JP5538671B2 - Light emitting device and LED lamp - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element mounting substrate for mounting a plurality of light emitting elements such as light emitting diodes (hereinafter referred to as LEDs). Furthermore, the present invention provides a light-emitting device in which light-emitting elements are mounted at a high density for the purpose of using the light-emitting device for lighting or the like, and includes a light-emitting element mounting substrate that ensures heat dissipation and can supply power to a plurality of light-emitting elements. The present invention relates to a light emitting device.

  Currently, light-emitting element modules including semiconductor light-emitting elements such as light-emitting diodes are used in various applications. Therefore, in order to broaden the application, research is being conducted on light-emitting element modules with higher output.

  FIG. 16 is a plan view of an embodiment of a conventional light emitting element module, and FIG. 17 is a plan view of another embodiment of a conventional light emitting element module.

First, a conventional light emitting element module will be described with reference to FIG.
The light emitting element module 550 has a configuration in which a plurality of light emitting elements 500 are arranged in a lattice shape on the upper surface side of the mounting enamel substrate 540 and mounted. A stepped portion 530 is formed on one side of the substantially rectangular mounting enamel substrate 540. The stepped portion 530 has a lower height in the thickness direction than the other portions of the mounting enamel substrate 540 by bending the mounting enamel substrate 540 by approximately the thickness of the mounting enamel substrate 540. A so-called main body portion of the mounting enamel substrate 540 excluding the stepped portion 530 has a square shape. In FIG. 16, a plurality of protrusions 520 are formed to protrude in the thickness direction on the stepped portion 530 of the mounting enamel substrate 540. In addition, a plurality of through holes 510 are formed at positions facing the protrusions 520 on the side of the mounting enamel substrate 540 that faces the side where the stepped portion 530 is formed.

  Here, the light emitting element module 550 in FIG. 16 has a plurality of light emitting elements 500 mounted on a mounting enamel substrate 540. As shown in FIG. 16, the light emitting element module 550 on which a plurality of light emitting elements 500 are mounted is assumed to have poor heat dissipation, resulting in chromaticity variations and reduced reliability. The light emitting element module 550 includes a stepped portion 530 and has a structure in which a plurality of light emitting element modules 550 are connected by inserting the protrusions 520 of the light emitting element module 550 into the through holes 510 of another light emitting element module 550. It has become. However, it is expected that the connection between the light emitting element modules 550 varies depending on the connection portion, and accordingly, the heat dissipation performance is lowered and the reliability is lowered.

Next, another conventional light emission measure module will be described with reference to FIG.
In the light emitting element module 590, the conductive layer 600 is formed on the mounting enamel substrate 560, and the light emitting element 570 is disposed on the conductive layer 600. Further, a connection terminal 580 is formed as a connection portion with another mounting enamel substrate 560.

Here, the light emitting element module 590 in FIG. 17 has a plurality of light emitting elements 570 mounted in the longitudinal direction on the mounting enamel substrate 560. As shown in FIG. 17, the light emitting element module 590 on which a plurality of light emitting elements 570 are mounted is assumed to have poor heat dissipation, resulting in chromaticity variations and a decrease in reliability. Further, the connection terminal 580 is provided at the end of the light emitting element module 590 so that the light emitting element modules 590 are connected. However, when the light emitting element modules 590 are continuously connected, the light emitting element modules 550 are connected to each other. It is expected that the fixing will vary, leading to a decrease in heat dissipation, and thus a decrease in reliability.
JP 2006-344893 A JP 2007-27695 A

  As described above, at present, it cannot be said that a light emitting element module in which a plurality of light emitting elements are arranged on a substrate has good heat dissipation.

  In addition, in the case of a light emitting device in which one light emitting element with high light emission intensity is arranged on a substrate, the light emission is bright spot-like, which makes it feel dazzling to the human eye and its use is limited. There is a problem. In addition, a light-emitting element with high emission intensity has a problem that heat generation is concentrated and heat dissipation is poor.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light-emitting device in which a plurality of light-emitting elements are arranged on a mounting enamel substrate having high heat dissipation and high mountability. Is to provide.

In the present invention, a plurality of wiring patterns are arranged on a substrate having an insulating layer formed on the surface of a core metal, and a plurality of light emitting elements are arranged in a plurality of rows along the longitudinal direction of the wiring pattern. The plurality of light emitting elements in each column are connected in parallel so that the plurality of light emitting elements in each column arranged along the longitudinal direction in each wiring pattern among the plurality of light emitting elements in the plurality of columns are connected in parallel . One bonding wire is connected to each wiring pattern, and the other bonding wire is connected to a wiring pattern located next to one side of each wiring pattern, and a plurality of light emitting elements and one of these bonding wires and sealed with a sealing resin so as to cover the entire the other bonding wire, provided with two electrodes external connection lands different polarity, electrode external connection land Positive electrode external connection land and the negative electrode external connection land, are connected to the wiring pattern at each end, the end of the wiring pattern, test whether the lighting of the plurality of light emitting elements of each column paralleled Thus, the light emitting device further includes a test pattern connection land which is not covered with the sealing resin for recognizing the quality of the plurality of light emitting elements and the quality of the bonding wire.

In the light emitting device of the present invention, it is preferable that a plurality of fixing through holes and / or fixing notches are provided at the peripheral edge or corner of the substrate. Moreover, it is preferable that an automatic recognition pattern for wire bonding and die bonding is provided on the substrate.

In the light emitting device of the present invention, it is preferable that a sensor is mounted on the substrate and an external connection land for mounting the sensor is provided.

The sensor is preferably a temperature sensor.

In the light-emitting device of the present invention, board is preferably a enameled substrate coated with enamel layer on the surface of the core metal.

  In the light emitting device of the present invention, the core metal is preferably made of at least one selected from ultra-low carbon steel, low carbon steel, medium carbon steel, and high carbon steel.

In the light-emitting device of the present invention, a fixing jig in the board is preferably made of the same material as the base plate. At this time, the influence of contraction of the substrate and the fixing jig due to heat from the light emitting device can be reduced.

  In the light-emitting device of the present invention, it is preferable that adjacent light-emitting elements are arranged in a dust shape so that the side surfaces do not face each other on the wiring pattern. At this time, it is preferable to mount a light emitting device having a large size. At this time, it is preferable that a large number of light emitting devices can be mounted.

In the light emitting device of the present invention, the shape of the sealing resin is preferably approximately hexagonal, octagonal, circular or rectangular.

In the light-emitting device of the present invention, the shape of the base plate is substantially polygonal shape, and are preferably substantially either circular and substantially square shape.

In the light-emitting device of the present invention, the sealing resin preferably contains a phosphor.

In the light-emitting device of the present invention, the wiring pattern, Ri uneven der in a plan view of the substrate, is Rukoto emitting element to each other are arranged in NiChidori shape such that their sides are not opposite adjacent on the wiring pattern preferable. Moreover, this invention is also an LED lamp provided with said light-emitting device, a mounting surface, and a socket. The LED lamp of the present invention includes the light emitting device described above and a mounting surface, and the light emitting device is fixed to the mounting surface by a mounting screw that passes through the fixing through hole and / or the fixing notch. Is preferred.

  The present invention also relates to a backlight light source, an illumination light source, an illumination fixture light source, a display device, or a traffic light for a liquid crystal display using the above-described light emitting device.

Light emitting device of the present invention, there is provided a structure in which are mounted a plurality of light emitting elements on the base plate, each other adjacent light-emitting element, the side surfaces are arranged so as not to face, in a zigzag pattern, large size It is preferable to mount the light emitting device. Since the LED chip is arranged at a predetermined distance, it is easy to take measures against heat dissipation of the light emitting device. Furthermore, when the uneven wiring pattern on the substrate is used as a light emitting element mounting surface and a power feeding surface , a large number of light emitting elements can be mounted, heat dissipation is good, and a large area light emitting device can be easily realized. it can.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated. In addition, dimensional relationships such as length, size, and width in the drawings are changed as appropriate for clarity and simplification of the drawings, and do not represent actual dimensions.

<Embodiment 1>
≪Light emitting device≫
FIG. 1 is a plan view schematically showing a state before the light emitting element in the light emitting device of Embodiment 1 is mounted on a hollow substrate. FIG. 2 is a plan view schematically showing a state before the light-emitting element in the light-emitting device of Embodiment 1 is mounted on a hollow substrate and sealed with a sealing resin. FIG. 3 is a plan view schematically showing the light emitting device of the first embodiment. FIG. 4 is a perspective view schematically showing the light emitting device of the first embodiment. Hereinafter, description will be given with reference to FIGS.

First, the structure of the light emitting device 120 in this embodiment will be described.
In the light emitting device 120 according to the present embodiment, a plurality of concave and convex wiring patterns 3 are arranged in parallel in the longitudinal direction on a hollow substrate 1 formed by covering a core metal surface with an insulating hollow layer 2. Tei Ru. The hollow substrate 1 has a substantially octagonal shape. And the LED chip 12 as a some light emitting element is mounted in the one side of the longitudinal direction in the uneven | corrugated wiring pattern 3. FIG. At this time, adjacent LED chips 12 are arranged in a dust shape on the wiring pattern 3 so that the side surfaces do not face each other. Specifically, the LED chips 12 are arranged at the end of the concave portion and the end of the convex portion of the concavo-convex wiring pattern 3. In addition, it is not necessary to arrange the LED chip 12 at the end portions of all the concave portions and the end portions of the convex portions.

  The LED chip 12 and the wiring pattern 3 are connected by bonding wires W. Further, a positive electrode external connection land 4 and a negative electrode external connection land 5 having different polarities and two sensor mounting external connection lands 6 having different polarities are provided along the same side of the hollow substrate 1. . At this time, the two external mounting lands 6 for mounting the sensor are sandwiched between the positive electrode external connection land 4 and the negative electrode external connection land 5. Note that the term “land” in this specification refers to a region having a predetermined area and electrically connectable.

Then, LED chip 12 and the bonding wires (not shown) is sealed covered Futomeju fat 1 3. In the present embodiment, the sealing resin 13 contains one or more phosphors and can be adjusted as appropriate. In the light emitting device 120, a light emitting unit 200 a portion of the sealing resins 1 3 are formed. In the present embodiment, the light emitting unit 200 has a substantially square shape.

  The light emitting device 120 includes an external wiring (not shown) connected to the mounting buffer unit 9, the mounting unit 11, the electrode external connection land, and the sensor mounting external connection land. The attachment portion 11 is a plurality of fixing through holes and / or fixing notches provided at the peripheral edge or corner of the hollow substrate 1. A resistance temperature sensor as a sensor 14 is attached (connected) to the external connection land 6 for mounting the sensor. An automatic recognition pattern 8 for recognizing the mounting position of the bonding wire or LED chip 12 and a polarity recognition through hole 7 are provided. A test pattern connection land 10 is provided at the end of the wiring pattern 3 for short-circuiting wires, insulating, and confirming lighting of the LED chip 12.

  Further, as shown in FIG. 4, a connector 300 and a convex portion 15 formed on the connector 300 are provided on the back side of the light emitting device 120. Only when the polarity recognition through-hole 7 formed in either the positive or negative wiring pattern 3 for supplying a current matches the convex portion 15 formed in the connector 300, a current is supplied from the outside to the light emitting device. Designed to be powered.

  In addition, since the test pattern connection land 10 is provided, it is possible to recognize a defect (such as lighting failure) of the LED chip 12 and a defect (short circuit, disconnection, etc.) of the bonding wire, so that it is replaced with a good LED chip 12 in the manufacturing process. Alternatively, the defect of the light emitting device 120 can be reduced by attaching a bonding wire again. The test pattern connection land 10 can be provided at the end or corner of the wiring pattern 3.

  Further, since the automatic recognition pattern 8 is provided, chip mounting accuracy and wire bonding accuracy are improved when die bonding wire bonding is performed in the manufacturing process.

  Here, the material of the core metal in the enamel substrate 1 is preferably a metal material having good thermal conductivity and capable of firmly baking the enamel layer 2, and is extremely low carbon steel, low carbon steel, medium carbon steel, and high carbon steel. Those consisting of at least one selected from the above are preferred, and a low-carbon steel plate is particularly preferred. Here, a C content of less than 0.01% by mass is an extremely low carbon steel, a C content of less than 0.3% by mass is a low carbon steel, and a C content of 0.3% by mass to less than 0.7% by mass. Medium carbon steel, 0.7% by mass or more is called high carbon steel. This is because the core metal made of extremely low carbon steel, low carbon steel, medium carbon steel and high carbon steel is easier to machine than ceramics and can easily form a concave part with an inclined surface. It is. Furthermore, when the light emitting device 120 requires high heat dissipation and heat resistance, the core metal is excellent in thermal conductivity, so that a large current can be supplied as a drive current. Furthermore, by using the core metal, the reliability of the LED chip 12 can be improved, and phosphor deterioration due to heat from the LED chip 12 can be suppressed.

  The material of the enamel layer 2 is preferably a material that can be baked thinly on the surface of the core metal and can provide sufficient electrical insulation. For example, the material can be selected from materials mainly made of glass. Among the materials used for forming the enamel layer 2 on the core metal surface, an alkali-free glass material is preferable, and the thermal conductivity of the glass material is about 1 W / mK. The thickness of the enamel layer 2 is preferably in the range of 20 μm to 200 μm, particularly preferably in the range of 30 μm to 100 μm. If the thickness of the enamel layer 2 is less than 20 μm, the heat dissipation becomes good, but the core metal is partially exposed because it is too thin, and the electrical insulation cannot be maintained. If the thickness of the enamel layer 2 is more than 200 μm, the electric insulation can be sufficiently maintained, but there is a problem that the heat dissipation is lowered.

  Further, a fixing jig (not shown) for fixing the light emitting device 120 to a lighting fixture or the like is preferably made of the same material as the enamel substrate 1. That is, it is preferable to use a fixing jig in which the core metal in the enamel substrate 1 is covered with the enamel layer 2. If the fixing jig is the light emitting device 120 made of the same material as the enamel substrate 1, the fixing jig is made of the same material as the enamel substrate 1 and has the same thermal expansion as the light emitting device 120 is manufactured or during operation of the light emitting device 120. It is possible to reduce the occurrence of cracks and cracks in the enamel substrate 1 due to warpage caused by the generated heat. For this reason, the yield of the light emitting device 120 is not lowered. Specifically, when using a low carbon steel sheet coated with a hollow layer as a substrate, it is preferable to use a screw of a low carbon steel coated with a hollow layer as a fixing jig.

  In addition, the sensor-mounted external connection land 6 has a resistance temperature sensor (thermistor, linear resistor, platinum resistance temperature detector) as a sensor 14, a chip current fuse (thin film chip), a photosensor (photo diode, etc.). Also, a humidity sensor (such as a variable resistance humidity sensor) may be mounted. In addition to the resistance temperature sensor, the sensor 14 is not particularly limited as long as it is a temperature sensor having a function of measuring temperature. For example, by mounting a chip current fuse (thin film chip) as the sensor 14, the light emitting device 120 is protected when an overcurrent flows into the light emitting device 120.

Next, the operation of the light emitting device 120 of this embodiment will be described.
First, an external wiring connected to the positive electrode external connection land 4 and the negative electrode external connection land 5 is applied to the wiring pattern 3. At this time, as shown in FIG. 4, a connector 300 and a convex portion 15 formed on the connector 300 are provided on the back side of the light emitting device 120. Only when the convex portion 15 formed in the connector 300 and the polarity recognition through hole 7 formed in one of the positive and negative wiring patterns 3 for supplying current are aligned as shown in FIG. Current is supplied to the light emitting device from the outside. And in the light-emitting device 120 of this Embodiment, since several LED chip 12 is mounted, uniform light emission can be obtained from the whole light emission part 200. FIG.

  In addition, a resistance temperature sensor is mounted on the light emitting device 120 as the sensor 14 on the external connection land 6 for mounting the sensor in the light emitting device 120, and the temperature of the light emitting device 120 can be seen. Therefore, the reliability of the light emitting device 120 is estimated. Since the core metal is made of a material having good thermal conductivity, the temperature at the center of the light emitting device 120 is measured even if the sensor 14 is mounted at the end or corner of the light emitting device 120. Here, when the back surface of the light emitting device and the fixing jig for the light emitting device are normally fixed with good adhesion with the light emitting device 120 turned off, for example, a resistance temperature sensor (linear resistor) is used as the sensor 14. The resistance value indicates 1000Ω, and the estimated temperature is estimated to be 25 ° C. When the adhesion between the back surface of the light emitting device and the light emitting device fixing jig is insufficient, for example, the resistance value of the resistance temperature sensor is 1018Ω. Insufficient adhesion means that the mounting screws are not tightened uniformly, and therefore dust or the like is sandwiched between the back surfaces of the light emitting device. If the adhesion is insufficient, retighten the mounting screws, check the back of the light-emitting device, check the surface of the light-emitting device fixing jig, and make sure that the estimated temperature is around 25 ° C with a resistance temperature sensor. To do. The sensor 14 is not limited to the resistance temperature sensor, and the same operation and effect can be provided as long as the temperature sensor has a function of measuring temperature.

  Furthermore, the enamel substrate 1 is obtained by coating the enamel layer 2 on the core metal, and has high heat dissipation for ensuring the reliability of the light-emitting element 12, shape flexibility that enables high-density mounting, and high electrical insulation. Have sex. Further, since the light emitting element can be directly mounted on the metal wiring pattern on the substrate, heat can be efficiently released to the outside of the light emitting device 120. Further, since the insulating layer formed on a general metal substrate is not formed, there is no fear that the insulating layer is altered or peeled off due to humidity or heat.

  Conventionally, LED chips are mounted on a substrate in one horizontal row or one vertical row, and the distance between adjacent LED chips is close, causing various problems. Examples of the problem include contact between LED chips due to the close distance, contact between bonding wires, and the like. According to the present embodiment, since the LED chip 12 is arranged at a predetermined distance, the above-described problems are less likely to occur. That is, measures for dissipating heat of the light emitting device 120 can be facilitated by arranging the placement area of the LED chip 12 in this arrangement.

  Further, according to the arrangement of the positive electrode external connection land 4, the negative electrode external connection land 5 and the sensor mounting external connection land 6 in the present embodiment, the wiring pattern 3 and the external wiring can be easily routed.

≪Manufacturing method≫
5-9 is sectional drawing which showed typically each process of the manufacturing method in this Embodiment. Hereinafter, a method for manufacturing the light emitting device in the present embodiment will be described with reference to FIGS. 1 and 5 to 9.

First, it demonstrates based on FIG.
A core metal having a desired area with a thickness of 1 to 3 mm is cut out. And the notch part used as the attachment part 11 is provided in the edge | side of this core metal as needed.

  Next, the core metal is suspended in a liquid in which glass powder is dispersed in an appropriate dispersion medium, and an electrode is disposed at a position facing the core metal, and the glass is electrodeposited on the core metal. Next, the taken-out core metal is baked at high temperature, and glass is baked on the surface of the core metal. By forming a thin and uniform enamel layer 2, an enamel substrate 1 is obtained. The film thickness of the enamel layer 2 is controlled to be 20 to 200 μm on both the front and back surfaces of the core metal. Next, an uneven wiring pattern 3 is formed on the enamel layer 2 by a method such as screen printing. The wiring pattern 3 can have a thickness of 15 to 20 μm. In addition, automatic recognition patterns 8 are formed at corners on the enamel substrate. A test pattern connection land 10 is provided at the end of each wiring pattern 3. The enamel substrate 1 provided with the wiring pattern 3 is formed by the above process.

Hereinafter, description will be given with reference to FIGS.
As shown in FIG. 5, a hollow substrate 1 having a hollow layer 2 provided with a wiring pattern 3 is prepared.

  Next, as shown in FIG. 6, the LED chip 12 is fixed to a predetermined mounting position of the LED chip 12 in the wiring pattern 3 with a resin or the like.

  Next, as shown in FIG. 7, the LED chip 12 and the wiring pattern 3 are electrically connected using bonding wires W.

  Next, as shown in FIG. 8, a substantially rectangular silicone rubber sheet 16 is brought into close contact with the enamel substrate 1. And the sealing resin 13 containing a fluorescent substance is inject | poured in the silicone rubber sheet 16, and the sealing resin 13 containing this fluorescent substance is thermosetted.

  Next, as shown in FIG. 9, the silicone rubber sheet 16 is removed, and the light emitting part 200 is formed. Here, the silicone rubber sheet 16 has a function like a dam (to prevent resin leakage) when the sealing resin 13 containing a phosphor is injected. Therefore, the silicone rubber sheet 16 has a feature that can be called a dam sheet. The silicone rubber sheet 16 can be used many times. Further, by changing the shape of the silicone rubber sheet 16, the shape of the light emitting unit 200 can be easily changed in various ways.

≪Other parts≫
As a specific resin material for forming the sealing resin 13, a transparent resin excellent in weather resistance such as an epoxy resin, a urea resin, or a silicone resin, or a light-transmitting inorganic material such as silica sol or glass excellent in light resistance is preferable. Used for. The sealing resin 13 may contain a diffusing agent in addition to the phosphor as described above. Specific examples of the material for the diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon oxide, calcium carbonate, and silicon dioxide.

Examples of the phosphor include α-sialon activated Eu (europium), β-sialon activated Eu (europium), pure nitride activated Eu (europium) (CaAlSiN ₃ ), Y ₂ O _2. S: Eu, ZnS: Cu, Al, (Ba, Mg) Al ₁₀ O ₁₇ : Eu, Mn, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu, (Ba, Mg) Al ₁₀ O ₁₇ : Eu, BOSE: Eu (Europium activated barium strontium orthosilicate), SOSE: Eu (Europium activated strontium barium orthosilicate), (Si · Al) ₆ (O · N) ₈ : Eu, ( Ba · Sr) ₂ SiO ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, SrAl ₂ O ₄ : Eu, 3.5 MgO · 0.5 MgF ₂ · GeO ₂ : Mn, Ba _{1. 5} Sr _0.5 SiO ₄ : Eu, Sr ₂ Ba ₁ SiO ₅ : Eu, Ca ₃ (Sc · Mg) ₂ Si ₃ O ₁₂ : Ce, CaSc ₂ O ₄ : Ce, (Y · Gd) ₃ Al ₅ O ₁₂ : Ce, (Sr · Ca) AlSiN ₃ : Eu, CaAlSiN ₃ : Eu, La ₂ O ₂ S: Eu, (Ba · Sr) ₂ SiO ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn, Ca (Si · Al) ₁₂ (O · N) ₁₆ : Eu, (Si · Al) ₆ (O · N) ₈ : Eu, (Y, Gd) ₃ Al ₅ O ₁₂ : Ce, Tb ₃ Al _{5 O 12: Ce, Lu 3 Al} 5 O 12: Ce, (Y, Gd) 3 Al 5 O 12: a phosphor composed of at least one Ce can be suitably used.

  Examples of the LED chip 12 include a blue LED chip in which a gallium nitride-based light emitting part is formed on a SiC substrate, a blue LED chip in which a gallium nitride-based light emitting part is formed on a sapphire substrate, and a ZnO (zinc oxide) compound semiconductor. A blue LED chip, an InGaAlP LED chip, and an AlGaAs compound semiconductor LED chip can be used.

  The sealing resin 13 may be formed by dropping. Alternatively, a sealing resin body may be formed using a mold. As the shape of the sealing resin body, for example, the sealing resin body is formed in a hemispherical shape that protrudes upward. It is also possible to have a lens function.

  In addition, the P side electrode and the N side electrode were formed on one surface of the LED chip, and the state where two wires were bonded with the surfaces as the upper surface was shown. Further, the LED chip 12 may have a light emission color of blue light emission, ultraviolet light emission, or green light emission. Further, white light may be obtained by converting light emitted from the LED chip with a phosphor, and illumination using white, light bulb color, or the like using, for example, three red, green, and blue LED chips without using the phosphor. You may get the color you need.

Further, the adhesion between the LED chip 12 and the wiring pattern 3 can be performed with a thermosetting resin or the like. Specific examples include epoxy resins, acrylic resins, imide resins, and silicone resins.

  In another embodiment described below, the above-described materials can be appropriately selected.

<Embodiments 2 and 3>
FIG. 10 is a plan view schematically showing the light emitting device of the second embodiment. FIG. 11 is a plan view schematically showing the light emitting device of the third embodiment.

  First, the second embodiment will be described with reference to FIG. The light emitting device 130 has the same structure as that of Embodiment 1 except that the shape of the light emitting unit 210 is an octagon. That is, in the manufacturing process, the shape viewed from the upper surface of the sealing resin is an octagon.

  Next, Embodiment 3 will be described with reference to FIG. The light emitting device 140 has the same structure as that of the first embodiment except that the light emitting unit 220 has a circular shape. That is, in the manufacturing process, the shape viewed from the upper surface of the sealing resin is circular.

  In addition to the embodiment shown in FIGS. 10 and 11, the shape seen from the top surface of the sealing resin may be a polygonal shape or a rectangular shape. And when bright spot light emission becomes a problem, it is preferable that this sealing resin is a substantially regular polygon shape or circular shape.

  In addition, the shape of the light emitting device, that is, the shape of the enamel substrate can also be selected from a substantially polygonal shape, a substantially circular shape, a substantially square shape, or any other appropriate manner. For example, when the hollow substrate has a rectangular shape or a substantially square shape, the light emitting elements can be arranged in close contact with each other, and can be suitably used for a fluorescent lamp type LED lamp described later. When the light-emitting device is used for a light bulb-type LED lamp, the enamel substrate preferably has a substantially circular shape or a substantially polygonal shape. Moreover, when the bright spot light emission of a light-emitting device becomes a problem, the enamel substrate preferably has a square shape or a hexagonal shape.

<Embodiment 4>
FIG. 12 is a plan view schematically showing the light emitting device of the fourth embodiment. Hereinafter, a description will be given with reference to FIG.

  The light emitting device 150 has a lead wire 320 connected to each of the sensor mounting external connection land 6, the positive electrode external connection land 4 and the negative electrode external connection land 5, and a connector 300 is attached to the end thereof. A socket insert connector 310 as a socket is attached as a receiving side of the connector 300. Others are the same as the first embodiment.

  According to the present embodiment, the lead wire 320 is taken out from the sensor mounting external connection land 6, the positive electrode external connection land 4, and the negative electrode external connection land 5 to the outside of the light emitting device 150. The connector 300 can be protected from heat generated by the light emitting unit 230 during operation.

  The socket is installed at the peripheral edge or corner on the back side, and is used to supply current to the electrode and the sensor.

<Embodiment 5>
FIG. 13 is a plan view schematically showing the light emitting device of the fifth embodiment. Hereinafter, a description will be given based on FIG.

  The light emitting device 160 forms a plurality of light emitting portions 240 by covering a light emitting element (not shown) and bonding wires (not shown) with a circular sealing resin according to the number of installed light emitting elements. ing. Other structures are the same as those of the light-emitting device in Embodiment 1.

  In this embodiment, since each light source looks small when it is the light emitting unit 240, when it is used as a lighting fixture, the light diffuses and looks uniform, which is very convenient when used as a large lighting fixture.

<Embodiment 6>
FIG. 14 is a schematic front view showing an embodiment of a light bulb-type LED lamp including an illumination light source using a light emitting device. FIG. 15 is a schematic top view showing an embodiment of a light bulb-type LED lamp including an illumination light source using a light emitting device. Hereinafter, description will be given based on FIG. 14 or FIG.

  The light bulb type LED lamp 1000 includes the light emitting device 120 according to the first embodiment as a light source for illumination. The light bulb type LED lamp 1000 includes a light bulb socket 1010, a reflective surface 1020, a mounting surface 1030, and a mounting screw 111. In the present embodiment, any one of the light-emitting devices of Embodiments 1 to 5 can be appropriately selected and used.

  The light bulb type LED lamp 1000 of this embodiment can provide an arbitrary color tone such as a light bulb color including white. This is because the light emitting device used for the light bulb type LED lamp 1000 is easy to manufacture and hardly causes color misregistration.

  In addition, the light-emitting device in Embodiments 1 to 5 can also be used for a backlight light source of a liquid crystal display, a light source for illumination, a light source for illumination, a display device, or a traffic light.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these.

[Example]
<Example 1>
The present embodiment will be described below with reference to FIGS.

  In order to prepare the enamel substrate 1, the following operation was performed. First, a low carbon steel plate having a thickness of 1.4 mm and a width of 40 mm, four sides of 19 mm, and the other four sides of 14 mm was cut out. Two notches were provided on the long side of the steel plate. This notch has a width of 4 mm and a cutting depth of 4 mm in the middle of the long side. Next, the core metal is suspended in the dispersion liquid in which the glass powder is dispersed in the dispersion medium, and an electrode is disposed at a position facing the core metal, so that the glass is electrodeposited on the core metal. And the taken-out core metal was baked at high temperature, the glass was baked on the surface of the core metal, and the enamel layer 2 was formed. The enamel layer 2 had a film thickness of 100 μm on both the front and back surfaces of the core metal.

Next, a wiring pattern 3 made of Au was formed on the enamel layer 2 by screen printing. At this time, the thickness of the wiring pattern 3 was 15 μm.
Further, a 1 mm square automatic recognition pattern 8 was formed as an automatic machine recognition pattern at the corner on the enamel substrate 1. A test pattern connection land 10 was provided at the end of the wiring pattern 3. Through the above steps, a hollow substrate 1 having a wiring pattern 3 as shown in FIG. 5 was produced.

Next, as shown in FIG. 2 and FIG. 6, an LED chip 12 (short side width 0.24 mm, long side 0.48 mm, thickness 0.14 mm) is formed with epoxy resin 9 on the concave and convex ends of the wiring pattern 3. The number of rows × 15 = 135 was fixed. The equipped with state of the LED chip 12 on the wiring pattern shown in FIG.

  Next, as shown in FIG. 7, the LED chip 12 and the wiring pattern 3 were electrically connected using bonding wires W.

Next, as shown in FIG. 8, a substantially rectangular silicone rubber sheet 16 was brought into close contact with the enamel substrate 1. The weight ratio of the phosphor to the silicone resin, which is a translucent resin, is such that the light emission of the manufactured light emitting device is approximately x, y = (0.345, 0.35) in the CIE chromaticity table. What was mixed so that it might become 1: 4 was used as sealing resin 13. Then, by injecting a sealing resin 13 containing a phosphor in a silicone rubber sheet 16, to form a Futomeju fat 1 3 containing a phosphor is cured 60 minutes a sealing resin 13 at a temperature of 0.99 ° C.. In this example, (Ba · Sr) ₂ SiO ₄ : Eu was used as the phosphor.

  And as shown in FIG. 9, the silicone rubber sheet 16 was removed and the light emission part 200 was formed.

  In addition, the chromaticity characteristic evaluation of the light emitting device of the present invention was measured using a measuring device employing a d · 8 (diffuse illumination · 8 ° light receiving method) optical system in accordance with JISZ8722 Condition C, DIN5033tail7, ISOk772411.

  Finally, the light emitting unit 200, the positive electrode external connection land 4, the negative electrode external connection land 5, the sensor mounting external connection land 6, the attachment portion 11, the external wiring connected to the external connection land (not shown) ), The mounting buffer portion 9 and the polarity recognition through hole 7 were produced by a known method. A KOA square chip thick film linear positive temperature coefficient resistor LA73, which is a resistance temperature sensor, was installed as a sensor 14 on the external connection land 6 for mounting the sensor.

  As shown in FIG. 4, the connector 300 for the printed board with the top boss and the convex portion 15 of the connector are formed on the back surface side of the light emitting device 120.

  Here, when the back surface of the light emitting device and the fixing jig for the light emitting device are normally fixed with good adhesion with the light emitting device 120 turned off, the resistance temperature sensor (linear resistor) as the sensor 14 is fixed. The resistance value was 1000Ω, and the estimated temperature was estimated to be 25 ° C. When the adhesion between the back surface of the light emitting device and the fixing jig for the light emitting device was insufficient, the resistance value was 1018Ω. Insufficient adhesion means that the mounting screws were not tightened uniformly, and that dust or the like was sandwiched between the back surfaces of the light emitting device. When the adhesiveness is insufficient, retighten the mounting screws, check the back of the light emitting device, check the surface of the light emitting device fixing jig, and set the estimated temperature to around 25 ° C with the resistance temperature sensor. .

<Example 2>
This embodiment will be described below with reference to FIG.

In this example, a sealing resin containing phosphor (Ba · Sr) ₂ SiO ₄ : Eu, CaAlSiN ₃ : Eu was used to make the light emitted from the light emitting unit 210 of the light emitting device 130 light bulb color.

  More specifically, the weight ratio between the phosphor and the silicone resin, which is a translucent resin, is 1 so that light with x, y = (0.447, 0.406) is obtained in the CIE chromaticity table. : The sealing resin mixed so as to be 2.782 was poured into the silicone rubber sheet, and then cured at a temperature of 120 ° C. for 30 minutes to form a sealing resin containing a phosphor.

  Moreover, the shape of the enamel substrate 1 and the light emitting unit 210 is an octagon. The sensor mounting external connection land is designed so that a chip current fuse (thin film chip) is mounted as the sensor 14 so that the light emitting device 130 can be protected when an overcurrent flows to the light emitting device 130.

<Example 3>
The present embodiment will be described below with reference to FIG.

In this embodiment, a sealing resin containing the phosphors CaAlSiN ₃ : Eu, Ca ₃ (Sc · Mg) ₂ Si ₃ O ₁₂ : Ce in order to increase the color rendering of the light emitted from the light emitting unit 220 of the light emitting device 140. Was used.

  More specifically, the weight ratio between the phosphor and the silicone resin, which is a translucent resin, is 1 so that light with x, y = (0.447, 0.406) is obtained in the CIE chromaticity table. : The sealing resin mixed to be 6.78 was poured into the silicone rubber sheet, and then cured at a temperature of 120 ° C. for 30 minutes to form a sealing resin containing a phosphor.

  In addition, the hollow substrate 1 has an octagonal shape, and the light emitting unit 220 has a substantially circular shape.

<Example 4>
This embodiment will be described below with reference to FIG.

In this embodiment, a sealing resin containing phosphors CaAlSiN ₃ : Eu, Ca ₃ (Sc · Mg) ₂ Si ₃ O ₁₂ : Ce in order to make the light emission from the light emitting unit 230 of the light emitting device 150 have a high color rendering. Was used.

  More specifically, the weight ratio between the phosphor and the silicone resin, which is a translucent resin, is 1 so that light with x, y = (0.447, 0.406) is obtained in the CIE chromaticity table. : The sealing resin mixed to be 6.78 was poured into the silicone rubber sheet, and then cured at a temperature of 120 ° C. for 30 minutes to form a sealing resin containing a phosphor.

  The light emitting device 150 has a configuration in which the lead wire 320 is connected to each of the sensor mounting external connection land 6, the positive electrode external connection land 4 and the negative electrode external connection land 5, and the connector 300 is attached to the end thereof. It was. Then, a socket insert connector 310 was attached as a receiving side of the connector 300. In addition, the hollow substrate 1 has a square shape, and the light emitting portion 230 has a substantially square shape. Others were the same as in Example 1.

<Example 5>
This embodiment will be described below based on FIG.

In this embodiment, a sealing resin containing the phosphors CaAlSiN ₃ : Eu, Ca ₃ (Sc · Mg) ₂ Si ₃ O ₁₂ : Ce in order to make the light emission from the light emitting part 240 of the light emitting device 160 have high color rendering. Was used.

  More specifically, the weight ratio between the phosphor and the silicone resin, which is a translucent resin, is 1 so that light with x, y = (0.447, 0.406) is obtained in the CIE chromaticity table. : The mixture mixed to be 6.78 was poured into the silicone rubber sheet, and then cured at a temperature of 120 ° C. for 30 minutes to form a sealing resin containing a phosphor.

  Moreover, the shape of the light emission part 240 was a substantially circular shape with an outer diameter of 1.6 mm, and 9 rows × 15 pieces = 135 pieces were formed. Others were the same as in Example 1.

Here, in Examples 1 to 5, a blue LED chip made of a gallium nitride compound semiconductor was used as the LED chip 12 as the light emitting element.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

FIG. 3 is a plan view schematically showing a state before the light emitting element in the light emitting device of Embodiment 1 is mounted on the enamel substrate. FIG. 3 is a plan view schematically showing a state before the light emitting element in the light emitting device of Embodiment 1 is mounted on a hollow substrate and sealed with a sealing resin. 3 is a plan view schematically showing the light emitting device of Embodiment 1. FIG. 1 is a perspective view schematically showing a light emitting device according to Embodiment 1. FIG. It is sectional drawing which showed typically 1 process of the manufacturing method in this Embodiment. It is sectional drawing which showed typically 1 process of the manufacturing method in this Embodiment. It is sectional drawing which showed typically 1 process of the manufacturing method in this Embodiment. It is sectional drawing which showed typically 1 process of the manufacturing method in this Embodiment. It is sectional drawing which showed typically 1 process of the manufacturing method in this Embodiment. FIG. 6 is a plan view schematically showing a light emitting device according to a second embodiment. FIG. 6 is a plan view schematically showing a light emitting device according to a third embodiment. FIG. 6 is a plan view schematically showing a light emitting device according to a fourth embodiment. FIG. 10 is a plan view schematically showing a light emitting device according to a fifth embodiment. It is a typical front view which shows one Embodiment of a light bulb type LED lamp provided with the light source for illumination using a light-emitting device. It is a typical top view which shows one Embodiment of a light bulb type LED lamp provided with the light source for illumination using a light-emitting device. It is a top view of one Embodiment of the conventional light emitting element module. It is a top view of another one Embodiment of the conventional light emitting element module.

Explanation of symbols

  1 enamel board, 2 enamel layer, 3 wiring pattern, 4 positive electrode external connection land, 5 negative electrode external connection land, 6 sensor mounting external connection land, 7 polarity recognition through hole, 8 automatic recognition pattern, 9 mounting Buffer section, 10 Test pattern connection land, 11 Mounting section, 12 LED chip, 13 Sealing resin, 14 Sensor, 15 Convex section, 16 Silicone rubber sheet, 111 Mounting screw, 120, 130, 140, 150, 160 Light emitting device, 200, 210, 220, 230 Light emitting part, 300 connector, 310 socket insert connector, 320 lead wire, 500,570 light emitting element, 510 through hole, 520 protrusion, 530 stepped part, 540, 560 mounting enamel substrate, 550, 590 Light emitting device module, 580 connection Terminal, 600 conductive layer, 1000 bulb type LED lamp, 1010 bulb socket, 1020 reflective surface, 1030 mounting surface, W bonding wire.

Claims (12)

A plurality of wiring patterns are arranged on a substrate on which an insulating layer is formed on the surface of the core metal,
A plurality of light emitting elements are arranged in a plurality of rows along the longitudinal direction of the wiring pattern,
The plurality of light emitting elements in each column are connected in parallel so that the plurality of light emitting elements in each column arranged along the longitudinal direction in each wiring pattern among the plurality of light emitting elements in the plurality of columns are connected in parallel . Connected to each wiring pattern with one bonding wire and connected to the wiring pattern located next to one side of each wiring pattern with the other bonding wire ,
Wherein a plurality of light emitting elements are sealed with a sealing resin so as to cover the entire of their said one bonding wire and the other bonding wires,
It has two electrode external connection lands with different polarities,
The positive electrode external connection land and the negative electrode external connection land of the electrode external connection land are respectively connected to the wiring patterns at both ends,
The end portion of the wiring pattern, by testing the presence or absence of lighting of a plurality of light emitting elements of the parallel connected each column, for recognizing the quality and acceptability of the bonding wire of said plurality of light emitting elements, A light emitting device further comprising a test pattern connection land not covered with the sealing resin.   The light emitting device according to claim 1, wherein a plurality of fixing through holes and / or fixing notches are provided at a peripheral edge or corner of the substrate.   The light-emitting device according to claim 1, wherein a sensor is mounted on the substrate and an external connection land for mounting the sensor is provided.   The light emitting device according to claim 3, wherein the sensor is a temperature sensor.   The light-emitting device according to claim 1, wherein an automatic recognition pattern for wire bonding and die bonding is provided on the substrate.   The light emitting device according to claim 1, wherein the substrate is a hollow substrate in which a hollow layer is coated on a surface of the core metal.   The light emitting device according to claim 6, wherein the core metal is made of at least one selected from extremely low carbon steel, low carbon steel, medium carbon steel, and high carbon steel.   The light emitting device according to claim 1, wherein the sealing resin has a substantially hexagonal shape, octagonal shape, circular shape, or rectangular shape.   The light emitting device according to claim 1, wherein the sealing resin contains a phosphor. The wiring pattern, Ri uneven der in a plan view of the substrate,
Wherein said light emitting element adjacent to each other is their side Ru disposed NiChidori shape so as not to face on the wiring pattern, the light-emitting device according to any one of claims 1 to 9.   The LED lamp provided with the light-emitting device in any one of Claims 1-10, a mounting surface, and a socket. A light emitting device according to claim 2 and a mounting surface.
The light emitting device is an LED lamp fixed to the mounting surface by a mounting screw passing through the fixing through hole and / or the fixing notch.

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