JP5615604B2 - Chip LED inspection device - Google Patents

Description

  The present invention relates to an inspection apparatus that detects a light-impermeable foreign matter mixed in or adhering to a sealing resin portion of a chip LED.

  Conventionally, various types of chip LEDs are known, and one of them is shown in FIG.

  As shown in FIG. 12, the chip LED 50 includes a light-transmitting substrate 51 and at least two light-impermeable electrode portions 52 and 52 formed on the back surface of the substrate 51 so as to be separated from each other. And a light emitting portion 53 disposed at the center of the surface of the substrate 51, and a translucent sealing resin 54 that covers the surface of the substrate 51 and seals the light emitting portion 53.

  In the sealing resin 54, the portion covering the light emitting portion 53 is formed in a convex curved surface shape (in this example, substantially hemispherical), and in addition to the role of sealing the light emitting portion 53 described above, the convex curved surface portion 54a. Plays a role as a lens for condensing the light emitted from the light emitting portion 53.

  Therefore, when a light-impermeable foreign matter is mixed in or attached to the surface of the convex curved surface portion 54a that plays such a role, the light emitted from the light emitting portion 53 is blocked by the foreign matter, and the chip LED 50 There is a disadvantage that the irradiated light becomes non-uniform.

  For this reason, conventionally, there has been a demand for an inspection apparatus that can detect the light-impermeable foreign matter mixed in or adhering to the sealing resin 54 (particularly, the convex curved surface portion 54a).

  On the other hand, as an inspection apparatus, a chip LED is not conventionally used as an inspection object, but an inspection apparatus disclosed in JP 2009-288050 A is known as an apparatus for inspecting a wiring pattern of a semiconductor package. .

  This inspection apparatus illuminates a subject with indirect illumination means, images the subject with a line sensor camera, analyzes the image, and detects defects. The indirect illumination means has a dome shape. A subject having a concave curved reflecting surface, irradiating the reflecting surface with light from a light emitting port formed on the inner surface on the opening side of the main body, and a subject below by the light reflected by the reflecting surface Illuminate. The camera images the subject from an observation window formed in the main body.

JP 2009-288050 A

  However, in the case of the chip LED having the above configuration, even if the conventional inspection apparatus is applied to the inspection of the chip LED as it is, the translucent foreign matter existing in the sealing resin portion is removed due to the configuration of the chip LED. It could not be detected accurately.

  When the chip LED is illuminated using the conventional indirect illumination means, an image obtained by photographing the chip LED with a camera is, as shown in FIG. 13, an outer peripheral portion of the convex curved surface portion (a rising portion from the substrate) as seen from the plane. ) (Reference numeral 55), and the part without the electrode (the part that transmits light on the front and back) (reference numeral 56) is a dark part, and the other electrode part and the light emitting part are bright and dark images. Note that portions other than the portion corresponding to the chip LED 50 in the image are dark portions.

  Since the electrode part and the light emitting part reflect light relatively well, the light transmitted through the sealing resin and the substrate is reflected by the electrode part, and again passes through the substrate and the sealing resin and enters the camera. On the other hand, the portion where the electrode is not formed is a dark portion because the light transmitted through the sealing resin and the substrate is not reflected.

  Further, with respect to the rising portion (outer peripheral portion) of the convex curved surface portion from the substrate, in the conventional indirect illumination means having the above-described structure, the reflected light (illumination light) contributing to illumination is directed to some extent downward. Therefore, in the outer periphery that intersects the illumination light at an acute angle, there is much illumination light that is regularly reflected on the surface of the outer periphery, and there is little illumination light that enters the resin. The reflected light that enters the camera from the outer peripheral portion is small, and it is considered that this is a dark portion.

  On the other hand, the light-impermeable foreign matter does not transmit light and thus becomes a dark part. Therefore, when the light-impermeable foreign matter is at a position corresponding to the outer peripheral portion (reference numeral 55) of the convex curved surface portion or the portion where the electrode is not formed (reference numeral 56), both become dark portions. It is extremely difficult to detect the foreign matter (see FIG. 13, reference numeral 57 in FIG. 13 is a foreign matter).

  As the chip LED, in addition to the above-described form, there is a chip LED provided with an opaque resin or other member on the entire back surface of the substrate, but the convex curved outer peripheral portion of the sealing resin is a dark portion. There is no difference in terms of becoming.

  The present invention has been made in view of the above circumstances, and is an inspection apparatus capable of accurately detecting a non-transparent foreign matter present in a sealing resin portion of a chip LED regardless of the position where the foreign matter exists. The purpose is to provide

The present invention for solving the above problems is as follows.
A light-transmitting substrate; a light-impermeable electrode portion formed on the back surface of the substrate; a light-emitting portion disposed in a central portion of the surface of the substrate; and the light-emitting portion covering the substrate surface Of a chip LED that is formed of a translucent sealing resin that seals at least a portion that covers at least the light emitting portion of the sealing resin, or is mixed into the sealing resin or on the surface thereof An inspection device for detecting attached light-transmitting foreign matter,
A plate-like or sheet-like support member for supporting the chip LED;
A camera that is arranged above the support member and that captures an image of the surface side of the chip LED placed on the support member;
An upper illumination mechanism that is also disposed above the support member and illuminates the surface of the chip LED placed on the support member;
A determination unit that analyzes an image captured by the camera and determines the presence or absence of the foreign matter,
The upper illumination mechanism is
A dome-shaped main body having a circular opening at the center of the lower surface and an image pickup opening at the top, and a plurality of light sources disposed in the dome main body, The inner concave curved surface forms a reflecting surface, and the light source is arranged on the inner bottom surface of the dome body so as to emit light toward the concave curved surface at equal intervals in the circumferential direction. A first illumination unit configured to irradiate the light reflected by the curved surface downward from the lower surface opening of the dome body;
A body in which the ring, the lower surface of the ring body, at equal intervals in the circumferential direction, and have a plurality of light sources disposed so as to irradiate light downward, the lower annular region The second illumination unit that illuminates as a high illuminance region ,
The first illumination unit indirectly illuminates the entire surface of the chip LED,
The second illumination unit is disposed below the first illumination unit so that the ring body is dome body coaxial with the first illuminating portion, the outer peripheral portion of the convex curved portion of at least the tip LED and Illuminate the annular region including the region outside this, from the diagonally upward outside,
Further, the camera relates to a chip LED inspection apparatus that is arranged above the first illumination unit and configured to capture a surface image of the chip LED through an imaging opening of the dome body.

  In the inspection apparatus according to the present invention, first, the chip LED to be inspected is positioned in the inspection region (imaging field of view of the camera) on the support member. As a mechanism for transporting the chip LED, for example, the chip LED is appropriately transported by a transport means and placed in the inspection region on the support member, or the chip LED is appropriately transported on the support member. May be passed through the inspection area at an appropriate conveying speed, or the support member in a state where the chip LED is placed is moved so that the chip LED is appropriately transferred at the inspection area. It may be a mechanism that passes through the inside.

  In the inspection area on the support member, the surface of the chip LED is illuminated by the upper illumination mechanism, and an image on the surface side of the chip LED is captured by the camera through the imaging opening formed in the dome body of the first illumination unit. .

  The upper illumination mechanism includes a first illumination unit and a second illumination unit. The surface of the chip LED is illuminated by the two illumination units, and thus the chip LED imaged by the camera is captured. The image is an image in which a portion corresponding to the electrode portion and the light emitting portion and a portion corresponding to the convex curved surface portion are bright portions.

  In the first illumination unit, light is irradiated from the light sources arranged on the inner bottom surface of the dome body at equal intervals in the circumferential direction toward the concave curved surface of the inner surface of the dome main body, and the reflected light reflected by the concave curved surface. Is irradiated downward from the lower surface opening, and the entire surface of the chip LED is illuminated by the reflected light. That is, the entire surface of the chip LED is indirectly illuminated by the first illumination unit.

  And the light irradiated from the 1st illumination part permeate | transmits sealing resin and a board | substrate, and since an electrode part and a light emission part reflect light comparatively well, the transmitted light is reflected by the said electrode part and light emission part. Again, the light passes through the substrate and the sealing resin and enters the camera. For this reason, the part equivalent to an electrode part and a light emission part turns into a bright part.

  On the other hand, in the second illuminating unit, light is irradiated to the lower surface of the ring body from a plurality of light sources arranged at equal intervals in the circumferential direction in a circular area in plan view centered on the position immediately below the plurality of light sources. As a whole, the lower annular area is mainly illuminated as a high illuminance area.

The surface of the chip LED is illuminated mainly by light emitted obliquely downward on the inside of the light emitted from the second illumination unit. The first illumination unit is indirect illumination using reflected light reflected by the concave curved surface of the inner surface of the dome body, and has a certain degree of directivity downward as in the conventional indirect illumination means described above. Therefore, with only the first illumination part, the outer peripheral part (the rising part from the substrate) of the convex curved part that intersects the illumination light at an acute angle becomes a dark part, but the second illumination part has at least the convex curved surface. Since the annular region including the outer peripheral portion and the outer region is illuminated obliquely from above, the outer peripheral portion of the convex curved surface portion is also illuminated with a sufficient amount of light, and is reflected by the same portion. Alternatively, a sufficient amount of light transmitted through the same portion is incident on the camera. Therefore, the outer peripheral part of the convex curved surface part can be made bright by the illumination by the second illumination part.

  Thus, the image of the chip LED illuminated by the first illumination unit and the second illumination unit and imaged by the camera is an image in which the whole is a bright part.

  Therefore, when the light-impermeable foreign matter is mixed in the sealing resin or adhered to the surface thereof, the image captured by the camera is an image in which only the foreign matter is a dark part. In the determination unit, when the image is analyzed to determine the presence or absence of foreign matter, this can be easily and accurately performed.

  In the present invention, the second illuminating unit may include an annular diffuse translucent film disposed below the light source.

  By the way, in the case of a chip LED having a translucent portion on the front and back, such as a chip LED in which at least two opaque electrodes are formed on the back surface of the substrate, this is the upper illumination mechanism. When the light is illuminated only by the light, the light transmitted through the sealing resin portion and the substrate is not reflected in the portion having translucency, so that an image in which the corresponding portion is a dark portion is obtained. Therefore, when a foreign substance exists in the part corresponding to the part which has this translucency, this cannot be detected correctly.

  In order to solve such a problem, in the present invention, the support member is formed of a transparent member, and further, a lower illumination that illuminates the back surface of the chip LED through the support member below the support member. A mode in which a mechanism is provided can be employed.

  As described above, when the illumination is performed only by the upper illumination mechanism, the light transmitted through the front and back surfaces is not reflected by the light transmitted through the sealing resin portion and the substrate, but becomes a dark portion. By illuminating the back surface of the LED, light that has passed through the support member further passes through the light-transmitting portion and enters the camera, so that an image in which the light-transmitting portion is a bright portion is obtained.

  Therefore, even when a foreign substance is present in the translucent part, this can be accurately detected by illuminating the back surface of the chip LED with the lower illumination mechanism.

  Note that the lower illumination mechanism does not need to have a light source in particular, and is provided from a reflecting plate that is disposed below the supporting member in parallel with the supporting member, and a surface facing the supporting member is a reflecting surface. This may be configured.

  As described above, the surface side of the chip LED is illuminated by the upper illumination mechanism. For this reason, the light emitted from the upper illumination mechanism passes through the translucent part, further passes through the support member, reaches the reflection surface of the reflection plate, is reflected by the reflection surface, and again supports the support member. The light passes through the light transmitting part and enters the camera. Therefore, even when such a reflector is used, an image in which the translucent part is a bright part can be obtained. In this case, the reflecting surface of the reflecting plate is preferably white. Further, the support member may be made of a white material, and in this case, the lower illumination mechanism is unnecessary.

  Note that a chip LED as an inspection object includes a light-transmitting substrate, a light-impermeable electrode portion formed on the back surface of the substrate, and a light-emitting portion disposed at the center of the surface of the substrate. And a translucent sealing resin that covers the substrate surface and seals the light emitting portion, and at least a portion of the sealing resin that covers the light emitting portion is formed in a convex curve shape. The shape of the convex curved surface portion is not limited at all.

  As described above, according to the present invention, the image of the chip LED imaged by the camera can be an image in which the whole is a bright portion, and as a result, foreign matter exists in the sealing resin portion. In this case, it is possible to obtain an image in which only the foreign matter is a dark part. Therefore, when the obtained image is analyzed to determine the presence or absence of the foreign matter, this can be easily and accurately performed. it can.

It is the front view which showed the inspection apparatus which concerns on one Embodiment of this invention. It is the longitudinal cross-sectional view which showed the upper illumination mechanism which concerns on this embodiment. It is the front view which isolate | separated and showed the 1st illumination part and the 2nd illumination part of the upper illumination mechanism which concern on this embodiment. It is sectional drawing of the arrow AA direction in FIG. It is a bottom view of the arrow B direction in FIG. It is a bottom view of the arrow CC direction in FIG. It is a bottom view of the arrow D direction in FIG. It is explanatory drawing which showed the illumination area of the 1st illumination part which concerns on this embodiment, and the illumination area of a 2nd illumination part. It is explanatory drawing which showed the picked-up image of chip | tip LED when illuminated using an upper illumination mechanism in this embodiment. It is explanatory drawing which showed the picked-up image of chip | tip LED when illuminated using a lower illumination mechanism in this embodiment. It is explanatory drawing which showed the picked-up image of chip | tip LED when it illuminates using an upper illumination mechanism and a lower illumination mechanism in this embodiment. It is explanatory drawing for demonstrating the form of chip LED. It is explanatory drawing which showed the captured image obtained by the conventional inspection apparatus.

  Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the inspection apparatus 1 of this example is provided with a transparent plate-like support member 5 on which a chip LED 50 to be inspected is placed, and is disposed above the support member 5. The camera 6 that captures an image of the surface side of the chip LED 50 placed thereon, the upper illumination mechanism 10 that is located above the support member 5 and directly below the camera 6, and the support member 5 are sandwiched therebetween. A determination unit 8 that analyzes the image captured by the lower illumination mechanism 7 disposed below the support member 5 and the camera 6 so as to face the upper illumination mechanism 10 and determines the quality of the captured chip LED 50. And.

  It is assumed that the chip LED 50 that is the inspection object of this example has the form shown in FIG.

  The supporting member 5 is not limited in its material as long as it transmits light without distortion, such as glass, and the form thereof may be a flexible sheet material in addition to a highly rigid plate material. .

  As shown in FIGS. 1 and 2, the upper illumination mechanism 10 includes a first illumination unit 11 and a second illumination unit 20 provided below the first illumination unit 11.

  As shown in FIGS. 2, 4, and 5, the first illumination unit 11 includes a bowl-shaped upper main body 13, and a ring-shaped lower main body 15 that is coaxially connected to the lower surface of the upper main body 13. And a plurality of LED lamps 19 serving as a light source disposed inside the main body 12.

  The inner surface (concave surface) 13a of the upper main body 13 is a reflecting surface, and an imaging opening 14 is formed at the top. An annular groove 16 is formed on the upper surface of the lower main body 15, and the LED lamp 19 is formed on the bottom surface of the groove 16 in the circumferential direction so that the irradiation direction faces upward. Are arranged at equal intervals along the line.

  Thus, according to the first illumination unit 11, the light emitted upward from each LED lamp 19 is reflected by the concave curved surface 13 a of the upper body 13 and passes through the opening 17 of the lower body 15. The entire surface of the chip LED 50 disposed below is illuminated. Note that the illumination by the first illumination unit 11 is indirect illumination having a certain degree of directivity directed downward, and the first illumination unit 11 illuminates a circular area below the first illumination unit 11.

  As shown in FIGS. 2 and 6, the second illumination unit 20 includes an opening on the upper surface and the lower surface, and a ring-shaped main body 21 provided coaxially with the lower surface of the lower main body 15. It comprises a plurality of LED lamps 23 as light sources provided on the main body 21 and an annular diffuse light-transmitting film 24 provided on the lower surface of the main body 21.

  The inner diameter of the lower surface opening of the main body 21 is larger than the inner diameter of the upper surface opening, and the LED lamp 23 is arranged on the annular inner upper surface so that the irradiation direction faces downward. It is arranged at equal intervals along the direction.

  Thus, according to the second illuminating unit 20, light is irradiated from the LED lamps 23 arranged in an annular shape into a circular area in a plan view centered on the position immediately below the LED lamps 23. Primarily, the lower annular area is illuminated as a high illuminance area. The chip LED 50 disposed below the surface is illuminated mainly by light irradiated obliquely downward on the inside, and at least the outer peripheral portion of the convex curved surface portion 54a and The annular area including the chip LED 50 outside is illuminated. The annular region shown in gray in FIG. 8 is the illumination region of the second illumination unit 20, and the outer peripheral portion of the convex curved surface portion 54a is included in the illumination region by adjusting the height position of the upper illumination mechanism 10. It is trying to be.

  The diffuse translucent film 24 disperses and transmits the light emitted from the LED lamp 23, and illuminates the inside of the annular region with almost uniform illuminance without unevenness.

  Also, the inner diameter of the upper surface opening of the main body 21 and the inner diameter of the diffusive transparent film 24 are both larger than the inner diameter of the opening 17 of the lower main body 15. It does not cause any trouble.

  The lower illumination mechanism 7 is a plate-like member disposed below the support member 5 in parallel with the support member 5 and having a white reflecting surface as a surface facing the support member 5. The lower illumination mechanism 7 emits the light emitted from the upper illumination mechanism 10 and directly passes through the support member 5 and the light transmitted through the chip LED 50 and the support member 5 on the support member 5 as the reflection surface. And the back surface of the chip LED 50 is illuminated.

  The camera 6 captures an image of the chip LED 50 below the opening 14 of the upper main body 11 and may be any device that can capture an image, such as an area sensor camera or a line sensor. Camera can be applied. However, when using a line sensor camera, it is necessary to move the chip LED 50 at a predetermined speed.

  The lower illumination mechanism 7 has a size that is at least larger than the chip LED 50.

  The determination unit 8 analyzes an image captured by the camera 6 and binarizes the captured image, for example, and determines whether or not foreign matter exists in the sealing resin 54 part of the chip LED 50.

  According to the inspection apparatus 1 of the present example having the above configuration, the chip LED 50 is inspected as follows.

  First, the chip LED 50 to be inspected is appropriately transported by a transport means and is positioned in the inspection area on the support member 5, that is, in the imaging field area of the camera.

  In the inspection area on the support member 5, the upper illumination mechanism 10 illuminates the front surface side of the chip LED 50, and the lower illumination mechanism 7 illuminates the rear surface side of the chip LED 50, and in this state, the front surface side of the chip LED 50 Are captured by the camera 6.

  As described above, the first illumination unit 11 of the upper illumination mechanism 10 illuminates the entire surface of the chip LED 50, and the second illumination unit covers the outer peripheral portion of the convex curved surface portion 54a of the chip LED 50 and the chip LED 50 outside this. 9 is illuminated, and when the illumination is performed using only the upper illumination mechanism 10 without using the lower illumination mechanism 7, a captured image of the chip LED 50 is as shown in FIG.

  That is, since the electrode part 52 and the light emitting part 53 reflect light relatively well, the light emitted from the first illumination part 11 and transmitted through the sealing resin part 54 and the substrate 51 is the electrode part 52 and the light emitting part 53. The light passes through the substrate 51 and the sealing resin 54 and enters the camera 6 again, so that the portion becomes a bright portion and the portion where the electrode 52 does not exist becomes a dark portion.

  In addition, for the outer peripheral portion (the rising portion from the substrate 51) of the convex curved surface portion 54a, the convex lighting portion 54a is illuminated by the second illumination unit 20 from obliquely upward on the outer side, and thus the convex curved surface portion 54a. A sufficient amount of light that is reflected by or transmitted through the same part is incident on the camera 6, and the outer peripheral part of the convex curved surface part 54a becomes a bright part. .

  On the other hand, the light irradiated from the upper illumination mechanism 10 and passed between the electrode portions 52 and 52 of the chip LED 50 is reflected by the reflection surface of the lower illumination mechanism 7 and again passes through the substrate 51 and the sealing resin 54. To enter the camera 6. Therefore, as shown in FIG. 10, the image between the electrode portions 52 and 52 of the chip LED 50 imaged by the camera 6 is also a bright portion. In FIG. 10, in order to emphasize and explain the operation of the lower illumination mechanism 7, the illumination effect on the surface of the chip LED 50 by the upper illumination mechanism 10 is ignored.

  Thus, the image taken by the camera 6 of the chip LED 50 illuminated by the upper illumination mechanism 10 and the lower illumination mechanism 7 is a bright part over the entire surface of the chip LED 50 on which the images shown in FIGS. 9 and 10 are superimposed. (See FIG. 11).

  Therefore, when there is an opaque substance in the sealing resin 54 part of the chip LED 50, as shown in FIG. 11, the image captured by the camera 6 is an image in which only the foreign substance 57 is a dark part. Become.

  Such an image captured by the camera 6 is transmitted to the determination unit 8, and the transmitted image is analyzed by the determination unit 8 to determine the presence or absence of the foreign matter 57. At that time, since only the foreign object 57 is a dark part of the image captured by the camera 6, the foreign object 57 can be detected easily and accurately.

  Thereafter, the chip LEDs placed on the support member 5 are sequentially replaced with new ones, and the above-described series of inspections are performed, whereby foreign matter inspection is continuously performed on a large number of chip LEDs.

  As mentioned above, although one Embodiment of this invention was described, the specific aspect which this invention can take is not limited to this at all, Other aspects can be taken in the range which does not deviate from the meaning of this invention.

  For example, the lower illumination mechanism 7 is composed of a reflection plate having a white reflection surface, but is not limited thereto, and may be an illumination mechanism using a light source such as an LED lamp. In this case, it is preferable to use a diffused light transmissive film or the like for illumination with diffused light.

  In addition, the form of the chip LED as the inspection object is not limited to the above example, and the inspection device according to the present invention is used to check for the presence or absence of foreign matter for those having a convex curved sealing resin. It is possible to inspect well, and the shape of the convex curved surface portion is not limited at all.

  In addition, if the support member 5 is made of a material exhibiting white, a portion that can transmit light on the front and back surfaces, such as between the electrode portions 52 and 52, is also a bright portion. In this case, the lower illumination mechanism 7 is It is unnecessary. Further, the lower illumination mechanism 7 is not necessary even when there is no translucent portion on the front and back surfaces, such as the electrode portion 52 formed on the entire surface of the substrate 51.

  In the above example, the support member 5 is fixed. However, the support member 5 in a state where the chip LED 50 is placed is moved, and the chip LED 50 is allowed to pass through the inspection region at an appropriate transport speed. You may do it.

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 5 Support member 6 Camera 7 Lower illumination mechanism 8 Judgment part 10 Upper illumination mechanism 11 1st illumination part 12 Main body part 13 Upper main body 15 Lower main body 19 LED lamp 20 2nd illumination part 21 Main body 23 LED lamp 24 Diffuse light transmission Membrane 50 chip LED
51 Substrate 52 Electrode 53 Light Emitting Unit 54 Sealing Resin 56 Foreign Material

Claims (5)

A light-transmitting substrate; a light-impermeable electrode portion formed on the back surface of the substrate; a light-emitting portion disposed in a central portion of the surface of the substrate; and the light-emitting portion covering the substrate surface Of a chip LED that is formed of a translucent sealing resin that seals at least a portion that covers at least the light emitting portion of the sealing resin, or is mixed into the sealing resin or on the surface thereof An inspection device for detecting attached light-transmitting foreign matter,
A plate-like or sheet-like support member for supporting the chip LED;
A camera that is arranged above the support member and that captures an image of the surface side of the chip LED placed on the support member;
An upper illumination mechanism that is also disposed above the support member and illuminates the surface of the chip LED placed on the support member;
A determination unit that analyzes an image captured by the camera and determines the presence or absence of the foreign matter,
The upper illumination mechanism is
A dome-shaped main body having a circular opening at the center of the lower surface and an image pickup opening at the top, and a plurality of light sources disposed in the dome main body, The inner concave curved surface forms a reflecting surface, and the light source is arranged on the inner bottom surface of the dome body so as to emit light toward the concave curved surface at equal intervals in the circumferential direction. A first illumination unit configured to irradiate the light reflected by the curved surface downward from the lower surface opening of the dome body;
A body in which the ring, the lower surface of the ring body, at equal intervals in the circumferential direction, and have a plurality of light sources disposed so as to irradiate light downward, the lower annular region The second illumination unit that illuminates as a high illuminance region ,
The first illumination unit indirectly illuminates the entire surface of the chip LED,
The second illumination unit is disposed below the first illumination unit so that the ring body is dome body coaxial with the first illumination section, the outer peripheral portion of the convex curved portion of at least the tip LED and Illuminate the annular region including the region outside this, from the diagonally upward outside,
Further, the camera is disposed above the first illumination unit, and is configured to capture a surface image of the chip LED through an imaging opening of the dome body. apparatus.   The chip LED inspection apparatus according to claim 1, wherein the second illuminating unit includes an annular diffusion light-transmitting film disposed below the light source. The support member is made of a transparent member,
The chip LED inspection apparatus further includes a lower illumination mechanism that is disposed below the support member and that illuminates the back surface of the chip LED placed on the support member through the support member. The chip LED inspection apparatus according to claim 1, wherein the inspection apparatus is a chip LED inspection apparatus.   The said lower illumination mechanism is arrange | positioned under the said supporting member in parallel with this supporting member, and is comprised from the reflecting plate by which the opposing surface with this supporting member became a reflective surface. Chip LED inspection device.   The chip LED inspection apparatus according to claim 4, wherein a reflection surface of the reflection plate is white.

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