JP5765633B2 - Printed wiring board and manufacturing method thereof - Google Patents

Description

  The present invention relates to a printed wiring board in which a lead (terminal) connected to an electronic component is inserted into a through hole and soldered, and a manufacturing method thereof.

  In recent years, with the miniaturization and thinning of digital devices such as mobile phones and digital still cameras (DSCs), printed wiring boards having land portions on which electronic components used in these devices are mounted are similarly small and thin. Is required. As such a printed wiring board, for example, a type in which a through hole for inserting a lead of an electronic component as shown in Patent Document 1 is formed is known. The through hole of this type of printed wiring board is subjected to a plating process in order to achieve electrical continuity from the back surface to the front surface where the lead tip of the electronic component of the printed wiring board is soldered.

JP 2005-44990 A

  However, in the case where the through hole is plated, such as the conventional printed wiring board disclosed in Patent Document 1, the aspect of the plated portion of the through hole is increased when the number of layers is increased and the thickness of the wiring board is increased. The ratio becomes high. In this case, there is a problem that cracks and the like are easily generated in the plating in the through hole due to the stress, and the electrical connection reliability is lowered. Moreover, in order to improve reliability, it is necessary to increase the plating thickness, leading to an increase in cost.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board that can solve the above-described problems caused by the prior art and ensure electrical connection reliability, and a method for manufacturing the same.

  The printed wiring board according to the present invention comprises a plurality of printed wiring substrates having land portions formed on at least one surface of an insulating layer, and a plurality of printed wiring substrates laminated in a lump so that the land portions overlap in the stacking direction. A plurality of printed wiring bases formed in the plurality of printed wiring bases and in contact with the land parts, and through holes for inserting leads that penetrate the inner sides of the land parts of the plurality of printed wiring bases in the stacking direction. And a via penetrating each printed wiring board disposed around the through hole.

  According to the present invention, the vias that contact the land portion and penetrate the printed wiring boards are disposed around the through hole for inserting the lead of the electronic component. Electrical connection can be achieved, and there is no need to plate through holes. Further, even if a crack or the like occurs in any of the vias, the electrical connection reliability is not lowered as compared with the case where the through hole is plated. For this reason, it becomes possible to ensure electrical connection reliability.

  In one embodiment of the present invention, a part of the plurality of printed wiring substrates is a single-sided wiring substrate in which the land portion is formed on one side, and the other part of the plurality of printed wiring substrates is The double-sided wiring base material in which the land portions are formed on both sides, and the via formed in the single-sided wiring base material is an interlayer connection via made of a conductive paste, and is formed in the double-sided wiring base material. The via is a via for conductor connection made of plating for connecting the land portions formed on both surfaces.

  In this case, a plurality of the vias for interlayer connection are arranged around the through hole and arranged in a stack structure in the stacking direction, and the vias for connecting the conductors are arranged around the through hole. It is desirable that a plurality of them are arranged and arranged so as to be shifted in the circumferential direction of the through hole with respect to the interlayer connection via as viewed from the stacking direction.

  The method for manufacturing a printed wiring board according to the present invention includes laminating a plurality of printed wiring base materials having land portions formed on at least one surface of an insulating layer so that the land portions overlap each other in the stacking direction. In the printed wiring board manufacturing method, the land portion is formed on one surface of the insulating layer, and an opening reaching the land portion from the other surface side is formed along the periphery of the land portion. Thereafter, a step of manufacturing a printed wiring board in which vias for interlayer connection are formed by filling the openings with a conductive paste, and forming the land portions at corresponding positions on both surfaces of the insulating layer, After the opening is formed along the periphery of the land portion so as to reach the land portion on the other surface side from the land portion on the surface side, or through the land portions on both surfaces, plating is performed in the opening portion. A step of producing a printed wiring substrate in which vias for connecting conductors are formed by applying, a step of laminating a plurality of the printed wiring substrates together so that each land portion overlaps along the laminating direction, A through hole for inserting a lead that penetrates the inside of each land portion of the plurality of printed wiring substrates in the stacking direction, and a via for connecting the interlayer and connecting between the conductors are arranged around the via hole. And a forming step.

  According to the present invention, vias for inter-layer connection and inter-conductor connection are arranged around through holes for lead insertion of electronic parts formed after batch lamination of a plurality of printed wiring substrates. The process of plating the through-hole for the front and back connection is not required. Further, even if a crack or the like occurs in any of the vias, the electrical connection reliability does not decrease. For this reason, it becomes possible to manufacture a printed wiring board capable of improving the electrical connection reliability without increasing the number of manufacturing steps.

  In one embodiment of the present invention, a plurality of the vias for interlayer connection and the connection between conductors are respectively formed along the periphery of the land portion, and when laminating the plurality of printed wiring substrates together, The inter-layer connection vias are arranged so as to form a stack structure in the stacking direction, and the inter-conductor connection vias are arranged so as to be shifted from the inter-layer connection vias when viewed from the stacking direction. Laminate.

  According to the present invention, electrical connection reliability can be ensured.

It is sectional drawing which shows the structure of the printed wiring board which concerns on the 1st Embodiment of this invention. It is A arrow directional view of FIG. It is a flowchart which shows the manufacturing process of the printed wiring board. It is a flowchart which shows the manufacturing process of the printed wiring board. It is a flowchart which shows the manufacturing process of the printed wiring board. It is sectional drawing which shows the same printed wiring board for every manufacturing process. It is sectional drawing which shows the same printed wiring board for every manufacturing process. It is sectional drawing which shows the same printed wiring board for every manufacturing process. It is a B arrow view of FIG.8 (c). It is sectional drawing which shows a mode that the electronic component was mounted in the printed wiring board. It is sectional drawing which shows the structure of the printed wiring board which concerns on the 2nd Embodiment of this invention. It is C arrow line view of FIG.

  Hereinafter, a printed wiring board and a manufacturing method thereof according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a sectional view showing the structure of a printed wiring board according to the first embodiment of the present invention. As shown in FIG. 1, the printed wiring board 1 according to the first embodiment includes a first printed wiring substrate 10, a second printed wiring substrate 20, a third printed wiring substrate 30, and a fourth printed wiring substrate. 40 and the 5th printed wiring board 50 are provided with the structure laminated at once by thermocompression bonding.

  Further, the printed wiring board 1 is formed with a through hole 60 penetrating the first to fifth printed wiring substrates 10 to 50 in the stacking direction. A lead (terminal) of an electronic component, which will be described later, mounted on the printed wiring board 1 is inserted into the through hole 60. The through hole 60 is formed by laser processing, mold processing, drill processing, or the like so that the radius (φ1 / 2) is about 500 μm, for example.

  The 1st-5th printed wiring base materials 10-50 are the 1st resin base material 11, the 2nd resin base material 21, the 3rd resin base material 31, the 4th resin base material 41, and the 5th resin as an insulating layer, respectively. A substrate 51 and wirings 12, 22, 32, 42, 52 formed on at least one surface (one surface) of the first to fifth printed wiring substrates 10-50 are provided.

  Further, the first to fifth printed wiring base materials 10 to 50 are land portions 13, 23, formed on one side of the first, second, fourth and fifth resin base materials 11, 21, 41, 51, respectively. 43, 53 and land portions 33a, 33b formed at corresponding positions on both surfaces of the third resin base 31. Therefore, the 3rd printed wiring board 30 consists of a double-sided board (double-sided CCL) which is what is called a core board, and other than this consists of a single-sided board (single-sided CCL). The printed wiring board 1 is obtained by laminating the printed wiring substrates 10 to 50 in a lump so that the land portions 13 to 53 overlap in the laminating direction.

  The first, second, fourth, and fifth printed wiring substrates 10, 20, 40, and 50 are formed by filling a conductive paste in via holes formed so as to be arranged around the through hole 60, for example. A plurality of interlayer connection vias 14, 24, 44, 54 that are in contact with and electrically connected to the land portions 13, 23, 43, 53 are provided. The third printed wiring board 30 is formed by plating in via holes formed so as to be disposed around the through holes 60, for example, and is in contact with and electrically connected to the land portions 33a and 33b. Vias 34 for connecting the two conductors.

  The via 34 is composed of an LVH plated via having a structure in which a via hole (through hole) formed from the other land portion 33b side is plated without penetrating one land portion 33a, for example, copper plating It is formed by. In this case, the plating layer 32 a is formed on the land portion 33 a and the wiring 32.

  The via 34 may have a structure in which a conductive paste is filled instead of plating in the via hole. In addition, although illustration is abbreviate | omitted, the via | veer 34 may be comprised by the plated through hole of IVH of the structure which plated in the through hole (through-hole) which penetrates between each land part 33a, 33b.

  As shown in FIG. 2, a plurality of vias 14 to 54 are arranged around the through hole 60 and arranged to form a stack structure in the stacking direction of the printed wiring substrates 10 to 50. On the other hand, a plurality of vias 34 are similarly arranged around the through-hole 60, but in the circumferential direction of the through-hole 60 with respect to the vias 14 to 54 as viewed from the stacking direction, for example, with respect to the center of the through-hole 60. Are arranged so as to be shifted by 45 °.

  Therefore, in FIG. 1, for convenience of illustrating the cross-sectional structure, the via 34 is described as if it is disposed on the same cross section as the other vias 14, 24, 44, 54, but in actuality, they are shifted from each other. Has been placed. For this reason, the adhesive layer 9 for interlayer adhesion flows into the recessed portion of the via 34 during the batch lamination. Note that the diameter φ2 of each of the vias 14 to 54 is formed to be about 100 μm by the processing method as described above.

  Thus, by arranging the via 34 so as to be displaced with respect to the other vias 14, 24, 44, 54, the pressurizing pressure at the time of stacking acts on the recessed portion of the via 34 and the via 34 is crushed. It is possible to prevent the pressurization pressure from being insufficient with respect to the vias 14 to 54 and to reliably connect the lands 13 to 53 with each other. When the vias 34 are arranged so as to have a stacked structure without being shifted, it is necessary to set the plating of the vias 44 or the amount of the conductive paste so that the recessed portions of the vias 34 are sufficiently filled.

  The 1st-5th resin base materials 11-51 are comprised by the resin film. As the resin film, for example, a resin film made of thermoplastic polyimide, polyolefin, liquid crystal polymer or the like, a resin film made of thermosetting epoxy resin, polyimide resin, or the like can be used.

  The wirings 12 to 52 and the land portions 13 to 53 are formed by patterning a conductive material such as copper foil. In addition, the conductive paste is at least one kind selected from, for example, at least one kind of low electrical resistance metal particles selected from nickel, gold, silver, copper, aluminum, iron and the like, and tin, bismuth, indium, lead and the like. And a low melting point metal particle, and a paste in which a binder component mainly composed of epoxy, acrylic, urethane or the like is mixed.

  The conductive paste thus configured has a characteristic that the contained low melting point metal can be melted at 200 ° C. or less to form an alloy, and in particular, can form an intermetallic compound with copper or silver. Prepare. Therefore, the connection portions between the vias 14, 24, 44, 54 and the land portions 13, 23, 43, 53 (including the plating layer 32a) are alloyed by an intermetallic compound at the time of batch lamination. Note that the conductive paste can also be formed of a nanopaste in which fillers such as gold, silver, copper, and nickel having a nanometer particle size are mixed with the binder component as described above.

  In addition, the conductive paste can also be composed of a paste in which metal particles such as nickel are mixed with the binder component as described above. In this case, the conductive paste has a characteristic that electrical connection is made when metal particles come into contact with each other. As a method for filling the via hole with the conductive paste, for example, a printing method, a spin coating method, a spray coating method, a dispensing method, a laminating method, and a method using these in combination can be used.

  Of the printed wiring substrates 10 to 50 laminated through the adhesive layer 9, the surfaces of the printed wiring substrates 10 and 50 arranged on the outermost layer are formed by the solder resist 8 except for the exposed wiring and land portions. Covered. The adhesive layer 9 is made of an organic adhesive containing a volatile component, such as an epoxy or acrylic adhesive.

  Since the printed wiring board 1 configured in this way is formed with a plurality of vias 14, 24, 44, 54 for inter-layer connection and vias 34 for connecting between conductors made of conductive paste, for example, cracks or the like in any one of them Even if this occurs, electrical conduction between the surfaces of the outermost layer can be established with other vias. Thereby, electrical connection reliability can be ensured.

  Further, since each via 14 to 54 is electrically connected, it is not necessary to conduct the portion of the through hole 60. For this reason, it is not necessary to separately plate the through hole 60 for the front and back connection of the printed wiring board 1 after the lamination of the printed wiring substrates 10 to 50, and the number of manufacturing processes and plating materials are reduced accordingly. Cost can be reduced.

Next, a method for manufacturing the printed wiring board 1 according to the first embodiment will be described.
3-5 is a flowchart which shows the manufacturing process of a printed wiring board. 6-8 is sectional drawing which shows a printed wiring board for every manufacturing process. 3 and 6 show the first, second, fourth, and fifth printed wiring substrates 10, 20, 40, 50, and FIGS. 4 and 7 show the third printed wiring substrate 30, FIGS. FIG. 8 shows details of each manufacturing process for the final process of the printed wiring board.

  First, the manufacturing process of the first, second, fourth, and fifth printed wiring substrates 10, 20, 40, 50 will be described with reference to FIG. Since these can be manufactured in the same process, the manufacturing process of the first printed wiring board 10 will be described as a representative here, but the second, fourth and fifth printed wiring boards 20 and 40 will be described. , 50 is the same.

  As shown in FIG. 6A, a single-sided copper-clad laminate (single-sided CCL) in which the conductor layer 7 is formed on one side of the first resin base 11 is prepared (step S100). Next, after forming an etching resist on the conductor layer 7 by photolithography, etching is performed to form conductor patterns such as the wiring 12 and the land portion 13 as shown in FIG. 6B (step S102).

  The single-sided CCL used in step S100 has a structure in which the first resin base material 11 having a thickness of about 25 μm is bonded to the conductor layer 7 made of a copper foil having a thickness of 12 μm, for example. In addition, as this single-sided CCL, what was produced by apply | coating a polyimide varnish to copper foil by the casting method, for example, and hardening the varnish can be used.

  In the casting method, the resin melted by the extruder is extruded from a linear slit provided on a flat die, and the molten film is rapidly cooled with a cooled roll and rolled up while being rolled. It is a known method for forming a simple film or sheet. This method is highly reliable and widely used.

  In addition, as single-sided CCL, a seed layer is formed on a polyimide film by sputtering, copper is grown by plating, and a conductor layer 7 is formed, or a rolled or electrolytic copper foil and a polyimide film are bonded together with an adhesive. It is also possible to use the one produced by the above. Note that the first resin base 11 does not necessarily need to be made of polyimide, and may be made of a plastic film such as a liquid crystal polymer as described above. For the etching in step S102, an etchant mainly composed of ferric chloride, an etchant mainly composed of cupric chloride, or the like can be used. In the above description, the circuit is formed using the subtractive method. However, the circuit may be formed using the semi-additive method.

  When the conductor pattern is formed, as shown in FIG. 6C, the adhesive 9a and the mask material 6 are applied to the surface of the first resin base 11 opposite to the wiring 12 and land 13 formation surface by thermocompression bonding. Pasting (step S104). For example, an epoxy thermosetting film having a thickness of about 25 μm can be used as the adhesive material 9a attached in step S104. For thermocompression bonding, a vacuum laminator is used, and these are bonded together by pressing at a pressure of 0.3 MPa at a temperature lower than the curing temperature of the adhesive 9a in an atmosphere under reduced pressure.

  The interlayer adhesive used for the adhesive 9a constituting the adhesive layer 9 is not only an epoxy thermosetting film, but also an acrylic adhesive, a thermoplastic adhesive typified by thermoplastic polyimide, etc. Is mentioned. Further, the interlayer adhesive does not necessarily need to be in the form of a film, and may be obtained by applying a varnish-like resin. As the mask material 6, various films that can be bonded and peeled off by UV irradiation can be used in addition to the above-described resin films and plastic films such as PET and PEN.

  Then, as shown in FIG. 6D, via holes 5 penetrating the mask material 6, the adhesive material 9 a, and the first resin base material 11 along the periphery of the land portion 13 from the attached mask material 6 side are predetermined. A plurality of portions are formed at the locations (step S106), and, for example, plasma desmear processing is performed in the via holes 5.

  As described above, the via hole 5 formed in step S106 has a diameter of about 100 μm, and a plurality of via holes 5 are formed at predetermined locations using, for example, a UV laser. In addition, the via hole 5 may be formed by a carbon dioxide gas laser, an excimer laser, or the like, or may be formed by drilling or chemical etching.

The plasma desmear treatment can be performed with a mixed gas of CF ₄ and O ₂ (tetrafluoromethane + oxygen), but other inert gas such as Ar (argon) can also be used, so-called dry treatment. Instead, it may be wet desmear treatment using a chemical solution.

  After that, as shown in FIG. 6E, the via hole 5 for interlayer connection is formed by filling the formed via hole 5 with, for example, a screen paste by screen printing (step S108), and shown in FIG. 6F. Thus, the mask material 6 is peeled off and removed (step S110), and the first printed wiring substrate having the first resin substrate 11 provided with the adhesive layer 9 while the wiring 12 and the land portion 13 are formed. 10 is formed. By performing such processing, the second, fourth and fifth printed wiring substrates 20, 40, 50, and in the case of a multilayer, other printed wiring substrates are formed and prepared.

  Next, the manufacturing process of the third printed wiring board 30 will be described with reference to FIG. In addition, the part already demonstrated may attach | subject the same code | symbol, and may omit description, and suppose that the content mentioned above is applicable to the specific processing content of each step. First, as shown in FIG. 7A, a double-sided copper-clad laminate (double-sided CCL) in which the conductor layer 7 is formed on both sides of the third resin base material 31 is prepared (step S200), and FIG. As shown, the via hole 5 is located at a predetermined location such as a location along the periphery of a portion to be a land portion that needs to be connected between conductors or other desired location, and is shifted from each via 14, 24, 44, 54. (Step S202), for example, a plasma desmear process is performed.

  Next, as shown in FIG. 7C, panel plating is performed on the entire surface of the third resin base material 31 (step S <b> 204) to form a plating layer 32 a on the conductor layer 7 and in the via hole 5. A part of the plating layer 32a in the via hole 5 becomes a plating via that will be used later as an inter-conductor connection via 34, and electrically connects the conductor layers 7 on both surfaces of the third resin substrate 31. Yes.

  Finally, as shown in FIG. 7D, wiring patterns such as wirings 32, land portions 33a and 33b, and vias 34 for connecting between conductors are formed on both surfaces of the third resin base 31 by etching or the like (steps). S206), the third printed wiring board 30 is formed. Instead of forming the via hole 5 in step S202, a through hole (not shown) may be formed and plated in step S204 to form the plated through hole as the via 34 for connection between conductors. .

  Next, the manufacturing process after the lamination process of each printed wiring base materials 10-50 is demonstrated, referring FIG. As described above, when the first to fifth printed wiring substrates 10 to 50 are manufactured, as shown in FIG. 8A, the land portions 13 to 53 and the vias 14 to 54 are mounted, for example, for electronic components. Align with the machine. At this time, as described above, the via 34 for conductor connection is aligned with the vias 14, 24, 44, 54.

  Then, as shown in FIG. 8B, the adhesive layer 9 of the first, second, fourth and fifth printed wiring substrates 10, 20, 40, 50 and the vias 14, 24, 44 for interlayer connection, Each printed wiring substrate 10-50 is temporarily fixed in a state where the conductive paste 54 is not cured (step S300).

  Thereafter, the printed wiring substrates 10 to 50 are thermocompression bonded and stacked together (step S302). In this step S302, for example, using a vacuum press machine, it heat-presses in a pressure-reduced atmosphere of 1 kPa or less, and it laminates | stacks by thermocompression bonding, and the printed wiring board 1 as shown in FIG. 1 is manufactured. At this time, the conductive paste filled in the via hole 5 is cured and alloyed simultaneously with the curing of the adhesive layers 9 between the layers and the resin base materials 11. Therefore, an alloy layer of an intermetallic compound is formed between each land portion 13 and the like in contact with the conductive paste.

  And as shown in FIG.8 (c), solder resist 8 is pattern-formed on the resin base materials 11 and 51 by the side of the land parts 13 and 53 of the printed wiring base materials 10 and 50 of the outermost layer in the printed wiring board 1. As shown in FIG. (Step S304). In the printed wiring board 1 at this time, as shown in FIG. 9, vias 14, 24, 44, 54 for interlayer connection and vias 34 for connecting between conductors are provided around the land portion 13. They are offset.

  Finally, if through holes 60 as shown in FIGS. 1 and 2 are formed at the centers of the land portions 13 to 53 (step S306), the vias 14 to 54 are arranged around the through holes 60. The printed wiring board 1 according to the embodiment is formed. As shown in FIG. 10, when the electronic component 90 is mounted on the printed wiring board 1, for example, the lead 91 of the electronic component 90 is inserted into the through hole 60 from the first printed wiring substrate 10 side, and the fifth print The land portion 53 of the wiring substrate 50 and the lead 91 are connected by the solder 99, and the electronic component 90 is mounted on the printed wiring board 1 (step S308).

  Since the electronic component 90 can be mounted in this way, it is not necessary to perform soldering on the land portion 13 side of the first printed wiring board 10 in addition to the above-described effects, and the material cost of the solder 99 is suppressed. And reliability of electrical connection can be ensured.

[Second Embodiment]
FIG. 11 is a cross-sectional view showing the structure of a printed wiring board according to the second embodiment of the present invention. 12 is a view taken in the direction of arrow C in FIG. As shown in FIGS. 11 and 12, the printed wiring board 1A according to the second embodiment has the structure of the vias 14 to 54 in the first to fifth printed wiring substrates 10 to 50 according to the first embodiment. It is different from the one concerning.

  In other words, the vias 14, 24, 44, 54 for interlayer connection are filled in large via holes formed for the respective land portions 13, 23, 43, 53, and the via 34 for connection between conductors is formed. Are plated in via holes formed with a size equal to or larger than the via holes of these vias 14, 24, 44, 54.

  In this case, for example, the interlayer connection via 44 is higher in height (thickness) than the other interlayer connection vias 14, 24, and 54 so as to be reliably connected to the recessed portion of the via 34. It is formed to be thicker. The through hole 60 is formed so as to penetrate the vias 14 to 54 and the land portions 13 to 53. Even with such a structure, the same effects as the printed wiring board 1 according to the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 1,1A Printed wiring board 5 Via hole 6 Mask material 7 Conductor layer 8 Solder resist 9 Adhesive layer 10 1st printed wiring base material 11 1st resin base material 12 Wiring 13 Land part 14 Via 20 2nd printed wiring base material 21 2nd Resin base material 22 Wiring 23 Land portion 24 Via 30 Third printed wiring base material 31 Third resin base material 32 Wiring 32a Plating layer 33a, 33b Land portion 34 Via 40 Fourth printed wiring base material 41 Fourth resin base material 42 Wiring 43 Land portion 44 Via 50 Fifth printed wiring substrate 51 Fifth resin substrate 52 Wiring 53 Land portion 54 Via 60 Through hole 90 Electronic component 91 Lead 99 Solder

Claims (2)

A printed wiring board obtained by laminating a plurality of printed wiring base materials in which a land portion is formed on at least one surface of an insulating layer so that each land portion overlaps along the laminating direction,
A through hole for inserting a lead that penetrates the inside of each land portion of the plurality of printed wiring substrates in the stacking direction;
A via formed in the plurality of printed wiring substrates, contacting the land portion and penetrating each printed wiring substrate disposed around the through hole ;
A part of the plurality of printed wiring substrates is a single-sided wiring substrate in which the land portion is formed on one side,
The other part of the plurality of printed wiring substrates is a double-sided wiring substrate in which the land portions are formed on both sides,
The via formed in the one-sided wiring substrate is a via for interlayer connection made of a conductive paste,
The via formed in the double-sided wiring substrate is a via for conductor connection consisting of plating for connecting land portions formed on both sides,
A plurality of the interlayer connection vias are arranged around the through hole and arranged to form a stack structure in the stacking direction,
A plurality of vias for connecting the conductors are arranged around the through-holes, and arranged so as to be shifted in the circumferential direction of the through-holes with respect to the vias for interlayer connection as seen from the stacking direction. Printed wiring board characterized by A method of manufacturing a printed wiring board, wherein a plurality of printed wiring substrates having land portions formed on at least one surface of an insulating layer are laminated together so that each land portion overlaps in the stacking direction,
The land is formed on one surface of the insulating layer, an opening reaching the land from the other surface is formed along the periphery of the land, and then the opening is filled with a conductive paste. A process for producing a printed wiring board in which vias for interlayer connection are formed,
The land portions are respectively formed at corresponding positions on both surfaces of the insulating layer, and are opened so as to reach the land portion on one surface side from the land portion on the other surface side or through the land portions on both surfaces. Forming a portion along the periphery of the land portion, and then manufacturing a printed wiring substrate in which a via for conductor connection is formed by plating in the opening; and
A step of laminating a plurality of the printed wiring base materials so that each land portion overlaps along the laminating direction;
A through hole for inserting a lead that penetrates the inside of each land portion of the plurality of printed wiring substrates in the stacking direction, and a via for connecting the interlayer and connecting between the conductors are arranged around the via hole. Forming a process ,
A plurality of vias for interlayer connection and connection between conductors are formed along the periphery of the land part,
When collectively laminating the plurality of printed wiring substrates, the vias for interlayer connection are arranged in a stack structure in the laminating direction, and the vias for connecting between conductors are viewed from the laminating direction. A method of manufacturing a printed wiring board, wherein the printed wiring board is laminated so as to be displaced with respect to an interlayer connection via .

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