electrode 11 and the low voltage electrode 12. Further, the overheat detecting element 14 is electrically and thermally connected to the low voltage electrode 12 through the copper foil 50.

  The through hole 51 is a hole penetrating from the stator side surface of the printed circuit board 1 to the anti-stator side surface. The surface of the hole is plated, and the copper foil 50 on the stator side surface of the printed circuit board 1 and the copper foil 50 on the surface opposite to the stator side of the printed circuit board 1 are electrically connected by plating applied to the through hole 51. Connected thermally and thermally.

  The motor terminal 5 passes through the through-hole 51 from the stator side surface of the printed circuit board 1 to the anti-stator side surface. The motor terminal 5 melts thread-like solder from the copper foil 50 provided on the surface of the printed circuit board 1 on the side opposite to the stator, and is electrically connected to the stator-side copper foil 50 through the through hole 51. Since the stator-side copper foil 50 is connected to the high voltage electrode 11 of the inverter IC 2, the motor terminal 5 is electrically connected to the high voltage electrode 11.

  The high voltage input line 17 is electrically connected to one end of the high voltage DC input wiring 104 provided on the stator side surface of the printed circuit board 1 by solder. The other end of the high-voltage DC input wiring 104 is electrically connected to the high-voltage electrode 11 provided on the inverter IC2 by solder. Note that, on the surface of the printed circuit board 1 on the stator side, the high-voltage DC input wiring 104 and the copper foil 50 shown around the motor terminal 5 are represented as being connected to one high-voltage electrode 11 for the purpose of illustration. However, it is assumed that the high-voltage DC input wiring 104 and the copper foil 50 are connected to different high-voltage electrodes 11.

  The motor external connection lead 7 is mounted not as a connector type but as a lead wire type on the surface opposite to the stator of the printed circuit board 1 in order to electrically connect an external power source (such as a high-voltage DC voltage) and the inverter IC 2. . For example, when the motor 61 is mounted on an air conditioner or the like, moisture may adhere to the outline of the motor 61. When the motor external connection lead 7 is a connector type, when this moisture adheres between the high and low voltage electrodes in the connector, these electrodes may be short-circuited. When the motor external connection lead 7 is a lead wire type, such a short circuit can be avoided and the reliability of the motor 61 can be ensured.

  Similarly to the high voltage electrode 11 and the low voltage electrode 12, the heat spreader 13 is electrically, thermally, and mechanically connected to the copper foil 50 by solder. Further, the heat spreader 13 is thermally connected to the copper foil 50 provided on the surface opposite to the stator of the printed circuit board 1 through the copper foil 50 applied to the through hole 51. Here, the surface-mounted inverter IC 2 has a package size larger than that of the Hall element 6 and the overheat detecting element 14, and therefore receives a large amount of heat shrinkage stress at the time of molding of the surrounding mold resin 4 and after molding. Cutting is easy to occur. However, when the heat spreader 13 is mechanically strongly connected to the copper foil 50 by solder, the inverter IC 2 is less susceptible to the heat shrinkage stress of the mold resin 4. Therefore, the inverter IC 2 according to the first embodiment has a dramatic mechanical connection strength with the printed circuit board 1 as compared with an IC that is connected by soldering only ordinary circuit electrodes (such as the high-voltage electrode 11 and the low-voltage electrode 12). And solder breakage is reduced. As a result, it is possible to incorporate the power conversion device 60 in the motor 61 molded with the mold resin 4.

  Further, the heat spreader 13 is thermally connected to the copper foil 50 by solder on the surface of the printed circuit board 1 on the stator side, and further thermally connected to the copper foil 50 on the side opposite to the stator via the through hole 51. Yes. Thereby, the heat generated in the inverter IC 2 can be radiated to the side opposite to the stator of the printed circuit board 1.

  Further, the overheat detecting element 14 and the inverter IC 2 are surface-mounted on the surface of the printed circuit board 1 on which the Hall element 6 is disposed. In this way, by mounting components on the surface of the printed circuit board 1 on the stator side, these components are electrically connected at one time by remelting the cream solder applied to the copper foil 50 (reflow soldering). And mechanically connectable. Further, by mounting components on the surface of the printed circuit board 1 on the stator side, the connection of the motor external connection leads 7 and the motor terminals 5 that must be soldered after the printed circuit board 1 is divided (detailed in FIG. 6). It becomes possible not to apply solder to the land for use (to prevent the application of solder with a metal mask).

  Further, by improving the temperature detection performance of the overheat detecting element 14, it is possible to surface-mount the inverter IC2 with the thickest heat spreader 13 among the mounted parts of the printed circuit board 1 on the printed circuit board on the stator side. It is. As a result, there is a margin in the mold space on the surface of the printed circuit board 1 opposite to the stator, so that the stator 3 can be thickened by the margin to obtain a motor 61 with a large output, or the margin can be thinned. By doing so, a thin and compact motor 61 with the same output can be obtained.

  In the above description, an example in which surface mounting components such as the Hall element 6, the overheat detecting element 14, and the inverter IC 2 are soldered to the printed circuit board 1 by reflow soldering has been described. The printed circuit board 1 may be flowed over and soldered to the joint between the component and the circuit board).

(About material removal of printed circuit board 1)
FIG. 6 is a diagram for explaining the merits when a plurality of printed circuit boards 1 according to Embodiment 1 of the present invention are taken out from a single circuit board. FIG. 6 shows an example on one circuit board. The example which shape | molded the printed circuit board 1 which concerns on Embodiment 1 is shown.

  The printed circuit board 1 according to the first embodiment is such that the neutral point connection 39 (see FIG. 4) of the stator 3 is not mounted, and an inverter in which a plurality of high-voltage elements are integrated on the IC chip 20 that is a one-chip semiconductor. By using IC2, the package is downsized. Thereby, the semicircular arc-shaped printed circuit board 1 having a cross-sectional area of ½ or less can be formed. At this time, the inner diameter portion of the printed circuit board 1 is formed in a semicircular arc shape so that a bearing (not shown) can be provided.

  Since the conventional printed circuit board is formed in an annular shape, components such as the inverter IC2 cannot be disposed on the inner peripheral part (the part corresponding to the bearing diameter) of the printed circuit board. Therefore, the inner peripheral part of the printed circuit board has been discarded. On the other hand, in the printed circuit board 1 according to Embodiment 1, the inner diameter portion of the printed circuit board 1 is formed in a semicircular arc shape. Therefore, when forming a plurality of printed circuit boards 1 on a single substrate, the printed circuit board 1 is printed by arranging the printed circuit boards 1 so that the inner diameter portions of the printed circuit boards 1 face each other and the arc centers of the inner diameter portions are offset from each other. The inner periphery of the substrate 1 can be used effectively. In other words, a plurality of printed circuit boards 1 can be formed at a high density on a single substrate, and the utilization efficiency of the substrate for forming the printed circuit board 1 can be improved.

  In addition, since the inner periphery of a conventional printed circuit board is formed in an annular shape, when an electronic component is connected to the printed circuit board using flow solder, the solder in the solder bath is blown through the through part. Go up. In order to prevent this blow-up, a step of applying a plate for closing the through portion is required before the flow soldering step, and a step of removing this plate is also required after the soldering step. On the other hand, since the printed circuit board 1 according to the first embodiment has a semicircular inner diameter portion instead of an annular inner peripheral portion, the aforementioned steps can be reduced when soldering by flow soldering. It can be manufactured at low cost.

  In the printed circuit board 1 according to the first embodiment, the heat spreader 13 disposed on the back surface of the inverter IC 2 (that is, between the inverter IC 2 and the printed circuit board 1) is connected to the copper foil 50, and the overheat detection element 14 is disposed in the vicinity thereof. Due to the arrangement, various effects as described above can be obtained. However, when configured in this way, another printed circuit board copper foil (for example, the high-voltage DC input wiring 104 shown in FIG. 1) is disposed between the inverter IC 2 and the printed circuit board 1 or around the inverter IC 2. I can't. Therefore, it is necessary to route the high-voltage DC input wiring 104 to the surface of the printed circuit board 1 on the side opposite to the stator. However, since the mold hole for holding the board (see reference numeral 100 in FIG. 1) is arranged on the surface of the printed board 1 on the side opposite to the stator, the wiring possible area of the high-voltage DC input wiring 104 becomes very narrow. ing. Therefore, the printed circuit board 1 having the copper foil 50 only on the anti-stator side cannot realize the high-voltage DC input wiring 104, and even if there is a slight copper foil 50 on the anti-stator side, this slight copper foil 50 cannot realize the high-voltage DC input wiring 104.

  On the other hand, when the inverter IC2 is in an up-and-down short-circuit state due to an abnormality such as when a different voltage is applied, the bonding wire 21 (see FIG. 2) that is the thinnest conductor on the high-voltage side of the DC power supply wiring is caused by the temperature rise due to the short-circuit current Generally blown out. Further, the IC chip 20 and the metal lead frame 22 that are close to the bonding wire 21 are also melted and broken by the heat generated at the time of fusing. According to the surface-mounted product package on the printed circuit board 1 according to the first embodiment, the metal lead frame 22 of the inverter IC 2 is shorter than the conventional lead type, so that the melt fracture is caused by the copper foil via the low-voltage electrode 12 and the high-voltage electrode 11. As many as 50.

  In the printed circuit board 1 according to the first embodiment, by diverting the motor output wiring 105 (see FIG. 1) from the high voltage electrode 11 to the side opposite to the stator, a wiring space is provided on the surface of the printed circuit board 1 on the stator side. A high-voltage DC input wiring 104 is provided in this wiring space. Therefore, the distance between the mold hole (100) and the high-voltage DC input wiring 104 can be increased as compared with the case where the high-voltage DC input wiring 104 is passed through the surface of the printed circuit board 1 opposite to the stator. Therefore, the resin thickness (thickness of the mold resin 4) for suppressing the influence when the high-voltage DC input wiring 104 is melted can be reduced. As a result, the motor 61 can be reduced in weight and size. The influence when the high-voltage DC input wiring 104 is melted is, for example, that the sound and light generated by the short-circuit current are generated on the side opposite to the stator of the printed circuit board 1 to give anxiety to the user.

  Needless to say, the same effect can be obtained even if the mold hole is closed after the mold hole (100) is molded. According to the printed circuit board 1 according to the first embodiment, this hole is used. It is possible to omit the process of closing the door. Further, according to the printed circuit board 1 according to the first embodiment, even when a processing method that does not leave the mold hole (100) is used, the distance between the high-voltage DC input wiring 104 and the outline of the mold resin 4 is increased. Therefore, the thickness of the resin provided on the side opposite to the stator of the printed board 1 can be reduced, and the motor itself can be made thinner.

(Effect of Embodiment 1)
In the inverter IC 2 according to the first embodiment, since the IC chip 20 is mounted on the heat spreader 13, the transient heat generation of the heat generated from the IC chip 20 is stored in the heat spreader 13 and the IC chip 20 is transient. Temperature rise is suppressed.

  In the inverter IC 2, the IC chip 20 and the heat spreader 13 are disposed close to the metal lead frame 22, and the IC chip 20 is thermally and mechanically connected to the IC package 23. Therefore, regarding the heat generation from the IC chip 20, the steady heat generation is radiated from the high voltage electrode 11 and the low voltage electrode 12 to the outside of the IC chip 20 through the metal lead frame 22, and further, the IC chip through the IC package 23. 20 is radiated to the outside.

  The IC chip 20 according to the first embodiment can dispose a plurality of semiconductor single crystal islands 27 in the form of islands on the same chip by providing the insulating isolation layer 29 having high insulating properties. Switching elements that require insulation can be mounted together.

  The IC chip 20 is smaller than a general IC, that is, an IC in which a plurality of semiconductor elements are arranged with a predetermined insulation distance and each of these semiconductor elements is mounted on a metal lead frame 22. Therefore, the inverter IC 2 body can be downsized.

  Further, since the IC chip 20 can also be configured with a low-voltage circuit on the same chip, there is no need for a low-voltage chip for control or a chip for high-low voltage separation outside, and these chips are electrically connected by a metal lead frame or the like. There is no need to connect to. Thereby, a power converter circuit and by extension, the power converter 60 whole can be made remarkably small.

  Further, the IC chip 20 has an aluminum wiring 25 as compared with a general IC, that is, an IC in which a plurality of semiconductor elements are arranged on a metal lead frame 22 and electrically connected between the semiconductor elements by bonding wires 21. It is possible to give a degree of freedom to the arrangement. Further, by using the IC chip 20, the high voltage electrode 11 and the low voltage electrode 12 can be provided separately in a very small space.

  Further, the overheat detection element 14 according to the first embodiment is disposed close to the heat spreader 13 having a thermally strong connection with the IGBT 34 in the inverter IC2. Further, the overheat detecting element 14 is electrically and thermally connected to the low voltage electrode 12 through the copper foil 50. Therefore, the overheat detection element 14 can accurately detect the temperature of the IGBT 34.

  Further, by improving the temperature detection performance of the overheat detection element 14, the inverter IC2 can suppress a decrease in the operating range of the motor 61 due to a temperature rise caused by being disposed on the surface of the printed circuit board 1 on the stator side. it can.

  In addition, the six IGBTs 34 constituting the inverter are arranged in an island shape on the IC chip 20 which is the same silicon chip and separated by the insulating separation layer 29. Further, the IC chip 20 includes the heat spreader 13 and Has a strong thermal connection. For this reason, even when the heat generation of the IGBTs 34 on the IC chip 20 varies, the IGBTs 34 are on the same solid and thus have substantially the same temperature, and the temperature distribution of the IGBTs 34 is smoothed.

  In addition, with the above-described configuration, it is possible to avoid deterioration in temperature detection performance due to variations in temperature distribution between the IGBTs 34 when the IGBTs 34 are configured as separate chips.

  Furthermore, it is not necessary to arrange a plurality of overheat detection elements 14 in order to detect temperature variations in each IGBT 34, and the cost can be reduced.

  Since the motor external connection lead 7 is mounted on the surface opposite to the stator of the printed circuit board 1 by a lead wire type, it is possible to avoid a short circuit between the high and low voltage electrodes when moisture adheres to the outer surface of the motor 61. The reliability of the motor 61 can be ensured.

  In the inverter IC 2, since the heat spreader 13 is mechanically strongly connected to the copper foil 50 by soldering, the mechanical connection strength with the printed circuit board 1 is drastically compared with the connection by soldering of only a normal circuit electrode. Can be improved. As a result, the power conversion device 60 can be built in the motor 61 formed of the mold resin 4.

  Further, the heat spreader 13 is thermally connected to the copper foil 50 by solder on the surface of the printed circuit board 1 on the stator side, and further thermally connected to the copper foil 50 on the side opposite to the stator via the through hole 51. Yes. Thereby, the heat generated in the inverter IC 2 can be radiated to the side opposite to the stator of the printed circuit board 1.

  In addition, since the inverter IC 2 is arranged on the surface of the printed circuit board 1 on the stator side, the heat spreader 13 is arranged at a position far from the bearing 9, so that a motor 61 that is less likely to cause electrolytic corrosion can be obtained.

  Further, by mounting components on the surface of the printed circuit board 1 on the stator side, it is possible to make electrical and mechanical connection at once by reflow soldering. Further, by mounting components on the surface of the stator of the printed circuit board 1, a metal mask is applied to the motor external connection leads 7 and the connection lands for the motor terminals 5 that need to be soldered after the printed circuit board 1 is divided. By using it, it becomes possible not to apply solder. Further, when the solder is remelted, the through hole 51 is not filled with the solder, and the masking tape attaching process and the peeling process are prevented so that the through hole 51 is not filled with the solder. There is an advantage that you can. Thus, by mounting components on the surface of the printed circuit board 1 on the stator side, soldering work of semiconductor elements and the like on the circuit board is facilitated, processing costs can be reduced, and the circuit board and the semiconductor can be reduced. The mechanical connection strength with an element or the like can be dramatically improved.

  In addition, by improving the temperature detection performance of the overheat detection element 14, the inverter IC 2 with the heat spreader 13 can be surface-mounted on the surface of the printed circuit board 1 on the stator side. As a result, there is a margin in the mold space on the surface of the printed circuit board 1 opposite to the stator, so that the stator 3 can be thickened by the margin to obtain a motor 61 with a large output, or the margin can be thinned. By doing so, a thin and compact motor 61 with the same output can be obtained.

  Further, in the printed circuit board 1 according to the first embodiment, the neutral point connection 39 (see FIG. 4) in the stator 3 is not mounted, and a plurality of high-voltage elements are integrated on the IC chip 20 which is a one-chip semiconductor. By using the inverter IC2, the package is downsized. Thereby, the semicircular arc-shaped printed circuit board 1 having a cross-sectional area of ½ or less can be formed.

  Moreover, since the printed circuit board 1 has an inner diameter portion formed in a semicircular arc shape, when forming a plurality of printed circuit boards 1 on a single substrate, the inner diameter portions of the respective printed circuit boards 1 are opposed to each other, and By arranging the circular arc centers of the portions to be offset from each other, it is possible to improve the utilization efficiency of the substrate for forming the printed circuit board 1.

  In addition, the motor 61 according to the first embodiment incorporates a power conversion device 60 having a printed circuit board 1 on which a semiconductor module (inverter IC2) that converts the voltage of an external power source into a high-frequency voltage and supplies it to the stator 3 is mounted. One end of the motor 61 facing the stator 3 of the printed circuit board 1 is electrically connected to the high-voltage input line 17 of the external power source, and the other end is electrically connected to the high-voltage electrode 11 of the inverter IC2. Since the high-voltage side wiring 104 is disposed, the mold hole (100) and the high-voltage DC input wiring 104 are compared with the case where the high-voltage DC input wiring 104 is passed through the surface of the printed circuit board 1 opposite to the stator. A lot of distance can be taken. Therefore, the resin thickness (thickness of the mold resin 4) for suppressing the influence when the high-voltage DC input wiring 104 is melted can be reduced. As a result, the motor 61 can be reduced in weight and size.

Embodiment 2. FIG.
(Configuration of air conditioner 200)
FIG. 7 is an overall external view of the air conditioner 200 according to Embodiment 2 of the present invention, and FIG. 8 is a cross-sectional view of the indoor unit 70 in the air conditioner 200.

  In the air conditioner 200 shown in FIG. 7, an indoor unit 70 hung on an indoor wall is connected to an outdoor unit 80 installed outdoors via a refrigerant pipe 90. Further, the indoor unit 70 incorporates an indoor blower 71 described later, and the outdoor unit 80 is provided with an outdoor blower 81.

  In FIG. 8, the indoor unit 70 includes a suction port 73 provided on the upper surface of the indoor unit 70, an indoor heat exchanger 72, an indoor blower 71, a blowout air passage 74, and a blowout port 75 as main components. It is configured. The indoor heat exchanger 72 exchanges heat between the indoor air and the refrigerant, and the indoor blower 71 sucks indoor air from the suction port 73 and passes this air through the indoor heat exchanger 72 to exchange heat. The air is conditioned and blows into the room. The indoor heat exchanger 72 extends from the upper back of the indoor unit 70 to the vicinity of the front middle stage, and is bent from the vicinity of the middle front of the indoor unit 70 toward the lower front part so as to surround the front side of the indoor blower 71. is set up. The indoor blower 71 is a line flow fan that is rotatably provided so as to extend in the longitudinal direction of the indoor unit 70. And the motor 61 (refer FIG. 1) with which the power converter device 60 which concerns on Embodiment 1 was incorporated is connected with the edge part of the longitudinal direction of the indoor air blower 71 in order to rotationally drive the indoor air blower 71. FIG. . In addition, a blowout air passage 74 through which conditioned air circulates is formed in the lower portion of the indoor blower 71. The blower outlet 75 is provided in the lower part of the indoor unit 70 in order to discharge the conditioned air which has circulated through the blowout air passage 74 to the outside.

(Basic operation of the indoor unit 70 of the air conditioner 200)
Next, the basic operation of the indoor unit 70 will be described. When the operation of the air conditioner 200 is started by the user operating a remote controller or the like, the motor 61 connected to the indoor blower 71 is rotationally driven, and the indoor blower 71 is rotationally driven in conjunction with the rotation. The room air is sucked from the suction port 73 by the rotation of the indoor blower 71. The sucked room air further passes through the indoor heat exchanger 72 by the continuous rotation of the indoor blower 71, and is heat-exchanged with the refrigerant circulating in the indoor heat exchanger 72. The indoor heat exchanger 72 functions as an evaporator when the air conditioner 200 is performing a cooling operation, and the refrigerant inside the indoor heat exchanger 72 evaporates, so that the passing indoor air is cooled. . On the other hand, when the air conditioner 200 is performing the heating operation, the indoor heat exchanger 72 functions as a condenser, and the passing indoor air is heated. Thus, when the indoor air sucked into the indoor unit 70 passes through the indoor heat exchanger 72, the indoor air is heat-exchanged by the indoor heat exchanger 72 and becomes conditioned air requested by the user. The conditioned air that has passed through the indoor heat exchanger 72 passes through the blowout air passage 74 and is blown into the room from the air outlet 75 by the continuous rotation of the indoor blower 71. Moreover, the air volume of the conditioned air blown out is adjusted by changing the rotation speed of the motor 61 connected to the indoor blower 71.

(Effect of Embodiment 2)
As described above, the air conditioner 200 according to Embodiment 2 incorporates the power conversion device 60 according to Embodiment 1 in the indoor blower 71 and mounts the motor 61, whereby the motor 61 is reduced in size. Accordingly, the size of the indoor heat exchanger 72 can be increased. Further, in the air conditioner 200 according to the second embodiment, since the resin for suppressing the influence on the outside of the motor at the time of abnormality such as the introduction of different voltages is thinned, both the reduction in size and the weight can be achieved, and the energy saving performance is high. In addition, it is possible to reduce anxiety to the user when an abnormality occurs.

  Further, the air conditioner 200 according to the second embodiment is mounted with the motor 61 according to the first embodiment with high output (that is, the mold space on the anti-stator side surface of the printed circuit board 1 as much as the margin of the stator. 3), the heat exchange performance at the time of start-up can be taken high, the set temperature can be reached in a short time, and the user's comfort can be improved. In addition, since the wind speed is increased by increasing the output of the motor 61, the temperature unevenness in the room can be eliminated, the comfort of the user can be improved, and at the same time, the anxiety to the user when an abnormality occurs is reduced. can do.

  In addition, the structure of the air conditioner 200 shown by FIG. 7 and FIG. 8 demonstrated above, especially the indoor unit 70 is an example, The structure is not limited by these. In the description of the second embodiment, the example in which the motor 61 according to the first embodiment is used as the indoor blower 71 of the indoor unit 70 has been described. However, the air conditioner 200 according to the second embodiment is limited to this. Instead of this, the motor 61 may be used for the outdoor blower 81 of the outdoor unit 80.

Further, the power conversion device 60 according to the first embodiment uses a high-voltage DC voltage that has undergone full-wave rectification or voltage doubler rectification as the high-voltage DC power supply 38. Therefore, compared to a circuit built-in motor using a low-voltage power supply of 30 V or less using a step-down power supply, the breaking energy of the wire and its surroundings at the time of a Si or SiC element chip short-circuit failure is orders of magnitude greater. If the resistance value of the high-voltage wiring system at the time of the short-circuit failure is R and the DC power supply voltage is V, the amount of heat generated at the time of breakdown is V ² / R. The resistance at the time of a short-circuit failure is a direction in which the high-voltage power element having a larger chip cross-sectional area becomes smaller. More than double. As a result, the outside of the motor or device is likely to be affected, and the user is likely to feel uneasy. Therefore, first, it is required not to cause destruction. In the unlikely event that a device breaks down, the user outside the device is not aware of the effect, so a safer device can be obtained. As described above, the printed circuit board 1 according to Embodiment 1 is provided with the high-voltage DC input wiring 104 on the surface of the printed circuit board 1 on the stator side. Therefore, the distance between the mold hole (100) and the high-voltage DC input wiring 104 can be increased as compared with the case where the high-voltage DC input wiring 104 is passed through the surface of the printed circuit board 1 opposite to the stator. Therefore, in the air conditioner 200 on which the motor 61 according to the first embodiment is mounted, the sound and light generated by the short circuit current are not generated on the side opposite to the stator of the printed circuit board 1, and the user when an abnormality occurs to the user Can reduce anxiety.

  In the embodiments described so far, the one-chip inverter IC2 is used as the main circuit of the inverter. However, the same effect can be obtained even when the high-voltage surface-mount type multi-chip inverter IC2 and the discrete main element are used. Needless to say.

  Examples of the wide band gap semiconductor include silicon carbide, gallium nitride-based materials, and diamond. Switching elements and diode elements formed by such wide band gap semiconductors have high voltage resistance and high allowable current density, so that switching elements and diode elements can be miniaturized. By using elements and diode elements, it is possible to reduce the size of a semiconductor module incorporating these elements. In these elements, since the ON resistance at the time of top and bottom short circuit is lower than that of the narrow gap Si semiconductor, a large amount of short circuit current flows, the degree of damage of the wire and its surroundings is large, and the effect of arranging the high voltage DC input wiring on the stator surface is effective. Get higher.

  In addition, since the wide band gap semiconductor has high heat resistance, the heat spreader 13 can be reduced in size. For example, the cooling method can be changed from water cooling to air cooling, thereby further reducing the size of the semiconductor module. It becomes possible. Therefore, since the metal lead frame 22 is shorter than that of the Si element, the degree of damage of the wire and its periphery is large, and the effect of arranging the high-voltage DC input wiring 104 on the stator surface is enhanced.

  Although both the switching element and the diode element are desirably formed of a wide band gap semiconductor, either one of the elements may be formed of a wide band gap semiconductor, and the effect described in this embodiment Can be obtained.

  In the first and second embodiments, the case where the thermal, electrical, and mechanical connection between the element and each metal is performed by solder has been described. However, the same applies even when other metal or a material such as conductive resin is used. Needless to say, an effect can be obtained.

  In the first and second embodiments, the double-sided through-hole substrate using the copper foil 50 is used for the printed circuit board 1, but the substrate is not configured by a base material made of another metal or an insulating material, etching, or the like. Needless to say, the same effect can be obtained even if double-sided wiring is used.

  Moreover, in Embodiment 1, 2, although the air conditioner was demonstrated as a motor mounting apparatus, you may use the motor 61 for ventilation ventilation apparatus. For example, by using the motor 61 as a motor of a ventilation blower that blows out indoor air to the outside, it goes without saying that the same effects as described above, such as thinning of the device and improvement of the blowing performance, can be obtained. The improvement of the air blowing performance is particularly effective when it is desired to discharge moisture and odor in a short time in a bathroom or a toilet.

  Moreover, in the above embodiment, although the air conditioner was demonstrated as a motor mounting apparatus, you may use the motor 61 for a water heater. For example, it goes without saying that by using the motor 61 for a blower in a hot water heater or a fluid pump in a hot water heater for heating water with a refrigerant, the same effects as described above such as thinning of the apparatus and improvement of the blowing performance can be obtained. Nor. The improvement of the high temperature and high load performance is particularly effective when pumping high temperature hot water which is a factor for increasing the ambient temperature of the motor.

  As described above, the present invention can be applied mainly to a motor incorporating a power converter, an air conditioner incorporating this motor, a water heater, and a ventilation fan, and particularly to miniaturizing a printed circuit board. This is useful as an invention capable of suppressing the thickness of the mold resin on the side opposite to the stator.

1 Printed circuit board 2 Inverter IC (semiconductor module)
DESCRIPTION OF SYMBOLS 3 Stator 4 Mold resin 5 Motor terminal 6 Hall element 7 Motor external connection lead 8 Rotor penetration hole 9 Bearing 9a Bearing housing 10 Bearing through hole 11 High voltage electrode 12 Low voltage electrode 13 Heat spreader 14 Overheat detection element 16 Rotor 17 High voltage input line 18 Low pressure I / O line 20 IC chip (semiconductor chip)
21 Bonding wire 22 Metal lead frame (external electrode)
23 IC package 25 Aluminum wiring 26 Silicon oxide film 27 Semiconductor single crystal island (semiconductor element)
28 Polycrystalline silicon 29 Insulating separation layer 31 Rotational speed output line 32 Output voltage command input line 33 Charge pump diode 34 IGBT
35a Upper arm drive circuit 35b Lower arm drive circuit 38 High voltage DC power supply 39 Neutral point connection 50 Copper foil 51 Through hole 60 Power converter 61 Motor 70 Indoor unit 71 Indoor blower 72 Indoor heat exchanger 73 Suction port 74 Blowout air flow path 75 Air outlet 80 Outdoor unit 81 Outdoor fan 90 Refrigerant piping 104 High-voltage DC input wiring 105 Motor output wiring 200 Air conditioner

Claims (10)

A motor incorporating a power conversion device having a substrate on which a semiconductor module for converting a voltage of an external power source into a high frequency voltage and supplying the voltage to a stator is mounted,
On the opposite side of the surface of the substrate facing the stator, a resin mold hole is formed by a mold that holds the opposite side,
One end is electrically connected to the high-voltage input line of the external power source and the other end is electrically connected to the high-voltage electrode of the semiconductor module on the surface of the substrate facing the stator where the mold hole is formed. high-voltage side wires that are disposed power converter built motor that. The high-pressure side wiring is the stator and opposed surfaces of the front Stories substrate, the power conversion device embedded motor according to 請 Motomeko 1 that is disposed at a position away from the mold hole. The semiconductor module has a semiconductor chip on which a plurality of semiconductor elements are formed,
The semiconductor chip is a power conversion device embedded motor according to 請 Motomeko 1 or claim 2 external electrode and that are electrically connected to the semiconductor module of a metal wire. The semiconductor module is disposed on the substrate, and the power conversion device embedded motor according to 請 Motomeko 3 that have a said positioned proximate to external electrodes of the semiconductor module heat spreader. The semiconductor chip is a power conversion device embedded motor according to 請 Motomeko 3 or claim 4 that is made of wide band gap semiconductor. An indoor unit that blows conditioned air into the installation room;
An indoor fan installed in the indoor unit and sending out the conditioned air from the outlet;
An outdoor unit that is connected to the indoor unit by a refrigerant pipe and performs heat exchange with outside air; and
With
Wherein the indoor blower, air conditioner that provided the power conversion device embedded motor according to any one of claims 1 to 5. An indoor unit that blows conditioned air into the installation room;
An outdoor unit that is connected to the indoor unit by a refrigerant pipe and performs heat exchange with outside air; and
An outdoor fan installed in the outdoor unit and for sending outside air into the outdoor unit;
With
Wherein the outdoor blower, the air conditioner that provided the power conversion device embedded motor according to any one of claims 1 to 5. A blower for heating water by a refrigerant, hot water supply unit the power conversion device embedded motor that provided according to any one of claims 1 to 5. A fluid pump for heating water by a refrigerant, hot water supply unit the power conversion device embedded motor that provided according to any one of claims 1 to 5. A ventilation blowing device for blowing out the indoor air to the outdoor, ventilation air blowing device power converter built motor according to claims 1 any one of claims 5 that provided.

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