CN113899753B

CN113899753B - Cutting equipment, LED detection system and LED detection method

Info

Publication number: CN113899753B
Application number: CN202111266013.XA
Authority: CN
Inventors: 程继华; 邹红; 潘新昌; 宋文; 宋邦莹; 余婷; 潘柳静; 柏海坡
Original assignee: Shenzhen Sinoer Photoelectric Co ltd
Current assignee: Shenzhen Sinoer Photoelectric Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2025-01-17
Anticipated expiration: 2041-10-28
Also published as: CN113899753A

Abstract

The invention discloses a cutting device, an LED detection system and an LED detection method. The LED detection method comprises the following steps of S extracting an LED to be detected, S repeatedly heating the LED to enable the silver colloid and the packaging part to expand and contract, S cutting the packaging part for the first time along the radial direction of the packaging part by the S conveying track to enable the packaging part to be broken into a head part and a tail part, and separating the head part from the bracket, wherein epoxy resin positioned in a cup opening groove is a part of the head part, S judging the coverage area of the silver colloid on the bottom surface of the cup opening groove, wherein if the coverage area is smaller than 6%, the LED is a defective product, if the coverage area is between 6% and 8%, the LED is a secondary product, and if the coverage area is above 8%, the LED is a qualified product. By adopting the LED detection method, the connection strength of the silver colloid and the bracket can be conveniently detected, and the situation that secondary products or unqualified products are applied to a severe environment, so that the LEDs are required to be frequently maintained or replaced in the follow-up process is avoided.

Description

Cutting equipment, LED detection system and LED detection method

Technical Field

The invention relates to the technical field of LEDs, in particular to cutting equipment, an LED detection system and an LED detection method.

Background

In the related art, referring to fig. 1, the led100 includes a support 110, a silver paste 120 layer, a wafer 130 and a packaging part 140, the support 110 has a cup opening surface 111, a cup opening groove 112 is formed in the cup opening surface 111, a silver paste 120 is formed on a bottom surface 1121 of the cup opening groove 112, and the wafer 130 is fixed on the silver paste 120. The encapsulation part 140 is made of epoxy resin, and the epoxy resin is encapsulated on the bracket 110, i.e., adhered to the inner circumferential surface of the cup opening groove 112, the cup opening surface 111 and the outer side surface of the bracket 110. After the die 130 is fixed, the LED100 is baked in an oven at 170 degrees, and the silver paste 120 is cured, so that the silver paste 120 is firmly bonded to the bottom surface 1121, and the silver paste 120 is firmly bonded to the die 130. However, in this link, the silver paste 120 and the bracket 110 are prone to have poor bonding, such as high voltage and virtual connection, and if such an LED100 is applied in a severe environment, the LED cannot be used for a long time, which results in frequent replacement of the LED by a user.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the LED detection method, which can conveniently detect whether the LED is qualified or not and avoid unqualified LEDs from being put into use.

The invention also provides a cutting device.

The invention further provides an LED detection system with the cutting device.

According to the LED detection method provided by the embodiment of the invention, the LED comprises a bracket, silver colloid, a wafer and a packaging part, wherein the bracket is provided with a cup opening groove, the silver colloid is adhered to the bottom surface of the cup opening groove, the wafer is adhered to the silver colloid, and the packaging part is packaged in the cup opening groove and outside the bracket, and comprises the following steps:

s100, extracting an LED to be detected;

S200, repeatedly heating the LED to expand and contract the silver colloid and the packaging part;

S300, cutting the packaging part for the first time along the radial direction of the packaging part so as to break the packaging part into a head part and a tail part, wherein the head part is separated from the bracket;

s400, judging the covering area of the silver colloid on the bottom surface of the cup opening groove, wherein the LED is an unqualified product if the covering area is smaller than a first preset area, the LED is a secondary product if the covering area is between the first preset area and a second preset area, and the LED is a qualified product if the covering area is above the second preset area.

The LED detection method at least has the advantages that the LED is repeatedly heated by the reflow oven for five times, in the process of repeatedly heating the LED, the silver colloid and the packaging part expand and contract uniformly, the connection between the packaging part and the silver colloid and the cup mouth groove is broken, the packaging part is cut along the cup mouth surface of the support by the cutter, namely, the radial direction of the packaging part, the cutter only needs to cut into about two millimeters, the packaging part is broken into two parts (the packaging part is similar to glass, when broken, the packaging part is broken), the head part and the tail part are respectively, the tail part is still fixed on the support, and the head part is separated from the support, wherein the epoxy resin in the cup mouth groove is a part of the head part, so that the epoxy resin in the cup mouth groove is also separated from the support (the cup mouth groove is seriously broken because of the repeated heating of the LED, and the epoxy resin in the cup mouth groove is separated). When the head is separated from the bracket, the silver colloid can be broken. And detecting the coverage area of the silver colloid on the bottom surface of the cup opening groove, wherein if the coverage area is smaller than a first preset area, the LEDs are unqualified products, so that the LEDs produced in the same batch with the LEDs are required to be scrapped, if the coverage area is between the first preset area and a second preset area, the LEDs are secondary products, the LEDs can be used in a poor environment, such as indoor use, for the LEDs, the LEDs produced in the same batch with the LEDs can be used, the scrapping of the LEDs is reduced, and if the coverage area is above the second preset area, the LEDs are qualified products, the product can be applied to a poor environment, and the LEDs still have long service lives. In summary, by adopting the LED detection method, the connection strength of the silver colloid and the bracket can be conveniently detected, and the problem that secondary products or unqualified products are applied to a severe environment, so that the LEDs are required to be frequently maintained or replaced later is avoided.

According to some embodiments of the invention, in the step S100, a plurality of LEDs are prepared, in the step S200, the LEDs are reserved after each heating and do not enter next heating, in the step S400, the LEDs obtained by continuous m times of heating are detected, if the LEDs are qualified products, detection is stopped, if the LEDs are unqualified products or secondary products, the LEDs obtained by the previous heating are continuously detected until the qualified products or the LEDs obtained by m times of heating are detected, wherein the LEDs obtained by m times of heating are obtained by reciprocal times of heating.

In the step S200, reserving the LEDs from being heated next time after each heating, and in the step S400, the LEDs cut for the first time are the LEDs obtained by heating m times in inverse number;

the LED detection method comprises the following steps of cutting the packaging part for the second time along the radial direction of the packaging part to enable the packaging part to be broken into a head part and a tail part, if epoxy resin in a cup opening groove is synchronously separated from the head part, the packaging part is unqualified for packaging the cup opening groove, if the epoxy resin in the cup opening groove is not synchronously separated from the head part, the packaging part is qualified for packaging the cup opening groove, wherein the LED cut for the second time is the LED obtained by heating for the first n times.

According to some embodiments of the invention, in the step S200, at least one heating temperature is between 250 degrees and 280 degrees.

According to the cutting device of the embodiment of the invention, the LED comprises a bracket, silver colloid, a wafer and a packaging part, wherein a cup opening groove is formed on the cup opening surface of the bracket, the silver colloid is adhered to the bottom surface of the cup opening groove, the wafer is adhered to the silver colloid, and the packaging part is packaged in the cup opening groove and the outside of the bracket, and comprises:

The positioning mechanism is used for positioning the LEDs;

The cutting mechanism comprises a first driving piece and a cutter, wherein the first driving piece is used for driving the cutter to cut the packaging part along the radial direction of the LED, and the distance between the cutter and the cup opening surface is 0-2.5 mm along the vertical direction of the cup opening surface.

The cutting equipment provided by the embodiment of the invention has the advantages that the positioning mechanism is used for positioning the bottom part of the LED and the part of the LED needing cutting is positioned outside the positioning mechanism. After the positioning of the LED is completed, the first driving member drives the cutter to move along the radial direction of the encapsulation portion, that is, along the cup opening surface of the bracket 110, thereby cutting the encapsulation portion of the LED. From the above, through the setting of cutting equipment, make things convenient for the cutting of the encapsulation portion of LED, and then make things convenient for LED's detection.

According to some embodiments of the invention, the cutting device further comprises a vibration disc, the vibration disc comprises a main body and a conveying track, the conveying track is connected with the main body, the main body is used for sequentially conveying the LEDs along the length direction of the conveying track, the positioning mechanism comprises a positioning jig, a limiting piece and a second driving piece, the positioning jig is provided with a positioning channel for positioning the LEDs, one end of the positioning channel is in butt joint with one end of the conveying track, the second driving piece is connected with the limiting piece, and the second driving piece is used for driving the limiting piece to move to the positioning channel so as to enable the LEDs to slide to a preset position along the positioning channel.

According to some embodiments of the invention, the positioning jig comprises a first jig, a second jig and a third driving member, wherein the positioning channel is defined between the first jig and the second jig, and the third driving member is connected with the first jig and is used for driving the first jig to be far away from or close to the second jig.

According to some embodiments of the invention, the height of the top of the first jig is lower than the height of the top of the second jig, and the cutter is located above the first jig.

The LED detection system comprises the cutting equipment and the detection module, wherein the detection module comprises a camera and a display module, and the camera is used for shooting the cut LED picture in real time and uploading the cut LED picture to the display module.

The LED detection system has the advantages that after the LED is cut, the camera shoots the cut LED and transmits corresponding pictures to the display, and a worker can clearly observe the condition of the LED through the display to judge whether the LED is a qualified product.

According to some embodiments of the invention, the detection system further comprises an identification module, and the identification module is used for detecting the silver colloid coverage condition inside the cut LED and calculating the coverage area of the silver colloid.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention is further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of an LED according to an embodiment of the present invention;

FIG. 2 is a flow chart of an LED detection method according to an embodiment of the invention;

FIG. 3 is a schematic view of a part of a cutting apparatus according to an embodiment of the present invention;

FIG. 4 is an enlarged schematic view of the area A of FIG. 3;

FIG. 5 is a schematic top view of a cutting apparatus according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a vibration plate according to an embodiment of the present invention.

Reference numerals:

LED100, bracket 110, cup opening surface 111, cup opening groove 112, bottom surface 1121, silver paste 120, wafer 130, package 140, head 141, tail 142;

the cutting apparatus 200, the positioning mechanism 210, the positioning jig 211, the first jig 2111, the second jig 2112, the third driving member 2113, the positioning channel 2114, the stopper 212, the second driving member 213, the cutting mechanism 220, the first driving member 221, the cutter 222, the vibration plate 230, the main body 231, and the conveying rail 232.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

In the description of the present invention, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Referring to fig. 1, the led100 includes a holder 110, a silver paste 120, a wafer 130, and a packaging part 140, wherein a cup opening groove 112 is formed in a cup opening surface 111 of the holder 110, the silver paste 120 is adhered to a bottom surface of the cup opening groove 112, the wafer 130 is adhered to the silver paste 120, and the packaging part 140 is packaged inside the cup opening groove 112 and outside the holder 110.

The invention discloses a detection method of an LED100, referring to fig. 2 to 4, comprising the following steps of S100 extracting an LED100 to be detected, S200 repeatedly heating the LED100 to expand and contract a silver paste 120 and a packaging part 140, S300 cutting the packaging part 140 for the first time along the radial direction of the packaging part 140 to break the packaging part 140 into a head part 141 and a tail part 142, separating the head part 141 from a bracket 110, wherein epoxy resin positioned in a cup opening groove 112 is a part of the head part 141, S400 judging the coverage area of the silver paste 120 of the bottom surface 1121 of the cup opening groove 112, wherein the LED100 is a non-qualified product if the coverage area is smaller than a first preset area, the LED100 is a secondary product if the coverage area is between the first preset area and a second preset area, and the LED100 is a qualified product if the coverage area is above the second preset area.

Specifically, in the first step, the LED100 is repeatedly heated by a reflow oven, and the silver paste 120 and the encapsulation portion 140 expand with heat and contract with cold approximately five times during the repeated heating process of the LED100, the connection between the encapsulation portion 140 and the silver paste 120 and the cup opening groove 112 is broken, in the second step, the encapsulation portion 140 is cut along the cup opening surface 111 of the support 110 by a cutter, that is, the radial direction of the encapsulation portion 140, the cutter only needs to cut approximately two millimeters, the encapsulation portion 140 is broken into two parts (the encapsulation portion 140 is similar to glass, when broken, the encapsulation portion is easily broken), the head portion 141 and the tail portion 142 are respectively fixed on the support 110, and the head portion 141 is separated from the support 110, wherein the epoxy resin positioned in the cup opening groove 112 is a part of the head portion 141, so that the epoxy resin in the cup opening groove 112 is also separated from the support 110 (in the scheme of the application is that the silver paste 120 and the encapsulation portion 140 are severely broken based on the repeated heating of the LED100, so that the epoxy resin in the cup opening groove 112 is separated). When the head 141 is separated from the bracket 110, the silver paste 120 may be broken. Third, the coverage area of the silver paste 120 on the bottom surface 1121 of the cup opening groove 112 is detected, wherein if the coverage area is smaller than the first preset area, the LED100 is a defective product, so that the LEDs 100 produced in the same batch as the LED100 are all required to be scrapped, if the coverage area is between the first preset area and the second preset area, the LED100 is a secondary product, the usage environment of the LED100 is not too bad, such as indoor usage, the LEDs 100 produced in the same batch as the LED100 can be used, the scrapping of the LED100 is reduced, and if the coverage area is above the second preset area, the LEDs 100 are defective products, the product can be used in a more severe environment, and the LED100 still has a longer service life.

In summary, by adopting the above method for detecting the LED100, the connection strength between the silver paste 120 and the bracket 110 can be conveniently detected, so as to avoid the application of secondary products or unqualified products in a severe environment, which results in the subsequent need of frequent maintenance or replacement of the LED100.

It should be noted that the first preset area is approximately sixty percent of the total area of the bottom surface of the cup opening groove 112, and the second preset area is approximately eighty percent of the total area of the bottom surface of the cup opening groove 112.

In some embodiments, in step S100, a plurality of LEDs 100 to be detected are selected from LEDs 100 produced in the same batch, in the process of step S200, the LEDs 100 are simultaneously placed into a reflow oven for heating, wherein after each heating of the LEDs 100 is completed, a plurality of LEDs 100 are reserved and do not enter the next heating until the last heating of the LEDs 100 is completed, in step S400, the LEDs 100 obtained last time are detected, for example, 25 LEDs 100 are selected, 5 LEDs 100 are reserved after each heating is completed until the five heating of the LEDs 100 is completed, wherein 5 LEDs 100 are reserved after each heating, and in step S400, the LEDs 100 obtained the fifth time are detected.

Further, in the process of step S400, if the LED100 is detected as a defective product or as a secondary product, the worker may detect the LED100 obtained by the adjacent primary heating, that is, the LED100 obtained by the fourth heating, determine the product condition of the LED100 obtained by the fourth heating, and if it is still not qualified, detect the LED100 obtained by the third heating again, and determine the product condition of the LED100 obtained by the third heating. By detecting the LED100 obtained by heating m times after multiple times, it is determined whether the silver paste 120 of the LED100 is directly separated from the support 110 due to overheating, and the breaking of the silver paste 120 is not obvious, so that the detection result of the LED100 is inaccurate.

Further, the LED100 detection method further comprises the steps of cutting the packaging part 140 of the LED100 obtained after heating for n times before cutting the packaging part 140 for the second time along the radial direction of the packaging part 140, so that the packaging part 140 is broken into a head part 141 and a tail part 142, and the head part 141 is separated from the bracket 110, wherein if the epoxy resin in the cup opening groove 112 is separated from the head part 141, the packaging part 140 does not qualify the packaging of the cup opening groove 112, and if the epoxy resin in the cup opening groove 112 is not separated from the head part 141, the packaging part 140 qualifies the packaging of the cup opening groove 112.

It should be noted that, the LED100 obtained by heating the package portion 140 and the cup opening groove 112 one time or several times is cut to determine whether the connection strength between the package portion and the cup opening groove is acceptable, for example, the LED100 is obtained by heating the package portion two times before cutting, and the LED100 obtained by heating the package portion several times after cutting is used to determine whether the connection strength between the silver paste 120 and the cup opening groove 112 is acceptable, for example, the LED100 obtained by heating the package portion two times after cutting.

In some embodiments, in step S200, wherein the at least one heating temperature is between 250 degrees and 280 degrees. After the LED100 and the electric board are welded, the electric board and the LED100 need to be heated by a reflow oven, and the heating temperature is about 260 ℃, so that the soldering flux volatilizes, and the LED100 and the electric board can be firmly fixed together. In the scheme of the application, the LED100 is heated by adopting the temperature between 250 degrees and 280 degrees, and whether the LED100 meets the requirement or not is judged after the LED100 is subjected to the temperature in the range, so that the silver colloid 120 and the bracket 110 still have good connection strength after the LED100 is put into use.

The second aspect of the present invention discloses a cutting apparatus 200, referring to fig. 3 to 5, the cutting apparatus 200 comprises a positioning mechanism 210 and a cutting mechanism 220, the positioning mechanism 210 is used for positioning the LED100, the cutting mechanism 220 comprises a first driving member 221 and a cutter 222, the first driving member 221 is connected with the cutter 222 and is used for driving the cutter 222 to move along the radial direction of the packaging part 140, and the distance between the cutter 222 and the cup rim surface 111 is between 0 mm and 2.5 mm along the vertical direction of the cup rim surface 111.

Specifically, the positioning mechanism 210 positions the bottom portion of the LED100, and positions the portion of the LED100 to be cut out outside the positioning mechanism 210. After the positioning of the LED100 is completed, the first driving member 221 drives the cutter 222 to move along the radial direction of the encapsulation portion 140, that is, along the cup opening surface 111 of the holder 110, thereby cutting the encapsulation portion 140 of the LED 100. From the above, the cutting of the package portion 140 of the LED100 is facilitated by the arrangement of the cutting device 200, so as to facilitate the detection of the LED 100.

It should be noted that, along the vertical direction of the cup opening surface 111, the distance between the cutter 222 and the cup opening surface 111 is between 0mm and 2.5 mm, so that when the package portion 140 breaks, the epoxy resin in the cup opening groove 112 remains connected to the head 141 of the package portion 140, and the detection of the LED100 is performed.

In some embodiments, the cutting apparatus 200 further includes a vibration plate 230 (refer to fig. 6), the vibration plate 230 includes a main body 231 and a conveying rail 232, the conveying rail 232 is connected to the main body 231, and the main body 231 sequentially conveys the LEDs 100 along a length direction of the conveying rail 232. The positioning mechanism 210 includes a positioning jig 211 and a positioning member 212, the positioning jig 211 defines a positioning channel 2114, a port of the positioning channel 2114 is in butt joint with a port of the conveying track 232, the positioning member 212 is slidably connected to the positioning jig 211, the second driving member 213 is connected to the positioning member 212, and the second driving member 213 is used for driving the positioning member 212 to slide to the positioning channel 2114, so that the LED100 slides to a preset position along the positioning channel 2114.

Specifically, the staff places a plurality of LEDs 100 to be detected in the main body 231, the LEDs 100 on the sides to be detected are conveyed along the length direction of the conveying track 232 under the vibration of the main body 231, and the LEDs 100 in the conveying track 232 slide into the positioning channels 2114 of the positioning jig 211 through the discharge ends of the conveying track 232 and are abutted against the positioning pieces 212, at this time, the LEDs 100 are just at the preset positions, and the blade of the cutter 222 just faces the LEDs 100 at the preset positions. Thereafter, the first driving member 221 drives the cutter 222 toward the LED100 at a preset position, thereby cutting the LED100 for subsequent detection of the LED100. After the LED100 is cut, the vibration plate 230 continues to convey the LED100 to the positioning channel 2114, and the cut LED100 continues to move along the positioning channel 2114 under the action of the following LED100 until the end, far from the conveying rail 232, of the LED100 slides away from the positioning jig 211 through the positioning channel 2114. As can be seen from the above, the cutting apparatus 200 adopts the above structure, and a worker can conveniently complete the cutting work of a large number of LEDs 100.

In some embodiments, the positioning jig 211 includes a first jig 2111, a second jig 2112, and a third driving member 2113, where the first jig 2111 and the second jig 2112 are vertically disposed and parallel to each other. The first jig 2111 and the second jig 2112 are disposed at intervals, and the positioning channel 2114 is defined between the right side surface of the first jig 2111 and the left side surface of the second jig 2112. The third driving member 2113 is connected to the first fixture 2111 for driving the first fixture 2111 away from or towards the second fixture 2112. Specifically, when the lamp is conveyed to the preset position along the positioning channel 2114, the third driving member 2113 drives the first fixture 2111 to move towards the second fixture 2112, so that the first fixture 2111 and the second fixture 2112 compress the LED100 at the preset position, and the subsequent cutter 222 can cut the LED100 better.

Further, the side surface of the first fixture 2111, which is close to the second fixture 2112, is provided with an arc groove adapted to the LED100, the side surface of the second fixture 2112, which is close to the first fixture 2111, is provided with an arc groove adapted to the LED100, and when the LED100 moves to a preset position, the LED100 is just located between the two arc grooves. The third driving piece 2113 drives the first fixture 2111 to move close to the second fixture 2112, so that the outer peripheral surface of the LED100 just fits the two arc grooves, the positioning fixture 211 is enabled to clamp the LED100 at the preset position more stably, and the subsequent cutter 222 can cut the LED100 better.

Further, the height of the top of the first fixture 2111 is lower than the height of the top of the second fixture 2112, and the cutter 222 is located above the first fixture 2111, so that a space is reserved above the first fixture 2111 for the operation of the cutter 222, so that the cutter 222 can cut the LED100 along the cup opening surface 111 of the bracket 110. The position where the second fixture 2112 is set is high enough, so when the cutter 222 cuts the LED100, the side surface of the second fixture 2112 can better support the LED100, so that the cutter 222 can better cut the LED100.

According to a third aspect of the present invention, an LED100 detection system is disclosed, which comprises a detection module and the above-mentioned cutting device 200, wherein the detection module comprises a camera and a display module, and the camera is used for capturing a picture of the cut LED100 in real time and uploading the picture to the display module.

Specifically, after the cutting of the LED100 is completed, the camera shoots the cut LED100 and transmits a corresponding picture to the display, so that a worker can clearly observe the condition of the LED100 through the display to determine whether the LED100 is a qualified product.

Further, the detection system further includes an identification module, and the identification module is configured to detect the coverage of the silver colloid 120 inside the cut LED100, and calculate the coverage area of the silver colloid 120. Through the setting of identification module, detecting system can judge automatically whether LED100 is qualified product, has saved staff's labour.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention. Furthermore, embodiments of the invention and features of the embodiments may be combined with each other without conflict.

Claims

The LED comprises a bracket, silver colloid, a wafer and a packaging part, wherein the bracket is provided with a cup opening groove, the silver colloid is adhered to the bottom surface of the cup opening groove, the wafer is adhered to the silver colloid, and the packaging part is packaged in the cup opening groove and the outside of the bracket, and is characterized by comprising the following steps:

s100, extracting an LED to be detected;

S200, repeatedly heating the LED to expand and contract the silver colloid and the packaging part;

S300, cutting the packaging part for the first time along the radial direction of the packaging part so as to break the packaging part into a head part and a tail part, wherein the head part is separated from the bracket;

S400, judging the silver colloid coverage area of the bottom surface of the cup opening groove, wherein the LED is an unqualified product if the coverage area is smaller than a first preset area, the LED is a secondary product if the coverage area is between the first preset area and a second preset area, and the LED is a qualified product if the coverage area is above the second preset area;

In the step S100, preparing a plurality of LEDs, reserving a plurality of LEDs after each heating in the step S200, and not heating the LEDs for the next time, in the step S400, detecting the LEDs obtained by the last heating, if the LEDs are qualified products, stopping detection, and if the LEDs are unqualified products or secondary products, continuing to detect the LEDs obtained by the last heating until the qualified products are detected or the LEDs obtained by the heating are detected;

The heating temperature is between 250 degrees and 280 degrees.
2. The method for detecting LEDs according to claim 1, wherein,

The LED detection method comprises the following steps of cutting the packaging part for the second time along the radial direction of the packaging part to enable the packaging part to be broken into a head part and a tail part, if epoxy resin in a cup opening groove is synchronously separated from the head part, the packaging part is unqualified for packaging the cup opening groove, if the epoxy resin in the cup opening groove is not synchronously separated from the head part, the packaging part is qualified for packaging the cup opening groove, wherein the LED cut for the second time is the LED obtained by heating for the first time.
3. The cutting device is used for implementing the LED detection method according to claim 1 or 2, the LED comprises a support, silver colloid, a wafer and a packaging part, a cup opening groove is formed on a cup opening surface of the support, the silver colloid is adhered to the bottom surface of the cup opening groove, the wafer is adhered to the silver colloid, and the packaging part is packaged in the cup opening groove and outside the support, and the cutting device is characterized by comprising:

The positioning mechanism is used for positioning the LEDs;

The cutting mechanism comprises a first driving piece and a cutter, wherein the first driving piece is used for driving the cutter to cut the packaging part along the radial direction of the LED, and the distance between the cutter and the cup opening surface is 0-2.5 mm along the vertical direction of the cup opening surface;

the cutting equipment further comprises a vibration disc, wherein the vibration disc comprises a main body and a conveying track, the conveying track is connected with the main body, and the main body is used for sequentially conveying the LEDs along the length direction of the conveying track;

The positioning mechanism comprises a positioning jig, a limiting piece and a second driving piece, wherein the positioning jig is provided with a positioning channel for positioning the LED, one end of the positioning channel is in butt joint with one end of the conveying track, the second driving piece is connected with the limiting piece, and the second driving piece is used for driving the limiting piece to move to the positioning channel so as to enable the LED to slide to a preset position along the positioning channel;

The positioning jig comprises a first jig, a second jig and a third driving piece, wherein the positioning channel is defined between the first jig and the second jig, and the third driving piece is connected with the first jig and used for driving the first jig to be far away from or close to the second jig;

The side that first tool is close to the second tool have with the arc groove of LED looks adaptation, the second tool is close to the side of first tool have with the arc groove of LED looks adaptation, when LED moves to preset the position, the LED just is located between two arc grooves.
4. A cutting apparatus according to claim 3, wherein the height of the top of the first jig is lower than the height of the top of the second jig, and the cutter is located above the first jig.
An led detection system, comprising:

the cutting apparatus of any one of claims 3 or 4;

The detection module comprises a camera and a display module, wherein the camera is used for shooting the picture of the LED after cutting in real time and uploading the picture to the display module.
6. The detection system of claim 5, further comprising an identification module for detecting a silver paste coverage of the inside of the cut LED and calculating a coverage area of the silver paste.