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JP5479972B2 - Imaging device - Google Patents

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JP5479972B2
JP5479972B2 JP2010075463A JP2010075463A JP5479972B2 JP 5479972 B2 JP5479972 B2 JP 5479972B2 JP 2010075463 A JP2010075463 A JP 2010075463A JP 2010075463 A JP2010075463 A JP 2010075463A JP 5479972 B2 JP5479972 B2 JP 5479972B2
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imaging
image sensor
wiring board
optical glass
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JP2011211379A (en
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真吾 堀井
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Olympus Corp
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Description

本発明は、撮像素子を備えた撮像装置に関するものである。   The present invention relates to an imaging device including an imaging element.

デジタルカメラ等の電子カメラにおいては、撮像レンズ等の撮像光学系(レンズユニット)の光軸方向において撮像素子を精度良く位置決めするための様々な技術が開示されている。例えば、特許文献1には、撮像素子ユニットを構成する光透過性部材の撮像素子側の面を撮像装置本体のレンズユニット側に向く受け面に突き当てることで撮像素子ユニットを位置決めし、撮像装置本体に組み込むようにしている。   In an electronic camera such as a digital camera, various techniques for accurately positioning an imaging element in the optical axis direction of an imaging optical system (lens unit) such as an imaging lens are disclosed. For example, Patent Document 1 discloses that an image pickup device unit is positioned by abutting a surface on the image pickup device side of a light-transmitting member constituting the image pickup device unit against a receiving surface facing the lens unit side of the image pickup device body. It is built in the main body.

特開2002−218293号公報JP 2002-218293 A

しかしながら、撮像装置を構成する部品の中には、例えば撮像素子を実装する配線基板や部品間を接続する接着剤等、温度変化によって膨張または収縮する部品が含まれる場合がある。このため、特許文献1の技術では、製造時において光軸方向における撮像素子の位置を精度良く位置決めしたとしても、実装後の温度変化によって前述のように部品が熱変形してしまうと、光軸方向において撮像素子の位置ズレが生じるという問題があった。   However, the components constituting the imaging device may include components that expand or contract due to temperature changes, such as a wiring board on which the imaging element is mounted and an adhesive that connects the components. For this reason, in the technique of Patent Document 1, even if the position of the imaging element in the optical axis direction is accurately positioned during manufacturing, if the component is thermally deformed as described above due to a temperature change after mounting, the optical axis There was a problem that the image sensor was displaced in the direction.

本発明は、上記に鑑みなされたものであって、光軸方向における撮像素子の位置ズレを防止することができる撮像装置を提供することを目的とする。   The present invention has been made in view of the above, and an object of the present invention is to provide an imaging apparatus capable of preventing the positional deviation of the imaging element in the optical axis direction.

上述した課題を解決し、目的を達成するため、本発明にかかる撮像装置は、撮像光学系が装着される装置本体と、表面の受光部が前記撮像光学系の光軸方向と直交配置された撮像素子と、前記撮像素子の裏面に当接配置された板部材と、前記装置本体と前記板部材との位置関係を固定する締結具と、を備えたことを特徴とする。   In order to solve the above-described problems and achieve the object, an imaging apparatus according to the present invention includes an apparatus main body to which an imaging optical system is mounted, and a light receiving unit on a surface arranged orthogonally to the optical axis direction of the imaging optical system. The image pickup device includes: an image pickup device; a plate member disposed in contact with the back surface of the image pickup device; and a fastener that fixes a positional relationship between the apparatus main body and the plate member.

また、本発明にかかる撮像装置は、上記の発明において、前記撮像素子の前記受光部が露出する開口部を有し、前記撮像素子がフリップチップ実装された配線基板と、前記配線基板の前記撮像素子がフリップチップ実装された面の裏面側で前記装置本体に当接配置された光学ガラスと、を備え、前記配線基板と前記光学ガラスとの間が弾性部材を介して接続されたことを特徴とする。   In the imaging device according to the present invention, in the above invention, the imaging substrate has an opening through which the light receiving portion of the imaging device is exposed, the imaging device is flip-chip mounted, and the imaging of the wiring substrate. Optical glass disposed in contact with the apparatus main body on the back side of the surface on which the element is flip-chip mounted, and the wiring board and the optical glass are connected via an elastic member. And

また、本発明にかかる撮像装置は、上記の発明において、前記弾性部材は、前記光軸方向に弾性変形することを特徴とする。   In the image pickup apparatus according to the present invention, the elastic member is elastically deformed in the optical axis direction.

本発明によれば、表面の受光部が装置本体に装着される撮像光学系の光軸方向と直交配置された撮像素子の裏面に板部材を当接配置し、このように撮像素子の裏面に当接配置された板部材と装置本体との位置関係を締結具によって固定することができる。したがって、撮像素子の光軸方向における位置を裏面が板部材に当接配置された状態で維持することができるので、光軸方向における撮像素子の位置ズレを防止することができる。   According to the present invention, the plate member is disposed in contact with the back surface of the imaging element in which the light receiving portion on the front surface is arranged orthogonal to the optical axis direction of the imaging optical system mounted on the apparatus main body, and thus on the back surface of the imaging element. The positional relationship between the plate member arranged in contact with the apparatus main body can be fixed by a fastener. Therefore, the position of the image sensor in the optical axis direction can be maintained in a state where the back surface is in contact with the plate member, so that the position shift of the image sensor in the optical axis direction can be prevented.

図1は、本実施の形態における撮像装置の構成を説明する一部断面図である。FIG. 1 is a partial cross-sectional view illustrating the configuration of the imaging device according to the present embodiment.

以下、図面を参照して、本発明にかかる撮像装置の好適な実施の形態を詳細に説明する。なお、この実施の形態によって本発明が限定されるものではない。また、図面の記載において、同一部分には同一の符号を付して示している。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of an imaging device according to the invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. Moreover, in description of drawing, the same code | symbol is attached | subjected and shown to the same part.

(実施の形態)
図1は、本実施の形態における撮像装置1の構成を説明する一部断面図である。図1に示すように、本実施の形態の撮像装置1は、撮像素子11等を備えた撮像ユニット10と、この撮像ユニット10が取り付けられる装置本体としての撮像装置本体30とを備える。この撮像装置1において、撮像装置本体30には、中央の開口33を挟んで撮像ユニット10の反対側に撮像光学系であるレンズユニット5が装着され、図1中に一点鎖線で示すレンズユニット5の光軸方向が撮像素子11の受光部111と直交するように撮像ユニット10とレンズユニット5とが対向配置される。ここで、レンズユニット5は、撮像レンズや絞り、これらを装着する枠体等で構成され、被写体からの光を入射する。
(Embodiment)
FIG. 1 is a partial cross-sectional view illustrating the configuration of the imaging device 1 according to the present embodiment. As shown in FIG. 1, the imaging apparatus 1 according to the present embodiment includes an imaging unit 10 including an imaging element 11 and the like, and an imaging apparatus body 30 as an apparatus body to which the imaging unit 10 is attached. In this imaging device 1, a lens unit 5 that is an imaging optical system is attached to the imaging device body 30 on the opposite side of the imaging unit 10 across the central opening 33, and the lens unit 5 indicated by a one-dot chain line in FIG. The imaging unit 10 and the lens unit 5 are arranged to face each other so that the optical axis direction thereof is orthogonal to the light receiving unit 111 of the imaging element 11. Here, the lens unit 5 includes an imaging lens, a diaphragm, a frame on which these are mounted, and the like, and receives light from a subject.

撮像装置本体30は、前面(図1の上側)の段差として形成されたレンズユニットマウント部31を備え、レンズユニット5は、その背面側をレンズユニットマウント部31に当て付けた状態で固定される。また、撮像装置本体30は、背面(図1の下側)の段差として形成された撮像ユニットマウント部32を備え、この撮像ユニットマウント部32の外周側の適所には、撮像装置本体30に撮像ユニット10を固定するための複数のネジ孔341が形成されている。そして、撮像ユニット10は、後述する光学ガラス15の前面を撮像ユニットマウント部32に当て付けた状態で、ネジ孔341に後述するネジ部材である締結具18を締結することで固定される。   The imaging device main body 30 includes a lens unit mount portion 31 formed as a step on the front surface (upper side in FIG. 1), and the lens unit 5 is fixed in a state where the rear surface side is applied to the lens unit mount portion 31. . The imaging device main body 30 includes an imaging unit mount portion 32 formed as a step on the back surface (lower side in FIG. 1). The imaging device main body 30 captures images at appropriate positions on the outer peripheral side of the imaging unit mount portion 32. A plurality of screw holes 341 for fixing the unit 10 are formed. And the imaging unit 10 is fixed by fastening the fastener 18 which is a screw member mentioned later to the screw hole 341 in the state which contacted the front surface of the optical glass 15 mentioned later to the imaging unit mount part 32. FIG.

このように構成される撮像装置1において、レンズユニット5から入射する被写体像は、撮像装置本体30の開口33を通過して撮像ユニット10に導かれ、光学ガラス15を通過して撮像素子11の受光部111に結像される。   In the imaging device 1 configured as described above, the subject image incident from the lens unit 5 passes through the opening 33 of the imaging device body 30 and is guided to the imaging unit 10, passes through the optical glass 15, and passes through the optical element 15. An image is formed on the light receiving unit 111.

撮像ユニット10は、撮像素子11と、撮像素子11を実装する配線基板としてのプリント配線基板12と、撮像素子11とプリント配線基板12とを電気的に接続する突起電極13と、撮像素子11の表面(図1の上面)側を保護する光学ガラス15と、撮像素子11の裏面(図1の下面)に当接配置された板部材17と、撮像装置本体30と板部材17との位置関係を固定する締結具18とを備える。撮像素子11とプリント配線基板12との間は撮像素子接着剤14によって接着され、プリント配線基板12と光学ガラス15との間は光学ガラス接着剤16によって接着されている。   The imaging unit 10 includes an imaging element 11, a printed wiring board 12 as a wiring board on which the imaging element 11 is mounted, a protruding electrode 13 that electrically connects the imaging element 11 and the printed wiring board 12, and the imaging element 11. The positional relationship between the optical glass 15 that protects the front surface (upper surface in FIG. 1), the plate member 17 that is in contact with the back surface (lower surface in FIG. 1) of the image sensor 11, and the imaging device main body 30 and the plate member 17. And a fastener 18 for fixing the. The imaging element 11 and the printed wiring board 12 are bonded by an imaging element adhesive 14, and the printed wiring board 12 and the optical glass 15 are bonded by an optical glass adhesive 16.

撮像素子11は、CCDやCMOS等で構成される。この撮像素子11は、その表面に受光部111を備える。また、撮像素子11の表面内には、受光部111を避けた適所においてプリント配線基板12と電気的に接続するための複数の電極パッド(不図示)が形成されている。   The image sensor 11 is composed of a CCD, a CMOS, or the like. The imaging device 11 includes a light receiving unit 111 on the surface thereof. In addition, a plurality of electrode pads (not shown) are formed in the surface of the image sensor 11 to be electrically connected to the printed wiring board 12 at an appropriate place avoiding the light receiving portion 111.

受光部111は、マイクロレンズや2次元的に配置される複数の画素等で構成される。この受光部111は、光学ガラス15を介して被写体からの光を受光し、この受光した光を光電変換処理する。撮像素子11は、このように受光部111が光電変換処理した信号をもとに被写体の画像信号を生成する。   The light receiving unit 111 includes a microlens, a plurality of pixels arranged two-dimensionally, and the like. The light receiving unit 111 receives light from the subject via the optical glass 15 and performs photoelectric conversion processing on the received light. The image sensor 11 generates an image signal of the subject based on the signal photoelectrically converted by the light receiving unit 111 in this way.

プリント配線基板12は、基板面である一方の面(図1の下面)に撮像素子11を配線接続する配線パターン(不図示)が形成された回路基板である。このプリント配線基板12には、撮像素子11の受光部111に対応して設計された開口寸法を有する開口部121が形成されている。ここで、プリント配線基板12には、開口部121と撮像素子11の受光部111とを対向させた態様で撮像素子11がフリップチップ実装される。このように撮像素子11を実装した状態のプリント配線基板12の開口部121は、撮像素子11の受光部111に対する被写体からの光の入射を可能にする。このプリント配線基板12は、例えばガラス繊維強化エポキシ樹脂や金属、セラミックス等の各種材料で形成された硬質性基板、あるいは可撓性基板で構成される。   The printed wiring board 12 is a circuit board on which a wiring pattern (not shown) for wiring-connecting the image sensor 11 is formed on one surface (the lower surface in FIG. 1) which is a substrate surface. The printed wiring board 12 is formed with an opening 121 having an opening size designed corresponding to the light receiving portion 111 of the image sensor 11. Here, the image pickup device 11 is flip-chip mounted on the printed wiring board 12 in such a manner that the opening 121 and the light receiving portion 111 of the image pickup device 11 face each other. Thus, the opening 121 of the printed wiring board 12 in the state where the image sensor 11 is mounted enables the light from the subject to be incident on the light receiving unit 111 of the image sensor 11. The printed wiring board 12 is composed of a hard board formed of various materials such as glass fiber reinforced epoxy resin, metal, ceramics, or a flexible board.

突起電極13は、例えばワイヤボンディング方式で形成された金(Au)や銅(Cu)等のスタッドバンプ、金(Au)や銀(Ag)、銅(Cu)、インジウム(In)、半田等の金属材料を用いてめっき方式で形成された金属バンプ、前述の金属材料で形成された金属ボール、表面が金属めっき処理された樹脂ボール等で実現される。この突起電極13は、撮像素子11の表面内に形成された前述の電極パッドの各々に接合される。これらの各突起電極13は、撮像素子11とプリント配線基板12とのフリップチップ実装によってプリント配線基板12の配線パターンと接触または接合され、これによって、撮像素子11とプリント配線基板12との電気的な接続が実現される。   The protruding electrode 13 is made of, for example, a stud bump such as gold (Au) or copper (Cu) formed by a wire bonding method, gold (Au), silver (Ag), copper (Cu), indium (In), solder, or the like. This is realized by metal bumps formed by plating using a metal material, metal balls formed by the above-described metal material, resin balls whose surface is subjected to metal plating, and the like. The protruding electrode 13 is bonded to each of the electrode pads formed on the surface of the image sensor 11. Each of these protruding electrodes 13 is brought into contact with or bonded to the wiring pattern of the printed wiring board 12 by flip chip mounting of the imaging element 11 and the printed wiring board 12, whereby the electrical connection between the imaging element 11 and the printed wiring board 12 is achieved. Connection is realized.

撮像素子接着剤14は、撮像素子11とプリント配線基板12との間隙を閉塞し、突起電極13を介した撮像素子11とプリント配線基板12との接続を固定する。この撮像素子接着剤14は、撮像素子11とプリント配線基板12との間に開口部121を避けて配置される。撮像素子接着剤14としては、熱硬化型接着剤、紫外線硬化型接着剤等の各種接着剤を適宜採用できる。   The imaging element adhesive 14 closes the gap between the imaging element 11 and the printed wiring board 12 and fixes the connection between the imaging element 11 and the printed wiring board 12 via the protruding electrodes 13. The image sensor adhesive 14 is disposed between the image sensor 11 and the printed wiring board 12 so as to avoid the opening 121. As the imaging element adhesive 14, various adhesives such as a thermosetting adhesive and an ultraviolet curable adhesive can be appropriately employed.

光学ガラス15は、レンズユニット5を経た被写体からの光を透過させて開口部121に導入し、撮像素子11の受光部111へと導く。この光学ガラス15は、プリント配線基板12の上記した基板面の裏面(図1の上面)側で撮像装置本体30の撮像ユニットマウント部32に当接配置され、プリント配線基板12の開口部121を閉塞する。なお、光学ガラス15は、受光部111への異物の混入を防止し、外力等による破損から受光部111を保護する役割も果たしている。   The optical glass 15 transmits light from the subject that has passed through the lens unit 5, introduces it into the opening 121, and guides it to the light receiving unit 111 of the image sensor 11. The optical glass 15 is disposed in contact with the imaging unit mount 32 of the imaging device body 30 on the back surface (upper surface in FIG. 1) of the printed circuit board 12 described above, and the opening 121 of the printed circuit board 12 is formed. Block. The optical glass 15 also serves to prevent foreign matter from entering the light receiving unit 111 and protect the light receiving unit 111 from damage due to external force or the like.

光学ガラス接着剤16は、プリント配線基板12と光学ガラス15とを固定し、これらの間隙を閉塞するものであり、プリント配線基板12と光学ガラス15との間に開口部121を避けて配置される。この光学ガラス接着剤16は、弾性部材に相当するものであり、弾性を有する接着剤を用いて実現される。具体的には、光学ガラス接着剤16は、例えば熱硬化型接着剤や紫外線硬化型接着剤等の各種接着剤を適宜採用でき、アクリル系、エポキシ系、シリコン系等の各種合成樹脂接着剤を用いることができる。   The optical glass adhesive 16 fixes the printed wiring board 12 and the optical glass 15 and closes the gap between them, and is disposed between the printed wiring board 12 and the optical glass 15 so as to avoid the opening 121. The The optical glass adhesive 16 corresponds to an elastic member, and is realized using an adhesive having elasticity. Specifically, as the optical glass adhesive 16, various adhesives such as a thermosetting adhesive and an ultraviolet curable adhesive can be appropriately employed, and various synthetic resin adhesives such as acrylic, epoxy, and silicon are used. Can be used.

板部材17は、撮像素子11の裏面の全域を覆うサイズに形成された平板状の部材であり、撮像装置本体30背面のネジ孔341と対向する位置において上下に貫通するネジ孔171を備える。板部材17と撮像素子11の裏面との間は、接着剤等で固定される。   The plate member 17 is a flat plate member that is formed in a size that covers the entire back surface of the image sensor 11, and includes a screw hole 171 that penetrates up and down at a position facing the screw hole 341 on the back surface of the image pickup apparatus body 30. A space between the plate member 17 and the back surface of the image sensor 11 is fixed with an adhesive or the like.

締結具18は、板部材17のネジ孔171および撮像装置本体30背面のネジ孔341に螺合するネジ部材であり、撮像装置本体30背面のネジ孔341に板部材17のネジ孔171を介して締結具18を締め付けることで、撮像素子11の裏面に当接配置された板部材17と撮像装置本体30との位置関係を固定する。この締結具18の長さおよび撮像装置本体30背面のネジ孔341の深さは、レンズユニット5の光軸方向における撮像素子11(詳細には受光部111)の位置によって定まる距離d1と板部材17の厚みとに応じて規定される。なお、板部材17のネジ孔171および撮像装置本体30背面のネジ孔341は、これらの外周部分においてプリント配線基板12と接触しない位置に形成される。ただし、プリント配線基板12のネジ孔171,341と対向する位置に締結具18と干渉しないように貫通孔を形成するスペースが確保できる場合には、この貫通孔に締結具18を挿通させる構成としてもよい。   The fastener 18 is a screw member that is screwed into the screw hole 171 of the plate member 17 and the screw hole 341 on the back surface of the imaging device main body 30. By tightening the fastener 18, the positional relationship between the plate member 17 disposed in contact with the back surface of the imaging element 11 and the imaging device main body 30 is fixed. The length of the fastener 18 and the depth of the screw hole 341 on the back surface of the imaging device main body 30 are determined by the distance d1 determined by the position of the imaging element 11 (specifically, the light receiving unit 111) in the optical axis direction of the lens unit 5 and the plate member. It is defined according to the thickness of 17. Note that the screw hole 171 of the plate member 17 and the screw hole 341 on the back surface of the imaging device main body 30 are formed at positions where they do not contact the printed wiring board 12 at their outer peripheral portions. However, when a space for forming a through hole can be secured at a position facing the screw holes 171 and 341 of the printed wiring board 12 so as not to interfere with the fastener 18, the fastener 18 is inserted into the through hole. Also good.

上記したように、実装後に例えば撮像素子11が発熱する等して温度変化が生じた場合には、撮像装置1を構成する例えばプリント配線基板12や撮像素子接着剤14、光学ガラス接着剤16等の部品が膨張または収縮して熱変形する場合がある。このため、従来の構成では、温度変化が生じると、これらの部材の熱変化によってレンズユニット5の光軸方向に対して撮像素子11の位置ズレが生じる場合があった。   As described above, when a change in temperature occurs due to, for example, the image sensor 11 generating heat after mounting, for example, the printed circuit board 12, the image sensor adhesive 14, the optical glass adhesive 16, etc. constituting the image pickup apparatus 1. In some cases, these parts expand or contract and thermally deform. For this reason, in the conventional configuration, when a temperature change occurs, the image sensor 11 may be misaligned with respect to the optical axis direction of the lens unit 5 due to a thermal change of these members.

これに対し、本実施の形態では、撮像素子11の裏面に板部材17を当接配置し、このように撮像素子11の裏面に当接配置された板部材17と撮像装置本体30との位置関係を締結具18によって固定することとした。したがって、レンズユニット5の光軸方向における撮像素子11の位置は、裏面が板部材17に当接配置された状態で維持される。   On the other hand, in the present embodiment, the plate member 17 is disposed in contact with the back surface of the image sensor 11, and the positions of the plate member 17 disposed in contact with the back surface of the image sensor 11 and the imaging device main body 30 in this manner. The relationship was fixed by the fastener 18. Therefore, the position of the imaging element 11 in the optical axis direction of the lens unit 5 is maintained in a state where the back surface is in contact with the plate member 17.

一方で、本実施の形態では、撮像素子11がフリップチップ実装されたプリント配線基板12と、このプリント配線基板12の基板面の裏面側で撮像装置本体30の撮像ユニットマウント部32に当接配置された光学ガラス15との間を、弾性を有する光学ガラス接着剤16によって接着・固定することとした。したがって、前述のように、撮像装置1を構成する例えばプリント配線基板12や撮像素子接着剤14、光学ガラス接着剤16等の部品が熱変形した場合には、光学ガラス接着剤16が光軸方向に膨張または収縮して弾性変形し、プリント配線基板12と光学ガラス15との間の図1中に示す距離d2が変動する。このように、本実施の形態の撮像装置1では、温度変化に起因して部品がレンズユニット5の光軸方向へと変形しようとする力は、光学ガラス接着剤16の弾性変形によって吸収される。   On the other hand, in the present embodiment, the printed circuit board 12 on which the image sensor 11 is flip-chip mounted, and the back surface side of the printed circuit board 12 are in contact with the imaging unit mount 32 of the imaging apparatus main body 30. The optical glass 15 is bonded and fixed with an optical glass adhesive 16 having elasticity. Therefore, as described above, when components such as the printed wiring board 12, the imaging element adhesive 14, and the optical glass adhesive 16 constituting the imaging apparatus 1 are thermally deformed, the optical glass adhesive 16 is in the optical axis direction. The distance d2 shown in FIG. 1 between the printed wiring board 12 and the optical glass 15 changes. As described above, in the imaging device 1 according to the present embodiment, the force that the component tries to deform in the optical axis direction of the lens unit 5 due to the temperature change is absorbed by the elastic deformation of the optical glass adhesive 16. .

したがって、本実施の形態によれば、裏面に板部材17を当接配置することでレンズユニット5の光軸方向における撮像素子11を位置決めし、位置決めした状態を維持することができる。これによれば、レンズユニット5の光軸方向に対して撮像素子11を精度良く位置決めすることができ、実装後の温度変化によって装置各部を構成する部品が熱変形した場合であっても、レンズユニット5の光軸方向における撮像素子11の位置ズレを防止できる。   Therefore, according to the present embodiment, it is possible to position the imaging element 11 in the optical axis direction of the lens unit 5 by placing the plate member 17 in contact with the back surface, and maintain the positioned state. According to this, the imaging device 11 can be accurately positioned with respect to the optical axis direction of the lens unit 5, and even if the components constituting each part of the apparatus are thermally deformed due to a temperature change after mounting, the lens The positional deviation of the image sensor 11 in the optical axis direction of the unit 5 can be prevented.

なお、本実施の形態の撮像装置1は、例えば一眼レフレックス式デジタルカメラやコンパクト型のデジタルカメラ、撮影機能を有する携帯電話、携帯情報端末等、電子カメラに広く適用が可能である。   Note that the imaging apparatus 1 according to the present embodiment can be widely applied to electronic cameras such as a single-lens reflex digital camera, a compact digital camera, a mobile phone having a photographing function, and a portable information terminal.

以上のように、本発明の撮像装置は、光軸方向における撮像素子の位置ズレを防止するのに適している。   As described above, the imaging apparatus of the present invention is suitable for preventing the positional deviation of the imaging element in the optical axis direction.

1 撮像装置
10 撮像ユニット
11 撮像素子
111 受光部
12 プリント配線基板
121 開口部
13 突起電極
14 撮像素子接着剤
15 光学ガラス
16 光学ガラス接着剤
17 板部材
171 ネジ孔
18 締結具
30 撮像装置本体
31 レンズユニットマウント部
32 撮像ユニットマウント部
341 ネジ孔
5 レンズユニット
DESCRIPTION OF SYMBOLS 1 Imaging device 10 Imaging unit 11 Imaging element 111 Light receiving part 12 Printed wiring board 121 Opening part 13 Projection electrode 14 Imaging element adhesive 15 Optical glass 16 Optical glass adhesive 17 Plate member 171 Screw hole 18 Fastener 30 Imaging apparatus main body 31 Lens Unit mount unit 32 Imaging unit mount unit 341 Screw hole 5 Lens unit

Claims (2)

撮像光学系が当て付けられた状態で固定されるレンズユニットマウント部と、該レンズユニットマウント部の背面に撮像ユニットが当て付けられた状態で固定される撮像ユニットマウント部とを有する装置本体と、
前記撮像ユニットとして、
表面の受光部が前記撮像光学系の光軸方向と直交配置された撮像素子と、
前記撮像素子の前記受光部が露出する開口部を有し、前記撮像素子がフリップチップ実装された配線基板と、
前記配線基板の前記撮像素子がフリップチップ実装された面の裏面側で前記装置本体に当接配置された光学ガラスと、
前記撮像素子の裏面に当接配置された板部材と、
前記装置本体と前記板部材との位置関係を固定する締結具と、
を備え、前記配線基板と前記光学ガラスとの間が光学ガラス接着剤によって接着されていることを特徴とする撮像装置。
An apparatus main body having a lens unit mount portion fixed in a state where the imaging optical system is applied ; and an imaging unit mount portion fixed in a state where the imaging unit is applied to the back surface of the lens unit mount portion ;
As the imaging unit,
An image sensor in which a light receiving portion on the surface is arranged orthogonal to the optical axis direction of the imaging optical system;
A wiring board having an opening through which the light receiving portion of the image sensor is exposed, and wherein the image sensor is flip-chip mounted;
Optical glass disposed in contact with the apparatus main body on the back side of the surface on which the image pickup device of the wiring board is flip-chip mounted;
A plate member disposed in contact with the back surface of the image sensor;
A fastener for fixing the positional relationship between the apparatus main body and the plate member;
An imaging apparatus comprising: an optical glass adhesive between the wiring board and the optical glass .
前記光学ガラス接着剤は、前記光軸方向に弾性変形することを特徴とする請求項に記載の撮像装置。 The imaging apparatus according to claim 1 , wherein the optical glass adhesive is elastically deformed in the optical axis direction.
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