JP5508823B2 - Wire rod blasting method and wire rod blasting apparatus - Google Patents

Description

  The present invention relates to a wire blasting method and a wire blasting apparatus, and more particularly, to a blasting method and a blasting apparatus suitable for processing a wire that is difficult to process in a tensioned state.

  The abrasives in the present invention include abrasive grains for the purpose of polishing and cutting, other abrasives, steel balls injected for the purpose of applying residual stress to the workpiece, glass, plastic, ceramic beads, etc. In the so-called “shot”, cleaning, and other purposes, various kinds of powders or grains such as seed husks and flour sprayed are widely included.

  From various powders and granules, the projected abrasive grains collide with the workpiece to cut or clean the workpiece, or the shot of steel balls or the like collide with the workpiece to give residual stress to the workpiece. Blasting is used in various fields in which the above-mentioned abrasive is projected onto a workpiece and the surface of the workpiece is processed by energy at the time of collision.

  Such blasting is also used for wire processing. For example, in the case of a relatively thick wire having a diameter of 3 mm or more, the above-mentioned blasting removes the scale of the surface and the surface roughness. Adjustments are made.

  Here, when the wire is processed by the blasting process described above, if the abrasive is projected onto the wire that is not applied with tension, the compressed gas is used for the collision of the abrasive against the wire and the projection of the abrasive. In some cases, the collision between the compressed gas and the wire causes the wire to be processed to be greatly bent and move vigorously (sway) by shaking, making it difficult to perform blasting in a stable processing state on the wire. It becomes.

  For this reason, when blasting a wire, a certain tension is applied to the wire to be treated to hold it, so that the above-mentioned collision with the abrasive and the compressed gas flowing through the abrasive are conveyed. Violent violence caused by bending or shaking caused by the projection energy of the abrasive, such as a collision with, is suppressed.

  In the processing performed by colliding the shot projected by the rotating impeller with respect to such a wire rod, not only the wire rod is tensioned but also a predetermined direction in the stretching direction of the wire rod in the tensioned state. It has also been proposed that a plurality of anti-sway devices arranged at intervals are provided, and the wire rods are held between three or more spherical support members provided on the anti-sway device so as to suppress the shake of the wire due to shot projection. (See claim 1 of Patent Document 1).

JP 2008-49414 A

  As described above, when blasting is performed on a wire, there is a problem that the wire is violated by the projection energy of the abrasive as described above.

  Such a problem of the wire rampage may occur in the projection of abrasives due to centrifugal force or in the blasting process in which abrasives are projected by a rotating impeller as introduced in Patent Document 1. In air-type blasting, which is injected with compressed gas, not only does the wire break up due to the collision between the abrasive and the wire, but also the wire rod caused by the collision with the compressed gas flow adds to the wire. Is difficult to keep in a stable state.

  For this reason, when blasting a wire, as described above, the wire is processed with tension applied to the wire to be processed.

  However, as described above, for a relatively thick wire having a wire diameter of 3 mm or more, disconnection or the like hardly occurs even if a relatively large tension is applied to the wire, and the occurrence of the above-described rampage can be suitably prevented. However, for example, a wire with a wire diameter of 300 μm or less, particularly a metal material made of iron, aluminum, copper, tin, indium and alloys thereof that breaks at a tensile load of 1 kgf or less, a wire made of synthetic resin such as polyethylene or PTFE, etc. In the case of wire with low tensile strength, blasting is effective because it breaks when tension is applied to the extent that the projection energy of the abrasive can suitably suppress the fluctuation caused by bending or shaking as described above. There was no way to do it.

  In addition, even if a wire rod with a tensile strength that does not break even if tension that can effectively suppress the occurrence of rampage due to the projection energy of the abrasive is to be processed, such tension is applied. Adding wire may cause deformations such as elongation, work hardening, and other changes in material properties. Applying a relatively large tension during processing to wires that do not like such changes in material properties. The above-described blasting cannot be performed.

  Therefore, the present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and only a relatively weak tension necessary for feeding and winding is applied without applying tension to the wire. An object of the present invention is to provide a wire blasting method and a wire blasting apparatus capable of performing air blasting in which an abrasive is injected together with a compressed gas in a stable state with respect to a wire even in a state. .

  Hereinafter, means for solving the problem will be described together with reference numerals used in the embodiment for carrying out the invention. This symbol is intended to clarify the correspondence between the description of the claims and the description of the mode for carrying out the invention. Needless to say, it is used for the interpretation of the technical scope of the claims of the present invention. It is not used restrictively.

In order to achieve the above object, the wire rod processing method according to the present invention penetrates through the wall thickness at a predetermined position in front of a blast gun 30 that injects an abrasive as a solid-gas two-phase fluid together with a compressed gas. The holding plate 41 in which the opening 43 that allows passage is formed is arranged so as to intersect the axial direction (injection direction) of the blast gun 30 at a predetermined angle,
While moving the wire 20 to be processed in contact with the surface 42 on the blast gun 30 side of the holding plate 41 in a predetermined movement direction, the solid gas is not in contact with the surface 42 of the holding plate 41. Phase wire is injected to process the wire 20 ;
The movement of the wire in the moving direction is performed with a tensile load of less than 1 kgf (Claim 1).

  In the wire blasting method having the above-described configuration, a groove 44 into which the wire 20 is fitted can be provided on the surface 42 of the holding plate 41 with the moving direction of the wire 20 as a longitudinal direction. 2).

Further, the blasting method of the wire rod having the above structure, the wire 20 may be a less wire diameter 300 [mu] m (claim 3).

  The opening 43 is formed in the holding plate 41 used in the above method in the collision range X of the surface 42 of the holding plate 41 with the solid-gas two-layer fluid (see FIGS. 4A and 4B). It is preferable that the space ratio, which is a ratio of the area and the sum of the areas of the portions Y existing in the collision range X in the opening 43, be 5 to 100%.

  It is preferable that the opening 43 is formed at a position where the wire 20 crosses the surface 42 of the holding plate 41 and that the opening width δ of the opening 43 at least at the position where the wire 20 crosses is 2 to 40 mm. (Claim 5).

  In the above method, the surface 42 of the holding plate 41 is further covered with a cover 48 made of a net or a porous plate having a wide opening with respect to the grain size of the abrasive, and the wire 20 is covered with the cover 48 and the above-mentioned method. The solid gas two-phase fluid may be jetted onto the cover 48 while being disposed between the holding plates 41.

  Further, the blasting of the wire may be performed by dividing the solid-gas two-phase fluid into a plurality of times for each predetermined angle in the circumferential direction of the wire 20 (Claim 7).

The wire blasting apparatus 1 of the present invention is a blasting apparatus provided with a blast gun 30 for injecting an abrasive as a solid-gas two-phase fluid together with a compressed gas.
A holding provided with a surface 42 in contact with a wire moving in a predetermined feeding direction at a predetermined position in front of the blast gun 30 and an opening 43 through which the compressed gas is allowed to pass is formed. The plate 41 is disposed so as to intersect the axial direction (injection direction) of the blast gun 30 at a predetermined angle so that the surface 42 is on the blast gun 30 side ,
A wire rod moving mechanism for moving the wire rod 20 in the moving direction with a tensile load of less than 1 kgf, in the embodiment, a wire rod feeding mechanism 22 and a wire rod winding mechanism 24 is provided (Claim 8).

  In the wire blasting apparatus 1 having the above configuration, a groove 44 into which the wire 20 is fitted can be provided on the surface 42 of the holding plate 41 with the moving direction of the wire 20 as a longitudinal direction. ).

Further, with respect to the holding plate 41, the area of the collision range X with the solid-gas two-layer fluid in the surface 42 of the holding plate 41 and the portion of the opening 43 existing in the collision range X. it is preferred that the ratio a is space ratio of the sum of the Y area of forming the opening 43 in the holding plate 41 so as to be 5% to 100% (claim 10).

Also, together with the wire 20 to form the opening 43 at a position crossing, it is preferable to form the opening width of the opening 43 in the transverse position of at least the wire 20 to 2 to 40 mm (claim 11).

Furthermore, a cover 48 may be provided which is made of a net-like body or a perforated plate having a wide opening with respect to the grain size of the abrasive, and covers the surface 42 of the holding plate 41 in a state where the wire 20 is placed in contact therewith. (Claim 12 ).

The blast gun 30 and the holding plate 41 are provided at a plurality of locations in the moving direction of the wire 20, and the axial direction (injection direction) of each blast gun 30 is equiangular with the circumferential direction of the wire 20. in may be formed by the arranging the respective blast gun 30 to be placed (claim 13).

  With the configuration of the present invention described above, the following remarkable effects can be obtained according to the wire blasting method and wire blasting apparatus of the present invention.

  A holding plate 41 in which an opening 43 penetrating the wall thickness is formed at a predetermined position in front of the blast gun 30 that injects the abrasive together with the compressed gas as a solid-gas two-phase fluid is arranged in the axial direction of the blast gun 30 ( (Injection direction) at a predetermined angle, while moving the wire 20 in a predetermined movement direction while the wire 20 to be processed is in contact with the surface 42 of the holding plate 41 on the blast gun 30 side By processing the wire 20 by injecting the solid-gas two-phase fluid onto the surface 42 of the holding plate 41, the minimum necessary tension necessary for moving the wire 20 with respect to the wire 20 is obtained. Even in a state where the wire 20 is not applied, it is possible to suitably prevent the wire 20 from being violated due to bending or shaking.

  As a result, it was possible to perform blasting without causing breaks or changes in material properties even for wires with relatively small diameters that are easily broken or wires whose material properties change when tension is applied.

  In the structure in which the holding plate 41 is provided with the groove 44 for fitting the wire 20, the occurrence of the above-described rampage occurring in the wire 20 can be more reliably prevented.

  Further, according to the configuration of the present invention described above, a wire rod having a diameter of 300 μm or less is processed as the wire rod 20, and the movement in the moving direction is performed with a tensile load of less than 1 kgf. However, it was possible to perform processing without causing disconnection, and without causing changes in material properties accompanying the application of tension, such as deformation and work hardening as described above.

  Further, in the configuration in which the space ratio is in the above numerical range, the compressed gas can be passed through the back side of the holding plate 41 very smoothly, and the wire rod 20 can be suitably prevented from being violated.

  In the configuration in which such an opening 43 is formed at a position where the wire 20 crosses, and at least the opening width δ of the opening 43 at the crossing position of the wire 20 is within the above numerical range. The wire 20 is not drawn into the opening 43, and the wire 20 is fixed in a state of being pressed against the surface 42 of the holding plate 41 at the edge of the opening by the compressed gas flow passing through the opening 43. It was possible to further suppress the rampage of the wire rod.

  The surface 42 of the holding plate 41 is covered with a cover 48 made of a net or a porous plate having a wide opening with respect to the grain size of the abrasive, and the wire 20 is interposed between the cover 48 and the holding plate 41. In the arrangement, the ramping of the wire 20 can be more suitably suppressed, and necessary processing for the wire 20 can be performed.

  By arranging the blast gun 30 at every predetermined angle in the circumferential direction of the wire 20 and performing the injection of the solid-gas two-phase fluid in a plurality of times, uniform processing is performed throughout the circumferential direction of the wire 20. Could be done.

BRIEF DESCRIPTION OF THE DRAWINGS It is an external view of the blast processing apparatus which shows one Embodiment of this invention, (A) is a front view, (B), (C) is a side view. It is the schematic explanatory drawing which showed arrangement | positioning with a blast gun and a wire rod holder, (A) is the figure seen from the orthogonal direction with respect to the longitudinal direction of a wire, (B) is the figure seen from the longitudinal direction of the wire. It is a top view of a holding plate, (A)-(E) shows a modification, respectively. It is explanatory drawing of a space ratio, (A) is a collision area | region with a solid-gas two-phase fluid in a part of holding plate, (B) is a collision area | region with the solid-gas two-phase fluid when the whole holding plate is If it becomes. The schematic perspective view which shows the example of attachment of the cover with respect to a holding plate. It is explanatory drawing of the holding plate used in the Example, (A) shows Example 1 and (B) shows the holding plate of Example 2, respectively. Surface electron micrograph of enamel-coated copper wire before blasting (Example 1). Surface electron micrograph of enamel-coated copper wire after blasting (Example 2).

  The wire blasting apparatus of the present invention will be described below with reference to the accompanying drawings, and a blasting method realized by the blasting apparatus will be described.

〔overall structure〕
A configuration example of the blasting apparatus of the present invention is shown in FIG.

  The blasting apparatus 1 shown in FIG. 1 contaminates the working environment due to scattering of the injected abrasives, etc., by performing blasting on the wire 20 to be processed in the processing chamber 11 formed in the cabinet 10. In order to be able to introduce a wire rod into the processing chamber 11 formed in the cabinet 10, one side wall 10a of the cabinet 10 is provided with the cabinet. An introduction hole 12 (see FIG. 1C) for introducing the wire 20 into the interior of the interior 10 is formed, and the wire 20 after being processed in the processing chamber 11 is carried out of the cabinet 10. The unloading hole 13 (see FIG. 1B) is formed in the other side wall 10b facing the one side wall 10a.

  A wire feed mechanism 22 having a spool 22a around which the wire 20 to be processed is wound in a coil shape is provided outside the cabinet 10 on the introduction hole 12 side, and the carry-out hole described above. Outside the cabinet 10 on the 13th side, a wire winding mechanism 24 having a spool 24a for winding the wire 20 after being processed in the processing chamber 11 is provided, and the spool 22a of the wire feeding mechanism 22 is provided. The wire 20 wound around the wire 10 is introduced into the processing chamber 11 of the cabinet 10 through the guide roller 22 g and the introduction hole 12, and the wire 20 that has passed through the processing chamber 11 of the cabinet 10 is introduced through the carry-out hole 13. By taking it out of the cabinet and winding it around a spool 24a provided in the wire winding mechanism 24 via a guide roller 24g. Material 20 is configured so as to pass through the working chamber 11 formed within the cabinet 10.

  The movement of the wire 20 by the wire take-up mechanism 24 and the wire feed mechanism 22 is performed by rotating the wire take-up spool 24a at a predetermined speed by a motor 24m provided in the wire take-up mechanism 24, for example. The wound wire 20 is wound, and the spool 22a around which the wire to be processed is wound by the motor 22m provided in the wire feed mechanism 22 is wound at the winding speed by the wire winding mechanism 24. By rotating the wire rod 20 at a corresponding speed and sending it out, the tensile force applied to the wire rod 20 is, for example, less than 1 kgf, preferably 0.1 to 0.6 kgf. doing.

  In the illustrated blast processing apparatus 1, the lower part of the cabinet 10 is formed in an inverted pyramid shape to form a hopper 14, and the lowermost end of the hopper 14 is a cyclone installed on the upper part of the cabinet 10 through a conduit. By communicating with a certain abrasive recovery tank 15, the abrasive recovered in the cabinet 10 is sucked into the abrasive recovery tank 15 by sucking the air inside the abrasive recovery tank 15 by a blower provided in a dust collector (not shown). 15 and the abrasive thus recovered can be re-injected and used for processing the wire.

  However, the blasting apparatus 1 according to the present invention is not limited to the configuration of the blasting apparatus 1 described with reference to FIG. 1, and a wire rod holding mechanism 40 (to be described later) is blast gun 30 with respect to various known blasting apparatuses. It can obtain by providing ahead of the injection direction.

[Wire holding mechanism]
In the processing chamber 11 of the cabinet 10 configured as described above, as shown in FIG. 2A and FIG. 2B as an example, an abrasive together with compressed gas is applied to the wire 20 passing through the processing chamber 11. A blast gun 30 (30a to 30f) that injects as a solid-gas two-phase fluid is provided, and the wire 20 to be processed is stabilized at a predetermined position in front of the blast gun 30 in the injection direction. The wire holding mechanism 40 provided with the holding plate 41 described above is provided for holding in this state.

  In the illustrated embodiment, the above-described wire holding mechanism 40 is a contact surface between the holding plate 41 having a surface in contact with the wire 20 conveyed in a predetermined feeding direction and the wire 20 of the holding plate 41. Although the cover 48 is provided to cover the surface, the wire holding mechanism 40 of the present invention may have at least the holding plate 41, and the cover 48 is not necessarily provided. .

Holding Plate The holding plate 41 includes a surface 42 that contacts the wire 20 that moves in a predetermined movement direction, and the surface 42 of the holding plate 41 has a predetermined direction (injection direction) with respect to the axial direction of the blast gun 30. A plate-like body made of a material such as iron, SUS, aluminum or copper, urethane, or other synthetic resin, which is arranged to intersect at an angle. In a state where a certain wire 20 is placed in contact, the above-described solid-gas two-phase fluid is sprayed onto the surface 42 of the holding plate 41, so that the wire 20 can be blasted while preventing the wire from being violated. It is something that can be done.

  Here, a wire rod in a state where a simple tension is not applied to the surface of the plate-like body or a minimum necessary tension is placed in contact with the surface of the plate-like body on which the wire is arranged is solid-gas two-phase. When the fluid is ejected, the wire contacting the surface of the plate-like body is prevented from bending in the back direction of the plate-like body, but when the compressed gas collides with the surface of the plate-like body, the surface of the plate-like body If the direction is changed in the direction along the line, the wire will be bent or shaken in a direction parallel to the plane of the plate-like body, and blasting will be applied to the wire placed on the surface of the plate-like body. Even if it is performed, blasting cannot be stably performed in a state in which the ramp of the wire is prevented.

  Therefore, in the present invention, while adopting a configuration in which the blasting is performed in a state where the wire is held on the holding plate 41 which is a plate-like body having a surface on which the wire 20 to be processed is in contact with the compression, In order to allow the gas flow to pass smoothly through the back side of the holding plate 41, the holding plate 41 is provided with an opening 43 that penetrates the thickness of the holding plate 41, so that the compressed gas is collided with the surface of the holding plate 41. By suppressing the change in the flow that occurs in the flow, it is possible to suppress the rampage that occurs in the wire rod 20 and to hold the wire rod 20 in a stable state on the holding plate 41 during blasting. .

  Such an opening may be formed, for example, as a single opening 43 as shown in FIG. 3 (A), or a plurality of openings as shown in FIGS. 3 (B) and 3 (C). The opening 43 may be configured as follows. Further, the opening 43 is not limited to a circular shape, and may have various shapes, and as shown in FIGS. 3D and 3E, It is good also as what forms as the slit-shaped opening 43. FIG.

  The size of the opening 43 formed in the holding plate 41 is not particularly limited in the case where the opening 43 is not provided at a position where the wire 20 is contacted and arranged, for example, as shown in FIG. 3A to 3D, when the opening 43 is formed at a position where the wire 20 is in contact with the wire, if the opening width is formed too large, as shown in FIGS. On the other hand, if the opening width is narrow, the compressed gas flow cannot be smoothly passed if the opening width is narrow. Preferably, the opening width δ at least at the transverse position of the wire is set to 2 to 2. It is formed to 40 mm.

  Thus, by forming the opening 43 at the position where the wire 20 is placed in contact with the wire 20, the compressed gas flow passing through the opening 43 to the back side of the holding plate 41 causes the wire 20 located on the opening 43 to be located. Force is generated in the direction in which the wire 20 is drawn into the opening 43, but in the opening 43 formed in the range of the opening width δ, the wire 20 does not bend enough to be drawn into the opening 43, and this The position of the wire 20 is fixed by pressing the wire 20 onto the surface 42 at the edge of the opening 43 by the compressed gas flow, and it is possible to suitably prevent the wire 20 from being violated on the holding plate 41. .

  In order to allow the compressed gas to smoothly pass through the holding plate 41 and to more reliably suppress the wire rod from being ramped up, the above-described holding plate 41 is set to have a “space factor” in the range of 5 to 100%. It is preferable to form the opening 43.

Here, the above-mentioned “space ratio” means the area of the collision range X of the surface 42 of the holding plate 41 with the solid-gas two-layer fluid and the area of the opening 43 existing in the collision range X. As shown in FIG. 4 (A), a collision range X between a part of the holding plate 41 and the solid-gas two-phase fluid [hatched in FIG. 4 (A)] In the collision zone X (including the area of the opening 43 portion), the opening portion existing in the collision range X (see the right side of FIG. 4A). Double hatched portion] The ratio of the total area of Y (Y1 + Y2 + Y3 + Y4 + Y5), that is,
(Area of Y / Area of X) × 100 = Space ratio (%)
Represented as:

  Further, for example, as shown in FIG. 4B, when the entire holding plate 41 is placed within the injection range of the solid-gas two-phase fluid, the entire surface of the holding plate 41 (including the portion where the opening 43 is formed). Is the above-mentioned X, and the opening 43 forming portion of the holding plate 41 is the above-mentioned Y (see FIG. 4B).

  By forming the above-described opening 43 with such a space ratio, the compressed gas can be suitably passed to the back side of the holding plate 41, and thereby the wire 20 with respect to the surface 42 of the holding plate 41. It is possible to suitably prevent the occurrence of rampage by holding.

  In addition, it is preferable to form the groove | channel 44 which the wire 20 fits in the contact part with the said wire 20 of such a holding plate 41 by making the moving direction of the wire 20 into a longitudinal direction.

  This groove is provided for fitting the wire 20 to prevent the wire 20 from being violated on the surface 42 of the holding plate 41. Although not particularly limited, if the wire rod 20 is formed to be excessively wide, the wire rod 20 cannot be prevented from being violated, and if formed too deep, the abrasive does not easily collide with the wire rod 20.

  On the other hand, if the width of the groove 44 is narrow and too shallow, the wire 20 is likely to drop off from the groove 44, and the rampage that occurs in the wire 20 cannot be suitably prevented.

  Therefore, the preferable width and depth of the groove 44 are, for example, about 0.2 to 2 mm in width and about 0.5 to 3 mm in depth.

  The cross-sectional shape in the width direction of the groove 44 is a U-shape, U-shape, V-shape, semicircular arc shape, etc. that opens upward as long as the fitted wire can be held in the groove 44. , Any shape may be used, and the shape is not particularly limited.

Cover The surface 42 of the holding plate 41 configured as described above may be covered with the cover 48 as described above.

  The cover 48 can be formed by a perforated plate such as a net or a punching metal having a large opening with respect to the grain size of the abrasive used. For example, the cover 48 is formed in the same shape as the holding plate 41. The above-described cover 48 may be formed by covering the hole plate on the surface 42 of the holding plate 41 so that the opening positions overlap.

  When the cover 48 is formed of a net-like body, the entire surface 42 of the holding plate 41 may be covered with the cover 48 that is a net-like body. Further, as shown in FIG. An opening 49 of the same size may be formed at a position corresponding to the provided opening 43, and attached to a position where the opening 43 of the holding plate 41 and the opening 49 of the cover 48 overlap.

  The cover 48 formed in this way is attached to the surface 42 of the holding plate 41 to which the wire 20 is placed in contact, thereby preventing the wire 20 from floating above the surface 42 of the holding plate 41, and The wire 20 can be held on the surface 42 of the holding plate 41 in a state in which the wire 20 is not easily ramped.

  The cover 48 is attached to the surface 42 of the holding plate 41 through a movement allowance larger than the wire diameter of the wire 20 so that the wire 20 arranged on the surface 42 of the holding plate 41 can smoothly move. As described above, when the groove 44 for fitting the wire 20 is provided on the surface 42 of the holding plate 41 as described above, and the entire wire 20 is fitted in the groove 44, the holding plate is used. The above-described cover 48 may be attached in a state where the cover 48 is in contact with the surface 42 of the 41. With this configuration, the wire 20 cannot be removed from the groove 44.

  By attaching the cover 48 in this way, it is possible to more reliably hold the wire with respect to the surface 42 of the holding plate 41, and to more reliably prevent the above-described rampage that occurs in the wire 20.

[Arrangement of blast gun and wire holding mechanism]
The wire holding mechanism 40 including the holding plate 41 configured as described above and a cover 48 provided as necessary is illustrated together with the blast gun 30 as an example when performing uniform processing on the entire circumferential direction of the wire 20. As shown in 2 (A) and (B), a plurality of wires 20 are arranged in the moving direction of the wire 20.

  In this case, for each arrangement, the blast gun 30 is arranged at a predetermined angle in the circumferential direction of the wire 20 so that uniform processing can be performed over the entire outer periphery of the wire 20 [FIG. See B)].

  In the embodiment shown in FIGS. 2 (A) and 2 (B), six sets of blast guns 30 and wire rod holding mechanisms 40 are provided, and the axial direction (injection direction) of each blast gun 30 is shown in FIG. 2 (B). As shown in the figure, the wire 20 to be machined is formed so that it can be blasted over the entire outer circumference 360 ° of the wire 20 by shifting by 60 ° around the same angle, for example, every 180 °. The above-described blast gun 30 is provided every 120 °, every 90 °, and every 72 °, and the wire rod is formed by two, three, four, or five blast guns 30 that are fewer than the illustrated embodiment. 20 may be processed, or may be processed by seven or more blast guns 30 with a narrower arrangement angle.

  As described above, when the blast guns 30 are arranged at predetermined angles, the holding plate 41 that is paired with each blast gun 30 also has a surface 42 that is, for example, in the axial direction (injection direction) of the blast gun. Although it may be arranged so as to be orthogonal to each other, in the embodiment shown in the figure, in FIG. 2A and FIG. Are arranged horizontally downward.

  In this case, the three holding plates 41 arranged on the right side in FIG. 2A and the three holding plates 41 arranged on the left side in FIG. In addition, the cover 48 may be provided in common as well.

[Blasting method]
The blasting of the wire using the blasting apparatus 1 provided with the wire holding mechanism 40 described above is performed as follows as an example.

  In the blast processing apparatus 1 having the configuration shown in FIG. 1, first, a spool 22 a around which a wire 20 to be processed is wound is attached to a support shaft 22 c provided in the wire feed mechanism 22.

  The wire 20 to be processed in the present invention is not particularly limited, and various materials and sizes can be processed, but the wire diameter is 300 μm or less, and the wire 20 can be easily disconnected by adding a tensile load of about 1 kgf. Metal wires such as iron, aluminum, copper, tin, indium and alloys thereof, and wires made of synthetic resin such as polyethylene and PTFE can also be targeted. The present invention can also be applied to the wire 20 that does not want to be affected by deformation such as elongation, work hardening, or other material properties due to the addition of tensile load.

  The wire feeding mechanism 22 rotates a spool 22a attached to the support shaft 22c by a motor 22m in accordance with a winding speed of a wire winding mechanism 24, which will be described later, thereby feeding the wire, for example, less than 1 kgf. It is comprised so that it can perform by tension | tensile_strength.

  One end of the wire 20 wound around the spool 22a attached to the wire feed mechanism 22 is introduced into the cabinet 10 through the introduction hole 12 formed in the cabinet 10 through the guide roller 22g as described above. In the embodiment shown in FIGS. 2 (A) and 2 (B) in contact with the surface of the holding plate 41 of the wire holding mechanism 40 arranged in the cabinet 10, the surface of the holding plate 41 is further moved. It is held by being covered with a cover 48 and pulled out of the cabinet 10 through the carry-out hole 13 provided in the cabinet 10, and this is transferred to a spool 24a provided in the wire winding mechanism 24 via a guide roller 24g. It is attached.

  The wire 20 is, for example, about 0.1 to 5 m / min so that the tension applied to the wire becomes less than 1 kgf by winding the wire 20 attached to the wire winding mechanism 24 and feeding by the feed mechanism. While moving at a speed, the abrasive is jetted together with the compressed gas from the blast gun 30.

  The compressed gas used to inject the abrasive is compressed with inert gas (for example, nitrogen gas) in addition to compressed air depending on the purpose of blasting, the material of the abrasive used, the material of the wire to be processed, etc. It can be selected from gas and other various types.

  As for the injection method, a direct pressure type in which a gas pressurized with a compressed gas in a pressurized tank or the like is introduced into a blast gun and injected, and a compressed gas flow introduced into the blast gun and an abrasive that has fallen from the abrasive tank. Various types of methods called gravity type or suction type, which are combined and injected in a blast gun, can be used, and the processing conditions are not particularly limited.

  As for the abrasives used, amorphous alumina abrasives (WA: white alundum, A: alundum), silicon carbide abrasives (GC: green carborundum, C: carborundum), spherical SUS Beads, glass beads, ceramic beads, resin beads, etc., seed husks, flour, and other various abrasives for processing purposes, for example, adjustment of surface roughness, application of residual stress, removal of surface coating, removal of lubricant , Abrasive grains and shots of various materials and particle sizes can be used according to other purposes such as cleaning.

  As described above, the abrasive together with the compressed gas is injected from the blast gun 30 as a solid-gas two-phase fluid.

  Since the wire 20 to be processed is in contact with the surface 42 of the holding plate 41 as described above and the occurrence of the turbulence is suppressed, the solid-gas two-phase fluid is thus applied to the wire 20 in this way. Even when the abrasive is sprayed, the wire 20 can be held in a predetermined position and stable processing can be performed.

  In the above configuration, when performing blasting using the wire holding mechanism 40 of the present invention, the contact side of the surface of the wire 20 with the holding plate 41 surface 42 which is the back side when viewed from the blast gun 30 side is used. Since the processing is difficult, when performing uniform processing over the entire circumference of the wire 20, the blast gun 30 and the wire holding mechanism 40 described above are provided at a plurality of locations in the moving direction (longitudinal direction) of the wire 20. And performing a blasting process a plurality of times with a blast gun 30 arranged at predetermined angles in the circumferential direction of the wire rod 20, so that a uniform machining can be performed over the entire circumference of the wire rod 20.

  Next, two examples in which the wire is processed by the method of the present invention will be described as Example 1 and Example 2, respectively.

[Example 1]
(1) Workpiece (wire)
An enameled copper wire that breaks at a wire diameter (diameter) of 80 μm and a tensile load of 0.2 kgf was used as a treatment target.

(2) Processing conditions Based on a commercially available gravitational blasting device (Blasting device “SGK-3” manufactured by Fuji Seisakusho), a wire rod is used in the blasting device cabinet 10 as described with reference to FIG. 20 are formed as the introduction holes 12 and the carry-out holes 13, and the wire feed mechanism 22 and the wire take-up mechanism 24 described above are provided outside the cabinet 10 to traverse the processing chamber 11 formed in the cabinet 10. The wire 20 can be transferred.

  In the cabinet 10 of this blast processing apparatus, as described with reference to FIGS. 2A and 2B, six sets of the blast gun 30 and the wire holding mechanism 40 are arranged.

  The blast gun 30 is arranged at an equal angle of 60 ° around the wire in the plane in which the axial direction (injection direction) is substantially orthogonal to the axial direction of the wire, and the outer circumference of the wire 20 is 360 ° all around. Cross processing was performed.

  The interval between adjacent blast guns 30 was set at an equal interval of approximately 100 mm in the wire transfer direction.

  The blast gun 30 used has a nozzle tip diameter (nozzle tip inner diameter) of 7 mm, and the blast gun 30 is introduced with a compressed gas (compressed air) pressurized to 0.2 MPa together with the abrasive. Injected.

  As shown in FIG. 6A, each of the holding plates 41 used is a urethane plate having a length (L) of 90 mm, a width (W) of 60 mm, and a thickness (T) of 5 mm, and a rectangular slit of 40 mm × 9 mm. 5 pieces were formed at a pitch of 12 mm, and a semicircular groove having a diameter of 1 mm, into which the wire was fitted, was formed at the center in the width direction of the holding plate 41 over the entire length in the length direction.

  Both were disposed so that the distance between the wire rod 20 passing through the tip of the blast gun 30 and the holding plate 41 was 100 mm, and the surface 42 of the holding plate 41 was processed without attaching the cover 48.

The area of the collision range X of the solid-gas two-phase fluid in the arrangement of the holding plate 41 (see FIG. 4A) is 320 mm ² , and the space ratio of the holding plate 41 is 65%.

  The moving speed of the wire 20 was 0.9 m / min, and Fuji Random (manufactured by Fuji Seisakusho) WA # 800 (center particle size: 14 μm) was used as the abrasive.

(3) Processing result By the said method, the above-mentioned wire 20 made into processing object was able to be blasted continuously, without breaking.

  Moreover, in visual confirmation, generation | occurrence | production of large fluctuations, such as a big bending and a shake | fluctuation, could not be confirmed.

  Furthermore, when FIG. 7 (before processing) and FIG. 8 (after processing), which are electron micrographs taken before and after processing of the wire 20 processed by the above method, are compared, the wire 20 after blast processing (see FIG. 8). In this case, the enamel coating on the surface is removed, and it can be confirmed that the wire diameter is about 20 μm smaller than the state before processing, and is substantially uniform over the entire circumference of the wire. It was confirmed that a processed material was obtained.

  From this, by performing blasting on the wire by the method of the present invention, the wire diameter is 300 μm or less and the wire is broken at a tensile load of less than 1 kgf, and even for wire that could not be blasted conventionally It was confirmed that blasting can be performed with a simple processed body.

[Example 2]
(1) Workpiece (wire)
A 120 μm diameter stainless steel wire that breaks at a tensile load of about 0.7 kgf (tensile strength: 63 kgf / mm ² , proof stress: 29 kgf / mm ² ).

(2) Machining conditions Machining was performed using a blasting machine called “pencil type” (direct pressure injection method: DPD manufactured by Fuji Seisakusho), whose injection method is a direct pressure method.

  As shown in FIGS. 2A and 2B, six sets of the blast gun 30 and the wire holding mechanism 40 are prepared, and the axial direction (injection direction) of the blast gun 30 is substantially orthogonal to the axial direction of the wire 20. In this plane, the wire rod is arranged at an equal angle of 60 ° around the center and processed over the entire 360 ° circumference of the wire rod, and the interval between adjacent blast guns 30 is approximately 100 mm in the transfer direction of the wire rod 20. The points at equal intervals are the same as in the first embodiment.

  The blast gun 30 used has a nozzle tip diameter (inner diameter of the nozzle tip) of 1.2 mm, and 0.15 MPa of compressed gas (compressed air) is introduced into the blast gun 30 together with the abrasive. A jet was made.

  As shown in FIG. 6 (B), the holding plate is a urethane plate having a length (L) of 90 mm, a width (W) of 60 mm, and a thickness (T) of 5 mm, and one opening having a diameter of 30 mm. Thus, a semicircular groove having a diameter of 1 mm into which the wire is fitted is formed at the center in the width direction of the holding plate over the entire length in the length direction.

  Both were arranged so that the distance between the tip of the blast gun and the wire passing through the holding plate was 50 mm.

The area of the collision region X of the solid-gas two-phase fluid in the holding plate 41 (see FIG. 4A) is 80 mm ² , and the space ratio of the holding plate 41 is 10%.

  The entire surface of the holding plate was covered with an iron wire mesh (opening 6 × 6 mm, wire diameter φ0.5 mm), and this wire mesh was used as the cover 48 described above.

  The moving speed of the wire was 0.9 m / min, the winding tension was 0.2 kgf, and Fuji Random (manufactured by Fuji Seisakusho) WA # 600 (center particle size: 20 μm) was used.

(3) Processing result By performing blast processing under the above conditions, the surface roughness necessary for the wire to be processed is adjusted before plating, and as a result, the above-mentioned wire that is to be processed is disconnected. Blasting could be performed continuously.

  In addition, in visual confirmation, it was not possible to confirm the occurrence of large deflections, fluctuations, etc. in the wire, and it was confirmed that the surface roughness required for the pretreatment of plating was adjusted on the entire surface of the wire. It was.

Note that the yield strength of the wire material to be processed in Example 2 is 29 kgf / mm ² as described above. Here, the “proof strength” is a value obtained by dividing the stress when permanent elongation of 0.2% occurs without returning to the original state even when the load is removed by the cross-sectional area of the material piece before the test.
Therefore, the above wire with a yield strength of 29 kgf / mm ² and a diameter of 120 μm is
0.06 ² π × 29 (kgf / mm ² ) = about 0.33 (kgf)
That is, when a tensile load of 0.33 kgf or more is applied, permanent elongation of 0.2% or more occurs, which affects the material properties of the wire.

  However, according to the method of the present invention, as described above, the wire can be transferred with a winding tension of 0.2 kgf, which is sufficiently low with respect to 0.33 kgf. In addition to preventing the wire from breaking, it has no effect on the material properties of the wire, or blasting with minimal influence on the material properties of the wire. Can be done.

  According to the wire blasting method and wire blasting apparatus of the present invention described above, it is possible to perform blasting on various wire materials, and in particular, for example, 1 kgf, which has been impossible in the past. The method of the present invention can be applied to fine wires that are broken even when relatively small tension is applied, or wires that affect material properties due to the addition of tensile tension. In addition, the apparatus can be used in the fields exemplified below.

(1) As a pre-treatment for coating fine wires with a predetermined paint, etc., the surface roughness adjustment of fine wires to improve paint adhesion, stripping of enamel wires, and predetermined surface roughness for enamel coatings Each process such as granting.

(2) A process of forming a predetermined surface roughness on the surface of the wire in order to ensure the stability of the discharge in the wire discharge method of electric discharge machining.

(3) The surface roughness of metal wires (iron, copper, aluminum, Pt, Ag, Au and their alloys) with a wire diameter of 80 μm or less is adjusted by surface blasting, surface cleaning, surface lubricant Each process such as removal.

  Moreover, it is not limited to a metal wire, For example, it is the fiber which consists of cellulose, and has a linear structure, the fiber made from resin, and the surface treatment of a wire.

(4) Removal of functional particles under the surface of the wire, for example, abrasive grains as an abrasive.

(5) Removal of an abnormal surface layer such as oxide scale generated during various treatments on the wire.
(6) Cleaning of the surface of the wire rod.

(7) Surface treatment for the catheter. For example, a dimple-shaped depression is formed on the outer circumference of the catheter by projecting a shot, and processing is performed to improve the slidability for smooth movement in the body.

  Here, the catheter is a hollow soft thin tube that is inserted into the body for examination or treatment, and is distinguished from “circuit”, “tube”, “line”, etc. that are connected to the outside of the body. Specifically, it is inserted into body cavities such as the thoracic cavity and abdominal cavity, lumens such as the digestive tract and ureter or blood vessels, and used for draining body fluids and infusions of medicinal solutions and contrast media. Typical examples include “urinary catheter (urinary catheter)” and “heart catheter (cardiac catheter)”.

(8) Surface treatment of a stent for medical use.
Similar to the catheter, the slipperiness is improved by giving the stent a dimple shape by blasting.

  In addition, various types of coatings are applied to medical devices in order to increase slipperiness within blood vessels. As such a treatment for improving the slipperiness, a very thin film is coated by controlling hydrophilic polymer, silicon, PTFE and the like in units of micron. It can also be used as a base treatment for coating.

  As such coating technology, processing technology to coat the surface of metal wire or rope with PTFE resin to a very thin film of 2μm to 5μm and extrusion molding of thermoplastic resin such as nylon resin to a minimum film thickness of 20μm In this coating technology, the adhesion of the resin material to the metal material can be improved by performing the ground treatment by blasting according to the method of the present invention. It can be expected that the fusion with the properties of the resin will be further promoted.

(9) Base processing for resin processing of orthodontic wires.
A characteristic of many patients (especially adult women) who visit orthodontics is that their aesthetic desire is much higher than their children. As a result, transparent plastic-white orthodontic brackets made of hard plastics and ceramics, and orthodontic wires (wires) with white Teflon (registered trademark) and epoxy resin processing are commercially available. The blasting of the present invention can also be applied to the ground processing at the time of processing.

DESCRIPTION OF SYMBOLS 1 Blast processing apparatus 10 Cabinet 10a One side wall 10b The other side wall 11 Processing chamber 12 Introduction hole 13 Unloading hole 14 Hopper 15 Abrasive recovery tank 20 Wire material 22 Wire material feed mechanism 22a Spool 22c Spindle 22m Motor 22g Guide roller 24 Wire material winding Mechanism 24a Spool 24m Motor 24g Guide roller 24c Support shaft 30 Blast gun 40 Wire rod holding mechanism 41 Holding plate 42 Surface (of holding plate)
43 Opening 44 Groove 48 Cover 49 Opening X Collision range of solid-gas two-phase fluid Y Opening 43 present in collision range X

Claims (13)

A holding plate in which an opening that penetrates the wall thickness and allows passage of the compressed gas is formed at a predetermined position in front of the blast gun that injects the abrasive together with the compressed gas as a solid-gas two-phase fluid. Arranged so as to intersect with the axis direction of
The solid-gas two-phase fluid is jetted onto the surface of the holding plate while moving in a predetermined moving direction with the wire to be processed in contact with the surface on the blast gun side of the holding plate. Processing the wire ,
A wire blasting method, wherein the wire is moved in the moving direction with a tensile load of less than 1 kgf .   2. The wire blasting method according to claim 1, wherein a groove in which the wire is fitted is provided on the surface of the holding plate with the moving direction of the wire as a longitudinal direction. Blasting method according to claim 1 or 2 wire according, characterized in that the wire was below the wire diameter 300 [mu] m.   A space ratio, which is a ratio of an area of a collision range of the surface of the holding plate with the solid-gas two-layer fluid and a sum of areas of the openings existing in the collision range, is 5 to 100%. The wire blasting method according to claim 1, wherein the opening is formed in the holding plate.   The said opening is formed in the position which the said wire crosses, and the opening width of the said opening in the crossing position of the said wire is formed in 2-40 mm at least, The any one of Claims 1-4 characterized by the above-mentioned. Blasting method for wire.   The surface of the holding plate is covered with a cover made of a mesh or a perforated plate having a wide opening with respect to the grain size of the abrasive, the wire is disposed between the cover and the holding plate, and the cover The wire blasting method according to any one of claims 1 to 5, wherein the solid-gas two-phase fluid is sprayed thereon.   The wire blasting method according to claim 1, wherein the injection of the solid-gas two-phase fluid is performed in a plurality of times for each predetermined angle in the circumferential direction of the wire. In a blasting apparatus equipped with a blast gun for injecting an abrasive together with a compressed gas as a solid-gas two-phase fluid,
A holding plate having a surface in contact with a wire moving in a predetermined feed direction at a predetermined position in front of the blast gun and having an opening that allows the compressed gas to pass through the wall, Arranged at a predetermined angle with the axial direction of the blast gun so that the surface is on the blast gun side ,
A wire blasting apparatus comprising a wire moving mechanism for moving the wire in the moving direction with a tensile load of less than 1 kgf .   The wire blasting apparatus according to claim 8, wherein a groove in which the wire is fitted is provided on the surface of the holding plate with the moving direction of the wire as a longitudinal direction. A space ratio, which is a ratio of an area of a collision range of the surface of the holding plate with the solid-gas two-layer fluid and a sum of areas of the openings existing in the collision range, is 5 to 100%. The wire blasting apparatus according to claim 8 or 9 , wherein the opening is formed in the holding plate so as to satisfy the following condition. Together with the wire to form the opening in a position to cross at least claim 8-10 any one of claims to the opening width of the opening in the cross position of the wire, characterized in that formed on 2~40mm Blasting equipment for wire. The cover is provided with a cover that covers the surface of the holding plate in a state in which the wire is in contact with the wire, which is formed of a net or a porous plate having a wide opening with respect to the grain size of the abrasive. 8-11 wire for blasting device according to any one. The blast gun and the holding plate are provided at a plurality of locations in the moving direction of the wire, and the blast gun is arranged so that the axial direction of each blast gun is arranged at an equal angle with respect to the circumferential direction of the wire. The blasting apparatus for wire rod according to any one of claims 8 to 12, wherein