JP5565806B2 - Lead frame, lead frame group, and manufacturing method thereof - Google Patents

Description

  The present invention relates to a lead frame, a lead frame group, and a manufacturing method thereof, and more particularly, to a strip-shaped lead frame and a lead frame group in which a plurality of wiring patterns are formed in a longitudinal direction, and a manufacturing method thereof.

  Conventionally, lead frames are used for assembling semiconductor devices and the like. The lead frame is a strip-like wiring pattern consisting of an inner lead part for electrical connection to the semiconductor chip and an outer lead part that functions as an external terminal of the semiconductor device, centering on the die pad part on which the semiconductor chip is mounted. A plurality of metal substrates are formed and configured.

  Such lead frames are usually used by being transported in a state in which about 50 to 100 sheets are stacked or used for assembling equipment for semiconductor devices. For this reason, the lead frames may rub against each other due to vibration in the laminated state, and defects such as deformation and scratches may occur. In order to prevent such problems, conventionally, a flat sheet of paper called interpolating paper, with holes drilled at approximately the same position as the wiring pattern part made of paper or resin, is used between the lead frames when stacking the lead frames. A lead frame was used between them.

  However, when using the interleaving paper, there is a problem that an interleaving paper that matches the shape of the product is required, which increases costs. In addition, when assembling a semiconductor device using a lead frame, it is necessary to add a process for removing the interleaving paper, which causes a problem of reducing the productivity of semiconductor device manufacturing. Furthermore, in a small lead frame for a semiconductor device, since the interval between the wiring patterns is narrow, it is difficult to process a hole at the same position as the wiring pattern on the insertion sheet because the interval between the hole processing becomes narrow. was there.

  Therefore, as a method that does not use interleaving paper, bending is performed on the frame portion of the lead frame to form a protrusion, and a gap is formed when the lead frames are stacked to prevent interference between the lead frames. A method has been proposed (see, for example, Patent Documents 1 and 2).

  Patent Document 1 discloses a lead frame in which a punch is abutted against a lead frame outer frame portion to be recessed, and a hemispherical protrusion is formed on the opposite side. When the lead frames are stacked, an interval corresponding to the height of the protrusion is provided.

  Further, in the lead frame and the manufacturing method thereof described in Patent Document 2, a die and a punch are used for the lead frame, and the clearance between the punch and the die is made larger than in the case of normal punching. The spacer is formed by performing half-punching to a punching depth of about / 4 to 1/6.

  Thus, by forming protrusions on the lead frame, the interval between the lead frames is ensured when the lead frames are stacked, and the use of interleaving paper is unnecessary.

JP-A-53-66170 JP-A-6-177309 JP 2005-50948 A

  However, since the lead frame described in Patent Document 1 has a hemispherical protrusion shape and a recessed back surface, the protrusions on the upper and lower lead frames overlap the recessed portions on the back surface. In such a configuration, when a lateral shift occurs and a stress is generated, there is a problem that the protrusion and the concave portion are caught, and problems such as deformation and scratches occur.

  On the other hand, the spacer formed by the manufacturing method described in Patent Document 2 has a large width and a small concave portion on the upper surface side, and the spacer does not overlap with the concave portion on the upper surface side. There is no problem.

  However, in recent years, the die pad part (including the suspension lead part) and the lead part have been bent to reduce the thickness of the semiconductor device and prevent the lead part from coming off from the sealing resin. The number of lead frames having a height several times the thickness is increasing (see, for example, Patent Document 3).

  On the other hand, in the lead frame described in Patent Document 2, the height of the spacer is limited to ¼ to ６ of the metal thin plate used in the lead frame. Therefore, as described in Patent Document 3, the inner lead (signal lead) has a bending angle of 90 °, and is used for a lead frame whose bending height greatly exceeds 1/4 of the lead frame thickness. There was a problem that I could not do it.

  Therefore, the present invention does not require an intervening sheet even when stacking lead frames whose bending height in the wiring pattern greatly exceeds 1/4 of the thickness of the lead frame plate, and overlapping lead frames. It is an object of the present invention to provide a lead frame that does not cause deformation and scratches due to contact with each other and a method for manufacturing the lead frame.

In order to achieve the above object, the lead frame according to the first aspect of the present invention has a plurality of wiring patterns formed in the longitudinal direction, and a feed hole used during processing is formed along the longitudinal direction in a frame-like portion that supports the wiring pattern. A plurality of strip-shaped lead frames,
The feed holes are formed in a plurality of rows in the longitudinal direction , and a plurality of rows formed in the longitudinal direction for each predetermined number that cannot divide the total number in each row of the feed holes in the longitudinal direction. A plurality of protrusions are formed on the frame-like portion so as to be arranged between the feed holes in each of the rows .

  As a result, a plurality of types of lead frames having different protrusion arrangement patterns can be prepared, and even when stacked, the protrusions can be prevented from being entangled, and a gap can be reliably provided between the upper and lower lead frames. At the same time, it is possible to reduce defects that cause deformation and scratches due to entanglement and rubbing.

2nd invention is the lead frame which concerns on 1st invention,
The feed hole and the protrusion are formed in frame-like portions at both ends in the width direction.

  As a result, feed holes and protrusions can be provided at locations away from the wiring pattern, and the wiring pattern can be prevented from being affected by processing or loading.

3rd invention is the lead frame which concerns on 1st or 2nd invention,
The feed holes are formed at a predetermined pitch with respect to the wiring pattern in the longitudinal direction.

  As a result, not only when the feed hole pitch is formed corresponding to the wiring pattern on a one-to-one basis, but also when the feed hole pitch is formed corresponding to a plurality of wiring patterns. A protrusion can be formed on the surface.

A fourth invention is a lead frame according to any one of the first to third inventions,
A plurality of the wiring patterns are also formed in the width direction.

  As a result, even when the lead frame has a plurality of wiring patterns formed in the longitudinal direction and the width direction, it is possible to prevent problems during stacking.

A fifth invention is the lead frame according to any one of the first to fourth inventions,
When the wiring pattern is bent, the height of the protrusion is higher than the height of the bent portion.

  Accordingly, even when a wiring pattern having a height much higher than the plate thickness of the lead frame is formed, the interval between the upper and lower lead frames can be reliably maintained when stacked.

A sixth invention is the lead frame according to the fifth invention,
The protrusion has a bent shape formed by bending.

  Thereby, a protrusion higher than the bending process performed on the wiring pattern can be easily formed.

A lead frame group according to a seventh invention has a plurality of lead frames according to any one of the first to sixth inventions, wherein the formation positions of the protrusions are different,
The lead frames are stacked and arranged so that the protrusions do not overlap between the upper and lower lead frames in contact with each other.

  As a result, even if vibrations occur when lead frames are stacked and shipped as a lead frame group, the upper and lower protrusions do not get entangled or rubbed and can be shipped without damaging the wiring pattern. It becomes.

A method for manufacturing a lead frame according to an eighth invention is a method for manufacturing a strip-shaped lead frame in which a predetermined number of wiring patterns are formed in the longitudinal direction,
A step of moving a hoop material in which a plurality of rows of predetermined feed holes are formed in the longitudinal direction according to a predetermined processing pitch determined by the feed holes, and sequentially forming a wiring pattern with a progressive die;
The included in the strip including a predetermined number of wiring patterns, a predetermined number of pitches that can not divide the total number of the feed holes in each column of the plurality of rows which are formed in the longitudinal direction, forming a protrusion on the hoop And a process of
Cutting the hoop material on which the predetermined number of wiring patterns and protrusions are formed to obtain the strip-shaped lead frame.

  Thereby, it is possible to form the protrusions at different positions with the continuous strips using a normal progressive die, and it is possible to easily manufacture the strips where the protrusions do not overlap when stacked.

A ninth aspect of the invention is the lead frame manufacturing method according to the eighth aspect of the invention,
The protrusion is formed by bending.

  As a result, the wiring pattern is bent, and even in the case of a wiring pattern having a shape higher than the plate thickness, protrusions higher than that can be formed. An interval can be formed between them.

A method for manufacturing a lead frame group according to a tenth aspect of the invention includes a step of sequentially manufacturing a plurality of lead frames using the lead frame manufacturing method according to the eighth or ninth aspect of the invention,
And a step of stacking and arranging the plurality of lead frames in the order of manufacture.

  Thereby, the positions of the protrusions can be made different between the upper and lower lead frames, and even when vibration or the like occurs, transportation such as shipment can be performed without causing entanglement between the protrusions.

  According to the present invention, it is possible to reduce the occurrence of entanglement and rubbing between the upper and lower lead frames when the lead frames are stacked.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan configuration diagram illustrating an example of a lead frame in a state in which a lead frame and a lead frame group according to Embodiment 1 of the present invention and protrusions used in the manufacturing method thereof are not formed. 3 is a plan configuration diagram illustrating an example of a lead frame according to Embodiment 1. FIG. FIG. 4 is a side view showing a state in which the lead frames according to the first embodiment are stacked to form a lead frame group. FIG. 6 is a process flow diagram illustrating an example of a method for manufacturing a lead frame and a lead frame group according to Example 1; It is the plane block diagram which showed an example of the lead frame which concerns on Example 2 of this invention. It is the plane block diagram which showed an example of the lead frame which concerns on Example 3 of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a plan configuration diagram showing an example of a lead frame and a lead frame group according to Embodiment 1 of the present invention, and a lead frame in a state in which no protrusions used in the manufacturing method thereof are formed. In FIG. 1, the lead frame 50 includes a wiring pattern 60, a frame-like portion 70, and a guide hole 80. As shown in FIG. 1, the lead frame 50 is formed in a strip shape and has a plurality of wiring patterns 60 in the longitudinal direction. A predetermined number of wiring patterns 60 are formed in the central region in the width direction of the lead frame 50 along the longitudinal direction. In FIG. 1, ten wiring patterns 60 are formed on one lead frame 50. The wiring pattern 60 is a product pattern to be a single product, and includes a die pad 61 on which the semiconductor device is mounted, an inner lead portion 62 to which the semiconductor device is wire-bonded, and wiring from the inner lead portion 62 to the outside. And an out lead portion 63 to be drawn out.

  Except for the region where the wiring pattern 60 of the lead frame 50 is formed, a frame-like portion 70 that supports the wiring pattern 60 is formed. In the frame-like portions 70 at both ends in the width direction of the lead frame 50, guide holes 80 for inserting pins are formed at regular intervals along the longitudinal direction for conveyance and positioning. In FIG. 1, the guide holes 80 correspond to the wiring pattern 60 on a one-to-one basis, and are formed in the frame-like portions 70 on both outer sides of the wiring pattern 60. The guide hole 80 is a feed hole used for movement and positioning of the lead frame 50 and is formed along the longitudinal direction, which is the moving direction of the strip-shaped lead frame 50 during processing.

  In FIG. 1, the number of wiring patterns 60 formed on the lead frame 50 is not limited and may be determined according to the application. In recent years, lead frames in which a plurality of wiring patterns are formed in the width direction have been widely used due to the effect of miniaturization, and may be configured as the lead frame 50 having such a configuration.

  FIG. 2 is a plan view showing an example of the lead frame according to the first embodiment of the present invention. In FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 2, two lead frames 51 and 52 according to the first embodiment are shown. Both of the lead frames 51 and 52 according to the present embodiment include a wiring pattern 60, a frame-shaped portion 70, a guide ring (feed hole) 80, and a protrusion 90. Each of the lead frames 51 and 52 has ten wiring patterns 60 and ten guide holes 80 in the frame-like portions 70 on both sides thereof, similarly to the lead frame 50 shown in FIG. That is, the lead frames 51 and 52 according to the present embodiment are formed with the protrusion 90 on the lead frame 50 in which the protrusion 90 shown in FIG. 1 is not formed. A cutting line 100 is provided between the lead frame 51 and the lead frame 52. The cutting line 100 is a line for cutting the lead frame 51 and the lead frame 52 at the final stage of processing, and is not actually provided before the cutting, but is a virtual line indicating a cutting position at the time of cutting processing. It is.

  The protrusions 90 are formed at a regular pitch, and are formed on the frame-shaped portion 70 so as to be disposed between the guide holes 80 in the longitudinal direction for every predetermined number of the guide holes 80. In FIG. 2, the protrusions 90 are formed for every three guide holes 80, that is, every three pitches. Here, in the strip-like lead frames 51 and 52 in which the ten wiring patterns 60 are formed in the longitudinal direction, ten guide holes 80 on one side in the longitudinal direction are respectively formed in the longitudinal direction. Yes. The three guide holes 80 sandwiched between the protrusions 90 with respect to the ten guide holes 80 are 10/3 = 3.33. Therefore, when the protrusions 90 are formed continuously with the lead frames 51 and 52 at three pitches, the three guide holes 80 exist outside the leftmost protrusion 90 of the lead frame 51. There is only one guide hole 80 on the outer side of the right protrusion 90, and the arrangement pattern of the left and right asymmetric protrusions 90 is obtained. Next, when the protrusions 90 are formed on the lead frame 52 at intervals of three, continuously from the lead frame 51, two guide holes are formed outside the leftmost protrusion 90 in the lead frame 52. 80, and the arrangement pattern of the symmetrical projections 90 in which two guide holes 80 exist outside the rightmost projection 90 is obtained.

  As described above, the protrusions 90 are formed at an indivisible number of pitch intervals with respect to the total number of the guide holes 80 of the strip-shaped lead frames 51 and 52, and thus the continuous lead frames 51 and 52 are different. Lead frames 51 and 52 having an arrangement pattern of protrusions 90 can be formed. This is because by setting the protrusions 90 for each predetermined number at a pitch that does not divide the total number of the guide holes 80, a fraction is generated in each of the guide holes 51, 52, and an arrangement pattern that always causes a sequential shift is obtained. Although not shown, the lead frame 52 is next (on the right side) to one guide hole 80 outside the leftmost protrusion 90 and three (or zero) guide holes 80 outside the rightmost protrusion 90. And an arrangement pattern different from both of the lead frames 51 and 52. Next, the arrangement pattern is such that zero (or three) guide holes 80 exist outside the leftmost protrusion 90 and one guide hole 80 exists outside the rightmost protrusion 90. These arrangement patterns circulate in a cycle in which the total number of guide holes 80 is divisible, and in the case of FIG. 2, since 30/3 = 10, the three lead frames 51 and 52 circulate in one cycle. At least in the adjacent lead frames 51 and 52, different arrangement patterns of the protrusions 90 are formed. Thus, if the strip-like lead frames 51 and 52 cut along the cutting line 100 are sequentially stacked, the protrusions 90 are necessarily formed at different positions between the upper and lower lead frames 51 and 52. Therefore, the protrusions 90 can be prevented from overlapping.

  FIG. 3 is a longitudinal side view showing a state in which the lead frames 51 and 52 according to the first embodiment of the present invention are stacked to form a lead frame group. In FIG. 3, the lead frame 51 is stacked or stacked on the lead frame 52.

  In FIG. 3, the protrusion 91 of the lead frame 51 and the protrusion 92 of the lead frame 52 are formed at different positions in the longitudinal direction. On the protrusion 92 of the lead frame 52, the frame-like portion 70 of the lead frame 51 is placed. The wiring pattern 60 of the lead frames 51 and 52 is bent and has a bent portion 64. The height of the bent portion 64 greatly exceeds 1/4 of the thickness of the lead frames 51 and 52 and reaches about twice the plate thickness of the lead frames 51 and 52, but the protrusion 92 is also bent. The bent shape is higher than that of the bent portion 64. Therefore, a gap 110 is appropriately secured between the lead frame 51 and the lead frame 52. The gap 110 is the difference between the height of the protrusion 92 and the height of the bent portion 64.

  Since the protrusion 91 of the lead frame 51 is formed at a position different from the protrusion 92 of the lead frame 52, the protrusion 92 is not entangled with the protrusion 92, and even if vibration or the like occurs, stress is applied and the wiring pattern 60 is damaged. The fear can be reduced. In FIG. 3, only the two-stage stacked state of the lead frames 51 and 52 is shown, but even when another lead frame is placed on the lead frame 51, the lead frames 51 and 52 are in contact with the protrusion 91. By selecting a lead frame having a protrusion arrangement pattern in which no protrusion is formed on the portion to be formed and the frame-like portion 70 is formed, there is no entanglement with the protrusion 91, and a lead frame group having an appropriate interval 110 is configured. can do.

  Next, a method for manufacturing the lead frame and the lead frame group according to the first embodiment will be described with reference to FIGS. FIG. 4 is a process flow diagram showing an example of a manufacturing method of the lead frame and the lead frame group according to the first embodiment of the present invention. In addition, about the component similar to the component demonstrated so far, the same referential mark as the past is attached | subjected and the description shall be abbreviate | omitted.

  In FIG. 4, in step 100, wiring patterns 60 are sequentially formed on the hoop material. First, a hoop-shaped thin metal plate is prepared as a raw material for the lead frames 51 and 52. The thickness of the metal plate used for the lead frames 51 and 52 is generally 0.08 mm to 0.4 mm, but in recent years, it is used to meet the demand for smaller and lighter electronic components. Thin metal plates are often used as lead frame materials.

  About the manufacturing method of the lead frames 51 and 52, it divides roughly and forms the lead frames 51 and 52 by melt | dissolving a metal plate partially with a chemical | medical agent, and pressing and stamping a metal plate with a metal mold | die. Can be divided into two types of so-called pressing methods for forming the lead frames 51 and 52. The lead frames 51 and 52 and the lead frame groups 51 and 52 according to the present embodiment can be manufactured by any manufacturing method. Here, a method of manufacturing by a pressing method will be described as an example.

  The manufacturing method of the lead frames 51 and 52 by the pressing method is performed by a processing method of the lead frames 51 and 52 using a known progressive die. First, as shown in step 100, the wiring pattern 60 is sequentially formed by a mold while feeding a hoop-like thin metal plate at a predetermined pitch.

  In step 110, the protrusion 90 is formed on the hoop material. The protrusion 90 is formed by pressing a portion other than the wiring pattern of the metal plate with a mold when forming the wiring pattern. The protrusions 90 are formed at a pitch that is not divisible by the wiring pattern 60 formed in the longitudinal direction of the lead frames 51 and 52.

  For example, as shown in FIG. 2, when the number of wiring patterns in the longitudinal direction is 10, the protrusion 90 is formed at every three wiring pattern pitches so that the lead frame 51 and the lead frame 52 are at different positions. A protrusion 90 is formed.

  The number of protrusions 90 formed in one lead frame 51, 52 may be two or more at both ends in the minimum lead frame width direction, but the lead frames 51, 52 are bent and entangled according to the thickness of the lead frames 51, 52. It is necessary to form at a pitch that does not occur.

  If the height of the protrusion 90 is such that the lead frames are not entangled, it is desirable that the height of the protrusion 90 be as low as possible because the bulk of the stacked lead frame groups 51 and 52 becomes low.

  The protrusion 90 may have any shape as long as it is set higher than the bending height of the inner lead 62 and the die pad 61 (including the suspension lead). As shown in FIG. 3, even when protrusions 90 are formed outside the wiring pattern 60 and stacked, the bent portions 64 do not overlap and a gap 110 is formed between the upper and lower lead frames 51 and 52, so there is no interleaving paper. Both can prevent the upper and lower lead frames 51 and 52 from being entangled.

  In step 120, the hoop material is cut into strips. The hoop material is cut along the cutting line 100 so that the strip-shaped lead frames 51 and 52 include a predetermined number of wiring patterns 60. Thereby, the strip-shaped lead frames 51 and 52 can be acquired for each product at the time of shipment. The hoop material is cut by, for example, punching a blade for cutting at the final stage in a progressive die.

  In step 130, the lead frames 51 and 52 on which the wiring pattern 60 and the protrusions 90 are sequentially formed are cut to obtain a plurality of strip-like lead frames 51 and 52.

  In step 140, a plurality of lead frames 51 and 52 are stacked and arranged in the cutting order to constitute a lead frame group. The order of stacking may be from the bottom or using a jig that stacks from top to bottom. The protrusions 90 of the upper and lower lead frames 51 and 52 are naturally formed at different positions by stacking in the cutting order regardless of whether the protrusions 90 are overlapped as shown in FIG. Arrangement.

  Note that stacking according to the cutting order is not necessarily required. The upper and lower lead frames 51 and 52 that are in contact with each other have different protrusion 90 arrangement patterns, and the upper and lower lead frames 51 and 52 that are directly stacked protrude from each other. If 90 does not overlap, it does not necessarily have to be loaded according to the cutting order. However, as described with reference to FIG. 2, the adjacent lead frames 51 and 52 necessarily have different protrusion 90 arrangement patterns, so that it is easier to stack the lead frames 51 and 52 in the cutting order. It is.

  By the end of step 140, the processing flow shown in FIG. Note that step 130 and step 140 may be performed in parallel. That is, if the manufactured lead frames 51 and 52 are sequentially stacked at different locations and the lead frames 51 and 52 are continuously manufactured in parallel, the strip-shaped lead frames 51 and 52 can be manufactured and shipped. The loading operation can be performed simultaneously.

  Thus, according to the manufacturing method of the lead frames 51 and 52 and the lead frame groups 51 and 52 according to the first embodiment, the lead frame 51 according to the present embodiment can be manufactured by a simple manufacturing process using a normal progressive die. , 52 and lead frame groups 51, 52.

  If only one strip-shaped lead frame 51, 52 is manufactured, the processing flow may be terminated at step 120.

  FIG. 5 is a plan view showing an example of the lead frame according to the second embodiment of the present invention. In FIG. 5, the lead frame 53 according to the second embodiment includes a wiring pattern 65, a frame-shaped portion 71, a guide hole 81, and a protrusion 93. The wiring pattern 65 is formed in the center portion of the lead frame 53 in the width direction, and the guide holes 81 and the protrusions 93 are formed along the longitudinal direction in the frame-like portions 71 at both ends in the width direction. This is the same as the lead frames 51 and 52 according to FIG.

  However, the lead frame 53 according to the second embodiment differs from the lead frames 51 and 52 according to the first embodiment in that a plurality of wiring patterns 65 are formed not only in the longitudinal direction but also in the width direction. Thus, the strip-shaped lead frame 53 may have a plurality of wiring patterns 65 formed not only in the longitudinal direction but also in the width direction.

  The lead frame 53 according to the second embodiment has 24 wiring patterns 65 in the longitudinal direction. On the other hand, only 12 guide holes 81 are included in the longitudinal direction. That is, one guide hole 81 is formed for two wiring patterns, and is configured with an arrangement pitch of every other. In such a case, at the time of processing, two rows of wiring patterns 65 are processed simultaneously by processing at one pitch. One guide hole 81 is provided for such a plurality of wiring patterns 65. Many of the formed processing pitches are employed in actual processes.

  Even in such a case, the present invention can be applied as in the first embodiment. In FIG. 5, the protrusion 93 is arranged between the guide holes 81 for every five guide holes 81. Since twelve guide holes 81 are included in the lead frame 53, in the case of five pitches, 12/5 = 2.4, which is not divisible by an integer. Therefore, as shown in FIG. 5, the guide hole 81 is divisible by 5 from the outside of the rightmost protrusion 93, but the guide hole 81 outside the leftmost protrusion 93 is a fraction of two. ing. In this case, the next lead frame 53 has zero guide holes 81 outside the leftmost protrusion 93 and two guide holes 81 outside the rightmost protrusion 93, and the lead frame 53 shown in FIG. This is a different arrangement pattern of the protrusions 93. Therefore, also in the lead frame 53 according to the second embodiment, the positions of the protrusions 93 are different between the upper and lower lead frames 53, and an appropriate interval 110 can be formed without fear of entanglement.

  Thus, even if the guide holes 81 and the wiring patterns 65 do not correspond one-to-one, the number of guide holes 81 is used as a reference, and the number of guide holes 81 cannot be divided at a predetermined number of pitches. By forming the protrusions 93, it is possible to configure the lead frame 53 having different arrangement patterns of the protrusions 93.

  The points that the protrusion 93 may be formed by bending, the point that the lead frame group 53 can be configured, the manufacturing method of the lead frame 53 and the lead frame group 53, and the like are the same as those of the lead frames 51 and 52 according to the first embodiment. The same applies to the contents described in the first embodiment as they are.

  FIG. 6 is a plan view showing an example of a lead frame according to Embodiment 3 of the present invention. In FIG. 6, the lead frame 54 according to the third embodiment includes a wiring pattern 66, a frame-shaped portion 72, a guide hole 82, and a protrusion 94.

  In the lead frame 54 according to the third embodiment, two wiring patterns 66 are formed in the width direction and eight in the longitudinal direction. Further, eight guide holes 82 correspond to the wiring pattern 66 on a one-to-one basis, and eight guide holes 82 are formed in the frame-like portions 72 at both ends in the width direction along the longitudinal direction.

  The protrusions 94 are formed at a pitch of three for every three guide holes 82. Since the total number of guide holes 82 in the longitudinal direction is 8, 8/3 = 2.666..., And projections 94 are provided at an indivisible number of pitches. In FIG. 6, one guide hole 82 exists outside the leftmost protrusion 94 and one guide hole 82 exists outside the rightmost protrusion 94. However, both ends are fractions that cannot be divided by 3. In the next lead frame 54, two guide holes 82 exist outside the leftmost protrusion 94, and three (or zero) guide holes 82 exist outside the rightmost protrusion 94. The protrusion 94 has an arrangement pattern different from the lead frame 54 shown in FIG.

  Therefore, even when the lead frames 54 are stacked up and down, the protrusions 94 do not overlap with each other between the upper and lower lead frames 54 that are directly stacked, and a predetermined interval 110 can be secured. In addition, details such as the point that the protrusion 94 may be formed by bending, the point that the lead frame group 54 may be stacked and the manufacturing method, and the like can be performed in the same manner as in Example 1. The contents can also be applied to the lead frame 54 according to the third embodiment.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

  For example, in the first to third embodiments, the example in which the protrusions 91 to 94 are formed on the frame-like portions 70 to 72 on both sides of the lead frames 51 to 54 has been described. However, the guide holes 80 to 82 are formed in the longitudinal direction. If it is arranged between the guide holes 80 to 82 every predetermined number, the protrusions 91 to 94 can be formed at various positions of the frame-like portions 70 to 72 in the width direction. For example, as in the lead frame 54 shown in the third embodiment, when the frame-shaped portion 72 has a large central portion in the width direction, the protrusions 91 to 94 may be formed in the central portion. Moreover, even if it is a frame-shaped part of both sides, it is not necessary to be arrange | positioned on the same line as the guide holes 80-82, and it is good to form the protrusions 90-94 on the line parallel to the guide holes 80-82. Also good.

  As described above, as long as the protrusions 90 to 94 are formed for each predetermined number in the longitudinal direction, the protrusions 90 to 94 can be variously determined depending on the use regardless of the place in the width direction.

  The present invention can be used for a lead frame on which a semiconductor device is mounted.

50, 51, 52, 53, 54 Lead frame 60, 65, 66 Wiring pattern 61 Die pad 62 Inner lead part 63 Outer lead part 64 Bending part 70, 71, 72 Frame-like part 80, 81, 82 Guide hole 90, 91 , 92, 93, 94 Protrusion 100 Cutting line 110 Distance

Claims (10)

A plurality of wiring patterns are formed in the longitudinal direction, and a frame-shaped portion that supports the wiring patterns is a strip-shaped lead frame in which a plurality of feed holes used during processing are formed along the longitudinal direction,
The feed holes are formed in a plurality of rows in the longitudinal direction , and a plurality of rows formed in the longitudinal direction for each predetermined number that cannot divide the total number in each row of the feed holes in the longitudinal direction. A lead frame, wherein a plurality of protrusions are formed on the frame-like portion so as to be disposed between the feed holes in each of the rows .   The lead frame according to claim 1, wherein the feed hole and the protrusion are formed in frame-like portions at both ends in the width direction.   The lead frame according to claim 1, wherein the feed holes are formed at a predetermined pitch with respect to the wiring pattern in the longitudinal direction.   The lead frame according to any one of claims 1 to 3, wherein a plurality of the wiring patterns are formed in the width direction.   5. The method according to claim 1, wherein when the wiring pattern is bent, a height of the protrusion is higher than a height of the bent portion. 6. The described lead frame.   The lead frame according to claim 5, wherein the protrusion has a bent shape formed by bending. A plurality of lead frames according to any one of claims 1 to 6, wherein the protrusions are formed at different positions,
A lead frame group, wherein the lead frames are stacked and arranged so that the upper and lower lead frames that contact each other do not overlap each other. A method of manufacturing a strip-shaped lead frame in which a predetermined number of wiring patterns are formed in a longitudinal direction,
A step of moving a hoop material in which a plurality of rows of predetermined feed holes are formed in the longitudinal direction according to a predetermined processing pitch determined by the feed holes, and sequentially forming a wiring pattern with a progressive die;
The included in the strip including a predetermined number of wiring patterns, a predetermined number of pitches that can not divide the total number of the feed holes in each column of the plurality of rows which are formed in the longitudinal direction, forming a protrusion on the hoop And a process of
Cutting the hoop material on which the predetermined number of wiring patterns and protrusions are formed, and obtaining the strip-shaped lead frame.   9. The lead frame manufacturing method according to claim 8, wherein the protrusion is formed by bending. Using the lead frame manufacturing method according to claim 8 or 9 to sequentially manufacture a plurality of lead frames;
And a step of stacking and arranging the plurality of lead frames in the order of manufacture.

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